KR101672525B1 - Nails Beauty Organization and its manufacturing method - Google Patents

Abstract

The present invention is characterized in that circular grooves are repeatedly formed in a rectangular or triangular arrangement on the surface of a substrate by etching to form a central groove portion having a diameter smaller than that of the circular groove portion in each of the rectangular or triangular arrangements, The present invention relates to a nail cosmetic device capable of improving the polishing efficiency and forming a photosensitive resin to adhere well to the surface of a substrate, thereby omitting the chromium coating process, and a manufacturing method thereof.
In order to achieve the above object, the present invention provides a method of polishing a surface of a substrate by etching a circular groove to repeatedly form the nail, thereby grinding the nail cut at the non-etched flat portion between the circular grooves, Wherein a central groove portion having a diameter smaller than that of the circular groove portion is formed in an etching process in a plane portion of the center of the arrays so that the nail is formed in the center of the arrays, .

Description

[0001] The present invention relates to a nail beauty instrument and a manufacturing method thereof,

The present invention relates to a nail beauty instrument and a method of manufacturing the same. More particularly, the present invention relates to a nail beauty instrument and a method of manufacturing the same. More particularly, By providing a center groove portion having a diameter smaller than that of the circular groove portion, the polishing efficiency is improved because the polishing is also performed at the centers of the respective arrays, and the photosensitive resin is formed so as to stick to the surface of the substrate well, And a method of manufacturing the same.

In general, nail care equipment consists mostly of sandpapers. The nail surface is polished by using sand paper with alternate particle sizes, and then polished with a polisher, or a separate polish is applied to protect the surface. However, a lot of hair salon or nail art shop that deals with many customers needs to clean up many customers' nails in a short period of time. However, when using different types of sand filters with different grain sizes, it takes a long time to clean the nails. There is a disadvantage that washing and drying time are additionally required since the nail should be polished and then washed with water to clean the nails of other customers in a clean state.

In view of this, the prior art No. 723456 is a cutting structure that is repeatedly arranged in the same shape repeatedly on a plate-shaped glass surface so that the nail surface and the end thereof can be cut and polished at a time. The cutting structure has a polygonal shape, And a flat surface portion in the form of a square in four sides of the corrosion groove is formed on the surface so that the boundary line between the flat portion and the corrosion groove portion on the surface is formed by the cutting edge so that the polishing and polishing of the nail are simultaneously performed. I have proposed a nail beauty instrument.

In the conventional technique, a nail is cut in a cut groove portion and is polished while being polished in a flat portion.

However, since the flat portion is formed in a square shape and the cutting groove is surrounded by the flat portion, there is a technical problem that the nails beauty instrument has directionality so that the nails are only caught and not polished when the nails are trimmed in diagonal directions. That is, when the nail-beauty instrument is moved in a square shape, the cutting and polishing are performed at the same time, since the flat portion and the cutting groove are alternately arranged in a state in which the flat portion is placed in a square form. On the contrary, when the flat portion is moved in the diagonal direction, There was a problem that it was not polished because it was so sharp, and it only had to be cut.

In the prior art, the photoresist and the etching process of the semiconductor manufacturing process are used. In this case, since the photosensitive resin to which the glass surface is smoothly applied is easily dropped, chromium is first coated on the glass surface so that the photosensitive resin is coated on the glass surface A pretreatment technique was used. However, since the equipment according to the chromium coating is expensive and the coating time is long, the manufacturing cost is increased. Further, the patterned portion of the photosensitive resin after exposure is chemically treated to remove the chromium, The glass surface must be finally etched back, which complicates the process.

The prior art No. 846444 also discloses that the recessed portion and the planar portion are formed on the surface of the substrate in a repeated irregular pattern alternating with each other in the length and width direction of the substrate so that the boundary between the recessed portion and the planar portion becomes the cutting edge.

However, when the concave portion is formed in a rectangular shape, the corner portions of the concave portions are adjacent to each other, and when the nail is trimmed in the adjacent direction, there is a disadvantage in that the nail is only caught by the corners and is not polished. In addition, even if the concave portion is formed in a circular shape, if the circular concave portion and the concave groove portion are too close to each other, the area of the planar portion is reduced to degrade the polishing performance. On the other hand, if the concave portion is separated from the concave portion, There is a problem that the number of the recesses is reduced in a substrate having a limited area, resulting in poor cutting performance.

In addition, prior art No. 846444 uses a photoresist and an etching process in a semiconductor manufacturing process. However, there has been a technical problem in that chromium should be coated so that the photosensitive resin adheres well to the surface of the substrate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, which comprises etching the substrate surface to form circular recesses in a rectangular or triangular arrangement, By providing a center groove portion having a diameter smaller than that of the circular groove portion, the polishing efficiency is improved because the polishing is also performed at the centers of the respective arrays, and the photosensitive resin is formed so as to stick to the surface of the substrate well, And a method of manufacturing the same.

In order to achieve the above object, the present invention provides a method of polishing a surface of a substrate by etching a circular groove to repeatedly form the nail, thereby grinding the nail cut at the non-etched flat portion between the circular grooves, Wherein a central groove portion having a diameter smaller than that of the circular groove portion is formed in an etching process in a plane portion of the center of the arrays so that the nail is formed in the center of the arrays, .

According to the present invention, a circular groove portion is formed by etching on the surface of a substrate, and an unetched flat portion is formed between the circular groove portions so that the surface of the nail is cut by the circular groove portion and polished by the plane portion . At this time, the circular groove portion is formed of any one of a rectangular array, a rhombic array, or a triangular array. The centers of these arrays have a larger planar portion between adjacent circular grooves, resulting in non-uniformity of the planar portions.

If the area of the planar portions is non-uniform, there is a difference in the amount of polishing between the adjacent planar portions of the circular groove and the planar portions located at the center of the arrangement, so that the uniform polishing is not performed, The problem is that there is more gloss than the lesser one.

In an embodiment of the present invention, a center groove portion having a diameter smaller than that of the circular groove portion is formed at the center of the arrangement of the circular groove portions so as to solve the problem, and a flat portion positioned at the center of the arrangement, By preventing the difference from occurring, the polishing is performed even at the center of the array. Thereby, the directionality of polishing is eliminated and homogeneous polishing can be performed.

And a composition in which the photosensitive resin adheres well to the surface of the substrate and the portion exposed to ultraviolet rays after exposure is removed and the remaining portion has acid resistance resistant to acid in the etching process. Accordingly, since the chromium coating process used for the pretreatment on the surface of the conventional substrate is omitted, the manufacturing process is simplified and the productivity is improved. Moreover, since there is no need to provide chromium coating equipment, the manufacturing cost can be reduced.

1 is a plan view of a nail beauty instrument according to an embodiment of the present invention;
2 (a) and 2 (b) are enlarged plan views showing a rectangular array and a comparative example of the embodiment of the present invention
Fig. 3 is an enlarged plan view showing a rhombic arrangement of an embodiment of the present invention
4 is an enlarged plan view showing a triangular arrangement of an embodiment of the present invention.
5 is a partial cross-sectional view of a nail beauty instrument according to an embodiment of the present invention
6 is a view showing a manufacturing process of a nail beauty instrument according to an embodiment of the present invention
FIG. 7 is a flowchart of a nail beauty instrument according to an embodiment of the present invention.

The nail beauty instrument of the embodiment of the present invention is provided with the substrate 10 made of glass, crystal and artificial diamond. This substrate 10 is constituted by a rod having a size suitable for finishing the nail, and a large number of circular grooves 20, which are formed by etching, are arranged on the surface.

These circular grooves 20 are repeated in the form of a rectangular array, a rhombic array, or a triangular array. Center grooves 21 having a diameter smaller than that of the circular grooves 20 are formed at the centers of these arrays together by etching. A planar portion 11 which is not etched is provided between the circular groove portion 20 and the central groove portion 21. The planar portion 11 formed around the central groove portion 21 and the circular groove portion 20, There is no large difference in the area of the flat portions 11 formed around the periphery of the polishing pad 11, and uniform polishing can be performed irrespective of the polishing direction.

In the embodiment of the present invention constructed as described above, the circular grooves 20 are etched longitudinally and laterally in the form of a rectangular array, a rhombic array and a triangular array on the surface of the substrate 10, And the central groove portion 21 having a small diameter is formed by etching.

2 (a) to 4, the circular groove 20, the flat portion 11 and the circular groove 20 are continuous (continuous) in the process of finishing the nail while moving the substrate 10 in the up and down, left, right, and diagonal directions, Cutting and grinding are performed at the same time. Since the central groove 21 is also formed in the center of the array of the circular grooves 20, the central groove 21 and the flat portion 11 intersect with each other to perform cutting and polishing at the same time. And the planar portions 11 formed around the central groove portion 21 have no significant difference in area, so that uniform polishing can be performed.

2 (b) illustrates a technique in which the center groove 21 is not formed. As can be seen, the center of the arrangement of the circular grooves 20 remains as an un-etched planar portion, so that cutting is not performed. There is a difference in the amount of polishing between the portion passing through the center of the array of circular grooves 20 and the portion passing through the circular grooves 20 and uniform polishing can not be performed according to the polishing direction. However, it is practicable when it is manufactured in a low-cost type after being used twice.
Hereinafter, a method for manufacturing a nail beauty instrument according to an embodiment of the present invention will be described.

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6 to 7, the nail-beauty device of the embodiment of the present invention includes a photosensitive resin made of a composition that adheres well to the surface of a work 100 having a size capable of being cut by cutting a plurality of substrates, (300). After the photosensitive resin is applied to the surface of the work 100 in a uniform thickness and dried, the portion where the planar portion 11 is to be formed, except for the circular groove portion 20 and the center groove portion 21, A mask film 200 clogged is placed on the surface of the photosensitive resin 300 and exposed to ultraviolet rays (UV). The portion exposed to ultraviolet rays after exposure is developed and removed by the chemical, and only the portion to become the planar portion 11 sticks to the material 100 to protect the surface during etching.

The mask film 200 is formed in an array of any one of a rectangular array, a rhombic array, or a triangular array so as to form the circular groove 20 and the central groove 21. The pattern corresponding to the central groove 21 is within 100 mu m.

After the exposed portion is removed by the chemical, the surface of the workpiece 100 is exposed. When the exposed portion is treated with an etching solution (ammonium fluoride, nitric acid, and sulfuric acid), the surface of the workpiece is etched, (20) and a central groove (21). When the non-developed photosensitive resin 300 adhering to the surface of the material 100 after etching is removed, the nail-beauty device of the embodiment of the present invention is completed. In the etching process, the surface of the material 100 is protected without being etched because the non-developed photosensitive resin 300 is resistant to the etching solution, and the planar portion 11 is completed. When the material 100 is cut into a rod shape, the substrate 10 is completed.

In the above process, the mask film 200 may be formed only on the circular groove 20 so that the pattern of the center groove 21 is not formed. When the mask film 200 on which the pattern of the central groove 21 is not formed is etched as described above, the material 100 free of the central groove 21 as shown in FIG. 2B can be obtained. When the material 100 is cut into a bar shape having a predetermined size, the substrate 10 is free from the central groove 21.

In the case of the substrate 10 without the central groove 21, there is a difference in the area of the planar portions 11 formed between the center of the array and the circular grooves 20, and the amount of polishing may be different depending on the direction of polishing . However, since the surface of the conventional material (100) can be manufactured at a lower cost than when chrome is coated and etched, there is an advantageous advantage in production as a low-cost product which is used once or twice.

The photosensitive resin of one embodiment of the present invention was developed for the purpose of coating a glass material to protect the material during physico-chemical processing and to stick to the surface of the material. The above-mentioned photosensitive resin has a property of being able to realize a photosensitive property with an epoxy resin such as urethane long-chain polyol or bisphenol type or phenol type. By the addition polymerization method as follows to synthesize a photosensitive resin.

The primary reaction is preferably carried out in the presence of an acid anhydride having reactivity with urethane long chain polyol (polyethylene glycol, polypropylene glycol, PC, PCD) or epoxy resin (bisphenol type, phenol type, etc.) Acrylic acid and the like) and a reactive monomer (acrylate monomer such as 2-HEMA, HEA, GMA, N-vinylpyrrolidone, etc.) were sequentially subjected to addition polymerization.

Each reaction sequence was 1 ~ 4HR by addition of acid anhydride, 1 ~ 4HR by addition of reactive monomer, or addition reaction by acid anhydride and reactive monomer. As a reaction for giving the photoreactivity, 10 parts by weight of the photo-initiator was added to 100 g of the reactant, and the photosensitivity was tested using an 8 kw photocoupler for a printed circuit board (PCB).

Photoreactive initiators were subjected to photosensitization tests using commercially available photocuring initiators such as acetophenone, 2.2.-methoxy-2-phenylacetophenone, dichloroacetone phenone, trichloroacetophenone and the like.

TPO (Photoinitiator): Mono Acyl Phosphine (Hydroxylcetoe series), and Photoinitiator are photoinitiators that help make the oligomer and monomer chemically bond to the desired resin.

DPHA (monomer): dipentaerythritol hexaacrylate.

Barium sulphate (Baso4) solid additive: Function of resin filler (Pattern formation).

BYK-333: Polyether-modified polydimethylsiloxane series Solvent-free, solvent-free, waterborne coatings with strong surface tension reducing effect and additives for silicone surfaces for printing inks.

YDCN: Cresol novolak type epoxy resin. Due to its high curing density due to its multifunctional nature, it has excellent physical, chemical and electrical properties and can be used as EMC and epoxy.

KD-404: Bisphenol-A type epoxy resin with mechanical and chemical properties.

Primary test results

100 parts by weight of a photosensitive resin reaction product and 5 to 20 parts by weight of a photoinitiator were mixed and stirred, and then the mixture was stirred at 300 meshes to be applied with a coating film thickness of 10 to 30 탆 and exposed to an exposure dose of 100 to 1000 mj.

100mj 200mj 300mj 400mj 500mj 600mj 700mj 1000mj Solvent resistance × × △ △ △ ○ ○ ◎ Acid resistance × × △ △ ○ ○ ◎ ◎

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The photoreactivity was different depending on the kind of photoinitiator, and the difference in the film formability was observed, but the above results were obtained at 500 ~ 1000mj.

The above first photosensitive reactive material can be used as an additive capable of imparting acid resistance to an epoxy resin or a phenolic resin.

In the second reaction, the addition reaction of the acid anhydride and the reactive monomer to the first reaction proceeded as described above. The reaction products obtained by the second reaction were increased in molecular weight and photoreactivity and the following results were obtained.

Second test result

100 parts by weight of a photosensitive resin reaction product and 5 to 20 parts by weight of a photoinitiator were mixed and stirred, and then the mixture was stirred at 300 meshes to be applied with a coating film thickness of 10 to 30 탆 and exposed to an exposure dose of 100 to 1000 mj.

300mj 500mj 600mj 700mj 800mj 900mj 1000mj Solvent resistance ○ ○ ◎ ◎ ◎ ◎ ◎ Acid resistance ○ ○ ◎ ◎ ◎ ◎ ◎

(?: Very good,?: Good,?: Fair, X: poor)

The second photosensitive reactive material acts to increase light sensitivity and impart acid-resistant properties when attached to epoxy resins, phenolic resins, and other photosensitive reactive oligomers.

The light-sensitive resin synthesized over the first and second order has properties such as adhesion, chemical resistance and acid resistance, and is thermally cured by a photoreaction and a curing agent such as an amine-based thermal curing agent, an acid anhydride curing agent, dicyanediamide and melamine It can be coated on electronic parts material to achieve acid resistance.

The tertiary reaction is a synthesis that adds light sensitivity and film forming ability to the second reactant, thereby maintaining photoreactivity and facilitating workability. The third reaction was carried out by addition polymerization or addition of an acid anhydride and an epoxy resin to the second reaction product. Unlike the first and second reactions, the third reaction is a reaction process for developing, photocuring, chemical resistance, and film formation (when hot air is dried in a box oven at 80 ° C).

In the first and second synthesis, a photocuring film was formed to determine the film formation, chemical resistance and acid resistance. However, the third reaction was able to blow off the volatile matter by a hot air dryer and to confirm other properties after the film formation.

Third test result

100 parts by weight of a photosensitive resin reaction product and 5 to 20 parts by weight of a photoinitiator were mixed and agitated and printed at 300 mesh to coat a film thickness of 10 to 30 占 퐉 and irradiate an exposure amount of 100 to 1000 mj.

200mj 300mj 400mj 500mj 600mj 700mj 1000mj Solvent resistance ◎ ◎ ◎ ◎ ◎ ◎ ◎ Acid resistance ◎ ◎ ◎ ◎ ◎ ◎ ◎ Heat resistance △ △ ○ ○ ◎ ◎ ◎

(?: Very good,?: Good,?: Fair, X: poor)

The reaction results confirmed that the tertiary reactant is formed as a coating film and that the solvent resistance, acid resistance, heat resistance and mechanical properties are realized during light irradiation.

The quaternary reaction is a process for realizing photolithography (photographic development type resist) as a process for imparting developability to a reactant having a coating film obtained in the above third reaction without inhibiting photoreactivity. An acid anhydride and a reactive monomer may be added to the tertiary reactant, or a melt reaction may be carried out.

The reaction product obtained as a result of the quaternary reaction can obtain a final resist having developability, light reactivity, solvent resistance, adhesion and mechanical properties.

Fourth test result

100 parts by weight of the photosensitive resin reactant and 5 to 20 parts by weight of the photoinitiator were mixed and stirred and printed in 300 mesh. The coating was applied in a thickness of 10 to 30 占 퐉, dried in a hot air drier at 80 占 폚 for 30 to 60 minutes, Respectively.

200mj 300 400 500 600 700 800 Developability ◎ ◎ ◎ ◎ ◎ ◎ ◎ Solvent resistance △ △ ○ ○ ◎ ◎ ◎ Acid resistance ◎ ◎ ◎ ◎ ◎ ◎ ◎

(?: Very good,?: Good,?: Fair, X: poor)

As a result of the test of the fourth reactant, it was found that the photoreactivity was slightly reduced but the developability was excellent. At low light exposure, the developability is excessively high and the film itself disappears due to the developer. If the light amount is appropriate, the range of pattern implementation when used as a development resist is wide.

Based on the results of the experiment, the following photosensitive resin composition was obtained.

(Example 1)

30 g of cresol novolak epoxy resin, 70 g of high-value epoxy acrylate resin, and 10 g of an acid-modified polycarbonate mixed with phthalic anhydride at the terminal of a polycarbonate having a molecular weight of 1000 at 30 DEG C for 30 minutes to prepare a composition .

(Example 2)

A composition was prepared in the same manner as in Example 1, except that 20 g of acid-modified polycarbonate mixed with phthalic anhydride was used in the OH group at the terminal of the polycarbonate having a molecular weight of 1000.

(Example 3)

A composition was prepared in the same manner as in Example 1, except that 30 g of acid-modified polycarbonate mixed with phthalic anhydride was used in the OH group at the terminal of the polycarbonate having a molecular weight of 1000.

(Example 4)

A composition was prepared in the same manner as in Example 1, except that 40 g of acid-modified polycarbonate mixed with phthalic anhydride was used in the OH group at the terminal of the polycarbonate having a molecular weight of 1000.

(Example 5)

70 g of a high acid epoxy acrylate resin, 30 g of a phthalic anhydride, 30 g of mixed acid-denatured polycarbonate and 30 g of barium sulfate at a temperature of 30 DEG C for 30 minutes in an OH group at the terminal of a polycarbonate having a molecular weight of 1000; And

5 g of a mixture of 95 g of cresol novolak epoxy resin and 5 g of TGIC (triglycidylisocyanurate) in a ratio of 8: 2 to bisphenol A type epoxy resin and dicyandiamide, and 30 g of barium sulfate were mixed at 30 DEG C for 30 minutes to prepare a curing agent 7 : ≪ / RTI > 3 at a temperature of 20 DEG C for 30 minutes.

(Example 6)

70 g of a high acid epoxy acrylate resin, 30 g of a phthalic anhydride, 30 g of mixed acid-denatured polycarbonate and 30 g of barium sulfate at a temperature of 30 DEG C for 30 minutes in an OH group at the terminal of a polycarbonate having a molecular weight of 1000; And

5 g of a mixture of 95 g of cresol novolac epoxy resin and 8: 2 mixture of bisphenol A type epoxy resin and dicyandiamide, 50 g of titanium dioxide and 20 g of barium sulfate were mixed at 30 DEG C for 30 minutes to prepare a curing agent of 7: 3 At a temperature of < RTI ID = 0.0 > 20 C < / RTI > for 30 minutes.

The physical properties of the above examples were tested under the following conditions.

1) Acid resistance - Dipping the glass plate at 20 ° C for 30 minutes in 20% hydrofluoric acid (HF)

2) Alkali resistance - Dipping glass plate in 10% caustic soda (NaOH) at 25 ℃ for 30 minutes.

3) Solvent resistance - A glass plate was immersed in methylene chloride (CH2 (Cl2)) at 25 DEG C for 30 minutes,

4) Surface Hardness - Measuring the thermal properties of the glass plate

5) Surface state - Visual judgment (gloss, semi gloss, matte)

Results of physical property test

Acid resistance My alkalinity Solvent resistance Surface hardness Surface condition Example 1 ◎ ◎ ◎ 6H Polish Example 2 ◎ ◎ ◎ 6H Polish Example 3 ◎ ◎ ◎ 6H Polish Example 4 ○ ○ ○ 5H Polish Example 5 ◎ ◎ ◎ 6H Polish Example 6 ◎ ◎ ◎ 6H Semi-gloss

(?: Very good,?: Good,?: Fair, X: poor)

According to the composition, an acid-modified polycarbonate, which is a raw material for synthesis of urethane, is added to an epoxy resin to prepare a photosensitive resin having acid resistance and adhesiveness.

10: substrate 11: plane portion
20: circular groove portion 21: central groove portion
100: Material 200: mask film
300: photosensitive resin

Claims (7)

A circular groove portion is repeatedly formed by etching on the surface of the substrate so that the fingernail is separated and the cut nails are polished in the non-etched flat portion between the circular groove portions, wherein the circular groove portions are arranged in a square array, a rhombic array or a triangular array The nail-biting device comprising:
Wherein a central groove portion having a diameter smaller than that of the circular groove portion is formed in an etching process in a plane portion at the center of the arrangements so that the nails are clipped even in the center of the arrangements. The circular groove portions are repeatedly formed by etching on the surface of the substrate so that the nails are clipped and the uncut portions are formed between the circular groove portions so that the cut nails are polished, Or a triangular arrangement, the method comprising the steps of:
Applying and drying a photosensitive resin having tackiness and acid resistance on the surface of a material on which a plurality of the substrates can be manufactured;
And a mask pattern having a pattern corresponding to the circular grooves, wherein a pattern corresponding to the center grooves is formed on the mask film so that a central groove portion having a diameter smaller than that of the circular groove portions is formed for each center of the arrays Exposing the photosensitive resin to development, removing the developed portion to expose the surface of the material;
Etching the exposed portion of the workpiece with an etching solution to form the circular groove and the central groove; And
Removing the undeveloped photosensitive resin, and washing and then cutting the material to the size of the substrate. delete delete delete delete delete

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