KR101676370B1 - Cutting device for print circuit board - Google Patents

Cutting device for print circuit board Download PDF

Info

Publication number
KR101676370B1
KR101676370B1 KR1020150071972A KR20150071972A KR101676370B1 KR 101676370 B1 KR101676370 B1 KR 101676370B1 KR 1020150071972 A KR1020150071972 A KR 1020150071972A KR 20150071972 A KR20150071972 A KR 20150071972A KR 101676370 B1 KR101676370 B1 KR 101676370B1
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
cutting
unit
cutting unit
Prior art date
Application number
KR1020150071972A
Other languages
Korean (ko)
Inventor
김태성
Original Assignee
한국본코트 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국본코트 주식회사 filed Critical 한국본코트 주식회사
Priority to KR1020150071972A priority Critical patent/KR101676370B1/en
Priority to JP2015244252A priority patent/JP6215288B2/en
Application granted granted Critical
Publication of KR101676370B1 publication Critical patent/KR101676370B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

Landscapes

  • Details Of Cutting Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Control Of Cutting Processes (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

An apparatus for cutting a printed circuit board according to an embodiment is disclosed. The PCB includes a frame unit including an upper frame, a lower frame, and a connection frame connecting the upper frame and the lower frame, and a printed circuit board disposed on one side of the lower frame, A guide member for guiding movement of the support plate, a cutting unit disposed perpendicularly to the longitudinal direction of the upper frame for cutting the printed circuit board, and a control unit for controlling operations of the support plate or the cutting unit .

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cutting apparatus,

The following description relates to a printed circuit board cutting apparatus.

A printed circuit board cutting apparatus forms a wiring pattern on a substrate, and a printed circuit board on which circuit components such as resistors and semiconductor elements are mounted by cream solder can be cut.

In cutting the printed circuit board, in order to facilitate division of the printed circuit board when the operator divides the printed circuit board by hand or when dividing the printed circuit board using the cutting apparatus, a cutting groove of "V" Guide grooves can be formed on both sides of the printed circuit board.

When the operator grasps the printed circuit board with both hands and applies a force to bend the printed circuit board around the cut groove or the guide groove, the printed circuit board can be cut along the cut groove.

 However, when the printed circuit board is bent and cut with the hand of the operator as described above, the printed circuit board is excessively bent even when the cut groove or the guide groove is provided on the printed circuit board. As a result, A tension imbalance or a compression imbalance may occur in a pattern or a mounted circuit component.

For example, Japanese Patent Application Laid-Open No. 2007-0103242 discloses a printed circuit board cutting apparatus. The above-described apparatus for cutting a printed circuit board may simultaneously mount two or more substrates to perform a cutting operation, thereby improving work efficiency.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board cutting apparatus capable of cutting a wide printed circuit board by disposing a cutting board on a front surface of a main body.

An object according to an embodiment is to provide a printed circuit board cutting apparatus capable of selectively supplying power to the cutting board.

An object of an embodiment is to provide a printed circuit board cutting apparatus capable of cutting various types of printed circuit boards.

The above and other objects are achieved by providing an apparatus for cutting a printed circuit board as described below.

The PCB includes a frame unit including an upper frame, a lower frame, and a connection frame connecting the upper frame and the lower frame, and a printed circuit board disposed on one side of the lower frame, A guide member for guiding movement of the support plate, a cutting unit disposed perpendicularly to the longitudinal direction of the upper frame for cutting the printed circuit board, and a control unit for controlling operations of the support plate or the cutting unit .

The cutting unit according to claim 1, wherein the cutting unit includes a cutting element having a blade part formed along an outer circumferential surface thereof and a first feeder connected to the cutting tool, wherein the cutting motor comprises: a driving motor; And a second transducer connected to the second motor and capable of selectively transmitting the power of the driving motor.

The drive unit may further include a transfer block connected to the drive motor and a transfer rod penetrating the transfer block to guide movement of the transfer block, The first carrier and the second carrier can be selectively connected while moving.

On one side, the drive unit may further include a transfer handle connected to the transfer block and rotating the transfer block along the transfer rod.

The cover may further include a protection plate that covers at least a part of the package substrate and prevents a user from contacting the package substrate when the PCB is cut.

The printed circuit board may further include a lower blade disposed on the upper side of the lower frame and inserted into a lower groove formed in the printed circuit board and having an end formed in a sharp shape to guide movement of the printed circuit board .

And a detection sensor for detecting insertion or movement of the printed circuit board, wherein the control unit controls the cutting unit such that when the detection sensor detects that the printed circuit board has passed through the cutting unit, It can be operated in the opposite direction.

On one side, the cutting unit may be moved downward from its initial position during operation in the opposite direction to cut the printed circuit board.

And may further comprise adjustment means for adjusting the height of the cutting unit on one side.

Another aspect of the present invention is a printed circuit board cutting apparatus including a frame unit including an upper frame, a lower frame, and a connection frame connecting the upper frame and the lower frame, a printed circuit board disposed on one side of the lower frame, An upper cutting unit disposed perpendicularly to the longitudinal direction of the upper frame and contacting the upper portion of the printed circuit board to cut the printed circuit board; A lower cutting unit that contacts the lower portion of the substrate and cuts the printed circuit board, and a control unit that controls operations of the support plate, the upper cutting unit, or the lower cutting unit.

On one side, the lower cutting unit may be moved together when driving the upper cutting unit.

And a lower cutting unit driving unit for driving the lower cutting unit together when the upper cutting unit is driven.

The apparatus for cutting a printed circuit board according to an embodiment can cut a wide printed circuit board by disposing a cutting board on the front surface of the main body.

The apparatus for cutting a PCB according to an embodiment can selectively supply power to the cutting board.

The printed circuit board cutting apparatus according to an embodiment can cut various types of printed circuit boards.

The effects of the present invention are not limited to those mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the following description.

1 is a side view of a printed circuit board cutting apparatus according to an embodiment.
2 is a front view of a printed circuit board cutting apparatus according to an embodiment.
3 is another front view of a printed circuit board cutting apparatus showing a state in which a support plate according to an embodiment is moved.
4 is a view showing a drive unit and a cutting unit according to an embodiment.
FIG. 5 shows a form in which a printed circuit board according to an embodiment is inserted.
6 is a diagram showing a cutting unit of a printed circuit board cutting apparatus according to another embodiment.

FIG. 1 is a side view of a printed circuit board cutting apparatus 1 according to an embodiment, and FIGS. 2 and 3 are front views of a printed circuit board cutting apparatus 1 according to an embodiment. Figs. 2 and 3 show a movement of the support plate 120. Fig.

1 to 3, an apparatus 1 for cutting a PCB according to an embodiment includes a frame unit 110, a support plate 120, a guide member 160, a cutting unit 130, and a control unit 150 ).

The frame unit 110 may include an upper frame 111, a lower frame 113, and a connection frame 112 connecting the upper frame 111 and the lower frame 113. The frame unit 110 may be formed in a 'C' shape as a whole.

The support plate 120 may be disposed on one side of the lower frame 113. The printed circuit board may be placed on the support plate 120. The printed circuit board cutting apparatus 1 may include a horizontal stand 122 and a user may adjust the arrangement of the printed circuit board with reference to the horizontal stand 122. [ The printed circuit board (not shown) may be constituted by one large plate. The printed circuit board may have a plurality of wiring patterns that form the electric circuit block. The material may include class epoxy or paper phenol. It is possible to dispose a resistor or a circuit component such as a semiconductor element on a printed circuit board and cut the printed circuit board for each electric circuit block.

The printed circuit board may have an upper groove and a lower groove formed on the upper and lower sides, respectively. The upper grooves and the lower grooves may be formed in the longitudinal direction of the printed circuit board. The upper groove and the lower groove can be a guide for cutting the printed circuit board, and the upper groove and the lower groove can be cut. The upper groove and the lower groove may each be formed with a V-shaped character. However, this is an example of a printed circuit board, and does not limit the material or the shape of the printed circuit board.

The guide member 160 can guide the movement of the support plate 120. The support plate 120 can be moved horizontally along the guide member 160 so that the printed circuit board placed on the support plate 120 can be moved together. Fig. 2 shows a state in which the support plate 120 is moved to the left, and Fig. 3 shows a state in which the support plate 120 is moved to the right side.

The support plate 120 may be manually moved or powered. When manually moved, the user can move the support plate 120. In this case, the support plate 120 may not be driven by the motor.

When the power is supplied and moved, the PCB cutting apparatus 1 includes a support plate drive unit (not shown), and the support plate drive unit can move the support plate along the guide member. The support plate drive unit may comprise a motor. The control unit controls the support plate drive unit to set the movement speed of the support plate.

The cutting unit 130 may be disposed perpendicular to the longitudinal direction of the upper frame 111. The cutting unit 130 includes a cutting unit 131 having a blade part formed along the outer circumferential surface thereof, and the cutting unit 131 can be rotatably disposed. The section group 131 can be inserted into the upper groove of the printed circuit board to cut the printed circuit board.

The cutting unit 130 may be disposed perpendicular to the longitudinal direction of the upper frame 111, thereby being advantageous for cutting a wide printed circuit board.

When the cutting unit 130 is disposed in parallel to the longitudinal direction of the upper frame 111, the printed circuit board is inserted toward the connection frame 112, and when the cutting unit 130 is in contact with the connection frame 112, The size of the substrate can be limited. On the other hand, if the cutting unit 130 is arranged as shown in Figs. 1 to 3, the insertion of the printed circuit board is not interfered with, so that a wide printed circuit board can be cut.

The protection plate 133 may cover at least a part of the cut-off 131. Therefore, when the printed circuit board is cut, the user can be prevented from coming into contact with the cutting tool, thereby preventing a safety accident from occurring. For example, the protective plate 133 may open the lower portion where the cut 131 is in contact with the printed circuit board and cover the upper portion where the cut 131 is not in contact with the printed circuit board.

The printed circuit board cutting apparatus 1 may further include a lower blade 130a disposed on the upper side of the lower frame 113. [ The lower blade 130a may have a sharp edge and may be inserted into a lower groove formed in the printed circuit board. The lower blade 130a can guide the movement of the printed circuit board.

For example, the cutting jig 131 and the lower blade 130a are disposed at positions corresponding to each other, so that the printed circuit board can be inserted between the cutting jig 131 and the lower blade 130a. The stepped assembly 131 may be inserted into the upper groove of the printed circuit board and the lower blade 130a may be inserted into the lower groove of the printed circuit board.

The section group 131 and the lower blade 130a may be disposed at intervals such that the printed circuit board can be cut. The section group 131 and the lower blade 130a may be disposed at a distance smaller than the height of the printed circuit board.

The height of the cut 131 or the lower blade 130a is adjustable so that the interval can be adjusted according to the printed circuit board. For example, the printed circuit board cutting apparatus 1 may include adjustment means (not shown) capable of adjusting the height of the cutting unit 130. The adjusting means may include a height adjusting hole formed in the height direction of the printed circuit board cutting apparatus 1, a bolt member connected to the cutting unit 130, passing through the height adjusting hole, and a nut member fastened to the bolt member .

When the height of the cutting unit 130 is adjusted, the bolt member and the nut member are released from each other, the bolted material is moved in the height adjusting hole, and then the nut member is fastened to the bolt member, Can be adjusted.

In addition, the support plate adjusting means 121 may be configured similar to the adjusting means to adjust the height of the support plate 120. By adjusting the height of the support plate adjusting means 121, it is possible to cut the printed circuit board of various thicknesses.

The cutting unit 130 may be operated with power or non-power. In case of non-powered operation, the cutting jig 131 can be rotated by the frictional force with the printed circuit board to be inserted. When the printed circuit board is inserted, the printed circuit board and the blade are brought into contact with each other, whereby the printed circuit board can be cut by friction with the printed circuit board and the blade.

In order to powerfully operate the cutting unit 130, the printed circuit board cutting apparatus 1 may further include a drive unit 140. [ The driving unit 140 may include a driving motor. The driving motor can cut the printed circuit board by rotating the cutting jig 131.

The user can select the powered or non-powered operation of the cutting unit 130. [ For this purpose, the disc assembly 131 may be selectively connected to the drive unit 140, and such a structure will be described in detail below.

4 is a diagram showing a drive unit 140 and a cutting unit 130 according to an embodiment. 4 (a) shows a state in which the cutting unit 130 and the drive unit 140 are not connected to each other, and FIG. 4 (b) shows a state in which the cutting unit 130 and the drive unit 140 are connected.

Referring to FIG. 4, the drive unit 140 may be selectively connected to the cutting unit 130 to selectively power the cutting unit 130.

The cutting unit 130 may include a first feeder 132 connected to the cutting jig 131 and the drive unit 140 may include a second feeder 142 connected to one side of the drive motor 141 can do. The first carrier 132 and the second carrier 142 may be composed of gears that can be engaged with each other.

The drive unit 140 may include a transfer block 143 and a transfer rod 144. The transfer block 143 is connected to the drive motor 141 and can be configured to penetrate the transfer rod 144. The transfer block 143 can be moved along the transfer rod 144 in the longitudinal direction of the transfer rod 144.

Referring to FIG. 4 (a), the cutting unit 130 can be used without power when the driving unit 140 and the cutting unit 130 are not connected. Since the driving unit 140 and the cutting unit 130 are not connected to each other, even if the cutting jig 131 rotates, the driving unit 140 may not be affected.

When power is supplied to the cutting unit 130, the transfer block 143 may be moved to engage the first transfer member 132 and the second transfer member 142.

When the first carrier 132 and the second carrier 142 are engaged with each other, the rotational power of the driving motor 141 rotates the second carrier 142 and the second carrier 142 rotates the first carrier 132 So that the cutting jig 131 can be rotationally driven.

The transfer knob 145 may be connected to one side of the transfer block 143. The transfer block 143 may be configured to be moved along the transfer rod 144 by rotating the transfer knob 145. [

Due to such a configuration, the driving unit 140 and the cutting unit 130 can be selectively connected by adjusting the transfer knob. If necessary, the cutting jig 131 can be used with power or non-power. If the drive motor and the drive shaft 131 are always connected to each other, when the drive shaft 131 is driven without power, the drive motor is forcedly driven when the drive shaft 131 is rotated according to the insertion of the printed circuit board, And may cause stress on the printed circuit board due to excessive force. On the other hand, the printed circuit board cutting apparatus 1 can release the connection between the drive motor and the cutting tool 131, and also prevent damage to the drive motor.

Fig. 5 shows a form in which the printed circuit board 3 according to one embodiment is inserted.

Referring to FIG. 5, the printed circuit board 3 may be inserted into contact with the cutting jig 131. The printed circuit board is inserted as shown in Fig. 5 (a), and the printed circuit board 3 can be cut along with the rotation of the cut-away body 131. Fig.

Hereinafter, the case in which the notch 131 is operated by the power will be described.

The printed circuit board cutting apparatus 1 may include a sensing sensor (not shown) for detecting the insertion or movement of the printed circuit board 3. [ The detection sensor is disposed on one side of the support plate 120 to sense insertion of the printed circuit board.

The sensing sensor may be a sensor for sensing the contact of the printed circuit board or an infrared sensor for sensing the distance from the printed circuit board. The position or type of the detection sensor is not limited to this, and other configurations capable of achieving the purpose of the detection sensor can be used.

The detection sensor can detect the state in which the printed circuit board 3 is fully inserted. When the printed circuit board is completely inserted as shown in FIG. 5 (b), the control unit 150 can stop the rotation of the sect on 131.

Thereafter, when the printed circuit board 3 is reversely inserted, the control unit 150 can rotate the sect on 131 in reverse. The direction may be the same direction as the inserting direction of the printed circuit board 3 with reference to the portion where the sect on base 131 and the printed circuit board 3 are in contact with each other. That is, since the rotation direction of the cut 131 is changed according to the insertion direction of the printed circuit board 3, the printed circuit board can be cut regardless of the insertion direction.

In addition, the cutting jig 131 can be moved downward from the initial position when operating in the opposite direction. For example, when inserting the printed circuit board 3, the insulator 131 partially cuts the printed circuit board 3, and when the printed circuit board 3 is reversely moved, (3) can be completely cut.

6 is a diagram showing a cutting unit of a printed circuit board cutting apparatus according to another embodiment.

Hereinafter, the components included in the above embodiments and the components including the common functions will be described using the same names. Unless otherwise stated, the description of the above embodiment can be applied to the following embodiments. A detailed description will be omitted below.

The printed circuit board cutting apparatus 2 may include an upper cutting unit 231 and a lower cutting unit 232. The upper cutting unit 231 may be disposed perpendicular to the longitudinal direction of the upper frame, and the lower cutting unit 232 may be disposed side by side with the upper cutting unit 231.

The printed circuit board can be inserted between the upper cutting unit 231 and the lower cutting unit 232. The upper cutting unit 231 may be in contact with the upper portion of the printed circuit board 3 and the lower portion of the printed circuit board 3 of the lower cutting unit 232.

Specifically, the upper cutting unit 231 is inserted into the upper groove of the printed circuit board 3, and the lower cutting unit 232 is inserted into the lower groove of the printed circuit board 3. [ On both sides of the printed circuit board 3, the printed circuit board 3 can be cut.

Unlike the above-described printed circuit board cutting apparatus 1, the upper cutting unit 231 and the lower cutting unit 232 are driven together so that the printed circuit board 3 can be cut. For example, when the upper cutting unit 231 is rotationally driven to cut the upper portion of the printed circuit board 3, the lower cutting unit 232 is also moved to cut the lower portion of the printed circuit board 3 .

That is, when the printed circuit board 3 is cut by the upper cutting unit 231, the lower cutting unit 232 can be moved together.

Alternatively, the printed circuit board cutting apparatus 2 may further include a lower cutting unit drive unit (not shown). The lower cutting unit driving unit may include a motor, and when the upper cutting unit 231 is driven, the lower cutting unit 232 may be driven together. For example, the upper cutting unit 231 may be rotationally driven and the lower cutting unit 232 may be linearly driven to cut the printed circuit board 3 at the upper and lower portions of the printed circuit board 3, respectively.

By using the above-described printed circuit board cutting apparatus, it is possible to cut a wide printed circuit board by disposing a cutting board on the front surface of the main body, selectively supply power to the cutting board, cut various types of printed circuit boards .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments and equivalents to the claims are within the scope of the following claims.

1 Printed circuit board cutting device
110 frame unit
120 support plate
130 Cutting Unit
140 drive unit
150 control unit

Claims (12)

A frame unit including an upper frame, a lower frame, and a connection frame connecting the upper frame and the lower frame;
A support plate disposed on one side of the lower frame, on which the printed circuit board is placed;
A guide member for guiding the movement of the support plate;
A cutting unit disposed perpendicularly to the longitudinal direction of the upper frame, for cutting the printed circuit board; And
And a control unit for controlling the operation of the support plate or the cutting unit,
Wherein the cutting unit includes a cutting jig having a blade part formed along an outer circumferential surface thereof and a first feeder connected to the cutting jig,
And a drive unit connected to one side of the drive motor and selectively connectable to the first carrier to transmit the power of the drive motor to the drive unit, Device.
delete The method according to claim 1,
Wherein the drive unit further includes a transfer block connected to the drive motor and a transfer rod penetrating the transfer block to guide movement of the transfer block,
Wherein the transfer block selectively connects the first carrier and the second carrier while moving along the transfer rod.
The method of claim 3,
Wherein the drive unit further comprises a transfer handle coupled to the transfer block and configured to move the transfer block along the transfer rod by rotation.
The method according to claim 1,
Further comprising a protection plate that covers at least a part of the cut-out portion and prevents a user from contacting the cut-through portion when cutting the printed circuit board.
The method according to claim 1,
Further comprising a lower blade disposed on the upper side of the lower frame and inserted in a lower groove formed in the printed circuit board and having an end formed in a sharp shape to guide movement of the printed circuit board.
The method according to claim 1,
And a sensing sensor for sensing insertion or movement of the printed circuit board,
Wherein the control unit operates the cutting unit in the opposite direction when the detection sensor senses that the printed circuit board has passed through the cutting unit.
8. The method of claim 7,
And the cutting unit is moved downward from the initial position when operating in the opposite direction to cut the printed circuit board.
The method according to claim 1,
Further comprising adjusting means for adjusting the height of the cutting unit.
A frame unit including an upper frame, a lower frame, and a connection frame connecting the upper frame and the lower frame;
A support plate disposed on one side of the lower frame, on which the printed circuit board is placed;
An upper cutting unit disposed perpendicularly to the longitudinal direction of the upper frame and contacting the upper portion of the printed circuit board to cut the printed circuit board;
A lower cutting unit disposed perpendicularly to the longitudinal direction of the lower frame, contacting the lower portion of the printed circuit board and cutting the printed circuit board; And
And a control unit for controlling the operation of the support plate, the upper cutting unit or the lower cutting unit,
Wherein the upper cutting unit includes a cutting jig having a blade portion formed along an outer circumferential surface thereof and a first feeder connected to the cutting jig,
And a driving unit connected to one side of the driving motor and capable of being selectively connected to the first carrier and capable of transmitting the power of the driving motor to the upper cutting unit, Cutting device.
11. The method of claim 10,
And the lower cutting unit can be moved together when the upper cutting unit is driven.
11. The method of claim 10,
And a lower cutting unit driving unit for driving the lower cutting unit together when the upper cutting unit is driven.
KR1020150071972A 2015-05-22 2015-05-22 Cutting device for print circuit board KR101676370B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150071972A KR101676370B1 (en) 2015-05-22 2015-05-22 Cutting device for print circuit board
JP2015244252A JP6215288B2 (en) 2015-05-22 2015-12-15 Printed circuit board cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150071972A KR101676370B1 (en) 2015-05-22 2015-05-22 Cutting device for print circuit board

Publications (1)

Publication Number Publication Date
KR101676370B1 true KR101676370B1 (en) 2016-11-15

Family

ID=57525474

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150071972A KR101676370B1 (en) 2015-05-22 2015-05-22 Cutting device for print circuit board

Country Status (2)

Country Link
JP (1) JP6215288B2 (en)
KR (1) KR101676370B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112894926A (en) * 2021-01-13 2021-06-04 赣州邦德电路科技有限公司 Fixing device for cutting and processing circuit board
CN113290278A (en) * 2021-04-09 2021-08-24 宋志龙 Cutting production system and cutting process of semicircular PCB
CN113510779A (en) * 2021-04-14 2021-10-19 杭州锦洲电子有限公司 Printed circuit board processing technology and equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107186777B (en) * 2017-07-18 2018-10-09 信丰利裕达电子科技有限公司 A kind of electronic display production PCB cutting apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060080757A (en) * 2005-01-06 2006-07-11 김태성 Cutting device of print circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5438752U (en) * 1977-08-22 1979-03-14
JPH027995U (en) * 1988-06-29 1990-01-18
JPH0712575B2 (en) * 1992-06-08 1995-02-15 庄田商事株式会社 Plate processing equipment
JP3021225B2 (en) * 1993-03-23 2000-03-15 公一 田中 Circuit board cutting device
JP3887490B2 (en) * 1998-06-02 2007-02-28 功 吉田 Blade positioning device for plate processing machine
JP4632917B2 (en) * 2005-10-06 2011-02-16 三菱電機株式会社 Polymer electrolyte fuel cell
KR100774559B1 (en) * 2006-04-18 2007-11-08 이주영 Cutting Device of printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060080757A (en) * 2005-01-06 2006-07-11 김태성 Cutting device of print circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112894926A (en) * 2021-01-13 2021-06-04 赣州邦德电路科技有限公司 Fixing device for cutting and processing circuit board
CN113290278A (en) * 2021-04-09 2021-08-24 宋志龙 Cutting production system and cutting process of semicircular PCB
CN113510779A (en) * 2021-04-14 2021-10-19 杭州锦洲电子有限公司 Printed circuit board processing technology and equipment

Also Published As

Publication number Publication date
JP6215288B2 (en) 2017-10-18
JP2016215363A (en) 2016-12-22

Similar Documents

Publication Publication Date Title
KR101676370B1 (en) Cutting device for print circuit board
US7644645B2 (en) Apparatus and method for detecting dangerous conditions in power equipment
US7231856B2 (en) Apparatus and method for detecting dangerous conditions in power equipment
KR100635125B1 (en) Cutter
US7516552B2 (en) Guide and portable cutting tool provided therewith
US20140290455A1 (en) Apparatus for detecting dangerous conditions in power equipment
CA2757865A1 (en) Safety device for table saw
JP2011518050A (en) Cutting device with adjustable cutting position
US20220241877A1 (en) Power tool
KR20190020864A (en) Chopping board device with cutter
US8776655B2 (en) Worktable for circular saws
ATE362815T1 (en) SAW BLADE CLAMPING DEVICE
JP5199812B2 (en) Cutting equipment
WO2008031708A3 (en) Safety mechanism for a food processor having two coupling points
EP4101598A1 (en) Side handle for power tool
CN107718329B (en) Clutch structure, cutting mechanism and ceramic tile cutting equipment
US4401003A (en) Lead trimmer for printed circuit boards
JP6728990B2 (en) tool
CN211334077U (en) Automatic change processing equipment that cuts
KR102115085B1 (en) Portable high speed cutting machine
KR101943271B1 (en) Cutting machine for circular plate
CN110587833A (en) Automatic change processing equipment that cuts
KR200310192Y1 (en) A board sawing machine
KR100347794B1 (en) Cutting device for print circuit board
KR20040057218A (en) A board sawing machine and its manufacturing method

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190826

Year of fee payment: 4