KR101672530B1 - A card having multiple fubctions and the method for fabrication the same - Google Patents

A card having multiple fubctions and the method for fabrication the same Download PDF

Info

Publication number
KR101672530B1
KR101672530B1 KR1020150181146A KR20150181146A KR101672530B1 KR 101672530 B1 KR101672530 B1 KR 101672530B1 KR 1020150181146 A KR1020150181146 A KR 1020150181146A KR 20150181146 A KR20150181146 A KR 20150181146A KR 101672530 B1 KR101672530 B1 KR 101672530B1
Authority
KR
South Korea
Prior art keywords
card
external terminal
chip
conductive paste
card module
Prior art date
Application number
KR1020150181146A
Other languages
Korean (ko)
Inventor
김남주
Original Assignee
김남주
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김남주 filed Critical 김남주
Priority to KR1020150181146A priority Critical patent/KR101672530B1/en
Application granted granted Critical
Publication of KR101672530B1 publication Critical patent/KR101672530B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • B42D2033/30—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The purpose of the present invention is to provide a method for stably manufacturing a card which solves distances between contact points of a financial chip (4a) and external terminals and has multiple functions. The method for manufacturing a card of the present invention comprises the steps of: (S1) preparing a main portion (10a) of a card module having one or more chips and elements necessary for the chips on a PCB (18) where a circuit is designed in advance; (S2) adhering corresponding contact points (14b-1, 14b-2, ..., 14b-8) of a height supplement pad (14b) to chip contact points (14-1, 14-2, ..., 14-8) of the main portion (10a) of the card module; (S3) completing the card module (10) by molding and forming the entire card module; (S4) laminating a front printing paper (20) and a back printing paper (30) on an upper and a lower sides of the card module, and transparent sheets (40, 50) of an upper and a lower sides of the upper and the lower sides; (S5) forming an external terminal mounting unit (100a) by performing a first milling in a width of the external terminal in an upper part of the chip contact points (14-1, ..., 14-8); and (S8) mounting the external terminal (14c) on the external terminal mounting unit (100a) while electrically connecting the chip contact points (14-1, ..., 14-8) to a terminal unit corresponding to the external terminal (14c).

Description

[0001] CARD HAVING MULTIPLE FUBCTIONS AND THE METHOD FOR FABRICATION THE SAME [0002]

More particularly, the present invention relates to a card having multiple functions and a method of manufacturing the card. More particularly, the present invention relates to a card having multiple functions, More particularly, to a card having multiple functions, which further has other functions such as Bluetooth and / or a display chip in addition to a financial IC chip and a manufacturing method thereof.

In general, a card is classified into a magnetic card using a magnet strip, a smart card using an IC chip, and a combination card serving as an IC chip according to a recording method. The smart card is classified into a contact type and a non- (NFC) card readable only at a distance of not more than 2 cm and an RF card readable at a long distance. In addition, if classified according to functions, there are debit cards, membership cards, transportation cards, point accumulation cards, and access cards in addition to credit cards. However, in recent years, OTP functions and new additional functions have been added to the cards.

1A to 1C, the IC chip module 4 as shown in FIGS. 1A to 1C is built in a smart card, and the IC chip module 4 as shown in FIG. 1A Only the external terminals 4-1, ..., 4-8 are exposed to the upper side of the card.

1B, an inner terminal (not shown) of the chip 4a is connected to the external terminals 4-1, ..., 4-8 and a wire bonding or the like In order to protect the chip module 4, an epoxy 4b or the like is used to form the chip module 4, and the chip module 4 is embedded in the smart card.

For the manufacturing method of such a smart card or combination card, Korean Patent No. 10-0486946 (name: smart card coated with a conductive paste in a loop coil contact and a method of manufacturing the same) and Korean Patent No. 10-0579019 : Combination card manufacturing method).

Among them, Korean Patent No. 10-0579019 entitled "Combi card manufacturing method" will be briefly described with reference to Figs. 1D to 1G.

First, as shown in FIG. 1D, a digging groove 10a for inserting the microchip 31 is formed in the lower layer 15 of the card. At this time, the depth of the digging grooves 10a is about 0.35 m.

Next, the loop coil 20 is adhered onto the card lower layer 15 as shown in Fig. 1E. At this time, the loop coil 20 is adhered in such a manner that it starts from around the perforated groove 10a and winds along the contour of the card. The start point and the end point of the winding of the loop coil 20 should be located at both ends when the microchip 31 is inserted.

Next, as shown in FIG. 1F, the combi module 30 on which the microchip 31 is mounted is inserted into the digging grooves 10a formed in the card bottom layer 15. In order to protect the combi module 30 on which the microchip 31 is mounted, the enclosure 32 is enclosed so that the combi module 30 is inserted into the digging grooves 10a And spaced apart by a predetermined distance (for example, 0.05 m) from each other.

When the combi module 30 is inserted into the digging grooves 10a formed in the card lower layer 15, the contacts 30a and 30b formed in the combi module 30 are inserted into the loops 10a through the adhesive 19, And adhered to the contacts 20a and 20b formed at both ends of the coil 20. [

When the contacts 30a and 30b of the combi module 30 inserted into the digging grooves 10a formed in the card lower layer 15 are adhered to the contacts 20a and 20b formed at both ends of the loop coil 20 A test for the combination module 30 is performed. At this time, if it is determined that the test result is defective, only the combi module 30 is replaced and then the test is performed again.

1G, when the result of the test of the combi module 30 is normal, the combi module 30 inserted in the digits digging groove 10a is provided with a figure, a number By attaching the card upper printed layer 11 and the card upper overlay layer 12 on which characters and the like are printed and attaching the card lower printed layer 16 and the card lower overlayer 17 to the card lower layer 15 Combi card will be completed.

At this time, a predetermined space (for example, about 0.02 m to 0.05 m) between the card upper printing layer 11 and the upper card overlay layer 12 and the combi module is adhered by the adhesive 19.

Here, the thickness of the upper print layer 11 is about 0.12 m-0.15 m, the thickness of the card upper overlay layer 12 is about 0.05 m-0.06 m, And the thickness of the card lower overlay layer 17 is approximately 0.05 m to 0.06 m.

Korean Patent No. 10-0486946 (name: smart card coated with conductive paste in loop coil contact and method of making the same) Korean Patent No. 10-0579019 (Name: Combi card manufacturing method)

However, in the case of a card having multiple functions of the above-described combination card of the prior art, a plurality of IC chips must be embedded in the card, and the chips must be connected to each other via a separate PCB, Since the chip on the substrate and the external terminal are spaced apart from each other (for example, eight terminals of the built-in chip must be interconnected with external terminals having eight terminal portions) It is impossible to directly connect the respective terminals (for example, eight terminals of the financial chip 4a) and the external terminals 4-1, ..., 4-8, and the built-in chip (for example, It is necessary to electrically resolve the difference between the position of the external terminal and the position of the external terminal (the financial chip 4a).

In addition, separate contacts of the built-in chip (for example, the financial chip 4a) for connection with the external terminals 4-1, ..., 4-8 are connected to the bottom of the PCB substrate The chip on the PCB is molded together with the PCB so that the contact points of the PCB surface are buried by the depth of the chip so that the PCB and the chips are molded (See FIG. 4) of the card module (see FIG. 3B), the front and rear surface printing paper sheets 20 and 30 and the upper and lower transparent sheets 40 and 50 . When the molded card module and the back printing paper 30 and the lower transparent sheet 50 are joined together and the front print paper 20 and the upper transparent sheet 40 are not joined together or both are laminated Even if only the molded card module is milled, the contact holes of the PCB surface must be milled as much as the embedded contact holes of the PCB are milled. The point that precision should be maintained is the same.

However, since the contacts of the PCB or the PCB are made of a weak material, the contact points of the PCB or the PCB are also milled as long as the accuracy of about several micrometers can not be maintained during milling. On the contrary, if the milling process is performed insufficiently in order to prevent this, another problem arises that the contact points are not sufficiently exposed and current is not supplied.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to solve the manufacturing problem caused by the separation between the contacts of the built-in chip (for example, the financial chip 4a) The present invention also provides a stable manufacturing method of a card having multiple functions.

These and other objects of the present invention will be apparent to those skilled in the art without departing from the scope of the present invention by the appended claims.

According to an aspect of the present invention, there is provided a method of manufacturing a multi-functional card, the method comprising: embedding one or more chips mounted on a PCB so as to have various functions; A method of manufacturing a card (100) having multiple functions, wherein the external terminals (4-1, ..., 4-8) are spaced apart from each other, the method comprising the steps of: (a) (S1) of preparing a main part (10a) of a card module provided with the above-mentioned chips and necessary elements; (b) the corresponding contact points 14b-1, 14b of the height-compensating pad 14b are connected to the chip contacts 14-1, 14-2, ..., 14-8 of the main portion 10a of the card module, -2, ..., 14b-8); (c) completing the card module 10 by molding the entirety of the card module (S3); (d) a step (S4) of laminating the front and back printing sheets (20) and (30) on the upper and lower sides of the card module and the upper and lower transparent sheets (40, 50) (e) forming the outer terminal seating portion 100a by performing first-order milling on the tops of the contacts 14b-1, ..., 14b-8 of the height supplementing pad by the width of the outer terminals S5); And (g) after the step (e), the contacts 14b-1, ..., and 14b-8 of the height-compensating pad exposed at the upper portion and the corresponding terminal portions 4- (S8) so that the external terminal (14c) is seated on the external terminal seating portion (100a) while electrically connecting the external terminals (1, 1, ..., 4-8). And a control unit.

Between the step (e) and step (g), (f) the upper portion of the contacts 14b-1, 14b-2, ..., 14b-8 of the height- (S6) of performing additional secondary milling so as to form a conductive paste inlet port 100b so as to reliably expose the portion; (G) is performed by discharging a conductive paste (100c) to the conductive paste input port (100b) (S7), and applying a voltage to each of the conductive paste input port (100b) and the external terminal The external terminal 14c is seated on the external terminal seating portion 100a so that the terminal portions are matched with each other (S8), and the conductive paste of each conductive paste input port 100b is electrically connected to corresponding external terminals .

Preferably, in the step (g), an adhesive agent 100d is added between the bottom surface of the external terminal seating portion 100a and the external terminal 14c to make more reliable bonding.

Also, preferably, the material of the height supplementary pad 14b is made of a material having a rigidity higher than that of the PCB.

Preferably, the card having multiple functions includes a chip having two or more different functions, and the chip contacts 14-1, ..., and 14-8 are contact points of a financial chip .

According to another aspect of the present invention, there is provided a multi-function card manufactured by the multi-function card manufacturing method.

According to the multi-functional card and the method of manufacturing the same according to the present invention, the contacts of the financial chip 4a can be easily separated from the external terminals, and a stable manufacturing method of the card having such multiple functions is provided.

Additional features and advantages of the present invention will become more apparent from the following description.

1A is an upper side view of a conventional IC chip module.
1B is a bottom view of a conventional IC chip module.
1C is a side view of a conventional IC chip module.
1D to 1G are views showing a method of manufacturing a combination card according to the prior art,
FIG. 2A is a plan view of a card module having multiple functions according to a preferred embodiment of the present invention, FIG. 2A is a view before attaching a height complementary pad, and FIG. 2B is a view after attaching a height complementary pad.
FIGS. 3A and 3B are sectional views of a card module having multiple functions according to a preferred embodiment of the present invention, wherein FIG. 3A is a view before molding, and FIG. 3B is a view after molding.
4 is a view showing a stacked configuration of cards having multiple functions according to a preferred embodiment of the present invention.
5 is a view showing a primary milling process after lamination of a card having multiple functions according to a preferred embodiment of the present invention.
6 is a view showing a second milling process after lamination of a card having multiple functions according to a preferred embodiment of the present invention.
7 is a view for explaining a conductive paste discharging step of a card having multiple functions according to a preferred embodiment of the present invention.
8 is a view for explaining a step of attaching an external terminal of a card having multiple functions according to a preferred embodiment of the present invention.
9 is a flowchart showing a method of manufacturing a multi-function card according to a preferred embodiment of the present invention.

Hereinafter, a card having multiple functions according to a preferred embodiment of the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

In the present specification, the following embodiments and embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein but is to be accorded the scope of the appended claims and their equivalents, Can be changed to an example.

First, a multi-function card according to a preferred embodiment of the present invention will be described with reference to Figs. 2 to 8. Fig.

FIGS. 2A and 2B are plan views of a card module having multiple functions according to a preferred embodiment of the present invention, wherein FIG. 2A is a view before attaching a pad for height supplementation, and FIG. 2B is a view after attaching a pad for height supplementation.

FIGS. 3A and 3B are cross-sectional views of a card module having multiple functions according to a preferred embodiment of the present invention, wherein FIG. 3A is a view before molding, and FIG. 3B is a view after molding.

FIG. 4 is a view showing a stacking configuration of a card having multiple functions according to a preferred embodiment of the present invention, FIG. 5 is a view showing a first-order milling process after stacking cards having multiple functions according to a preferred embodiment of the present invention FIG. 6 is a view showing a secondary milling process after lamination of a card having multiple functions according to a preferred embodiment of the present invention, and FIG. 7 is a view showing a process of discharging conductive paste of a card having multiple functions according to a preferred embodiment of the present invention 8 is a view for explaining a step of attaching an external terminal to a card having multiple functions according to a preferred embodiment of the present invention, and Fig. 9 is a view for explaining steps of attaching a card having multiple functions according to a preferred embodiment of the present invention Fig.

As shown in FIG. 4, the multi-function card 100 according to the preferred embodiment of the present invention includes a front print paper 20 and a back print paper 20 on upper and lower sides of a card module 10 having multiple functions, The upper transparent sheet 10 and the lower transparent sheet 50 are laminated on the upper side and the lower side, respectively.

In addition, as shown in FIG. 3B, the card module 10 having multiple functions is formed by forming a molding 19 in a main portion 10a of a card module having multiple functions, 2A and 2B and 3A, a main portion 10a is provided with a plurality of chips or antennas or the like on a PCB 18 having a display portion 12a formed on one side (the lower right side in FIGS. 2A and 2B) Respectively.

A display chip 12, a BLE (Bluetooth Low Energy) chip 13, and a financial chip 14 are connected to a main control unit (MCU) 11, Each chip is connected to its respective operating element.

That is, the display chip 12 is connected to the display unit 12a and displays necessary card information (card number, CVC code, validity period, membership name, barcode, OTP information, etc.) through the display unit 12a . This will indicate which of the multiple integrated cards is currently active.

The BLE chip 13 is connected to the BLE antenna 13a, and the card 100 having multiple functions according to the present invention communicates with the mobile communication terminal (not shown) via the Bluetooth network. However, this is merely an example of communication, and is not necessarily limited to this. However, the BLE method is advantageous for efficiently inputting or managing a plurality of pieces of card information, the BLE chip transmits very small packets rapidly, The size is not large even if it is transmitted, and it is quick and advantageous to synchronize.

The financial chip 14 is similar to the case of a smart card or a combi card containing a conventional NFC chip for short-distance communication. That is, the financial chip 14 is connected to the NFC antenna 14a and performs short-range communication with the reader. On the other hand, the contacts 14-1, ..., , 14-8), so as to operate also in a contact manner.

Since the capacity of the battery is limited due to the limitation of the size and the thickness of the card, the display unit 12a can be activated only when the power button is turned on by pressing the power button 16, Thereby outputting the card information.

Reference numerals 17a and 17b denote a directional key for selecting a card type. However, this may be omitted if the display unit is constituted by a touch screen and a GUI environment is created.

The front face of the card 100 having the multiple functions is characterized by the front side printing paper 20 on the upper side of the card module 10 having multiple functions. As described above, A transparent window for a display is formed at a position matched with the display portion 12a and the corresponding positions of the contact pads 14b, the power button 16 and the selection direction keys 17a, A terminal of the financial chip, a power button display section, and a selection direction key display section are printed.

On the other hand, the rear surface of the card 100 having the multiple functions is characterized by the back side printing paper 30 on the lower side of the card module 10 having multiple functions. In this case, (Sine according to the card to be activated when the sine is different for each card is displayed differently), and there is a magnetic information generation part at the corresponding position of the magnet strip of the existing magnetic card. At this time, the magnetic information generating unit does not actually magnetize the magnetic information, but merely serves to give the same magnet information to the reader when passing the card to the magnet reader.

Now, with reference to Figs. 2A to 9, a method of manufacturing a card 100 having multiple functions according to a preferred embodiment of the present invention will be described.

First, the card module 10 of the card 100 having the multiple functions of the present invention is manufactured. 2A, the card module 10 includes various chips 12, 13, 14, and 15, antennas 13a and 14a, a power button 16, Buttons 17a and 17b, and a main part 10a of a card module provided with a display window, a battery, and a connection circuit therebetween (S1 in FIG. 9). In particular, in this case, the internal terminals (not shown) of the financial chip 14 are connected to the MCU 15 and the antenna 14a as well as the financial chip contacts 14-1, 14-2, ..., 14-8).

Now, as shown in FIG. 2b and FIG. 3a, a plurality of pads (not shown) of the height-supplementing pads 14b are provided on the financial chip contacts 14-1, 14-2, ..., 14-8 of the module 10a The corresponding contact points 14b-1, 14b-2, ..., 14b-8 are bonded by soldering, ultrasonic welding, or conductive glue (S2). Alternatively, the card may be bonded by using the technique of the patent No. 1073440 entitled " card using a trigger and its manufacturing method ", which is related to the present inventor.

Then, as shown in FIG. 3B, the entire module is molded by using silicone, epoxy, or other molding material (S3) to complete the card module 10, and then, as shown in FIG. 4, And the upper and lower transparent sheets 40 and 50 are stacked on the upper and lower sides of the front print paper 20 and the rear print paper 30 respectively and then the upper and lower transparent sheets 40 and 50 are melt- The card 100 excluding the external terminals of the chip for use is completed.

The thickness of the upper and lower transparent sheets 40 and 50 is 0.04 to 0.06 mm, and the thicknesses of the upper and lower transparent sheets 40 and 50 are 0.04 mm to 0.06 mm. The thickness of the module 10 is 0.4 to 0.6 mm and the thickness of the PCB 18 is 0.1 to 0.2 mm when the printing paper 20 and the printing paper 30 are 0.1 to 0.15 mm respectively. Therefore, the thickness of the height-compensating pad 14b should be a thickness that is less than the thickness of the PCB 18 and the thickness of the molding layer in the thickness of the card module 10, Is appropriate.

5, first-order milling is performed on the top of the financial chip contacts 14-1, ..., 14-8 by the width of the external terminal (14c in Fig. 8) Thereby forming a portion 100a (S5).

At this time, if there is no pad 14b for reinforcing the height of the rigid material, the flexible molding part at the time of milling also forms financial chip contacts 14-1, ..., 14-8 of the same material as the FPCB 18 The card is also subjected to milling, resulting in a card failure. On the contrary, the card may be milled far below the financial chip contacts 14-1, ..., 14-8, In the present invention, there is a pad 14b for reinforcing the height of a rigid material, so that the milling can be appropriately performed up to this point.

Thereafter, in order to completely secure the upper portion of the contacts 14b-1, 14b-2, ..., 14b-8 of the height compensating pad 14b, Secondary milling is performed to form the conductive paste inlet 100b (S6).

If the upper portion of the contacts 14b-1, 14b-2, ..., 14b-8 of the height complementary pad 14b is sufficiently exposed by the primary milling as required, Only the contact portions 14b-1, 14b-2, ..., 14b-8 of the height-compensating pad 14b are subjected to the secondary milling after the primary milling for more reliable electrical connection, Is more preferable.

Subsequently, the conductive paste 100c is discharged to the conductive paste input port 100b (eight in this embodiment) (S7). Finally, the conductive paste input port 100b and the external terminal 14c The conductive paste of each conductive paste input port 100b and the corresponding external terminals are electrically connected to each other so that the external terminals 14c are seated on the external terminal seating portion 100a while the respective terminal portions are matched ). At this time, it is preferable that an adhesive 100d is added between the bottom surface of the external terminal seating portion 100a and the external terminal 14c so that more reliable bonding can be achieved.

On the other hand, the electrical connection between the corresponding terminal portions of the financial chip contacts 14-1, ..., 14-8 and the external terminal 14c is not necessarily limited to the conductive paste method, Alternatively, the conductive paste may be applied to the financial chip contacts 14-1, ..., 14-8, and then the conductive paste may be bonded to the financial chip contacts 14-1, ..., 14-8, The conductive paste may be applied to the external terminal and then bonded to the external terminal. As a result, the step S7 may be omitted, or the steps S7 and S8 may be simultaneously performed.

Of course, electrical connection may be made through solder instead of the conductive paste or through the initiator described above. The size of each contact of the external terminal 14c, which is also referred to as "COB base film ", is preferably 0.5 to 2 mm * 0.5 to 2 mm.

Although the above is an example of a smart card having multiple functions with multiple chips, it is necessary to connect the internal terminal of the chip to not only the external terminal but also other devices For a variety of reasons, the manufacture of all smart cards which need to adjust the height of the PCB contacts due to the different position of the chip and the horizontal position of the external terminal (COB base film) It will be possible to apply.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but variations and modifications may be made therein without departing from the spirit and scope of the invention. It is natural to belong.

100: Multi-function card
10: Card module 20: Front printing paper
30: back side printing paper 40: upper side transparent sheet
50: Lower side transparent sheet

Claims (6)

Wherein one or more chips mounted on a PCB are mounted so as to have various functions, wherein among the one or more chips, terminals of chips on the PCB and external terminals (4-1, ..., 4-8) The method comprising the steps of:
(a) preparing (S1) a main portion 10a of a card module provided with the one or more chips and necessary elements on a PCB 18 on which circuits are previously designed;
(b) the corresponding contact points 14b-1, 14b of the height-compensating pad 14b are connected to the chip contacts 14-1, 14-2, ..., 14-8 of the main portion 10a of the card module, -2, ..., 14b-8);
(c) completing the card module 10 by molding the entirety of the card module (S3);
(d) a step (S4) of laminating the front and back printing sheets (20) and (30) on the upper and lower sides of the card module and the upper and lower transparent sheets (40, 50)
(e) forming the outer terminal seating portion 100a by performing first-order milling on the tops of the contacts 14b-1, ..., 14b-8 of the height supplementing pad by the width of the outer terminals S5); And
(g) After the step (e), the contact points 14b-1, ..., and 14b-8 of the height-compensating pad exposed at the upper portion and the corresponding terminal portions 4-1 (S8) so that the external terminal (14c) is seated on the external terminal seating portion (100a) while allowing the external terminal (14a, ..., 4-8) to be electrically connected.
The method comprising the steps of: The method according to claim 1,
Between the step (e) and the step (g)
(f) further secondary milling is carried out so as to reliably expose the upper portions of the contacts 14b-1, 14b-2, ..., 14b-8 of the height complementary pad 14b to form conductive paste input ports (S6);
Further comprising:
The step (g)
The conductive paste 100c is discharged to the conductive paste input port 100b at step S7 so that the respective terminals of the conductive paste input port 100b and the external terminal 14c are matched with each other, (S8) so that the conductive paste of each conductive paste input port (100b) and the corresponding external terminals are electrically connected to each other. . The method according to claim 1,
Wherein the step (g) further comprises the step of adding an adhesive (100d) between the bottom surface of the external terminal seating portion (100a) and the external terminal (14c) Gt; The method according to claim 1,
Wherein the pad of the height supplementing pad (14b) is made of a material having a rigidity higher than that of the PCB. The method according to claim 1,
Wherein the card having the multiple functions includes a chip having two or more different functions,
Wherein the chip contacts (14-1, ..., 14-8) are contact points of a financial chip. 8. A card having multiple functions, which is produced by the method for manufacturing a card having multiple functions according to any one of claims 1 to 5.
KR1020150181146A 2015-12-17 2015-12-17 A card having multiple fubctions and the method for fabrication the same KR101672530B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150181146A KR101672530B1 (en) 2015-12-17 2015-12-17 A card having multiple fubctions and the method for fabrication the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150181146A KR101672530B1 (en) 2015-12-17 2015-12-17 A card having multiple fubctions and the method for fabrication the same

Publications (1)

Publication Number Publication Date
KR101672530B1 true KR101672530B1 (en) 2016-11-10

Family

ID=57484598

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150181146A KR101672530B1 (en) 2015-12-17 2015-12-17 A card having multiple fubctions and the method for fabrication the same

Country Status (1)

Country Link
KR (1) KR101672530B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101760675B1 (en) * 2016-11-09 2017-07-24 주식회사 마늘랩 Smart card having middle pad and manufacturing method thereof
WO2020116891A1 (en) * 2018-12-07 2020-06-11 코나아이 주식회사 Ic chip for power supply and method for manufacturing same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486946B1 (en) 2003-01-22 2005-05-03 (주)이.씨테크날리지 Smart Card Coated With Conductive Paste On A Point Of Contact Of Loop Coil And Method For Manufacturing it
KR100579019B1 (en) 2003-11-10 2006-05-12 (주)이.씨테크날리지 Method for fabricating combi card
KR20060050979A (en) * 2004-09-02 2006-05-19 싸이칩 인크. Sd/mmc cards
KR20090029979A (en) * 2007-09-19 2009-03-24 주식회사 하이스마텍 Manufacturing method for the combi card

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486946B1 (en) 2003-01-22 2005-05-03 (주)이.씨테크날리지 Smart Card Coated With Conductive Paste On A Point Of Contact Of Loop Coil And Method For Manufacturing it
KR100579019B1 (en) 2003-11-10 2006-05-12 (주)이.씨테크날리지 Method for fabricating combi card
KR20060050979A (en) * 2004-09-02 2006-05-19 싸이칩 인크. Sd/mmc cards
KR20090029979A (en) * 2007-09-19 2009-03-24 주식회사 하이스마텍 Manufacturing method for the combi card

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101760675B1 (en) * 2016-11-09 2017-07-24 주식회사 마늘랩 Smart card having middle pad and manufacturing method thereof
WO2020116891A1 (en) * 2018-12-07 2020-06-11 코나아이 주식회사 Ic chip for power supply and method for manufacturing same
KR20200069604A (en) * 2018-12-07 2020-06-17 코나아이 (주) Ic chip for power supplyment and manufacturing method of it
KR102150867B1 (en) * 2018-12-07 2020-09-02 코나아이 (주) Ic chip for power supplyment and manufacturing method of it

Similar Documents

Publication Publication Date Title
KR102540133B1 (en) Chip cards and chip card manufacturing methods
US10769405B2 (en) Electronic card comprising a fingerprint sensor and method of manufacturing such a card
TW514834B (en) Chip-card
US10685275B2 (en) Method for fabricating a smart card device
KR101572715B1 (en) Method for creating a multifunctional module and device including same
CN104577342A (en) Booster antenna structure
US9167691B2 (en) Dual interface module and dual interface card having a dual interface module manufactured using laser welding
US11769030B2 (en) Enrolment device for a biometric smart card
US10440825B2 (en) Chip card module and method for producing a chip card module
KR101672530B1 (en) A card having multiple fubctions and the method for fabrication the same
JP2022507119A (en) Electronic module for chip card
KR101151025B1 (en) Manufacturing method of contact and non-contact card
US20170039464A1 (en) A method for fabricating an electronic/electrical circuit device
KR101904257B1 (en) A method for fabrication of a card having input/output device
US11681891B2 (en) Electronic module for chip card comprising a display screen
US20230252260A1 (en) A method of forming a prelam body of a smart card, a method of forming a smart card, a prelam body, and a smart card
EP3995994A2 (en) Integrated biometric sensor module and method for manufacturing a smartcard comprising an integrated biometric sensor module
RU2818686C1 (en) Payment smart card with contactless interface and light-emitting diodes (versions)
JP2018092482A (en) Ic module, medium mounted with ic module and method for manufacturing ic module
US11392189B1 (en) Interactive core for electronic cards
US20170076192A1 (en) Method for Producing a Film Which Serves as a Carrier for Electronic Components
JP4996179B2 (en) IC card and IC card manufacturing method
US20180233805A1 (en) Method for manufacturing a radiofrequency antenna on a substrate and antenna thus obtained
JP2010072930A (en) Ic module and ic card using the same
CN107423801A (en) Smart card and its manufacture method

Legal Events

Date Code Title Description
GRNT Written decision to grant