JP2002073089A - Card type electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold semiconductor memory cards having different sizes, especially thickness, while securing good electrical connection and at the prescribed position of a card type electronic apparatus whose thickness is restricted, and to make the thickness of the card type electronic apparatus thinner into and from which the semiconductor memory card is inserted and pulled out. SOLUTION: In the card type electronic apparatus 1 that houses a packaging member in a case 2, a circuit board 3 to support the packaging member composes a part of holding part for storing and holding a semiconductor memory card 10, and supports directly the contact point side of the stored semiconductor memory card. The surface opposed to the contact point side of the memory card of the circuit board is a holding surface, the circuit board serve as a component that composes a holding part to hold the memory card, and thereby, supports the memory card.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card-type electronic device, and more particularly to a portable electronic device for reproducing or recording digital information such as sound and image.

[0002]

2. Description of the Related Art Magnetic tapes, magnetic disks, and the like have been known as recording media for recording and reproducing image data and audio data. Recording and reproduction of data recorded on a recording medium such as a magnetic tape or a magnetic disk requires a mechanically driven mechanism such as a motor, and thus there is a limit in reducing the size and weight of the apparatus. On the other hand, a portable semiconductor memory has been developed as a recording medium for recording large-capacity data, and a data compression technique capable of greatly reducing the data capacity has been developed. And
A small and lightweight data device capable of recording and reproducing a large amount of data by combining them has been proposed.

Various types of portable semiconductor memories, such as a card type and a stick type, have been proposed.
Various card-type memories such as a D-card memory have been proposed. As for the data compression technique, for example, MPG1 Layer1, MPG1 Layer
2, various things such as MPG BC, MPG AC, and AC3 have been proposed.

[0004]

In a portable reproducing apparatus for reproducing audio data recorded on a semiconductor memory card, in order to store audio data on the semiconductor memory card, a cable is connected between the reproduction-only apparatus and a personal computer. (For example, a USB cable or a parallel cable), and a sound source such as a CD (compact disc) or audio data supplied from the Internet is downloaded from the personal computer through the cable. In such a reproducing apparatus using a semiconductor memory card as a recording medium, since a cable is used for connection with a personal computer, it is necessary to prepare a new cable corresponding to the personal computer and the reproducing apparatus. There is a problem of operability that an operation of connecting the playback device with a cable is required.

[0005] Therefore, there is a need for an apparatus which solves the above-mentioned problems and which does not require a peripheral device such as a cable and can easily perform a connection operation. It is also required that the playback device be smaller and lighter than the conventionally proposed playback device. On the other hand, a card type electronic device such as an IC card or a PC card has a function of inputting / outputting data in combination with an external data input / output device such as a personal computer, sharing necessary data with the personal computer, and displaying recorded data. The one equipped with it is proposed.

[0006] PCMCIA is used as a card type electronic device.
It is known that the size and the like are standardized by a standard. According to the PCMCIA standard, for example, in type 2, the dimension (W) of one side is 54.0 mm and the dimension (L) of the other side is 85.60.
mm, vertical dimension (thickness) (T2 × 2) 5.00 mm
It is used as an adapter to connect to other peripheral devices mainly in personal computers. On the other hand, the personal computer is provided with a PCMCIA-standard slot as means for connecting to external peripheral devices, in addition to the above-described terminals for connecting cables of various standards.

In such a card-type electronic device,
There are two issues regarding thickness. The first issue is
The second problem is to introduce semiconductor memories having different sizes (especially thicknesses) and to obtain good electrical connection in a card-type electronic device whose thickness is limited. In a card-type electronic device for obtaining electrical connection, the present invention is to reduce the thickness of the card-type electronic device as much as possible. There are various types of semiconductor memory cards having different memory capacities and sizes, and it is desired that various types of semiconductor memory cards can be used with one card-type electronic device. The reading of the semiconductor memory card is usually performed by using a holder provided with electric contact pieces corresponding to the contacts of the semiconductor memory card and holding the semiconductor memory card in the vertical direction and the side direction. It is formed corresponding to the size of the semiconductor memory card in order to obtain holding and good electrical contact.

Therefore, in order to read semiconductor memory cards of different sizes (especially thicknesses) with one card-type electronic device, it is necessary to provide a holder corresponding to each size of semiconductor memory card. Of course, the holder corresponding to the thick semiconductor memory card also becomes thicker,
It is difficult to fit in a card-type electronic device with a limited thickness, and even more, it is impossible to fit in a card-type electronic device with a configuration in which a plurality of holders corresponding to each semiconductor memory card are stacked. There is a first problem.
For example, in a limited card type electronic device specified by the PCMCIA standard, it is necessary to hold a semiconductor memory card at a predetermined position within a specified thickness (5.00 mm) to ensure good electrical connection. With a conventional holder, it is difficult to satisfy a specified thickness.

Also, the thickness of card-type electronic devices tends to become thinner and thinner, even if the currently set standards and design specifications are satisfied. There is a second problem that it becomes impossible to cope.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the problem relating to the thickness of a card-type electronic device. A first object is to secure and maintain a good electrical connection at a position, and a second object is to reduce the thickness of a card-type electronic device for inserting and removing a semiconductor memory card.

[0011]

According to the present invention, in order to solve the above-mentioned object, a circuit board can be configured in a plurality of forms (first to fourth forms described below). A first mode according to a circuit board is a card-type electronic device in which a mounting member is housed in a case, and a circuit board that supports the mounting member forms a part of a holding unit that stores and holds a semiconductor memory card. , Supporting the stored semiconductor memory card. The circuit board of the first embodiment has a surface facing the contact side of the semiconductor memory card as a holding surface, and also serves as a component constituting a holding portion for holding the semiconductor memory card, and supports the semiconductor memory card. According to the circuit board of the first embodiment, the holding surface of the holding portion for holding the semiconductor memory card, which has been conventionally required, can be omitted,
The tolerance in the thickness direction of the card-type electronic device can be increased.

Here, the part of the holding portion formed by the circuit board includes each holding surface for supporting the semiconductor memory card in the upper surface direction, the lower surface direction, or the side surface direction, and at least one of the holding surfaces. The semiconductor memory card can be held by the circuit board from the upper surface direction, the lower surface direction, the side surface direction, or a combination thereof.

A second aspect of the circuit board is a card-type electronic device in which a mounting member is housed in a case, wherein the circuit board supporting the mounting member is a circuit board of an electrical contact piece that makes electrical contact with a semiconductor memory card. The groove has a groove portion that allows bending in the thickness direction. The circuit board of the second embodiment has a groove. The groove accommodates a part of the electric contact piece that makes electrical contact with the semiconductor memory card, and releases the bending caused by the contact of the electric contact piece with the semiconductor memory card. Normally, the groove is formed in the holding portion of the semiconductor memory card. In the present embodiment, by providing the groove in the circuit board portion, the holding surface of the holding portion can be omitted, and the card type electronic device can be used. The allowable amount in the thickness direction can be increased.

A third mode of the circuit board is the same as the second mode, except that the groove penetrates the circuit board. By forming the groove through the circuit board, the thickness of the circuit board can be further reduced, and the tolerance in the thickness direction of the card-type electronic device can be increased. A fourth mode according to a circuit board is a card-type electronic device in which a mounting member is housed in a case, wherein the circuit board supporting the mounting member has a semiconductor memory card insertion / removal direction in a longitudinal direction of a groove, and a semiconductor memory card. And a bottom portion of a holding frame for holding the semiconductor memory card, having a through-groove for allowing the electrical contact piece in electrical contact with the circuit board to bend in the thickness direction of the circuit board. The fourth embodiment is different from the first embodiment in the configuration of the first embodiment.
Therefore, the holding surface of the holding portion can be omitted, and the allowable amount in the thickness direction of the card-type electronic device can be increased.

The above-described groove may be formed for each electrical contact, or may be configured to accommodate a plurality of adjacent electrical contacts collectively. Can be collectively stored.
Further, the penetrating portion formed in the groove portion can be formed over the entire length of each groove portion, or can be formed only in a part of each groove portion. When a plurality of groove portions are provided, only the predetermined groove portion is formed. You can also. The configuration for introducing or leading the semiconductor memory card into or out of the case includes a configuration in which the semiconductor memory card is inserted or removed through a slot provided in the case as shown in the above-described embodiment, and, for example, all or an upper cover or a lower cover forming the case. Part or one or all of the side surface forming the case can be opened and closed, and the opening and closing portion can be opened and closed to open and close.

Therefore, according to each of the above-described embodiments, even in the case where the thickness of the card type electronic device is limited, the semiconductor memory cards having different thicknesses can be connected to predetermined positions and have good electrical connection. The thickness of the card-type electronic device into which the semiconductor memory card is inserted and withdrawn can be reduced at least by the thickness of the holding surface of the conventional holder.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram schematically illustrating a card-type electronic device of the present invention. In addition, regarding the card type electronic device of the present invention, the arrangement structure of each component will be described with reference to FIGS. 1 to 4, the earphone terminal structure will be described with reference to FIGS. 5 and 6, and FIGS. The substrate and the contact structure will be described with reference to FIGS.

First, an outline of a card-type electronic device of the present invention will be described with reference to FIG. In FIG. 1, a card-type electronic device 1 conforms to the PCMCIA standard (85.60 mm).
× 54.0 mm × 5.00 mm), a substrate 3 provided in the case 2, a connector terminal 4, an earphone terminal 6, and a mounting member such as an IC chip or a circuit component provided on the substrate 3. (Not shown).

The case 2 has four end faces 2a, 2b, 2
c, 2d, an upper surface 2e, and a lower surface 2f, and the connector terminal 4 provided on the end surface 2a can be inserted into a slot provided in an external device such as a personal computer, and is electrically connected by being inserted. On the end face 2b opposite to the end face 2a, a slot 5 for inserting and removing the semiconductor memory card 10, an opening 6a of an earphone terminal 6 for inserting and removing an earphone plug 11, and a hold button 8 are provided. In addition,
The hold button 8 is an operation state holding unit for holding the current operation of the card-type electronic device. When the card-type electronic device is playing, the hold operation is maintained regardless of the operation button being turned off. When the card-type electronic device is stopped, the reproduction operation is not performed and the stopped state is maintained regardless of whether the operation button is turned on.

The semiconductor memory card 10 inserted from the slot 5 is held by the memory card holder 9 and the substrate 3 provided in the case 2 and electrically connected by contacts (not shown) provided on the substrate 3. Is performed. In the case 2, a secondary battery 7 is provided on the connector terminal 4 side, and is used as a power supply for driving the card-type electronic device 1 to reproduce sound on the earphone. An opening (or notch) 3 is partially formed in the substrate 3.
b is provided to form a space for accommodating the secondary battery 7. As a result, the secondary battery 7 is located in the case 2 between the connector terminal and the inserted semiconductor memory card 10. The fixing of the secondary battery 7 in the case 2 can be performed, for example, using an adhesive member such as a double-sided tape on the inner surface of the cover 20 (upper cover 20a or lower cover 20b).

Therefore, in the card-type electronic device 1, the mounting member is housed in the case 2, the connector terminal 4 is inserted into one end surface 2a in the longitudinal direction of the case 2, and the slot 5 for inserting and removing the semiconductor memory card 10 is inserted into the other end surface 2b. And an earphone terminal 6, and a secondary battery 7 on the connector terminal 4 side in the case 2.

FIG. 2 is a perspective view of each part of the card-type electronic device according to the present invention with the cover shown in FIG. 2 removed.
This will be described with reference to the component diagram of FIG. 3 and the plan and side views of both sides inside the case with the cover removed in FIG. 2, FIG. 2 (a) is a perspective view of an exterior part of the card type electronic device 1 viewed from the end face 2b side, and FIG. 2 (b) is an end face 2b of the card type electronic device 1 with the case 2 removed. 2C is a perspective view of an exterior portion of the card-type electronic device 1 viewed from the end face 2a side, and FIG. 2D is a substrate portion of the card-type electronic device 1 with the case 2 removed. 2E is a perspective view of the card type electronic device 1 as viewed from the end face 2a side, and FIG. 2E is a perspective view of the card type electronic device 1 as viewed from the end face 2a side.

In FIG. 2A, the upper surface 2e of the case 2
A display unit 21 and an operation unit 22 are provided above. The display section 21 is a section for displaying information such as a reproduction state, and can be formed using liquid crystal display means. The operation unit 22 is a part for instructing operation commands such as reproduction and stop, and can be constituted by buttons and switches.
A slot 5 for inserting the semiconductor memory card 10 is formed at a substantially central portion on the side of the end face 2b, and an earphone terminal and a hold button 8 are provided on both sides of the slot 5. Note that the slot 5 can be formed by providing a cutout portion in the frame 2 g that forms the case 2.

The substrate 3 shown in FIG. 2B has a secondary battery 7 between an end face 2a on the connector terminal side and an end face 2b on the opposite side.
And a memory card holder 9, a display unit 21 a is mounted on the substrate 3 on the side of the secondary battery 7,
The operation unit 2 is provided on the side of the memory card holder 9.
2a is mounted on the substrate 3. An earphone terminal 6 is provided on the end face 2b side of the memory card holder 9.
Is provided, and the earphone plug 11
Contact 12 can be electrically contacted. Further, a hold button 8 is provided on the end face 2b side adjacent to the operation unit 22a. The display unit 21a, the operation unit 22a, and the hold button 8 are electrically attached to the board 3 and connected to a circuit (not shown) mounted on the board 3. Also, FIGS. 2 (c) and (d)
2A and 2B are views seen from different directions from FIGS. 2A and 2B, respectively, and show the end surface 2a on the connector terminal side.

FIG. 2E shows a bottom surface portion of the card-type electronic device, and shows a back surface portion of the secondary battery 7 and the earphone terminal 6. A notch 3c for engagement is formed in a part of the bottom surface of the substrate 3, and the display unit 21a can be attached to the substrate 3 by engaging the engagement pawl 21f with the notch 3c for engagement. it can. The holding portion 6e forming a part of the earphone terminal 6 is provided in the case 2
The contact 6b, which is formed integrally with the frame 2g, and also forms a part of the earphone terminal 6, is fitted into the holder 6e.
By fitting the contact portion 6b into the holding portion 6e,
An earphone terminal 6 is formed.

In the parts diagram of FIG.
a is a transparent sheet 21b, an LCD (liquid crystal display) 21
c, conductive rubber 21d, LCD holder 21e, LC
In the D holder 21e, a transparent sheet 21b, an LCD 21c,
And the conductive rubber 21d are sequentially incorporated. The conductive rubber 21d mechanically and electrically connects the LCD 21c and the circuit pattern of the substrate 3 using elasticity. Further, the LCD holder 21e is
f can be attached by engaging the notch 3c for engagement formed on the substrate 3 side.

The operation unit 22a includes an operation button 22b
And a dome switch 22c. Dome switch 22
“c” electrically turns on and off the circuit pattern of the substrate 3 by elasticity. The contact portion 6b of the earphone terminal 6
The contacts 6c and 6d are integrally formed and provided as a single component, and are brought into contact with different contact portions of the earphone plug contact 12 to perform electrical connection. In FIG. 3, each of the contacts 6c and 6d has two contact pieces. In FIG. 3, an opening 3b for accommodating the secondary battery 7 is formed in the substrate 3, and a memory card holder 9 for accommodating a semiconductor memory card 10 is provided on the substrate 3.

In FIG. 4, the plan views of FIGS. 4 (a) and 4 (c) show both sides of the case with the covers removed,
FIG. 4B is a side view showing the side of the case. FIG.
The plan view of (a) shows a state in which the substrate 3 is viewed from above, and the connector terminal 4, the secondary battery 7, the memory card holder 9 in which the semiconductor memory card 10 is inserted, and the display on the upper surface 3e of the substrate. A unit 21a and an operation unit 22a are provided, and a holding portion 6e of an earphone terminal is formed integrally with the frame 2g constituting the case.
Has a contact 6c electrically connected to the earphone plug 12.
Is incorporated.

FIG. 4C is a plan view showing the substrate 3 as viewed from below. The lower surface 3f of the substrate, the back surface of the secondary battery 7e, the holding portion 6e of the earphone terminal and the holding portion 6e. The back side of the contact portion 6b incorporated in the portion 6e is shown. The contact portion 6b includes a contact 6c and a contact 6d.
Contacts 6c corresponds to the contact of the tip portion of the earphone plug 12, on the other hand, the contact 6d includes ₁ and 6d ₂ 2 one contact 6d,
It corresponds to two contact points on the base part of the earphone plug 12. The two contacts at the base of the earphone plug 12 are formed with an annular insulating ring interposed therebetween. Further, an engagement claw 21f of the display unit engaged with the engagement notch 3c formed in the substrate 3 is shown.

Next, the configuration of the earphone terminal will be described with reference to FIGS. FIG. 5 shows the substrate with the cover removed, and FIG. 6 shows only the earphone terminal.

FIG. 5B is a view of the substrate 3 with the upper cover 20a removed, as viewed from above, and shows only the substrate substantially the same as FIG. 4A. FIG. 5 (d)
Is a view of the substrate 3 as viewed from below, and shows only the substrate substantially the same as FIG. 4C. FIG. 5 (a)
Indicates an inner surface of a cover that covers the substrate 3 illustrated in FIG.
FIG. 5C shows a side view of the substrate 3 shown in FIG. Note that FIG. 5B and FIG.
(D) shows both surfaces of the contact portion 6b.

In FIG. 5, a contact portion 6b constituting the earphone terminal 6 is provided on the side of the substrate 3 in the components related to the earphone terminal 6. The contact portion 6b is formed of, for example, an insulating material, and insulates the contact 6c from the contact 6d and maintains the positional relationship between the contacts. The contact points of the contact 6c and the contact 6d (6d ₁ , 6d ₂ ) are arranged in directions substantially orthogonal to each other, and each contact portion (contact 12c) of the contact 12 of the inserted earphone plug 11 and _one (contact 6c).
c) makes contact at the plug tip in the direction of insertion of the earphone plug 11, while the other (contact 6d) is a plug side portion (contact 12d) in a direction orthogonal to the direction of insertion of the earphone plug 11.
Touch with.

The enlarged view of the earphone terminal shown in FIG. 6 is the same as FIG. 5D, as viewed from the bottom side of the card-type electronic device, and viewed from opposite directions. The earphone terminal 6 includes a contact portion 6b and a holding portion 6e. The contact portion 6b is a contact 12 of the earphone plug 12.
It has a contact 6c and a contact 6d for making electrical connection with the contacts c and 12d, and is attached to the substrate 3 side. Contact 6b
Is attached to the substrate 3 by screw holes 6 provided in the contact portions 6b.
This can be done by screwing with h. The contact 12d has two contact portions (12d ₁ , 12d ₂ ) formed with an insulating material interposed therebetween, and each contact portion contacts each of the two contact portions 6b to perform electrical connection.

The contact 6c forms a bifurcated contact piece and is installed toward the earphone plug 12 in the direction in which the earphone plug 12 is inserted, and between the contact 6c and the tip of the contact 12c of the inserted earphone plug 12. Make electrical connections. The bifurcated contact piece has elasticity, and by making elastic contact with the tip portion of the contact point 12c, a good contact state is maintained, and at the same time, a positional deviation occurring in the insertion direction and the orthogonal direction thereof is allowed. I have. The other contact 6d is U
It has two contact pieces (6d ₁ , 6d ₂ ) formed in the shape of a letter, and both contact pieces are installed along the insertion direction of the earphone plug 12 and the ends thereof are directed toward the side of the inserted earphone plug 12. The inserted and inserted earphone plug 12
Electrical connection is made between two side portions of the contact 12d. The contact piece of the contact 6d has elasticity and elastically contacts the U-shaped tip with the side surface of the contact 12d, thereby maintaining a good contact state and a direction orthogonal to the insertion direction. Is allowed.

The holding portion 6e is a portion for holding the above-mentioned contact portion 6b. The holding portion 6e is formed at a common end of the end surface 2b and the side surface 2c of the case 2, that is, at a corner 2h of the frame 2g. The corner portion 2h is a portion where two side members (side members forming the end surface 2b and the side surface 2c) forming the frame 2g intersect and are positions where mechanical strength is easily obtained. The mounting strength can be increased. By increasing the mounting strength of the contact portion 6b, it is possible to avoid poor contact at the contact portion 6b even when the card-type electronic device 1 receives an impact while being carried or handled. If the holding part 6e is formed in the middle part of the side member of the frame 2g, the middle part of the side member is a part having a relatively low mechanical strength, so that it is easily deformed by an external force, and The portion 6e fluctuates, and a contact failure easily occurs in the contact portion 6b.

Note that, with the above configuration, the earphone terminal 6
The opening 6a of the case 2 is the end face 2b or the side face 2c of the case 2.
Formed at the end. The opening 6a can be provided at either end of the end face 2b or the side face 2c. However, since the slot 5 for the semiconductor memory card 10 is provided in the end face 2b, the length of the end face 2b side has little margin. , And the length of the inserted earphone plug 12,
It is preferable that the opening 6a is provided on the end surface 2b side and the earphone plug 12 is inserted in the side surface 2c direction.

The holding portion 6e can be formed integrally with the frame 2g. When the frame 2g is formed of a resin material or a metal material, the holding portion 6e is formed integrally with the frame 2g. Accordingly, in addition to increasing the mechanical strength of the holding portion 6e itself, similarly to the above, it is possible to increase the mounting strength of the contact portion 6b, and to prevent poor contact of the contact portion 6b.

Further, the holding portion 6e can be formed in the vicinity of the fixing portion where the screw portion 2i of the frame 2g is provided. The screw portion 2i is a component for fixing the upper cover 20a and the lower cover 20b to the frame 2g. By arranging the upper and lower covers 20a and 20b of the frame 2g and attaching screws (not shown) to the screw portions 2i, the vicinity of the screw portions 2i is raised by the upper cover 20a and the lower cover 20b. And is fixed by receiving surface pressure from below. By forming the holding portion 6e in a range that receives the surface pressure from the upper cover 20a and the lower cover 20b, the mechanical strength of the holding portion 6e can be increased, and furthermore, the contact failure of the contact portion 6b can be prevented. Can be.

Therefore, in the holding portion 6e, the frame 2
The mechanical strength of the holding portion 6 is increased by the configuration provided on the corner 2h of the frame g, the configuration formed integrally with the frame 2g, and the configuration formed near the fixing portion provided with the screw portion 2i of the frame 2g. Although the contact failure of the contact portion 6b can be prevented, each of the above-described configurations can be used alone or in combination. In the case of forming the case of the card-type electronic device, when the frame, the upper cover, and the lower cover are formed separately, and one of the upper cover and the lower cover is integrally formed with the frame. In some cases, it may be formed by the former member and two parts of the other cover.

In the case where the frame, the upper cover, and the lower cover are separate parts, the case is formed by sandwiching the frame between the upper cover and the lower cover and fixing the frame with a fixed portion. When one of the cover and the frame is an integral member, the integral member of the frame and the cover and the other cover
It is formed by fixing with a fixed part of the part. The cover formed integrally with the frame may be either an upper cover or a lower cover. In addition, the one cover and the frame may be integrally formed by integrally forming the two portions with a resin or the like, or by forming one (for example, a metal cover) previously formed on the other (for example, a resin frame). Can be performed by being integrated at the time of forming.

Next, the structure of the substrate and the structure for a semiconductor card to be mounted on the substrate will be described with reference to FIGS. 7 to 11 and FIG. FIG. 7 is a perspective view showing a substrate portion. On the substrate 3, a pattern unit 3i for mounting and connecting an IC chip and a circuit component is provided, and a display unit (not shown) is attached using a notch 3c for engagement. The upper surface 3e of the substrate 3 also serves as a support surface for supporting the inserted semiconductor memory card 10, and is in contact with the contact point of the semiconductor memory card 10 at the leading end side in the insertion direction of the semiconductor memory card 10 for electrical connection. Is provided. Contact 3g
Is formed by arranging a plurality of elastic conductive contact pieces 3h. A contact is formed at one end of the contact piece 3h to make electrical connection with the contact of the inserted semiconductor memory card, and the other end of the contact piece 3h is electrically connected to the pattern 3i formed on the substrate 3. Connected.

The symbol 3k formed on the contact piece 3h is
Reference numeral 3n indicates a positioning hole when the contact piece 3h is mounted on the substrate 3, and reference numeral 3n indicates a positioning hole when the spacer 9a is mounted on the substrate 3. The groove 9c formed in the memory card holder 9 and the protruding portion 9d formed in the spacer 9a are configured to determine a joint position between the memory card holder 9 and the spacer 9a and engage therewith.

FIG. 8A is a plan view of the substrate 3 on which the memory card holder 9 is mounted as viewed from above.
(B) shows a cross section of the contact piece 3h and a substrate portion on which the contact piece 3h is provided. In FIG. 8B, a semiconductor memory card (not shown) is inserted from the right. In FIG. 8B, one end of the contact piece 3h is fixed on the substrate 3 and is electrically connected to the pattern 3i.
The other end of the contact piece 3h is formed to be curved with a convex portion toward the contact side of the semiconductor memory card 10 to be inserted. The projecting portion constitutes a contact 3 j electrically connected to a contact of the semiconductor memory card 10, and the upper surface 3
e protrudes toward the semiconductor memory card 10 side.

On the other hand, a groove 3a is formed in a portion of the substrate near the contact 3j. The groove 3a is formed along the length direction of the contact piece 3h, and the bending of the contact piece 3h generated when the contact 3j contacts the contact of the semiconductor memory card 10 is released by the groove 3a. Due to the elasticity of 3 h, the electrical connection between both contact points can be maintained well. In FIG. 8, the groove 3a is
However, the depth of the groove may be any depth as long as it is sufficient to release the bending of the contact piece 3h, and does not necessarily need to be through. When the groove depth of the groove is smaller than the bending of the contact piece 3h, it can be dealt with by deforming the tip of the curved portion of the contact 3j in the groove by contacting the groove bottom or the lower cover 20b.

The holding of the semiconductor memory card 10 is performed by supporting the lower side of the semiconductor memory card 10 on the upper surface 3 e of the substrate 3 and supporting the upper side with the memory hold holder 9. The memory hold holder 9 includes the contact piece 3 with the spacer 9a interposed therebetween.
h (or the upper surface 3 e of the substrate 3), thereby being provided on the upper surface 3 e of the substrate 3. The spacer 9a is attached to the substrate 3 by, for example, as shown in FIGS.
After being positioned in the hole 3n on the side and temporarily fixed with an adhesive, it can be fixed by attaching the hold holder 9 to the substrate 3. The hold holder 9 can be attached to the substrate 3 by using a protruding piece 9e provided around the side of the hold holder 9 as an attachment end and fixed to the substrate 3 with an adhesive or the like. The thickness of the spacer 9a is set according to the maximum thickness of the semiconductor memory card to be used. The thin semiconductor memory card is held by the elasticity of the contact piece 3h.

On a part of the surface of the memory hold holder 9 on the side of the semiconductor memory card, an elastic piece 9b directed toward the substrate 3 is provided. The elastic piece 9b presses the inserted semiconductor memory card against the contact 3j on the substrate 3 to improve the electrical contact between the contact of the semiconductor memory card and the contact 3j on the substrate 3. The elastic piece 9b is, for example,
It can be formed by making a U-shaped cut in a part of the memory hold holder 9 and bending the one-sided piece formed by the cut toward the substrate 3 side. Accordingly, even when the thickness of the semiconductor memory card is different, the holding and the electrical contact are performed by the elasticity of the elastic piece 9b and the contact piece 3h. Thus, the card-type electronic device of the present invention can support semiconductor memory cards having different sizes.

FIG. 9 is a view of the configuration of FIG. 7 as viewed from the back side of the substrate, and shows the configuration of the contact portion 3g. The configuration of the contact portion 3g shown in FIGS. 7 and 9 shows a state where the contact portion 3g is being mounted on the substrate 3. Until the plurality of contact pieces 3h are fixed on the substrate 3, one ends thereof are cut off and joined together by joining pieces 3l, thereby maintaining the positional relationship between the contact pieces 3h. After attaching the contact portion 3g to the substrate 3, the separation joining piece 3l is finally separated from each contact piece 3h. In addition, a positioning hole 3k is formed in a part of the contact piece 3h, and is used for positioning when attaching to the substrate 3.

FIG. 10 is a view for explaining a procedure for attaching the contact portion 3g and the memory hold holder 9 to the spacer 9a to the substrate 3. In this installation, contact part 3
g is temporarily fixed to the memory hold holder 9 and the spacer 9a, and then attached to the substrate 3. First, FIG.
As shown in FIG.
a and each component of the contact portion 3g are prepared. Contact 3g
Is formed by arranging a plurality of contact pieces 3h side by side, cutting off an end opposite to the contact 3j, and integrally joining them by a joining piece 3l. At the boundary between the contact piece 3h and the separation joining piece 3l, a separation part 3q is formed by, for example, forming a thin part, and the separation joining piece 3l can be separated by bending at the separation part 3q.
A hole 3k for positioning is formed in a part of the contact pieces 3h.

Next, as shown in FIG. 10 (b), the contact portion 3g and the memory hold holder 9 with the spacer 9a interposed therebetween.
Is temporarily fixed to form an integral part. To fix the spacer 9a to the memory hold holder 9, the above-described groove 9 is used.
c and the projection 9d can be engaged. To fix the contact 3g to the spacer 9a,
An adhesive can be used. Thereafter, FIG.
According to the procedure shown in FIG. 10 (f), the component in which the memory hold holder 9, the spacer 9 a, and the contact portion 3 g are temporarily fixed integrally is attached to the substrate 3.

On the substrate 3 side, a positioning projection 3r is formed at a position corresponding to the positioning hole 3k (FIG. 10 (c)). To attach the contact portion 3g to the substrate 3, the positioning is performed by aligning the positioning hole 3k with the positioning protrusion 3r, and the protrusion 9e of the memory hold holder 9 is fixed to the substrate 3 with an adhesive. At the same time, the contact piece 3h of the contact portion 3g is connected to the pattern portion 3i of the substrate.
By soldering. 3p in FIG.
Indicates a soldered portion. This soldering part 3p
When the contact portion 3g is attached to the substrate 3 by the soldering operation described above, since the contact pieces 3h are integrally joined by the separation joining pieces 3l, the positional relationship between the contact pieces 3h is maintained (FIG. 10 (d)).

After being attached to the substrate 3, each of the contact pieces 3h is fixed at a predetermined position by soldering, so that the separation joining piece 3l becomes unnecessary. Therefore, in the separating section 3q, the separating joint piece 3l is separated by bending the separating joint piece 3l (FIG. 10 (e),
(F)).

FIG. 11 is a diagram showing the electrical connection between the semiconductor memory card according to the present invention and the substrate side in comparison with the conventional one. FIGS. 11 (a), (b), and (c) show a case according to the configuration of the present invention. FIG. 11 (a) shows a state where a semiconductor memory card is not inserted, and FIGS. 9 (b) and 9 ( (c) shows a state in which semiconductor memory cards (thicknesses T1 and T2) having different thicknesses are inserted.

The contact on the side of the semiconductor memory card 10 is electrically connected by contacting the contact piece 3h and the contact 3j. The deflection of the contact piece 3h caused by this contact is:
It can escape in the groove 3a. By using the bending of the contact piece 3h in the groove 3a, semiconductor memory cards having different thicknesses can be used. When the thickness of the semiconductor memory card is different, FIG.
0 (c), the contact 3j bends in accordance with the thickness of the semiconductor memory card, and the amount of the bend can be released in the groove 3a, so that the contact 3j of the contact piece 3h is always on the semiconductor memory card 10 side. Contact.

The grooves 3a shown in FIGS.
Although it is formed so as to penetrate the substrate 3, it is not always necessary to form it so as to penetrate the substrate 3, and as shown in FIG. . Further, as in the present invention, the substrate 3 serves as a support surface for supporting the lower surface of the semiconductor memory card 10 and the support surface serves as a contact portion for making electrical connection with the contact of the semiconductor memory card 10. The thickness of the memory hold holder can be reduced. In the configuration of the present invention,
The thickness from the substrate bottom to the upper surface of the memory hold holder is the thickness t1 of the memory hold holder 9, the thickness t2 of the space for inserting the semiconductor memory card 10, and the thickness of the substrate 3.
T4, which is the sum of the thickness t3.

On the other hand, as shown in FIG. 10E, in the configuration in which the memory hold holder is placed on the substrate 3, the thickness t5 of the upper surface of the memory hold holder 9 and the semiconductor memory card 10 are inserted. The sum t7 of the thickness t2 of the space portion, the thickness t6 of the lower surface of the memory hold holder 9, and the thickness t3 of the substrate 3, is increased by at least the thickness t6 of the lower surface of the memory hold holder 9. FIG.
As shown in (f), in the configuration in which the upper surface of the semiconductor memory card 10 is electrically connected, the memory hold holder 9
The thickness t8 of the upper surface of the memory hold holder 9, the thickness t2 of the space for inserting the semiconductor memory card 10, and the thickness t3 of the substrate 3 are equal to t9. Only the required thickness is required, and the thickness increases.

Further, an opening 3 b for accommodating the secondary battery 7 is formed in the substrate 3 on the connector terminal 4 side. The shape of the opening 3b is not necessarily limited to the shape surrounding the four sides of the secondary battery 7 depending on the size and the arrangement position of the secondary battery 7, and the shape of the substrate 3 is notched. A configuration in which a part is held can also be adopted. Also,
The shape of the secondary battery 7 is not limited to a rectangle, and may be any shape. In this case, the shape of the opening and the notch may be any shape corresponding to the shape of the secondary battery 7. it can.

Next, the configuration of the power supply section of the card type electronic device of the present invention will be described with reference to FIGS. 1, 2, 4 and 12 to 1.
4 will be described. The power supply unit of the card-type electronic device of the present invention includes a secondary battery and has a configuration in which the secondary battery can be charged from an external device via a connector terminal. As shown in FIG. 1, FIG. 2, and FIG.
Is provided on one end face in the longitudinal direction of the case 2, and the connector terminal includes a charging terminal for charging the secondary battery 7 provided in the case 2. Some of the terminals provided in the connector terminal 4 are used as charging terminals, and are connected to the secondary battery 7 via a charging circuit formed on the substrate. As the charging terminal, a terminal dedicated to charging can be set from a plurality of terminals provided in the connector terminal, or an arbitrary terminal can be switched between data exchange and charging as needed. The allowable power of the connector terminal is set by adding a margin for safety to a value obtained by combining data exchange and charging.

The connector terminal 4 can exchange audio data with an external device such as a personal computer, and can charge the secondary battery 7 provided in the case 2 via a charging terminal. Charging can be performed simultaneously with data exchange,
Only charging can be performed independently of data exchange.

FIGS. 12 to 14 show an example of a circuit configuration of the card-type electronic device of the present invention. FIG. 12 shows a basic structure of a circuit configuration, FIG. 13 shows an example of a configuration of a charging circuit, and FIG.
Is an operation example. In FIG. 12, a circuit provided in the card-type electronic device is formed on a substrate 3 and exchanges signals with an external device such as a personal computer connected by a connector terminal 4 via an interface 18 and a charging circuit 10.
0, the secondary battery 7 is charged, and the power supply circuit 19 is charged.
Power.

A CPU 15 is connected to the interface 18. The CPU 15 has an internal memory 14 and a decoder 1.
6, and the semiconductor card memory 10 is connected via the contact portion 3g. The internal memory 14 stores data input from an external device such as a personal computer or the semiconductor card memory 10, and stores a program for driving the CPU 15 and the like. The decoder 16 is signal conversion means for forming a signal for driving the earphone 13 from data input from an external device or the semiconductor card memory 10. The signal formed by the decoder 16 is power-amplified by the AMP 17, Is a drive signal for driving the. The power supply circuit 19 supplies power to a circuit portion surrounded by a broken line at a predetermined voltage.

The card-type electronic device of the present invention has a rechargeable battery 7
Is used as a main power supply, and the secondary battery 7 is charged with power supplied from an external device via the connector terminal 4 and the charging circuit 1 is charged.
00. Accordingly, when the connector terminal 4 is connected to an external device, the card type electronic device is driven by transmitting / receiving signals to / from the external device through the connector terminal 4 to supply power, and the secondary battery 7 is connected to the external device. Charge. On the other hand, when the card type electronic device is used independently by removing the connector terminal 4 from the external device, the card type electronic device is driven using the charged secondary battery 7. As the secondary battery, for example, a lithium ion battery can be used.

FIG. 13 shows the charging circuit 100 and the power supply circuit 1.
9 shows one configuration example. The charging circuit 100 is connected to the connector terminal 4 on one side and connected to the secondary battery 7 and the power supply circuit 19 on the other side, and controls a switching element 100 a (for example, a switching element 100 a) that controls the connection between the connector terminal 4 and the secondary battery 7. Transistor or FET), a charge control circuit 100b that controls the charging of the secondary battery 7 by controlling the switching element 100a, and a circuit portion (for example, a diode circuit) that allows current to flow in one direction only toward the power supply circuit 19. Prepare.

The charge control circuit 100b includes a connector terminal 4
The voltage of the secondary battery 7 and the voltage value of the secondary battery 7 are detected, and the switching element 100a is controlled according to these voltage states to control the charging operation of the secondary battery 7. For example, when an external device is connected to the connector terminal 4 and a sufficient voltage is supplied, when the charging of the secondary battery 7 is insufficient, the switching element 100a is closed to charge the secondary battery 7, and the secondary battery 7 is charged. When the charging of the secondary battery 7 is sufficient, the switching element 100a is opened to prevent the secondary battery 7 from being overcharged. At this time, power is supplied to the power supply circuit 19 through a diode circuit.

When a sufficient voltage is not supplied from the external device or when the external device is not connected to the connector terminal 4, the switching element 100a is opened to discharge the secondary battery 7 and cause the power supply circuit to be opened. Power to 19. At this time, by opening the switching element 100a, overdischarge of the secondary battery 7 can be prevented. The power supply circuit 19 includes voltage conversion circuits (for example, DC / DC converters) 19a, 19b, and 19c that form predetermined voltages (for example, V1, V2, and V3), and supplies a predetermined voltage to a load. Note that the charge control circuit 100b and the power supply circuit 19 can be configured by an IC having the function.

FIG. 14A shows a case where the connector terminal is connected to an external device and the data writing operation and the charging operation are performed simultaneously. FIG. 14B shows the case where the connector terminal is disconnected from the external device and reproduced. Is performed. In FIG. 14, the flow of the signal is indicated by a dashed arrow,
The flow of power supply is indicated by solid arrows. In FIG. 14A, data input from the connector terminal 4 is signal-processed by the CPU 15 from the interface 18 and written into the semiconductor memory card 10 or the internal memory 14. In addition, charging of the secondary battery 7 and power supply to the power supply circuit 19 are performed from the connector terminal 4 via the charging circuit 100.

In FIG. 14B, at the time of reproduction, the CP
Under the control of U15, data written in the semiconductor memory card 10 or the internal memory 14 is read out, converted into an audio signal by the decoder 16, then power-amplified by the AMP 17, and the earphone 13 is driven. The driving power at this time is obtained by discharging the secondary battery 7.

According to the embodiment of the present invention, components can be functionally arranged in a card-type electronic device.
Further, according to the embodiment of the present invention, an earphone terminal to which an earphone plug can be favorably connected can be provided for a card-type electronic device having a limited width.
Further, according to the embodiment of the present invention, semiconductor memory cards of different sizes are held at predetermined positions and with good electrical connection with respect to card-type electronic devices having a limited width. be able to. Further, according to the embodiment of the present invention, it is possible to provide a power supply that can be accommodated in a card-type electronic device having a limited size and that can easily supply power required to drive the card-type electronic device. .

[0068]

As described above, according to the present invention,
For a card-type electronic device having a limited thickness, a semiconductor memory card having a different size, particularly a thickness, can be held at a predetermined position and with good electrical connection, and can be inserted and removed. The thickness of the card-type electronic device can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram schematically illustrating a card-type electronic device of the present invention.

FIG. 2 is a perspective view of each part of the configuration of the card-type electronic device of the present invention with a cover removed.

FIG. 3 is a component diagram of a configuration of a card-type electronic device of the present invention.

FIG. 4 is a plan view and a side view of both sides inside a case in a state where a cover of the configuration of the card-type electronic device of the present invention is removed.

FIG. 5 is a diagram for explaining an earphone terminal structure of the card-type electronic device of the present invention.

FIG. 6 is a diagram illustrating an earphone terminal structure of the card-type electronic device of the present invention.

FIG. 7 is a perspective view showing a substrate part of the card-type electronic device of the present invention.

FIG. 8 is a diagram for explaining a configuration of a substrate of the card-type electronic device of the present invention.

FIG. 9 is a diagram illustrating a configuration of a substrate of the card-type electronic device of the present invention.

FIG. 10 is a view for explaining a procedure for attaching a contact portion, a memory hold holder, and a spacer of the card-type electronic device of the present invention to a substrate.

FIG. 11 is a diagram showing an electrical connection between the semiconductor memory card according to the present invention and the substrate side in comparison with the related art.

FIG. 12 is a diagram for explaining a basic structure of a circuit configuration of the card-type electronic device of the present invention.

FIG. 13 is a diagram illustrating a configuration example of a charging circuit of the card-type electronic device of the present invention.

FIG. 14 is a diagram illustrating an operation example of the card-type electronic device of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Card-type electronic device 2 Case 2a, 2b End surface 2c, 2d Side surface 2e Top surface 2f Bottom surface 2g Frame 2h Corner 2i Screw 3 Substrate 3a Groove 3b Opening (notch) 3c Notch for engagement 3d For earphone terminal Notch 3e Top 3f Bottom 3g Contact 3h Contact 3i Pattern 3j Contact 3k Positioning hole 3l Separating joint 3m Positioning protrusion 3n Positioning hole 3p Solder 3q Disconnect 4 Connector terminal 5 Slot 6 Earphone terminal 6a opening 6b contacts 6c, 6d _1, 6d ₂ contact 6e holding portion 6f insulating portion 6 g _1, 6 g ₂ connection 7 secondary battery 8 hold button 9 memory hold holder 9a spacer 9b hold portion 9c groove 9d protruding portion 9e protruding Piece 10 semiconductor memory card 11 earphone plug 12 a Phone plug contact 12c, 12d Contact 13 Earphone 14 Internal memory 15 CPU 16 Decoder 17 AMP 18 Interface 19 Power supply circuit 19a, 19b, 19c Voltage conversion circuit 20 Cover 20a Upper cover 20b Lower cover 21 Display 21a Display unit 21b Transparent sheet 21c LCD 21d Conductive rubber 21e LCD holder 21f Engagement pawl 22 Operation part 22a Operation unit 22b Button 22c Dome switch 100 Charging circuit 100a Switching element 100b Charging control circuit

Claims (6)

[Claims] 1. A card-type electronic device in which a mounting member is placed in a case, wherein a circuit board supporting the mounting member includes:
A card-type electronic device, which constitutes a part of a holding unit that stores and holds a semiconductor memory card, and supports the semiconductor memory card. 2. The card-type electronic device according to claim 1, wherein the circuit board has a groove that allows a thickness of the circuit board in an electrical contact piece that is in electrical contact with the semiconductor memory card. A card-type electronic device characterized by the above-mentioned. 3. The card-type electronic device according to claim 2, wherein the groove penetrates a circuit board. 4. The card-type electronic device according to claim 1, wherein the case has a slot for inserting and removing a semiconductor memory card. 5. A card-type electronic device in which a mounting member is housed in a case, wherein the circuit board has an insertion / removal direction of the semiconductor memory card as a longitudinal direction of a groove, and the electric connection piece of an electric contact piece which makes electrical contact with the semiconductor memory card. A card-type electronic device, comprising: a through-groove that allows bending in a thickness direction of a substrate; and a bottom portion of a holding frame that holds the semiconductor memory card. 6. The card-type electronic device according to claim 1, wherein the card-type electronic device is a PC.
A card-type electronic device having a size conforming to the MCIA type 2 standard.