WO2020116891A1 - Ic chip for power supply and method for manufacturing same - Google Patents

Ic chip for power supply and method for manufacturing same Download PDF

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Publication number
WO2020116891A1
WO2020116891A1 PCT/KR2019/016915 KR2019016915W WO2020116891A1 WO 2020116891 A1 WO2020116891 A1 WO 2020116891A1 KR 2019016915 W KR2019016915 W KR 2019016915W WO 2020116891 A1 WO2020116891 A1 WO 2020116891A1
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WIPO (PCT)
Prior art keywords
terminal
pad
chip
power supply
power
Prior art date
Application number
PCT/KR2019/016915
Other languages
French (fr)
Korean (ko)
Inventor
오영덕
이승기
진영래
Original Assignee
코나아이 주식회사
코나엠 주식회사
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Publication of WO2020116891A1 publication Critical patent/WO2020116891A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G06K19/07707—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual the visual interface being a display, e.g. LCD or electronic ink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Definitions

  • the present invention relates to an IC chip for power supply and a method for manufacturing the same, and to provide an IC chip for power supply and a method for manufacturing the IC chip for supplying power to other modules in a smart card by improving the existing IC chip structure.
  • a smart card is a type in which a semiconductor chip containing various functions such as a microprocessor (CPU), memory, and operating system (OS) is inserted into a plastic card shaped like a credit card. It is also called a chip card or IC card, and it can store a lot of information and perform various functions compared to a conventional magnetic card, and has excellent stability. It is also divided into a contact-type smart card that operates when the metal pattern of the card and the terminal part of the input device are in contact, and a contactless smart card that can send and receive data at a close distance to the input device.
  • a contact-type smart card that operates when the metal pattern of the card and the terminal part of the input device are in contact
  • a contactless smart card that can send and receive data at a close distance to the input device.
  • a smart card with IC chips capable of storing large amounts of information has been developed and is actively used as a card equipped with biometric and secure OTP functions as well as payment.
  • the IC chip mounted on such a smart card was able to use contact and contactless communication as one IC chip using 8 pins (hereinafter referred to as ISO 8 pins) specified in ISO-7816.
  • the existing IC chip 110 has a contact structure composed of 6 pins or 8 pins, and each pin C1 performs a power supply (Vcc) function required for driving the IC chip.
  • RST reset signal
  • CLK clock signal
  • GND ground reference voltage
  • the CFU pin 114 and the C8 pin 118 may be further included as RFU contacts as spare terminals, and may be used as contacts connected to an external antenna in a plug-in type package.
  • the configuration of the IC chip is manufactured by attaching the chip 120 to the lead frame 150 and then connecting the contacts 111 to 118 by wire bonding (see FIG. 2 ).
  • the lead frame 150 is a metal substrate on which a semiconductor chip is mounted and attached, and serves to supply electricity to and support the semiconductor chip.
  • a smart card using an IC chip can supply power through an internal power supply such as a battery or a charging circuit, and various technologies have been developed for efficient power supply.
  • an internal power supply such as a battery or a charging circuit
  • various technologies have been developed for efficient power supply.
  • the battery itself when power is supplied using a battery, the battery itself must be KC certified, and there is a problem that there is a risk of fire.
  • a smart card without a battery has been developed.
  • the present invention is a device for solving the above problems and supplying power to a smart card without a battery, and is designed to utilize an IC chip, when designing an electronic card according to an embodiment of the present invention, an IC chip
  • An object of the present invention is to provide a technology that utilizes a terminal to enable power supply.
  • a power supply IC chip includes: a semiconductor chip including one or more terminals, each of which performs a different function; A contact on a metal lead frame connected to a terminal of the semiconductor chip by wire bonding through a via hole through the PCB; A first pad connected to a supply voltage connection among the connection portions and formed on the PCB; And a second pad formed on the PCB and connected to a ground connection among the connection portions, wherein the first pad and the second pad are each a power supply unit designed in one or more modules included in the smart card. Can be connected.
  • the module may include at least one of a display module and a communication module including BLE.
  • the IC chip for power supply when the IC chip for power supply is inserted into a reader or charger, power is supplied through a contact terminal, and power supplied through the first pad and the second pad can be applied to the module.
  • the one or more terminals are at least one of a power voltage (Vcc) terminal, a ground (GND) terminal, a communication (LA, LB) terminal, a synchronization signal (CLK) terminal, an input/output (I/O) terminal, and a spare (RFU) terminal. Includes terminals.
  • a method of manufacturing an IC chip for power supply includes the steps of disposing a semiconductor chip on a lead frame including one or more terminals each performing a different function; Connecting a terminal of the semiconductor chip and a contact on the metal lead frame by wire bonding, respectively, through a via hole through the PCB; Forming a first pad disposed on the PCB and connected to a supply voltage connection part among the connection parts; And forming a second pad disposed on the PCB and connected to a ground connection part among the connection parts.
  • the present invention even if the smart card does not have an additional battery, by designing the voltage supplied to the IC chip to be supplied to an external module, it is possible to reduce the cost of manufacturing a smart card and enable efficient power supply, but is most suitable for cardization. .
  • the power is supplied to another module through the arrangement of the power supply pad of the IC chip, stable power supply is possible without additional circuit changes and additional components. That is, it is possible to receive power only by using a smart card without constructing a separate infrastructure, thereby maximizing economic efficiency.
  • the power can be continuously supplied, such as when a smart card is mounted on a charger (or a reader), the power supply time and voltage limitation of the existing smart card can be overcome to provide power for a long time.
  • the card can be equipped with modules of various functions, and has the advantage of increasing utilization.
  • Figure 1 shows the contact structure of the IC chip of the existing smart card.
  • FIG. 2 is a perspective view of an IC chip according to an embodiment of the present invention.
  • Figure 3 shows the structure of an electronic card according to an embodiment of the present invention.
  • FIG. 4 illustrates a contact structure of an IC chip according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view illustrating the connection between the IC chip and the contact pad according to an embodiment of the present invention.
  • Figure 2 shows a perspective view of an IC chip according to an embodiment of the present invention, showing the contact structure of the back of the IC chip.
  • the IC chip 110 includes a lead frame 150 and a semiconductor chip 120, and terminals of the semiconductor chip 120 are connected to the contacts 125 formed in the lead frame by wire bonding. , It is possible to make the contacts 125 perform each function.
  • the lead frame 150 is a metal substrate on which a semiconductor chip is mounted and attached, and serves to supply electricity to and support the semiconductor chip. At this time, the metal pads 130 and 140 may be additionally made and used so that some of the contacts 125 are connected to the external module.
  • the IC chip is designed to connect the semiconductor chip 120 to the lead frame 150, but is connected to an antenna and used as a communication terminal, existing pads 130 and 140
  • pads 210 and 230 were additionally manufactured to design pads for power supply.
  • the power supply pad includes a first pad 210 connected to a Vcc terminal and a second pad 230 connected to a ground (GND, ground) terminal.
  • the first pad 210 is connected to the Vcc terminal, and the second pad 230 is connected to the ground terminal.
  • the COB pad type IC chip 110 is mounted on the smart card, the first pad 210 and the second pad 230 may be connected to the power supply terminals of other modules to supply power voltage.
  • the voltage supplied to the IC chip can be designed to be supplied to an external module, thereby reducing the cost of manufacturing the smart card and enabling efficient power supply.
  • the smart card according to an embodiment of the present invention can continuously receive power when used by inserting it into a contact terminal such as a high-pass card, and the IC chip contact structure according to an embodiment of the present invention Through it, it becomes possible to supply power to other modules in the smart card. According to this power supply method, it is possible to efficiently supply power to various modules such as a display module and a communication module in a smart card. In addition, there is an effect of maximizing economic efficiency since power can be supplied only with a smart card without constructing an additional infrastructure.
  • FIG. 3 shows the structure of an electronic card according to an embodiment of the present invention.
  • the smart card 300 includes an IC chip 200, an LED module 310, and a BLE module 320. This illustrates an embodiment, and the configuration of the smart card 300 is not limited to this, and may further include additional components such as a processor and memory required for the operation of the smart card.
  • the smart card 300 may include an LED module 310 for displaying a status to a user.
  • the LED module 310 may be implemented to turn on a blue light when operating, or a red light when malfunctioning or when power is not supplied.
  • the BLE module 320 is a type of Bluetooth communication module in which the smart card 300 supports Blue Low Energy (BLE), and the smart card 300 is capable of BLE communication with an electronic module such as a smart phone or wearable device carried by the user. Can be connected through.
  • BLE Blue Low Energy
  • the LED module 310 and the BLE module 320 are exemplary, and various modules may be mounted in addition to the smart card 300 according to an embodiment of the present invention.
  • the LED module 310 and the BLE module 320 may be supplied with power from the IC chip 200.
  • the power supply terminals of the LED module 310 and the BLE module 320 may be connected to the first pad 210 and the second pad 230 of the IC chip 200.
  • the first pad 210 is connected to the power supply terminal (Vcc) to provide a supply voltage
  • the second pad 230 serves as a ground terminal, thereby powering each module (310, 320).
  • Can supply the power supply terminal
  • the IC chip 200 may be supplied with power in a contact or non-contact manner.
  • the smart card 300 is connected to an electronic device (for example, a high-pass terminal) capable of receiving power through the contact terminal 130, so that the power voltage can be supplied while connected.
  • the IC chip 200 may receive a voltage and supply it to the internal modules 310 and 320. As such, the IC chip 200 may supply the voltage to the other module using the voltage received through the contact or contactless communication, thereby efficiently operating the smart card 300 without an additional power supply.
  • the IC chip 200 may have eight contact structures. Each contact includes a Vcc contact 410 that performs a power supply (Vcc) function required for driving the IC chip, a GND contact 420 that performs a ground reference voltage (GND) function, and a reset signal (RST) reset.
  • RST contact 450 for applying, LA contact 430 used for contactless communication and connected to an antenna LB contact 440, CLK contact 470 for applying a clock signal (CLK), for data input/output It includes an I/O contact 460 which is a contact.
  • the IC chip 200 may include communication contact pads 220 and 240 disposed on the left and right sides of the semiconductor chip 250 to connect to the antenna terminal.
  • An antenna may be connected to the communication contact pads 220 and 240.
  • This is a general structure used in the existing IC chip 200.
  • the small circles 415, 425, 455, 465, and 475 formed around the semiconductor chip 250 are connections on the metal lead frame, and are via holes formed in the front contact portion, and are connected to the via hole through the wire bonding to the terminals of the semiconductor chip 250. Connect with the field.
  • the wire indicated by the dotted line may be connected to the LA terminal 431 of the contact pad 240 and the LB terminal 441 of the contact pad 220 to be used as a communication terminal.
  • Other terminals can be bonded to via holes, respectively, and used as Vcc, GND, RST, I/O, and CLK terminals.
  • the Vcc terminal of the semiconductor chip 250 may be connected to the supply voltage connection 415 through wire bonding, and the supply voltage connection 415 may be connected to the first pad 210 through wire bonding.
  • the GND terminal of the semiconductor chip 250 may be connected to the ground connection portion 425 through wire bonding, and the ground connection portion 425 may be connected to the terminal 231 of the second pad 230 through wire bonding.
  • the RST terminal of the semiconductor chip 250 may be connected to the RST connection 455 through wire bonding, and the I/O terminal of the semiconductor chip 250 may be connected to the I/O connection 465 through wire bonding,
  • the CLK terminal of the semiconductor chip 250 may be connected to the CLK connection 475 through wire bonding.
  • the IC chip 200 may further include additional pads 210 and 230 to supply power to other modules in the smart card.
  • the first pad 210 is connected to the Vcc contact 410 as a supply power to have a potential of a supply voltage
  • the second pad 230 is connected to the GND contact 420 to serve as a ground.
  • the pads 210 and 230 are disposed on the upper and lower portions of the semiconductor chip 250 in this drawing, this is only an example, and may be designed to be disposed at different locations or to have two or more pads.
  • the first pad 210 and the second pad 230 disposed for power supply are connected to the semiconductor chip 250 through wire bonding.
  • 5 is a cross-sectional view illustrating the connection between the IC chip and the contact pad according to an embodiment of the present invention. Referring to (a) of FIG. 5, through holes 530 and 540 are formed in a plate formed of a metal lead frame 510 and a PCB 520 to form a metal lead frame 510 and a terminal of the semiconductor chip 250. It has taken a method of connecting each area of the front part of the.
  • the Vcc terminal and the ground (GND) terminal of the semiconductor chip 250 are respectively connected to the first pad 210 and the second pad 230.
  • I can connect. That is, the supply voltage of the metal lead frame 510 connected from the Vcc terminal of the semiconductor chip 250 through the wire bonding W1 to the connection portion 415 for the supply voltage of the metal lead frame 510 and connected to the Vcc terminal.
  • the connection part 415 is connected to the first pad 210 through wire bonding W2.
  • the Vcc terminal can be expanded and used by mixing the front side bonding and the back side bonding.
  • the ground terminal of the semiconductor chip 250 and the ground connection portion 425 of the metal lead frame 510 are connected through a wire bonding W3, and the ground connection portion of the metal lead frame 510 connected to the ground terminal ( 425) is connected to the second pad 230 through wire bonding (W4), so that the second pad 230 is implemented to perform a grounding role.
  • the first pad 210 and the second pad 230 connected as described above may serve as a contact point for supplying power, and provide a supply voltage when the pads 210 and 230 are connected to other modules in the smart card.
  • the pads for supplying power are not limited to two, but can be arranged and extended in two or more, and transmits the voltage supplied by the IC chip to another module to serve as a power supply.
  • the power is supplied to other modules through the arrangement of power supply pads of the IC chip, stable power supply without additional circuit changes and additional components It has the effect of becoming possible.
  • the power can be continuously supplied, such as when a smart card is mounted on a charger (or a reader), the power supply time and voltage limitation of the existing smart card can be overcome to provide power for a long time.
  • the card can be equipped with modules of various functions, and has the advantage of increasing utilization.

Abstract

The present invention relates to an IC chip for power supply and a method for manufacturing same. The IC chip comprises: a semiconductor chip including one or more terminals performing different functions; contacts on a metal lead frame, connected to the terminals of the semiconductor chip by means of wire bonding through via holes penetrating a PCB; a first pad connected to one of the contacts being for a supply voltage, the first pad being formed on the PCB; and a second pad connected to one of the contacts being for grounding, the second pad being formed on the PCB, wherein the first pad and the second pad are connected to a module included in a smart card and used as power supply terminals for the module.

Description

전원 공급용 아이씨 칩 및 이의 제조 방법IC chip for power supply and manufacturing method thereof
본 발명은 전원 공급용 아이씨 칩 및 이의 제조 방법에 관한 것으로서, 기존의 아이씨 칩 구조를 개선하여 스마트 카드 내 다른 모듈에 전원 공급이 가능하도록 하는 전원 공급용 아이씨 칩 및 이의 제조 방법을 제공한다.The present invention relates to an IC chip for power supply and a method for manufacturing the same, and to provide an IC chip for power supply and a method for manufacturing the IC chip for supplying power to other modules in a smart card by improving the existing IC chip structure.
스마트카드는 마이크로 프로세서(CPU), 메모리, 운영체제(OS) 등 다양한 기능이 들어있는 반도체 칩이 신용카드 모양의 플라스틱 카드에 삽입된 형태를 말한다. 칩 카드 혹은 아이씨(IC) 카드라고도 불리며, 기존 마그네틱 카드 대비 많은 정보를 저장하고 다양한 기능을 수행할 수 있으며 안정성이 뛰어난 장점이 있다. 카드의 금속 패턴과 입력기기의 단자부가 접촉했을 때 작동하는 접촉식 스마트카드와, 입력기기와 가까운 거리에서 데이터를 주고 받을 수 있는 비접촉식 스마트카드로 나뉘기도 한다.A smart card is a type in which a semiconductor chip containing various functions such as a microprocessor (CPU), memory, and operating system (OS) is inserted into a plastic card shaped like a credit card. It is also called a chip card or IC card, and it can store a lot of information and perform various functions compared to a conventional magnetic card, and has excellent stability. It is also divided into a contact-type smart card that operates when the metal pattern of the card and the terminal part of the input device are in contact, and a contactless smart card that can send and receive data at a close distance to the input device.
최근 대용량의 정보를 수록할 수 있는 아이씨 칩들이 내장된 스마트 카드로 개발되어 결제뿐만 아니라 생체 인식, 보안 OTP 기능들을 탑재한 카드로 적극 활용되고 있다. 이러한 스마트 카드에 탑재되는 아이씨 칩은 ISO-7816에 규정된 8핀(이하, ISO 8핀)을 사용하여 접촉식(Contact)과 비접촉식(Contactless) 통신을 하나의 아이씨 칩으로 사용할 수 있었다.Recently, a smart card with IC chips capable of storing large amounts of information has been developed and is actively used as a card equipped with biometric and secure OTP functions as well as payment. The IC chip mounted on such a smart card was able to use contact and contactless communication as one IC chip using 8 pins (hereinafter referred to as ISO 8 pins) specified in ISO-7816.
도 1의 (a)에 도시된 것처럼, 기존의 아이씨 칩(110)은 6핀 또는 8핀으로 구성된 접점 구조를 갖고, 각각의 핀은 아이씨 칩 구동에 필요한 공급 전원(Vcc) 기능을 수행하는 C1 핀(111), 재설정 신호(RST; Reset)를 인가하는 C2 핀(112), 클럭 신호(CLK; Clock)를 인가하는 C3 핀(113), 접지 참조 전압(GND; Ground) 기능을 수행하는 C5 핀(115), 프로그래밍 전압 또는 가변 공급 전압(Vpp)을 인가하는 C6 핀(116), 데이터 입력/출력을 위한 접점인 C7 핀(117)을 포함한다. 8핀 구조의 경우 예비 단자인 RFU 접점으로 C4 핀(114), C8 핀(118)을 더 포함할 수 있고, 플러그인 타입의 패키지에서 외장 안테나와 연결되는 접점으로 활용될 수 있다. As shown in (a) of FIG. 1, the existing IC chip 110 has a contact structure composed of 6 pins or 8 pins, and each pin C1 performs a power supply (Vcc) function required for driving the IC chip. Pin 111, C2 pin 112 applying a reset signal (RST; Reset), C3 pin 113 applying a clock signal (CLK), C5 performing a ground reference voltage (GND) function It includes a pin 115, a C6 pin 116 for applying a programming voltage or a variable supply voltage (Vpp), and a C7 pin 117 as a contact point for data input/output. In the case of the 8-pin structure, the CFU pin 114 and the C8 pin 118 may be further included as RFU contacts as spare terminals, and may be used as contacts connected to an external antenna in a plug-in type package.
이러한 아이씨 칩의 구성은, 리드 프레임(150)에 칩(120)을 부착한 후, 와이어 본딩으로 접점들(111 내지 118)과 연결하는 방식으로 제작된다(도 2 참조). 리드 프레임(150)은 반도체 칩을 올려 부착하는 금속 기판으로서, 반도체 칩에 전기를 공급하고 이를 지지해 주는 역할을 한다. The configuration of the IC chip is manufactured by attaching the chip 120 to the lead frame 150 and then connecting the contacts 111 to 118 by wire bonding (see FIG. 2 ). The lead frame 150 is a metal substrate on which a semiconductor chip is mounted and attached, and serves to supply electricity to and support the semiconductor chip.
한편, 아이씨 칩을 이용한 스마트 카드는, 배터리 또는 충전회로 등 내부 전원 공급 장치를 통해 전원 공급이 가능한데, 효율적인 전원 공급을 위해 다양한 기술들이 개발되고 있다. 일례로, 배터리를 이용하여 전원을 공급한 경우, 배터리 자체에 KC 인증을 받아야 하고, 화재의 위험이 있다는 문제점이 있어, 이를 극복하기 위하여, 배터리가 없는 타입의 스마트 카드가 개발되고 있다.Meanwhile, a smart card using an IC chip can supply power through an internal power supply such as a battery or a charging circuit, and various technologies have been developed for efficient power supply. For example, when power is supplied using a battery, the battery itself must be KC certified, and there is a problem that there is a risk of fire. To overcome this, a smart card without a battery has been developed.
본 발명은 상기한 문제점을 해결하고 배터리 없이 스마트 카드 내부에 전원을 공급하기 위한 장치로서, 아이씨 칩(IC Chip)을 활용하기 위해 고안되어 본 발명의 일 실시예에 의한 전자 카드 설계 시, 아이씨 칩을 통해 전원 공급이 가능하도록 단자를 활용하는 기술을 제공하는 것을 목적으로 한다.The present invention is a device for solving the above problems and supplying power to a smart card without a battery, and is designed to utilize an IC chip, when designing an electronic card according to an embodiment of the present invention, an IC chip An object of the present invention is to provide a technology that utilizes a terminal to enable power supply.
본 발명의 일 실시예에 따르면, 전원 공급용 아이씨 칩은, 각각이 다른 기능을 수행하는 하나 이상의 단자를 포함하는 반도체 칩; PCB를 관통하는 관통 홀(via hole)을 통해, 와이어 본딩으로 상기 반도체 칩의 단자와 연결되는 금속 리드 프레임 상의 접속부(contact); 상기 접속부 중 공급 전압용 접속부와 연결되고, 상기 PCB 상에 형성되는 제1 패드; 및 상기 접속부 중 접지용 접속부와 연결되고, 상기 PCB 상에 형성되는 제2 패드를 포함하고, 상기 제1 패드 및 상기 제2 패드는, 각각이 스마트 카드 내 포함된 하나 이상의 모듈에 설계된 전원 공급부에 연결될 수 있다.According to an embodiment of the present invention, a power supply IC chip includes: a semiconductor chip including one or more terminals, each of which performs a different function; A contact on a metal lead frame connected to a terminal of the semiconductor chip by wire bonding through a via hole through the PCB; A first pad connected to a supply voltage connection among the connection portions and formed on the PCB; And a second pad formed on the PCB and connected to a ground connection among the connection portions, wherein the first pad and the second pad are each a power supply unit designed in one or more modules included in the smart card. Can be connected.
선택적으로, 모듈은 디스플레이 모듈, BLE를 포함한 통신용 모듈 중 적어도 하나를 포함할 수 있다. 또한 전원 공급용 아이씨 칩은 리더기 또는 충전기에 삽입 시 접촉식 단자를 통해 전원을 공급받고, 상기 제1 패드와 제2 패드를 통해 공급받은 전원을 상기 모듈에 인가할 수 있다. 상기 하나 이상의 단자는 전원 전압(Vcc) 단자, 접지(GND) 단자, 통신용(LA, LB) 단자, 동기화 신호(CLK) 단자, 입출력(I/O) 단자 및 예비(RFU) 단자 중 적어도 하나의 단자를 포함한다.Optionally, the module may include at least one of a display module and a communication module including BLE. In addition, when the IC chip for power supply is inserted into a reader or charger, power is supplied through a contact terminal, and power supplied through the first pad and the second pad can be applied to the module. The one or more terminals are at least one of a power voltage (Vcc) terminal, a ground (GND) terminal, a communication (LA, LB) terminal, a synchronization signal (CLK) terminal, an input/output (I/O) terminal, and a spare (RFU) terminal. Includes terminals.
본 발명의 다른 실시예로서, 전원 공급용 아이씨 칩의 제조 방법은, 각각이 다른 기능을 수행하는 하나 이상의 단자를 포함하는 반도체 칩을 리드 프레임 상에 배치하는 단계; PCB를 관통하는 관통 홀(via hole)을 통해, 와이어 본딩으로 상기 반도체 칩의 단자와 상기 금속 리드 프레임 상의 접속부(contact)를 각각 연결하는 단계; 상기 PCB 상에 배치되고, 상기 접속부 중 공급 전압용 접속부와 연결되는 제1 패드를 형성하는 단계; 및 상기 PCB 상에 배치되고, 상기 접속부 중 접지용 접속부와 연결되는 제2 패드를 형성하는 단계를 포함할 수 있다.In another embodiment of the present invention, a method of manufacturing an IC chip for power supply includes the steps of disposing a semiconductor chip on a lead frame including one or more terminals each performing a different function; Connecting a terminal of the semiconductor chip and a contact on the metal lead frame by wire bonding, respectively, through a via hole through the PCB; Forming a first pad disposed on the PCB and connected to a supply voltage connection part among the connection parts; And forming a second pad disposed on the PCB and connected to a ground connection part among the connection parts.
본 발명에 의하면, 스마트 카드가 추가로 배터리를 구비하지 않더라도, 아이씨 칩에 공급되는 전압을 외부 모듈에 공급 가능하도록 설계함으로써 스마트 카드 제작 비용을 절감하고 효율적인 전원 공급이 가능하면서도 카드화하기 가장 적합하다. According to the present invention, even if the smart card does not have an additional battery, by designing the voltage supplied to the IC chip to be supplied to an external module, it is possible to reduce the cost of manufacturing a smart card and enable efficient power supply, but is most suitable for cardization. .
본 발명의 일 실시예에 따른 아이씨 칩의 전원 공급용 패드 배치를 통해 다른 모듈에 전원을 공급하도록 설계함에 따라, 추가적인 회로 변경과 구성요소의 추가 없이도 안정적인 전원 공급이 가능해지는 효과를 갖는다. 즉, 별도의 인프라 구축없이, 스마트 카드 만으로 전원을 공급받을 수 있어 경제적 효용성이 극대화되는 효과가 있다.According to an embodiment of the present invention, as the power is supplied to another module through the arrangement of the power supply pad of the IC chip, stable power supply is possible without additional circuit changes and additional components. That is, it is possible to receive power only by using a smart card without constructing a separate infrastructure, thereby maximizing economic efficiency.
나아가, 스마트 카드를 충전기(또는 리더기)에 장착하여 이용하는 경우와 같이 지속적으로 전원을 공급받을 수 있는 경우에는 기존 스마트 카드의 전력 공급 시간과 전압의 한계를 극복하여 장시간 전원을 공급받을 수 있어, 스마트 카드에 다양한 기능의 모듈을 탑재할 수 있고, 활용도가 높아지는 이점이 있다.Furthermore, if the power can be continuously supplied, such as when a smart card is mounted on a charger (or a reader), the power supply time and voltage limitation of the existing smart card can be overcome to provide power for a long time. The card can be equipped with modules of various functions, and has the advantage of increasing utilization.
도 1은 기존 스마트 카드의 아이씨 칩의 접점 구조를 도시한 것이다.Figure 1 shows the contact structure of the IC chip of the existing smart card.
도 2는 본 발명의 일 실시예에 의한 아이씨 칩의 사시도를 도시한 것이다.2 is a perspective view of an IC chip according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 의한 전자 카드의 구조를 도시한 것이다.Figure 3 shows the structure of an electronic card according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 아이씨 칩의 접점 구조를 도시한 것이다.4 illustrates a contact structure of an IC chip according to an embodiment of the present invention.
도 5는 본 발명의 일 실시예에 의한 아이씨 칩과 접점 패드의 연결을 설명하기 위한 단면도이다.5 is a cross-sectional view illustrating the connection between the IC chip and the contact pad according to an embodiment of the present invention.
다수의 도면에서 동일한 참조번호는 동일한 구성요소를 가리킨다.The same reference numbers in the multiple drawings indicate the same components.
이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be implemented in various different forms, and thus is not limited to the embodiments described herein. In addition, in order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and like reference numerals are assigned to similar parts throughout the specification.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "indirectly connected" with another member in between. . Also, when a part “includes” a certain component, this means that other components may be further provided instead of excluding other components, unless otherwise stated.
이하 첨부된 도면을 참고하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 일 실시예에 의한 아이씨 칩의 사시도를 도시한 것으로, 아이씨 칩 후면의 접점 구조를 나타낸다. 도 2를 참조하면, 아이씨 칩(110)은 리드 프레임(150)과 반도체 칩(120)을 포함하고, 반도체 칩(120)의 단자들은 와이어 본딩으로 리드 프레임에 형성된 접점들(125)과 연결되어, 접점들(125)이 각각의 기능을 수행하도록 할 수 있다. 리드 프레임(150)은 반도체 칩을 올려 부착하는 금속 기판으로서, 반도체 칩에 전기를 공급하고 이를 지지해 주는 역할을 한다. 이 때, 접점들(125) 일부가 외부 모듈과 연결되도록 하기 위해 추가로 금속 패드(130, 140)를 만들어 이용할 수 있다.Figure 2 shows a perspective view of an IC chip according to an embodiment of the present invention, showing the contact structure of the back of the IC chip. Referring to FIG. 2, the IC chip 110 includes a lead frame 150 and a semiconductor chip 120, and terminals of the semiconductor chip 120 are connected to the contacts 125 formed in the lead frame by wire bonding. , It is possible to make the contacts 125 perform each function. The lead frame 150 is a metal substrate on which a semiconductor chip is mounted and attached, and serves to supply electricity to and support the semiconductor chip. At this time, the metal pads 130 and 140 may be additionally made and used so that some of the contacts 125 are connected to the external module.
일 실시예로서, 본 발명의 일 실시예에 의한 아이씨 칩은 반도체 칩(120)을 리드 프레임(150)에 연결하도록 설계하되, 안테나와 연결되어 통신용 단자로 사용되는 기존의 패드(130, 140) 외에, 추가로 패드(210, 230)를 제작하여 전원 공급용 패드를 설계하였다. 일 실시예로서, 전원 공급용 패드는 Vcc 단자와 연결되는 제1 패드(210) 및 접지(GND, 그라운드) 단자와 연결되는 제2 패드(230)을 포함한다. 제1 패드(210)는 Vcc 단자와 연결되고, 제2 패드(230)는 접지 단자와 연결된다. COB 패드 형태의 아이씨 칩(110)을 스마트 카드에 장착 시, 제1 패드(210)와 제2 패드(230)를 다른 모듈의 전원 공급 단자와 연결하여, 전원 전압이 공급되도록 이용할 수 있다.As an embodiment, the IC chip according to an embodiment of the present invention is designed to connect the semiconductor chip 120 to the lead frame 150, but is connected to an antenna and used as a communication terminal, existing pads 130 and 140 In addition, pads 210 and 230 were additionally manufactured to design pads for power supply. In one embodiment, the power supply pad includes a first pad 210 connected to a Vcc terminal and a second pad 230 connected to a ground (GND, ground) terminal. The first pad 210 is connected to the Vcc terminal, and the second pad 230 is connected to the ground terminal. When the COB pad type IC chip 110 is mounted on the smart card, the first pad 210 and the second pad 230 may be connected to the power supply terminals of other modules to supply power voltage.
이러한 설계를 통해, 스마트 카드가 추가로 배터리를 구비하지 않더라도, 아이씨 칩에 공급되는 전압을 외부 모듈에 공급 가능하도록 설계함으로써 스마트 카드 제작 비용을 절감하고 효율적인 전원 공급이 가능하다. 일 실시예로서, 본 발명의 일 실시예에 의한 스마트 카드는 하이패스 카드와 같이 접촉식 단말기에 삽입하여 사용하는 경우 지속적으로 전원을 받을 수 있어, 본 발명의 일 실시예에 의한 아이씨 칩 접점 구조를 통해 스마트 카드 내 다른 모듈에 전원을 공급하는 것이 가능해진다. 이러한 전원 공급 방법에 따라, 스마트 카드 내 디스플레이모듈, 통신 모듈 등 다양한 모듈에 효율적인 전원 공급이 가능해진다. 또한 별도의 인프라 구축없이, 스마트 카드 만으로 전원을 공급받을 수 있어 경제적 효용성이 극대화되는 효과가 있다.Through such a design, even if the smart card does not have an additional battery, the voltage supplied to the IC chip can be designed to be supplied to an external module, thereby reducing the cost of manufacturing the smart card and enabling efficient power supply. As an embodiment, the smart card according to an embodiment of the present invention can continuously receive power when used by inserting it into a contact terminal such as a high-pass card, and the IC chip contact structure according to an embodiment of the present invention Through it, it becomes possible to supply power to other modules in the smart card. According to this power supply method, it is possible to efficiently supply power to various modules such as a display module and a communication module in a smart card. In addition, there is an effect of maximizing economic efficiency since power can be supplied only with a smart card without constructing an additional infrastructure.
도 3은 본 발명의 일 실시예에 의한 전자 카드의 구조를 도시한 것이다. 스마트 카드(300)는 아이씨 칩(200), LED 모듈(310), BLE 모듈(320)을 포함한다. 이는 일 실시예를 도시한 것으로, 스마트 카드(300)의 구성은 이에 한정되지 않으며, 스마트 카드의 동작에 필요한 프로세서, 메모리 등 추가 구성요소를 더 포함할 수 있다.Figure 3 shows the structure of an electronic card according to an embodiment of the present invention. The smart card 300 includes an IC chip 200, an LED module 310, and a BLE module 320. This illustrates an embodiment, and the configuration of the smart card 300 is not limited to this, and may further include additional components such as a processor and memory required for the operation of the smart card.
본 발명의 일 실시예에 의한 스마트 카드(300)는, 사용자에게 상태 디스플레이를 위한 LED 모듈(310)을 포함할 수 있다. 예컨대, LED 모듈(310)은 동작 시 파란불, 오동작 시나 전원 공급이 안되는 경우 빨간불이 들어오도록 구현될 수 있다. BLE 모듈(320)은 스마트 카드(300)가 BLE(Blue Low Energy)를 지원하는 블루투스 통신 모듈의 일종으로, 스마트 카드(300)는 사용자가 휴대하는 스마트 폰 또는 웨어러블 기기 등의 전자 모듈과 BLE 통신을 통해 연결될 수 있다. 상기 LED 모듈(310) 및 BLE 모듈(320)은 예시적인 것으로서, 본 발명의 일 실시예에 의한 스마트 카드(300)는 이외에도 다양한 모듈이 장착될 수 있다.The smart card 300 according to an embodiment of the present invention may include an LED module 310 for displaying a status to a user. For example, the LED module 310 may be implemented to turn on a blue light when operating, or a red light when malfunctioning or when power is not supplied. The BLE module 320 is a type of Bluetooth communication module in which the smart card 300 supports Blue Low Energy (BLE), and the smart card 300 is capable of BLE communication with an electronic module such as a smart phone or wearable device carried by the user. Can be connected through. The LED module 310 and the BLE module 320 are exemplary, and various modules may be mounted in addition to the smart card 300 according to an embodiment of the present invention.
일 실시예로서, LED 모듈(310)과 BLE 모듈(320)은 아이씨 칩(200)으로부터 전원을 공급받을 수 있다. LED 모듈(310)과 BLE 모듈(320)의 전원 공급 단자는 아이씨 칩(200)의 제1 패드(210), 제2 패드(230)에 연결될 수 있다. 상술한 것처럼, 제1 패드(210)는 전원 공급 단자(Vcc)와 연결되어 공급 전압을 제공하고, 제2 패드(230)는 접지 단자의 역할을 하여, 각각의 모듈(310, 320)에 전원을 공급할 수 있다. As an embodiment, the LED module 310 and the BLE module 320 may be supplied with power from the IC chip 200. The power supply terminals of the LED module 310 and the BLE module 320 may be connected to the first pad 210 and the second pad 230 of the IC chip 200. As described above, the first pad 210 is connected to the power supply terminal (Vcc) to provide a supply voltage, and the second pad 230 serves as a ground terminal, thereby powering each module (310, 320). Can supply.
일 실시예로서, 아이씨 칩(200)는 접촉식 또는 비접촉식으로 전원을 공급받을 수 있다. 스마트 카드(300)는 접촉식 단자(130)를 통해 전원을 공급받을 수 있는 전자 기기(예컨대, 하이패스 단말기)에 연결되어, 접속된 동안 전원 전압을 공급받을 수 있다. 다른 예로, 스마트 카드(300)는 결제 또는 출입을 위해 안테나(330)를 통한 비접촉식 통신을 활성화하는 경우 아이씨 칩(200)이 전압을 전달받고, 이를 내부 모듈(310, 320)에 공급할 수 있다. 이처럼, 아이씨 칩(200)이 접촉식 또는 비접촉식 통신으로 전달받은 전압을 활용하여 다른 모듈에 공급하여, 추가적인 전원 공급 장치 없이도 스마트 카드(300)의 효율적으로 운용할 수 있다.In one embodiment, the IC chip 200 may be supplied with power in a contact or non-contact manner. The smart card 300 is connected to an electronic device (for example, a high-pass terminal) capable of receiving power through the contact terminal 130, so that the power voltage can be supplied while connected. As another example, when the smart card 300 activates contactless communication through the antenna 330 for payment or access, the IC chip 200 may receive a voltage and supply it to the internal modules 310 and 320. As such, the IC chip 200 may supply the voltage to the other module using the voltage received through the contact or contactless communication, thereby efficiently operating the smart card 300 without an additional power supply.
도 4는 본 발명의 일 실시예에 따른 아이씨 칩(200)의 세부 접점 구조를 도시한 것이다. 아이씨 칩(200)은 8개의 접점 구조를 가질 수 있다. 각각의 접점은 아이씨 칩 구동에 필요한 공급 전원(Vcc) 기능을 수행하는 Vcc 접점(410), 접지 참조 전압(GND; Ground) 기능을 수행하는 GND 접점(420), 재설정 신호(RST; Reset)를 인가하는 RST 접점(450), 비접촉식 통신에 이용되어 안테나에 연결되는 LA 접점(430) LB 접점(440), 클럭 신호(CLK; Clock)를 인가하는 CLK 접점(470), 데이터 입력/출력을 위한 접점인 I/O 접점(460)을 포함한다.4 illustrates a detailed contact structure of the IC chip 200 according to an embodiment of the present invention. The IC chip 200 may have eight contact structures. Each contact includes a Vcc contact 410 that performs a power supply (Vcc) function required for driving the IC chip, a GND contact 420 that performs a ground reference voltage (GND) function, and a reset signal (RST) reset. RST contact 450 for applying, LA contact 430 used for contactless communication and connected to an antenna LB contact 440, CLK contact 470 for applying a clock signal (CLK), for data input/output It includes an I/O contact 460 which is a contact.
일 실시예로서, 아이씨 칩(200)은 안테나 단자에 대해 연결하기 위해 반도체 칩(250) 좌우에 배치된 통신용 접점 패드(220, 240)를 포함할 수 있다. 통신용 접점 패드(220, 240)에는 안테나가 연결될 수 있다. 이는 기존의 아이씨 칩(200)에서 이용되는 일반적인 구조이다. 반도체 칩(250) 주변에 형성된 작은 원들(415, 425, 455, 465, 475)은 금속 리드 프레임 상의 접속부로서, 전면 접촉부에 형성된 비아홀(via hole)로 와이어 본딩을 통해 반도체 칩(250)의 단자들과 연결된다. 점선으로 표시된 와이어는 접점 패드(240)의 LA 단자(431), 접점 패드(220)의 LB 단자(441)와 각각 연결되어 통신용 단자로 활용될 수 있다. 그 외 단자들은 비아 홀에 각각 본딩되어 Vcc, GND, RST, I/O, CLK 단자로 활용될 수 있다.As an embodiment, the IC chip 200 may include communication contact pads 220 and 240 disposed on the left and right sides of the semiconductor chip 250 to connect to the antenna terminal. An antenna may be connected to the communication contact pads 220 and 240. This is a general structure used in the existing IC chip 200. The small circles 415, 425, 455, 465, and 475 formed around the semiconductor chip 250 are connections on the metal lead frame, and are via holes formed in the front contact portion, and are connected to the via hole through the wire bonding to the terminals of the semiconductor chip 250. Connect with the field. The wire indicated by the dotted line may be connected to the LA terminal 431 of the contact pad 240 and the LB terminal 441 of the contact pad 220 to be used as a communication terminal. Other terminals can be bonded to via holes, respectively, and used as Vcc, GND, RST, I/O, and CLK terminals.
도 4에 도시된 바와 같이, 반도체 칩(250)의 Vcc 단자는 공급 전압용 접속부(415)와 와이어 본딩을 통해 연결될 수 있고, 공급 전압용 접속부(415)는 와이어 본딩을 통해 제1 패드(210)의 단자(211)와 연결될 수 있다. 반도체 칩(250)의 GND 단자는 와이어 본딩을 통해 접지용 접속부(425)에 연결될 수 있고, 접지용 접속부(425)는 와이어 본딩을 통해 제2 패드(230)의 단자(231)와 연결될 수 있다. 반도체 칩(250)의 RST 단자는 와이어 본딩을 통해 RST 접속부(455)에 연결될 수 있고, 반도체 칩(250)의 I/O 단자는 와이어 본딩을 통해 I/O 접속부(465)에 연결될 수 있으며, 반도체 칩(250)의 CLK 단자는 와이어 본딩을 통해 CLK 접속부(475)에 연결될 수 있다.As illustrated in FIG. 4, the Vcc terminal of the semiconductor chip 250 may be connected to the supply voltage connection 415 through wire bonding, and the supply voltage connection 415 may be connected to the first pad 210 through wire bonding. ) May be connected to the terminal 211. The GND terminal of the semiconductor chip 250 may be connected to the ground connection portion 425 through wire bonding, and the ground connection portion 425 may be connected to the terminal 231 of the second pad 230 through wire bonding. . The RST terminal of the semiconductor chip 250 may be connected to the RST connection 455 through wire bonding, and the I/O terminal of the semiconductor chip 250 may be connected to the I/O connection 465 through wire bonding, The CLK terminal of the semiconductor chip 250 may be connected to the CLK connection 475 through wire bonding.
일 실시예로서, 본 발명에 의한 아이씨 칩(200)은 스마트 카드 내 다른 모듈에 전원을 공급하기 위해 추가 패드(210, 230)를 더 구비할 수 있다. 제1 패드(210)는 공급전원인 Vcc 접점(410)과 연결되어 공급 전압의 전위를 갖고, 제2 패드(230)는 GND 접점(420)과 연결되어 접지 역할을 할 수 있다. 본 도면에서는 반도체 칩(250)의 상하부에 패드들(210, 230)을 배치하였으나 이는 예시에 불과하며, 다른 위치에 배치되거나, 둘 이상의 패드가 배치되도록 설계할 수 있다. As an embodiment, the IC chip 200 according to the present invention may further include additional pads 210 and 230 to supply power to other modules in the smart card. The first pad 210 is connected to the Vcc contact 410 as a supply power to have a potential of a supply voltage, and the second pad 230 is connected to the GND contact 420 to serve as a ground. Although the pads 210 and 230 are disposed on the upper and lower portions of the semiconductor chip 250 in this drawing, this is only an example, and may be designed to be disposed at different locations or to have two or more pads.
전원 공급을 위해 배치되는 제1 패드(210)와 제2 패드(230)는 와이어 본딩을 통해 반도체 칩(250)과 연결된다. 도 5는 본 발명의 일 실시예에 의한 아이씨 칩과 접점 패드의 연결을 설명하기 위한 단면도이다. 도 5의 (a)를 참조하면, 메탈 리드 프레임(510)과 PCB(520)로 형성된 플레이트에 관통 홀(530, 540)을 형성하여, 반도체 칩(250)의 단자와 메탈 리드 프레임(510)의 전면부 각 영역을 연결하는 방식을 취해왔다. The first pad 210 and the second pad 230 disposed for power supply are connected to the semiconductor chip 250 through wire bonding. 5 is a cross-sectional view illustrating the connection between the IC chip and the contact pad according to an embodiment of the present invention. Referring to (a) of FIG. 5, through holes 530 and 540 are formed in a plate formed of a metal lead frame 510 and a PCB 520 to form a metal lead frame 510 and a terminal of the semiconductor chip 250. It has taken a method of connecting each area of the front part of the.
본 발명의 일 실시예에 의하면, 도 5의 (b)에 도시된 것처럼, 반도체 칩(250)의 Vcc 단자와 접지(GND) 단자를 제1 패드(210)와 제2 패드(230)에 각각 연결할 수 있다. 즉, 반도체 칩(250)의 Vcc 단자에서 금속 리드 프레임(510)의 공급 전압용 접속부(415)로 와이어 본딩(W1)을 통해 연결되고, Vcc 단자와 연결된 금속 리드 프레임(510)의 공급 전압용 접속부(415)가 와이어 본딩(W2)을 통해 제1 패드(210)와 연결된다. 이처럼, 전면부 본딩과 후면부 본딩 방식을 혼용함으로써, Vcc 단자를 확장하여 이용할 수 있다. 마찬가지로, 반도체 칩(250)의 접지 단자와 금속 리드 프레임(510)의 접지용 접속부(425)가 와이어 본딩(W3)을 통해 연결되고, 접지 단자와 연결된 금속 리드 프레임(510)의 접지용 접속부(425)가 와이어 본딩(W4)을 통해 제2 패드(230)와 연결되어, 제2 패드(230)가 접지 역할을 수행할 수 있도록 구현된다.According to an embodiment of the present invention, as illustrated in FIG. 5B, the Vcc terminal and the ground (GND) terminal of the semiconductor chip 250 are respectively connected to the first pad 210 and the second pad 230. I can connect. That is, the supply voltage of the metal lead frame 510 connected from the Vcc terminal of the semiconductor chip 250 through the wire bonding W1 to the connection portion 415 for the supply voltage of the metal lead frame 510 and connected to the Vcc terminal. The connection part 415 is connected to the first pad 210 through wire bonding W2. As described above, the Vcc terminal can be expanded and used by mixing the front side bonding and the back side bonding. Likewise, the ground terminal of the semiconductor chip 250 and the ground connection portion 425 of the metal lead frame 510 are connected through a wire bonding W3, and the ground connection portion of the metal lead frame 510 connected to the ground terminal ( 425) is connected to the second pad 230 through wire bonding (W4), so that the second pad 230 is implemented to perform a grounding role.
이렇게 연결된 제1 패드(210)와 제2 패드(230)는 전원 공급을 위한 접점 역할을 하여, 스마트 카드 내 다른 모듈에 패드(210, 230)를 연결 시 공급 전압을 제공할 수 있다. 상술한 것처럼, 전원 공급을 위한 패드는 2개에 한정되지 않고, 둘 이상으로 배열되어 확장될 수 있고, 아이씨 칩이 공급받은 전압을 다른 모듈에 전달하여 전원 공급 장치로서의 역할을 수행하도록 한다.The first pad 210 and the second pad 230 connected as described above may serve as a contact point for supplying power, and provide a supply voltage when the pads 210 and 230 are connected to other modules in the smart card. As described above, the pads for supplying power are not limited to two, but can be arranged and extended in two or more, and transmits the voltage supplied by the IC chip to another module to serve as a power supply.
도 2 내지 5를 참조하여 설명한 본 발명의 실시예들에 의하면, 아이씨 칩의 전원 공급용 패드 배치를 통해 다른 모듈에 전원을 공급하도록 설계함에 따라, 추가적인 회로 변경과 구성요소의 추가 없이도 안정적인 전원 공급이 가능해지는 효과를 갖는다. 특히, 스마트 카드를 충전기(또는 리더기)에 장착하여 이용하는 경우와 같이 지속적으로 전원을 공급받을 수 있는 경우에는 기존 스마트 카드의 전력 공급 시간과 전압의 한계를 극복하여 장시간 전원을 공급받을 수 있어, 스마트 카드에 다양한 기능의 모듈을 탑재할 수 있고, 활용도가 높아지는 이점이 있다.According to embodiments of the present invention described with reference to FIGS. 2 to 5, as the power is supplied to other modules through the arrangement of power supply pads of the IC chip, stable power supply without additional circuit changes and additional components It has the effect of becoming possible. In particular, if the power can be continuously supplied, such as when a smart card is mounted on a charger (or a reader), the power supply time and voltage limitation of the existing smart card can be overcome to provide power for a long time. The card can be equipped with modules of various functions, and has the advantage of increasing utilization.
전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The above description of the present invention is for illustration only, and a person having ordinary knowledge in the technical field to which the present invention pertains can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.
본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted to be included in the scope of the present invention.

Claims (9)

  1. 각각이 다른 기능을 수행하는 하나 이상의 단자를 포함하는 반도체 칩;A semiconductor chip including one or more terminals, each of which performs a different function;
    PCB를 관통하는 관통 홀(via hole)을 통해, 와이어 본딩으로 상기 반도체 칩의 단자와 연결되는 금속 리드 프레임 상의 접속부(contact);A contact on a metal lead frame connected to a terminal of the semiconductor chip by wire bonding through a via hole through the PCB;
    상기 접속부 중 공급 전압용 접속부와 연결되고, 상기 PCB 상에 형성되는 제1 패드; 및A first pad connected to a supply voltage connection among the connection portions and formed on the PCB; And
    상기 접속부 중 접지용 접속부와 연결되고, 상기 PCB 상에 형성되는 제2 패드를 포함하고,Among the connection portion is connected to the ground connection portion, and includes a second pad formed on the PCB,
    상기 제1 패드 및 상기 제2 패드는, 각각이 스마트 카드 내 포함된 하나 이상의 모듈에 설계된 전원 공급부에 연결되는 것을 특징으로 하는 전원 공급용 아이씨 칩.The first pad and the second pad, the power supply IC chip, characterized in that each connected to a power supply designed in one or more modules included in the smart card.
  2. 제 1 항에 있어서,According to claim 1,
    상기 모듈은 디스플레이 모듈, BLE를 포함한 통신용 모듈 중 적어도 하나를 포함하는 전원 공급용 아이씨 칩.The module is a power supply IC chip comprising at least one of a display module, a communication module including BLE.
  3. 제 1 항에 있어서,According to claim 1,
    상기 전원 공급용 아이씨 칩은 리더기 또는 충전기에 삽입 시 접촉식 단자를 통해 전원을 공급받고, 상기 제1 패드와 제2 패드를 통해 공급받은 전원을 상기 모듈에 인가하는 것을 특징으로 하는 전원 공급용 아이씨 칩.When the IC chip for supplying power is inserted into a reader or charger, power is supplied through the contact terminal, and power supplied through the first pad and the second pad is applied to the module. chip.
  4. 제 1 항에 있어서,According to claim 1,
    상기 하나 이상의 단자는 전원 전압(Vcc) 단자, 접지(GND) 단자, 통신용(LA, LB) 단자, 동기화 신호(CLK) 단자, 입출력(I/O) 단자 및 예비(RFU) 단자 중 적어도 하나의 단자를 포함하는 전원 공급용 아이씨 칩.The one or more terminals are at least one of a power voltage (Vcc) terminal, a ground (GND) terminal, a communication (LA, LB) terminal, a synchronization signal (CLK) terminal, an input/output (I/O) terminal, and a spare (RFU) terminal. IC chip for power supply including a terminal.
  5. 전원 공급용 아이씨 칩의 제조 방법으로서,As a method of manufacturing an IC chip for power supply,
    각각이 다른 기능을 수행하는 하나 이상의 단자를 포함하는 반도체 칩을 금속 리드 프레임 상에 배치하는 단계;Placing a semiconductor chip including one or more terminals, each of which performs a different function, on the metal lead frame;
    PCB를 관통하는 관통 홀(via hole)을 통해, 와이어 본딩으로 상기 반도체 칩의 단자와 상기 금속 리드 프레임 상의 접속부(contact)를 각각 연결하는 단계;Connecting a terminal of the semiconductor chip and a contact on the metal lead frame by wire bonding, respectively, through a via hole through the PCB;
    상기 PCB 상에 배치되고, 상기 접속부 중 공급 전압용 접속부와 연결되는 제1 패드를 형성하는 단계; 및Forming a first pad disposed on the PCB and connected to a supply voltage connection part among the connection parts; And
    상기 PCB 상에 배치되고, 상기 접속부 중 접지용 접속부와 연결되는 제2 패드를 형성하는 단계를 포함하는 제조 방법.And forming a second pad disposed on the PCB and connected to a ground connection part among the connection parts.
  6. 제 5 항에 있어서,The method of claim 5,
    상기 제1 패드 및 상기 제2 패드를 스마트 카드 내 포함된 하나 이상의 모듈에 대하여, 각 모듈의 전원 공급부에 연결하는 단계를 더 포함하는 제조 방법.The first pad and the second pad for one or more modules included in the smart card, further comprising the step of connecting to the power supply of each module.
  7. 제 6 항에 있어서,The method of claim 6,
    상기 모듈은 디스플레이 모듈, BLE를 포함한 통신용 모듈 중 적어도 하나를 포함하는 제조 방법.The module is a manufacturing method comprising at least one of a display module, a communication module including BLE.
  8. 제 6 항에 있어서,The method of claim 6,
    상기 전원 공급용 아이씨 칩은 리더기 또는 충전기에 삽입 시 접촉식 단자를 통해 전원을 공급받고, 상기 제1 패드와 제2 패드를 통해 공급받은 전원을 상기 모듈에 인가하는 것을 특징으로 하는 제조 방법.When the IC chip for supplying power is inserted into a reader or charger, power is supplied through a contact terminal, and power is supplied through the first pad and the second pad to the module.
  9. 제 5 항에 있어서,The method of claim 5,
    상기 하나 이상의 단자는 전원 전압(Vcc) 단자, 접지(GND) 단자, 통신용(LA, LB) 단자, 동기화 신호(CLK) 단자, 입출력(I/O) 단자 및 예비(RFU) 단자 중 적어도 하나의 단자를 포함하는 제조 방법.The one or more terminals are at least one of a power voltage (Vcc) terminal, a ground (GND) terminal, a communication (LA, LB) terminal, a synchronization signal (CLK) terminal, an input/output (I/O) terminal, and a spare (RFU) terminal. A manufacturing method comprising a terminal.
PCT/KR2019/016915 2018-12-07 2019-12-03 Ic chip for power supply and method for manufacturing same WO2020116891A1 (en)

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