JP3340724B2 - Plating solution jet nozzle device for plating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating solution jet nozzle device for a plating apparatus which improves the uniformity of a plating film.

[0002]

2. Description of the Related Art There is known a plating apparatus provided with a plating solution jetting nozzle device having a large number of nozzles for jetting a plating solution toward a product to be plated. On the other hand, when plating on the surface of a product (W) such as a product having a flat surface or a printed circuit board having a through hole or a blind via hole as shown in FIG. 6, a flat product surface ( It is necessary to apply a plating film having a uniform thickness to H1). In the case of a product having a through hole or a blind via hole, these through hole (H2) or blind via hole (H
It is necessary to apply a plating film (P) having a uniform thickness similar to that of the other product surface (H1) also in 3). However, in particular, it is difficult to apply a plating film having a uniform thickness similar to that of other product surfaces also on the through hole portion and the blind via hole portion.

[0003]

In view of such circumstances, the present inventor has proposed that the plating solution can be uniformly sprayed onto the surface of the product to be plated, so that the surface of the product to be plated can be uniformly coated. The thickness of the plating film can be formed, especially for products such as printed circuit boards with formed through holes and blind via holes. An object of the present invention is to provide a plating solution jetting nozzle device capable of forming a uniform plating film.

[0004]

The plating solution jetting nozzle device of the plating apparatus provided by the present invention has a large number of jetting holes formed along the direction of supplying the plating solution in the pipe, and these jetting holes are formed in a plating solution tank. A nozzle pipe installed to be disposed in the plating solution in the plating solution supply pipe connecting the nozzle pipe to a circulation pump installed outside the plating solution tank via a branch pipe; A suction port is provided in the plating solution in the plating solution tank, and a plating solution recovery pipe connected to the circulation pump at the other end is provided, and the plating solution is plated from the ejection hole of the nozzle tube. A plating solution jetting nozzle device of a plating device configured to jet toward a product, wherein the nozzle pipe is branched from the branch pipe provided side by side along a transfer direction of a product to be plated. At a predetermined interval in the piping arranged in upright position, and a and that through the product to be plated processed by oppositely arranged in upright position, and has the features described below.

In other words, the plating solution jetting nozzle device of the present invention comprises the nozzle mounted on the branch pipe in an upright state.
The nozzle pipe is ejected from the ejection hole formed in the nozzle pipe.
The direction of jetting of the plating solution is arbitrary in the direction around the nozzle tube.
So that the end of the nozzle tube is
Characterized by being attached to the branch pipe in a threaded state.
You.

[0006] With this configuration, the jetting direction of the plating solution spouted from the spout hole of each nozzle tube can be effectively spouted into the blind via hole portion of the product in which the blind via hole is formed. Can be oriented at an angular position and can form a plating film with a uniform thickness on the blind via hole as well as other product surfaces, thus improving the uniformity of plating especially on products with blind via holes Can be done.

Further, the plating solution jetting nozzle device of the present invention is characterized in that a plurality of nozzle tubes formed at predetermined intervals along the pipe direction of the nozzle pipe are provided on the nozzle pipe which is attached to the branch pipe in an upright state. The diameter of the ejection holes is gradually reduced from the upper side to the lower side so as to equalize the ejection amount of the plating solution ejected from each ejection hole. With this configuration, it is possible to equalize the ejection amount of the plating solution ejected from each ejection hole having a height difference formed in the nozzle tube without being affected by the water pressure,
The uniformity of plating can be improved.

Further, in the plating solution jetting nozzle apparatus of the present invention, a reinforcing member extending along the pipe direction of the nozzle pipe is fixedly attached to the nozzle pipe, and a predetermined member is fixed to the reinforcing member. A large number of long holes are formed at intervals, and these long holes are formed as the ejection holes by communicating these long holes with the inside of the nozzle tube. With this configuration, the shape and linear accuracy of the nozzle tube made of plastic tube can be reinforced so as not to be deformed by the influence of heat in the plating solution, and the straightness of the plating solution ejected through the long holes can be improved. In particular, it is possible to improve the uniformity of plating on a product in which a through hole including a long hole or a small hole diameter is formed.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partial longitudinal side view of a plating apparatus provided with a plating solution jet nozzle apparatus, and FIG.
2 is a partially enlarged front view of the plating solution jetting nozzle device shown in FIG. 3, FIG. 3 is an enlarged cross-sectional plan view taken along the line AA of FIG. 2, and FIG. 4 is a plan view schematically showing the plating solution jetting nozzle device. FIG. 5 is a plan view schematically showing a plating solution jetting nozzle device.

The plating solution jetting nozzle device of the plating apparatus shown in FIGS. 1 to 5 has a large number of jetting holes 2 formed along the direction of supplying the plating solution in the tube. And a nozzle pipe 1 provided to be disposed in the plating solution A therein and a circulating pump 5 provided outside the plating solution tank 3 via the branch pipe 4. A liquid supply pipe 6 and a plating liquid recovery pipe 7 having a suction port 8 disposed in the plating liquid A in the plating liquid tank 3 and having the other end connected to the circulation pump 5.
The plating liquid is ejected from the ejection hole 2 of the nozzle tube 1 toward a product W (in this embodiment, a substantially sheet-shaped printed circuit board is shown) to be plated. . Then, the nozzle pipe 1 branches from the branch pipe 4 provided side by side along the transfer direction of the product W to be plated, and is arranged in a standing state at a predetermined interval to the branch pipe 4, And the product W to be plated
It is opposed to an upright state via. In addition, that the nozzle tube 1 is opposed to the upright state via the product W to be plated means that the nozzle tube 1 is opposed to the left-right symmetric position across the product W to be plated as shown in FIGS. In addition to what you set up,
This also includes a device that is provided at a position shifted in the transfer direction of the product W across the product W.

In FIG. 1, reference numeral 10 denotes an anode in which an anode ball or the like is housed in an anode bag, and 11 denotes a jig (a hanger and a hanger) for holding an upper end of a product W to be plated serving as a cathode in a suspended state. This jig 11 is slidably held by a cathode bar 12. The plating apparatus shown in FIG. 1 performs plating while the product W is transferred horizontally in the plating solution A in the plating solution tank 3 as shown in FIGS. Is branched vertically from the branch pipe 4 installed along the transfer path of the product W,
A blind cap 1 is provided at the lower end of the vertically provided nozzle tube 1.
It is blocked by 3. The nozzle tube 1 provided in the plating solution A in the plating solution tank 3 is formed of a non-conductive material, preferably a plastic of a non-conductive material.

Each nozzle hole 2 of the nozzle tube 1 has a nozzle tube opposed to an upright state via a product W to be plated, as shown by an arrow of a plating solution in FIG. Each of the ejection holes 2 is arranged alternately and alternately along the standing direction. With this configuration,
It is easy to make the ejection position of the plating solution ejected from each ejection hole 2 correspond to each through-hole portion (H2) of the product in which a large number of through-holes are formed. It is possible to form a plating film (P) having a uniform thickness similar to that of the product surface (H1), and thus it is possible to improve the uniformity of plating on a product having a large number of through holes.

The nozzle pipe 1 attached to the branch pipe 4 in an upright state, as shown in FIG. 5, ejects a plating solution ejected from an ejection hole 2 formed in the nozzle pipe 1. The pipe end of the nozzle tube 1 is directed to an arbitrary position in the direction around the nozzle tube 1 (in the case of forming the nozzle tube 1 into a cylindrical shape as in the illustrated embodiment, the circumferential direction of the tube). Is screwed to the branch pipe 4. In the embodiment shown in FIG. 2, a male screw part 15 (screw shape is omitted) is formed on the outer periphery of the pipe end of the nozzle pipe 1, and this male screw part 15 is formed on the branch pipe 4 formed of a square pipe. It is screwed to a female screw portion 16 fixed to the lower surface (the female screw portion 16 is communicated with the inside of the branch pipe 4). Of course, the branch pipe 4 side may be a male thread, and the pipe end side of the nozzle pipe 1 may be a female thread.
With this configuration, the jetting direction of the plating solution jetted from the jet holes 2 of each nozzle tube 1 can be effectively controlled for each of the nozzle tubes 1 with respect to the blind via hole portion (H3) of the product in which the blind via hole is formed. Blind beer hole (H3)
In addition, a plating film (P) having a uniform thickness similar to that of the other product surface (H1) can be formed, and therefore, it is possible to improve the uniformity of plating particularly on a product in which a blind via hole is formed.

Further, the plating solution jetting nozzle device of the present invention is formed at a predetermined interval along the pipe direction of the nozzle pipe 1 on the nozzle pipe 1 attached to the branch pipe 4 in an upright state. Although not shown, the diameter of the large number of ejection holes 2 is formed so as to gradually decrease from the top to the bottom so that the ejection amount of the plating solution ejected from each ejection hole 2 can be equalized. is there. The diameter of each of the jet holes 2 is
It may be formed so that it gradually decreases gradually from the upper part to the lower part, or a group of the plurality of ejection holes 2 having the same diameter is formed so as to gradually decrease from the upper part to the lower part. Is also good. With such a configuration, the amount of the plating solution jetted from each of the jet holes 2 having a height difference formed in the nozzle tube 1 can be equalized without being affected by the water pressure, and the plating can be made uniform. Can be improved.

As shown in FIGS. 1 to 3, the plating solution jetting nozzle apparatus of the present invention has a plastic wall thickness extending from the nozzle tube 1 along the direction of the nozzle tube 1. The reinforcing member 20 is fixed to an attached state by an adhesive means, and a number of long holes 21 are formed in the reinforcing member 20 at predetermined intervals. Each of the long holes 21 is configured as the ejection hole 2 by communicating with the inside of the pipe. Means for connecting each elongated hole 21 of the reinforcing member 20 to the inside of the nozzle tube 1 is such that each ejection hole 2 formed in the nozzle tube 1 matches each elongated hole 21 of the reinforcing member 20. However, this can be easily achieved by forming the longitudinal grooves 22 corresponding to the entire formation range of each of the long holes 21 in the nozzle tube 1. With this configuration, the pipe shape and linear accuracy of the nozzle tube 1 made of a plastic tube can be reinforced so as not to be deformed by the influence of heat in the plating solution, and the plating solution ejected through the long holes 21. The straightness of the product can be improved, and in particular, the uniformity of plating can be improved for a product in which a through hole formed of a long hole or a small hole diameter is formed.

[0016]

According to the plating liquid jet nozzle apparatus of the plating apparatus of the present invention having the above-described structure, the plating liquid can be uniformly jetted toward the surface of the product to be plated. A plating film having a uniform thickness can be formed on the surface of the product. In particular, even for products such as printed circuit boards with through holes and blind via holes, a uniform plating film similar to the surface of other products can be formed in the through holes and blind via holes. The uniformity of plating on a product such as a printed circuit board having a via hole can be remarkably improved.

[Brief description of the drawings]

FIG. 1 is a partial longitudinal side view of a plating apparatus provided with a plating solution jetting nozzle apparatus.

FIG. 2 is a partially enlarged front view of the plating solution jetting nozzle device shown in FIG.

FIG. 3 is an enlarged cross-sectional plan view taken along the line AA of FIG. 2;

FIG. 4 is a plan view schematically showing a plating solution jetting nozzle device.

FIG. 5 is a plan view schematically showing a plating solution ejection nozzle device.

FIG. 6 is an enlarged vertical sectional side view of a product showing a plating state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Nozzle pipe 2 Injection hole 3 Plating liquid tank 4 Branch pipe 5 Circulation pump 6 Plating liquid supply pipe 7 Plating liquid recovery pipe 8 Suction port 10 Anode 11 Jig 12 Cathode bar 13 Blind cap 15 Male screw part 16 Female screw part 20 Reinforcing member 21 Slot 22 Vertical slot A Plating solution W Product

Claims (3)

(57) [Claims] 1. A nozzle pipe having a number of ejection holes formed along a plating solution supply direction in a tube, the nozzle holes being provided so as to be arranged in the plating solution in a plating solution tank, A plating solution supply pipe for connecting the nozzle pipe to a circulation pump provided outside the plating solution tank via a branch pipe, and a suction port provided in the plating solution in the plating solution tank; A plating solution recovery pipe connected to the circulation pump, and a plating solution ejection nozzle device of a plating device configured to eject a plating solution from an ejection hole of the nozzle tube toward a product to be plated. And the nozzle pipe is branched from the branch pipe provided side by side along the transfer direction of the product to be plated, and the nozzle pipe is arranged in an upright state at a required interval to the branch pipe, and the plating processing is performed. Products The nozzle pipe attached to the branch pipe in the upright state is connected to the branch pipe by changing the jetting direction of the plating solution ejected from an ejection hole formed in the nozzle pipe into the nozzle pipe. A plating solution jetting nozzle device for a plating apparatus, wherein a pipe end of the nozzle pipe is screwed to the branch pipe so as to be directed to an arbitrary position in a pipe circumferential direction of the pipe. 2. A nozzle tube having a plurality of ejection holes formed along a plating solution supply direction in the tube, and having these ejection holes disposed in the plating solution in the plating solution tank. A plating solution supply pipe for connecting the nozzle pipe to a circulation pump provided outside the plating solution tank via a branch pipe, and a suction port provided in the plating solution in the plating solution tank; A plating solution recovery pipe connected to the circulation pump, and a plating solution ejection nozzle device of a plating device configured to eject a plating solution from an ejection hole of the nozzle tube toward a product to be plated. And the nozzle pipe is branched from the branch pipe provided side by side along the transfer direction of the product to be plated, and the nozzle pipe is arranged in an upright state at a required interval to the branch pipe, and the plating processing is performed. Products A large number of ejection holes formed at predetermined intervals along the pipe direction of the nozzle pipe in the nozzle pipe attached to the branch pipe in an upright state. Characterized in that the hole diameter of the plating liquid is gradually reduced from the upper part to the lower part so that the amount of the plating liquid ejected from each ejection hole can be equalized. 3. A nozzle tube having a plurality of ejection holes formed along a plating solution supply direction in the tube, the nozzle holes being provided so as to be arranged in the plating solution in a plating solution tank, and A plating solution supply pipe for connecting the nozzle pipe to a circulation pump provided outside the plating solution tank via a branch pipe, and a suction port provided in the plating solution in the plating solution tank; A plating solution recovery pipe connected to the circulation pump, and a plating solution ejection nozzle device of a plating device configured to eject a plating solution from an ejection hole of the nozzle tube toward a product to be plated. And the nozzle pipe is branched from the branch pipe provided side by side along the transfer direction of the product to be plated, and the nozzle pipe is arranged in an upright state at a required interval to the branch pipe, and the plating processing is performed. Products A reinforcing member extending along the pipe direction of the nozzle pipe is fixed to the nozzle pipe in an attached state, and a predetermined interval is provided between the reinforcing members. A plurality of long holes are formed, and these long holes are communicated with the inside of the nozzle tube to form each of the long holes as the ejection hole. Nozzle device.