KR101738621B1 - On board type RF interposer unit and installing method thereof - Google Patents

On board type RF interposer unit and installing method thereof Download PDF

Info

Publication number
KR101738621B1
KR101738621B1 KR1020150110672A KR20150110672A KR101738621B1 KR 101738621 B1 KR101738621 B1 KR 101738621B1 KR 1020150110672 A KR1020150110672 A KR 1020150110672A KR 20150110672 A KR20150110672 A KR 20150110672A KR 101738621 B1 KR101738621 B1 KR 101738621B1
Authority
KR
South Korea
Prior art keywords
contact
test board
housing
lower housing
fixing
Prior art date
Application number
KR1020150110672A
Other languages
Korean (ko)
Other versions
KR20170018144A (en
Inventor
전진국
박성규
남상진
Original Assignee
주식회사 오킨스전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 오킨스전자 filed Critical 주식회사 오킨스전자
Priority to KR1020150110672A priority Critical patent/KR101738621B1/en
Publication of KR20170018144A publication Critical patent/KR20170018144A/en
Application granted granted Critical
Publication of KR101738621B1 publication Critical patent/KR101738621B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes

Abstract

The present invention relates to a board integrated RF interposer unit and a mounting method thereof, and more particularly, to a board integrated RF interposer unit and a mounting method thereof, An upper housing located at the upper side, a mounting hole of the lower housing and an installation hole of the upper housing, a contact pin for connecting a connection terminal of the test board to a socket of an RF module to be tested, And a fixing member for fixing the RF module to the test board. The RF module to be tested is tested while being integrally fixed to the test board.
According to the present invention as described above, it is possible to test a plurality of RF modules by integrally fixing them on a test board, thereby preventing and minimizing the shaking of the test board and the interposer unit, thereby improving the test accuracy.

Description

[0001] The present invention relates to a board-integrated RF interposer unit and an installation method thereof,

The present invention relates to an interposer unit, and more particularly, to an interposer unit capable of stably connecting a test board and a plurality of RF modules to be tested to improve test accuracy, To an integrated RF interposer unit and a mounting method thereof.

Generally, a module for wireless communication includes an RF (Radio Frequency) transceiver to perform wireless communication using airwaves.

The conventional RF interposer unit is made of an antenna connector and an RF cable connector, and is detachably mountable, as disclosed in Japanese Patent Laid-open No. 10-0762002.

The antenna connector and the RF cable connector are configured in a rigid coupling structure to prevent easy separation after coupling.

However, since the RF interposer unit is manufactured through a test process, the unit for testing has the same or similar configuration as the actual product, and after the test, the separation operation is difficult and the operation time is increased.

Particularly, when the RF module is forcibly separated, the RF module is tilted and the defect rate is increased.

Accordingly, there is an urgent need to develop a technology capable of stably combining a test board and an RF module to be tested, thereby improving test accuracy and preventing defects caused by conventional testing.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a lower housing, a plurality of mounting holes formed therein, an upper housing positioned on the upper side of the lower housing, And a fixing member for fixing the lower housing and the upper housing to the test board, wherein the contact pins for connecting the connection terminals of the test board to the socket of the RF module to be tested, A board-integrated RF interposer unit capable of testing a plurality of RF modules to be tested in a fixed state, thereby improving test accuracy by preventing and minimizing fluctuation of the test board and interposer unit, and a mounting method thereof Is to provide.

According to an aspect of the present invention, there is provided a portable terminal including a lower housing having a plurality of mounting holes, an upper housing having a plurality of mounting holes corresponding to the mounting holes of the lower housing, A contact pin positioned in the mounting hole of the upper housing to connect to a connection terminal of the test board and a socket of an RF module to be tested, and a fixing member for fixing the lower housing and the upper housing to the test board And tests the RF module to be tested while being integrally fixed to the test board.

Preferably, the contact pin includes: a base contact portion for preventing interference with other adjacent contact pins in a tubular form; a plurality of contact pins disposed inside the base contact portion for connecting the connection terminal of the test board to an RF module to be tested; A contact contact portion, and a contact fixing portion for fixing the connection contact portion to the base contact portion.

The contact pin is movably disposed along the mounting hole of the lower housing and the mounting hole of the upper housing. The contact pin is further provided with a pressing member on the base contact portion to press the lower housing with the lower housing. When the test board is fixed to the test board, as the lower end portion is pressed on the test board and moved upward, the pressing member is compressed and pressed to the test board by the elastic force.

The mounting hole of the lower housing is formed to have a diameter larger than that of the lower end, and a lower end of the mounting hole of the upper housing is formed to have a diameter larger than that of the upper end. The diameter of the lower end is formed to be equal to the diameter of the upper end of the mounting hole And an engagement protrusion protruding from the upper end of the attachment hole and the lower end of the attachment hole is formed on the outer periphery of the lower end of the contact pin. The pressing member is positioned between the engagement protrusion and the lower end of the installation hole.

The connection contact portion includes a connection contact portion body having an elastic space portion therein, a first connection contact portion provided at one end of the connection contact portion body to be connected to the connection terminal of the test board, A first connection contact portion provided at the other end of the connection contact portion and connected to the RF module, and a second connection contact portion provided in the elastic space portion of the connection contact portion body, for connecting at least one of the first connection contact portion and the second connection contact portion in the corresponding direction And a connection elastic portion for pressing the connection elastic portion.

In addition, the lower housing and the test board have corresponding guide holes formed therein, and guide pins are formed to be guided and fixed to the corresponding guide holes, and are preliminarily fixed before use of the fixing member.

A lower housing having a plurality of mounting holes and a plurality of mounting holes corresponding to the mounting holes of the lower housing; an upper housing positioned above the lower housing; a mounting hole of the lower housing and a mounting hole of the upper housing; And a fixing member for fixing the lower housing and the upper housing to the test board, the contact pin being located at a lower portion of the lower housing and connected to a socket of the RF module to be tested, A contact pin mounting step of mounting the contact pins on respective lower mounting holes of the housing of the lower housing of the upper housing and the lower housing of the lower housing of the lower housing, A contact pin mounting step in which each contact pin is pressed downward by a pressing member, Using a member and a contact pin fixing step, to secure the lower housing and the upper housing a plurality of contact pins are located on the test board.

The step of fixing the contact pins may include a first fixing step of positioning the lower ends of the plurality of contact pins positioned between the lower housing and the upper housing to contact the corresponding connection terminals of the test board, A second fixing step of moving the pressing member in the downward direction together with the upper housing to contact the test board so as to increase the pressing force of the pressing member in the direction of the connection terminal to the corresponding contact pin, And a third fixing step of fixing the rough bottom housing and the top housing to the test board using the fixing member.

As described above, according to the integrated board type RF interposer unit and the method of mounting the board integrated RF unit according to the present invention, it is possible to test a plurality of RF modules by integrally fixing them on a test board, Preventing, and minimizing degradation of the test results.

FIG. 1 is a view showing a board-integrated RF interposer unit according to the present invention,
FIG. 2 is an exploded view of a board-integrated RF interposer unit according to the present invention,
FIG. 3 is a cross-sectional view of a board-integrated RF interposer unit according to the present invention,
4 is an exploded cross-sectional view of a board-integrated RF interposer unit according to the present invention,
FIG. 5 is a view showing contact pins of the board-integrated RF interposer unit according to the present invention,
6 is a view showing a contact contact portion of a contact pin according to the present invention,
FIG. 7 is a flowchart illustrating a method of installing a board-integrated RF interposer unit according to the present invention,
8 is a flowchart illustrating a contact pin fixing step according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

It should be noted that the present invention is not limited to the scope of the present invention but is only illustrative and various modifications are possible within the scope of the present invention.

FIG. 1 is an exploded view of a board-integrated RF interposer unit according to the present invention, FIG. 2 is an exploded view of a board-integrated RF interposer unit according to the present invention, FIG. FIG. 4 is a cross-sectional view of the board-integrated RF interposer unit according to the present invention, and FIG. 5 is a cross-sectional view illustrating the board-integrated RF interposer unit according to the present invention, 6 is a view showing a contact contact portion of a contact pin according to the present invention, FIG. 7 is a flowchart showing a method of installing a board-integrated RF interposer unit according to the present invention, and FIG. Is a flowchart illustrating a contact pin fixing step according to the present invention.

As shown in the figure, the board integrated RF interposer unit 10 is composed of a lower housing 100, an upper housing 200, a contact pin 300 and a fixing member 400.

The lower housing 100 is formed with a plurality of mounting holes 110 and is positioned so as to be in contact with the test board 20.

The upper housing 200 has a plurality of mounting holes 210 corresponding to the mounting holes 110 of the lower housing 100 and is positioned on the upper side of the lower housing 100.

The contact pins 300 are located in the mounting holes 110 of the lower housing 100 and the mounting holes 210 of the upper housing 200 and connected to the connection terminals of the test board 20 and the socket of the RF module to be tested .

The fixing member 400 is provided to fix the lower housing 100 and the upper housing 200 to the test board 20.

The fixing member 400 is preferably composed of a bolt 410 and a nut 420. When the lower housing 100 and the upper housing 200 are fixed to the test board 20, .

The board interposer RF interposer unit 10 can test an RF module to be tested while being integrally fixed to the test board 20.

Here, the contact pin 300 is movably positioned along the mounting hole 110 of the lower housing 100 and the mounting hole 210 of the upper housing 200.

The contact pin 300 is provided on the base contact portion 310 so as to be pressed toward the lower housing 100 by the pressing member 500. When the contact pin 300 is fixed to the test board by the fixing member 400, The pressing member 500 is compressed and pressed against the test board 20 by the elastic force.

3 to 4, the mounting hole 110 of the lower housing 100 is formed to have a larger diameter than that of the lower end, and the mounting hole 210 of the upper housing 200 has a lower end The diameter is larger than the upper end.

The diameter of the lower end of the installation hole 210 of the upper housing 200 is equal to the diameter of the upper end of the attachment hole 110 of the lower housing 100.

An engaging protrusion 310 protrudes from the upper end of the mounting hole 110 and a lower end of the mounting hole 210 at the lower end of the contact pin 300. The engaging protrusion 310 and the mounting hole 210, The pressing member 500 is positioned between the lower ends of the pressing members.

5, the contact pin 300 is composed of a base contact portion 310, a connection contact portion 320, and a contact fixing portion 330.

The base contact portion 310 is provided in a tubular shape to prevent interference with other adjacent contact pins.

The connection contact unit 320 is disposed inside the base contact unit 310 to connect the connection terminal of the test board 20 to an RF module to be tested.

The contact fixing portion 330 is provided to fix the connection contact portion 320 to the base contact portion 310 and is formed of an insulator to electrically disconnect the base contact portion 310 and the connection contact portion 320 do.

6, the connection contact portion 320 includes a connection contact body 322, a first connection contact portion 324, a second connection contact portion 326, and a connection elastic portion 328 do.

The first contact contact portion 324 is provided at one end of the contact contact body 322 and is connected to the connection terminal of the test board 20 Respectively.

The connection contact portion 326 is provided at the other end of the connection contact body 322 to be connected to the RF module.

The connection elastic portion 328 is provided in the elastic space portion of the connection contact body 322 to press one or more of the first connection contact portion 324 and the second connection contact portion 326 in the corresponding direction do.

The first connection contact portion 324 compresses and moves the connection elastic portion 328 when connected to the connection terminal of the test board 20 and the second connection contact portion 326 is connected to the connection contact body 324. [ (322) and connected to the RF module.

Of course, it is natural that the first connection contact portion 324 and the second connection contact portion 326 can be operated reversely and can be moved at the same time.

The lower housing 100 and the test board 20 are formed with guide holes 610 corresponding to the guide holes 610. The guide pins 600 are inserted into the corresponding guide holes 610 to be guided and fixed, Pre-fix the member (400) before use.

It is preferable that the guide pin 600 is constrained to each guide hole 610.

A guide post 700 is further provided between the lower housing 100 and the upper housing 200. The lower end of the guide post 700 is positioned between the lower housing 100 and the upper housing 200, And protrudes upward from the upper housing 200.

A guide groove is formed in the RF module so as to correspond to the upper end of the guide post 700 so that it is guided to be mounted at an accurate position.

7, the contact pin mounting step S10, the contact pin mounting step S20, and the contact pin fixing step S30 are performed in the same manner as the above-described method of mounting the board- integrated RF interposer unit 10, .

The contact pin mounting step S10 mounts the contact pins 300 to the respective mounting holes 110 of the lower housing 100 of the board-integrated RF interposer unit 10, respectively.

In the contact pin installation step S20, the upper housing 200 is installed on the upper side of the lower housing 100 on which the contact pins 300 are mounted, and the mounting hole 110 of the lower housing 100 and the upper housing 200 And the contact pins 300 are pressed downward by the pressing member 500. In this case,

In the contact pin fixing step S30, the lower housing 100 and the upper housing 200, on which the plurality of contact pins 300 are positioned, are fixed to the test board 20 using the fixing member 400. [

The contact pin fixing step S30 includes a first fixing step S31, a second fixing step S32 and a third fixing step S33 as shown in FIG.

In the first fixing step S31, the lower ends of the plurality of contact pins positioned between the lower housing 100 and the upper housing 200 are positioned to contact the corresponding connection terminals of the test board 20.

The second fixing step S32 moves the lower housing 100 together with the upper housing 200 downward so that the lower surface of the lower housing 100 is in contact with the test board 20 so that the pressing member 400 is compressed, Thereby increasing the pressing force on the connection terminal 300 toward the corresponding connection terminal.

The third fixing step S33 fixes the lower housing 100 and the upper housing 200 to the test board 20 using the fixing member 400 after the second fixing step S32.

10: interposer unit 20: test board
100: lower housing 110: mounting hole
200: upper housing 210: installation hole
300: contact pin 310: base contact portion
320: connection contact portion 322: connection contact portion body
324: first connection contact portion 326: second connection contact portion
328: connection elastic portion 330: contact fixing portion
400: fixing member 500: pressing member
600: guide pin 700: guide post

Claims (8)

A lower housing having a plurality of mounting holes formed therein;
An upper housing having a plurality of mounting holes corresponding to the mounting holes of the lower housing, the upper housing positioned above the lower housing;
A contact pin located at a mounting hole of the lower housing and an installation hole of the upper housing to connect to a connection terminal of a test board and a socket of an RF module to be tested; And
And a fixing member for fixing the lower housing and the upper housing to the test board,
Testing the RF module to be tested while being integrally fixed to the test board,
The contact pin
A base contact portion for preventing interference with other adjacent contact pins in a tubular shape;
A connection contact part located inside the base contact part and connecting a connection terminal of the test board to an RF module to be tested; And
And a contact fixing portion for fixing the connection contact portion to the base contact portion. delete The contact pin according to claim 1,
The base contact portion is movably positioned along the mounting hole of the lower housing and the mounting hole of the upper housing, and further includes a pressing member at the base contact portion to press the lower housing,
And the pressing member is compressed and pressed against the test board by the elastic force as the lower end portion is pressed on the test board and moved upward when the test fixture is fixed to the test board by the fixing member. The method of claim 3,
The mounting hole of the lower housing has a larger upper end than a lower end,
The installation hole of the upper housing has a lower end portion formed to have a diameter larger than that of the upper end portion, a diameter of the lower end portion is formed to be the same as an upper end diameter of the stationary hole,
And an engagement protrusion protruding from an upper end of the mounting hole and a lower end of the mounting hole is formed on an outer periphery of a lower end of the contact pin,
And the pressing member is positioned between the engaging jaw and the lower end of the mounting hole.
The connector according to claim 1,
A connection contact body having an elastic space portion therein;
A first connection contact portion provided at one end of the connection contact body to be connected to a connection terminal of the test board;
A second connection contact provided at the other end of the connection contact body to be connected to the RF module; And
And a connection elastic part provided in the elastic space part of the connection contact body for pressing at least one of the first connection contact part and the second connection contact part in the corresponding direction. The method according to claim 1,
Wherein the lower housing and the test board are respectively formed with corresponding guide holes and further formed with guide pins to be guided and fixed by the corresponding guide holes so as to be preliminarily fixed before use of the fixing member, Interposer unit.
A contact pin mounting step for mounting the contact pins according to any one of claims 1 and 3, respectively;
The upper housing is installed at an upper side of the lower housing on which the contact pins are mounted so that the contact pins are provided on the mounting holes of the upper housing and the mounting holes of the lower housing and the contact pins are pressed downward by the pressing member step; And
And a contact pin fixing step of fixing the lower housing and the upper housing, on which the plurality of contact pins are located, to the test board using the fixing member. 8. The method of claim 7,
A first fixing step of positioning a lower end of a plurality of contact pins positioned between the lower housing and the upper housing to be in contact with a corresponding connection terminal of the test board;
A second fixing step of compressing the pressing member to increase the pressing force toward the corresponding connection terminal with respect to the contact pin as the lower surface of the lower housing moves downward together with the upper housing so as to be in contact with the test board; And
And a third fixing step of fixing the lower housing and the upper housing through the second fixing step to the test board using the fixing member.
KR1020150110672A 2015-08-05 2015-08-05 On board type RF interposer unit and installing method thereof KR101738621B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150110672A KR101738621B1 (en) 2015-08-05 2015-08-05 On board type RF interposer unit and installing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150110672A KR101738621B1 (en) 2015-08-05 2015-08-05 On board type RF interposer unit and installing method thereof

Publications (2)

Publication Number Publication Date
KR20170018144A KR20170018144A (en) 2017-02-16
KR101738621B1 true KR101738621B1 (en) 2017-06-09

Family

ID=58264865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150110672A KR101738621B1 (en) 2015-08-05 2015-08-05 On board type RF interposer unit and installing method thereof

Country Status (1)

Country Link
KR (1) KR101738621B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101891641B1 (en) * 2017-08-28 2018-08-27 프라임텍 주식회사 Contact pinhaving enhanced contact area

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001033482A (en) * 1999-07-26 2001-02-09 Rohm Co Ltd Contact type probe device
JP5714817B2 (en) * 2007-07-19 2015-05-07 日本発條株式会社 Probe card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001033482A (en) * 1999-07-26 2001-02-09 Rohm Co Ltd Contact type probe device
JP5714817B2 (en) * 2007-07-19 2015-05-07 日本発條株式会社 Probe card

Also Published As

Publication number Publication date
KR20170018144A (en) 2017-02-16

Similar Documents

Publication Publication Date Title
CN111194410B (en) Detector
KR200471076Y1 (en) Socket for testing electronics
CN101490572B (en) Apparatus and method for detecting a location of conductive pins with respect to a circuit board
US9817055B2 (en) Testing apparatus for testing electrical circuit board having electrical connectors thereon
KR101620541B1 (en) Connector for electrical connection
KR101392399B1 (en) Burn-in socket for test
US8235750B2 (en) Coaxial inspection connector and receptacle
KR102148438B1 (en) Test socket
KR101591013B1 (en) Self-Combined Prove Pin
CN106680540B (en) Coaxial connector for probing
US9910068B2 (en) Semiconductor chip test device
KR20180028134A (en) Apparatus for testing semiconductor package
KR101738621B1 (en) On board type RF interposer unit and installing method thereof
KR101186204B1 (en) Test apparatus for Flexible Printed Circuit Board
KR101183809B1 (en) Coaxial connector for inspection
KR101827860B1 (en) Pin block assembly
KR101624981B1 (en) Socket For Testing Electronics
KR101454820B1 (en) Apparatus for test of semi conductor device
US20120268154A1 (en) Testing jig for pogo pin connector
KR101646544B1 (en) Test socket with minimized number of components
KR101738619B1 (en) RF interposer unit and assembling method thereof
KR101557150B1 (en) Apparatus for test of semi conductor device
KR101323293B1 (en) Test apparatus for integrated circuit
KR102158027B1 (en) A hollow test pin
CN210071940U (en) Filter performance debugging clamp

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant