TW200945680A - Socket and semiconductor device - Google Patents

Socket and semiconductor device Download PDF

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Publication number
TW200945680A
TW200945680A TW098101084A TW98101084A TW200945680A TW 200945680 A TW200945680 A TW 200945680A TW 098101084 A TW098101084 A TW 098101084A TW 98101084 A TW98101084 A TW 98101084A TW 200945680 A TW200945680 A TW 200945680A
Authority
TW
Taiwan
Prior art keywords
socket
card
terminal
sim
terminals
Prior art date
Application number
TW098101084A
Other languages
Chinese (zh)
Inventor
Hirotaka Nishizawa
Tamaki Wada
Hironori Iwasaki
Hideo Koike
Minoru Shinohara
Original Assignee
Renesas Tech Corp
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Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200945680A publication Critical patent/TW200945680A/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
    • G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07741—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A socket has a card slot (107) into which a feature expansion card (101) is inserted. The feature expansion card (101) is inserted along the longitudinal direction of an SIM card outline socket (106). The SIM card outline socket (106) has an LGA package (109) containing a semiconductor chip. The LGA package (109) is mounted on a principal surface of the SIM card outline socket (106). An ISO terminal (112) is disposed on a rear surface opposite to the principal surface of the SIM card outline socket (106) so as to overlap with the feature expansion card (101). Card terminals are provided on a principal surface at both sides of the feature expansion card (101). Socket terminals (108) are provided at both sides of the card slot (107) into which the feature expansion card (101) is inserted, and the socket terminal (108) has a structure in which the card terminal (104) is vertically caught therein. Thus, the feature expansion card (101) is prevented from being deformed when inserted into the SIM card outline socket (106), and reduction in thickness can be realized.

Description

200945680 六、發明說明： 【發明所屬之技術領域】 本發明係關於插座、及於該插座插入卡片所構成之半導 體裝置；特別關於藉由與SIM卡具有相容性之插座、及於 . 該插座所插入並含有與插座電性地連接之半導體晶片之卡 片來構成半導體裝置。 【先前技術】 # 一種 1C 卡稱為 SIM 卡（Subscriber Identity Module Card: 用戶識別模組卡）。SIM卡係插進行動電話機、記錄有使用 於識別利用者之合約者資訊之1C卡。即使為不同方式之電 話機’藉由改插共通之1C卡而使用，可原樣承襲電話號碼 或收費資訊而使用，作為GSM卡係於GSM行動電話機實 現。SIM卡之外形尺寸係使用15 mmx25 mmx〇 76 mm之 ID-000格式。亦即，俯視尺寸為15 mmx25 mm，厚度為 0.76 mm程度。於表面排列有由IS〇/IEC7816_3之端子位置 φ 及功能規格所決定之外部介面端子（以下僅稱為「ISO端 子」）。 作為本發明者所檢討之技術，例如插座及卡片可思慮如 - 專利文獻1之技術。專利文獻1係關於記憶卡用接器 - (adaptor)及記憶卡。於專利文獻1揭示有一種記憶卡用接 器，其係進行大小轉換，以便可將大小較小之記憶卡作為 多媒體卡來使用；其記憶卡插入部係由蓋體覆蓋。 此外，本申請人係根據所發明之結果，分別以藉由卡端 子為u字狀之插座端子從上下爽住之結構、於卡兩端配置 137653.doc 200945680 有插座端子之構造 ’擷取到專利文獻 有卡端子之構造、為了減低厚度而露出 之觀點，進行先前技術調查。其結果 2〜6 〇 專利文獻2係於5己憶卡兩端分別含有複數端子，並對控 制卡插人之結構；其雖揭示用於各種規格之卡片之泛用 卡’但未揭Wfitk詳細結構（料 :系揭示於卡用連接器插入含有階差部之卡片時，丄順 著框體之導引#移動之結構，其成為卡兩端部被予以保持 之機構。專利文獻5係表示於插入記憶卡之連接器，卡連 接器為U字狀構造之—例。專利文獻6係於印刷基板之終端 端子插入處，揭示U字狀之端子，其表示ϋ字狀端子之一 例。 [專利文獻1]日本特開2006_236261號公報 [專利文獻2]曰本特表2006_506709號公報 [專利文獻3]日本特開2006-156109號公報 [專利文獻4]日本特開2006-147301號公報 [專利文獻5]曰本特開2002-3 19000號公報 [專利文獻6]日本特開平π-149967號公報 【發明内容】 [發明所欲解決之問題] 然而’關於如前述之插座及卡片之技術，本發明者經檢 討之結果，闡明如以下之事項。 曾考慮例如藉由於製成SIM卡等之規格卡之外形尺寸之 插座，追加新記憶體功能，插入可擴充之卡片（以下僅稱 137653.doc 200945680 為「記憶體擴充卡」）’以將插座與記憶體擴充卡予以一 體化。之後稱一體化之裝置為半導體裝置。 然而，於插座插入記憶體擴充卡時，因接點端子之斥 力，於規格卡發生膨脹，規格卡之總厚在規格外而需要其 - 防止策略。 * 因此，雖嘗試加上如專利文獻1之蓋體來抑制膨脹，但 發現對於薄型化會有未能發揮充分功能之情況。此係原因 〇 為片簧上之插座端子設置於卡插槽之下部，卡片由該插座 端子往上方推升。 因此，本發明之目的在於提供一種於插座及卡片防止將 卡片插入插座時之變形，適於插座薄型化之技術。 另一方面，藉由於插座插入外形尺寸小於插座之卡片， 可追加、擴充記憶體功能。 然而，若可追加、擴充記憶體功能以外之功能，可進一 步有效使用半導體裝置。 ® “因此’其他之發明目的係在於提供-種於插座及卡片， 藉由將卡片插入插座而可於當初功能追加、擴充新功能之 技術。 此外忒等技術（變形防止技術及功能追加技術）僅提供 兩者之彳或予以組合均可。本發明之前述以及其他目的 ”新特徵將從本說明書之記述及附圖來閣明。 [解決問題之技術手段] 簡單說明本申請·牵中所# + + & Τ π茶T所揭不之許多實施例中之代表之概 137653.doc 200945680 亦卩按澴代表實施例之插座係於主面，含有外形尺寸 T於该插座之卡片所插入之區域（卡用插槽）；於該區域沿 著卡片之插入方向，複數插座端子排列於兩侧；該插座端 子a又置為夾著插入之卡片之緣部；於插座之背面含有可與 外部裝置連接之外部連接端子；該外部連接端子係與前述 插座端子連接。 進一步而言，按照其他實施例之插座與卡片一體化之半 導體裝置含有·插座’其含有：複數外部連接端子，其係 用以與外部裝置連接；微電腦晶片，其係藉由與該外部連 接端子收發信絲進行第1#料處理；及複數插座端子， 其係可發送來自前述微電腦晶片之信號或向前述微電腦晶 片接收信號；複數卡端子，其係連接於前述複數插座端 子；及卡片，其係含有藉由經前述複數卡端子，與前述微 電腦晶片&發信號，來進行第2資料處理之半導體晶片， 外开> 尺寸比前述插座小而插入前述插座。 【實施方式】 [發明之效果] 若簡單說明本中請案中所揭示之許多實施例中，藉由上 述代表實施例所獲得之效果，則可於插座及卡片防止將卡 片插入插座時之變形。而且，藉由甘μ & 稽田其他實施例所獲得之效 果係於插座及卡片，藉由將外形尺+ 〜&寸小於插座之卡片插入 插座’可於僅限於插座之當初功 田〜刀此，容易追加、擴充新功 能。 以下，根據圖式來詳細說明本路ΒΒ >生 赞明之實施型態。此外， 137653.doc 200945680 於用以說明實施型態之所有圖中，原則上同一構件係附上 同一符號，並省略其重複說明。 (實施型態1) 圖1係於按照本發明之實施型態1之插座及卡片，表示其 結構之圖；（a)係表示功能擴充卡，（b)係表示SIM卡外形插 座，（c)係表示功能擴充卡已插入SIM卡外形插座之狀態之 A-A剖面圖。於此，功能擴充卡係外形尺寸小於插座、可 於插座追加新功能之卡片。此外，關於功能擴充卡之具體 内容係於後面敘述。 SIM卡外形插座106之外形尺寸係例如與SIM卡相同，依 據 ETSI TS 102 221 V4. 4.0 (2001-10)之插入式 UICC (Universal Integrated Circuit Card:通用積體電路卡）之規 格而為15 mmx25 mmx0.76 mm。亦即，俯視尺寸為15 mm X 25 mm，厚度為0.76 mm程度。關於厚度容許在0:76 mm士0.08 mm之範圍，可為0.84 mm以下之厚度。 一般於SIM卡，IS07816介面端子配置有C1〜C8之8個端 子，IS07 816端子之分配係C1為VCC(+電源），C2為RES(重 設），C3為 CLK(時鐘），C4、C6、C8 為 RSV(保留），C5為 VSS(接地），C7為1/0(輸出入）。於此，保留端子可作為 USB介面之實現、MMC、串列介面之實現、或非接觸（無 接觸卡）功能之實現等之擴充端子來使用。此外，於圖1等 所示之本發明之SIM卡外形插座106亦設置有同樣端子。 SIM卡外形插座106係經由依據ISO/IEC7816-3之規格之 1807816介面端子（：1〜€8而具有18078161/卩，可與外部機器 137653.doc 200945680 連接。 於SIM卡外形插座106内，搭載有$全微電腦晶片或快 閃記憶體控制器等半導體晶片、或電容·電阻.線圈等被 動兀件或主動TL件等晶片零件。此外，安全微電腦晶片或 快閃記憶體控制器等|導體晶片為1晶片《複數晶片均 可。而且，該等半導體晶片或晶片零件係藉由密封樹脂來 密封，以確保其形狀及強度。安全微電腦晶片或快閃記憶 體控制^未必具有安全微電腦魏m兄僅為通訊協 疋轉換用之控制器亦可。而且，於功能擴充卡ιοί搭載安 王1C功此之情況亦可為無控制器之僅布線連接轉換之情 況。亦即，意味其為端子轉換接器。 如圖1(a)所示，功能擴充卡1〇1之俯視形狀大致為長方 形，厚度方向之剖面形狀為凸狀。沿著插入方向之2邊所 設之部分，於此作為緣部1〇2。若採其他表現緣部1〇2係 較其2邊之間之中心線接近各個邊之部分。進一步而言， 功能擴充卡101係由該緣部1〇2及中央部分1〇3所組成，緣 02之厚度薄於中央部分丨〇3。藉由使緣部】们之厚度薄 於中央部分103，可容易對插座插入。此外，於此，緣部 102之厚度雖薄於中央部分103，但依緣部1〇2之構造，相 5予度亦可。而且，於緣部1 02之兩面，沿著插入方向設 置有複數卡端子104。於圖中雖無法看到，但於緣部102之 背面側亦與正面側同樣設置有複數卡端子1〇4，於正面及 背面位於相同位置之卡端子1〇4係分別電性地連接。而 且於緣部1〇2，設置有功能擴充卡ι〇1插入SIM卡外形插 137653.doc 200945680 功能擴充 之尺寸為 座106時用以固定之凹口 1〇5。此外，作為—例 卡1〇1之尺寸為14.5 mmxl2 mm，中央部分1〇3 14.5 mmx9 mm。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket, and a semiconductor device formed by inserting a card into the socket; in particular, a socket that is compatible with a SIM card, and the socket. A card inserted into and containing a semiconductor wafer electrically connected to the socket constitutes a semiconductor device. [Prior Art] # A 1C card is called a SIM card (Subscriber Identity Module Card). The SIM card is inserted into the mobile phone, and the 1C card for identifying the contractor information of the user is recorded. Even if a different type of telephone is used by re-plugging a common 1C card, it can be used as it is for a telephone number or charging information, and is implemented as a GSM card in a GSM mobile phone. The external dimensions of the SIM card are in the ID-000 format of 15 mmx25 mmx〇 76 mm. That is, the top view is 15 mm x 25 mm and the thickness is 0.76 mm. External interface terminals (hereinafter simply referred to as "ISO terminals") determined by the terminal position φ of IS〇/IEC7816_3 and the functional specifications are arranged on the surface. As a technique reviewed by the present inventors, for example, a socket and a card can be considered as the technique of Patent Document 1. Patent Document 1 relates to a memory card connector - (adaptor) and a memory card. Patent Document 1 discloses a connector for a memory card which is size-converted so that a memory card having a small size can be used as a multimedia card; and the memory card insertion portion is covered by the cover. In addition, according to the result of the invention, the applicant has respectively adopted the structure of the socket terminal which is u-shaped by the card terminal from the upper and lower sides, and the configuration of the socket terminal at the two ends of the card 137653.doc 200945680 The patent document has a structure of a card terminal and a viewpoint of being exposed to reduce the thickness, and a prior art investigation is performed. The result is 2 to 6 〇 Patent Document 2 is a structure in which a plurality of terminals are respectively included at both ends of the 5 card and the control card is inserted; although it discloses a general-purpose card for cards of various specifications 'but the Wfitk is not disclosed in detail. Structure (Material: It is disclosed that when the card connector is inserted into the card containing the step portion, the structure that moves along the guide # of the frame becomes the mechanism in which both ends of the card are held. Patent Document 5 shows In the connector for inserting a memory card, the card connector has a U-shaped structure. For example, Patent Document 6 discloses a terminal of a terminal of a printed circuit board, and discloses a U-shaped terminal, which is an example of a U-shaped terminal. [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-156109 (Patent Document 3) Japanese Laid-Open Patent Publication No. 2006-156109 (Patent Document 4) JP-A-2006-147301 [Patent Document 5] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. 00-149967 [Patent Document 6] [Problems to be Solved by the Invention] However, regarding the technology of the socket and the card as described above, The inventor's review In the following, it is considered that, for example, a socket of a size other than a specification card such as a SIM card is added, and a new memory function is added, and an expandable card is inserted (hereinafter, only 137653.doc 200945680 is referred to as "memory expansion". Card")" integrates the socket and the memory expansion card. The integrated device is then referred to as a semiconductor device. However, when the memory card is inserted into the socket, the expansion of the specification card occurs due to the repulsive force of the contact terminal. The total thickness of the specification card is outside the specifications, and it is necessary to prevent it. * Therefore, although the cover of Patent Document 1 is attempted to suppress the expansion, it has been found that the thinning may fail to function adequately. The reason is that the socket terminal on the leaf spring is disposed under the card slot, and the card is pushed up from the socket terminal. Therefore, the object of the present invention is to provide a deformation of the socket and the card to prevent the card from being inserted into the socket. The technology of thinning the socket. On the other hand, the memory function can be added and expanded by inserting a card whose external size is smaller than the socket. However, if functions other than the memory function can be added and expanded, the semiconductor device can be further effectively used. "Therefore, the other invention aims to provide a socket and a card, which can be originally inserted by inserting a card into a socket. Technology to add or expand new functions. Other technologies (deformation prevention technology and function addition technology) are only available in combination or combination. The above and other objects of the present invention will be described in the description of the present specification. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The socket of the representative embodiment is attached to the main surface, and has an outer dimension T (the card slot) in which the card of the socket is inserted; in this area, a plurality of socket terminals are arranged on both sides along the insertion direction of the card; the socket The terminal a is further disposed to sandwich the edge of the inserted card; and the external connection terminal of the socket is connected to the external device; the external connection terminal is Said socket terminal. Further, a semiconductor device integrated with a socket and a card according to another embodiment includes a socket which includes: a plurality of external connection terminals for connecting to an external device; and a microcomputer chip which is connected to the external terminal Transmitting a signal wire to perform a first material processing; and a plurality of socket terminals for transmitting a signal from the microcomputer chip or receiving a signal to the microcomputer chip; a plurality of card terminals connected to the plurality of socket terminals; and a card A semiconductor wafer for performing second data processing by transmitting the signal to the microcomputer chip & via the plurality of card terminals, and having a smaller size than the socket is inserted into the socket. [Embodiment] [Effects of the Invention] In the many embodiments disclosed in the present application, the effects obtained by the above representative embodiments can be used to prevent deformation of the card and the card when the card is inserted into the socket. . Moreover, the effect obtained by the other embodiments of Gam & Yoshida is attached to the socket and the card, and the card can be inserted into the socket by the shape of the tape + ~ & This is easy to add and expand new features. Hereinafter, the implementation form of this road ΒΒ > 生赞明 will be described in detail based on the drawings. In the drawings, the same reference numerals are attached to the same components, and the repeated description thereof is omitted. (Embodiment 1) FIG. 1 is a view showing a structure of a socket and a card according to an embodiment 1 of the present invention; (a) is a function expansion card, and (b) is a SIM card appearance socket, (c) ) is an AA cross-sectional view showing the state in which the function expansion card has been inserted into the SIM card outline socket. Here, the function expansion card is a card having a smaller external size than the socket and a new function for the socket. In addition, the details of the function expansion card will be described later. The external dimensions of the SIM card receptacle 106 are, for example, the same as the SIM card, and are 15 mm x 25 according to the specifications of the plug-in UICC (Universal Integrated Circuit Card) of ETSI TS 102 221 V4. 4.0 (2001-10). Mmx0.76 mm. That is, the top view is 15 mm X 25 mm and the thickness is 0.76 mm. The thickness is allowed to be in the range of 0:76 mm ± 0.08 mm, and may be a thickness of 0.84 mm or less. Generally, on the SIM card, the IS07816 interface terminal is equipped with 8 terminals of C1~C8, the distribution system of IS07 816 terminal is CCC (+ power supply), C2 is RES (reset), C3 is CLK (clock), C4, C6 , C8 is RSV (reserved), C5 is VSS (ground), and C7 is 1/0 (output). Here, the reserved terminal can be used as an extension terminal of the implementation of the USB interface, the implementation of the MMC, the serial interface, or the implementation of the non-contact (contactless card) function. Further, the SIM card outline socket 106 of the present invention shown in Fig. 1 and the like is also provided with the same terminal. The SIM card form factor socket 106 is connected to an external device 137653.doc 200945680 via a 1807816 interface terminal (: 1 to €8) according to the ISO/IEC7816-3 specification. It is mounted in the SIM card form factor socket 106. There are semiconductor wafers such as micro-chip chips or flash memory controllers, or passive components such as capacitors, resistors, coils, etc., or active TL parts. In addition, secure micro-computer chips or flash memory controllers, etc. | It can be a single wafer of "multiple wafers. Moreover, these semiconductor wafers or wafer parts are sealed by a sealing resin to ensure their shape and strength. Safe microcomputer chip or flash memory control ^ does not necessarily have a safety microcomputer Wei Mu brother It is also only a controller for communication protocol conversion. Moreover, in the case where the function expansion card ιοί is equipped with the Anwang 1C function, it can also be a case where only the controller-only wiring connection is switched. That is, it means that it is a terminal. As shown in Fig. 1(a), the functional expansion card 〇1 has a substantially rectangular shape in plan view and a convex shape in the thickness direction. Two sides along the insertion direction The portion to be provided is here as the edge portion 1〇2. If the other representation edge portion 1〇2 is closer to the side of the side than the center line between the two sides, further, the function expansion card 101 is The edge portion 1〇2 and the central portion 1〇3 are formed, and the thickness of the edge 02 is thinner than the central portion 丨〇3. By making the thickness of the edge portion thinner than the central portion 103, the socket can be easily inserted. Therefore, although the thickness of the edge portion 102 is thinner than the central portion 103, the phase 5 may be provided depending on the structure of the edge portion 1〇2. Further, on both sides of the edge portion 102, a plurality of card terminals are disposed along the insertion direction. 104. Although not visible in the figure, the back side of the edge portion 102 is also provided with a plurality of card terminals 1〇4 on the front side, and the card terminals 1〇4 at the same position on the front and back sides are electrically electrically Connected. Also at the edge 1〇2, a function expansion card ι〇1 is inserted into the SIM card outline insert 137653.doc 200945680 The function expansion is the recess 1〇5 for fixing the seat 106. In addition, as an example The size of the card 1〇1 is 14.5 mmxl2 mm and the central part is 1〇3 14.5 mmx9 mm.

於功能擴充卡1〇1，搭載有用以追加記憶體容量之非揮 發性記憶體、ROM、RAM等。而且，追加功能時，有具 有可處理依據近距離無線通訊規格⑼咖 CommUnication : NFC)之外部裝置經由天線所接收之信 號，而且發送可經由天線予以無線輸出之輸出信號之功能 (以下僅稱為「NFC功能」）之半導體晶片。進一步搭載有 半導體晶[天線、RF模組、電容器、電池等。而:，亦 可使功能擴充卡101具有SIM卡功能而單獨使用。 如圖1(b)所示，SIM卡外形插座106係含有功能擴充卡 101所插入之卡用插槽（區域）1〇7，於其兩端含有導引部 115。導引部115係於剖面形狀成為「〕」字形狀。導引部 115係具有將功能擴充卡101插入SIM卡外形插座1〇6之卡用 插槽（區域）107時，使卡片順暢地插入之作用，及具有插入 後，從上下方向保持功能擴充卡1〇1之緣部1〇2之作用。而 且，於導引部115設置有複數開口部113。進一步於該複數 開口部in之各個配置有插座端子108。插座端子1〇8連接 於至少具有用於ISO端子i丨2或後述之SIM卡之安全功能之 微電腦晶片（以下僅稱為「SIM用安全微電腦晶片」）。插 座端子108為U字狀之金屬片，成為以上下夾住功能擴充卡 101之卡端子104之構造。而且，插座端子1〇8之上端成為 與SIM卡外形插座1 〇6之表面相同高度、或其以下之高度。 137653.doc 200945680 而且’於SIM卡外形插座l〇6，於功能擴充卡1〇1所未插入 之厚層部分，有露出接觸端子11〇之凹部1Π，搭載有SIM 用女全微電腦晶片之LGA(Land Grid Array :地栅陣列）封 裝體109嵌合於凹部in，位於lga封裝體109之背面之封 裝體端子與接觸端子11〇被予以烊接。而且，於靠近lga 封農體109之1個角設置有倒角部114。此外，SIM卡外形插 座106之外形尺寸係具有經規格化之SIM卡之外形尺寸。 如圖1(c)所示’功能擴充卡ι〇1插入SIM卡外形插座ι〇6 時，藉由U字狀之插座端子1〇8夾住位於薄層部1〇2之兩面 之卡端子104，電性地連接端子彼此，同時保持功能擴充 卡101。而且’插座端子108之上端係於開口部113露出， 但不會從SIM卡外形插座106之表面飛出。進一步於SIM卡 外形插座106之背面設置有複數IS〇端子112。 因此，不會由U字狀之插座端子108，對於功能擴充卡 101往單一方向推壓。因此，不易產生功能擴充卡1〇1之翹 曲、歪斜、膨脹等。 而且’藉由含有開口部113，可使插座端子108之上端與 SIM卡外形插座106之表面相同高度、或為其以下之高度， 因此可予以薄型化。 而且，於功能擴充卡1〇1，沿著插入方向將複數卡端子 1 〇4排列於卡片之2邊之情況下，比起僅排列於i邊之情 況，可取定較大之間距長度，而且可取定較多端子數。 進一步而言，藉由將SIM用安全微電腦晶片予以封裝體 化，可於安裝在插座前予以篩選，插座製造全體之良率提 137653.doc 200945680 升。而且，即使晶片類別或晶片大小不同，#由將封裝體 外形及插腳數（配置）予以共通化’以便容易對應多類別。 從該等可實現組裝容易且低價之卡用插座。 進一步於圖1 ’以各插座端子108為單位設置有開口部 - 113 ’但跨越複數插座端子108設置有i個開口亦可。其 ‘ 中’於每插座端子108設置有開口部113之情況，具有防止 插座端子108之扭曲或變形之效果。 Q 而且’若可較薄地設計SIM卡外形插座1〇6之厚度，則 不設置開口部113而予以加蓋之構造亦可。該情況係具有 保護插座端子108之效果。 此外，於圖1係作為經封震體化而舉例表示LGA封裝 體’但關於封裝體種類’ BGA(Ball Grid Array :球柵陣列） 封裝體或引線架型封裝體亦可。 而且，於此，於LGA封裝體109與接觸端子110之連接雖 利用焊錫’取代焊錫而利用導電性接著材料或導電性膜 _ (片材）亦可。 而且，取代LGA封裝體109而製成將SIM用安全微電腦晶 片之裸晶片，直接連接於接觸端子110之c〇B(Chip 〇n • B〇ard :基板載晶）之構造亦可。 - 圖2係於按照本發明之實施型態1之插座及卡片，表示其 外形尺寸之圖；（a)係表示功能擴充卡已插入SIM卡外形插 座之狀態之A-A剖面圖’（b)係表示從功能擴充卡之正面及 背面觀看之圖’（c)係表示SIM卡外形插座之B部放大圖。 如圖2(c)所示’於插座端子ι〇8之内側，設置功能擴充卡 137653.doc 200945680 101上側對卡端子104之接觸用之突起2〇1、及功能擴充卡 101下側對卡端子104之接觸用之突起202。突起201, 202之 成型係利用從突起201，202之背面側之推出等。 此外’於此雖表示設置有突起2〇1, 2〇2之例，但依U字 狀之插座端子108之夾力之情形，含有雙方之某一方或不 含有均可。 圖3係於按照本發明之實施型態1之插座及卡片，從背面 侧觀看SIM卡外形插座、卡端子、LGA封裝體之圖。 如圖3所示，於SIM卡外形插座1〇6之背面側，配置含有 8個端子之ISO端子112。而且，於功能擴充卡ιοί之背面 側’配置含有10個端子之卡端子1〇。進一步於LGA封裝體 109之背面側，配置含有複數端子之封裝體端子3〇1。 圖4係於按照本發明之實施型態1之插座及卡片，表示功 能擴充卡已插入SIM卡外形插座之狀態之剖面圖之圖；（a) 係表示開口部塞住之情況，（b)係表示開口部未塞住之情 況。 如圖4(a)所示，插座端子1〇8内建於（被覆蓋於）SIM卡外 形插座106之構造之情況，僅因覆蓋插座端子108之部分之 厚度，無法取得SIM卡外形插座106之高度，需要更薄之功 能擴充卡101。因此，如圖4(b)所示，使用SIM卡外形插座 106之全部厚度來構成插座端子108。於插座端子ι〇8上係 製成於SIM卡外形插座1 06開有孔洞（開口部113)之構造。 藉此’可予以薄型化。 圖5係於按照本發明之實施型態丨之插座及卡片，表示於 137653.doc -12- 200945680 SIM卡外形插座插入功能擴充卡之狀況之圖；（勾係表示插 入4 ’（b)係表示插入中，（c)係表示插入後。 如圖5所示，由於複數卡端子1〇4係沿著功能擴充卡1〇1 之插入方向配置，因此於插入時會摩擦複數插座端子1〇8 ' 内而插入。因此，儘可能為了防止電源導入時由卡插拔所 • 造成之誤動作’宜施以熱插拔（Hot Insertion)對策。 例如將卡端子丨〇4中不使用之端子用於功能擴充卡1〇1之 ❹ 插入檢出用。而且，於SIM卡外形插座106設置檢出功能擴 充卡1 0 1有無插入之機構。關於該熱插拔對策之具體例係 於後面敘述。 圖6係於按照本發明之實施型態1之插座及卡片，表示連 接ISO端子、接觸端子與插座端子之端子架之構造之一例 之圖。如圖6所示，SIM卡外形插座1〇6含有以同一金屬材 料連接ISO端子112、接觸端子11〇與插座端子1〇8之端子架 601。藉由以塑膠等樹脂’將該端子架6〇1予以一體成型， ❹ 來製作SIM卡外形插座106。 端子架60 1係沿著功能擴充卡1 〇 1之插入方向，於其兩側 排列有（2排）複數插座端子1〇8。而且，ISO端子ι12係配置 ’ 為由排列成2排之插座端子108所夾著。ISO端子ι12之端子 • 分別與排列成2排之插座端子108之接近側之1排端子各個 連接。 而且，ISO端子112之部分可藉由附上凹凸，以在與樹脂 一體成型後’於SIM卡外形插座1〇6之背面側露出。SIM用 安全微電腦晶片係將預先密封於LGA等之封裝體 137653.doc -13- 200945680 裝體109)以焊接安裝於一體成型之端子架6〇1之接觸端子 110。此外，亦可取代LGA封裝體109而將SIM用安全微電 腦晶片直接連接於端子架601之接觸端子11〇，製成c〇B構 造亦可。 因此，藉由以同一材料之端子架601來構成180端子 112、接觸端子11〇及插座端子1〇8，SIM卡外形插座1〇6之 製作變得容易，可謀求低成本化。 (實施型態2) 圖7係表示於按照本發明之實施型態2之插座及卡片，於 SIM卡外形插座黏貼有貼紙（seal)之結構之圖；（a)、（b)、 (c)係表示黏貼貼紙前之狀態，（d)、（e)、（f)係表示黏貼貼 紙後之狀態。貼紙701, 702，703係標示型名、型號、商標 等之貼紙。 如圖7(a)、（d)所示，於SIM卡外形插座106之LGA封裝體 109部分黏貼貼紙701。藉此，可保護LGA封裝體109。該 情況下，由於貼紙未貼在功能擴充卡上，因此可插拔功能 擴充卡101。 如圖7(b)、（e)所示，於SIM卡外形插座106之LGA封裝體 109部分及插座端子1 〇8上黏貼貼紙702。藉此，可保護 LGA封裝體109及插座端子1〇8。該情況下，由於貼紙未貼 於功能擴充卡上，因此可插拔功能擴充卡101。 如圖7(c)、（f)所示，於SIM卡外形插座1〇6之上側整面黏 貼貼紙703。藉此，可保護LGA封裝體1〇9、插座端子1〇8 及功能擴充卡101。該情況下，無法插拔功能擴充卡101。 137653.doc -14- 200945680 適於為了功能擴充卡101之竄改防止等不欲使功能擴充卡 1 〇 1插拔之情況。 根據以上，藉由黏貼貼紙，可因應目的來保護LGA封裝 體109及插座端子108、功能擴充卡 101。 - (實施型態3) • 圖8係於按照本發明之實施型態3之插座及卡片，表示於 SIM卡外形插座插入功能擴充卡之狀況之圖；（a)係表示插 ❼ 入刖’（b)係表示插入中，（c)係表示插入後。 如圖8(a)所示，在插入SIM卡外形插座1〇6a之功能擴充 卡1〇1&之插入方向前端之主面，設置有卡端子104a。而 且，於SIM卡外形插座1〇6a之卡插入部之前端（插入頂 端），設置有插座端子108a。如圖8(c)所示，功能擴充卡 1〇la插入SIM卡外形插座l〇6a時，成為插座端子i〇8a從上 下方向失著卡端子l〇4a之構造。插座端子108a分別之構造 係與按照前述實施型態i之插座端子i 〇8相同。 ® 因此’若根據本實施型態3，與前述實施型態1相同，藉 由僅夾著插入SIM卡外形插座l〇6a之功能擴充卡l〇la之前 端部，可抑制膨脹發生。 • 而且’由於按照前述實施型態1之功能擴充卡101及按照 - 本實施型態3之功能擴充卡i〇ia之尺寸，可最大限度地利 用SIM卡外形插座106, 106a之插座區域，因此可取定最大 尺寸。 (實施型態4) 圖9係於按照本發明之實施型態4之插座及卡片，表示其 137653.doc -15· 200945680 結構之圖；（a)係從背面側觀看之圖，（b)係從正面側觀看 之圖。圖10係於按照本發明之實施型態4之插座及卡片， 表示於SIM卡外形插座插入功能擴充卡之狀況之圖；（a)係 表示插入前，（b)係表示插入中，（幻係表示插入後。 相對於前述實施型態1〜3係從SIM卡外形插座之後方（靠 近ISO端子112)插入功能擴充卡之形式’本實施型態*係從 SIM卡外形插座之前方（靠近倒角部丨丨4b)插入功能擴充卡 之形式。 由於在SIM卡外形插座1 〇6b之卡插入口側具有倒角部 114b，因此功能擴充卡1011)之外形尺寸成為小於按照前述 實施型態1之功能擴充卡101之外形尺寸。插座端子1〇81?分 別之構造係與按照前述實施型態i之插座端子1〇8相同，成 為從上下夾住卡端子l〇4b之構造。而且，於SIM卡外形插 座106b内搭載有SIM用安全微電腦晶片。 功能擴充卡ioib可作為安全微電腦晶片（SecMCU)、The function expansion card 1〇1 is equipped with non-volatile memory, ROM, RAM, etc., which are used to add a memory capacity. In addition, when the function is added, there is a function that can receive signals received by an external device according to the short-range wireless communication standard (9) ComUnication: NFC, and transmit an output signal that can be wirelessly output via an antenna (hereinafter simply referred to as "NFC function" semiconductor wafer. Further, semiconductor crystals [antennas, RF modules, capacitors, batteries, etc.) are mounted. And:, the function expansion card 101 can also be used separately with the SIM card function. As shown in Fig. 1(b), the SIM card form factor receptacle 106 includes a card slot (area) 1〇7 into which the function expansion card 101 is inserted, and a guide portion 115 is provided at both ends thereof. The guide portion 115 has a cross-sectional shape of a "]" shape. The guiding portion 115 has a function of smoothly inserting the card when the function expansion card 101 is inserted into the card slot (area) 107 of the SIM card socket 1, 6 and has a function expansion card from the up and down direction after insertion. The role of 1〇2 in the edge of 1〇1. Further, a plurality of openings 113 are provided in the guiding portion 115. Further, a socket terminal 108 is disposed in each of the plurality of opening portions in. The socket terminal 1A8 is connected to a microcomputer chip (hereinafter simply referred to as "SIM-based secure microcomputer chip") having at least a security function for the ISO terminal i丨2 or a SIM card to be described later. The socket terminal 108 is a U-shaped metal piece, and has a structure in which the card terminal 104 of the function expansion card 101 is sandwiched. Further, the upper end of the socket terminal 1A8 has the same height as the surface of the SIM card socket 1, 6 or less. 137653.doc 200945680 And 'in the SIM card socket l〇6, in the thick layer part of the function expansion card 1〇1, there is a recess 1露出 exposing the contact terminal 11〇, and the LGA equipped with the female full microcomputer chip for SIM The (Land Grid Array) package 109 is fitted in the recess in, and the package terminal located on the back surface of the LGA package 109 is connected to the contact terminal 11A. Further, a chamfered portion 114 is provided at a corner close to the lga sealing body 109. In addition, the external dimensions of the SIM card outline receptacle 106 are dimensioned by a standardized SIM card. As shown in Fig. 1(c), when the function expansion card ι〇1 is inserted into the SIM card socket ι〇6, the card terminals on both sides of the thin layer portion 1〇2 are clamped by the U-shaped socket terminals 1〇8. 104, electrically connecting the terminals to each other while maintaining the function expansion card 101. Further, the upper end of the socket terminal 108 is exposed at the opening 113, but does not fly out from the surface of the SIM card socket 106. Further, a plurality of IS ports 112 are disposed on the back surface of the SIM card outline socket 106. Therefore, the U-shaped socket terminal 108 is not pushed in the single direction with respect to the function expansion card 101. Therefore, warpage, skew, expansion, and the like of the function expansion card 1〇1 are less likely to occur. Further, by including the opening portion 113, the upper end of the socket terminal 108 can be made to have the same height as the surface of the SIM card socket 106 or a height lower than that, so that the thickness can be reduced. Further, in the case where the function expansion card 101 is arranged in the insertion direction to arrange the plurality of card terminals 1 〇 4 on the two sides of the card, a larger interval length can be determined than in the case where only the i side is arranged, and More terminals can be taken. Further, by packaging the SIM with a secure microcomputer chip, it can be screened before being installed in the socket, and the overall yield of the socket manufacturing is 137653.doc 200945680 liters. Moreover, even if the wafer type or the wafer size is different, # is common to the package outline and the number of pins (arrangement) so as to easily correspond to a plurality of categories. From these, it is possible to realize an easy-to-assemble card socket. Further, in Fig. 1, 'the opening portion - 113' is provided in units of the respective socket terminals 108, but i openings may be provided across the plurality of socket terminals 108. The case where the 'intermediate' is provided with the opening portion 113 at each of the socket terminals 108 has an effect of preventing distortion or deformation of the socket terminal 108. Further, if the thickness of the SIM card-shaped socket 1〇6 is designed to be thinner, the opening 113 may be provided without being provided. This situation has the effect of protecting the receptacle terminal 108. In addition, in Fig. 1, an LGA package ' is exemplified as a sealed body, but a package type 'BGA (Ball Grid Array) package or a lead frame type package may be used. Further, here, the connection between the LGA package 109 and the contact terminal 110 may be performed by using solder as a substitute for solder, and a conductive adhesive material or a conductive film (sheet) may be used. Further, instead of the LGA package 109, a bare wafer of the SIM safety microchip wafer may be directly connected to the structure of the contact terminal 110 cCB (Chip 〇n • B〇ard: substrate carrier crystal). - Figure 2 is a diagram showing the outer dimensions of the socket and card according to the embodiment 1 of the present invention; (a) is a cross-sectional view of the AA showing the state in which the function expansion card has been inserted into the shape of the SIM card socket (b) Figure (c) shows an enlarged view of part B of the SIM card outline socket. As shown in FIG. 2(c), on the inner side of the socket terminal ι8, a function expansion card 137653.doc 200945680 101 is provided on the upper side of the contact terminal 2 for contact with the card terminal 104, and the lower side of the function expansion card 101 is provided. A protrusion 202 for contact of the terminal 104. The forming of the projections 201, 202 is performed by pushing out from the back side of the projections 201, 202 and the like. Further, although the example in which the protrusions 2〇1 and 2〇2 are provided is described herein, the pinch force of the U-shaped socket terminal 108 may or may not be contained. Fig. 3 is a view showing a socket and a card according to an embodiment 1 of the present invention, and a view of a SIM card outline socket, a card terminal, and an LGA package viewed from the back side. As shown in Fig. 3, an ISO terminal 112 including eight terminals is disposed on the back side of the SIM card outline socket 1〇6. Further, a card terminal 1 having 10 terminals is disposed on the back side of the function expansion card ιοί. Further, a package terminal 3〇1 including a plurality of terminals is disposed on the back side of the LGA package 109. Figure 4 is a cross-sectional view showing the state in which the function expansion card has been inserted into the SIM card socket according to the socket and the card of the embodiment 1 of the present invention; (a) showing the state in which the opening is plugged, (b) This indicates that the opening is not plugged. As shown in FIG. 4(a), the socket terminal 1 is built in (covered on) the structure of the SIM card socket 106, and the SIM card socket 106 cannot be obtained only because of the thickness of the portion covering the socket terminal 108. The height requires a thinner function expansion card 101. Therefore, as shown in Fig. 4 (b), the socket terminal 108 is constructed using the entire thickness of the SIM card outline socket 106. The socket terminal 〇8 is formed in a structure in which a hole (opening 113) of the SIM card-shaped socket 106 is opened. This can be made thinner. Figure 5 is a diagram showing the state of the expansion card of the SIM card form factor socket inserted in the 137653.doc -12-200945680 according to the embodiment of the present invention; (the hook indicates the insertion 4 '(b) Indicates the insertion, and (c) indicates the insertion. As shown in Fig. 5, since the plurality of card terminals 1〇4 are arranged along the insertion direction of the function expansion card 1〇1, the plurality of socket terminals 1 are rubbed during insertion. 8 'Insert inside. Therefore, as far as possible, in order to prevent the malfunction caused by the card being inserted and removed during the power supply, 'Hot Insertion' measures should be applied. For example, the terminal that is not used in the card terminal 丨〇4 is used. In the case of the function expansion card 1〇1, it is inserted and detected. Further, a mechanism for detecting whether or not the expansion function card 1 0 1 is inserted is provided in the SIM card socket 106. A specific example of the hot swapping strategy will be described later. Fig. 6 is a view showing an example of a structure of a terminal frame for connecting an ISO terminal, a contact terminal and a socket terminal according to the socket and the card of the embodiment 1 of the present invention. As shown in Fig. 6, the SIM card socket 1〇6 Containing the same metal material The terminal frame 601 of the ISO terminal 112, the contact terminal 11A, and the socket terminal 1〇8 is connected. The terminal frame 6〇1 is integrally molded by a resin such as plastic, thereby forming a SIM card outline socket 106. The terminal frame 60 1 is along the insertion direction of the function expansion card 1 〇1, and (2 rows) of multiple socket terminals 1〇8 are arranged on both sides thereof. Moreover, the ISO terminal ι12 is configured as 'the socket terminals 108 arranged in 2 rows. The terminals of the ISO terminal ι12 are respectively connected to the one row of terminals on the side close to the socket terminals 108 arranged in two rows. Moreover, the portion of the ISO terminal 112 can be attached to the resin by being attached to the resin. 'The back side of the SIM card form factor socket 〇6 is exposed. The SIM microcomputer-based secure microcomputer chip series is pre-sealed to the package of the LGA or the like 137653.doc -13- 200945680 The body 109) is solder-mounted to the integrally formed terminal frame 6 Contact terminal 110 of 〇1. Further, instead of the LGA package 109, the SIM safe micro-computer chip may be directly connected to the contact terminal 11 of the terminal holder 601 to form a c〇B structure. Therefore, by forming the 180 terminal 112, the contact terminal 11A, and the socket terminal 1〇8 with the terminal frame 601 of the same material, the SIM card outline socket 1〇6 can be easily manufactured, and the cost can be reduced. (Embodiment 2) FIG. 7 is a view showing a structure in which a socket and a card according to Embodiment 2 of the present invention are pasted with a sticker on a SIM card outline socket; (a), (b), (c) ) indicates the state before the sticker is attached, and (d), (e), and (f) indicate the state after the sticker is pasted. Stickers 701, 702, 703 are stickers with name, model, trademark, etc. As shown in Figs. 7(a) and (d), the sticker 701 is adhered to the LGA package 109 of the SIM card outline socket 106. Thereby, the LGA package 109 can be protected. In this case, since the sticker is not attached to the function expansion card, the expansion card 101 can be plugged and unplugged. As shown in Figs. 7(b) and (e), the sticker 702 is adhered to the LGA package 109 portion of the SIM card outline socket 106 and the socket terminal 1 〇 8. Thereby, the LGA package 109 and the socket terminals 1A8 can be protected. In this case, since the sticker is not attached to the function expansion card, the function expansion card 101 can be inserted and removed. As shown in Figs. 7(c) and (f), the sticker 703 is adhered to the entire upper surface of the SIM card outline socket 1〇6. Thereby, the LGA package 1〇9, the socket terminal 1〇8, and the function expansion card 101 can be protected. In this case, the function expansion card 101 cannot be inserted or removed. 137653.doc -14- 200945680 It is suitable for the tampering of the function expansion card 101, etc. It is not necessary to make the function expansion card 1 〇 1 plug and unplug. According to the above, the LGA package 109, the socket terminal 108, and the function expansion card 101 can be protected by the sticker. - (Embodiment 3) • Fig. 8 is a diagram showing a state in which a socket and a card according to an embodiment 3 of the present invention are inserted into a function expansion card of a SIM card form socket; (a) shows a plug-in 刖' (b) indicates insertion, and (c) indicates insertion. As shown in Fig. 8(a), a card terminal 104a is provided on the main surface of the front end in the insertion direction of the function expansion card 1〇1& inserted into the SIM card outline socket 1〇6a. Further, a socket terminal 108a is provided at the front end (insertion top end) of the card insertion portion of the SIM card outline socket 1?6a. As shown in Fig. 8(c), when the function expansion card 1〇la is inserted into the SIM card outline socket 16a, the socket terminal i〇8a is configured to lose the card terminal 104a from the upper and lower sides. The socket terminals 108a are respectively constructed in the same manner as the socket terminals i 〇 8 according to the foregoing embodiment i. Therefore, according to the present embodiment 3, as in the first embodiment, the occurrence of expansion can be suppressed by sandwiching only the front end portion of the function expansion card 10a inserted into the SIM card outline socket 100a. • Moreover, due to the size of the function expansion card 101 according to the foregoing embodiment 1 and the function expansion card i〇ia according to the embodiment 3, the socket area of the SIM card sockets 106, 106a can be utilized to the utmost extent, The maximum size can be taken. (Embodiment 4) FIG. 9 is a view showing a structure of a 137653.doc -15·200945680 structure according to an embodiment 4 of the present invention; (a) a view from the back side, (b) The picture is viewed from the front side. Figure 10 is a view showing a state in which a socket and a card according to an embodiment 4 of the present invention are inserted into a function expansion card of a SIM card form socket; (a) indicates before insertion, and (b) indicates insertion, (phantom) Indicates the form of the function expansion card inserted from the back of the SIM card outline socket (near the ISO terminal 112) with respect to the foregoing embodiments 1 to 3 'this embodiment type* is from the front of the SIM card shape socket (near The chamfered portion 4b) is inserted into the form of the function expansion card. Since the card insertion opening side of the SIM card outline socket 1 〇 6b has the chamfered portion 114b, the external expansion of the function expansion card 1011) becomes smaller than that according to the foregoing embodiment. 1 function expansion card 101 external dimensions. The socket terminals 1 〇 81 分 are constructed in the same manner as the socket terminals 1 〇 8 according to the above-described embodiment i, and are configured to sandwich the card terminals 10b from the upper and lower sides. Further, a SIM secure microcomputer chip is mounted in the SIM card outline socket 106b. The function expansion card ioib can be used as a secure microcomputer chip (SecMCU).

Fel1Ca晶片等功能追加用之小型功能擴充卡來利用。若與 功能擴充卡搭餘料㈣上之情況比較，功能擴充 卡0lb之大小雖僅可對應小型卡片，但容易從以往之 構造進行轉移。而且’如本實施型態4之結構之情況，由 於功能擴充卡101b不會重疊於IS〇端子mb，故容易牵繞 布線因此，端子架容易予以i層化。但由於倒角部之影 響，與後方插人比較，功能擴充卡之面積可能變小。 (實施型態5) 圖U係於按照本發明之實施型態5之插座及卡片，表示 137653.doc 200945680 其結構之圖；（a)係從正面側觀看之圖，（b)係從背面侧觀 看之圖。圖12係於按照本發明之實施型態5之插座及卡 片，表示於SIM卡外形插座插入功能擴充卡之狀況之圖； (a)係表示插入前’（13)係表示插入中，（c)係表示插入後。 • 圖13係於按照本發明之實施型態5之插座及卡片，表示IS〇 . 端子與插座端子之結線例之圖。 相對於前述實施型態4係從SIM卡外形插座之前方插入 ❹ 功能擴充卡之形式’本實施型態5係從SIM卡外形插座之側 方插入功能擴充卡之形式。 與前述實施型態4相同，由於在SIM卡外形插座i〇6c之卡 插入頂端側具有倒角部114c，因此功能擴充卡丨0丨 尺寸成為小於按照前述實施型態1之功能擴充卡丨〇丨之外形 尺寸。插座端子108c分別之構造係與按照前述實施型態4 之插座端子108b相同’成為從上下夾住卡端子1〇4c之構 造。而且’於SIM卡外形插座i〇6c内搭載有SIM用安全微 電腦晶片。 與前述實施型態4相同’若與功能擴充卡搭載於IS〇端子 112 c上之情況比較，功能擴充卡1 〇 1 e之大小雖僅可對應小 型卡片’但谷易從以往SIM之構造進行轉移。而且，本實 . 施型態5係與前述實施型態4之前方插入形式比較，其卡寬 尺寸之設計自由度高。 本實施型態5之SIM卡外形插座1 〇6c之情況下，如圖丨3所 示’ ISO端子112c與插座端子1〇8之連接可採1層予以結 線。 137653.doc -17- 200945680 (實施型態6) 圖14係於按照本發明之實施型態6之插座及卡片，表示 其結構之圖。圖14係表示側方向插人形式之其他實施例。 如圖14所示，於SIM卡外形插座1〇6d插入之功能擴充卡 ioid係於與主面對向之背面，配置有IS〇端子n2d。而 且，於與SIM卡外形插座106d之主面對向之背面，形成有 開口部113d。從SIM卡外形插座i〇6d之側方插入有功能擴 充卡ioid，從開口部113(1露出IS〇端子112d。該情況下， 可於功能擴充卡l〇ld搭載安全微電腦晶片，以作為1§〇相 容端子使用。 (實施型態7) 圖15係表示按照本發明之實施型態7之功能擴充卡之外 形之圖；（a)為俯視圖，（b)為正視圖，（c)為背面圖，（d)為 側面圖。圖1 8係表示按照本發明之實施型態7之功能擴充 卡之端子分配例及外形之圖；（a)為俯視圖，為背面 圖，（c)為剖面圖。 本實施型態7之功能擴充卡係於前述實施型態1〜6之sim 卡外形插座插入之功能擴充卡之一例。 例如圖18(a)、（b)所示分配功能擴充卡丨〇丨e之端子。於 此’含有ISO端子C1〜C8及功能擴充端子RFU1, 2。此外， C1 為 VCC，C2 為 RES，C3 為 CLK ’ C4 為 USB，C5 為 VSS， C6為 SWP，C7為 I/O，C8為 USB。 如圖18(c)所示，功能擴充卡i〇ie係由半導體晶片（安全 微電腦晶片、NFC晶片等）1 801、模製樹脂！ 802、金屬線接 137653.doc •18· 200945680 合部1803、基板布線1804、基板1805等構成。 於功能擴充卡101 e，搭載有用以追加記憶體容量之非揮 發性記憶體、ROM、RAM或功能追加用之安全微電腦晶 片、NFC晶片、天線、RF模組、電容器、電池等。此外， - 前述功能擴充端子RFU1, 2係連接於該等之端子。而且， ^ 亦可使功能擴充卡l〇le具有SIM卡功能而單獨使用。作為 SIM卡之大小屬小型之版本來使用之情況下，將虛線所示 之ISO端子112e作為卡端子104e使用。 〇 此外，僅背面端子之功能擴充卡亦可。亦即，容易從以 往COT(Chip On Tape:捲帶載晶）封裝體之SIM-MCU進行 轉移。此外，於此，以由ISO端子夾著之方式配置RFU1, 2，但配置於ISO端子之端部旁亦可。 (實施型態8) 圖16係表示按照本發明之實施型態8之SIM卡外形插座 之結構之圖；（a)係從正面側觀看外觀之圖，（b)係從正面 φ 側觀看構造之圖，（c)係從正面側觀看内容物之圖，（d)係 從背面側觀看外觀之圖，（e)係從背面側觀看構造之圖， (f)係從背面側觀看内容物之圖。圖19係於按照本發明之實 • 施型態8之SIM卡外形插座，表示附ISO端子SIM模組之端 - 子分配例及外形之圖；（a)為俯視圖，（b)為背面圖，（c)為 剖面圖。於此，於1邊配置連接於搭載在插座之SIM用安全 微電腦之端子。 如圖16(a)所示，本實施型態8之SIM卡外形插座106f係 與前述實施型態4之SIM卡外形插座106b同一形狀，於正面 137653.doc -19- 200945680 側有功能擴充卡所插入之卡用插槽107f及插座端子108f 等。如圖16(d)所示，於SIM卡外形插座106f之背面側設置 有ISO端子112f。SIM卡外形插座106f之内部布線之結線構 造係如圖16(b)、（e)。如圖16(c)、（f)所示，附ISO端子SIM 模組1601具備ISO端子112f，與插座端子108f焊接而連 接。亦可將附ISO端子SIM模組1601與功能擴充卡予以共 通封裝體化。而且，於附ISO端子SIM模組1601搭載有SIM 用安全微電腦晶片。 圖17係表示按照本發明之實施型態8之SIM卡外形插座 之組裝方法之圖。 如圖17所示，附ISO端子SIM模組1601係嵌入於SIM卡外 形插座106f之凹部lllf，接觸端子110f與封裝體端子301f 被予以焊錫連接。於此，於接觸端子1 l〇f與封裝體端子 30If之連接雖利用焊錫，取代焊錫而利用導電性接著材料 或導電性膜（片材）亦可。例如圖19(a)、（b)所示分配附ISO 端子SIM模組1601之端子。此外，Cl為VCC，C2為RES， C3 為 CLK，C4 為 USB，C5 為 VSS，C6 為 SWP，C7 為 I/O， C8 為 USB。 如圖19(c)所示，附ISO端子SIM模組1601係由ISO端子 112f、封裝體端子301f、SIM用安全微電腦晶片1901、模 製樹脂1802a、金屬線接合部1803a、基板布線1804a、基 板1 805a等構成。此外，於此雖以從前方插入功能擴充卡 之例來表示，但亦可適用於從另一方插入之情況。 (實施型態9) 137653.doc -20- 200945680 圖2〇係於按照本發明之實施型態9之插座及卡片，表示 SIM卡外形插座及功能擴充卡之結構之圖。 按照本實施型態9之SIM卡外形插座1 〇6g係將搭載有SIM 用安全微電腦晶片之功能擴充卡1 〇丨e，轉換為SIM外形之 接器。亦即’功能擴充卡l〇le為SIM卡之大小屬小型之版 本，且與以往之SIM卡具有相容性。 如圖20所示，於SIM卡外形插座l〇6g之凹部11 ig，嵌入 將擴充卡端子轉換為ISO端子之基板i8〇5g，並將封裝體端 子3〇lg與接觸端子ii〇g予以焊錫連接^ IS〇端子112g與封 裝體端子301g係藉由基板布線i804g連接。而且，接觸端 子110g係與插座端子1 〇gg連接。此外，於此，於封裝體端 子301g與接觸端子ll〇g之連接雖利用焊錫，作為導電性接 著材料或導電性膜（片材）來取代焊錫亦可。而且，於此雖 以從岫方插入功能擴充卡之例來表示，但亦可適用於從另 一方插入之情況。 (實施型態10) 圖21係於按照本發明之實施型態i 〇之插座及卡片，表示 功能擴充卡之卡端子連接於ISO端子之例之圖。若採其他 表現，功能擴充卡之卡端子並聯連接於IS〇端子及SIM用 安全微電腦晶片端子。圖21 (a)係以搭載有NFC晶片之功能 擴充卡來將NFC之功能予以功能擴充之例，（b)係表示以搭 載有安全微電腦晶片之功能擴充卡來追加有別與SIM之安 全微電腦之功能之例。圖22係於按照本發明之實施型態1〇 之插座及卡片’表示端子之分配例之圖。 137653.doc -21 - 200945680 如圖21(a)所示，SIM卡外形插座106h具備SIM用安全微 電腦晶片1901h及ISO端子112h，各個端子與插座端子連 接。藉由將搭載有NFC晶片之功能擴充卡101h插入，可容 易擴充NFC功能。 如圖21(b)所示，SIM卡外形插座106h具備SIM用安全微 電腦晶片1901h及ISO端子112h，各個端子與插座端子連 接。藉由將搭載有別於SIM用安全微電腦晶片190 lh之安全 微電腦晶片（Sec-MCU)之功能擴充卡101i插入，可容易擴 充其他安全微電腦功能。 圖22之端子分配係C1對應於VCC，C2對應於RES，C3對 應於CLK，C4對應於USB，C5對應於VSS，C6對應於 SWP，C7對應於I/O，C8對應於USB。 於SIM卡外形插座106h插入之功能擴充卡101h之卡端子 係與ISO端子112h連接。藉此，可實現附加有於SIM卡外 形插座106h插入之功能擴充卡101h所具有之功能之SIM卡 (半導體裝置）。 於SIM卡外形插座106h插入之功能擴充卡101h搭載NFC 晶片之情況，該SIM卡（半導體裝置）具有NFC功能。 於SIM卡外形插座106h插入之功能擴充卡101i搭載具有 有別於搭載於SIM卡外形插座106h之SIM用安全微電腦之 功能之安全微電腦晶片之情況，可追加該功能。於此之其 他功能係指例如NFC功能、儲存功能、USB功能等。 於SIM卡外形插座106h插入之功能擴充卡101i搭載具有 較搭載於SIM卡外形插座106h之SIM用安全微電腦晶片高 137653.doc -22- 200945680 度之功能之安全微電腦晶片之情況，可置換功能。於此之 高度功能係指CPU處理性能之提升、應用軟體之追加、伴 隨於服務追加之ROM或RAM之硬體系統強化等。 而且，於此雖說明於功能擴充卡内建安全微電腦晶片或 NFC晶片並進行資料處理之例，但資料處理亦包含單純之 貢料記憶（記憶體）。 (實施型態11) 圖23係於按照本發明之實施型態11之插座及卡片，表示 功能擴充卡之卡端子經由SIM用安全微電腦晶片連接於 ISO端子之例之圖。若採其他表現，功能擴充卡之卡端 子、SIM用安全微電腦晶片端子與ISO端子係_聯連接。 圖23(a)係以搭載有NFC晶片之功能擴充卡來將NFC之功能 予以功能擴充之例，（b)係表示以搭載有安全微電腦晶片之 功能擴充卡來追加有別與SIM之安全微電腦之功能之例。 圖24係於按照本發明之實施型態11之插座及卡片，表示端 子之分配例之圖。 如圖23(a)所示，SIM卡外形插座106k具備SIM用安全微 電腦晶片1901h及ISO端子112h，功能擴充卡之卡端子經由 SIM用安全微電腦晶片連接於ISO端子。藉由將搭載有NFC 晶片之功能擴充卡l〇lh插入，可容易擴充NFC功能。 如圖23(b)所示，SIM卡外形插座106k具備SIM用安全微 j 電腦晶片190 lh及ISO端子112h，功能擴充卡之卡端子經由 SIM用安全微電腦晶片連接於ISO端子。藉由將搭載有別 於SIM用安全微電腦晶片1901h之功能之安全微電腦晶片 137653.doc -23 - 200945680 (Sec-MCU)之功能擴充卡10Π插入，可容易擴充其他安全 微電腦功能。 圖24之端子分配係C1對應於VCC，C2對應於RES，C3對 應於CLK，C4對應於USB，C5對應於VSS，C6對應於 SWP，C7對應於I/O，C8對應於USB。 插座端子連接於搭載有SIM用安全微電腦晶片190 lh之 連接基板。連接基板具有SIM之ISO端子。插座端子係藉 由連接基板連接於SIM用安全微電腦晶片1901h，SIM之 ISO端子亦藉由連接基板連接於SIM用安全微電腦晶片 1901h。藉此，SIM用安全微電腦晶片1901h可因應功能之 需要，來進行將供給自SIM之ISO端子之VCC之電源供給 至擴充卡之電源端子VCC之控制，於非必要時不供給電 源，藉此亦可節約消耗電力。 同樣地，關於來自ISO端子之各信號，SIM用安全微電 腦晶片1901h係僅於有要求時，進行對功能擴充卡送出信 號之控制，從屬地使用功能擴充卡，或相反地使信號全部 通過功能擴充卡之使用方式均可。 (實施型態12) 圖25係於按照本發明之實施型態12之插座及卡片，表示 熱插拔（Hot Insertion)對策之一例之圖。 於本實施型態12，舉例說明前述實施型態11之SIM卡外 形插座，但不限定於此，關於其他實施型態亦可適用。 如圖25所示，於SIM卡外形插座1 06m内，設置檢出功能 擴充卡已插入之開關2501。然後，藉由來自開關2501之控 137653.doc •24- 200945680 制k號2502 ’ SIM用安全微電腦晶片i901h進行SIM卡外形 插座106m之電源之開啟/關閉控制。 圖26係於按照本發明之實施型態丨2之插座及卡片，表示 檢出卡插入之開關之結構之一例之圖；（勾係表示卡片未插 • 入時’（b)係表示卡片插入時。 . 如圖26(a)、（b)所示，於SIM卡外形插座l〇6m之卡插入 别端部，設置檢出卡片之到達之開關25〇1。若功能擴充卡 ❹ 1 〇 111插入至收納定位，則按下卡插入檢出之開關2501，開 關2501導通。 因此’藉由施以如本實施型態12之熱插拔（H〇tA small function expansion card for adding functions such as Fel1Ca chips is used. Compared with the case of the function expansion card (4), the size of the function expansion card 0lb can only correspond to a small card, but it is easy to transfer from the conventional structure. Further, in the case of the configuration of the present embodiment 4, since the function expansion card 101b does not overlap the IS〇 terminal mb, it is easy to wind the wiring, and therefore the terminal frame can be easily layered. However, due to the influence of the chamfered portion, the area of the function expansion card may become smaller as compared with the rear insertion. (Embodiment 5) FIG. 5 is a view showing a structure of a socket and a card according to Embodiment 5 of the present invention, showing a structure of 137653.doc 200945680; (a) a view from the front side, and (b) a view from the back side. Side view. Figure 12 is a view showing a state in which a socket and a card according to an embodiment 5 of the present invention are inserted into a function expansion card of a SIM card form socket; (a) indicates that before insertion (13) indicates insertion, (c) ) indicates after insertion. • Fig. 13 is a view showing an example of a connection between a terminal and a socket terminal in a socket and a card according to an embodiment 5 of the present invention. In contrast to the foregoing embodiment 4, the form of the function expansion card is inserted from the front of the SIM card socket. This embodiment 5 is in the form of a function expansion card inserted from the side of the SIM card socket. In the same manner as the foregoing embodiment 4, since the card insertion top end side of the SIM card outline socket i〇6c has the chamfered portion 114c, the function expansion card 丨0丨 becomes smaller than the function expansion card according to the above-described embodiment 1.丨 outside size. The socket terminals 108c are respectively configured to be the same as the socket terminals 108b according to the above-described embodiment 4, and are configured to sandwich the card terminals 1〇4c from above and below. Further, a secure microcomputer chip for SIM is mounted in the SIM card socket i〇6c. The same as the above-described embodiment 4, 'Compared with the case where the function expansion card is mounted on the IS〇 terminal 112c, the size of the function expansion card 1 〇1 e can only correspond to a small card'. Transfer. Further, the present embodiment 5 has a higher degree of freedom in designing the card width dimension as compared with the previously inserted form of the above-described embodiment 4. In the case of the SIM card outline socket 1 〇 6c of the present embodiment 5, the connection of the 'ISO terminal 112c and the socket terminal 1〇8' as shown in Fig. 3 can be connected in one layer. 137653.doc -17- 200945680 (Embodiment 6) Fig. 14 is a view showing the structure of a socket and a card according to Embodiment 6 of the present invention. Fig. 14 is a view showing another embodiment of the lateral direction insertion form. As shown in Fig. 14, the function expansion card ioid inserted in the SIM card outline socket 1〇6d is placed on the back surface facing the main body, and the IS〇 terminal n2d is disposed. Further, an opening portion 113d is formed on the back surface facing the main surface of the SIM card outline socket 106d. A function expansion card ioid is inserted from the side of the SIM card socket i〇6d, and the IS〇 terminal 112d is exposed from the opening 113 (1). In this case, the safety microcomputer chip can be mounted on the function expansion card l〇ld as 1 §〇Compatible terminal use. (Embodiment 7) FIG. 15 is a view showing the appearance of the function expansion card according to the embodiment 7 of the present invention; (a) is a plan view, (b) is a front view, (c) (a) is a side view. Fig. 18 is a diagram showing a terminal distribution example and an outline of a function expansion card according to an embodiment 7 of the present invention; (a) is a plan view, and is a rear view, (c) The function expansion card of this embodiment 7 is an example of a function expansion card inserted into the sim card form socket of the above-mentioned embodiments 1 to 6. For example, the distribution function expansion shown in Fig. 18 (a) and (b) is shown. The terminal of the cassette e. This contains the ISO terminals C1 to C8 and the function expansion terminals RFU1, 2. In addition, C1 is VCC, C2 is RES, C3 is CLK 'C4 is USB, C5 is VSS, C6 is SWP C7 is I/O and C8 is USB. As shown in Figure 18(c), the function expansion card i〇ie is made of semiconductor chip (safe Microcomputer wafer, NFC wafer, etc. 1 801, molded resin! 802, metal wire connection 137653.doc • 18· 200945680 joint 1803, substrate wiring 1804, substrate 1805, etc. The function expansion card 101 e is equipped with A non-volatile memory with a memory capacity, a ROM, a RAM, or a secure microcomputer chip for adding a function, an NFC chip, an antenna, an RF module, a capacitor, a battery, etc. - The function expansion terminal RFU1, 2 is connected to The terminals of the terminals, and ^ can also be used separately for the function expansion card to have a SIM card function. When the size of the SIM card is a small version, the ISO terminal 112e shown by a broken line is used as a card. The terminal 104e is used. 〇 In addition, only the function expansion card of the rear terminal may be used, that is, it is easy to transfer from the SIM-MCU of the conventional COT (Chip On Tape) package. The RFUs 1 and 2 are disposed in such a manner that the ISO terminals are sandwiched, but they may be disposed beside the ends of the ISO terminals. (Embodiment 8) FIG. 16 is a view showing the structure of a SIM card outline socket according to Embodiment 8 of the present invention. (a) Department The front view is viewed from the front side, (b) is a view of the structure viewed from the front side φ side, (c) is a view of the contents viewed from the front side, and (d) is a view of the appearance viewed from the back side, (e) A view of the structure is viewed from the back side, (f) is a view of the contents viewed from the back side. Fig. 19 is a SIM card outline socket according to the embodiment of the present invention, which indicates the end of the SIM terminal with the ISO terminal. - Sub-allocation example and outline view; (a) is a plan view, (b) is a rear view, and (c) is a cross-sectional view. Here, the terminal connected to the SIM safe microcomputer mounted on the outlet is disposed on one side. As shown in Fig. 16 (a), the SIM card receptacle 106f of the present embodiment 8 has the same shape as the SIM card receptacle 106b of the above-described embodiment 4, and has a function expansion card on the front side 137653.doc -19-200945680 side. The inserted card slot 107f, the socket terminal 108f, and the like. As shown in Fig. 16 (d), an ISO terminal 112f is provided on the back side of the SIM card outline socket 106f. The wiring structure of the internal wiring of the SIM card outline socket 106f is as shown in Figs. 16(b) and (e). As shown in Figs. 16(c) and 16(f), the ISO terminal SIM module 1601 includes an ISO terminal 112f and is soldered to the socket terminal 108f for connection. The ISO terminal SIM module 1601 and the function expansion card can also be packaged in common. Further, a SIM-based secure microcomputer chip is mounted on the ISO terminal SIM module 1601. Figure 17 is a view showing a method of assembling a SIM card outline socket according to an embodiment 8 of the present invention. As shown in Fig. 17, the ISO terminal SIM module 1601 is embedded in the recess lllf of the SIM card external socket 106f, and the contact terminal 110f and the package terminal 301f are soldered. Here, the connection between the contact terminals 1 lf and the package terminal 30If may be made of solder, and a conductive adhesive material or a conductive film (sheet) may be used instead of solder. For example, the terminals of the SIM terminal 1601 with the ISO terminal are assigned as shown in Figs. 19(a) and (b). In addition, Cl is VCC, C2 is RES, C3 is CLK, C4 is USB, C5 is VSS, C6 is SWP, C7 is I/O, and C8 is USB. As shown in FIG. 19(c), the ISO terminal SIM module 1601 includes an ISO terminal 112f, a package terminal 301f, a SIM safe microcomputer chip 1901, a molded resin 1802a, a wire bonding portion 1803a, and a substrate wiring 1804a. The substrate 1 805a and the like are configured. Further, although it is shown as an example in which a function expansion card is inserted from the front, it may be applied to the case where it is inserted from the other side. (Embodiment 9) 137653.doc -20- 200945680 FIG. 2 is a diagram showing the structure of a SIM card outline socket and a function expansion card in a socket and a card according to Embodiment 9 of the present invention. According to the SIM card form factor socket 1 〇 6g of the present embodiment 9, the function expansion card 1 〇丨e equipped with the SIM safe microcomputer chip is converted into a SIM form connector. That is, the function expansion card l为le is a small version of the size of the SIM card, and is compatible with the conventional SIM card. As shown in FIG. 20, the substrate i8〇5g which converts the expansion card terminal into the ISO terminal is embedded in the recess 11 ig of the SIM card socket l6g, and the package terminal 3〇lg and the contact terminal ii〇g are soldered. The connection NMOS terminal 112g and the package terminal 301g are connected by the substrate wiring i804g. Further, the contact terminal 110g is connected to the socket terminal 1 〇 gg. Further, in this case, solder may be used as the conductive connecting material or the conductive film (sheet) instead of the solder in the connection between the package terminal 301g and the contact terminal 111g. Further, although it is shown as an example in which a function expansion card is inserted from the other side, it may be applied to the case where it is inserted from the other party. (Embodiment 10) Fig. 21 is a view showing an example in which a card terminal of a function expansion card is connected to an ISO terminal in accordance with an embodiment of the present invention. If other performance is used, the card terminal of the function expansion card is connected in parallel to the IS〇 terminal and the SIM safety microchip terminal. Fig. 21 (a) shows an example in which the function of the NFC is expanded by a function expansion card equipped with an NFC chip, and (b) shows a safety microcomputer equipped with a function expansion card equipped with a secure microcomputer chip. An example of the function. Fig. 22 is a view showing an example of the arrangement of the terminals in the socket and the card ’ according to the embodiment of the present invention. 137653.doc -21 - 200945680 As shown in Fig. 21 (a), the SIM card form factor socket 106h is provided with a SIM safe microcomputer chip 1901h and an ISO terminal 112h, and each terminal is connected to the socket terminal. By inserting the function expansion card 101h equipped with an NFC chip, the NFC function can be easily expanded. As shown in Fig. 21 (b), the SIM card outline socket 106h includes a SIM safe microcomputer chip 1901h and an ISO terminal 112h, and each terminal is connected to the socket terminal. By plugging in the function expansion card 101i of the secure microcomputer chip (Sec-MCU) equipped with the 190 lh of the secure microcomputer chip for SIM, it is easy to expand other secure microcomputer functions. The terminal assignment system C1 of Fig. 22 corresponds to VCC, C2 corresponds to RES, C3 corresponds to CLK, C4 corresponds to USB, C5 corresponds to VSS, C6 corresponds to SWP, C7 corresponds to I/O, and C8 corresponds to USB. The card terminal of the function expansion card 101h inserted in the SIM card outline socket 106h is connected to the ISO terminal 112h. Thereby, a SIM card (semiconductor device) to which the function of the function expansion card 101h inserted in the SIM card external socket 106h is added can be realized. When the function expansion card 101h inserted in the SIM card form socket 106h is mounted with an NFC chip, the SIM card (semiconductor device) has an NFC function. This function can be added to the case where the function expansion card 101i inserted in the SIM card-shaped socket 106h is mounted with a secure microcomputer chip having a function similar to that of the SIM-based secure microcomputer mounted on the SIM card-type socket 106h. Other functions herein refer to, for example, NFC functions, storage functions, USB functions, and the like. The function expansion card 101i inserted in the SIM card form factor socket 106h is provided with a replaceable function in the case of a secure microcomputer chip having a function of 137653.doc -22-200945680, which is mounted on the SIM card socket 106h. The high-level functions here refer to the improvement of CPU processing performance, the addition of application software, and the hardening of hardware systems accompanying ROM or RAM added by services. Moreover, although the example describes the case where the function expansion card has a built-in secure microcomputer chip or an NFC chip and performs data processing, the data processing also includes a simple tributary memory (memory). (Embodiment 11) FIG. 23 is a view showing an example of a socket and a card according to an embodiment 11 of the present invention, in which a card terminal of a function expansion card is connected to an ISO terminal via a SIM safe microchip. If other performances are used, the card terminal of the function expansion card and the secure microcomputer chip terminal of the SIM are connected to the ISO terminal system. Fig. 23 (a) shows an example in which a function expansion card of an NFC chip is used to expand the function of the NFC, and (b) shows a function of a secure microcomputer that is equipped with a secure microcomputer chip. An example of the function. Fig. 24 is a view showing an example of allocation of terminals in a socket and a card according to an embodiment 11 of the present invention. As shown in Fig. 23 (a), the SIM card form factor socket 106k includes a SIM secure microcomputer chip 1901h and an ISO terminal 112h, and the card terminal of the function expansion card is connected to the ISO terminal via a SIM secure microcomputer chip. The NFC function can be easily expanded by inserting a function expansion card l〇lh equipped with an NFC chip. As shown in Fig. 23(b), the SIM card form factor socket 106k is provided with a SIM safe micro j computer chip 190 lh and an ISO terminal 112h, and the card terminal of the function expansion card is connected to the ISO terminal via a SIM secure microcomputer chip. By inserting the function expansion card 10 of the secure microcomputer chip 137653.doc -23 - 200945680 (Sec-MCU) equipped with the function of the secure microcomputer chip 1901h for SIM, it is possible to easily expand other secure microcomputer functions. The terminal assignment system C1 of Fig. 24 corresponds to VCC, C2 corresponds to RES, C3 corresponds to CLK, C4 corresponds to USB, C5 corresponds to VSS, C6 corresponds to SWP, C7 corresponds to I/O, and C8 corresponds to USB. The socket terminal is connected to a connection substrate on which a secure microcomputer chip 190 lh for SIM is mounted. The connection substrate has an ISO terminal of SIM. The socket terminal is connected to the SIM safe microcomputer chip 1901h via a connection substrate, and the ISO terminal of the SIM is also connected to the SIM safety microcomputer chip 1901h via the connection substrate. Therefore, the SIM safe microchip 1901h can perform the control of supplying the power supply of the VCC supplied from the ISO terminal of the SIM to the power supply terminal VCC of the expansion card in response to the function, and the power supply is not supplied when necessary. It can save power consumption. Similarly, for each signal from the ISO terminal, the SIM for the secure microcomputer chip 1901h performs control of the signal sent by the function expansion card only when required, and slavely uses the function expansion card, or conversely, the signal is fully expanded by function. The card can be used in any way. (Embodiment 12) Fig. 25 is a view showing an example of a hot insertion (Hot Insertion) countermeasure in a socket and a card according to an embodiment 12 of the present invention. In the present embodiment 12, the SIM card external socket of the above-described embodiment 11 is exemplified, but the present invention is not limited thereto, and other embodiments may be applied. As shown in Fig. 25, in the SIM card socket 106b, the switch 2501 in which the expansion function card has been inserted is set. Then, the power-on/off control of the SIM card form factor socket 106m is performed by the k-type 2502 'SIM secure microcomputer chip i901h from the switch 2501 137653.doc •24-200945680. Figure 26 is a view showing an example of the structure of the switch for detecting the insertion of the card according to the socket and the card of the embodiment of the present invention; (the hook indicates that the card is not inserted) (b) indicates the card insertion As shown in Fig. 26(a) and (b), the card of the SIM card shape socket l〇6m is inserted into the other end, and the switch 25〇1 for detecting the arrival of the card is set. If the function expansion card ❹ 1 〇 When the 111 is inserted into the storage position, the switch is inserted into the detected switch 2501, and the switch 2501 is turned on. Therefore, by applying the hot plug as in the present embodiment 12 (H〇t

Insertion)對策，可防止電源導入時由卡插拔所造成之誤動 作。 (實施型態13) 圖27係於按照本發明之實施型態13之插座及卡片，表示 熱插拔（Hot Insertion)對策之其他一例之圖。 _ 於本實施型態13 ’舉例說明前述實施型態11之SIM卡外 形插座，但不限定於此，關於其他實施型態亦可適用。 如圖27所不，為了檢出功能擴充卡l〇lh之插入，作為檢 • 出用而設置連接於_之端子。例如作為—例，將RFm ' 77配給GND。SIM用安全微電腦晶片1901h可藉由監視 RFU1之位準，來檢出功能擴充卡i〇ih之插入，可控制對 功能擴充卡10 lh之電源供給。 圖28及圖29係於按照本發明之實施型態13之插座及卡 片表不卡插入檢出機構之一例之圖。圖29⑷係表示卡片 137653.doc -25- 200945680 完全插入之狀態，圖29(b)係表示卡片未完全插入之狀態。 如圖28及圖29所示，藉由對於1個卡端子1 04h(例如 GND)設置2個插座端子108m, 108η，以檢出2個插座端子 108m, 108η彼此之導通，檢出功能擴充卡10lh之插入。若 功能擴充卡l〇lh插入至正確位置，則插座端子108m與插座 端子108η會導通，可檢出功能擴充卡101h之插入。 因此，藉由施以如本實施型態13之熱插拔（Hot Insertion)對策，可防止電源導入時由卡插拔所造成之誤動 作。 (實施型態14) 於前述實施型態1 0及11，說明藉由將内建NFC晶片之功 能擴充卡插入SIM卡外形插座，可擴充NFC功能。於此， 說明有關於行動電話等外部裝置插入插座，以實現NFC功 能之方法。 圖30及圖3 1係於按照本發明之實施型態14之插座及卡 片，表示將半導體裝置（SIM卡外形插座106η及功能擴充卡 10In)組入（插入）外部裝置來實現NFC功能之方法之區塊 圖。Insertion measures prevent misoperation caused by card insertion and removal during power supply. (Embodiment 13) Fig. 27 is a view showing another example of the hot insertion (Hot Insertion) countermeasure in the socket and the card according to the thirteenth embodiment of the present invention. The SIM card external socket of the above-described embodiment 11 is exemplified in the present embodiment 13', but is not limited thereto, and may be applied to other embodiments. As shown in Fig. 27, in order to detect the insertion of the function expansion card l〇lh, a terminal connected to _ is provided for detection. For example, as an example, RFm '77 is assigned to GND. The SIM for the secure microcomputer chip 1901h can detect the insertion of the function expansion card i〇ih by monitoring the level of the RFU1, and can control the power supply to the function expansion card 10 lh. Fig. 28 and Fig. 29 are views showing an example of a socket and a card insertion card detecting mechanism according to an embodiment 13 of the present invention. Fig. 29 (4) shows the state in which the card 137653.doc -25 - 200945680 is fully inserted, and Fig. 29 (b) shows the state in which the card is not fully inserted. As shown in FIG. 28 and FIG. 29, by providing two socket terminals 108m and 108n for one card terminal 104h (for example, GND), it is detected that the two socket terminals 108m and 108n are electrically connected to each other, and the function expansion card is detected. 10lh insertion. If the function expansion card l〇lh is inserted into the correct position, the socket terminal 108m and the socket terminal 108n are turned on, and the insertion of the function expansion card 101h can be detected. Therefore, by applying the hot insertion countermeasure according to the present embodiment 13, it is possible to prevent a malfunction caused by the card being inserted and removed at the time of power supply. (Embodiment 14) In the foregoing embodiments 10 and 11, it is explained that the NFC function can be expanded by inserting the function expansion card of the built-in NFC chip into the SIM card form socket. Here, a method for inserting an external device such as a mobile phone into a socket to realize the NFC function will be described. 30 and FIG. 31 are diagrams showing a socket and a card according to an embodiment 14 of the present invention, showing a method of integrating (inserting) a semiconductor device (SIM card outline socket 106n and function expansion card 10In) into an external device to realize an NFC function. Block diagram.

於此之外部裝置3002係指例如行動電話或其他攜帶式電 子機器。外部裝置3002係含有將SIM卡外形插座106η插入 之區域，其含有用以與其他外部裝置通訊之非接觸卡用RF 部。 圖30(a)係於外部裝置3002與SIM卡外形插座106η之連 接，利用ISO端子之I/O端子（C7)來實現NFC功能之例。 137653.doc -26- 200945680 圖30(b)係於外部裝置3002與SIM卡外形插座106η之連 接，利用ISO端子之SWP端子（C6)來實現NFC功能之例。 圖3 1(a)係於外部裝置3002與SIM卡外形插座106η之連 接，利用ISO端子之USB端子（C4及C8)來實現NFC功能之 例。 圖3 1(b)係於外部裝置3002與SIM卡外形插座106η之連 接，利用ISO端子之SWP端子（C6)及有別於ISO端子所設置 之RFU1端子、RFU2端子來實現NFC功能之例。 如圖30(a)所示，SIM卡外形插座106η含有SIM用安全微 電腦晶片1901η及ISO端子。 SIM卡外形插座1 06η係藉由組入（插入）於外部裝置 3002，可經由搭載於外部裝置3002之通常之基頻RF部及基 頻用天線來進行無線通訊。 此時，經由設置於SIM卡外形插座1 06η之外部連接用端 子即ISO端子，來與外部裝置3002連接。 而且，於該插座插入内建具有NF C功能之NF C晶片之功 能擴充卡l〇ln，以構成半導體裝置。 藉由於插座插入功能擴充卡10 In，NFC晶片連接於SIM 用安全微電腦晶片1901η，該SIM用安全微電腦晶片1901η 連接於ISO端子之I/O端子（C7)。 而且，外部裝置3002含有用以與其他外部裝置通訊之非 接觸卡用RF部、及連接於該RF部之主控MPU。該主控 MPU與I/O端子係藉由插座插入外部裝置，而經由插座之 ISO端子連接。藉此，NFC晶片與非接觸卡用RF部會連 137653.doc -27- 200945680 接。 NFC晶片對其他外部裝置發送信號之情況，SIM用安全 微電腦晶片190 In係將NFC晶片之信號，轉換為IS07816上 所支援之NFC控制指令。SIM用安全微電腦晶片1901η係將 該NFC控制指令追加於全體指令中，經由I/O端子及外部裝 置3002之主控MPU送至非接觸卡用RF部。從非接觸卡用 RF部經由非接觸用天線，將信號予以無線通訊。 藉此可實現NFC功能。此外，從其他外部裝置接收信號 之情況，則成為與前述發送之情況相反之處理。 該圖30(a)之情況下，進行資料之收發係藉由利用NFC控 制指令，而可使用既有之I/O線（插座之ISO端子與外部裝 置之連接線），由於不需要新布線，因此具有電路不會變 得複雜之效果。 接著，說明關於圖30(b)。圖30之（b)與（a)之差異之概要 如下。 内建於功能擴充卡l〇ln之NFC晶片係不經由SIM用安全 微電腦晶片190In而與ISO端子之SWP端子（C6)連接。 NFC晶片對其他外部裝置發送信號之情況，NFC晶片經 由SWP端子，將信號送至非接觸卡用RF部，藉此可實現 NFC功能。 此外，從其他外部裝置接收信號之情況，則成為與前述 發送之情況相反之處理。（b)之情況即使於例如SIM用安全 微電腦晶片1901η不具有（不適合）SWP端子功能時，仍可藉 由内建於功能擴充卡之NFC晶片具有與SWP端子之收發功 137653.doc -28 - 200945680 能來實現。 總言之，SIM用安全微電腦晶片1901η無法經由SWP端子 收發信號之情況，仍可收發NFC信號。 接著，說明關於圖31(a)。以下為圖31(a)與圖30(a)之差 . 異。 内建於功能擴充卡1〇1η之NFC晶片係不經由SIM用安全 微電腦晶片1901η而與ISO端子之USB端子（C4及C8)連接。 NFC晶片對其他外部裝置發送信號之情況，NFC晶片經 由USB端子及外部裝置之轉換I/F，將信號送至非接觸卡用 RF部，藉此可實現NFC功能。 此外，從其他外部裝置接收信號之情況，則成為與前述 發送之情況相反之處理。圖31(a)之情況係具有可根據USB 規格來收發資料之效果。 接著，說明關於圖31(b)。以下為圖31(b)與圖30(b)之差 異。 φ 内建於功能擴充卡l〇ln之NFC晶片係不經由SIM用安全 微電腦晶片1901η而與ISO端子之SWP端子（C6)連接。進一 步而言，NFC晶片亦連接於有別於ISO端子之RFU1端子 - 3004、RFU2端子 3003。 . 此外，該情況下，於插座必須設置用以與外部裝置連接 之RFU1端子、RFU2端子。RFU1端子及RFU2端子設置為 夾於圖3之ISO端子112與含有倒角部之短邊之間，或設置 為炎於ISO端子與兩短邊之間均可。 NFC晶片對其他外部裝置發送信號之情況，NFC晶片經 137653.doc -29- 200945680 由SWP端子、RFU1端子及RFU2端子，將信號送至非接觸 卡用RF部’藉此可實現nfc功能。 此外’從其他外部裝置接收信號之情況’則成為與前述 2送之情況相反之處理。圖31(b)之情況具有可分別組合指 令、資料、時鐘該類信號，來收發資料之效果。 例如將各端子分別分配給指令用、資料用、時鐘用，或 將1個端子作為發送用，並將另丨個端子作為接收用均可。 而且，收發資料時，利用連接於swp端子、RFU1端 子、RFU2端子各個之3條布線全部，或以3條中之任2條來 進行均可。 如以上，藉由於外部裝置，將SIM卡外形插座插入有内 建NFC晶片之功能擴充卡之半導體裝置予以插入，藉此可 與其他外部裝置通訊。 於實施型態14採用圖丨所示之構造之情況下，功能擴充 卡係於緣部102之兩面，沿著插入方向配置複數卡端子 104 ° 由於設置RFU1端子或RFU2端子而端子數增加之情況 下，由於可於2個邊配置卡端子，因此即使端子增加，仍 可容易配置。 因此，即使是端子數增加之情況，仍可容易連接插座與 卡片。 對半導體裝置（SIM卡外形插座1〇6n及功能擴充卡1〇ln) 之電源供給會有從外部裝置供給之情況。該情況下，藉由 SIM卡外形插座10611之18〇端子進行。電源電壓成為 137653.doc -30- 200945680 VCC(Cl)端子，接地電壓成為VSS(C5)端子。圖21所示之 SIM用安全微電腦晶片與功能擴充卡以並聯連接於ISO端 子之情況，對SIM用安全微電腦晶片與功能擴充卡分別個 別地供給電源。The external device 3002 herein refers to, for example, a mobile phone or other portable electronic device. The external device 3002 includes an area in which the SIM card outline socket 106n is inserted, and includes an RF unit for contactless card for communicating with other external devices. Fig. 30 (a) shows an example in which the external device 3002 is connected to the SIM card outline socket 106n, and the NFC function is realized by the I/O terminal (C7) of the ISO terminal. 137653.doc -26- 200945680 Fig. 30(b) shows an example in which the external device 3002 is connected to the SIM card outline socket 106n, and the NFC function is realized by the SWP terminal (C6) of the ISO terminal. Fig. 3 (a) is an example in which the external device 3002 is connected to the SIM card outline socket 106n, and the NFC function is realized by the USB terminals (C4 and C8) of the ISO terminal. Fig. 3 (b) shows an example in which the external device 3002 is connected to the SIM card outline socket 106n, and the NFC function is realized by the SWP terminal (C6) of the ISO terminal and the RFU1 terminal and the RFU2 terminal which are different from the ISO terminal. As shown in Fig. 30 (a), the SIM card outline socket 106n includes a secure microcomputer chip 1901n for SIM and an ISO terminal. The SIM card form factor socket 106 is incorporated (inserted) into the external device 3002, and can be wirelessly communicated via the normal baseband RF unit and the baseband antenna mounted on the external device 3002. At this time, it is connected to the external device 3002 via an ISO terminal which is an external connection terminal provided in the SIM card socket 610n. Further, a function expansion card lnln having an NF C-chip having an NF C function is inserted into the socket to constitute a semiconductor device. The NFC chip is connected to the SIM safe microcomputer chip 1901n by the socket insertion function expansion card 10 In, and the SIM safety microcomputer chip 1901 n is connected to the ISO terminal I/O terminal (C7). Further, the external device 3002 includes a non-contact card RF unit for communicating with other external devices, and a master MPU connected to the RF unit. The master MPU and the I/O terminal are connected to the external device through the socket, and are connected via the ISO terminal of the socket. Thereby, the NFC chip and the non-contact card RF unit are connected to 137653.doc -27- 200945680. When the NFC chip transmits a signal to another external device, the SIM security microcomputer chip 190 In converts the signal of the NFC chip into an NFC control command supported by the IS07816. The SIM safety microcomputer chip 1901 η adds the NFC control command to the entire command, and sends it to the non-contact card RF unit via the I/O terminal and the main control MPU of the external device 3002. The signal is wirelessly communicated from the non-contact card RF unit via the non-contact antenna. This allows NFC functionality to be achieved. Further, when a signal is received from another external device, it is a process opposite to the case of the above transmission. In the case of FIG. 30(a), the data is transmitted and received by using the NFC control command, and the existing I/O line (the connection line between the ISO terminal of the socket and the external device) can be used, since no new cloth is needed. The line, therefore, has the effect that the circuit does not become complicated. Next, description will be made regarding FIG. 30(b). The outline of the difference between (b) and (a) of Fig. 30 is as follows. The NFC chip built in the function expansion card is connected to the SWP terminal (C6) of the ISO terminal without via the SIM safety microcomputer chip 190In. When the NFC chip transmits a signal to another external device, the NFC chip sends the signal to the RF unit for the contactless card via the SWP terminal, thereby realizing the NFC function. Further, when a signal is received from another external device, it is a process opposite to the case of the above transmission. (b) In the case where, for example, the SIM-based secure microcomputer chip 1901n does not have (unsuitable) the SWP terminal function, the NFC chip built into the function expansion card can be transceived with the SWP terminal 137653.doc -28 - 200945680 can be realized. In summary, the SIM for the secure microcomputer chip 1901n cannot send and receive signals via the SWP terminal, and can still send and receive NFC signals. Next, the description will be given with respect to Fig. 31 (a). The difference between Fig. 31 (a) and Fig. 30 (a) is as follows. The NFC chip built in the function expansion card 1〇1η is connected to the USB terminals (C4 and C8) of the ISO terminal without via the SIM safety microcomputer chip 1901n. When the NFC chip transmits a signal to another external device, the NFC chip transfers the signal to the RF unit of the contactless card via the I/F of the USB terminal and the external device, thereby realizing the NFC function. Further, when a signal is received from another external device, it is a process opposite to the case of the above transmission. The case of Fig. 31 (a) has an effect of transmitting and receiving data according to the USB specification. Next, description will be made regarding FIG. 31(b). The difference between Fig. 31 (b) and Fig. 30 (b) is shown below. The NFC chip built into the function expansion card 〇ln is connected to the SWP terminal (C6) of the ISO terminal without via the SIM safety microcomputer chip 1901n. Further, the NFC chip is also connected to the RFU1 terminal - 3004 and RFU2 terminal 3003 which are different from the ISO terminal. Further, in this case, the RFU1 terminal and the RFU2 terminal to be connected to the external device must be provided in the socket. The RFU1 terminal and the RFU2 terminal are disposed between the ISO terminal 112 of Fig. 3 and the short side including the chamfered portion, or may be disposed between the ISO terminal and the two short sides. When the NFC chip transmits a signal to another external device, the NFC chip transmits the signal to the RF unit for the contactless card by the SWP terminal, the RFU1 terminal, and the RFU2 terminal via 137653.doc -29-200945680, whereby the nfc function can be realized. Further, the case of "receiving a signal from another external device" is the reverse of the case of the above-mentioned two-feed. The case of Fig. 31(b) has the effect of separately combining signals such as instructions, data, and clocks to transmit and receive data. For example, each terminal can be assigned to an instruction, a data, or a clock, or one terminal can be used for transmission, and another terminal can be used for reception. In addition, when transmitting and receiving data, all three wirings connected to the swp terminal, the RFU1 terminal, and the RFU2 terminal may be used, or any two of the three wires may be used. As described above, by the external device, the SIM card form factor socket is inserted into the semiconductor device having the function expansion card in which the NFC chip is built, thereby being able to communicate with other external devices. In the case where the embodiment 14 is configured as shown in the figure, the function expansion card is attached to both sides of the edge portion 102, and the plurality of card terminals 104 are arranged along the insertion direction. The number of terminals is increased by the RFU1 terminal or the RFU2 terminal. In the following, since the card terminals can be arranged on two sides, even if the terminals are increased, they can be easily arranged. Therefore, even if the number of terminals is increased, the socket and the card can be easily connected. The power supply to the semiconductor device (SIM card outline socket 1〇6n and function expansion card 1〇ln) may be supplied from an external device. In this case, it is performed by the 18〇 terminal of the SIM card outline socket 10611. The power supply voltage becomes 137653.doc -30- 200945680 VCC (Cl) terminal, and the ground voltage becomes the VSS (C5) terminal. In the case where the SIM secure microcomputer chip and the function expansion card shown in Fig. 21 are connected in parallel to the ISO terminal, the SIM secure microchip and the function expansion card are separately supplied with power.

而且，圖23所示之功能擴充卡經由SIM用安全微電腦而 與ISO端子串聯地連接之情況，對功能擴充卡之電源供給 係由SIM用安全微電腦控制。該情況下，SIM用安全微電 腦可因應必要來對功能擴充卡供給電源或不供給，可節約 消耗電力。 進一步亦可使半導體裝置保有電源。該情況係於功能擴 充卡搭載電池或電容器，對半導體裝置内之半導體晶片或 其他零件進行電源供給。 以上，根據其實施型態具體說明由本發明者所實現之發 明，但本發明不限定於前述實施型態，當然可於不脫離其 要旨之範圍内予以各種變更。而且，亦可將實施型態1〜14 分別適宜地組合。而且，僅取出各實施型態之一部分並適 宜地組合亦可。 [產業上之可利用性] 本發明可於1C卡、電子機器等之製造業利用。 【圖式簡單說明】 圖1係於按照本發明之實施型態1之插座及卡片，表示其 結構之圖；（a)係表示功能擴充卡，（b)係表示SIM卡外形插 座，（c)係表示功能擴充卡已插入SIM卡外形插座之狀態之 A-A剖面圖； 137653.doc -31 - 200945680 圖2係於按照本發明之實施型態丨之插座及卡片表示其 尺寸之圖；（a)係表示功能擴充卡已插入SIM卡外形插座之 狀態之A-A剖面圖，（b)係表示功能擴充卡之俯視圖，（c)係 表示SIM卡外形插座之B部放大圖； 圖3係於按照本發明之實施型態丨之插座及卡片，從背面 侧觀看SIM卡外形插座、卡端子、L(JA封裝體之圖； 圖4係於按照本發明之實施型態丨之插座及卡片，表示功 旎擴充卡已插入SIM卡外形插座之狀態之剖面圖之圖；（&) 係表示無開口部之情況，（b)係表示有開口部之情況； 圖5係於按照本發明之實施型態丨之插座及卡片，表示於 SIM卡外形插座i〇6插入功能擴充卡1〇1之狀況之圖；（勾係 表示插入前，（b)係表示插入中，（c)係表示插入後； 圖6係於按照本發明之實施型態丨之插座及卡片，表示連 接ISO编子、接觸端子與插座端子之金屬架之構造之一例 之圖； 圖7係於按照本發明之實施型態2之插座及卡片，表示於 SIM卡外形插座黏貼有貼紙（seai)之結構之圖；（a)、（匕）、 (c)係表示黏貼貼紙前之狀態，⑷、⑷、⑴係表示黏貼貼 紙後之狀態； 圖8係於按照本發明之實施型態3之插座及卡片，表示於 SIM卡外形插座插入功能擴充卡之狀況之圖；（幻係表示插 入前，（b)係表示插入中，（匀係表示插入後； 圖9係於按照本發明之實施型態4之插座及卡片，表示其 結構之圖；（a)係從背面側觀看之圖，（1))係從正面側觀看 137653.doc -32- 200945680 之圖； 圖10係於按照本發明之實施型態4之插座及卡 η 表示 於SIM卡外形插座插入功能擴充卡之狀況之圖；（岣係表示 插入前’（b)係表示插入中’（匀係表示插入後； - 圖11係於按照本發明之實施型態5之插座及卡片，表示 其結構之圖；（a)係從正面侧觀看之圖，（b)係從背面側觀 看之圖； φ 圖12係於按照本發明之實施型態5之插座及卡片，表示 於SIM卡外形插座插入功能擴充卡之狀況之圖；（句係表示 插入前，（b)係表示插入中，（勾係表示插入後； 圖13係於按照本發明之實施型態5之插座及卡片，表示 ISO端子與插座端子之結線例之圖； 圖14係於按照本發明之實施型態6之插座及卡片，表示 其結構之圖； 圖15係表示按照本發明之實施型態7之功能擴充卡之外 ❿ 形之圖；⑷為俯視圖，（b)為正視圖，（c)為背面圖，（d)為 側面圖； 圖16係表示按照本發明之實施型態8之SIM卡外形插座 - 之結構之圖；（a)係從正面侧觀看外觀之圖，（b)係從正面 側觀看構造之圖’（c)係從正面側觀看内容物之圖，（d)係 從为面側觀看外觀之圖，（e)係從背面侧觀看構造之圖， (f)係從背面側觀看内容物之圖； 圖17係表示按照本發明之實施型態8之SIM卡外形插座 之組裝方法之圖； 137653.doc -33· 200945680 圖18係表示按照本發明之實施型態7之功能擴充卡之端 子分配例及外形之圖；（a)為俯視圖，（b)為背面圖，（c)為 剖面圖； 圖19係於按照本發明之實施型態8之SIM卡外形插座， 表示附ISO端子SIM模組之端子分配例及外形之圖；（a)為 俯視圖，（b)為背面圖，（c)為剖面圖； 圖20係於按照本發明之實施型態9之插座及卡片，表示 SIM卡外形插座及功能擴充卡之結構之圖； 圖21係於按照本發明之實施型態10之插座及卡片，表示 功能擴充卡之卡端子連接於ISO端子之例之圖；（a)係以搭 載有NFC晶片之功能擴充卡來將NFC之功能予以功能擴充 之例，（b)係表示以搭載有安全微電腦晶片之功能擴充卡來 追加有別與SIM之安全微電腦之功能之例； 圖22係於按照本發明之實施型態10之插座及卡片，表示 端子之分配例之圖； 圖23係於按照本發明之實施型態11之插座及卡片，表示 功能擴充卡之卡端子經由SIM用安全微電腦晶片連接於 ISO端子之例之圖；（a)係以搭載有NFC晶片之功能擴充卡 來將NFC之功能予以功能擴充之例，（b)係表示以搭載有安 全微電腦晶片之功能擴充卡來追加有別與SIM之安全微電 腦之功能之例； 圖24係於按照本發明之實施型態11之插座及卡片，表示 端子之分配例之圖； 圖25係於按照本發明之實施型態12之插座及卡片，表示 137653.doc -34- 200945680 熱插拔（Hot Insertion)對策之一例之圖； 圖26係於按照本發明之實施型態12之插座及卡片，表示 檢出卡插入之開關之結構之一例之圖；（a)係表示卡片未插 入時，（b)係表示卡片插入時； • 圖27係於按照本發明之實施型態13之插座及卡片，表示 熱插拔（Hot Insertion)對策之其他一例之圖； 圖28係於按照本發明之實施型態13之插座及卡片，表示 卡插入檢出機構之一例之圖； 〇 圖29係於按照本發明之實施型態13之插座及卡片，表示 卡插入檢出機構之一例之圖；係表示卡片完全插入之狀 態’（b)係表示卡片未完全插入之狀態； 圖30係於按照本發明之實施型態14之插座及卡片，將 SIM卡外形插座組入外部裝置來實現nfC功能之方法之區 塊圖。（a)係於外部裝置與SIM卡外形插座之連接，利用 ISO端子之1/0端子（C7)來實現NFC功能之例；（b)係於外部 φ 裝置與SIM卡外形插座之連接，利用ISO端子之SWP端子 (C6)來實現NFC功能之例；及 圖3 1係於按照本發明之實施型態14之插座及卡片，將 • SIM卡外形插座組入外部裝置來實現NFC功能之方法之區 • 塊圖。（a)係於外部裝置與SIM卡外形插座之連接，利用 ISO端子之USB端子（C4及C8)來實現NFC功能之例；（b)係 於外部裝置與SIM卡外形插座之連接，利用ISO端子之 SWP端子（C6)及有別於ISO端子所設置之RFU1端子、RFU2 端子來實現NFC功能之例。 137653.doc -35- 200945680 【主要元件符號說明】 101, 101a, 101b, 101c, 101d5 功能擴充卡 lOle, 101h, 10Π, 101η 102 緣部 103 中央部分 104, 104a, 104b, 104c, 104e, 卡端子 104h 105 凹口 106, 106a, 106b, 106c, 106d, SIM卡外形插座 106f, 106g, 106h, 106k, 106m, 106n 107, 107f 卡用插槽（區域） 108, 108a, 108b, 108c, 108f, 插座端子 108g, 108m, 108n 109 LGA封裝體 110, llOf, llOg 接觸端子 111, lllf, lllg 凹部 112, 112b, 112c, 112c!, 112e, MO端子 112f, 112g, 112h, C1-C8 113, 113d 開口部 114, 114b, 114c 倒角部 115 導引部 201, 202 突起 301, 301f, 301g 封裝體端子 137653.doc -36- 200945680Further, the function expansion card shown in Fig. 23 is connected in series to the ISO terminal via the SIM safety microcomputer, and the power supply to the function expansion card is controlled by the SIM safety microcomputer. In this case, the SIM safety micro-computer can supply power to the function expansion card or not, as needed, saving power consumption. Further, the semiconductor device can be kept powered. In this case, the battery or capacitor is mounted on the function expansion card to supply power to the semiconductor wafer or other components in the semiconductor device. The invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the invention. Further, the embodiments 1 to 14 may be appropriately combined. Further, it is also possible to take out only a part of each embodiment and suitably combine them. [Industrial Applicability] The present invention can be utilized in manufacturing industries such as 1C cards and electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a structure of a socket and a card according to an embodiment 1 of the present invention; (a) showing a function expansion card, and (b) showing a SIM card appearance socket, (c) (A) is a cross-sectional view showing the state in which the function expansion card has been inserted into the SIM card socket; 137653.doc -31 - 200945680 FIG. 2 is a diagram showing the size of the socket and the card according to the embodiment of the present invention; ) is an AA cross-sectional view showing the state in which the function expansion card has been inserted into the SIM card socket, (b) is a top view showing the function expansion card, and (c) is an enlarged view of the B portion of the SIM card socket; The socket and the card of the embodiment of the present invention are viewed from the back side of the SIM card socket, the card terminal, and the L (the diagram of the JA package; FIG. 4 is a socket and a card according to an embodiment of the present invention, A diagram of a cross-sectional view of a state in which a power expansion card has been inserted into a form factor socket of a SIM card; (&) indicates a case where there is no opening portion, (b) indicates a case where an opening portion is provided; and FIG. 5 is an embodiment according to the present invention. Type socket and card, indicated in SIM Figure 2 shows the state of the card expansion socket i〇6 inserted into the function expansion card 1〇1; (the hook indicates the insertion, (b) indicates the insertion, and (c) indicates the insertion; Figure 6 is the implementation according to the present invention. FIG. 7 is a diagram showing an example of a structure of a metal frame connecting an ISO clip, a contact terminal and a socket terminal; FIG. 7 is a socket and a card according to an embodiment 2 of the present invention, which is shown on a SIM card. The shape socket is attached with a structure of a sticker (seai); (a), (匕), (c) indicates the state before the sticker is attached, and (4), (4), (1) indicates the state after the sticker is attached; The socket and the card of the embodiment 3 of the present invention are shown in the state in which the function card of the SIM card is inserted into the function expansion card; (the phantom indicates the insertion, and (b) indicates the insertion, (the symmetry indicates the insertion; 9 is a diagram showing the structure of the socket and the card according to the embodiment 4 of the present invention; (a) is a view from the back side, and (1) is viewed from the front side 137653.doc -32 - 200945680 Figure 10 is a socket and card according to an embodiment 4 of the present invention. η represents a state in which the SIM card form socket is inserted into the function expansion card; (岣 indicates before insertion '(b) indicates insertion) (mean indicates after insertion; - Figure 11 is in accordance with an embodiment of the present invention 5 socket and card, showing the structure of the figure; (a) is a view from the front side, (b) is a view from the back side; φ Figure 12 is a socket according to the embodiment 5 of the present invention Card, which is a diagram showing the state in which the function card is inserted into the SIM card socket; (the sentence indicates the insertion, (b) indicates the insertion, (the hook indicates the insertion; Figure 13 is the embodiment according to the present invention). FIG. 14 is a view showing a structure of a socket and a card according to an embodiment 6 of the present invention, and FIG. 15 is a view showing a configuration according to the present invention; FIG. Figure 7 is a top view, (b) is a front view, (c) is a rear view, (d) is a side view; Figure 16 is a view showing an embodiment according to the present invention. 8 SIM card shape socket - the structure of the structure; (a) from (b) is a view of the structure viewed from the front side, (c) is a view of the contents viewed from the front side, (d) is a view of the appearance viewed from the front side, and (e) is a view from the front side. FIG. 17 is a view showing a method of assembling a SIM card outline socket according to an embodiment 8 of the present invention; 137653.doc -33· 200945680 Figure 18 is a view showing a terminal distribution example and an outline of a function expansion card according to an embodiment 7 of the present invention; (a) is a plan view, (b) is a rear view, and (c) is a cross-sectional view; The SIM card outline socket of the embodiment 8 of the present invention is a diagram showing a terminal distribution example and an outer shape of an ISO terminal SIM module; (a) is a plan view, (b) is a rear view, and (c) is a cross-sectional view; 20 is a diagram showing the structure of a SIM card socket and a function expansion card according to the socket and card according to the embodiment 9 of the present invention; FIG. 21 is a socket and a card according to the embodiment 10 of the present invention, showing the function expansion. A diagram of a card terminal connected to an ISO terminal; (a) is equipped with an NFC crystal The function expansion card is used to expand the function of the NFC function, and (b) shows the function of adding the function expansion card of the secure microcomputer chip to the function of the secure microcomputer of the SIM. FIG. 22 is based on this. The socket and the card of the embodiment 10 of the invention show a diagram of the distribution example of the terminal; and FIG. 23 is the socket and the card according to the embodiment 11 of the present invention, and the card terminal of the function expansion card is connected via the secure microcomputer chip of the SIM. (a) is an example in which the function of the NFC is expanded by a function expansion card equipped with an NFC chip, and (b) is a function expansion card equipped with a secure microcomputer chip. FIG. 24 is a diagram showing a distribution example of a terminal according to an embodiment 11 of the present invention; FIG. 25 is a diagram showing a socket according to an embodiment 12 of the present invention; And card, showing 137653.doc -34-200945680, a diagram of an example of a hot insertion (Hot Insertion) countermeasure; FIG. 26 is a socket and card according to an embodiment 12 of the present invention, showing a checkout card A diagram showing an example of the structure of the switch; (a) indicates that the card is not inserted, (b) indicates when the card is inserted; • Fig. 27 is a socket and card according to the embodiment 13 of the present invention, indicating hot plug FIG. 28 is a view showing an example of a card insertion detecting mechanism according to an embodiment 13 of the present invention; FIG. 29 is a view showing an embodiment of the card insertion detecting mechanism; The socket and the card of the type 13 are diagrams showing an example of the card insertion detecting mechanism; the state indicating that the card is completely inserted' (b) indicates the state in which the card is not fully inserted; and FIG. 30 is the embodiment according to the present invention. 14 sockets and cards, block diagrams of the method of integrating the SIM card shape socket into an external device to implement the nfC function. (a) is an example in which the external device is connected to the SIM card socket, and the NFC function is realized by the 1/0 terminal (C7) of the ISO terminal; (b) the connection between the external φ device and the SIM card socket is utilized. Example of implementing the NFC function by the SWP terminal (C6) of the ISO terminal; and FIG. 31 is a method for implementing the NFC function by assembling the SIM card form socket into an external device according to the socket and the card of the embodiment 14 of the present invention. Area • Block diagram. (a) is an example in which an external device is connected to a SIM card socket, and an NFC function is realized by using a USB terminal (C4 and C8) of the ISO terminal; (b) is connected to an external device and a SIM card socket, using ISO The SWP terminal (C6) of the terminal and the RFU1 terminal and RFU2 terminal set different from the ISO terminal are used to implement the NFC function. 137653.doc -35- 200945680 [Description of main component symbols] 101, 101a, 101b, 101c, 101d5 Function expansion card lOle, 101h, 10Π, 101η 102 Edge 103 central part 104, 104a, 104b, 104c, 104e, card terminal 104h 105 notch 106, 106a, 106b, 106c, 106d, SIM card outline socket 106f, 106g, 106h, 106k, 106m, 106n 107, 107f card slot (area) 108, 108a, 108b, 108c, 108f, socket Terminals 108g, 108m, 108n 109 LGA package 110, llOf, llOg contact terminal 111, lllf, lllg recess 112, 112b, 112c, 112c!, 112e, MO terminal 112f, 112g, 112h, C1-C8 113, 113d opening 114, 114b, 114c chamfered portion 115 guiding portion 201, 202 protrusion 301, 301f, 301g package terminal 137653.doc -36- 200945680

601 端子架 701, 702, 703 貼紙 1601 附ISO端子SIM模組 1801 半導體晶片 1802, 1802a 模製樹脂 1803, 1803a 金屬線接合部 1804, 1804a, 1804g 基板布線 1 805, 1805a, 1805g 基板 1901, 1901h, 1901n SIM用安全微電腦晶片 2501 開關 2502 控制信號 3002 外部裝置 3003 RFU2端子 3004 RFU1端子 RFU1, RFU2 功能擴充端子601 terminal frame 701, 702, 703 sticker 1601 with ISO terminal SIM module 1801 semiconductor wafer 1802, 1802a molding resin 1803, 1803a wire bonding portion 1804, 1804a, 1804g substrate wiring 1 805, 1805a, 1805g substrate 1901, 1901h , 1901n SIM safe microcomputer chip 2501 switch 2502 control signal 3002 external device 3003 RFU2 terminal 3004 RFU1 terminal RFU1, RFU2 function expansion terminal

137653.doc 37-137653.doc 37-

Claims (1)

200945680 七、申請專利範圍： 1· 一種插座，其係含有： 成對之第1及第2邊；及 第3邊’其係與該第1及第2邊呈正交； 於主面含有可從前述第3邊，將外形尺寸小於前述插 座之卡片插入前述第丨與第2邊之間之區域； 並含有：第4邊，其係於前述第1與第2邊之間，從第3 邊沿著第1邊設置； 第5邊’其係於前述第1與第2邊之間，從第3邊沿著第 2邊設置；及 複數插座端子，其係連接於分別沿著前述第4邊及第5 邊所設置之前述卡片； 前述插座端子係設置為可夾著前述卡片之緣部； 於與前述插座之主面相對向之背面，含有可與外部裝 置連接之外部連接端子； 前述外部連接端子係與前述插座端子連接。 2. 如請求項1之插座，其中 前述插座之外形尺寸為SIM卡之外形尺寸； 前述外部連接端子為IS〇端子。 3. 如請求項2之插座，其中 含有：第1導引部，其係於前述主面上，設置為由前 述第1邊及第4邊炎著；及 第2導引部，其係於前述主面上，設置為由前述第2邊 及第5邊夾著； 137653.doc 200945680 於前述第1及第2導引部分別含有複數開口部 於前述開口部設置有前述插座端子。 4. 5. 6. 如請求項1至3中任一項之插座，其中 前述插座端子 搭載有半導體晶片；該半導體晶片係與 或前述外部連接端子連接。 如請求項4之插座，其中 月ij述半導體晶片係用於SIM之微電腦晶片 如請求項5之插座，其中 含有封裝體，其係内建有前述微電腦晶片 没置有封聚 前述封裝體係於與其主面相對向之背面， 體端子； 前述插座含有凹部，其係用以搭載前述封裝體； 於前述凹部之底部設置有接觸端子； 前述封裝體端子與前述接觸端子相連接。 7.如請求項6之插座，其中 iso端子係排列成由前述第4邊及第5邊夾著； 較接近前述第4邊而非前述第5邊之IS〇端子係連接於 沿著前述第4邊排列之前述插座端子； 較接近前述第5邊而非前述第4邊之IS〇端子係連接於 沿著前述第5邊排列之前述插座端子。 8.如請求項1之插座，其中 前述插座係檢測插入之前述卡片有無插入。 9· 一種半導體裝置，其係包含： 插座，其含有：複數外部連接端子，其係用以與外部 137653.doc 200945680 裝置連接； 端子收發信號來 微電腦晶片’其係藉由與該外部連接 進行第1資料處理；及 複數插座々而子，其係可發送來自前述微電腦晶片之信 號或向前述微電腦晶片接收信號； 複數卡端子，其係連接於前述複數插座端子·及 卡片，其係含有藉由經前述複數卡端子與前述微電腦 晶片收發信號，來進行第2資料處理之半導體晶片，外 形尺寸比前述插座小而插入前述插座。 10. —種半導體裝置，其係包含： 插座，其含有：複數外部連接端子，其係用以與外部 裝置連接； 微電腦晶片，其係藉由與該外部連接端子收發信號來 進行第1資料處理；及 複數插座端子，其係與前述外部連接端子連接； 複數卡端子，其係連接於前述複數插座端子；及 2片，其係含有藉由與前述卡端子收發信號，來對於 與酌述外邛裝置之信號進行第2資料處理之半導體晶 片，外幵；尺寸比插座小而插入前述插S，前述插座端子 與卡端子相連接。 11.如吻求項9或ίο中任一項之半導體裝置，其中 前述插座之外形尺寸為SIM卡之外形尺寸； 前述外部連接端子為ISO端子； 别述半導體晶片係具有NFC功能之晶片。 137653.doc 200945680 12_如請求項11之半導體裝置，其中 含有有別於前述ISO端子之端子； 該端子係與前述具有NFC功能之半導體晶片連接。 I3·如請求項U之半導體裝置，其中 於前述卡片之緣部設置有前述卡端子； 前述插座端子係設置為可炎著前， 片之緣部。 137653.doc200945680 VII. Patent application scope: 1. A socket comprising: a pair of first and second sides; and a third side 'which is orthogonal to the first and second sides; From the third side, a card having an outer size smaller than the socket is inserted into a region between the second and second sides; and a fourth side is provided between the first and second sides, and from the third Provided along the first side; the fifth side 'between the first and second sides, and the third side along the second side; and a plurality of socket terminals connected to the fourth side respectively And the card provided on the fifth side; the socket terminal is disposed to sandwich the edge of the card; and has an external connection terminal connectable to an external device on a back surface opposite to the main surface of the socket; The connection terminal is connected to the aforementioned socket terminal. 2. The socket of claim 1, wherein the outer size of the socket is an outer dimension of the SIM card; and the external connection terminal is an IS〇 terminal. 3. The socket of claim 2, comprising: a first guiding portion on the main surface, which is provided by the first side and the fourth side; and a second guiding portion The main surface is provided with the second side and the fifth side. The 137653.doc 200945680 includes the plurality of openings in the first and second guiding portions, and the socket terminal is provided in the opening. 4. The socket of any one of claims 1 to 3, wherein the socket terminal is mounted with a semiconductor wafer; the semiconductor wafer is connected to the external connection terminal. The socket of claim 4, wherein the semiconductor chip is used for a microcomputer chip of the SIM, such as the socket of claim 5, which comprises a package, wherein the microcomputer chip is built without the above-mentioned package system The main surface faces the back surface of the body terminal; the socket includes a recess for mounting the package; a contact terminal is disposed at a bottom of the recess; and the package terminal is connected to the contact terminal. 7. The socket of claim 6, wherein the iso terminal is arranged to be sandwiched by the fourth side and the fifth side; and the IS〇 terminal closer to the fourth side than the fifth side is connected along the foregoing The socket terminal arranged in four sides; the IS terminal connected to the fifth side instead of the fourth side is connected to the socket terminal arranged along the fifth side. 8. The socket of claim 1, wherein said socket detects the presence or absence of insertion of said card inserted. 9. A semiconductor device, comprising: a socket, comprising: a plurality of external connection terminals for connecting to an external 137653.doc 200945680 device; and a terminal for transmitting and receiving signals to the microcomputer chip by performing a connection with the external connection 1 data processing; and a plurality of sockets, which can transmit signals from the microcomputer chip or receive signals from the microcomputer chip; a plurality of card terminals connected to the plurality of socket terminals and cards, The semiconductor wafer subjected to the second data processing by transmitting and receiving signals from the microcomputer chip via the plurality of card terminals has a smaller outer shape than the socket and is inserted into the socket. 10. A semiconductor device, comprising: a socket, comprising: a plurality of external connection terminals for connecting to an external device; and a microcomputer chip for performing first data processing by transmitting and receiving signals with the external connection terminal And a plurality of socket terminals connected to the external connection terminals; a plurality of card terminals connected to the plurality of socket terminals; and two pieces containing signals transmitted and received by the card terminals, and The semiconductor chip of the second device is processed by the signal of the device, and the outer casing is inserted into the plug S, and the socket terminal is connected to the card terminal. The semiconductor device according to any one of the preceding claims, wherein the outer size of the socket is an outer dimension of the SIM card; the external connection terminal is an ISO terminal; and the semiconductor wafer is an NFC-enabled wafer. The semiconductor device of claim 11, which comprises a terminal different from the aforementioned ISO terminal; the terminal is connected to the aforementioned semiconductor wafer having an NFC function. The semiconductor device of claim U, wherein the card terminal is provided at an edge portion of the card; and the socket terminal is provided at an edge portion of the sheet before the inflammation. 137653.doc
TW098101084A 2008-03-24 2009-01-13 Socket and semiconductor device TW200945680A (en)

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CN202840165U (en) * 2012-10-15 2013-03-27 中兴通讯股份有限公司 Subscriber identity module (SIM) card compatible device and associated terminal
CN103646879B (en) * 2013-12-04 2016-04-27 江苏长电科技股份有限公司 A kind of manufacture method of detachable, assemblnig SIP encapsulating structure

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