KR101674850B1 - Organic electroluminescent panel production method and production apparatus - Google Patents

Abstract

An object of the present invention is to provide a method of manufacturing an organic electroluminescent panel capable of continuous production using a long substrate and preventing positional deviation and peeling of a long substrate after bonding and suppressing the size of a manufacturing apparatus, to provide. A bonding step of bonding a long element substrate having an organic electroluminescence element formed on its surface and an elongated sealing substrate having an adhesive layer made of a curable resin on its surface to form a multilayer substrate; A first curing step of curing the adhesive layer while linearly transporting the multilayer substrate, and a second curing step of curing the adhesive layer while bending and transporting the multilayer substrate, and these steps are performed in this order do.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic electroluminescent panel,

The present invention relates to a method and an apparatus for manufacturing an organic electroluminescent panel (hereinafter also referred to as " organic EL panel ").

The light-emitting unit of the organic EL panel and the light-emitting unit are remarkably damaged in light emission luminance when they absorb moisture. Therefore, it is necessary to maintain the interior of the organic EL panel in a low humidity environment, and a means for blocking and protecting from the outside air is provided to provide a sealing structure.

As a manufacturing method of the organic EL panel, for example, an airtight space is made by using a glass cap or a metal tube and an adhesive, and an organic electroluminescence element (hereinafter also referred to as "organic EL element") and a drying agent A method of a casing type in which a sealing member is inserted and sealed is disclosed.

Recently, a method of manufacturing a solid sealing type organic EL panel in which a thin organic light emitting layer is formed on a plastic substrate or a glass substrate, and a flexible high-barrier film or metal foil is used to seal the surface with an adhesive . This manufacturing method has been put into practical use as a manufacturing method of a thin and lightweight organic EL panel excellent in moisture resistance.

On the other hand, a method of manufacturing an organic EL panel by a roll-to-roll method using a flexible substrate such as a resin film has been actively studied. The roll-to-roll production method has an advantage of improving the production efficiency because it can be continuously produced.

Further, there is disclosed a joining method provided with an adjusting mechanism by positional information, which can precisely and easily form an electrode lead-out portion at an arbitrary position on a sealing substrate. Further, in the sealing method of the face bonding structure, a method of bonding under vacuum is proposed to improve the sealing performance, that is, the bonding quality.

Patent Document 1 discloses a method of forming a sealing structure by joining a long element substrate and a long sealing substrate by a roll-to-roll method. In this case, an alignment mark is used as the electrode position information of the element substrate. Patent Document 2 discloses that lamination is efficiently performed by providing storage means in a chamber in vacuum laminating between successive substrates.

Japanese Patent Publication No. 2012-22783 Japanese Patent Application Laid-Open No. 2002-52610

However, there is a possibility that the long substrate which has been sealed after bonding is displaced due to transportation in the manufacturing process. There is a problem such that positional deviation and peeling occur during transportation of each step after the bonding step although the bonding is performed by performing position alignment with high accuracy. Particularly, in the case of the roll-to-roll method, the substrates are continuously connected, and it is necessary to carry them continuously without interruption from the relationship of the front and rear processing steps. As a result, if a slight positional deviation occurs, the positional deviation may be continuously and unfixedly enlarged from the position.

In Patent Document 1, there is no particular description on the conveying method from the joining step to the hardening step. In the case of linearly conveying from the joining step to the hardening step, the process becomes large and the apparatus becomes large. In addition, in the case of only a linear transport, curling is likely to occur due to a temperature change (cooling) after curing and curing shrinkage.

Further, in Patent Document 2, in order to reduce the chamber volume, bending and conveying through a pass roll is frequently used. In this case, there is a problem that positional deviation and peeling tend to occur due to bending and conveying after bonding.

The present invention has been made in view of this situation. An object of the present invention is to provide a method of manufacturing an organic electroluminescent panel capable of continuous production using a long substrate and preventing displacement and peeling of a long substrate after bonding and suppressing the size of a manufacturing apparatus, Device.

The inventors of the present invention have studied the cause of positional deviation in a multilayered substrate after bonding and found that there occurs peeling between layers in a process after bonding or a shift or deformation occurs between layers due to the action of a shearing force .

Therefore, the inventors of the present invention have repeatedly studied the solution of such a problem. As a result, after the long element substrate and the long sealing substrate are bonded, the curable resin to be bonded to both the substrates is semi-cured while maintaining the linear transporting process, and then the curing resin is completely cured The above problems can be solved. That is, the present invention has the following configuration.

1. An organic electroluminescent device comprising an elongated element substrate having an organic electroluminescent element having an organic functional layer and a second electrode, the organic electroluminescent element including a first electrode and a light emitting layer formed on a surface thereof, and a long sealing substrate having an adhesive layer composed of a curable resin formed on the surface thereof A bonding step of bonding a surface of the element substrate on which the organic electroluminescence element is formed and a surface of the sealing substrate on which the adhesive layer is formed to form a multilayer substrate; a linear transporting step of linearly transporting the multilayer substrate; And a second curing step of curing the adhesive layer while flexing and transporting the multilayer substrate, wherein the steps are carried out in this order, characterized in that the organic electroluminescence A method of manufacturing a panel.

2. The method for manufacturing an organic electroluminescence panel according to 1 above, wherein the curable resin constituting the adhesive layer is a thermosetting resin and the curing means of the adhesive layer is a heating.

3. The method of manufacturing an organic electroluminescence panel according to 1 above, wherein the curable resin constituting the adhesive layer is a photo-curable resin, and the curing means of the adhesive layer is light irradiation.

4. The organic electroluminescent device according to any one of 1 to 3 above, wherein the curing rate of the curable resin constituting the adhesive layer before the second curing step after the first curing step is 30% A method of manufacturing a panel.

5. The organic electroluminescent device according to any one of 1 to 3 above, wherein the viscosity of the curable resin constituting the adhesive layer before the second curing step after the first curing step is 3000 Pas · s or more. A method of manufacturing a sense panel.

6. The organic electroluminescent panel according to any one of 1 to 3 above, wherein the bonding position between the element substrate and the sealing substrate is adjusted by an adjusting mechanism based on positional information in the bonding step Gt;

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7. An organic electroluminescent device comprising an elongated element substrate having an organic electroluminescent element having an organic functional layer and a second electrode, the organic electroluminescent element including a first electrode and a light emitting layer formed on a surface thereof, and a long sealing substrate having an adhesive layer formed of a curable resin on the surface thereof A first curing unit for curing the adhesive layer while linearly transporting the multilayer substrate; and a second curing unit for curing the adhesive layer while flexing and transporting the multilayer substrate, And a second curing unit for applying a voltage to the organic electroluminescence panel.

8. The organic electroluminescent device according to the above 7, wherein the curable resin constituting the adhesive layer is a thermosetting resin, and the curing means of the adhesive layer in the first cured portion and the second cured portion is heating. Apparatus for manufacturing panels.

9. The organic electroluminescent device according to 7 above, wherein the curable resin constituting the adhesive layer is a photo-curable resin and the curing means of the adhesive layer in the first cured portion and the second cured portion is light irradiation. Apparatus for manufacturing nessence panels.

10. The apparatus for manufacturing an organic electro luminescence panel according to any one of 7 to 9 above, characterized in that the bonding portion includes an adjustment mechanism based on positional information of a bonding position of the element substrate and the sealing substrate .

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According to the method of manufacturing an organic EL panel of the present invention, continuous production using a long substrate can be performed, positional deviation and peeling after bonding of a long substrate can be prevented, and the size of the manufacturing apparatus can be suppressed. According to the apparatus for manufacturing an organic EL panel of the present invention, continuous production using a long substrate is possible, positional deviation and peeling after bonding of a long substrate can be prevented, and the size of the manufacturing apparatus can be suppressed.

1 is a schematic diagram showing a manufacturing process and an apparatus for manufacturing an organic EL panel according to the present embodiment.

Hereinafter, embodiments for carrying out the present invention will be described, but the present invention is not limited to the embodiments described below, and it is possible to arbitrarily change the embodiments without departing from the gist of the present invention .

(Manufacturing Method of Organic EL Panel)

The production of the organic EL panel of the present embodiment includes: a long element substrate on which an organic EL element having an organic functional layer including a first electrode and a light emitting layer and a second electrode is formed on the surface; and an adhesive layer composed of a curable resin A long sealing substrate is bonded to a surface of the element substrate on which the organic EL element is formed and a surface of the sealing substrate on which the adhesive layer is formed to form a sealing structure.

(Organic EL panel)

In the present embodiment, the organic EL panel comprises an element substrate on which an organic EL element is formed on the surface, and a sealing substrate on which an adhesive layer is formed on the surface, Layer structure that is formed by joining, in the surface of the substrate.

Here, the organic EL element has a first electrode formed on at least an element substrate, an organic functional layer formed on the first electrode, a light emitting layer, and a second electrode formed on the organic functional layer, and is in the form of a thin film. A voltage is applied between both electrodes of the organic EL element, so that the light emitting layer emits light.

In the organic EL panel of the present embodiment, in order to keep the organic EL element in the organic EL panel in a low humidity environment and to shield and protect it from the external environment, the organic EL element is sandwiched between the element substrate and the adhesive layer on the sealing substrate It is hermetically sealed.

The element substrate and the sealing substrate of the present embodiment are all flexible long sheets. Normally, organic EL elements are present intermittently on the element substrate with intervals therebetween. The device substrate and the sealing substrate are continuously bonded via an adhesive layer to form a long multilayer substrate having a multilayer structure. As a result, a large number of organic EL panels can be obtained by cutting the produced long multilayer substrate before and after the organic EL device.

(Element substrate)

Here, the element substrate of the present embodiment will be described.

The element substrate is a substrate serving as a base when the organic EL element is formed. The element substrate is preferably flexible and has mechanical strength, heat resistance when the organic EL device is manufactured on the element substrate, gas barrier property against water vapor or oxygen, and the like. Further, it is preferable that the element substrate is made of a transparent resin in order to transmit the emitted light.

Examples of the material constituting the element substrate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane (registered trademark), cellulose diacetate, cellulose triacetate (TAC) , Cellulose esters or derivatives thereof such as cellulose acetate butyrate, cellulose acetate propionate (CAP), cellulose acetate phthalate and cellulose nitrate, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, poly Polyether sulfone (PES), polyphenylene sulfide, polysulfone, polyether imide, polyether ketone imide, polyamide, fluorine resin, polyether sulfone resin, , Polymethyl methacrylate, poly There may be mentioned methacrylic acid esters, polyarylates, Aton (registered trademark, manufactured by JSR) or Appel (registered trademark, manufactured by Mitsui car flexors, Ltd.) and so on of the cycloolefin-based resin and the like. When light emitted from the sealing substrate is transmitted through the sealing substrate, a material other than a transparent resin may be selected as the material constituting the element substrate. For example, copper, a copper alloy, aluminum, an aluminum alloy, gold, , Stainless steel, and tin. These may be used alone, or two or more kinds may be mixed or multilayered.

Thickness of the element substrate is not particularly limited, but from the viewpoints of molding processability, handling property, and the like, it is preferably 50 占 퐉 to 500 占 퐉. Further, the thickness of the element substrate can be measured by using a micrometer.

The organic EL element is formed on the surface of the element substrate. The organic EL element may be formed on at least one surface of the element substrate. The organic EL element can be sealed and sealed by bonding the surface of the element substrate on which the organic EL element is formed and the surface of the sealing substrate on which the adhesive layer is formed. It is also possible to form the organic EL elements on both side surfaces of the element substrate and to bond the two sealing substrates from both sides of the element substrate to seal and seal the organic EL elements on both sides.

The details of the configuration of the organic EL element formed on the element substrate will be described later.

(Sealing substrate)

Next, the sealing substrate of this embodiment will be described.

The sealing substrate is for blocking and protecting the organic EL elements and the like from the external environment. The sealing substrate is preferably flexible, and preferably has mechanical strength, gas barrier properties against water vapor or oxygen, and the like.

Examples of the material constituting the sealing substrate include ethylene tetrafluoroethylene copolymer, polyethylene, polypropylene, polystyrene, polymethyl methacrylate, nylon, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, Thermosetting resins such as urethane resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, unsaturated polyester resin, polyurethane resin and acrylic resin, copper, copper alloy, aluminum, aluminum alloy , Gold, nickel, titanium, stainless steel, and tin.

These materials may be used singly, or may be used as a multilayer sheet obtained by mixing a plurality of kinds of materials or combining them by bonding, extrusion lamination, coextrusion or the like, if necessary. It is also possible to produce various combinations of thickness, density, molecular weight and the like of the sheet to be used in order to obtain desired physical properties.

The thickness of the sealing substrate is not particularly limited, but is preferably 10 占 퐉 or more and 300 占 퐉 or less in consideration of molding processability, handling property, and gas barrier layer stress cracking resistance. Further, the thickness of the sealing substrate can be measured by using a micrometer.

When the thermoplastic resin or the curable resin is used as the sealing substrate, it is preferable to form the gas barrier layer on the sealing substrate by a vapor deposition method or a coating method. Examples of the gas barrier layer include a metal vapor deposition film, an inorganic vapor deposition film, and a metal foil. Examples of the metal vapor deposition film and the inorganic vapor deposition film include thin film handbooks p879 to p901 (Nihon Gakujutsu Shinkokai), vacuum technology handbooks p502 to p509, p612, p810 (Nikkan Kogyo Shinbunsha), vacuum handbook presentation p132 to p134 KK) can be mentioned. For example, In, Sn, Pb, Au , Cu, Ag, Al, Ti, Ni, metal such as _{W, MgO, SiO, SiO 2} , Al 2 O 3, GeO, NiO, CaO, BaO, Fe 2 O ₃ , Y ₂ O ₃ , TiO ₂ , Cr ₂ O ₃ , Si _x O _y (x = 1, y = 1.5 to 2.0) and Ta ₂ O ₃ , ZrN, SiC, TiC, PSG, Si ₃ N ₄ , SiN, monocrystalline Si, and amorphous Si. As the material of the metal foil, for example, a metal material such as aluminum, copper, and nickel, and an alloy material such as stainless steel and aluminum alloy can be mentioned, but aluminum is preferable in view of processability and cost. These may be used singly or two or more may be used in any combination and ratio.

The film thickness of the metal vapor deposition film and the inorganic vapor deposition film is usually 5 nm or more, preferably 10 nm or more, and usually 1000 nm or less, preferably 300 nm or less, from the viewpoint of easiness of vapor deposition film formation. The film thickness of the metal foil is 1 to 100 占 퐉, preferably 10 占 퐉 to 50 占 퐉, from the viewpoint of handling at the time of production and thinning of the panel. Further, a resin film such as polyethylene terephthalate or nylon may be laminated in advance in order to facilitate handling during manufacture. Further, a protective layer containing a thermoplastic resin may be formed on the gas barrier layer.

The water vapor transmission rate of the sealing substrate of the present embodiment is preferably 0.01 g / m < 2 > day or less in consideration of gas barrier property required for commercialization as an organic EL panel, and the oxygen permeability is 0.1 ml / MPa or less. The water permeability is a value measured by the MOCON method in accordance with the method of JIS K7129B (1992), and the oxygen permeability is a value measured by the MOCON method mainly in accordance with the method of JIS K7126B (1987).

(Adhesive layer)

In the present embodiment, the adhesive layer is a layer for sealing and protecting the organic EL element from the external environment by bonding and fixing the element substrate and the sealing substrate.

The adhesive layer is formed on the surface of the sealing substrate. The adhesive layer may be formed on at least one surface of the sealing substrate. The organic EL element can be sealed and sealed by bonding the surface of the sealing substrate on which the adhesive layer is formed and the surface of the element substrate on which the organic EL element is formed. It is also possible to form an adhesive layer on both side surfaces of the sealing substrate, to bond the two element substrates from both sides of the sealing substrate, and to seal and seal the organic EL elements on both sides.

In the present embodiment, the resin constituting the adhesive layer is a curable resin. As the curable resin, any one or both of a thermosetting resin and a photo-curable resin can be used. It is preferable to use a resin which is excellent in moisture resistance and water resistance, less in volatile components and less in shrinkage upon curing.

Examples of the thermosetting resin include thermosetting resins such as epoxy resin, acrylic resin, silicone resin, urea resin, melamine resin, phenol resin, resorcinol resin, unsaturated polyester resin and polyurethane resin.

Examples of the photo-curing resin include radical-type photo-curing resins using various acrylates such as ester acrylate, urethane acrylate, epoxy acrylate, melamine acrylate and acryl resin acrylate, or urethane polyester, , Cationic photo-curing resins using resins such as vinyl ether, and the like.

Examples of the method of forming the adhesive layer by the curable resin include a coating method such as gravure coating, roll coating, bar coating, die coating, knife coating, hot melt coating, dipping, spin coating and spray coating, A printing method such as screen printing can be used. The curable resin at the time of forming the adhesive layer may be in a liquid state of low viscosity or in a paste state of high viscosity.

The thickness of the adhesive layer is preferably 1 占 퐉 to 100 占 퐉 in terms of sealing performance and thinning of the panel. In order to remove moisture contained in the adhesive layer, a drying agent such as barium oxide or calcium oxide may be mixed into the adhesive layer.

It is preferable to add a filler to the curable resin constituting the adhesive layer, if necessary. The amount of the filler to be added is preferably 5 to 70% by volume in consideration of the adhesive force. The size of the filler to be added is preferably 1 占 퐉 to 100 占 퐉 in consideration of the adhesive strength, the thickness of the adhesive layer after bonding, and the like. The kind of the filler to be added is not particularly limited, and examples thereof include soda glass, alkali-free glass or metal oxide such as silica, antimony oxide, titania, alumina, zirconia or tungsten oxide.

(Manufacturing Method of Organic EL Panel)

A manufacturing method of an organic EL panel according to the present embodiment is a manufacturing method of an organic EL panel in which an elongated element substrate having an organic EL element formed on its surface and a long sealing substrate having an adhesive layer composed of a curable resin formed on its surface are bonded to the surface Layer substrate, a linear transporting step of linearly transporting the multilayer substrate, a first curing step of curing the adhesive layer while linearly transporting the multilayer substrate, And a second curing step of curing the adhesive layer while flexing and transporting the multilayer substrate, and these steps are performed in this order.

(Organic EL panel manufacturing apparatus)

An apparatus for manufacturing an organic EL panel according to the present embodiment includes a long element substrate having an organic electroluminescence element having an organic functional layer including a first electrode and a light emitting layer and a second electrode formed on a surface thereof, A linear conveying section for linearly conveying the multilayer substrate; a first hardening section for hardening the adhesive layer while linearly conveying the multilayer substrate; And a second hardened portion for hardening the adhesive layer while being conveyed.

Hereinafter, the manufacturing process and the manufacturing apparatus of the organic EL panel according to the present embodiment will be described. The manufacturing process will be described with reference to the drawings, including not only the process described in the claims, but also the process and equipment before and after the process.

Fig. 1 is a schematic diagram showing a manufacturing process and an apparatus for manufacturing the organic EL panel according to the present embodiment, and is shown as a sectional view of the manufacturing apparatus 1 of the organic EL panel of the present embodiment.

(Unwinding process)

The unwinding step is a step of loosening the element substrate from the roll on which the long element substrate is wound, and loosening the sealing substrate from the roll on which the long sealing substrate is wound.

1 includes a roll 4 on which a long element substrate having an organic EL element formed on one side thereof is wound and a guide roll for guiding the element substrate 2 to be unrolled from the roll 4 And a releasing portion of the element substrate is provided. The element substrate 2 is unrolled from the roll 4 via a guide roll. At this time, the organic EL element is formed on the lower surface of the element substrate 2.

The manufacturing apparatus 1 of the organic EL panel shown in Fig. 1 is provided with a releasing section of a sealing substrate 3 having a roll 5 wound with a long sealing substrate. The sealing substrate 3 is unwound from the roll 5.

(Adhesive layer application step)

Next, in the adhesive layer application step, a curable resin is applied onto the surface of the sealing substrate 3 which is unwound from the roll 5, from a coating device 6 filled with a paste-like curable resin, And an adhesive layer 7 is formed on the upper surface. After the curable resin is applied, a sealer (not shown) may be provided as needed to appropriately dry the sealing substrate 8 having the adhesive layer formed on its surface.

(Bonding step)

The bonding step is a step of bonding the element substrate and the sealing substrate on the surface of the element substrate on which the organic EL element is formed and the surface of the sealing substrate on which the adhesive layer is formed to form a multilayer substrate. The bonding method is a pressing method using a bonding roll, but the bonding means is not particularly limited. Roll laminate, flat plate bonding, diaphragm bonding, and the like. In this embodiment, a joining roll is used as a typical joining means.

1, the bonding portion 10 includes a bonding roll 9 for bonding the element substrate 2 and the sealing substrate 3, and a sealing substrate 8 on which an adhesive layer is formed, (Not shown). The element substrate 2 unwound from the roll 4 and the sealing substrate 8 having the adhesive layer formed on its surface are pressed and bonded by the bonding roll 9.

By bonding by the bonding roll 9, the element substrate 2 and the sealing substrate 3 are brought into close contact with each other through the adhesive layer 7 without gaps, and the organic EL element can be sealed inside. It is preferable that the adhesive layer 7 formed on the surface of the sealing substrate 3 is bonded by the bonding roll 9 in a fluidized state in order to obtain excellent sealing performance. Here, the fluidization of the adhesive layer 7 means that the viscosity of the resin constituting the adhesive layer 7 is 10 Pa · s or more and less than 5000 Pa · s. The viscosity of the resin constituting the adhesive layer 7 at the time of fluidization is preferably 50 to 200 Pa · s.

The bonding roll 9 may have a function of heating the roll surface, or may not have the function of heating the roll surface. It is not necessary to heat the curable resin constituting the adhesive layer 7 by a heater (not shown) provided in front of the bonding roll 9 or the bonding roll 9 when the curable resin constituting the adhesive layer 7 is in a fluidized state before bonding. When the thermosetting resin is heated, care should be taken that the heating temperature does not exceed the curing initiation temperature of the thermosetting resin.

Here, the curing initiation temperature of the thermosetting resin is defined as the rising temperature of the exothermic peak due to curing when the thermosetting resin is heated under a nitrogen atmosphere at a heating rate of 5 deg. C / min using DSC.

In the unwinding step, the adhesive layer coating step, and the bonding step, it is preferable to adjust the bonding position of the element substrate and the sealing substrate by an adjusting mechanism based on position information. Specifically, an alignment mark is formed on an element substrate as information indicating a position of a lead-out electrode of the organic EL element, and the position of the lead-out electrode on the element substrate is specified by detecting the alignment mark using a sensor. On the other hand, an opening for electrode extraction is formed on the sealing substrate in accordance with the extraction electrode position information. Thereafter, based on the positional information of both the substrates, a multi-layer substrate in which the extraction electrodes on the element substrate and the electrode extraction openings on the sealing substrate are bonded with high precision can be obtained have. Details of the adjustment mechanism by the positional information of the bonding position of the element substrate and the sealing substrate are described in Patent Document 1. [

In Fig. 1, the bonding roll 9 is a so-called nip roll composed of upper and lower pairs of rolls. The multilayer substrate 11 in which the element substrate 2 and the sealing substrate 3 are bonded and the organic EL element is sealed and sealed by the adhesive layer 7 is formed. The number of rolls may be two, one pair, or may be increased to four, such as two pairs, if necessary. Further, the nip pressure or the rotation speed of the roll can be suitably set on condition that the element substrate 2 and the sealing substrate 3 can be bonded and the organic EL element is not damaged. It is preferable that the bonding portion 10 is provided with an adjusting mechanism (not shown) by positional information of the bonding position of the element substrate 2 and the sealing substrate 3.

(Linear conveying step)

The linear transporting step is a step of linearly transporting the multilayer substrate bonding process to the first curing process. Since the adhesive layer is not cured in the multilayer substrate in which the element substrate immediately after the bonding step is bonded to the sealing substrate by the adhesive layer, peeling occurs in the interlayer between the multilayer substrate and the adhesive layer, , There is a possibility that positional deviation or deformation may occur between layers. Therefore, the multilayer substrate before the adhesive layer is hardened needs to be linearly transported.

Here, the straight conveyance means a conveyance path on which the inclination angle of the substrate is basically 0 degrees on the conveying roll. However, when the substrate is warped in relation to its own weight or tension, the inclination angle of the substrate may be less than 20 degrees. The inclination angle of the substrate refers to an angle formed between two water lines falling from the portion where the substrate is tangent to the roll on which the substrate is wound to the rotation center point of the roll in a vertical cross section with respect to the roll axis direction. In the free span between the rolls, it means that the flexural curvature of the substrate is R1000 mm or more.

In Fig. 1, the linear transport section 12 is a section until the multilayer substrate 11 having passed the bonding section 10 is transported to the first curing section 14. Fig.

(First curing step)

The first curing step is a step of curing the adhesive layer in the multilayer substrate while linearly transporting the multilayer substrate. In the first curing step, the multilayer substrate is transported in a straight line, and the adhesive layer is cured in a state in which no displacement or deformation occurs. However, the adhesive layer is not completely cured, but is kept partially cured. By partially curing the adhesive layer of the multi-layer substrate, it is possible to suppress the occurrence of positional shifts and delamination between the layers during bending and transportation, which will be described later.

It is also preferable that the curing rate of the curable resin constituting the adhesive layer after the first curing step and before the second curing step is controlled to be 30% or more. , More preferably not less than 40%, and even more preferably not less than 50%. Further, it is preferable to control it to be 70% or less.

Here, the curing rate of the curable resin can be measured as the progress of the curing reaction by measuring the intensity of a characteristic IR peak derived from a crosslinkable monomer or the like existing in the curable resin. The state where the characteristic IR peak intensity derived from the monomer in the initial state before the curing reaction was set to 0% and the characteristic IR peak intensity derived from the monomer was almost zero due to the progress of the curing reaction and the monomer was completely consumed was taken as 100% The relative degree of curing can be evaluated. The peak intensity derived from a monomer can be measured in a non-destructive state by measurement of real-time FT-IR using a conventional FT-IR (Fourier transform infrared spectrophotometer). For example, FT-IR (product number: Nicolet FT-IR) manufactured by Thermo Fisher Co., Ltd. is used for measurement at spectral resolving power of 2 cm ^-1 and 15 seconds (8 integrations). DTGS is used for the detector, and real time analysis software (product number: OMNIC Series) manufactured by Thermo Fisher can be used for measurement of real time data and analysis of time division data set. The degree of curing after the first curing step can be measured by measuring the FT-IR spectrum when the same resin sample as that of the curable resin constituting the adhesive layer to be measured is placed under the condition corresponding to the first curing step.

After the first curing step and before the next second curing step, the curing rate of the curable resin constituting the adhesive layer is controlled to be 30% or more so that, when bent and conveyed after the second curing step described later, It is possible to suppress the occurrence of deformation or the like. In addition, since the multilayered substrate is bent in a partially cured state, the deformation inherent in the multilayered substrate can be released and the residual stress can be relaxed.

It is also preferable that the viscosity of the curable resin constituting the adhesive layer after the first curing step and before the second curing step is controlled to be 3000 Pas s or more. More preferably not less than 4000 Pa · s, and still more preferably not less than 5,000 Pa · s. Further, it is preferable to control to be 500000 Pa 占 퐏 or less.

Here, the viscosity of the curable resin constituting the adhesive layer can be measured by a conventional viscometer for a polymer. For example, it can be measured using a rheometer DAR-100 manufactured by REOLOGICA. The viscosity after the first curing step can be measured by using the same resin sample as that of the curable resin constituting the adhesive layer to be measured and measuring the viscosity of the resin sample under the conditions corresponding to the first curing step.

After the first curing step and before the next second curing step, the viscosity of the curable resin constituting the adhesive layer is controlled to be not less than 3,000 Pa · s so that when the resin is bent and conveyed after the second curing step described later, It is possible to suppress the occurrence or the occurrence of deformation. In addition, since the multilayered substrate is bent in a partially cured state, the deformation inherent in the multilayered substrate can be released and the residual stress can be relaxed. In this case, it is preferable to increase the viscosity to a level at which the viscosity does not decrease when heated or the like in the subsequent second curing step.

When the curable resin constituting the adhesive layer is a thermosetting resin, it is preferable that the curing means of the adhesive layer in the first curing step and the second curing step is heating. When the curable resin constituting the adhesive layer is a photo-curable resin, it is preferable that the curing means of the adhesive layer in the first curing step and the second curing step is light irradiation.

1, the first curing unit 14 includes a curing apparatus 13 for curing an adhesive layer in the multilayer substrate 11. [ When the adhesive layer in the multilayer substrate 11 is a thermosetting resin, the curing apparatus 13 is a heater, and when the adhesive layer in the multilayer substrate 11 is a photo-curable resin, the curing apparatus 13 is a light irradiation apparatus. The heater or the light irradiation apparatus can be selected from a variety of known apparatuses.

(Second curing step)

In the second curing step, a multi-layer substrate on which the adhesive layer is partially cured is carried in the first curing section, and the adhesive layer in the multi-layer substrate is cured while flexing and transporting the multi-layer substrate. In the second curing step, the adhesive layer is completely cured while flexing and transporting the multi-layer substrate. By completely curing the adhesive layer of the multilayer substrate, the organic EL element is sandwiched and sealed between the element substrate and the adhesive layer on the sealing substrate.

Here, the bending conveyance means that the inclination angle of the substrate is 20 DEG or more when the substrate is wound on the conveying roll in relation to the self weight or tension of the substrate. In the free span between the rolls, the bending curvature of the substrate is less than R1000 mm.

By curing the adhesive layer while flexing and conveying the adhesive layer, the shrinkage stress generated at the time of bonding and at the time of curing the adhesive layer is dispersed and released, and the residual stress after curing is reduced. As a result, positional deviation and peeling of the long base material after bonding can be prevented. It is possible to suppress the occurrence of peeling, curling and the like over time even when the organic EL panel is formed, and the sealing performance can be improved.

The method of bending and transporting the multilayer substrate is not particularly limited. A combination of rolls, a combination of rolls, a combination of rolls and belts, a combination of rolls and winding rolls, and a combination of belt and winding rolls. Also, the number, size, mutual distance, transport speed, transport tension, and elapsed time of the rolls or belts can be appropriately selected and used.

When the curable resin constituting the adhesive layer is a thermosetting resin, a heating means and a light irradiation means when the curable resin constituting the adhesive layer is a photo-curable resin are provided for curing the adhesive layer while flexing and transporting the multilayer substrate.

In Fig. 1, the second hardened portion 17 has a combination of five rolls 15 capable of bending and transporting the multilayered substrate 11 so that the multilayered substrate 11 can be bent and transported. The multi-layer substrate 11 is alternately bent and conveyed between the plurality of rolls 15 at an inclination angle of 20 degrees or more.

1, the second hardened portion 17 is provided with a hardening device 16 for hardening the adhesive layer in the multilayered substrate 11 in order to harden the adhesive layer in the multilayered substrate 11. When the adhesive layer in the multilayer substrate 11 is a thermosetting resin, the curing apparatus 16 is a heater, and when the adhesive layer in the multilayer substrate 11 is a photo-curable resin, the curing apparatus 16 is a light irradiation apparatus. The heater or the light irradiation device can be selected and used appropriately from devices of various known methods.

As described above, since the second curing step according to the present embodiment flexibly transports the multilayer substrate between rolls or the like, it is possible to reduce the size of the apparatus for the second curing step, .

(Winding process, cutting process)

In Fig. 1, the multi-layered substrate 11 having been subjected to the second curing step described above is then wound as a roll 18 as a long organic EL panel or cut to a predetermined dimension to form a plurality of organic EL panels .

(chamber)

In the manufacturing apparatus 1 for producing an organic EL panel according to the present embodiment, each step such as a release step, an adhesive layer application step, a bonding step, a linear transport step, a first curing step, a second curing step, a winding step, , Or may be installed in the chamber to protect it from the external environment. A chamber may be provided for each process, or a chamber including a plurality of processes may be provided. For example, when the bonding process is performed in a reduced pressure atmosphere at a pressure lower than atmospheric pressure, it is possible to provide the bonding portion 10 in a chamber having a function capable of managing the pressure in a reduced-pressure atmosphere below atmospheric pressure. The same applies to other processes.

As described above, according to the method for producing an organic EL panel of the present invention, continuous production using a long substrate can be performed by a roll-to-roll system, and displacement and peeling of a long substrate after bonding can be prevented. As a result, the sealing performance of the organic EL panel can be improved and the productivity can be improved. Also, curling of the organic EL panel over time can be suppressed.

Further, according to the apparatus for manufacturing an organic EL panel of the present invention, it is possible to continuously produce an organic electroluminescent panel using a long substrate, prevent displacement and peeling of a long substrate after bonding, So that a compact manufacturing apparatus can be obtained.

[Structure of Organic EL Device]

Hereinafter, the structure of the organic EL device of the present embodiment will be described in more detail (not shown).

As the organic functional layer of the organic EL device, an organic functional layer having various functions such as a carrier (hole and electron) injection layer, a blocking layer, and a transport layer may be provided in addition to a basic organic functional layer directly involved in light emission, . The organic EL device is usually formed by laminating these various organic functional layers in addition to an element substrate, an electrode, and a light emitting layer.

In the organic EL device, a preferable example of the lamination of the organic functional layer is as follows. In the following (1) to (6), the layers described previously are formed on the first electrode (anode) side and are stacked so as to reach the second electrode (cathode) side in the order described below.

(1) Emissive layer / electron transport layer

(2) hole transporting layer / light emitting layer / electron transporting layer

(3) hole transporting layer / light emitting layer / hole blocking layer / electron transporting layer

(4) hole transporting layer / light emitting layer / hole blocking layer / electron transporting layer / electron injecting layer (cathode buffer layer)

(5) Hole injection layer (anode buffer layer) / hole transport layer / light emitting layer / hole blocking layer / electron transport layer / electron injection layer

(6) Hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer

Hereinafter, each part constituting the organic EL element will be described. However, the constitution of the organic EL element is not limited to the following contents at all.

As described above, the element substrate is preferably composed of a flexible substrate such as a resin. When a resin is used as the element substrate, it is preferable that the gas barrier layer described below is formed on the surface of the resin sheet.

(Gas barrier layer)

It is preferable that one or more gas barrier layers are formed between the element substrate and the organic functional layer from the viewpoint of moisture resistance.

The material for forming the gas barrier layer is not particularly limited, and examples thereof include an inorganic material, an organic material film, or a hybrid film of both. It is preferable to use a material having a function of suppressing intrusion of elements such as moisture and oxygen which causes deterioration of the element. For example, a metal oxide such as silicon oxide, silicon dioxide, or a metal nitride such as silicon nitride can be used. Further, in order to further improve the strength of the gas barrier layer, it is preferable to adopt a laminated structure of a layer containing an inorganic layer and an organic layer. The order of lamination of the inorganic layer and the organic layer is not particularly limited, but it is preferable to laminate the two layers alternately a plurality of times.

(First electrode)

The first electrode (anode) is an electrode film that supplies (injects) holes to the organic functional layer (specifically, the light emitting layer). The kind and physical properties of the material of the first electrode are not particularly limited and can be arbitrarily set. For example, the first electrode can be formed of an electrode material such as a material having a large work function (4 eV or more), for example, a metal, an alloy, an electrically conductive compound, or a mixture thereof. In addition, the first electrode may be made of a transparent material (transparent electrode) such as indium tin oxide (ITO) or indium zinc oxide.

The sheet resistance as the first electrode (anode) is preferably several hundreds? /? Or less. Though the film thickness varies depending on the material, it is usually selected in the range of 10 to 1000 nm, preferably 10 to 200 nm.

(Organic functional layer)

Various organic functional layers constituting the organic functional layer will be described below, but a known material such as a specific material for each organic functional layer of these organic functional layers can be applied, and thus the description thereof will be omitted. Further, with respect to the method of forming the organic functional layer, known methods such as a vapor deposition method and a coating method can be applied, and therefore, the description thereof will be omitted.

The term "

The light emitting layer is formed by recombining holes injected from the first electrode directly or from the first electrode through the hole transporting layer or the like and electrons injected from the second electrode (cathode) through the electron transporting layer or the like, . The light emitting portion may be the inside of the light emitting layer, or may be the interface between the light emitting layer and the adjacent layer.

The light emitting layer is preferably formed of an organic luminescent material containing a host compound (host material) and a luminescent material (luminescent dopant compound). By constituting the light-emitting layer in this way, any light-emitting color can be obtained by suitably adjusting the light-emitting wavelength of the light-emitting material and the kind of the light-emitting material to be contained. Further, by constituting the light-emitting layer in this way, the light-emitting material in the light-emitting layer can emit light.

The total sum of the film thicknesses of the light-emitting layers can be appropriately set in accordance with desired light-emitting characteristics and the like. From the viewpoints of, for example, homogeneity of the light-emitting layer, prevention of unnecessary high-voltage application at the time of light emission, and improvement of the stability of the luminescent color with respect to the drive current, the total thickness of the luminescent layers is preferably 1 nm or more and 200 nm or less Do. In particular, from the viewpoint of the low driving voltage, it is preferable that the sum of the film thicknesses of the light emitting layers is 30 nm or less.

The host compound contained in the light emitting layer is preferably a compound having a phosphorescence emission yield of phosphorescence at room temperature (25 캜) of 0.1 or less, more preferably 0.01 or less. The volume ratio of the host compound in the light emitting layer is preferably 50% or more of the various compounds contained in the light emitting layer.

As the light emitting material contained in the light emitting layer, for example, a phosphorescence emitting material (phosphorescent compound, phosphorescent emitting compound), a fluorescent light emitting material, or the like can be used. One light-emitting layer may contain one kind of light-emitting material, or plural kinds of light-emitting materials having different maximum light-emitting wavelengths may be contained. By using a plurality of kinds of light emitting materials, it is possible to emit light by mixing a plurality of lights having different emission wavelengths, whereby light of any desired color can be obtained. Specifically, for example, white light can be obtained by including a blue light emitting material, a green light emitting material, and a red light emitting material (three kinds of light emitting materials) in a light emitting layer.

&Quot; Injection layer (hole injection layer, electron injection layer) "

The injection layer is a layer for reducing the drive voltage or improving the light emission luminance. The injection layer is usually formed between the electrode and the light-emitting layer. The injection layer is generally roughly divided into two. That is, the injection layer is roughly divided into a hole injection layer for injecting holes (carriers) and an electron injection layer for injecting electrons (carriers). A hole injection layer (anode buffer layer) is formed between the first electrode and the light emitting layer or the hole transporting layer. The electron injection layer (cathode buffer layer) is formed between the second electrode and the light emitting layer or the electron transporting layer.

&Quot; Jersey layer (hole blocking layer, electronic blocking layer) "

The blocking layer is a layer for preventing transport of carriers (holes, electrons). The blocking layer is generally divided into two. That is, the blocking layer is largely divided into a hole blocking layer for blocking the transport of holes (carriers) and an electron blocking layer for blocking the transportation of electrons (carriers).

The hole blocking layer is a layer having a function (electron transporting function) of the electron transporting layer as described later in a broad sense. The hole blocking layer is formed of a material having an electron transporting function and a small hole transporting ability. By forming such a hole blocking layer, the injection balance between holes and electrons in the light emitting layer can be made suitable. Further, by this, the probability of recombination of electrons and holes can be improved.

As the hole blocking layer, the structure of the later-described electron transporting layer can be similarly applied as required. When the hole blocking layer is formed, it is preferable that the hole blocking layer is formed adjacent to the light emitting layer.

On the other hand, the electron blocking layer is a layer having a hole transporting layer function (hole transporting function) described later in a broad sense. The electron blocking layer is formed of a material having a hole transporting function and a small electron transporting ability. By forming such an electron blocking layer, the injection balance between holes and electrons in the light emitting layer can be made suitable. Further, by this, the probability of recombination of electrons and holes can be improved. As the electron blocking layer, if necessary, the structure of the hole transporting layer described later can be similarly applied.

The film thickness of the blocking layer is not particularly limited, but is preferably 3 nm or more, more preferably 5 nm or more, still more preferably 100 nm or less, and further preferably 30 nm or less.

&Quot; Transport layer (hole transport layer, electron transport layer) "

The transport layer is a layer that transports carriers (holes and electrons). The transport layer is generally divided into two. That is, the transport layer is largely classified into a hole transporting layer for transporting holes (carriers) and an electron transporting layer for transporting electrons (carriers).

The hole transporting layer is a layer for transporting (injecting) the holes supplied from the first electrode into the light emitting layer. A hole transporting layer is formed between the first electrode or the hole injecting layer and the light emitting layer. Further, the hole transporting layer also acts as a barrier for preventing the inflow of electrons from the second electrode side. Therefore, the term hole transport layer may be used in a broad sense to mean a hole injection layer and / or an electron blocking layer. The hole transporting layer may be formed in only one layer, or may be formed in plural layers.

The electron transporting layer is a layer for transporting (injecting) electrons supplied from the second electrode to the light emitting layer. The electron transporting layer is formed between the second electrode or the electron injecting layer and the light emitting layer. Further, the electron transporting layer also acts as a barrier for preventing the inflow of holes from the first electrode side. Therefore, the term electron-transporting layer may be used in a broad sense to mean an electron injection layer and / or a hole blocking layer. Further, the electron transporting layer may be formed in only one layer, or may be formed in plural layers.

An electron transporting material (sometimes used as a hole blocking material) used in an electron transporting layer (an electron transporting layer that has a single-layer structure and an electron transporting layer located on the light emitting layer side when a plurality of electron transporting layers and electron transporting layers are provided) And is not particularly limited. However, as the electronic material used in the electron transporting layer, a material having a function of transferring (transporting) electrons injected from the second electrode to the light-emitting layer is usually applicable.

(Second electrode)

The second electrode (cathode) is an electrode film that supplies (injects) electrons to the light emitting layer. The material constituting the second electrode is not particularly limited, but typically, a material having a small work function (4 eV or less) such as a metal (electron injectable metal), an alloy, an electroconductive compound, .

In the organic EL device, when light is extracted from the second electrode side, the second electrode can be formed of an electrode material having light transmittance like the first electrode. In this case, for example, a metal film containing an electrode material for forming a cathode is formed so as to have a film thickness of 1 nm or more and 20 nm or less, and then a film containing a conductive transparent material described in the first electrode is formed on the metal film, Transparent or semitransparent second electrode can be formed.

1: Manufacturing apparatus of organic EL panel
2: element substrate
3: sealing substrate
4, 5, 15, 18: Roll
6:
7: Adhesive layer
8: A sealing substrate having an adhesive layer formed on its surface
9:
10:
11: multilayer substrate
12:
13, 16: Curing device
14: First hardening part
17: Second hardening part

Claims (12)

A long element substrate on which an organic electroluminescence element having an organic functional layer including a first electrode and a light emitting layer and a second electrode is formed on a surface and a long sealing substrate on which an adhesive layer composed of a curable resin is formed on the surface, A bonding step of bonding a surface on which the organic electroluminescence element is formed and a surface of the sealing substrate on which the adhesive layer is formed to form a multilayer substrate,
A linear transporting step of linearly transporting the multilayer substrate;
A first curing step of curing the adhesive layer while linearly transporting the multilayer substrate,
And a second curing step of curing the adhesive layer while flexing and transporting the multilayer substrate, wherein the steps are carried out in this order. The method of manufacturing an organic electroluminescent panel according to claim 1, wherein the curable resin constituting the adhesive layer is a thermosetting resin, and the curing means of the adhesive layer is a heating. The method of manufacturing an organic electroluminescent panel according to claim 1, wherein the curable resin constituting the adhesive layer is a photo-curable resin, and the curing means of the adhesive layer is light irradiation. The organic electroluminescent device according to any one of claims 1 to 3, wherein the curing rate of the curable resin constituting the adhesive layer before the second curing step after the first curing step is 30% A method of manufacturing a nensus panel. The organic electroluminescent device according to any one of claims 1 to 3, wherein the viscosity of the curable resin constituting the adhesive layer before the second curing step after the first curing step is 3000 Pas · s or more A method of manufacturing a luminescence panel. The organic electroluminescent device according to any one of claims 1 to 3, wherein the bonding position between the element substrate and the sealing substrate is adjusted by an adjusting mechanism based on positional information in the bonding step A method of manufacturing a panel. A long element substrate on which an organic electroluminescence element having an organic functional layer including a first electrode and a light emitting layer and a second electrode is formed on a surface thereof and an elongated sealing substrate on which an adhesive layer composed of a curable resin is formed, A joining portion for forming a substrate,
A linear conveying section for linearly conveying the multilayer substrate;
A first hardening unit for hardening the adhesive layer while linearly transporting the multilayer substrate,
And a second hardening unit for hardening the adhesive layer while flexing and transporting the multilayer substrate. The organic electroluminescent panel according to claim 7, wherein the curable resin constituting the adhesive layer is a thermosetting resin, and the curing means of the adhesive layer in the first cured portion and the second cured portion is heating . The organic electroluminescent device according to claim 7, wherein the curable resin constituting the adhesive layer is a photo-curable resin, and the curing means of the adhesive layer in the first cured portion and the second cured portion is light irradiation. A device for manufacturing a sense panel. 10. The organic electroluminescence panel according to any one of claims 7 to 9, wherein the bonding portion includes an adjustment mechanism based on positional information of a bonding position of the element substrate and the sealing substrate Manufacturing apparatus. delete delete

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