KR101692115B1 - 검사 장치 및 검사 방법 - Google Patents

검사 장치 및 검사 방법 Download PDF

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Publication number
KR101692115B1
KR101692115B1 KR1020140170308A KR20140170308A KR101692115B1 KR 101692115 B1 KR101692115 B1 KR 101692115B1 KR 1020140170308 A KR1020140170308 A KR 1020140170308A KR 20140170308 A KR20140170308 A KR 20140170308A KR 101692115 B1 KR101692115 B1 KR 101692115B1
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South Korea
Prior art keywords
image
color
defect
picked
section
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KR1020140170308A
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English (en)
Korean (ko)
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KR20150091216A (ko
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준이치 시오미
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가부시키가이샤 스크린 홀딩스
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Publication of KR20150091216A publication Critical patent/KR20150091216A/ko
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Publication of KR101692115B1 publication Critical patent/KR101692115B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
KR1020140170308A 2014-01-31 2014-12-02 검사 장치 및 검사 방법 KR101692115B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-017108 2014-01-31
JP2014017108A JP6348289B2 (ja) 2014-01-31 2014-01-31 検査装置および検査方法

Publications (2)

Publication Number Publication Date
KR20150091216A KR20150091216A (ko) 2015-08-10
KR101692115B1 true KR101692115B1 (ko) 2017-01-02

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KR1020140170308A KR101692115B1 (ko) 2014-01-31 2014-12-02 검사 장치 및 검사 방법

Country Status (4)

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JP (1) JP6348289B2 (ja)
KR (1) KR101692115B1 (ja)
CN (1) CN104819984B (ja)
TW (1) TWI590725B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107093174B (zh) * 2017-04-05 2018-03-27 湖北工业大学 一种pcb设计缺陷检测方法
TWI721385B (zh) * 2018-07-08 2021-03-11 香港商康代影像技術方案香港有限公司 產生印刷電路板合成彩色影像之技術
CN111295251B (zh) * 2018-10-01 2021-09-03 富山住友电工株式会社 镀敷线材的制造方法和镀敷线材的制造装置
CN112313472B (zh) * 2018-10-29 2023-12-26 松下知识产权经营株式会社 信息提示方法、信息提示装置、以及信息提示系统
CN111380875B (zh) * 2018-12-29 2023-09-12 深圳中科飞测科技股份有限公司 一种缺陷检测方法及系统
JP2020144691A (ja) * 2019-03-07 2020-09-10 株式会社Ｓｃｒｅｅｎホールディングス 代表色決定方法、検査装置、検査方法およびプログラム
CN111443096B (zh) * 2020-04-03 2023-05-30 联觉(深圳)科技有限公司 印刷电路板的缺陷检测方法、系统、电子装置及存储介质
KR102311595B1 (ko) * 2021-03-31 2021-10-13 (주)아이프리즘 제품 날인 비전 검사 시스템 및 그 방법
CN113240673B (zh) * 2021-07-09 2021-09-17 武汉Tcl集团工业研究院有限公司 缺陷检测方法、装置、电子设备及存储介质
TWI786894B (zh) * 2021-10-20 2022-12-11 國立清華大學 檢測方法
CN116223515B (zh) * 2023-05-05 2023-07-11 成都中航华测科技有限公司 一种用于电路板测试过程的导电图形缺陷检测方法
CN117292381B (zh) * 2023-11-24 2024-02-27 杭州速腾电路科技有限公司 一种印刷电路板的序列号读取方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005172584A (ja) * 2003-12-10 2005-06-30 Shirai Denshi Kogyo Kk 印刷物の検査方法およびその検査装置
US20060262295A1 (en) * 2005-05-20 2006-11-23 Vistec Semiconductor Systems Gmbh Apparatus and method for inspecting a wafer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08194737A (ja) * 1995-01-17 1996-07-30 Dainippon Printing Co Ltd 微細パターンの段差測定装置
US6084663A (en) * 1997-04-07 2000-07-04 Hewlett-Packard Company Method and an apparatus for inspection of a printed circuit board assembly
EP0871027A3 (en) * 1997-04-07 1999-05-19 Hewlett-Packard Company Inspection of print circuit board assembly
CN1188693C (zh) * 1998-08-18 2005-02-09 奥宝科技有限公司 利用颜色检查印刷电路板
IL132817A (en) * 1999-11-08 2003-11-23 Orbotech Schuh Gmbh & Co Illumination and image acquisition system
WO2006004202A1 (en) * 2004-07-05 2006-01-12 Matsushita Electric Industrial Co., Ltd. Method of generating image of component
KR101338576B1 (ko) * 2005-12-26 2013-12-06 가부시키가이샤 니콘 화상 해석에 의해서 결함 검사를 실시하는 결함검사장치
JP4734650B2 (ja) * 2006-10-31 2011-07-27 国立大学法人 岡山大学 クリームはんだ印刷の不良検出方法および装置
CN101556250A (zh) * 2008-04-11 2009-10-14 郭上鲲 产品质量的检验系统及其方法
JPWO2009125839A1 (ja) * 2008-04-11 2011-08-04 株式会社ニコン 検査装置
CN101661004B (zh) * 2009-07-21 2011-05-25 湖南大学 一种基于支持向量机的电路板焊接质量视觉检测方法
JP2013092514A (ja) * 2011-10-26 2013-05-16 Samsung Electro-Mechanics Co Ltd 基板検査システム及び基板検査方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005172584A (ja) * 2003-12-10 2005-06-30 Shirai Denshi Kogyo Kk 印刷物の検査方法およびその検査装置
US20060262295A1 (en) * 2005-05-20 2006-11-23 Vistec Semiconductor Systems Gmbh Apparatus and method for inspecting a wafer

Also Published As

Publication number Publication date
JP2015143656A (ja) 2015-08-06
JP6348289B2 (ja) 2018-06-27
KR20150091216A (ko) 2015-08-10
CN104819984B (zh) 2017-09-22
TW201531180A (zh) 2015-08-01
CN104819984A (zh) 2015-08-05
TWI590725B (zh) 2017-07-01

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