KR101696713B1 - Substrate align device - Google Patents
Substrate align device Download PDFInfo
- Publication number
- KR101696713B1 KR101696713B1 KR1020150113418A KR20150113418A KR101696713B1 KR 101696713 B1 KR101696713 B1 KR 101696713B1 KR 1020150113418 A KR1020150113418 A KR 1020150113418A KR 20150113418 A KR20150113418 A KR 20150113418A KR 101696713 B1 KR101696713 B1 KR 101696713B1
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- KR
- South Korea
- Prior art keywords
- substrate
- unit
- photographing
- aligning
- suction
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for processing a substrate for a display, and more particularly, to an apparatus for aligning positions before and after adsorption of a substrate during substrate suction transfer.
In recent years, as the society has become a full-fledged information age, the display industry has been rapidly developed to visually display various electrical signal information. In response to this, a liquid crystal display (LCD) having advantages of weight reduction, thinning and low power consumption A liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED), and an electroluminescence display device (ELD) Substrates have been introduced to replace CRT (Cathode Ray Tube).
In general, a display substrate is manufactured by interposing a unique fluorescent or polarizing material layer between a pair of transparent substrates, and then bonding them to each other. Recently, pixels, which are image display basic units, are arranged in a matrix on these display substrates, An active matrix type in which each switching element is individually controlled is widely used because of its excellent video performance and color reproducibility.
The manufacturing process of the display substrate includes a thin film deposition process for forming a thin film of a predetermined material on the substrate surface, a photolithography process for exposing a selected portion of the thin film, a process for removing the exposed portion of the thin film, The etching process for patterning is repeated several times, and a lot of processes such as cleaning and cutting are carried out.
In addition, various manufacturing processes of these display substrates are performed in manufacturing equipment unique to each process, and the substrate, which is an object to be processed, is transferred to each manufacturing equipment through adsorption. In this process, A device for substrate alignment is arranged between each manufacturing equipment.
However, in the conventional substrate aligning apparatus, it is difficult to grasp the misalignment state of the substrate generated during the adsorption process, and since the poor alignment state can not be corrected, there is a problem that the accuracy of the substrate adsorption transfer is greatly reduced.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate alignment apparatus capable of precisely aligning a substrate having a poor alignment state during an adsorption process.
The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.
In order to accomplish the above object, the present invention provides a substrate processing apparatus comprising: a table portion having a transverse length and a longitudinal length different from each other and having a rectangular plate shape transferred and seated; A plurality of camera units for photographing a substrate held on the table unit and a substrate attracted to the suction unit, a table alignment unit for moving the table unit, and an adsorption unit alignment unit for horizontally rotating the adsorption unit and; An upper supporting part coupled to the upper part of the suction part such that the suction part can rotate horizontally; And the upper portion of the upper portion of the adsorbing portion is fixed to the upper portion of the upper support portion corresponding to the edge of the adsorption portion, And a moving bracket provided so as to be capable of relative movement with respect to the protruding piece and the attracting portion through an upper portion and an upper portion of the upper X-axis and an upper portion of the upper Y-axis.
Here, the plurality of camera units may include a pair of a horizontal photographing lower camera unit for photographing a horizontal alignment mark of the board placed on the table unit, and a pair of photographing units for photographing the vertical alignment marks of the board, And a lower camera unit.
The table alignment unit may include at least one of a Y-axis moving unit that moves the table unit in a direction in which the substrate is conveyed, an X-axis moving unit that moves the table unit in a direction perpendicular to the direction in which the substrate is conveyed, and a rotating unit that rotates the table unit .
A pair of horizontal photographing upper camera portions for photographing lateral alignment marks of the substrate attracted to the adsorption portions and a pair of vertical photographing upper cameras for photographing vertical alignment marks of the substrate adsorbed to the adsorption portions, And the like.
delete
The substrate aligning apparatus according to an embodiment of the present invention has a function of aligning the substrate to the correct position before the adsorption and further aligning the adsorbed state after the adsorption so that the substrate can be adsorbed and transferred in a highly precise state.
The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.
1 is a perspective view of a substrate alignment apparatus according to an embodiment of the present invention;
[0001] The present invention relates to a substrate aligning apparatus and, more particularly, to a substrate aligning apparatus and a substrate aligning apparatus.
FIG. 3 is a side view schematically showing an operation state of a table part, a mounting state and a table part between a table part and a moving part in a substrate aligning device according to an embodiment of the present invention; FIG.
FIG. 5 is a block diagram illustrating a relationship among main components constituting a substrate aligning apparatus according to an embodiment of the present invention. FIG.
5 is a plan view showing the movement and rotation of the table portion.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In describing the present embodiment, the same designations and the same reference numerals are used for the same components, and further description thereof will be omitted. First, a configuration according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view of a substrate alignment apparatus according to an embodiment of the present invention. FIG. 2 is a sectional view of a substrate alignment apparatus according to an embodiment of the present invention. 3 is a plan view of a substrate aligning apparatus according to an embodiment of the present invention. The
As shown in the figure, the
The upper and lower moving
The upper and lower moving
The table aligning portion includes an
The
The
Here, the
The
That is, when the substrate is transported in the horizontal direction and in the vertical direction, the horizontal lower
The
In addition, the
1, the suction portion alignment portion includes protruding
Here, the upper
FIG. 4 is a block diagram illustrating a relationship among major components of a substrate alignment apparatus according to an embodiment of the present invention. Referring to FIG.
The
A method of aligning a substrate using the substrate aligning apparatus according to an embodiment of the present invention will now be described.
First, the substrate is transferred to the upper portion of the
After that, the horizontal lower
At this time, when the mounting position of the substrate is different from the preset position, the
The position-corrected substrate is moved to the lower side of the
After that, the horizontal photographing
Through this process, the substrate adsorbed to the correct position is transferred to the next process step.
As described above, according to the substrate aligning apparatus according to the embodiment of the present invention, the substrate can be aligned to the correct position regardless of the direction of the substrate to be transported.
Furthermore, after the substrate before the adsorption is aligned in the correct position, even after the adsorption is carried out, the adsorption transfer of the substrate can be carried out very precisely by further re-adjusting in the adsorbed state.
It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or scope of the invention as defined in the appended claims. It is obvious to them. Therefore, the above-described embodiments are to be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, but may be modified within the scope of the appended claims and equivalents thereof.
100: substrate alignment device 110:
120:
132b: vertical length
134b: vertical length upper camera part 172: table part
174: lower support portion 182:
184: X-axis is east 185: Shanghai is east
188: Y-axis moving section 195:
Claims (5)
An upper supporting part coupled to the upper part of the suction part such that the suction part can rotate horizontally;
And the upper portion of the upper portion of the adsorbing portion is fixed to the upper portion of the upper support portion corresponding to the edge of the adsorption portion, And a moving bracket provided so that the upper X-axis and the upper Y-axis are movable relative to the protruding piece and the attracting part through the moving part.
Wherein the plurality of camera units comprise:
A pair of horizontal photographing lower camera parts for photographing horizontal alignment marks of the board placed on the table part; And
A pair of vertical photographing lower camera parts for photographing vertical alignment marks of the board placed on the table part;
Wherein the substrate alignment apparatus comprises:
Wherein the table aligning portion comprises a Y-axis moving portion for moving the table portion in a direction in which the substrate is conveyed, an X-axis moving portion for moving the table portion in a direction perpendicular to the feeding direction of the substrate, and a rotating portion for rotating the table portion Substrate alignment device.
A pair of horizontal photographing upper camera parts for photographing horizontal alignment marks of the substrate attracted to the suction part; And
A pair of vertical photographing upper camera parts for photographing vertical alignment marks of the substrate attracted to the suction part;
Further comprising: a substrate holder for holding the substrate;
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150113418A KR101696713B1 (en) | 2015-08-11 | 2015-08-11 | Substrate align device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150113418A KR101696713B1 (en) | 2015-08-11 | 2015-08-11 | Substrate align device |
Publications (1)
Publication Number | Publication Date |
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KR101696713B1 true KR101696713B1 (en) | 2017-01-16 |
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Family Applications (1)
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KR1020150113418A KR101696713B1 (en) | 2015-08-11 | 2015-08-11 | Substrate align device |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100853298B1 (en) * | 2007-06-28 | 2008-08-20 | 주식회사 프로텍 | An align method of a substrate |
KR20130047296A (en) * | 2011-10-31 | 2013-05-08 | 주식회사 로보스타 | Vision tracking system |
KR101261266B1 (en) * | 2010-11-03 | 2013-05-09 | 유병소 | Laser processing device and laser processing method using the same |
JP2013125795A (en) * | 2011-12-13 | 2013-06-24 | Panasonic Corp | Substrate positioning device and substrate positioning method |
-
2015
- 2015-08-11 KR KR1020150113418A patent/KR101696713B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100853298B1 (en) * | 2007-06-28 | 2008-08-20 | 주식회사 프로텍 | An align method of a substrate |
KR101261266B1 (en) * | 2010-11-03 | 2013-05-09 | 유병소 | Laser processing device and laser processing method using the same |
KR20130047296A (en) * | 2011-10-31 | 2013-05-08 | 주식회사 로보스타 | Vision tracking system |
JP2013125795A (en) * | 2011-12-13 | 2013-06-24 | Panasonic Corp | Substrate positioning device and substrate positioning method |
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