KR101696713B1 - Substrate align device - Google Patents

Substrate align device Download PDF

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Publication number
KR101696713B1
KR101696713B1 KR1020150113418A KR20150113418A KR101696713B1 KR 101696713 B1 KR101696713 B1 KR 101696713B1 KR 1020150113418 A KR1020150113418 A KR 1020150113418A KR 20150113418 A KR20150113418 A KR 20150113418A KR 101696713 B1 KR101696713 B1 KR 101696713B1
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KR
South Korea
Prior art keywords
substrate
unit
photographing
aligning
suction
Prior art date
Application number
KR1020150113418A
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Korean (ko)
Inventor
박금성
홍현수
Original Assignee
주식회사 영우디에스피
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Priority to KR1020150113418A priority Critical patent/KR101696713B1/en
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Publication of KR101696713B1 publication Critical patent/KR101696713B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An objective of the present invention is to provide a substrate aligning device which can be efficiently controlled. To achieve the objective, the substrate aligning device comprises: a table unit having horizontal and vertical lengths different from each other, wherein a substrate of a rectangular plate shape is transported to be seated thereon; a suction unit positioned on an upper portion of the table unit to suck the substrate placed on the table unit; a plurality of camera units to photograph the substrate seated on the table unit and the substrate sucked on the suction unit; a table aligning unit to move the table unit; a suction unit aligning unit to horizontally rotate the suction unit to align the suction unit; an upper support unit mounted on an upper portion of the suction unit to horizontally rotate a center of the suction unit; a protruding part wherein the suction unit aligning unit is fixed on one side of the upper support unit corresponding to an edge of the suction unit; a rotary shaft installed on the protruding part; an upper Y-axis moving unit installed on the rotary shaft; an upper X-axis moving unit installed on the suction unit; and a moving bracket to be relatively moved with respect to the protruding part and the suction unit by the upper Y-axis moving unit and the upper X-axis moving unit.

Description

[0001] Substrate align device [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for processing a substrate for a display, and more particularly, to an apparatus for aligning positions before and after adsorption of a substrate during substrate suction transfer.

In recent years, as the society has become a full-fledged information age, the display industry has been rapidly developed to visually display various electrical signal information. In response to this, a liquid crystal display (LCD) having advantages of weight reduction, thinning and low power consumption A liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED), and an electroluminescence display device (ELD) Substrates have been introduced to replace CRT (Cathode Ray Tube).

In general, a display substrate is manufactured by interposing a unique fluorescent or polarizing material layer between a pair of transparent substrates, and then bonding them to each other. Recently, pixels, which are image display basic units, are arranged in a matrix on these display substrates, An active matrix type in which each switching element is individually controlled is widely used because of its excellent video performance and color reproducibility.

The manufacturing process of the display substrate includes a thin film deposition process for forming a thin film of a predetermined material on the substrate surface, a photolithography process for exposing a selected portion of the thin film, a process for removing the exposed portion of the thin film, The etching process for patterning is repeated several times, and a lot of processes such as cleaning and cutting are carried out.

In addition, various manufacturing processes of these display substrates are performed in manufacturing equipment unique to each process, and the substrate, which is an object to be processed, is transferred to each manufacturing equipment through adsorption. In this process, A device for substrate alignment is arranged between each manufacturing equipment.

However, in the conventional substrate aligning apparatus, it is difficult to grasp the misalignment state of the substrate generated during the adsorption process, and since the poor alignment state can not be corrected, there is a problem that the accuracy of the substrate adsorption transfer is greatly reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate alignment apparatus capable of precisely aligning a substrate having a poor alignment state during an adsorption process.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

In order to accomplish the above object, the present invention provides a substrate processing apparatus comprising: a table portion having a transverse length and a longitudinal length different from each other and having a rectangular plate shape transferred and seated; A plurality of camera units for photographing a substrate held on the table unit and a substrate attracted to the suction unit, a table alignment unit for moving the table unit, and an adsorption unit alignment unit for horizontally rotating the adsorption unit and; An upper supporting part coupled to the upper part of the suction part such that the suction part can rotate horizontally; And the upper portion of the upper portion of the adsorbing portion is fixed to the upper portion of the upper support portion corresponding to the edge of the adsorption portion, And a moving bracket provided so as to be capable of relative movement with respect to the protruding piece and the attracting portion through an upper portion and an upper portion of the upper X-axis and an upper portion of the upper Y-axis.

Here, the plurality of camera units may include a pair of a horizontal photographing lower camera unit for photographing a horizontal alignment mark of the board placed on the table unit, and a pair of photographing units for photographing the vertical alignment marks of the board, And a lower camera unit.

The table alignment unit may include at least one of a Y-axis moving unit that moves the table unit in a direction in which the substrate is conveyed, an X-axis moving unit that moves the table unit in a direction perpendicular to the direction in which the substrate is conveyed, and a rotating unit that rotates the table unit .

A pair of horizontal photographing upper camera portions for photographing lateral alignment marks of the substrate attracted to the adsorption portions and a pair of vertical photographing upper cameras for photographing vertical alignment marks of the substrate adsorbed to the adsorption portions, And the like.

delete

The substrate aligning apparatus according to an embodiment of the present invention has a function of aligning the substrate to the correct position before the adsorption and further aligning the adsorbed state after the adsorption so that the substrate can be adsorbed and transferred in a highly precise state.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view of a substrate alignment apparatus according to an embodiment of the present invention;
[0001] The present invention relates to a substrate aligning apparatus and, more particularly, to a substrate aligning apparatus and a substrate aligning apparatus.
FIG. 3 is a side view schematically showing an operation state of a table part, a mounting state and a table part between a table part and a moving part in a substrate aligning device according to an embodiment of the present invention; FIG.
FIG. 5 is a block diagram illustrating a relationship among main components constituting a substrate aligning apparatus according to an embodiment of the present invention. FIG.
5 is a plan view showing the movement and rotation of the table portion.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In describing the present embodiment, the same designations and the same reference numerals are used for the same components, and further description thereof will be omitted. First, a configuration according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view of a substrate alignment apparatus according to an embodiment of the present invention. FIG. 2 is a sectional view of a substrate alignment apparatus according to an embodiment of the present invention. 3 is a plan view of a substrate aligning apparatus according to an embodiment of the present invention. The table aligning portion 172 includes a table portion 172, A mounting state between the upper and lower shovels, and an operation process of the table portion.

As shown in the figure, the substrate aligning apparatus 100 according to an embodiment of the present invention includes a table portion 172, a vertically movable portion, a table aligning portion, and a suction portion 110. Here, the table unit 172 has a structure in which the substrate is transferred and seated, and a separate substrate transfer unit 192 (see FIG. 4) for transferring the substrate to the table unit 172 is provided . The substrate transfer unit 192 is provided in the outer X axis or Y axis direction of the table unit 172 so that the substrate can be transferred to the table unit 172 along the X axis and the Y axis.

The upper and lower moving parts 185 and 174 may be provided to move the table part 172 and the lower holding part 174 up and down in the Z axis, have.

The upper and lower moving parts 185 may be an LM guide module or a ball screw module. The configuration in which the LM guide module and the ball screw module are translationally moved has already been described in various forms and is obvious to those skilled in the art, so a detailed description thereof will be omitted.

The table aligning portion includes an X-axis moving portion 184 for translating the table portion 172 along the X-axis, a Y-axis moving portion 188 for translating the table portion 172 along the Y-axis, And a rotation unit 182 that rotates the table unit 172 with respect to the central portion of the table unit 172. Here, the X-axis moving part 184 and the Y-axis moving part 188 may also be applied to the LM guide module or the ball screw module.

The X-axis moving part 184 and the Y-axis moving part 188 and the rotating part 182 are connected to the lower holding part 174 so that the lower holding part 174 and the table part 172 are simultaneously moved to the X- Y-axis and a rotational movement with respect to the central portion of the table portion 172 is possible.

The adsorption unit 110 is disposed at a predetermined position above the table unit 172. The adsorption unit 110 is horizontally rotatable about the center of the upper support unit 120 Thereby forming a combined configuration.

Here, the adsorption unit 110 has a flat bottom in order to adsorb the substrate by a vacuum method, and a plurality of adsorption holes (not shown) are provided over the entire lower surface. The suction holes are connected to a separate vacuum module (not shown) so that the inside of the suction holes can be vacuumed according to the operation of the vacuum module.

The camera units 132a, 132b, 134a, and 134b are used to grasp the seating state of the substrate placed on the table unit 172. As shown in the figure, a plurality of upper and lower camera units 132a, A pair of horizontal photographing lower camera portion 132a for photographing the horizontal alignment marks of the board transferred to the main body 172 and a pair of vertical photographing lower camera portions 132b for photographing the vertical direction alignment marks of the board .

That is, when the substrate is transported in the horizontal direction and in the vertical direction, the horizontal lower imaging camera portion 132a and the vertical imaging lower camera portion 132b are moved in the horizontal direction alignment mark and the vertical direction alignment mark And it is possible to determine whether the substrate transferred using the lower camera units 132a and 132b is transferred in the X-axis direction or the Y-axis direction and is transferred to the correct position.

The substrate aligning apparatus 100 according to the present embodiment includes a pair of horizontal photographing upper camera portion 134a for photographing a horizontal alignment mark of the substrate attracted to the adsorbing portion 110, And a pair of vertical camera units 134b for photographing the vertical alignment marks of the substrate that are attracted to the upper camera units 134a and 134b. It is possible to grasp in which direction the adsorbent was adsorbed.

In addition, the substrate aligning apparatus 100 according to the present embodiment further includes an adsorption section aligning section. The adsorbing portion aligning portion functions to finely rotate the substrate attracted to the adsorbing portion 110. The adsorbing portion aligning portion includes a protruding piece 122, a moving bracket 155, an upper X Axis includes a moving part 151 and an upper Y-axis moving part 152.

1, the suction portion alignment portion includes protruding pieces 122 fixed to one side of the upper support portion 120 corresponding to the edge of the suction portion 110, An upper Y axis moving part 152 provided on the rotating shaft 121 and an upper X axis moving part 151 provided on the suction part 110 and an upper X axis moving part 151 disposed on the rotating shaft 121, And a moving bracket 155 installed to allow relative movement of the protruding piece 122 and the suction unit 110 through the upper part Y-axis moving part 152.

Here, the upper X-axis moving part 151 and the upper Y-axis moving part 152 may be an LM guide module or a ball screw module.

FIG. 4 is a block diagram illustrating a relationship among major components of a substrate alignment apparatus according to an embodiment of the present invention. Referring to FIG.

The substrate aligning apparatus 100 according to the present embodiment may further include a controller 195. The substrate aligning apparatus 100 according to an exemplary embodiment of the present invention includes the rotation unit 182, the substrate transfer unit 192, . At this time, the upper camera units 134a and 134b and the lower camera units 132a and 132b are also electrically connected to the controller 195.

A method of aligning a substrate using the substrate aligning apparatus according to an embodiment of the present invention will now be described.

First, the substrate is transferred to the upper portion of the table portion 172 using the transfer portion 192.

After that, the horizontal lower imaging camera portion 132a or the vertical imaging lower camera portion 132b positioned on the table portion 172 is moved to the upper portion of the table portion 172, The photographing is performed so that the position and the position of the substrate coincide with the predetermined position.

At this time, when the mounting position of the substrate is different from the preset position, the X-axis moving part 184 or the Y-axis moving part 188 or the rotating part 182 moves the table part 172 as shown in FIG. So that the substrate is positioned at the set position.

The position-corrected substrate is moved to the lower side of the adsorption unit 110 through the upper and lower movable units 185, and then the adsorption unit 110 adsorbs the substrate through the adsorption holes.

After that, the horizontal photographing upper camera section 134a or the vertical photographing section camera section 134b takes another photograph to determine whether the substrate adsorbed by the adsorption section 110 has been adsorbed to the set position, When the adsorption position is different from the predetermined adsorption position, the upper X-axis moving part 151 and the upper Y-axis moving part 152 provided at the edge of the adsorption part 110 are simultaneously operated, The position can be finely rotated and precisely recalibrated.

Through this process, the substrate adsorbed to the correct position is transferred to the next process step.

As described above, according to the substrate aligning apparatus according to the embodiment of the present invention, the substrate can be aligned to the correct position regardless of the direction of the substrate to be transported.

Furthermore, after the substrate before the adsorption is aligned in the correct position, even after the adsorption is carried out, the adsorption transfer of the substrate can be carried out very precisely by further re-adjusting in the adsorbed state.

It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or scope of the invention as defined in the appended claims. It is obvious to them. Therefore, the above-described embodiments are to be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, but may be modified within the scope of the appended claims and equivalents thereof.

100: substrate alignment device 110:
120: Support part 132a:
132b: vertical length lower camera part 134a: horizontal length upper camera part
134b: vertical length upper camera part 172: table part
174: lower support portion 182:
184: X-axis is east 185: Shanghai is east
188: Y-axis moving section 195:

Claims (5)

A table placed on the top of the table portion for attracting the substrate placed on the table portion, a substrate placed on the table portion, A table aligning unit for moving the table unit; and an adsorption unit aligning unit for horizontally rotating the adsorption unit to align the plurality of camera units;
An upper supporting part coupled to the upper part of the suction part such that the suction part can rotate horizontally;
And the upper portion of the upper portion of the adsorbing portion is fixed to the upper portion of the upper support portion corresponding to the edge of the adsorption portion, And a moving bracket provided so that the upper X-axis and the upper Y-axis are movable relative to the protruding piece and the attracting part through the moving part. The method according to claim 1,
Wherein the plurality of camera units comprise:
A pair of horizontal photographing lower camera parts for photographing horizontal alignment marks of the board placed on the table part; And
A pair of vertical photographing lower camera parts for photographing vertical alignment marks of the board placed on the table part;
Wherein the substrate alignment apparatus comprises: The method according to claim 1,
Wherein the table aligning portion comprises a Y-axis moving portion for moving the table portion in a direction in which the substrate is conveyed, an X-axis moving portion for moving the table portion in a direction perpendicular to the feeding direction of the substrate, and a rotating portion for rotating the table portion Substrate alignment device. The method according to claim 1,
A pair of horizontal photographing upper camera parts for photographing horizontal alignment marks of the substrate attracted to the suction part; And
A pair of vertical photographing upper camera parts for photographing vertical alignment marks of the substrate attracted to the suction part;
Further comprising: a substrate holder for holding the substrate; delete
KR1020150113418A 2015-08-11 2015-08-11 Substrate align device KR101696713B1 (en)

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Application Number Priority Date Filing Date Title
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100853298B1 (en) * 2007-06-28 2008-08-20 주식회사 프로텍 An align method of a substrate
KR20130047296A (en) * 2011-10-31 2013-05-08 주식회사 로보스타 Vision tracking system
KR101261266B1 (en) * 2010-11-03 2013-05-09 유병소 Laser processing device and laser processing method using the same
JP2013125795A (en) * 2011-12-13 2013-06-24 Panasonic Corp Substrate positioning device and substrate positioning method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100853298B1 (en) * 2007-06-28 2008-08-20 주식회사 프로텍 An align method of a substrate
KR101261266B1 (en) * 2010-11-03 2013-05-09 유병소 Laser processing device and laser processing method using the same
KR20130047296A (en) * 2011-10-31 2013-05-08 주식회사 로보스타 Vision tracking system
JP2013125795A (en) * 2011-12-13 2013-06-24 Panasonic Corp Substrate positioning device and substrate positioning method

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