KR101735563B1 - One-piece device having a vortex nozzle Holes - Google Patents

One-piece device having a vortex nozzle Holes Download PDF

Info

Publication number
KR101735563B1
KR101735563B1 KR1020160024966A KR20160024966A KR101735563B1 KR 101735563 B1 KR101735563 B1 KR 101735563B1 KR 1020160024966 A KR1020160024966 A KR 1020160024966A KR 20160024966 A KR20160024966 A KR 20160024966A KR 101735563 B1 KR101735563 B1 KR 101735563B1
Authority
KR
South Korea
Prior art keywords
hole
electrolytic solution
vibration
supply
supply pipe
Prior art date
Application number
KR1020160024966A
Other languages
Korean (ko)
Inventor
배민수
오태석
Original Assignee
(주)네오피엠씨
배민수
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)네오피엠씨, 배민수 filed Critical (주)네오피엠씨
Priority to KR1020160024966A priority Critical patent/KR101735563B1/en
Application granted granted Critical
Publication of KR101735563B1 publication Critical patent/KR101735563B1/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
    • B05B1/3405—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl to produce swirl
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to an integrated nozzle apparatus having a vortex jetting structure for increasing flow rate, and more particularly, to a nozzle apparatus for supplying an electrolytic solution, which is installed in a plating vessel, through a coupling tube to a substrate, A supply pipe portion having a supply space formed therein and having a connection hole communicating with the supply space on the outer surface thereof and a spray nozzle for receiving and discharging the electrolytic solution transferred from the connection hole, Wherein the inner spray hole is formed in a rear surface portion communicating with the connection hole so that the electrolyte is swirled and the outer spray hole is formed in the front surface portion to communicate with the through hole, An electrolytic solution delivered from the inner spray hole and an electrolytic solution flowing through the through hole are sprayed, By that eddy current is introduced to the bar around the electrolytic solution, there is an effect that was distributed in a uniform electrolyte without ion is not biased by the electrolytic solution to be moved it becomes possible supply of the number of the electrolytic solution makes it possible to form a plating layer of uniform thickness to the substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a one-piece device having a vortex spray structure for increasing a flow rate,

The present invention relates to an integral nozzle apparatus having a vortex jetting structure for increasing the flow rate. More particularly, the present invention relates to an integral nozzle apparatus having a vortex jetting structure for increasing the flow rate, The electrolytic solution around the sprayer is vortexed and injected so as to be injected together, so that it is possible to supply a large amount of electrolytic solution, and ions can be distributed uniformly in the electrolytic solution due to the electrolytic solution to be moved, To an integral nozzle device having a vortex jetting structure for increasing the flow rate.

In general, a printed circuit board (PCB) can be regarded as a kind of electronic component element printed with wiring and arrangement space necessary for mounting a predetermined electronic component. Recently, a multilayer board having two or more layers has been used. In order to form a circuit in the process of manufacturing such a printed circuit board, a series of procedures are repeated in which the nickel and chromium plating layers are formed so as to be repeatedly immersed in the water tank.

A conventional substrate plating apparatus is disclosed in Korean Patent Application No. 10-2009-0107687, in which a substrate to be plated such as a dissolvable electrode member and a semiconductor wafer is disposed in a plating tank containing an electrolytic solution, The ions generated while the soluble electrode member is oxidized by supplying power are transferred to the substrate to be plated to form a plating layer.

However, in the conventional substrate plating apparatus, the ions distributed in the electrolytic solution are supplied to the substrate to be plated while the electrolytic solution is supplied. However, since the ions can not be uniformly distributed in the electrolytic solution, And there is a problem that the ion supply is concentrated on a specific region of the substrate to form a non-uniform plating layer.

The above-mentioned invention means the background art of the technical field to which the present invention belongs, and does not mean the prior art.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the above-mentioned problems of the prior art. An object of the present invention is to provide a spray tube in which an inner spray hole, a through hole and an outer spray hole are formed along a longitudinal direction, The electrolytic solution in the vicinity is swirled and flowed together and injected together, so that it is possible to supply a large amount of electrolytic solution, and it is possible to uniformly distribute the electrolytic solution to the electrolytic solution, And a vortex jetting structure for the vortex jetting structure.

The present invention relates to a nozzle device for supplying an electrolytic solution, which is installed in a plating vessel, through a coupling tube to a substrate, and which is fastened to the coupling tube and closed at one end, has a supply space formed therein, An inner spray hole is formed in the back surface of the spray bar so as to communicate with the connection hole so that the electrolyte filled in the plating bath is swept, A through hole communicating with the inner injection hole is formed in the front portion of the inner spray hole and an outer spray hole is formed in the front portion to communicate with the through hole so that the electrolyte injected through the inner spray hole and the electrolyte injected through the through hole are sprayed .

In addition, the supply pipe portion is formed with a connecting hole maintaining a predetermined distance along the longitudinal direction, and the injection bar is maintained at a constant interval along the longitudinal direction so as to receive the electrolyte solution from the connection hole, Hole and the outer injection hole are formed.

The diameter of the inner spray hole may be smaller than the diameter of the through hole and the outer spray hole, and the diameter of the through hole and the outer spray hole may be the same.

The vortex fan unit may further include a shaft portion having an upper shaft formed on the upper side of the outer jet hole and a lower shaft formed on the lower side of the outer jet hole and a shaft portion rotatably fitted to the upper shaft, And a fan unit including a fan and a lower fan rotatably fitted to the lower shaft, wherein a jetting space is formed between the upper fan and the lower fan.

In addition, a bellows portion is provided on the supply tube portion, an end portion of the bellows portion is provided to communicate with the coupling tube, a cylinder portion is provided on an outer surface of the supply tube portion, the elevation shaft of the cylinder portion is fixed to the coupling tube, And a vibration part is further provided on the outer surface of the housing.

In the integral nozzle device having a vortex jetting structure for increasing the flow rate of the present invention, a jetting bar having an inner jetting hole, a through hole and an outer jetting hole formed along a longitudinal direction is provided in a supply duct portion to which an electrolyte is supplied, A plurality of electrolytic solutions can be supplied and the ions can be uniformly distributed in the electrolytic solution without being biased by the electrolytic solution, thereby forming a plating layer having a uniform thickness on the substrate.

1 is a side view showing an integral nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention.
FIG. 2 is a side view showing a partial enlargement of the integral nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention.
3 is a front view enlarged view of an integral nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention.
4 is a view illustrating a process of injecting and vapourizing an electrolyte in an integral nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention.
FIG. 5 is a view showing the state of use of the integral nozzle device having the vortex jetting structure for increasing the flow rate according to the present invention.
6 is a view showing another embodiment of the integral nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention.
7 is a view showing another embodiment of the integral nozzle apparatus having a vortex jetting structure for increasing the flow rate according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an integral nozzle apparatus having a vortex jetting structure for increasing flow rate according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

In addition, the following embodiments are not intended to limit the scope of the present invention, but merely as an example, and various embodiments may be implemented through the present invention.

FIG. 1 is a side view showing an integral nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention, and FIG. 2 is a side view showing a partial enlargement of the integral nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention 3 is an enlarged front view of an integral nozzle apparatus having a vortex jetting structure for increasing the flow rate according to the present invention. FIG. 4 is a perspective view of the integral nozzle apparatus having a vortex jetting structure for increasing the flow rate according to the present invention, FIG. 5 is a view showing a state of use of the integral type nozzle device having a vortex jetting structure for increasing the flow rate according to the present invention, and FIG. 6 is a view for explaining an operation of increasing the flow rate FIG. 7 is a view showing another embodiment of the integral nozzle apparatus having a vortex jetting structure, and FIG. 7 is a cross- Fig. 5 is a view showing another embodiment of the integral nozzle apparatus having the nozzle unit shown in Fig.

As shown in the drawing, the integral nozzle apparatus 10 (hereinafter, referred to as a nozzle apparatus for convenience of explanation) having a vortex jetting structure for increasing the flow rate of the present invention is installed in a plating tank filled with an electrolyte solution, The nozzle device is composed of a supply pipe portion 20 and a spray bar 30. The nozzle device includes a supply pipe portion 20 and a spray pipe 30.

The coupling pipe 100 can be fastened to the plating vessel 100 and a frame can be fixed to the plating vessel 100. The frame can be screwed to a frame frame disposed above the plating vessel to transfer the substrate, It is also possible to fix it.

The supply pipe portion 20 is made of a metal material or a synthetic resin material. The supply pipe portion 21 is welded or screwed so that the upper portion is hermetically sealed to the coupling pipe as shown in FIG. 1, And a connection hole (22) is formed on the outer surface so as to communicate with the supply space (21).

The supply pipe portion 20 receives the electrolytic solution through the coupling pipe, and the coupling pipe is connected to the pump to supply the electrolytic solution to the supply pipe portion 20.

At this time, the electrolytic solution is filled in the plating vessel, and the electrolytic solution is transferred from the supply pipe 20 to the spray bar 30, and the electrolytic solution is sprayed from the spray bar 30 to the electrolytic solution filled in the plating bath Lt; / RTI >

The sprayer bar 30 receives and discharges the electrolytic solution delivered from the connection hole 22. The sprayer bar 30 is connected to the connection hole 22 so that the electrolytic solution filled in the plating vessel swirls and swirls. A through hole 32 having a structure penetrating to communicate with the inner spray hole 31 is formed in the side surface portion of the inner spray hole 31 so as to communicate with the through hole 32, So that the electrolyte injected from the inner injection hole 31 and the electrolyte solution flowing through the through hole 32 are injected.

The sprayer bar 30 is formed of a metal material or a synthetic resin material and welded or fused to the outer surface of the supply pipe 20 in a state where the connection hole 22 and the inner injection hole 31 are arranged to communicate with each other, .

At this time, it is preferable that the spray bar 30 is integrally formed with the supply pipe portion 20.

The electrolyte is injected into the inner injection hole 31 by the pressure of the pump and injected into the substrate through the outer injection hole 33 as shown in FIG. The electrolytic solution moves to the outer injection hole 33 and the electrolytic solution filled in the plating bath flows through the through hole 32 as shown in FIG. 4 due to the moving flow or the low pressure due to the speed at the time of the movement, The electrolytic solution around the spray bar 30 is vortexed while the filled electrolytic solution flows into the through hole 32 by moving to the outer spray hole 33 together with the plating liquid sprayed from the holes 31, It is possible to uniformly distribute the ions generated while the members are oxidized in the electrolyte to form a plating layer having a constant thickness on the substrate and to spray the electrolytic solution moving through the vortex and the outer spray holes 33 It is possible to remove the bubbles arranged on the substrate by a liquid electrolyte.

It is preferable that the supply tube portion 20 is supplied with an electrolyte filled in the plating vessel through a pump to circulate the electrolyte solution.

The connection pipe 22 is formed in the supply pipe 20 at a predetermined interval along the length of the supply pipe 20. The supply pipe 22 is provided with a connection hole 22, The inner spray holes 31, the through holes 32 and the outer spray holes 33 are formed at regular intervals and the electrolyte can be supplied to the entire substrate as shown in FIG.

The diameter of the inner injection hole 31 is formed to be smaller than the diameter of the through hole 32 and the outer injection hole 33 and the diameters of the through hole 32 and the outer injection hole 33 are formed to be the same The electrolytic solution flowing through the through hole 32 together with the electrolytic solution sprayed from the inner spray hole 31 can be sprayed through the outer arc spray hole and preferably the diameter of the through hole 32 is (33) is larger than the inner injection hole (31) and smaller than the outer injection hole (33).

6, the vortex fan unit 40 is installed in the outer injection hole 33. The vortex fan unit 40 includes an upper shaft 411 formed on the upper side of the outer injection hole 33 and a lower shaft 411 formed on the lower side And a lower fan 422 rotatably fitted in the lower shaft 412. The upper shaft 421 is rotatably fitted in the upper shaft 411 and the lower shaft 422 is rotatably fitted in the lower shaft 412. [ And the lower fan 422 and the upper fan 421. The ejection space 43 is formed between the upper fan 421 and the lower fan 422 so that the electrolyte injected into the outer ejection hole 33 is discharged into the ejection space The electrolytic solution is vortexed or vibrated by the upper and lower fans 421 and 422 which are rotated while being collided with the upper and lower fans 421 and 422 while being blown through the upper and lower fans 421 and 422, So that the ions can be uniformly distributed in the electrolyte without being biased.

7, the supply pipe 20 is provided with a bellows portion 23, an end of the bellows portion 23 is connected to the connection pipe, and an outer surface of the supply pipe portion 20 is provided with a cylinder And the vibrating part 25 is further provided on the outer surface of the supply pipe part 20 so that the operation of the cylinder part 24 It is possible to supply the electrolytic solution to the substrate while moving the supply pipe portion 20 by moving the supply pipe portion 20 so that the length of the supply pipe portion 20 and the spray bar 30 do not match the length of the substrate, It is possible to uniformly distribute the water and the bubbles disposed on the substrate by the vibration of the vibrating unit 25 and the swinging water.

The vibration unit 25 includes a vibration pad 251 having an internal vibration space 251a and being bonded or screwed to the outer surface of the supply pipe unit 20 and a vibration spring 251 disposed in the vibration space 251a, 252, and a vibrator 253 which is fused or screwed to the upper portion of the vibration pad 251.

The vibration of the vibrator 253 is sequentially transmitted to the supply pipe portion 20 through the vibration pad 251 to vibrate the electrolytic solution.

A vibration space 251a and a vibration spring 252 are formed inside the vibration pad 251 to buffer shocks caused by the vibration from being transmitted to the supply pipe portion 20.

It is preferable that the vibration spring 252 is inserted into the vibration space by forming a coupling groove in the upper part and the lower part of the vibration space 252. The support pipe 20 is provided with a support panel for supporting the vibration pad and the vibrator 253 .

10: nozzle device 20: supply tube
30: Minute Sabah 40: Whirlwind Pan
21: supply space 22: connection hole
23: Bellows 24: Cylinder part
25: vibrating part 251: vibration pad
251a: vibration space 252: vibration spring
253: a vibrator
31: Inner side spray hole 32: Through hole
33: Outside injection hole
41: shaft portion 411:
412: Lower shaft
42: pan section 421: upper pan
422: Lower fan
43: Spout space
100: Coupling tube

Claims (5)

1. A nozzle apparatus for supplying an electrolytic solution, which is installed in a plating vessel and is delivered through a coupling tube, to a substrate,
A supply pipe portion which is fastened to the coupling pipe and has one end closed, a supply space formed therein, and a connection hole formed on the outer surface so as to communicate with the supply space; And
And an injection hole for injecting and discharging the electrolytic solution delivered from the connection hole,
The sprayer includes an inner spray hole formed in a rear surface portion of the spray bowl so as to communicate with the connection hole so as to swirl the electrolytic solution filled in the plating tank, a through hole having a structure penetrating through the inner spray hole to communicate with the inner spray hole, And an electrolyte injected through the through hole is injected through the outer injection hole,
Wherein the supply pipe portion is formed with a connecting hole at a predetermined interval along the longitudinal direction,
The injection bar is provided with an inner spray hole, a through hole, and an outer spray hole, which are spaced apart from each other along the longitudinal direction so as to receive the electrolyte solution from the connection hole.
Wherein the diameter of the inner spray hole is smaller than the diameter of the through hole and the outer spray hole, the diameter of the through hole and the outer spray hole are the same,
A vortex fan unit is further installed in the outer injection hole,
Wherein the vortical fan portion includes a shaft portion having an upper shaft formed on the upper side of the outer injection hole and a lower shaft formed on the lower side,
And a fan unit including an upper fan rotatably fitted to the upper shaft and a lower fan rotatably fitted to the lower shaft,
An ejection space is formed between the upper fan and the lower fan,
Wherein a bellows portion is provided on the supply tube portion, and an end portion of the bellows portion is installed to be in communication with the coupling tube, and a cylinder portion is provided on an outer surface of the supply tube portion, an elevation shaft of the cylinder portion is fixed to the coupling tube, The electrolytic solution can be supplied to the substrate while moving while the supply pipe portion is lifted and lowered by the operation of the cylinder portion so that the length of the supply pipe portion and the spray bar are not matched with the length of the substrate, It is possible to uniformly distribute the ions and to remove the bubbles disposed on the substrate due to the oscillation of water and the vibrating portion,
The vibrating part includes a vibrating pad having an internal vibrating space and fixed to an outer surface of the supply tube part, a vibration spring arranged in the vibrating space, and a vibrator fused or screwed to the upper part of the vibrating pad,
The vibration of the vibrator is sequentially transmitted to the supply pipe portion through the vibration pad to vibrate the electrolytic solution,
A vibration space and a vibration spring are formed inside the vibration pad to buffer shocks caused by the vibration from being transmitted to the supply pipe portion,
Wherein the vibrating space is formed with coupling grooves in the upper and lower portions to allow the vibration spring to be inserted and further the support panel is further formed in the supply tube portion to support the vibration pad and the vibrator. Type nozzle unit.
delete delete delete delete
KR1020160024966A 2016-03-02 2016-03-02 One-piece device having a vortex nozzle Holes KR101735563B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160024966A KR101735563B1 (en) 2016-03-02 2016-03-02 One-piece device having a vortex nozzle Holes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160024966A KR101735563B1 (en) 2016-03-02 2016-03-02 One-piece device having a vortex nozzle Holes

Publications (1)

Publication Number Publication Date
KR101735563B1 true KR101735563B1 (en) 2017-05-15

Family

ID=58739536

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160024966A KR101735563B1 (en) 2016-03-02 2016-03-02 One-piece device having a vortex nozzle Holes

Country Status (1)

Country Link
KR (1) KR101735563B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117265609A (en) * 2023-11-20 2023-12-22 圆周率半导体(南通)有限公司 Electroplating equipment and method for improving uniformity of PCB hole filling electroplating copper plating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200408029Y1 (en) * 2005-11-01 2006-02-07 오리온오엘이디 주식회사 Nozzle for spraying cleansing solution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200408029Y1 (en) * 2005-11-01 2006-02-07 오리온오엘이디 주식회사 Nozzle for spraying cleansing solution

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117265609A (en) * 2023-11-20 2023-12-22 圆周率半导体(南通)有限公司 Electroplating equipment and method for improving uniformity of PCB hole filling electroplating copper plating
CN117265609B (en) * 2023-11-20 2024-04-09 圆周率半导体(南通)有限公司 Electroplating equipment and method for improving uniformity of PCB hole filling electroplating copper plating

Similar Documents

Publication Publication Date Title
CN107107618B (en) Ink gun and ink-jet recording apparatus
TWI756611B (en) Ultrasonic cleaning apparatus and ultrasonic cleaning system
KR101735563B1 (en) One-piece device having a vortex nozzle Holes
KR101916350B1 (en) Vertical continuous plating apparatus
KR101754792B1 (en) Plating apparatus having a plating electrode and the nozzle plate integral structure
JP2018126696A (en) Laminar flow ultrasonic cleaning apparatus
JP3501747B2 (en) Plating solution jet nozzle system with adjustable flow rate of plating equipment
KR101137776B1 (en) Substrate plating device havung structure of dust removal
JP3340724B2 (en) Plating solution jet nozzle device for plating equipment
KR101783880B1 (en) Variable nozzle device having a vortex Holes
CN114425498B (en) Catalyst support impregnation apparatus and method
KR101652481B1 (en) chemical coating apparatus using double slit nozzle
JP2003200090A (en) Spray nozzle for printed circuit board and wet line facility using the nozzle
JP2007000844A (en) Apparatus for generating fine bubble
JP2018001143A (en) Pipe inside washing device and pipe inside washing method
JP2021053703A (en) Local soldering nozzle and local soldering device
KR102010064B1 (en) Plating apparatus
KR102384218B1 (en) Apparatus for dispensing
JP2006294762A (en) Substrate processing apparatus
JPH05129266A (en) Method and equipment for cleaning
KR20180045142A (en) An ultrasonic cleaning apparatus and ultrasonic cleaning system including the same
KR101804457B1 (en) Vibration generating device for plating for Degassing
KR101593378B1 (en) Spraying apparatus for plating solution on printed circuit board
JP2663615B2 (en) Cleaning method
JP2001062350A (en) Liquid injection device

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant