KR101676370B1 - 인쇄회로기판 절단장치 - Google Patents

인쇄회로기판 절단장치 Download PDF

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Publication number
KR101676370B1
KR101676370B1 KR1020150071972A KR20150071972A KR101676370B1 KR 101676370 B1 KR101676370 B1 KR 101676370B1 KR 1020150071972 A KR1020150071972 A KR 1020150071972A KR 20150071972 A KR20150071972 A KR 20150071972A KR 101676370 B1 KR101676370 B1 KR 101676370B1
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
cutting
unit
cutting unit
Prior art date
Application number
KR1020150071972A
Other languages
English (en)
Korean (ko)
Inventor
김태성
Original Assignee
한국본코트 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국본코트 주식회사 filed Critical 한국본코트 주식회사
Priority to KR1020150071972A priority Critical patent/KR101676370B1/ko
Priority to JP2015244252A priority patent/JP6215288B2/ja
Application granted granted Critical
Publication of KR101676370B1 publication Critical patent/KR101676370B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

Landscapes

  • Engineering & Computer Science (AREA)
  • Details Of Cutting Devices (AREA)
  • Control Of Cutting Processes (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020150071972A 2015-05-22 2015-05-22 인쇄회로기판 절단장치 KR101676370B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150071972A KR101676370B1 (ko) 2015-05-22 2015-05-22 인쇄회로기판 절단장치
JP2015244252A JP6215288B2 (ja) 2015-05-22 2015-12-15 印刷回路基板切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150071972A KR101676370B1 (ko) 2015-05-22 2015-05-22 인쇄회로기판 절단장치

Publications (1)

Publication Number Publication Date
KR101676370B1 true KR101676370B1 (ko) 2016-11-15

Family

ID=57525474

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150071972A KR101676370B1 (ko) 2015-05-22 2015-05-22 인쇄회로기판 절단장치

Country Status (2)

Country Link
JP (1) JP6215288B2 (ja)
KR (1) KR101676370B1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112894926A (zh) * 2021-01-13 2021-06-04 赣州邦德电路科技有限公司 一种线路板裁剪加工用固定装置
CN113290278A (zh) * 2021-04-09 2021-08-24 宋志龙 半圆形pcb板的裁剪生产系统与裁剪工艺
CN113510779A (zh) * 2021-04-14 2021-10-19 杭州锦洲电子有限公司 一种印制电路板加工工艺及设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107186777B (zh) * 2017-07-18 2018-10-09 信丰利裕达电子科技有限公司 一种电子显示屏生产用pcb裁切设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060080757A (ko) * 2005-01-06 2006-07-11 김태성 인쇄회로기판 절단장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5438752U (ja) * 1977-08-22 1979-03-14
JPH027995U (ja) * 1988-06-29 1990-01-18
JPH0712575B2 (ja) * 1992-06-08 1995-02-15 庄田商事株式会社 板材の加工装置
JP3021225B2 (ja) * 1993-03-23 2000-03-15 公一 田中 回路基板切断装置
JP3887490B2 (ja) * 1998-06-02 2007-02-28 功 吉田 板材加工機の刃物位置決め装置
JP4632917B2 (ja) * 2005-10-06 2011-02-16 三菱電機株式会社 固体高分子形燃料電池
KR100774559B1 (ko) * 2006-04-18 2007-11-08 이주영 인쇄회로기판 절단장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060080757A (ko) * 2005-01-06 2006-07-11 김태성 인쇄회로기판 절단장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112894926A (zh) * 2021-01-13 2021-06-04 赣州邦德电路科技有限公司 一种线路板裁剪加工用固定装置
CN113290278A (zh) * 2021-04-09 2021-08-24 宋志龙 半圆形pcb板的裁剪生产系统与裁剪工艺
CN113510779A (zh) * 2021-04-14 2021-10-19 杭州锦洲电子有限公司 一种印制电路板加工工艺及设备

Also Published As

Publication number Publication date
JP6215288B2 (ja) 2017-10-18
JP2016215363A (ja) 2016-12-22

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