JP2003078435A - Radio communication equipment - Google Patents
Radio communication equipmentInfo
- Publication number
- JP2003078435A JP2003078435A JP2001266427A JP2001266427A JP2003078435A JP 2003078435 A JP2003078435 A JP 2003078435A JP 2001266427 A JP2001266427 A JP 2001266427A JP 2001266427 A JP2001266427 A JP 2001266427A JP 2003078435 A JP2003078435 A JP 2003078435A
- Authority
- JP
- Japan
- Prior art keywords
- wireless communication
- communication device
- unit
- circuit
- antenna coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、無線通信装置に関
し、特に、基板上にその回路部とアンテナコイルが存在
している無線通信装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wireless communication device, and more particularly to a wireless communication device having a circuit portion and an antenna coil on a substrate.
【０００２】[0002]
【従来の技術】情報の機密性の面からＩＣカードが次第
に普及されつつ中、近年では、読み書き装置（以下リー
ダライタと言う）と接触せずに情報の授受を行う非接触
型のＩＣカードが提案されている。中でも、外部のリー
ダライタとの信号交換を、あるいは信号交換と電力供給
とを電磁波により行う方式のものが一般的である。一
方、データを搭載したＩＣを、アンテナコイルと接続し
た、シート状ないし札状の非接触式のＩＣタグが、近
年、種々提案され、商品や包装箱等に付け、万引き防
止、物流システム等に利用されるようになってきた。そ
して、無線通信装置である、非接触型のＩＣカードや非
接触式ＩＣタグ等の非接触式データキャリア装置は、従
来、その信号の交信を、専用のリーダライタを用いて行
なっていた。2. Description of the Related Art IC cards are becoming more and more popular in terms of confidentiality of information, and in recent years, non-contact type IC cards that exchange information without contacting a reading / writing device (hereinafter referred to as a reader / writer) have become available. Proposed. Among them, a system in which signals are exchanged with an external reader / writer, or signals are exchanged and power is supplied by electromagnetic waves is generally used. On the other hand, in recent years, various sheet-shaped or bill-shaped non-contact type IC tags in which an IC carrying data is connected to an antenna coil have been proposed and attached to products, packaging boxes, etc. to prevent shoplifting, logistics systems, etc. It has come to be used. In a non-contact type data carrier device such as a non-contact type IC card or a non-contact type IC tag which is a wireless communication device, conventionally, a signal is exchanged using a dedicated reader / writer.
【０００３】最近では、インターフェース部と、機能カ
ード特有の機能を持たせた機能部と、これらを関連付け
て動作させるための回路部である周辺回路部とを有し、
外部機器とインターフェース部を介して接続して機能部
を機能させるカード状の機能モジュールで、アンテナを
設け、外部機器と非接触で信号交換を行なうタイプの無
線通信装置も種々提案されている。Recently, it has an interface section, a function section having a function peculiar to a function card, and a peripheral circuit section which is a circuit section for operating these in association with each other.
Various types of wireless communication devices have been proposed, which are card-shaped functional modules that are connected to an external device via an interface unit to cause the functional unit to function, and are provided with an antenna to exchange signals with the external device in a contactless manner.
【０００４】上記無線通信装置においては、従来、図４
に示すように、回路部（４５１〜４５３、４３０）とア
ンテナ部４３５は、それぞれ、別々の基板４１０、４１
５に構成されていた。図４中、４１０、４１５は基板、
４３０は配線、４３５はアンテナ部、４５１、４５２、
４５３はチップ、４６０はコネクタである。このため、
例えば、特に薄型であることが必要な用途のカード状の
機能モジュールのタイプの無線通信装置においても、回
路部とアンテナ部が別々に構成されている場合、機能モ
ジュール自体の厚さが厚くなってしまう問題があった。
また、アンテナ部を、回路部とは別の基板に製造するた
めコスト高となってしまうという問題もあった。In the wireless communication device described above, the conventional configuration shown in FIG.
As shown in FIG. 5, the circuit parts (451 to 453, 430) and the antenna part 435 are provided on different substrates 410 and 41, respectively.
It was composed of five. In FIG. 4, 410 and 415 are substrates,
430 is wiring, 435 is antenna part, 451, 452,
453 is a chip and 460 is a connector. For this reason,
For example, even in a wireless communication device of the type of a card-shaped functional module for an application that needs to be particularly thin, if the circuit unit and the antenna unit are separately configured, the thickness of the functional module itself becomes large. There was a problem.
There is also a problem that the cost is high because the antenna part is manufactured on a substrate different from the circuit part.
【０００５】[0005]
【発明が解決しようとする課題】上記のように、従来、
無線通信装置においては、回路部とアンテナ部は、図４
に示すように、別々に構成されているため、厚さが厚く
なってしまう問題や、アンテナ部を、回路部とは別に製
造するためコスト高となってしまうという問題があり、
この対応が求められていた。本発明は、これに対応する
もので、厚さが厚くならず、コスト高とならない無線通
信装置を提供しようとするものである。As described above, as described above,
In the wireless communication device, the circuit unit and the antenna unit are shown in FIG.
As shown in FIG. 2, since they are configured separately, there is a problem that the thickness becomes thick, and there is a problem that the cost increases because the antenna part is manufactured separately from the circuit part.
This response was required. The present invention is directed to provide a wireless communication device that does not increase the thickness and does not increase the cost.
【０００６】[0006]
【課題を解決するための手段】本発明の無線通信装置
は、カード状の無線通信装置であって、基板上にその回
路部とアンテナコイルが設けられ、且つ、アンテナコイ
ルは無線通信装置の回路部の全体または一部を囲むよう
に配設されていることを特徴とするものである。そし
て、上記において、回路部は、変調、復調を行なうため
の回路であるＲＦ部と、マイコン、ロジックＩＣ、ＭＰ
Ｕ等からなる制御・演算部と、メモリ部と、インターフ
ェース部とからから構成されていることを特徴とするも
のである。そしてまた、上記において、ＵＳＢ（Ｕｎｉ
ｖｅｒｓａｌ Ｓｅｒｉａｌ Ｂｕｓ）、ＳＤカード
（Ｓｅｃｕｒｅ Ｄｅｇｉｔａｌカード）、ＩＥＥＥ１
３９４等の汎用の規格に準拠するものであることを特徴
とするものである。また、上記において、回路部の全体
が１つのＩＣチップないし複数のチップを接続して形成
されていることを特徴とするものである。A wireless communication device according to the present invention is a card-shaped wireless communication device in which a circuit portion and an antenna coil are provided on a substrate, and the antenna coil is a circuit of the wireless communication device. It is characterized in that it is arranged so as to surround all or part of the part. Further, in the above, the circuit section includes an RF section which is a circuit for performing modulation and demodulation, a microcomputer, a logic IC, and an MP.
It is characterized in that it is composed of a control / arithmetic unit such as U, a memory unit, and an interface unit. Also, in the above, the USB (Uni
Versal Serial Bus), SD card (Secure Digital card), IEEE1
It is characterized by conforming to a general-purpose standard such as 394. Further, in the above, the entire circuit portion is formed by connecting one IC chip or a plurality of chips.
【０００７】[0007]
【作用】本発明の無線通信装置は、上記のような構成に
することによって、厚さが厚くならず、コスト高となら
ない無線通信装置の提供を可能としている。即ち、基板
上にその回路部とアンテナコイルが設けられており、且
つ、アンテナコイルは無線通信装置の回路部の全体また
は一部を囲むように設けられていることにより、図４に
示す従来の無線通信装置のように、回路部とアンテナ部
をそれぞれ別の基板上に配し、これを積層した構造でな
く、回路部とアンテナ部を基板上の別の領域にして設け
ている構造で、無線通信装置全体の薄化を可能としてい
る。また、１つの基板上の別の領域に、回路部とアンテ
ナ部を設ける構造で、図４に示す従来の無線通信装置に
比べ、製造コストの削減を可能にしており、特に、回路
部の全体が１つのＩＣチップないし複数のチップを接続
して形成されている場合には、その製造が容易なものと
なる。The wireless communication device of the present invention, by having the above-mentioned structure, can provide a wireless communication device which does not become thick and which does not increase the cost. That is, the circuit portion and the antenna coil are provided on the substrate, and the antenna coil is provided so as to surround the whole or a part of the circuit portion of the wireless communication device. Like a wireless communication device, the circuit portion and the antenna portion are arranged on different substrates, respectively, and not a laminated structure, but a structure in which the circuit portion and the antenna portion are provided in different regions on the substrate, This enables the thinning of the entire wireless communication device. In addition, a structure in which a circuit portion and an antenna portion are provided in another region on one substrate makes it possible to reduce manufacturing cost as compared with the conventional wireless communication device illustrated in FIG. Is formed by connecting one IC chip or a plurality of chips, the manufacturing thereof becomes easy.
【０００８】インターフェース部や周辺回路が、ＵＳＢ
（Ｕｎｉｖｅｒｓａｌ Ｓｅｒｉａｌ Ｂｕｓ）、ＳＤ
カード（Ｓｅｃｕｒｅ Ｄｅｇｉｔａｌカード）、ＩＥ
ＥＥ１３９４等の規格に準拠するものである場合には、
汎用の各種機器に挿入して使用する汎用の挿入型のカー
ドとして用いることもできる。この場合、例えば、携帯
電話等の外部機器に挿入して、これを非接触のメモリー
カードとして利用する、使用形態も採れる。あるいは、
携帯電話等の通信機器に挿入して非接触のデータキャリ
アとして用い、この通信機器により外部機器との通信を
行なう使用形態も採れる。勿論、本発明のカード状の無
線通信装置をパソコン等のコンピュータや、ＰＤＡ（Ｐ
ｅｒｓｏｎａｌ Ｄｉｇｉｔａｌ Ａｓｓｉｓｔａｎｎ
ｔｓの略で携帯情報端末のこと）等の機器に挿入して使
用する形態を採ることもできる。The interface section and peripheral circuits are USB
(Universal Serial Bus), SD
Card (Secure Digital Card), IE
If it conforms to the standards such as EE1394,
It can also be used as a general-purpose insert type card that is used by inserting into various general-purpose devices. In this case, for example, it may be used in a form in which it is inserted into an external device such as a mobile phone and used as a non-contact memory card. Alternatively,
It is also possible to use it by inserting it into a communication device such as a mobile phone and using it as a non-contact data carrier, and communicating with an external device by this communication device. Of course, the card-shaped wireless communication device of the present invention can be applied to a computer such as a personal computer or a PDA (P
personal Digital Assistance
It can also be used by inserting it into a device such as a portable information terminal (abbreviation of ts).
【０００９】[0009]
【発明の実施の形態】本発明の実施の形態例を図に基づ
いて説明する。図１（ａ）は本発明の無線通信装置の実
施の形態の第１の例の概略構成図で、図１（ｂ）は図１
（ａ）のＡ１−Ａ２における概略断面図で、 図２
（ａ）は本発明の無線通信装置の実施の形態の第２の例
の概略構成図で、図２（ｂ）は図１（ａ）のＢ１−Ｂ２
における概略断面図で、図３（ａ）は本発明の無線通信
装置を携帯電話に挿入して、メモリーカドとして使用す
る使用形態の例を示した図で、図３（ｂ）は本発明の無
線通信装置をデータキャリアとして、携帯電話に挿入し
た状態で、携帯電話を介して他機器と通信を行なう例を
示した図である。図１〜図３中、１００は無線通信装
置、１１０は基板、１２０はチップ（半導体チップとも
言う）、１２１はインターフェース部、１２２は制御・
演算部、１２３はＲＦ部（変調、復調回路部とも言
う）、１２４はメモリ部、１３０はアンテナコイル（ア
ンテナ部とも言う）、１３１は裏面配線、１４０は接着
剤層、２００は無線通信装置、２１０は基板、２２０
Ａ、２２０Ｂはチップ（半導体チップとも言う）、２２
１はインターフェース部、２２２は制御・演算部、２２
３はＲＦ部（変調、復調回路部とも言う）、２２４はメ
モリ部、２３０はアンテナコイル（アンテナ部とも言
う）、２３１は裏面配線、２４０は接着剤層、３００は
無線通信装置、３１０は携帯電話、３１１は表示部、３
３０は外部機器、３６０はインターネットである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to the drawings. 1A is a schematic configuration diagram of a first example of an embodiment of a wireless communication device of the present invention, and FIG.
2A is a schematic cross-sectional view taken along line A1-A2 of FIG.
(A) is a schematic block diagram of the 2nd example of embodiment of the radio | wireless communication apparatus of this invention, FIG.2 (b) is B1-B2 of FIG.1 (a).
3 (a) is a schematic cross-sectional view in FIG. 3 (a), showing an example of a use form in which the wireless communication device of the present invention is inserted into a mobile phone and used as a memory card, and FIG. FIG. 11 is a diagram showing an example in which a wireless communication device is used as a data carrier and is inserted into a mobile phone to communicate with another device via the mobile phone. 1 to 3, 100 is a wireless communication device, 110 is a substrate, 120 is a chip (also referred to as a semiconductor chip), 121 is an interface unit, and 122 is a control / control unit.
An arithmetic unit, 123 is an RF unit (also referred to as a modulation / demodulation circuit unit), 124 is a memory unit, 130 is an antenna coil (also referred to as an antenna unit), 131 is a backside wiring, 140 is an adhesive layer, 200 is a wireless communication device, 210 is a substrate, 220
A and 220B are chips (also called semiconductor chips), 22
1 is an interface unit, 222 is a control / arithmetic unit, 22
3 is an RF unit (also referred to as a modulation / demodulation circuit unit), 224 is a memory unit, 230 is an antenna coil (also referred to as an antenna unit), 231 is a backside wiring, 240 is an adhesive layer, 300 is a wireless communication device, and 310 is a mobile phone. Telephone, 311 is display part, 3
30 is an external device and 360 is the Internet.
【００１０】本発明の無線通信装置の実施の形態の第１
の例を図１に基づいて説明する。本例の無線通信装置１
００は、カード状の無線通信装置であって、１つの基板
１１０上にその回路部であるチップ１２０とアンテナコ
イル１３０とが領域を分けて設けられ、且つ、アンテナ
コイル１３０は無線通信装置の回路部であるチップ１２
０の全体を囲むように配設されている。アンテナコイル
１３０は、外部機器（図３（ａ）の携帯電話３１０等に
相当）と信号の授受を非接触にて行なう際の、電波信号
の受信、送信を行なうためのものである回路部であるチ
ップ１２０は、変調、復調を行なうための回路であるＲ
Ｆ部１２３と、マイコン、ロジックＩＣ、ＭＰＵ等から
なる制御・演算部１２２と、メモリ部１２４と、インタ
ーフェース部１２２とからから構成されている。インタ
ーフェース部１２２は、これを用いる外部機器との接続
のためのもので、外部機器に対応し、ＵＳＢ（Ｕｎｉｖ
ｅｒｓａｌ Ｓｅｒｉａｌ Ｂｕｓ）、ＳＤカード（Ｓ
ｅｃｕｒｅ Ｄｅｇｉｔａｌカード）、ＩＥＥＥ１３９
４等の汎用の規格に準拠するものである。The first embodiment of the wireless communication apparatus of the present invention
Will be described with reference to FIG. Wireless communication device 1 of this example
Reference numeral 00 denotes a card-shaped wireless communication device in which a chip 120 as a circuit portion and an antenna coil 130 are separately provided on one substrate 110, and the antenna coil 130 is a circuit of the wireless communication device. Part 12
It is arranged so as to surround 0 as a whole. The antenna coil 130 is a circuit unit for receiving and transmitting a radio signal when transmitting and receiving a signal to and from an external device (corresponding to the mobile phone 310 in FIG. 3A) in a non-contact manner. A certain chip 120 is an R circuit which is a circuit for performing modulation and demodulation.
The F unit 123 includes a control / calculation unit 122 including a microcomputer, a logic IC, and an MPU, a memory unit 124, and an interface unit 122. The interface unit 122 is for connection with an external device that uses the interface unit 122, corresponds to the external device, and has a USB (Univ
ersal Serial Bus), SD card (S
secure Digital card), IEEE139
4 and other general-purpose standards.
【００１１】本例の無線通信装置１００は、１つの基板
１１０上にその回路部であるチップ１２０とアンテナコ
イル１３０とが領域を分け、且つ、チップ１２０を１つ
設けただけの簡単な構造で、図４に示す基板２つ用い、
回路部とアンテナ部をそれぞれ、別の基板で分け、これ
らを重ねた構造に比べ、全体を薄くでき、その作製は容
易で製造コストも安くできる。The wireless communication device 100 of this example has a simple structure in which a chip 120, which is a circuit portion thereof, and an antenna coil 130 separate regions on one substrate 110, and only one chip 120 is provided. , Using two substrates shown in FIG.
Compared to a structure in which the circuit part and the antenna part are separated on separate substrates and these are stacked, the entire structure can be made thinner, and its manufacture is easier and the manufacturing cost can be reduced.
【００１２】例えば、図３（ａ）に示すように、携帯電
話３１０に挿入して、これを非接触のメモリーカードと
して利用する形態も採れる。あるいは、図３（ｂ）に示
すように、携帯電話３１０に挿入して、携帯電話３１０
を通信機器として、且つ、本例の無線通信装置をデータ
キャリアとして用いて、外部機器３３０との通信を行な
う使用形態も採れる。For example, as shown in FIG. 3 (a), a mode in which it is inserted into a mobile phone 310 and used as a non-contact memory card can be adopted. Alternatively, as shown in FIG. 3B, the mobile phone 310 may be inserted into the mobile phone 310.
Can be used as a communication device, and the wireless communication device of this example can be used as a data carrier to communicate with the external device 330.
【００１３】製造方法としては、例えば、銅箔を積層し
た基材を用い、フォトエッチング法により、アンテナコ
イル１３０を基板１１０上に形成した配線基板に対し、
更にチップ１２０を接着剤層１４０を介して装着して本
例の無線通信装置を形成する方法が挙げられるが、これ
限定はされない。印刷法や転写法等もある。尚、アンテ
ナコイル１３０を形成する際に他の必要な接続部や接続
用配線を形成しておく。本例では、アンテナコイル１３
０が交差する際接触しないように裏面配線１３１を設
け、スルホール等を介して表裏を接続している。スルホ
ールとしては、孔部に金属をめっき形成するのが一般的
であるが、導電性ペーストを孔部に充填して表裏を接続
しても良い。As a manufacturing method, for example, a base material laminated with copper foil is used and a photo-etching method is applied to a wiring board on which the antenna coil 130 is formed on the board 110.
Further, a method of mounting the chip 120 via the adhesive layer 140 to form the wireless communication device of this example can be mentioned, but the method is not limited to this. There are also printing methods and transfer methods. Incidentally, when forming the antenna coil 130, other necessary connecting portions and connecting wires are formed. In this example, the antenna coil 13
The back wiring 131 is provided so as not to come into contact when 0s cross each other, and the front and back are connected via a through hole or the like. As the through hole, a metal is generally formed in the hole by plating, but the hole may be filled with a conductive paste to connect the front and back.
【００１４】次に、本発明の無線通信装置の実施の形態
の第２の例を図２に基づいて説明する。本例の無線通信
装置２００は、カード状の無線通信装置であって、１つ
の基板２１０上にその回路部であるチップ２２０Ａ、２
２０Ｂとアンテナコイル２３０とが領域を分けて設けら
れ、且つ、アンテナコイル２３０は無線通信装置の回路
部であるチップ２２０Ａのみその全体を囲むように配設
されている。本例の無線通信装置２００の場合も、第１
の例の場合と同様、１つの基板２１０上にその回路部で
あるチップ２２０Ａ、２２０Ｂとアンテナコイル２３０
とが領域を分けた簡単な構造で、図４に示す基板２つ用
い、回路部とアンテナ部をそれぞれ、別の基板で分け、
これらを重ねた構造に比べ、全体を薄くでき、その作製
は容易で製造コストも安くできる。尚、本例の場合は、
チップ２２０Ａ、２２０Ｂの２つのチップを基板２１０
上に設けた構造で、且つ、アンテナコイル２３０がチッ
プ２２０Ａのみ全体を囲むように配設されているため、
第１の例の場合に比べ、アンテナのループは小となり、
通信距離が劣る。各部については、第１の例と同じで、
説明は省く。Next, a second example of the embodiment of the wireless communication apparatus of the present invention will be described with reference to FIG. The wireless communication device 200 of the present example is a card-shaped wireless communication device, and the chips 220A and 2C which are circuit parts thereof are formed on one substrate 210.
20B and the antenna coil 230 are provided in separate regions, and the antenna coil 230 is arranged so as to surround only the chip 220A, which is the circuit portion of the wireless communication device. Also in the case of the wireless communication device 200 of this example, the first
As in the case of the example of FIG.
Is a simple structure in which the regions are divided, two substrates shown in FIG. 4 are used, and the circuit portion and the antenna portion are divided by different substrates,
Compared to the structure in which these are stacked, the entire structure can be made thinner, and its manufacture is easier and the manufacturing cost can be reduced. In the case of this example,
The two chips 220A and 220B are mounted on the substrate 210.
With the structure provided above, and since the antenna coil 230 is arranged so as to surround only the chip 220A,
Compared to the case of the first example, the loop of the antenna is small,
Communication distance is inferior. Each part is the same as the first example,
I will omit the explanation.
【００１５】[0015]
【発明の効果】本発明は、上記のように、厚さが厚くな
らず、コスト高とならない無線通信装置の提供を可能に
した。As described above, the present invention makes it possible to provide a wireless communication device which does not become thick and costly.
【図１】図１（ａ）は本発明の無線通信装置の実施の形
態の第１の例の概略構成図で、図１（ｂ）は図１（ａ）
のＡ１−Ａ２における概略断面図である。FIG. 1 (a) is a schematic configuration diagram of a first example of an embodiment of a wireless communication device of the present invention, and FIG. 1 (b) is FIG. 1 (a).
3 is a schematic cross-sectional view taken along line A1-A2 of FIG.
【図２】図２（ａ）は本発明の無線通信装置の実施の形
態の第２の例の概略構成図で、図２（ｂ）は図１（ａ）
のＢ１−Ｂ２における概略断面図である。FIG. 2 (a) is a schematic configuration diagram of a second example of the embodiment of the wireless communication device of the present invention, and FIG. 2 (b) is FIG. 1 (a).
3 is a schematic cross-sectional view taken along line B1-B2 of FIG.
【図３】図３（ａ）は本発明の無線通信装置を携帯電話
に挿入して、メモリーカドとして使用する使用形態の例
を示した図で、図３（ｂ）は本発明の無線通信装置をデ
ータキャリアとして、携帯電話に挿入した状態で、携帯
電話を介して他機器と通信を行なう例を示した図であ
る。FIG. 3 (a) is a diagram showing an example of a usage form in which the wireless communication device of the present invention is inserted into a mobile phone and used as a memory card, and FIG. 3 (b) is a wireless communication device of the present invention. FIG. 6 is a diagram showing an example in which the device is used as a data carrier and communicates with another device via the mobile phone in a state of being inserted into the mobile phone.
【図４】従来の無線通信装置の図FIG. 4 is a diagram of a conventional wireless communication device.
１００ 無線通信装置
１１０ 基板
１２０ チップ（半導体チップとも言
う）
１２１ インターフェース部
１２２ 制御・演算部
１２３ ＲＦ部（変調、復調回路部とも
言う）
１２４ メモリ部
１３０ アンテナコイル（アンテナ部と
も言う）
１３１ 裏面配線
１４０ 接着剤層
２００ 無線通信装置
２１０ 基板
２２０Ａ、２２０Ｂ チップ（半導体チップとも言
う）
２２１ インターフェース部
２２２ 制御・演算部
２２３ ＲＦ部（変調、復調回路部とも
言う）
２２４ メモリ部
２３０ アンテナコイル（アンテナ部と
も言う）
２３１ 裏面配線
２４０ 接着剤層
３００ 無線通信装置
３１０ 携帯電話
３１１ 表示部
３３０ 外部機器
３６０ インターネット100 wireless communication device 110 substrate 120 chip (also called semiconductor chip) 121 interface unit 122 control / calculation unit 123 RF unit (also called modulation and demodulation circuit unit) 124 memory unit 130 antenna coil (also called antenna unit) 131 backside wiring 140 Adhesive layer 200 Wireless communication device 210 Substrates 220A, 220B Chips (also called semiconductor chips) 221 Interface section 222 Control / arithmetic section 223 RF section (also called modulation and demodulation circuit section) 224 Memory section 230 Antenna coil (also called antenna section) ) 231 Backside wiring 240 Adhesive layer 300 Wireless communication device 310 Mobile phone 311 Display unit 330 External device 360 Internet
Claims (4)
上にその回路部とアンテナコイルが設けられ、且つ、ア
ンテナコイルは無線通信装置の回路部の全体または一部
を囲むように配設されていることを特徴とする無線通信
装置。1. A card-shaped wireless communication device, wherein a circuit portion and an antenna coil are provided on a substrate, and the antenna coil is arranged so as to surround all or part of the circuit portion of the wireless communication device. And a wireless communication device.
調を行なうための回路であるＲＦ部と、マイコン、ロジ
ックＩＣ、ＭＰＵ等からなる制御・演算部と、メモリ部
と、インターフェース部とからから構成されていること
を特徴とする無線通信装置。2. The circuit unit according to claim 1, wherein the circuit unit is an RF unit that is a circuit for performing modulation and demodulation, a control / calculation unit including a microcomputer, a logic IC, an MPU, a memory unit, and an interface unit. A wireless communication device comprising:
ｎｉｖｅｒｓａｌＳｅｒｉａｌ Ｂｕｓ）、ＳＤカード
（Ｓｅｃｕｒｅ Ｄｅｇｉｔａｌカード）、ＩＥＥＥ１
３９４等の汎用の規格に準拠するものであることを特徴
とする無線通信装置。3. The USB (U
universal Serial Bus), SD card (Secure Digital card), IEEE1
A wireless communication device according to a general-purpose standard such as 394.
体が１つのＩＣチップないし複数のチップを接続して形
成されていることを特徴とする無線通信装置。4. The wireless communication device according to claim 1, wherein the entire circuit portion is formed by connecting one IC chip or a plurality of chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001266427A JP2003078435A (en) | 2001-09-03 | 2001-09-03 | Radio communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001266427A JP2003078435A (en) | 2001-09-03 | 2001-09-03 | Radio communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003078435A true JP2003078435A (en) | 2003-03-14 |
Family
ID=19092718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001266427A Pending JP2003078435A (en) | 2001-09-03 | 2001-09-03 | Radio communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003078435A (en) |
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| JPH11149536A (en) * | 1997-11-14 | 1999-06-02 | Toppan Printing Co Ltd | Composite ic card |
| JP2002517764A (en) * | 1998-06-08 | 2002-06-18 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Identification tags with enhanced security |
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