JP6733729B2 - Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic component - Google Patents

Description

The present disclosure relates to a photosensitive resin composition, a photosensitive resin film, a method for producing a cured product, a laminate, and an electronic component.

In the field of manufacturing semiconductor integrated circuits (LSI) or wiring boards, a photosensitive material is used as a resist for forming a conductor pattern. For example, in manufacturing a wiring board, a resist is formed using a photosensitive resin composition, and then a conductor pattern, a metal post, and the like are formed by plating. More specifically, a photosensitive layer is formed using a photosensitive resin composition or the like on a support (substrate), the photosensitive layer is exposed through a predetermined mask pattern, and then a conductor pattern and a metal post are formed. A resist pattern (resist) is formed by performing a developing treatment so that a portion where the above is formed can be selectively removed (peeled). Next, a conductor such as copper is formed on the removed portion by a plating process, and then the resist pattern is removed, whereby a wiring board having a conductor pattern, a metal post and the like can be manufactured.

Conventionally, a thick conductor pattern and a metal post have been produced by growing a metal plating after removing the resist pattern. In order to meet such a demand, for example, a thick film photosensitive resist having a thickness of about 30 μm and a photosensitive layer having a thickness of about 65 μm has been used (see Patent Documents 1 and 2).
In addition, in recent years, in order to further improve the performance, a conductor layer having a thickness of 150 μm is formed by performing a plating treatment while destroying a layer existing in a direction in which plating growth is desired to be selectively performed among the metal ion diluted layers with a plating solution. Attempts have been made to form the film to a certain extent (see Patent Document 3).

JP, 2005-034926, A JP, 2014-074774, A JP, 2014-080674, A

However, in the conventional thick-film photosensitive resist, for example, when it is required to form a thick photosensitive layer having a thickness of 70 μm or more, it is difficult for light to pass to the bottom and the pattern shape may be deteriorated. Further, in the method described in Patent Document 3, since plating is advanced while the metal ion diluted layer is partially destroyed, it is difficult to form a stable and excellent pattern. Therefore, even when a photosensitive layer having a thickness of 70 μm, further 150 μm thicker than the conventional one, or thicker (thickness in the direction perpendicular to the substrate) is formed, the photosensitivity with excellent pattern formability is obtained. A resist is required.
Further, when a film-like or liquid photosensitive resin composition is provided in a manufacturing process with a view to mass production, the surface tackiness of the photosensitive layer (tackiness; in the case of a liquid photosensitive resin composition, after coating, When the tackiness of the photosensitive layer is high, the manufacturing apparatus is likely to be contaminated, and the manufacturing may be interrupted to clean the apparatus, or the photosensitive layer may be defective. Therefore, productivity becomes poor and it becomes difficult to mass-produce industrially. Therefore, it is required to reduce tackiness after coating.

Therefore, the problems to be solved by the present disclosure have been made in view of the above circumstances. For example, even when a thick photosensitive layer having a thickness of 70 μm or more is formed, excellent pattern formability and tack are achieved. Provided are a photosensitive resin composition having suppressed properties, a photosensitive resin film, a method for producing a cured product, a laminate, and an electronic component (hereinafter sometimes referred to as "photosensitive resin composition or the like"). Is.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the problems can be solved by a photosensitive resin composition having the following constitution. The present disclosure provides the following photosensitive resin composition and the like.

[1] Component (A): a high molecular weight polymer having a photopolymerizable functional group and a carbon-nitrogen bond, (B) component: a low molecular weight polymer having a photopolymerizable functional group, and (C) component: photopolymerization initiation. And an agent,
The photosensitive resin composition, wherein the component (A) contains a high molecular weight product having 6 or more ethylenically unsaturated groups as a photopolymerizable functional group and having a weight average molecular weight of 2,500 or more.
[2] The photosensitive resin composition according to the above [1], wherein the component (A) contains a high molecular weight compound having a (meth)acryloyl group as a photopolymerizable functional group.
[3] The photosensitive resin composition according to the above [1] or [2], wherein the component (A) contains a high molecular weight compound having a urethane bond as a carbon-nitrogen bond.
[4] The component (A) contains a high molecular weight polymer having 6 to 30 ethylenically unsaturated groups as a photopolymerizable functional group and having a weight average molecular weight of 2,500 to 100,000. The photosensitive resin composition according to any one of [1] to [3].
[5] The component (A) includes a high molecular weight product having 6 to 8 ethylenically unsaturated groups as a photopolymerizable functional group and having a weight average molecular weight of 2,500 to 50,000. The photosensitive resin composition according to any one of [1] to [4].
[6] The above-mentioned [1] to [1], wherein the component (A) contains a high molecular weight compound having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton and an aromatic ring skeleton. 5] The photosensitive resin composition according to any one of 5).
[7] The component (B) contains at least one selected from the group consisting of a low molecular weight body having a urethane bond, a low molecular weight body having an isocyanuric ring, and a low molecular weight body having an alicyclic skeleton. The photosensitive resin composition according to any one of [1] to [6].
[8] The photosensitive resin composition according to any one of the above [1] to [6], wherein the component (B) further contains a low molecular weight product having at least one ethylenically unsaturated group and a urethane bond.

（Ｒ^Ｃ１、Ｒ^Ｃ２及びＲ^Ｃ３は、各々独立に、水素原子、炭素数１〜６のアルキル基、又は炭素数１〜６のアルコキシ基を示し、Ｒ^Ｃ４及びＲ^Ｃ５は、各々独立に、水素原子、炭素数１〜６のアルキル基、炭素数１〜６のアルコキシ基、又は炭素数６〜１２のアリール基を示す。水素原子以外のＲ^Ｃ１〜Ｒ^Ｃ５は、各々置換基を有していてもよい。）

（Ｒ^Ｃ６は、水酸基、炭素数１〜６のアルコキシ基、又はアミノ基を示し、Ｒ^Ｃ７及びＲ^Ｃ８は、各々独立に、水素原子、炭素数１〜８のアルキル基、炭素数６〜１２のアリール基、又は炭素数１〜８のアルコキシ基を示す。Ｒ^Ｃ７とＲ^Ｃ８は、互いに結合して、炭素数３〜１６の環状構造を形成していてもよい。水酸基及び水素原子以外のＲ^Ｃ６〜Ｒ^Ｃ８は、各々置換基を有していてもよく、置換基を有するアミノ基は、置換基同士が互いに結合して、炭素数３〜１２の環状構造を形成していてもよい。
Ｒ^Ｃ９は、各々独立に、水素原子、ハロゲン原子、水酸基、アミノ基、メルカプト基、又は酸素原子、窒素原子及び硫黄原子から選ばれる１種以上の原子を含んでいてもよい炭素数１〜１０の有機基を示す。）[9] The component according to any one of [1] to [8] above, wherein the component (C) contains a compound represented by the following general formula (C1) or a compound represented by the following general formula (C2). Photosensitive resin composition.

(R ^C1 , R ^C2 and R ^C3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and R ^C4 and R ^C5 are each independently, A hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and each of R ^{C1 to} R ^C5 other than a hydrogen atom has a substituent. It may be.)

(R ^C6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group, and R ^C7 and R ^C8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkyl group having 6 to 12 carbon atoms. Or an alkoxy group having 1 to 8 carbon atoms, R ^C7 and R ^C8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms. Each of R ^{C6 to} R ^C8 may have a substituent, and in the amino group having a substituent, the substituents may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms. ..
Each R ^C9 independently has a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or 1 to 10 carbon atoms which may contain one or more atoms selected from an oxygen atom, a nitrogen atom and a sulfur atom. Represents an organic group of. )

[10] The component (D) according to any one of the above [1] to [9], which further contains a high molecular weight polymer having a glass transition temperature of 70 to 150° C. and having no carbon-nitrogen bond. Photosensitive resin composition.
[11] The photosensitive resin composition as described in any of [1] to [10] above, which further contains a component (E): a silane compound.
[12] The photosensitive resin composition according to the above [11], wherein the component (E) contains a silane compound having a thiol group.
[13] A photosensitive resin film having a photosensitive layer using the photosensitive resin composition according to any one of [1] to [12] above.
[14] A step of providing a photosensitive layer on the substrate using the photosensitive resin composition according to any one of the above [1] to [12] or the photosensitive resin film according to the above [13], A step of irradiating at least a part of the layer with an actinic ray to form a photo-cured portion, and a step of removing at least a part of the photosensitive layer other than the photo-cured portion to form a resin pattern in order. Method of manufacturing things.
[15] The method for producing a cured product according to [14], further including a step of heat-treating the resin pattern.
[16] The method for producing a cured product according to the above [14] or [15], wherein the resin pattern has a thickness of 70 μm or more and 300 μm or less.
[17] A laminate including the cured product of the photosensitive resin composition according to any one of [1] to [12].
[18] The laminate according to the above [17], wherein the cured product has a thickness of 70 μm or more and 300 μm or less.
[19] An electronic component including the cured product of the photosensitive resin composition according to any one of [1] to [12].

According to the present disclosure, it is possible to provide a photosensitive resin composition or the like that has excellent pattern formability even when a thick photosensitive layer having a thickness of 70 μm or more is formed, and has suppressed tackiness.

It is a schematic diagram of a resolution evaluation mask used in the examples.

Hereinafter, the present disclosure will be described in detail.
In the present specification, the numerical range indicated by using "to" indicates a range including the numerical values before and after "to" as the minimum value and the maximum value, respectively. In the numerical range described stepwise in the present specification, the upper limit value or the lower limit value of the numerical range of a certain step may be replaced with the upper limit value or the lower limit value of the numerical range of another step. In the numerical ranges described in the present specification, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
“(Meth)acrylic acid” means at least one of “acrylic acid” and “methacrylic acid” corresponding thereto, and the same applies to other similar expressions such as (meth)acrylate.

[Photosensitive resin composition]
The photosensitive resin composition according to the embodiment of the present disclosure (hereinafter, may be simply referred to as the present embodiment) includes (A) component: a high molecular weight body having a photopolymerizable functional group and a carbon-nitrogen bond, (B) component: a low molecular weight product having a photopolymerizable functional group, and (C) component: a photopolymerization initiator,
The component (A) is a photosensitive resin composition containing a high molecular weight product having 6 or more ethylenically unsaturated groups as a photopolymerizable functional group and having a weight average molecular weight of 2,500 or more.
In the present specification, the “solid content” is a non-volatile content excluding volatile substances such as water and solvent contained in the photosensitive resin composition, and when the resin composition is dried, it is volatilized. It shows the components that remain without it, and includes liquid, starch syrup and wax at room temperature around 25°C. Hereinafter, each component will be described.

<(A) component: high molecular weight polymer>
The photosensitive resin composition of the present embodiment includes a photopolymerizable functional group and a high molecular weight polymer having a carbon-nitrogen bond as the component (A), and the component (A) has 6 or more as the photopolymerizable functional group. It includes a high molecular weight product having an ethylenically unsaturated group and having a weight average molecular weight of 2,500 or more. The “high molecular weight substance” means a compound having a weight average molecular weight (Mw) of 2,500 or more. In addition, in this specification, the value of a weight average molecular weight is the value calculated|required by the standard polystyrene conversion using tetrahydrofuran (THF) by the gel permeation chromatograph (GPC) method.
Examples of the photopolymerizable functional group contained in the component (A) include (meth)acryloyl groups; ethylenically unsaturated groups such as alkenyl groups such as vinyl groups and allyl groups. From the viewpoint of improving pattern formability, a polymer having a (meth)acryloyl group as a photopolymerizable functional group may be contained, and a polymer having a urethane bond as a carbon-nitrogen bond may be contained. Examples of the high molecular weight compound having a (meth)acryloyl group include (meth)acrylate, and those having a urethane bond as a carbon-nitrogen bond include, for example, a (meth)acrylate having a urethane bond (hereinafter, referred to as “meth”). Sometimes referred to as "urethane (meth)acrylate".
As described above, the component (A) contains a high molecular weight compound having 6 or more ethylenically unsaturated groups as a photopolymerizable functional group and having a weight average molecular weight of 2,500 or more. The number of photopolymerizable functional groups contained in the high molecular weight polymer is appropriately selected from 6 to 30, 6 to 24, 6 to 20, or 6 to 15 in one molecule from the viewpoint of improving pattern formability and heat resistance. In addition, from the viewpoint of stabilizing the physical properties and characteristics of the obtained cured product and reducing the tackiness, it can be appropriately selected from 6 to 12, 6 to 10, or 6 to 8.
The component (A) may include a polymer having a skeleton of at least one selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton.

As the high molecular weight urethane (meth)acrylate, for example, a terminal (meth)acrylate having a hydroxyl group is reacted with a terminal isocyanate group of a polyadduct of an isocyanate compound having at least two isocyanate groups in a molecule and a diol compound. The reaction product thus obtained is included.
Specific examples of the isocyanate compound having at least two isocyanate groups in one molecule include aliphatic diisocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, decamethylene diisocyanate and dodecamethylene diisocyanate; 1,3-bis(isocyanatomethyl)cyclohexane, isophorone diisocyanate, 2,5-bis(isocyanatomethyl)norbornene, bis(4-isocyanatocyclohexyl)methane, 1,2-bis(4-isocyanatocyclohexyl)ethane Alicyclic diisocyanate compounds such as 2,2-bis(4-isocyanatocyclohexyl)propane, 2,2-bis(4-isocyanatocyclohexyl)hexafluoropropane and bicycloheptane triisocyanate; 1,4-phenylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate, hydrogenated xylylene diisocyanate, Examples thereof include diisocyanate compounds such as aromatic diisocyanate compounds such as naphthalene-1,5-diisocyanate, and multimers such as uretdione type dimers, isocyanurate type and biuret type trimers of these diisocyanate compounds. These may be used alone or in combination of two or more, and the two or three isocyanate compounds constituting the multimer may be the same or different.
Among them, from the viewpoint of improving the pattern formability, it may be appropriately selected from an alicyclic diisocyanate compound and a multimer of the diisocyanate compound, and particularly from an isophorone diisocyanate and an isocyanurate type multimer (isocyanurate polyisocyanate). Just select it.
The above isocyanate compounds can be used alone or in combination of two or more.

Examples of the diol compound include diol compounds having 1 to 20 carbon atoms, and specific examples thereof include ethylene glycol, diethylene glycol, propanediol, dipropylene glycol, butanediol, pentanediol, isopentyl glycol, and hexanediol. , Linear or branched saturated diol compounds such as nonanediol, decanediol, dodecanediol, dimethyldodecanediol and octadecanediol; Or a branched unsaturated diol compound; various cyclohexanediols, various cyclohexanedimethanol, various tricyclodecanedimethanol, diol compounds having an alicyclic skeleton such as hydrogenated bisphenol A, hydrogenated bisphenol F, and the like. Here, the saturated diol compound and the unsaturated diol compound can be collectively referred to as a diol compound having a chain hydrocarbon skeleton.
The above diol compounds can be used alone or in combination of two or more.

The diol compound having a chain hydrocarbon skeleton has 1 to 20 carbon atoms, 2 to 16 carbon atoms, from the viewpoints of improving pattern formability and increasing the glass transition point (Tg) after polymerization to improve water resistance. , 2-14 saturated diol compounds may be appropriately selected, and more specifically, ethylene glycol or octadecanediol may be appropriately selected.
In addition, the diol compound having an alicyclic skeleton has 5 to 20, 5 and 5 carbon atoms from the viewpoints of improving pattern formability and increasing the glass transition point (Tg) after polymerization to improve water resistance. It may be appropriately selected from 18, 6 to 16 diol compounds having an alicyclic skeleton, and more specifically, various cyclohexanediols such as 1,3-cyclohexanediol and 1,4-cyclohexanediol, and 1,3-cyclohexanediol. It may be appropriately selected from various cyclohexanedimethanols such as cyclohexanedimethanol and 1,4-cyclohexanedimethanol.

Examples of the (meth)acrylate having a hydroxyl group include compounds having at least one hydroxyl group and at least one (meth)acryloyl group in one molecule. More specifically, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2- Hydroxy-3-phenoxypropyl(meth)acrylate, 2-hydroxy-3-(o-phenylphenoxy)propyl(meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl(meth)acrylate, 2-hydroxy- Monofunctional (meth)acrylates such as 3-(2-naphthoxy)propyl(meth)acrylate, their ethoxylated products, their propoxylated products, their ethoxylated propoxylated products, and their caprolactone modified products; trimethylol Bifunctional (meth)acrylates such as propane di(meth)acrylate, glycerin di(meth)acrylate, bis(2-(meth)acryloyloxyethyl)(2-hydroxyethyl)isocyanurate, their ethoxylated products, these , A propoxylated product thereof, an ethoxylated propoxylated product thereof, and a caprolactone modified product thereof; cyclohexanedimethanol type epoxy di(meth)acrylate, tricyclodecane dimethanol type epoxy di(meth)acrylate, hydrogenated bisphenol A type epoxy di(meth) ) Acrylate, hydrogenated bisphenol F type epoxy di(meth)acrylate, hydroquinone type epoxy di(meth)acrylate, resorcinol type epoxy di(meth)acrylate, catechol type epoxy di(meth)acrylate, bisphenol A type epoxy di(meth)acrylate, bisphenol F type Bifunctional epoxy (meth)acrylates such as epoxy di(meth)acrylate, bisphenol AF type epoxy di(meth)acrylate, biphenol type epoxy di(meth)acrylate, fluorene bisphenol type epoxy di(meth)acrylate, isocyanuric acid monoallyl type epoxy di(meth)acrylate, etc. Trifunctional or higher functional (meth)acrylates such as ditrimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and ethoxylation thereof Body, propoxylated products thereof, ethoxylated propoxylated products thereof, and caprolactone-modified products thereof; Trifunctional or more functional epoxy (meth)acrylates such as enol novolac type epoxy (meth)acrylate, cresol novolac type epoxy poly(meth)acrylate, isocyanuric acid type epoxy tri(meth)acrylate; trimethylolpropane tri(meth)acrylate, ditri Examples thereof include hydroxypropylated products such as methylolpropane tetra(meth)acrylate.
These may be used alone or in combination of two or more.

Here, the ethoxylated product, the propoxylated product, the ethoxylated propoxylated product, and the hydroxypropylated product of (meth)acrylate are each, for example, an alcohol compound (or a phenol compound) which is a raw material of the (meth)acrylate. It is obtained by using, as a raw material, one or more ethylene oxide groups, propylene oxide groups, ethylene oxide groups and propylene oxide groups, and a hydroxypropyl group added.
The caprolactone modified product is obtained, for example, by using, as a raw material, a product obtained by modifying an alcohol compound (or a phenol compound), which is a raw material of the (meth)acrylate, with ε-caprolactone.

Examples of the reaction product obtained by reacting the terminal isocyanate group of the polyaddition product of the isocyanate compound having at least two isocyanate groups in one molecule with the diol compound with the (meth)acrylate having a hydroxyl group include the following general formula ( Examples thereof include those having the structural unit represented by 1).

In the general formula (1), X ₁ represents a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, and Y ₁ represents a chain hydrocarbon skeleton or an alicyclic skeleton. The divalent organic group contained therein is shown. Further, when the component (A) has a plurality of the structural units, a plurality of X ₁ and Y ₁ may be the same or different. That is, examples of the component (A) include those having at least one kind of skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton.

The divalent organic group of X ₁ is an organic group derived from the aliphatic diisocyanate compound, the alicyclic diisocyanate compound, and the aromatic diisocyanate compound exemplified as the compound having the above isocyanate group, that is, from the above isocyanate compound. Examples thereof include a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, which is a residue excluding the isocyanate group. The divalent organic group represented by X ₁ may be these residues themselves or residues derived from an isocyanate compound derivative such as a polyaddition product of the above isocyanate compound and a diol compound. May be.
From the viewpoint of improving the pattern formability and improving the transparency, water resistance, and moisture resistance of the resin composition in a well-balanced manner, X ₁ is a divalent organic group having an alicyclic skeleton, and among them, It may be a divalent organic group having an alicyclic skeleton, which is a residue of isophorone diisocyanate represented by (2).

The divalent organic group having a chain hydrocarbon skeleton or an alicyclic skeleton of Y ₁ is a diol compound having a chain hydrocarbon skeleton and a diol having an alicyclic skeleton, which are exemplified as the above-mentioned diol compound. Examples thereof include a compound-derived organic group, that is, a divalent organic group having a chain hydrocarbon skeleton or an alicyclic skeleton, which is a residue obtained by removing a hydroxyl group from the above diol compound.
Among them, from the viewpoint of improving the pattern formability and increasing the glass transition point (Tg) after polymerization to improve the water resistance, the divalent organic group having a chain hydrocarbon skeleton has 1 carbon atom. To 20, 2 to 16, and 2 to 14 may be appropriately selected from the residue obtained by removing the hydroxyl group from the saturated diol compound, and more specifically, it may be appropriately selected from the residue obtained by removing the hydroxyl group from ethylene glycol or octadecane diol. Good. From the same viewpoint, the divalent organic group having an alicyclic skeleton is the residue obtained by removing a hydroxyl group from a diol compound having an alicyclic skeleton having 5 to 20, 5 to 18, and 6 to 16 carbon atoms. It may be appropriately selected from the groups, and more specifically, various cyclohexanediols such as 1,3-cyclohexanediol and 1,4-cyclohexanediol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, and the like. It may be appropriately selected from residues obtained by removing a hydroxyl group from various cyclohexanedimethanols.

Specific examples of the reaction product obtained by reacting the terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule with a diol compound with a (meth)acrylate having a hydroxyl group include , And compounds represented by the following general formulas (3) and (4).

In formulas (3) and (4), n ₁ and n ₂ each independently represent an integer of 3 to 20.

The reaction product when an isocyanurate type trimer which is a trimer of diisocyanate (isocyanurate type triisocyanate) is used as the isocyanate compound is, for example, one of the following general formulas (5) and (6). The compounds shown may be mentioned.

In general formulas (5) and (6), n ₃ and n ₄ each independently represent an integer of 2 to 20.

Examples of commercially available products containing the urethane acrylate represented by the general formula (1) or (3) include UN-952 (functional group number: 10, Mw: 6,500 to 11,000), UN-953: ( Functional group number: 20, weight average molecular weight: 14,000 to 40,000), UN-954: (functional group number: 6, weight average molecular weight: 4,500), H-219 (functional group number: 9, weight average molecular weight: 25,000 to 50,000) (these are all trade names, manufactured by Negami Kogyo Co., Ltd.). Moreover, as a commercial item containing the urethane acrylate represented by the general formula (6), for example, UN-905 (functional group number: 15, Mw: 40,000 to 200,000) (trade name, manufactured by Negami Industry Co., Ltd. ) And the like.
Among these, UN-952 and UN-954 are preferable, and UN-954 is more preferable, from the viewpoint of pattern formability and photosensitivity.
In the above description, the number of functional groups in parentheses and Mw are the total number of (meth)acryloyl groups contained in urethane (meth)acrylate and the weight average molecular weight, respectively.

The total number of (meth)acryloyl groups (the number of photopolymerizable functional groups) contained in the high molecular weight urethane (meth)acrylate is 6 to 30, 6 to 6 in one molecule from the viewpoint of improving pattern formability and heat resistance. It may be appropriately selected from 24, 6 to 20, or 6 to 15, and from the viewpoint of stabilizing the physical properties and characteristics of the obtained cured product and reducing tackiness, 6 to 12, 6 to 10, Alternatively, it may be appropriately selected from 6 to 8.
When the number of photopolymerizable functional groups is 6 or more, heat resistance and rigidity of the cured product at high temperature can be improved as well as pattern formability. On the other hand, when the number of photopolymerizable functional groups is 30 or less, the rigidity of the cured product is improved and the adhesion to the substrate or the like is improved. Further, a resin composition having an appropriate viscosity can be obtained, the coating property is improved, and when the resin composition after coating is irradiated with light, only the surface portion is easily photocured rapidly and Since the phenomenon that the photo-curing does not proceed sufficiently can be suppressed and excellent resolution can be obtained, excellent pattern formability can be obtained even when a thick photosensitive layer is formed. Furthermore, after performing at least one of photo-curing and heat-curing, the unreacted (meth)acryloyl group remains less, and it is possible to further suppress variations in the physical properties and characteristics of the resulting cured product.

The component (A) has a weight average molecular weight of 2,500 or more, and may have a weight average molecular weight of 3,000 or more from the viewpoint of improving coatability and resolution of the resin composition, and further improving developability and compatibility. From the viewpoint, it may be 3,500 or more. On the other hand, the upper limit of the weight average molecular weight may be 100,000 or less, or 50,000 or less from the viewpoint of improving the coatability and resolution of the resin composition, and further, the developability and compatibility of the resin composition may be improved. From the viewpoint of improvement, it may be 40,000 or less, or 20,000 or less.
When the weight average molecular weight is 2,500 or more, it is possible to suppress the occurrence of dripping of the applied composition when it is applied onto a substrate, so that excellent film formability can be obtained. In addition, it is possible to easily form a thick photosensitive layer, and it is possible to suppress the problem that the stress of the resin due to curing shrinkage increases and the reliability decreases.
On the other hand, when the weight average molecular weight is 100,000 or less, coatability is improved, a thick photosensitive layer is easily formed, and pattern formability is improved. Further, since the solubility in the developing solution is also good, excellent resolution can be exhibited. Furthermore, the transparency of the cured product is improved, and a cured product having an excellent transmittance required as a transparent material can be obtained.
From the above, as one aspect of this embodiment, the component (A) has 6 to 30 ethylenically unsaturated groups as a photopolymerizable functional group, and has a weight average molecular weight of 2,500 to 100,000. It may be a photosensitive resin composition containing a certain high molecular weight substance. Further, the component (A) is a photosensitive resin composition containing a high molecular weight product having 6 to 8 ethylenically unsaturated groups as a photopolymerizable functional group and a weight average molecular weight of 2,500 to 50,000. It may be a thing.

The content of the component (A) may be appropriately selected from 10% by mass or more, 20% by mass or more, or 30% by mass or more based on the total solid content of the photosensitive resin composition. When the content is 10% by mass or more, the coatability is improved, and excellent pattern formability is obtained even when a thick photosensitive layer is formed.
Considering the pattern forming property of the obtained resin composition, the coating property, and the physical properties and characteristics required for the cured product of the resin composition, the upper limit of the content of the component (A) is the solid content of the photosensitive resin composition. It may be appropriately selected from 95 mass% or less, 85 mass% or less, or 75 mass% or less based on the total amount.
Further, the content of the high molecular weight urethane (meth)acrylate in the component (A) is 70 to 100% by mass based on the total solid content of the component (A), from the viewpoint of improving the pattern formability. -100 mass%, 90-100 mass%, 95-100 mass%, or 100 mass% (total amount) may be appropriately selected.

<(B) component: low molecular weight substance>
The photosensitive resin composition of the present embodiment contains a low molecular weight compound having a photopolymerizable functional group as the component (B). The "low molecular weight substance" means a compound having a weight average molecular weight of less than 2,500. Here, even when the low molecular weight substance having a photopolymerizable functional group has a silicon atom, it is not a silane compound of the component (E) described later, but a low molecular weight substance having a photopolymerizable functional group. It is classified into the component (B) with priority given to the existence.
Examples of the photopolymerizable functional group contained in the component (B) include (meth)acryloyl groups; ethylenically unsaturated groups such as alkenyl groups such as vinyl groups and allyl groups. The component (B) may be a low-molecular weight substance having at least one photopolymerizable functional group, and the component (B) may be a (meth)acryloyl group as a photopolymerizable functional group from the viewpoint of improving pattern formability. May have. From the viewpoint of improving pattern formability, the component (B) may have two or more photopolymerizable functional groups, or may have 2 to 5 photopolymerizable functional groups.
The photosensitive resin composition of the present embodiment includes, as the component (B), a component (B1): a low molecular weight substance having an isocyanuric ring, a component (B2): a low molecular weight substance having a urethane bond, and a component (B3): a fat. It is preferable to contain at least one selected from the group consisting of low molecular weight compounds having a cyclic skeleton. When the photosensitive resin composition of the present embodiment contains at least one of these, the adhesiveness with the base material of the electronic component is improved, and excellent pattern formability tends to be obtained. In addition, in the case of a low molecular weight compound having two or more of an isocyanuric ring, a urethane bond, and an alicyclic skeleton, if it has at least an isocyanuric ring, it is classified as a component (B1), and also has a urethane bond. When it has an alicyclic skeleton, it is classified as the component (B2) with priority given to having a urethane bond. That is, a low molecular weight substance having an alicyclic skeleton without having an isocyanuric ring and a urethane bond is classified as the component (B3).

(Component (B1): low molecular weight compound having isocyanuric ring)
From the viewpoint of improving pattern formability, the component (B1) may have two or more photopolymerizable functional groups, or may have 2 to 5 photopolymerizable functional groups. It may have two or three functional groups, or may have three.
The photopolymerizable functional group contained in the component (B1) is the one described as the photopolymerizable functional group contained in the component (B), and is a photopolymerizable functional group from the viewpoint of improving pattern formability. It may have a (meth)acryloyl group.
Examples of the component (B1) include compounds represented by the following general formula (7).

（一般式（７）中、Ｒ^４、Ｒ^５及びＲ^６は、各々独立に炭素数１〜６のアルキレン基を示し、Ｒ^７及びＲ^８は、各々独立に水素原子又はメチル基を示し、Ｒ^９は水素原子又は（メタ）アクリロイル基を示す。）

(In the general formula (7), R ⁴ , R ⁵ and R ⁶ each independently represent an alkylene group having 1 to 6 carbon atoms, and R ⁷ and R ⁸ each independently represent a hydrogen atom or a methyl group, R ⁹ represents a hydrogen atom or a (meth)acryloyl group.)

In formula (7), the alkylene group having 1 to 6 carbon atoms represented by R ⁴ , R ⁵ and R ⁶ may be an alkylene group having 1 to 4 carbon atoms, and is an alkylene group having 1 to 3 carbon atoms. It may be.
Examples of the alkylene group having 1 to 6 carbon atoms include methylene group, ethylene group, propylene group, butylene group, isopropylene group, isobutylene group, t-butylene group, pentylene group, hexylene group, and the like. From the viewpoint of improving pattern formability, it may be an ethylene group.
In the general formula (7), R ⁷ and R ⁸ each independently represent a hydrogen atom or a methyl group, and may be a hydrogen atom from the viewpoint of improving pattern formability.
In the general formula (7), R ⁹ represents a hydrogen atom or a (meth)acryloyl group, and may be a (meth)acryloyl group from the viewpoint of improving pattern formability.

The compound represented by the general formula (7) may be one or more selected from the group consisting of a compound represented by the following formula (7-1) and a compound represented by the following formula (7-2). Well, from the viewpoint of improving pattern formability, a compound represented by the following formula (7-1) may be used.

The weight average molecular weight of the component (B1) is less than 2,500, and may be appropriately selected from 200 to 1,500, 300 to 1,000, or 350 to 600 from the viewpoint of improving pattern formability. Good.

As the component (B1), a commercially available product may be used. Examples of commercially available products include "A-9300" (compound represented by the above formula (7-1)) manufactured by Shin-Nakamura Chemical Co., Ltd., "M-215" manufactured by Toagosei Co., Ltd. (the above formula ( 7-2) and the like.
The component (B1) can be used alone or in combination of two or more kinds.

(Component (B2): low molecular weight compound having urethane bond)
From the viewpoint of improving pattern formability, the component (B2) may have two or more photopolymerizable functional groups, and may have 2 to 6 photopolymerizable functional groups. It may have 2 to 4 functional groups, or may have 2 photopolymerizable functional groups.
The photopolymerizable functional group contained in the component (B2) is the one described as the photopolymerizable functional group contained in the component (B), and is a photopolymerizable functional group from the viewpoint of improving pattern formability. It may have a (meth)acryloyl group.
In the present specification, the component (B2) having a (meth)acryloyl group as a photopolymerizable functional group may be simply referred to as "low molecular weight urethane (meth)acrylate".

Examples of the urethane (meth)acrylate having a low molecular weight include a reaction product of a (meth)acrylate having a hydroxyl group and an isocyanate compound having an isocyanate group. Here, examples of the (meth)acrylate having a hydroxyl group and the isocyanate compound include the acrylates having a hydroxyl group and the isocyanate compound exemplified as the raw materials used for the production of the high molecular weight polymer described in the description of the component (A). To be As the isocyanate compound, a monoisocyanate compound other than the above-mentioned ones can be used. Examples of monoisocyanate compounds include aliphatic monoisocyanate compounds such as ethyl isocyanate, propyl isocyanate, butyl isocyanate, octadecyl isocyanate, and 2-isocyanatoethyl (meth)acrylate; alicyclic monoisocyanate compounds such as cyclohexyl isocyanate; phenyl isocyanate, etc. Aromatic monoisocyanate compounds and the like.
Here, examples of the appropriate selection from the viewpoint of improving the pattern formability and the like are the same as those appropriately selected from the same viewpoint as those used for the production of the high molecular weight polymer.

Further, as the low molecular weight urethane (meth)acrylate, a terminal (meth)acrylate having a hydroxyl group is reacted with a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule and a diol compound. The reaction product thus obtained is included. Here, as the isocyanate compound having at least two isocyanate groups in one molecule, the diol compound, and the (meth)acrylate having a hydroxyl group, the isocyanate group in one molecule exemplified as those used for producing a high molecular weight compound Examples thereof include an isocyanate compound having at least two, a diol compound, and a (meth)acrylate having a hydroxyl group. Here, examples of the appropriate selection from the viewpoint of improving the pattern formability and the like are the same as those appropriately selected from the same viewpoint as those used for the production of the high molecular weight polymer.
Examples of this reaction product include those having a structural unit represented by the following general formula (8).

In the general formula (8), X ₂ represents a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, and Y ₂ represents a chain hydrocarbon skeleton or an alicyclic skeleton. The divalent organic group which it has is shown. That is, examples of the component (B2) include those having at least one kind of skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton. Examples of X ₂ and Y ₂ are the same as those of X ₁ and Y ₁ in the general formula (1).
From the viewpoint of improving the pattern formability and improving the transparency, water resistance, and moisture resistance of the resin composition in a well-balanced manner, X ₂ is a divalent organic group having a chain hydrocarbon skeleton or a branched organic group. It may be appropriately selected from a divalent organic group having a chain hydrocarbon skeleton, a branched alkylene group having 2 to 12 carbon atoms, for example, the residue of the above aliphatic diisocyanate compound. From the same viewpoint, Y ₂ may be appropriately selected from a divalent organic group having an alicyclic skeleton, for example, a residue of a diol compound having the alicyclic skeleton.

Specific examples of the low molecular weight urethane (meth)acrylate include urethane acrylates represented by the following general formula (9).

In the general formula (9), n ₅ represents an integer of 1 to 4. R< ¹⁰ > and R< ¹¹ > are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and a plurality of R< ¹⁰ > and R< ¹¹ > are each at least three alkyl groups having 1 to 4 carbon atoms. ..
In the urethane acrylate represented by the general formula (9), X _{2 in the} general formula (8) is a residue of trimethylhexamethylene diisocyanate, which is a divalent organic group having a chain hydrocarbon skeleton, and Y ₂ has a structural unit is the residue of a divalent organic group cyclohexanedimethanol having an alicyclic skeleton, as commercially available products containing a urethane acrylate, for example, TMCH-5R (trade name, number of functional groups: 2, Mw:950, manufactured by Hitachi Chemical Co., Ltd.) and the like.
Further, as a commercial product containing a urethane (meth)acrylate having a structural unit represented by the general formula (8), KRM8452 (functional group number: 10, Mw: 1,200, manufactured by Daicel Ornex Co., Ltd.), UN -3320HA (functional group number: 6, Mw: 1,500, manufactured by Negami Industry Co., Ltd.), UN-3320HC (functional group number: 6, Mw: 1,500, manufactured by Negami Industry Co., Ltd.) and the like. In the above description, the number of functional groups and Mw in parentheses are the total number of (meth)acryloyl groups contained in urethane (meth)acrylate and the weight average molecular weight, respectively.

The weight average molecular weight of the component (B2) is less than 2,500, may be 2,000 or less from the viewpoint of improving the adhesion, and may be 1,500 or less from the viewpoint of improving the resolution. It may be 1,000 or less. On the other hand, the lower limit of the weight average molecular weight may be appropriately used depending on the desired purpose, but may be 500 or more, or 700 or more from the viewpoint of film forming property.
By including the component (B2) as the component (B), the effect of improving the pattern formability becomes large.

(Component (B3): low molecular weight compound having an alicyclic skeleton)
From the viewpoint of improving pattern formability, the component (B3) may have two or more photopolymerizable functional groups, or may have 2 to 4 photopolymerizable functional groups. It may have two sex functional groups.
The photopolymerizable functional group contained in the component (B3) is the one described as the photopolymerizable functional group contained in the component (B), and is a photopolymerizable functional group from the viewpoint of improving pattern formability. It may have a (meth)acryloyl group.
The alicyclic skeleton of the component (B3) is not particularly limited, and examples thereof include an alicyclic hydrocarbon skeleton having 5 to 20 carbon atoms. The alicyclic hydrocarbon skeleton is at least one selected from the group consisting of a cyclopentane skeleton, a cyclohexane skeleton, a cyclooctane skeleton, a cyclodecane skeleton, a norbornane skeleton, a dicyclopentane skeleton, and a tricyclodecane skeleton. Good. Among these, a tricyclodecane skeleton may be used from the viewpoint of improving pattern formability.

The weight average molecular weight of the component (B3) is less than 2,500, may be 2,000 or less from the viewpoint of improving adhesion, and is 1,500 or less from the viewpoint of improving resolution. , 1,000 or less, or 500 or less. On the other hand, the lower limit of the weight average molecular weight may be appropriately used depending on the desired purpose, but may be 150 or more, or 200 or more from the viewpoint of film formability.
The component (B3) may be tricyclodecane dimethanol diacrylate from the viewpoint of pattern formability.
As the component (B3), a commercially available product may be used. Examples of commercially available products include A-DCP (tricyclodecane dimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.).

The content (total content) of the component (B) is appropriately 5% by mass or more, 10% by mass or more, 20% by mass or more, or 30% by mass or more based on the total solid content of the photosensitive resin composition. You may choose. When the content of the component (B) is 5% by mass or more, excellent pattern formability can be obtained even when a thick photosensitive layer is formed, and excellent rigidity of the cured product can be obtained. From the same viewpoint, the upper limit of the content of the component (B) is appropriately 70% by mass or less, 60% by mass or less, or 50% by mass or less based on the total solid content of the photosensitive resin composition. Just select it.
The total solid content of the components (A) and (D) [however, when the component (D) is not contained, only the component (A)] The content of the component (B) based on 100 parts by mass is the pattern forming property. From the viewpoint of improving the rigidity of the cured product, it may be appropriately selected from 20 to 120 parts by mass, 25 to 100 parts by mass, 30 to 80 parts by mass, or 40 to 80 parts by mass.

The total content of the components (B1) to (B3) in the component (B) is 50 mass% or more, 70 mass% or more, 80 mass% or more, 90 mass% or more, 95 mass% or more, or substantially. It can be appropriately selected from 100% by mass.
When using at least two or more of the above-mentioned components (B1) to (B3), the content of the component (B2) in the total solid content of the component (B) is 10% by mass or more and 15% by mass. As described above, it may be appropriately selected from 20% by mass or more. When the content of the component (B2) is 10% by mass or more, excellent pattern formability can be obtained even when a thick photosensitive layer is formed, and excellent rigidity of the cured product can be obtained. From the same viewpoint, the upper limit of the component (B2) may be appropriately selected from 90% by mass or less, 80% by mass or less, and 70% by mass or less.

<(C) component: photopolymerization initiator>
The photosensitive resin composition of this embodiment contains a photopolymerization initiator as the component (C). The component (C) is not particularly limited as long as it is capable of polymerizing at least one of the component (A) and the component (B), and can be appropriately selected from photopolymerization initiators usually used. From the viewpoint of improving pattern formability, those that generate free radicals by actinic rays, for example, acylphosphine oxide-based, oxime ester-based, aromatic ketone-based, quinone-based, alkylphenone-based, imidazole-based, acridine-based, phenylglycine Examples thereof include photopolymerization initiators such as those based on coumarin and coumarin.

The acylphosphine oxide photopolymerization initiator has an acylphosphine oxide group [>P(=O)-C(=O)-R], and is, for example, (2,6-dimethoxybenzoyl)-2,4. ,6-Pentylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("IRGACURE-TPO" (manufactured by BASF)), ethyl-2. ,4,6-Trimethylbenzoylphenylphosphinate, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("IRGACURE-819" (manufactured by BASF)), (2,5-dihydroxyphenyl)diphenylphosphine Oxides, (p-hydroxyphenyl)diphenylphosphine oxide, bis(p-hydroxyphenyl)phenylphosphine oxide, tris(p-hydroxyphenyl)phosphine oxide and the like can be mentioned.

The oxime ester-based photopolymerization initiator is a photopolymerization initiator having an oxime ester bond, and is, for example, 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime)( Trade name: OXE-01, manufactured by BASF), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime) (trade name: OXE -02, manufactured by BASF), 1-phenyl-1,2-propanedione-2-[O-(ethoxycarbonyl)oxime] (trade name: Quantacure-PDO, manufactured by Nippon Kayaku Co., Ltd.) and the like.

Examples of the aromatic ketone photopolymerization initiator include benzophenone, N,N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N,N'-tetraethyl-4,4'-diaminobenzophenone, 4 -Methoxy-4'-dimethylaminobenzophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one ("IRGACURE-651" (manufactured by BASF)), 2-benzyl-2-dimethylamino-1-. (4-morpholinophenyl)-butan-1-one (“IRGACURE-369” (manufactured by BASF)), 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one. (“IRGACURE-907” (manufactured by BASF)) and the like.

Examples of the quinone-based photopolymerization initiator include 2-ethylanthraquinone, phenanthrenequinone, 2-t-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, and 2phenylanthraquinone. , 3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone and 2,3-dimethylanthraquinone. To be

Examples of the alkylphenone-based photopolymerization initiator include benzoin-based compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin phenyl ether, 2,2-dimethoxy-1,2-diphenylethane-1- ON (“IRGACURE-651” (manufactured by BASF), 1-hydroxy-cyclohexyl-phenyl-ketone (“IRGACURE-184” (manufactured by BASF)), 2-hydroxy-2-methyl-1-phenyl-propane- 1-one (“IRGACURE-1173” (manufactured by BASF)), 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one (“IRGACURE-”) 2959" (manufactured by BASF), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one ("IRGACURE". -127" (manufactured by BASF) and the like.

Examples of the imidazole-based photopolymerization initiator include 2,4,5-triarylimidazole dimers such as 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-diphenyl. -1,3-diazol-2-yl]-4,5-diphenylimidazole and other 2-(o-chlorophenyl)-4,5-diphenylimidazole dimers, 2-(o-chlorophenyl)-4,5- Di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2- (P-Methoxyphenyl)-4,5-diphenylimidazole dimer and the like.

Examples of the acridine-based photopolymerization initiator include 9-phenylacridine, 1,7-bis(9,9′-acridinyl)heptane, and the like.

Examples of the phenylglycine-based photopolymerization initiator include N-phenylglycine, N-methyl-N-phenylglycine, N-ethyl-N-phenylglycine, and the like.

Examples of the coumarin-based photopolymerization initiator include 7-amino-4-methylcoumarin, 7-dimethylamino-4-methylcoumarin, 7-diethylamino-4-methylcoumarin, 7-methylamino-4-methylcoumarin. , 7-ethylamino-4-methylcoumarin, 7-dimethylaminocyclopenta[c]coumarin, 7-aminocyclopenta[c]coumarin, 7-diethylaminocyclopenta[c]coumarin, 4,6-dimethyl-7-. Ethylaminocoumarin, 4,6-diethyl-7-ethylaminocoumarin, 4,6-dimethyl-7-diethylaminocoumarin, 4,6-dimethyl-7-dimethylaminocoumarin, 4,6-diethyl-7-ethylaminocoumarin , 4,6-Diethyl-7-dimethylaminocoumarin, 2,3,6,7,10,11-hexanehydro-1H,5H-cyclopenta[3,4][1]benzopyrano-[6,7,8- ij]Quinolidin 12(9H)-one, 7-diethylamino-5′,7′-dimethoxy-3,3′-carbonylbiscoumarin, 3,3′-carbonylbis[7-(diethylamino)coumarin], 7-diethylamino -3-Thienoxy silk marine etc. are mentioned.

Among these (C) photopolymerization initiators, a compound represented by the following general formula (C1) or a compound represented by the following general formula (C2) may be used from the viewpoint of improving pattern formability. ..

（Ｒ^Ｃ１、Ｒ^Ｃ２及びＲ^Ｃ３は、各々独立に、水素原子、炭素数１〜６のアルキル基、又は炭素数１〜６のアルコキシ基を示し、Ｒ^Ｃ４及びＲ^Ｃ５は、各々独立に、水素原子、炭素数１〜６のアルキル基、炭素数１〜６のアルコキシ基、又は炭素数６〜１２のアリール基を示す。水素原子以外のＲ^Ｃ１〜Ｒ^Ｃ５は、各々置換基を有していてもよい。）

(R ^C1 , R ^C2 and R ^C3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and R ^C4 and R ^C5 are each independently, A hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and each of R ^{C1 to} R ^C5 other than a hydrogen atom has a substituent. It may be.)

(R ^C6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group, and R ^C7 and R ^C8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkyl group having 6 to 12 carbon atoms. Or an alkoxy group having 1 to 8 carbon atoms, R ^C7 and R ^C8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms. Each of R ^{C6 to} R ^C8 may have a substituent, and in the amino group having a substituent, the substituents may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms. ..
Each R ^C9 independently has a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or 1 to 10 carbon atoms which may contain one or more atoms selected from an oxygen atom, a nitrogen atom and a sulfur atom. Represents an organic group of. )

In formula (C1), R ^C1 , R ^C2, and R ^C3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms.
The alkyl group having 1 to 6 carbon atoms represented by R ^C1 , R ^C2 and R ^C3 may be an alkyl group having 1 to 3 carbon atoms, or may be an alkyl group having 1 or 2 carbon atoms. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, an n-heptyl group, and an n-hexyl group.
The alkoxy group having 1 to 6 carbon atoms represented by R ^C1 , R ^C2 and R ^C3 may be an alkoxy group having 1 to 3 carbon atoms or an alkoxy group having 1 or 2 carbon atoms. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propyloxy group, an isopropyloxy group, an n-butoxy group, and a tert-butoxy group.
Among these groups, R ^C1 , R ^C2 and R ^C3 may be a methyl group from the viewpoint of improving pattern formability.

In formula (C1), R ^C4 and R ^C5 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms. ..
The alkyl group having 1 to 6 carbon atoms and the alkoxy group having 1 to 6 carbon atoms represented by R ^C4 and R ^C5 are the same as those described for R ^C1 , R ^C2 and R ^C3 .
The aryl group having 6 to 12 carbon atoms represented by R ^C4 and R ^C5 may be an aryl group having 6 to 10 carbon atoms or an aryl group having 6 to 8 carbon atoms. Examples of the aryl group include a phenyl group and a naphthyl group.

Examples of the substituent that R ^{C1 to} R ^C5 may have include a halogen atom, a carboxy group, a hydroxy group, an amino group, a mercapto group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms. Group, an aryl group having 6 to 12 carbon atoms, and the like. Examples of the alkyl group, alkoxy group and aryl group which are the substituents which R ^{C1 to} R ^C5 may have include the same as the alkyl group, alkoxy group and aryl group described as R ^{C1 to} R ^C5. ..

In the general formula (C2), R ^C6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group.
The alkoxy group represented by R ^C6 is the same as the case of R ^C1 , R ^C2 and R ^C3 in the general formula (C1).
Among these groups, R ^C6 may be a hydroxyl group from the viewpoint of improving pattern formability.

In formula (C2), R ^C7 and R ^C8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or an aryl group having 6 to 12 carbon atoms. ..
^{Examples of the} alkyl group, alkoxy group and aryl group represented by R ^C7 and R ^C8 include the same groups as the alkyl group, alkoxy group and aryl group represented by R ^{C1 to} R ^C5 in formula (C1).
R ^C7 and R ^C8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms.
The cyclic structure may be a cyclic structure having 4 to 10 carbon atoms or a cyclic structure having 5 to 8 carbon atoms.
The cyclic structure may be an alicyclic structure from the viewpoint of improving pattern formability, and examples of the alicyclic structure include a cyclopentane structure, a cyclohexane structure, a cycloheptane structure, and a cyclooctane structure. Also, these alicyclic structures may include carbon atoms to which R ^C7 and R ^C8 are directly bonded.

The substituents that R ^{C6 to} R ^C8 may have are the same as the substituents that R ^{C1 to} R ^C5 in the general formula (C1) may have.
However, in the amino group having a substituent, the substituents may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms.
The cyclic structure formed by the substituent of the amino group may be a cyclic structure having 3 to 10 carbon atoms or a cyclic structure having 3 to 5 carbon atoms.
The cyclic structure may be a 5- to 10-membered ring containing a nitrogen atom of an amino group, a 5- to 7-membered ring containing a nitrogen atom of an amino group, or a 6-membered ring containing a nitrogen atom of an amino group. It may be a ring. Furthermore, these cyclic structures may contain a hetero atom other than a nitrogen atom such as an oxygen atom. Specific examples of the cyclic structure formed by the substituent of the amino group include a structure represented by the following formula (C3) (morpholino group).

In formula (C2), each R ^C9 independently contains a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or at least one atom selected from an oxygen atom, a nitrogen atom and a sulfur atom. Is an organic group having 1 to 10 carbon atoms.
The organic group having 1 to 10 carbon atoms represented by R ^C9 may be an organic group having 1 to 6 carbon atoms, or may be an organic group having 1 to 4 carbon atoms.
The ^C1-10 organic group represented by R ^C9 may be a hydrocarbon group such as an alkyl group, an alkenyl group, or an aryl group. Examples of the alkyl group, alkenyl group and aryl group include the same groups as the alkyl group, alkenyl group and aryl group represented by R ^{C1 to} R ^C5 in the general formula (C1).
Examples of the organic group having 1 to 10 carbon atoms containing an oxygen atom represented by R ^C9 include an alkoxy group having 1 to 10 carbon atoms.
As a C1-C10 organic group containing the nitrogen atom which R ^<C9> represents, the group represented by the said General formula (C3) is mentioned, for example.
Examples of the organic group having 1 to 10 carbon atoms containing a sulfur atom represented by R ^C9 include an alkylthio group such as a methylthio group.

As the content of the component (C), the amount at which the absorbance at a wavelength of 365 nm is 0.35 or less in a thickness (after drying) of the photosensitive layer formed of the photosensitive resin composition of 50 μm is 0.35 or less. The amount may be appropriately selected from the following amounts, an amount of 0.2 or less, or an amount of 0.1 or less. With the above content, for example, even when a pattern is formed with a thick photosensitive layer of 70 μm or more, light easily passes through to the bottom of the photosensitive layer (the surface of the photosensitive layer on the substrate side), so that the pattern is formed. It is possible to improve the sex. Here, the absorbance is, for example, using an ultraviolet-visible spectrophotometer (product name: "U-3310 Spectrophotometer", manufactured by Hitachi High-Technologies Corporation), using a polyethylene terephthalate film alone as a reference, and the wavelength of 365 nm. The absorbance for light can be measured.

The content of the component (C) may be appropriately determined by the absorbance of the photosensitive layer at a thickness of 50 μm, and is usually 0.05 to 20% by mass and 0.05 to 20% by mass based on the total solid content of the photosensitive resin composition. It may be appropriately selected from 12% by mass, 0.1 to 8% by mass, 0.1 to 5% by mass, or 0.1 to 3% by mass. With the above content, the sensitivity of the photosensitive resin composition can be improved, deterioration of the resist shape can be suppressed, and pattern formability can be improved.

In addition to the above-mentioned component (C), N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine and the like can be used. The (C′) photopolymerization initiation auxiliary agent such as a primary amine may be used alone or in combination of two or more kinds.

<(D) component: high Tg high molecular weight polymer>
The photosensitive resin composition of the present embodiment may contain, as the component (D), a polymer having a glass transition temperature of 70 to 150° C. and no carbon-nitrogen bond. The “high molecular weight substance” has the same definition as in the component (A). By containing the component (D), it has an effect of suppressing tack of the photosensitive resin composition.
The component (D) may contain an ethylenically unsaturated group from the viewpoint of pattern formability and the reduction of tackiness. Examples of the ethylenically unsaturated group include a (meth)acryloyl group and a vinyl group. From the viewpoint of pattern formability, a (meth)acryloyl group may be used.
The component (D) may contain a high molecular weight compound having at least one kind of skeleton selected from the group consisting of an alicyclic skeleton and an aromatic ring skeleton. From the viewpoint, it may contain a high molecular weight compound having an alicyclic skeleton.

The high molecular weight compound having an alicyclic skeleton is, for example, a part of an acid group derived from the acid group-containing acrylic resin (d1) having no carbon-nitrogen bond, and an alicyclic ring having no carbon-nitrogen bond. It can be produced by reacting with an epoxy group derived from the formula epoxy group-containing unsaturated compound (d2).
Examples of the acid group-containing acrylic resin (d1) having no carbon-nitrogen bond include an acid having an ethylenically unsaturated group and a monomer such as an ester of (meth)acrylic acid, a vinyl aromatic compound, or a polyolefin compound. A copolymer obtained by copolymerizing one or more selected ones can be used. Specifically, an acid having an ethylenically unsaturated group such as (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, 2-carboxypropyl (meth)acrylate, (anhydrous)maleic acid is used as an essential component. In addition, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, stearyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl ( Esters of (meth)acrylic acid such as (meth)acrylate; vinyl aromatic compounds such as styrene, α-methylstyrene, vinyltoluene, p-chlorostyrene; monomers of polyolefin compounds such as butadiene, isoprene, chloroprene, and methyl Examples thereof include copolymers obtained by copolymerizing one or more kinds of monomers selected from other monomers such as isopropenyl ketone, vinyl acetate and vinyl propionate.
The acid value of the component (d1) may be 15 mgKOH/g or more, and may be 40 to 500 mgKOH/g. Since the component (d1) has such an acid value, a sufficient amount of acid groups remain in the component (D) even after the component (d1) and the component (d2) described later are reacted. Become.

The alicyclic epoxy group-containing unsaturated compound (d2) having no carbon-nitrogen bond is preferably a compound having one ethylenically unsaturated group and one alicyclic epoxy group in one molecule. Specific examples include compounds represented by any of the following formulas (I) to (X).

Here, R ^D1 is each independently a hydrogen atom or a methyl group. R ^D2's are each independently an aliphatic saturated hydrocarbon group.
As the aliphatic saturated hydrocarbon group represented by R ^D2 , a linear or branched alkylene group having 1 to 6 carbon atoms, a cycloalkylene group having 3 to 8 carbon atoms, an arylene group having 6 to 14 carbon atoms, and Examples thereof include a divalent organic group composed of these combinations. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a tetramethylene group, an ethylethylene group, a pentamethylene group, and a hexamethylene group. Examples of the cycloalkylene group include a cyclopentylene group, a cyclohexylene group, a cyclooctylene group and the like. Examples of the arylene group include a phenylene group and a naphthylene group. The divalent organic group comprising a combination thereof, for example, -CH ₂ - phenylene group _-CH 2 -, - CH ₂ - cyclohexylene group -CH ₂ - and the like.
R ^D2 is a methylene group, an ethylene group, a propylene group, a tetramethylene group, an ethylethylene group, a pentamethylene group, a hexamethylene group, a phenylene group, or cyclohexylene from the viewpoint of pattern formability and the reduction of tackiness. groups, -CH 2 _- phenylene group -CH 2 _- and a may well include a methylene group, an ethylene group, may be a propylene group, or may be a methylene group.

The alicyclic epoxy group-containing unsaturated compound (d2) having no carbon-nitrogen bond may be a compound represented by the above formula (III) from the viewpoint of pattern formability.
As the component (D), a commercially available product may be used, and examples thereof include (ACA)Z250 of Cyclomer P series (manufactured by Daicel Ornex Co., Ltd., acid value: 101.7 mgKOH/g). (ACA)Z250 is a resin composed of three structural units represented by the following formula, which is produced by the reaction of an acid group-containing acrylic resin and an alicyclic epoxy group-containing unsaturated compound.

（式中、Ｒ^Ｄ１は水素原子又はメチル基を表す。Ｒ^Ｄ３は炭素数１〜６のアルキル基または炭素数１〜６のヒドロキシアルキル基を表す。）

(In the formula, R ^D1 represents a hydrogen atom or a methyl group. R ^D3 represents an alkyl group having 1 to 6 carbon atoms or a hydroxyalkyl group having 1 to 6 carbon atoms.)

The glass transition temperature of the component (D) is 70 to 150°C, but may be 100 to 150°C, 115 to 150°C, or 125 to 150°C. Here, the glass transition temperature of the component (D) is a value measured by the following method.
(Method for measuring glass transition temperature of component (D))
As a pretreatment for measurement, the component (D) is heated at 120° C. for 3 hours and then cooled to prepare a sample.
Using 10 mg of the sample, a differential scanning calorimeter (manufactured by Shimadzu Corporation, trade name: DSC-50) was used under a nitrogen stream to raise the temperature in the temperature range of 25 to 200° C. at a heating rate of 20° C./min. However, the influence of solvent etc. is eliminated. After cooling to 25° C., the temperature is raised again under the same conditions, and the temperature at which the deviation of the baseline starts is taken as the glass transition temperature.

The weight average molecular weight of the component (D) may be 3,000 to 50,000, 4,000 to 40,000, or 5,000 to 30,000. .. If it is 3,000 or more, the tack suppressing effect tends to be large, and if it is 50,000 or less, the resolution tends to be improved.

When the photosensitive resin composition of the present embodiment contains the component (D), the contents of the component (D) are (A) component and (D) component from the viewpoints of pattern formability and reduction of tackiness. It may be 5 to 60 parts by mass, 10 to 40 parts by mass, or 10 to 30 parts by mass with respect to 100 parts by mass in total of the components.

<(E) component: Silane compound>
Moreover, the photosensitive resin composition of this embodiment may further contain a (E) silane compound. As the component (E), a known silane coupling agent can be used. The component (E) can improve the adhesiveness of the electronic component to the substrate, and particularly when the substrate contains silicon (for example, a glass substrate, a silicon wafer, an epoxy resin-impregnated glass cloth substrate, etc.). Is valid. Examples of the silane coupling agent include alkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane; (meth)acryloxypropyltrimethoxysilane, (meth)acryloxypropylmethyldimethoxysilane. (Meth)acryloyl group-containing alkoxysilane such as γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N-(1, Amine-based alkoxysilane such as 3-dimethylbutylidene)propylamine; γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, glycidoxypropylmethyldiethoxysilane, glycidoxypropylmethyldi Glycidoxy group-containing alkoxysilanes such as isopropenoxysilane; Alicyclic epoxy group-containing alkoxysilanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; Ureido group-containing alkoxys such as 3-ureidopropyltriethoxysilane Silanes; mercapto group-containing alkoxysilanes such as 3-mercaptopropyltrimethoxysilane and 3-mercaptopropylmethyldimethoxysilane; carbamate group-containing alkoxysilanes such as triethoxysilylpropylethylcarbamate; 3-(triethoxysilyl)propylsuccinic anhydride Examples thereof include polybasic acid anhydride group-containing alkoxysilanes. These may be used alone or in combination of two or more.
From the viewpoint of further improving adhesiveness, (meth)acryloxypropyltrimethoxysilane, (meth)acryloxypropylmethyldimethoxysilane, and other (meth)acryloyl group-containing alkoxysilanes, glycidoxypropyltrimethoxysilane, glycidoxy A silane coupling agent having an ethylenically unsaturated group in the molecule such as glycidoxy group-containing alkoxysilane such as propylmethyldiethoxysilane and glycidoxypropylmethyldiisopropenoxysilane may be used.

When the photosensitive resin composition of the present embodiment contains the component (E), the content of the component (E) is 0.05 to 15% by mass, based on the total solid content of the photosensitive resin composition, and 0. 1 to 10% by mass, 0.1 to 7% by mass, 1 to 7% by mass, or 1 to 5% by mass may be appropriately selected. With the above content, deterioration of the resist shape can be suppressed and pattern formability can be improved.

<(F) component: thermal radical polymerization initiator>
Further, the photosensitive resin composition of the present embodiment may further contain (F) a thermal radical polymerization initiator. The component (F) is not particularly limited and includes, for example, α,α′-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide and the like. Dialkyl peroxide; methyl ethyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, and other ketone peroxides; 1,1-bis(t-butylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)- 2-methylcyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(t-hexylperoxy)cyclohexane, 1,1-bis(t-hexyl) Peroxy)-3,3,5-trimethylcyclohexane and other peroxyketals; p-menthane hydroperoxide and other hydroperoxides; octanoyl peroxide, lauroyl peroxide, stearyl peroxide, benzoyl peroxide and other diacyl peroxides Oxide; peroxy such as bis(4-t-butylcyclohexyl)peroxydicarbonate, di-2-ethoxyethylperoxydicarbonate, di-2-ethylhexylperoxydicarbonate, di-3-methoxybutylperoxycarbonate Carbonate; t-butylperoxypivalate, t-hexylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-Ethylhexanoylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-hexylper Oxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurylate, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate Peroxides such as peroxyesters such as, t-butylperoxybenzoate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane and t-butylperoxyacetate Polymerization initiator, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2' Examples thereof include azo-based polymerization initiators such as -azobis(4-methoxy-2'-dimethylvaleronitrile).

As the component (F), a peroxide polymerization initiator, a dialkyl peroxide polymerization initiator, and among them, dicumyl peroxide can be selected from the viewpoint of improving pattern formability. Further, the component (F) can be used alone or in combination of two or more kinds.

When the photosensitive resin composition of the present embodiment contains the component (F), its content is 0.1 to 10% by mass and 0.2 to 5% by mass based on the total solid content of the photosensitive resin composition. It may be appropriately selected from mass% or 0.3 to 1.5 mass %. With the above content, the heat resistance of the photosensitive resin composition is improved and the reliability when used as a permanent film is improved.

<(G) component: Inorganic filler>
The photosensitive resin composition of the present embodiment may contain the component (G) for the purpose of further improving various properties such as adhesion between the photosensitive resin composition and the substrate, heat resistance, and rigidity of the cured product. it can.
Examples of the component (G) include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), titania (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), zirconia (ZrO ₂ ), silicon nitride (Si ₃ N ₃ ). ₄ ), barium titanate (BaO.TiO ₂ ), barium carbonate (BaCO ₃ ), magnesium carbonate (MgCO ₃ ), aluminum hydroxide (Al(OH) ₃ ), magnesium hydroxide (Mg(OH) ₂ ), titanium Lead oxide (PbO.TiO ₂ ), lead zirconate titanate (PZT), lead lanthanum zirconate titanate (PLZT), gallium oxide (Ga ₂ O ₃ ), spinel (MgO.Al ₂ O ₃ ), mullite (3Al) ₂ O ₃ · 2SiO _2), cordierite _{(2MgO · 2Al 2 O 3 ·} 5SiO 2), talc _{(3MgO · 4SiO 2 · H 2} O), aluminum titanate _{(TiO 2 · Al 2 O 3} ), yttria-containing zirconia _{(Y 2 O 3 · ZrO 2} ), barium silicate (BaO · 8SiO _2), boron nitride (BN), calcium carbonate (CaCO _3), barium sulfate (BaSO _4), calcium sulfate (CaSO _4), zinc oxide (ZnO), magnesium titanate (MgO.TiO ₂ ), hydrotalcite, mica, calcined kaolin, carbon (C) and the like can be used. These inorganic fillers may be used alone or in combination of two or more.

The average particle size of the component (G) is appropriately selected from 0.01 to 3 μm, 0.01 to 2 μm, or 0.02 to 1 μm from the viewpoint of improving adhesiveness, heat resistance, and rigidity of the cured product. Good. Here, the average particle size of the component (G) is the average particle size of the inorganic filler dispersed in the photosensitive resin composition, and is a value obtained by the following measurement. First, after diluting (or dissolving) the photosensitive resin composition 1000 times with methyl ethyl ketone, a submicron particle analyzer (Beckman Coulter, Inc., trade name: N5) was used to comply with international standard ISO 13321. Then, particles having a refractive index of 1.38 and dispersed in a solvent are measured, and the particle diameter at an integrated value of 50% (volume basis) in the particle size distribution is taken as the average particle diameter. Further, the component (G) contained in the photosensitive layer provided on the carrier film or the cured film of the photosensitive resin composition is diluted (or dissolved) 1000 times (volume ratio) with the solvent as described above. Then, it can be measured by using the submicron particle analyzer.

When the photosensitive resin composition of the present embodiment contains the component (G), the upper limit of the content is 10% by mass or less, 5% by mass or less, or the total solid content of the photosensitive resin composition. 1% by mass or less may be appropriately selected, and the lower limit may be appropriately selected from 0% by mass or more, and may be 0% by mass (that is, it may not be included). As described above, by substantially not containing the component (G), the transmittance of the photosensitive resin composition is improved, and for example, even when a pattern is formed with a thick photosensitive layer of 70 μm or more, the photosensitive layer Since it becomes easy for light to properly pass through to the bottom (the surface of the photosensitive layer on the side of the substrate), pattern formability is improved.

<Other additives>
The photosensitive resin composition of the present embodiment may further contain additives such as a sensitizer, a heat resistant high molecular weight polymer, a thermal crosslinking agent, and an adhesion aid other than the component (E), if necessary. You can

Examples of the sensitizer include sensitizers of pyrazolines, anthracenes, xanthones, oxazoles, benzoxazoles, thiazoles, benzothiazoles, triazoles, stilbenes, triazines, thiophenes and naphthalimides. Agents. These may be used alone or in combination of two or more.

As the heat-resistant high molecular weight material, for example, from the viewpoint of improving processability, it has high heat resistance and is used as an engineering plastic, polyoxazole and their precursors, phenol novolac, novolac resins such as cresol novolac, and polyamide. Examples thereof include imide and polyamide. These may be used alone or in combination of two or more.

As the thermal crosslinking agent, from the viewpoint of improving the rigidity of the cured product, for example, from the group consisting of an epoxy resin, a phenol resin substituted at the α-position with a methylol group, an alkoxymethyl group, a methylol group and an alkoxymethyl group at the N-position. Examples include melamine resins and urea resins substituted with at least one selected. These may be used alone or in combination of two or more.

The content of these other additives is not particularly limited as long as the effect of the photosensitive resin composition of the present embodiment is not impaired, and for example, 0 based on the total solid content of the photosensitive resin composition. 1 to 10% by mass, 0.3 to 5% by mass, or 0.5 to 5% by mass may be appropriately selected.

<Diluent>
A diluent can be used in the photosensitive resin composition of the present embodiment, if necessary. Examples of the diluent include alcohols having 1 to 6 carbon atoms such as isopropanol, isobutanol and t-butanol; amides such as N,N-dimethylformamide, N,N-dimethylacetamide and N-methylpyrrolidone; dimethyl. Sulfur atom-containing compounds such as sulfoxide and sulfolane; γ-butyrolactone, esters such as dimethyl carbonate; cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate , Polar solvents such as esters such as propylene glycol monoethyl ether acetate, and the like. These may be used alone or in combination of two or more.

The amount of the diluent to be used may be appropriately selected from the amount such that the total solid content of the photosensitive resin composition is 50 to 90% by mass, 60 to 80% by mass, or 65 to 75% by mass. That is, when the diluent is used, the content of the diluent in the photosensitive resin composition may be appropriately selected from 10 to 50% by mass, 20 to 40% by mass, or 25 to 35% by mass. When the amount of the diluent used is within the above range, the coatability of the photosensitive resin composition is improved and it becomes possible to form a finer pattern.
In addition, for example, when a photosensitive layer having a thickness of 70 μm or more is to be formed, the viscosity of the photosensitive resin composition at 25° C. is 0.5 to 20 Pa·s, or considering the ease of forming the photosensitive layer. The amount can be 1 to 10 Pa·s.

In the photosensitive resin composition of the present embodiment, the components (A) to (C), the components (D) to (G) used as desired, other additives, and a diluent are roll-milled. It can be obtained by uniformly kneading and mixing with a bead mill or the like.

The photosensitive resin composition of this embodiment may be used in the form of a liquid or a film.
When used as a liquid, the method for applying the photosensitive resin composition of the present embodiment is not particularly limited, and examples thereof include a printing method, a spin coating method, a spray coating method, a jet dispensing method, an inkjet method, and a dip coating method. Various coating methods can be used. Among these, a printing method or a spin coating method may be appropriately selected from the viewpoint of forming a thick photosensitive layer more easily.
When it is used as a film, it can be used, for example, in the form of a photosensitive resin film described later, and in this case, a photosensitive layer having a desired thickness can be formed by laminating using a laminator or the like.

In the thickness (after drying) of the photosensitive layer formed by the photosensitive resin composition of the present embodiment 50 μm, the absorbance for light having a wavelength of 365 nm is 0.35 or less, 0.3 or less, 0.2 or less, or It can be appropriately selected from 0.1 or less. When the absorbance of the photosensitive layer at a thickness of 50 μm is 0.35 or less, for example, even when a pattern is formed by a thick photosensitive layer of 70 μm or more, the bottom of the photosensitive layer (on the substrate side of the photosensitive layer Since the light easily passes to the surface, the pattern formability can be improved. The absorbance for light having a wavelength of 365 nm when the thickness of the photosensitive layer is 50 μm can be obtained by converting the absorbance measured for photosensitive layers other than 50 μm in thickness to the absorbance of 50 μm based on Lambert-Beer's law. it can.

[Photosensitive resin film]
The photosensitive resin film of this embodiment has a photosensitive layer using the photosensitive resin composition of this embodiment. The photosensitive resin film of this embodiment may have a carrier film. In the present specification, the term “layer” includes not only a structure having a shape formed on the entire surface but also a structure having a partly formed shape when observed as a plan view.

The photosensitive resin film of the present embodiment, for example, a photosensitive resin composition of the present embodiment is applied on a carrier film by the above various coating methods to form a coating film, and the coating film is dried. , A photosensitive layer can be formed and manufactured. When the photosensitive resin composition of the present embodiment contains a diluent, at least a part of the diluent may be removed during drying.

For drying the coating film, a dryer using hot air drying, far infrared rays, or near infrared rays can be used, and the drying temperature is from 60 to 120°C, 70 to 110°C, or 90 to 110°C. It may be selected appropriately. The drying time may be appropriately selected from 1 to 60 minutes, 2 to 30 minutes, or 5 to 20 minutes. When dried under the above conditions, when the photosensitive resin composition of the present embodiment contains a diluent, at least a part of the diluent can be removed.

Examples of the carrier film include polyester resin films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT) and polyethylene naphthalate (PEN), and resin films such as polyolefin resin films such as polypropylene and polyethylene. The polyester resin film may be selected from the viewpoint of improving the mechanical strength and heat resistance of the photosensitive resin film.
The thickness of the carrier film may be appropriately selected from 10 μm to 3 mm or 10 to 200 μm in consideration of handleability and the like.

The thickness of the photosensitive layer may be appropriately selected from 1 to 500 μm, 10 to 300 μm, or 30 to 100 μm. When the thickness is 30 μm or more, for example, when forming a photosensitive layer having a thickness of 150 μm or more, the number of operations such as laminating can be further reduced, and when the thickness is 100 μm or less, the photosensitive resin film is wound. When wound on the core, the deformation of the photosensitive layer due to the difference in stress between the inside and the outside of the core can be further reduced. Considering the effect of the photosensitive resin composition of the present embodiment that excellent pattern formability can be obtained even when a thick photosensitive layer is formed, it may be 70 μm or more, and a thickness of more than 100 μm. It may be. Note that the photosensitive layer having a thickness of 70 μm or more is, for example, a carrier film formed by laminating a photosensitive layer formed on a carrier film and a photosensitive layer formed on a protective layer described below, A photosensitive resin film having a thick photosensitive layer and a protective layer in this order can be obtained.

Further, in the photosensitive resin film of this embodiment, a protective layer may be laminated on the surface of the photosensitive layer opposite to the surface in contact with the carrier film. As the protective layer, for example, a resin film of polyethylene, polypropylene or the like may be used. Further, the same resin film as the carrier film described above may be used, or a different resin film may be used.

[Cured product manufacturing method]
The method for producing a cured product of the present embodiment includes a step of forming a photosensitive layer on the substrate using the photosensitive resin composition of the present embodiment or the photosensitive resin film (photosensitive layer forming step), and at least one of the photosensitive layers. A step of irradiating an actinic ray to a portion to form a photocured portion (exposure step), and a step of removing at least a part of the photosensitive layer other than the photocured portion to form a resin pattern (removing step). Have in order. Further, if desired, the method further includes a step of heating the resin pattern (heating step). The method for producing a cured product according to the present embodiment makes it possible to form a desired pattern. Further, even when a photosensitive layer having a thickness of, for example, 70 μm or more is formed, it has excellent pattern formability. Taking advantage of the characteristics of the resin composition, a desired pattern can be formed by using a thick cured product having a thickness of 70 μm or more, for example. In the present specification, the term "process" is not limited to an independent process, and even if it cannot be clearly distinguished from other processes, it means "process" if the intended action of the process is achieved. include.

(Photosensitive layer forming step)
In forming the photosensitive layer, the photosensitive layer can be formed by applying or laminating the photosensitive resin composition or the photosensitive resin film of the present embodiment on a substrate, respectively.
Examples of the substrate include a glass substrate, a silicon wafer, a metal oxide insulator such as TiO ₂ and SiO ₂ , silicon nitride, a ceramic piezoelectric substrate, and an epoxy resin-impregnated glass cloth substrate.

When the photosensitive layer is formed by applying the photosensitive resin composition to the substrate, the photosensitive resin composition in the form of a solution dissolved in the above diluent may be applied to the substrate and applied as necessary. The coating film obtained in this way may be dried. The coating and drying may be carried out by the various coating methods described for the preparation of the above-mentioned photosensitive resin film and the coating film drying method.
When a photosensitive resin film is used, the photosensitive layer can be formed by a laminating method using a laminator or the like.

The thickness of the photosensitive layer provided on the substrate varies depending on the forming method (coating method or laminating method), the solid content concentration and viscosity of the photosensitive resin composition, etc., but as the lower limit of the thickness of the photosensitive layer after drying, It may be appropriately selected from 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more. The upper limit is not particularly limited as long as the resin pattern can be formed, but may be appropriately selected from, for example, 500 μm or less, 300 μm or less, or 250 μm or less. The thickness of the photosensitive layer may be appropriately selected from the above range depending on the application. When used in electronic parts and the like, the lower limit may be appropriately selected from 70 μm or more, 100 μm or more, or 150 μm or more, and the upper limit is 500 μm. Hereinafter, it may be appropriately selected from 300 μm or less, or 250 μm or less.
In the method for producing a cured product of the present embodiment, since the photosensitive layer is formed using the photosensitive resin composition of the present embodiment, it is possible to form a thick photosensitive layer. For example, when a photosensitive layer having a thickness of 150 μm or more is formed, the photosensitive layer is not applied once (and dried if necessary) or formed by lamination, and is applied multiple times until the desired thickness is obtained (and, if necessary, May be repeated).

(Exposure process)
In the exposure step, at least a part of the photosensitive layer provided on the substrate in the photosensitive layer forming step is irradiated with an actinic ray if necessary, and the exposed portion is photocured to form a cured portion. The active layer may be irradiated with the active ray through a mask having a desired pattern when the active ray is applied, and LDI (Laser Direct Imaging) exposure method, DLP (Digital Light Processing) exposure method and the like may be used. Actinic rays may be irradiated by a direct writing exposure method.
Further, from the viewpoint of improving the pattern formability, post-exposure heating (PEB: Post exposure bake) may be performed using a hot plate, a drier or the like after the exposure. The drying conditions are not particularly limited, but may be performed at a temperature of 60 to 120° C. or 70 to 110° C. for 15 seconds to 5 minutes or 30 seconds to 3 minutes.

Exposure amount of active ray ^{is, 10~2,000mJ / cm 2, 100~1,500mJ /} cm 2, or, may be suitably selected from 300~1,000mJ / cm ^2. Examples of the actinic rays used include ultraviolet rays, visible rays, electron beams and X-rays. Further, as the light source, a low pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a halogen lamp or the like can be used.

(Removal process)
In the removing step, at least a part of a portion (unexposed portion) other than the cured portion of the photosensitive layer formed in the exposing step is removed to form a resin pattern. The unexposed portion may be removed by using, for example, a developing solution such as an organic solvent.
Examples of the organic solvent include ethanol, cyclohexanone, cyclopentanone, propylene glycol methyl ether acetate, N-methylpyrrolidone and the like. Among them, cyclopentanone can be used from the viewpoint of developing speed. These may be used alone or in combination of two or more.
Further, various additives which are usually used may be added to the organic solvent used as the developing solution.

Further, after removing the unexposed portion with a developer, if necessary, washing with water, alcohol such as methanol, ethanol, isopropyl alcohol, n-butyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol dimethyl ether acetate, etc. (rinse) You may.

(Heating process)
The heating step is a step that is adopted as necessary, and is a step of heating the resin pattern formed in the removing step to form a cured product. The heat treatment is preferably carried out for 1 to 2 hours while the heating temperature is selected and the temperature is raised stepwise. The heating temperature may be appropriately selected from 120 to 240°C, 140 to 230°C, or 150 to 220°C. When the temperature is raised stepwise, for example, after heat treatment for at least one of 120° C. and 160° C. for 10 to 50 minutes or 20 to 40 minutes, at 220° C. for about 30 to 100 minutes. The heat treatment may be performed for 5 minutes or 50 to 70 minutes.

The thickness of the obtained resin pattern is the same as the thickness of the photosensitive layer after drying, and the lower limit thereof is appropriately 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more. The upper limit may be appropriately selected from 500 μm or less, 300 μm or less, or 250 μm or less. The thickness of the resin pattern may be appropriately selected from the above range depending on the application, and when used for electronic parts and the like, the lower limit may be appropriately selected from 70 μm or more, more than 100 μm, or 150 μm or more, and the upper limit is 500 μm. Hereinafter, it may be appropriately selected from 300 μm or less, or 250 μm or less.

[Laminate]
The laminate of the present embodiment is provided with a cured product of the photosensitive resin composition of the present embodiment, and for example, various substrates such as a substrate used in the above-mentioned method for producing a cured product and a carrier film of a photosensitive resin film are used. The thing which equips a support with this hardened|cured material is mentioned. The cured product of the photosensitive resin composition of the present embodiment can be formed, for example, by the above-described method for producing a cured product of the present embodiment.

The thickness of the cured product in the laminate of the present embodiment may be appropriately selected from the lower limit of 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more, and the upper limit of 500 μm or less, 300 μm. It may be appropriately selected from the following, or from 250 μm or less. The thickness of the cured product may be appropriately selected from the above range depending on the application, and when used for electronic parts and the like, the lower limit may be appropriately selected from 70 μm or more, more than 100 μm, or 150 μm or more, and the upper limit may be 500 μm. Hereinafter, it may be appropriately selected from 300 μm or less, or 250 μm or less.

The cured product provided on the substrate obtained by the above-mentioned method for producing a cured product uses the photosensitive resin composition of the present embodiment, and excellent pattern formability can be obtained even in a thick photosensitive layer of, for example, 70 μm or more. Therefore, for example, with the trend of miniaturization and high performance of electronic devices, it is possible to meet the demand for an electronic circuit board that requires a thick cured material to be provided on a substrate in a finer pattern. .. Further, for example, in a plating process in the production of an electronic circuit board, by using a cured product formed of the photosensitive resin composition of the present embodiment as an insulating film, it is possible to suppress a decrease in yield due to a short circuit between wirings. it can.
Therefore, the laminated body of the present embodiment is used as an electronic component such as an electronic circuit board in a mobile terminal such as a mobile phone.

Hereinafter, the objects and advantages of the present embodiment will be described more specifically based on Examples and Comparative Examples, but the present embodiment is not limited to the following Examples. The method for measuring the weight average molecular weight of each component and the method for measuring the glass transition temperature of component (D) are as follows.

(Measurement of weight average molecular weight)
The weight average molecular weight is a value obtained by standard polystyrene conversion by the GPC method using the following apparatus, and was measured using a solution in which 0.5 mg of the polymer was dissolved in 1 mL of tetrahydrofuran (THF).
Device name: Tosoh Corporation HLC-8320GPC
Column: Gelpack R-420, R-430, and R-440 (3 ties)
Detector: RI detector Column temperature: 40°C
Eluent: THF
Flow rate: 1 ml/min Standard substance: polystyrene

(Measurement of glass transition temperature of component (D))
As a pretreatment for the measurement, the component (D) was heated at 120° C. for 3 hours and then cooled to prepare a sample.
Using 10 mg of the sample, a differential scanning calorimeter (manufactured by Shimadzu Corporation, trade name: DSC-50) was used under a nitrogen stream to raise the temperature in the temperature range of 25 to 200° C. at a heating rate of 20° C./min. Then, the temperature was cooled to 25° C., and then the temperature was raised again under the same conditions, and the temperature at which the deviation of the baseline starts was taken as the glass transition temperature.

(Synthesis Example 1; Synthesis of Resin P-1)
635 g of methyl methacrylate, 30 g of butyl acrylate, 245 g of butyl methacrylate, and 75 g of 2-hydroxyethyl methacrylate were mixed to obtain a monomer mixture. 0.9 g of 2,2'-azodiisobutyronitrile was dissolved in the obtained monomer mixture to prepare a mixed solution. To a 1 L autoclave equipped with a stirrer and a condenser, 1030 g of propylene glycol monomethyl ether acetate was added as a solvent, and the above mixture was added while stirring. Then, polymerization was carried out at 90° C. for 6 hours in a nitrogen atmosphere at a stirring rotation speed of 100 min ⁻¹ to obtain an acrylic resin (resin P-1) solution having a weight average molecular weight of 43,370.

(Examples 1 to 15, Comparative Examples 1 to 6)
The composition was blended according to the blending composition shown in Table 1 or Table 2 (the unit of the numerical value in the table is a mass part, and in the case of a solution, it is a solid content conversion amount), and the mixture was kneaded with a three-roll mill to obtain a photosensitive resin. A composition was prepared. N,N-dimethylacetamide was added so that the solid content concentration was 60% by mass to obtain a photosensitive resin composition.

Next, each evaluation was performed by the following method using the photosensitive resin composition obtained above. The evaluation results are shown in Tables 1 and 2.

[Preparation of photosensitive resin film]
A polyethylene terephthalate film (manufactured by Teijin Ltd., trade name: A-4100) having a thickness of 50 μm was used as a carrier film, and the photosensitive resin compositions of Examples and Comparative Examples were dried on the carrier film to have a thickness of 50 μm. Was evenly applied. Then, a photosensitive layer was formed by heating and drying at 100° C. for 15 minutes using a hot air convection dryer to prepare a photosensitive resin film having a carrier film and a photosensitive layer.

[Evaluation of pattern formability]
A photosensitive resin film is placed on a glass epoxy substrate (obtained by etching copper of MCL-E-679F (trade name, manufactured by Hitachi Chemical Co., Ltd.)), and the photosensitive layer is oriented in the direction in which the photosensitive layer is located on the glass epoxy substrate side. Then, the carrier film was removed. Lamination was performed at 60° C. using a laminator. Then, the photosensitive resin film was laminated again on the photosensitive layer by the above method, the carrier film was removed, and this was repeated 3 times to obtain a 200 μm thick photosensitive layer and the carrier film on the glass epoxy substrate. The laminated body provided was obtained.
A resolution evaluation mask (line width: 5 μm, 8 μm, 10 μm, 15 μm, 20 μm, 25 μm, 6 types, line space: all 200 μm) having the pattern shape shown in FIG. 1 was placed on the carrier film of the laminate as an exposed portion. Further, an i-line filter (HB-0365, manufactured by Asahi Bunko Co., Ltd.) was mounted, and exposure was performed using a high-precision parallel exposure device (manufactured by Mikasa Co., Ltd.). In this case, by dividing the laminate into four regions, with the amount of different exposure the four regions ^{(300mJ / cm 2, 600mJ /} cm 2, 1,000mJ / cm 2, 1,400mJ / cm 2), the wavelength 365 nm ( It was exposed to light of i-line). The sample after exposure was subjected to post-exposure heating for 1 minute on a hot plate at 90°C.
Then, the carrier film was removed, and the film was developed by immersing it in a developing solution (cyclopentanone) for 20 minutes. The pattern after development was dried at room temperature for 30 minutes and observed with a metallographic microscope to evaluate the pattern formability. The evaluation was performed according to the following criteria. Here, "formable" means that the unexposed portion is removed cleanly, and the line portion (exposed portion) has no defects such as falling. The evaluation results are shown in Tables 1 and 2.
A: It was possible to form with a line width of 5 to 10 μm.
B: It could not be formed with a line width of 5 to 10 μm, but could be formed with a line width of 15 to 20 μm.
C: Could not be formed with a line width of 20 μm or less, or the photosensitive layer was peeled off after development.

[Evaluation of tackiness]
At the time of producing the photosensitive resin film, a thumb finger tack test was performed on the film after the application of the photosensitive resin composition. The case where stickiness was not felt was rated as A, and the case where stickiness was felt was rated as C. The results are shown in Tables 1 and 2.

[Measurement of absorbance]
With respect to the photosensitive resin film obtained in the above [Preparation of photosensitive resin film], the absorbance at a wavelength of 365 nm at a photosensitive layer thickness (thickness after drying) of 50 μm was measured. Specifically, the absorbance (Abs) at a wavelength of 365 nm was measured using an ultraviolet-visible spectrophotometer (product name: “U-3310 Spectrophotometer”, manufactured by Hitachi High-Technologies Corporation). A polyethylene terephthalate (PET) film alone was used as a reference. The measurement results are shown in Tables 1 and 2.

[Evaluation of insulation reliability]
The insulation reliability was evaluated by a high temperature and high humidity bias test. The evaluation device TEG (Test Element Group) (trade name: WALTS-KIT EM0101JY, manufactured by WALTS, L/S=40 μm/15 μm) having a thickness of 50 μm obtained in Examples 1 to 15 on the comb-shaped copper electrode. The photosensitive resin film was attached at 60° C. using a laminator so that the photosensitive layer was oriented to the comb-shaped copper electrode side. Then, after exposure with i-line at an exposure amount of 1,000 mJ/cm ² , the film was heated on a hot plate at 90° C. for 1 minute. Then, after further heating in an oven at 200° C. for 1 hour, it was cooled to room temperature to obtain a measurement sample.
A lead wire was attached to the electrode portion of the TEG of the obtained measurement sample with solder, and a high temperature and high humidity bias test was performed [voltage; 5 V (DC), test time: 100 hours, 85° C., 85% RH (high temperature high temperature Wet machine (made by ESPEC) is used)].
As a result, the measurement samples obtained by using the photosensitive resin films of Examples 1 to 15 all had a resistance value of 1.0×10 ⁷ Ω or more at a test time of 100 hours, and were sufficiently insulated. It was confirmed that the reliability was excellent.

Details of each material in Table 1 and Table 2 are as follows.
[(A) component]
UN-952: Urethane acrylate (manufactured by Negami Kogyo Co., Ltd., trade name, number of functional groups: 10, weight average molecular weight: 9,000, a reaction product of a hydroxyl group-containing acrylate and a diisocyanate compound, and an acryloyl group in the molecule. (Has a photopolymerizable functional group), a urethane bond (carbon-nitrogen bond), a chain hydrocarbon skeleton, and an alicyclic hydrocarbon skeleton.
-UN-954: Urethane acrylate (manufactured by Negami Kogyo Co., Ltd., trade name, number of functional groups: 6, weight average molecular weight (Mw): 4,500)
Resin P-1: acrylic resin solution prepared in Synthesis Example 1 (weight average molecular weight: 43,370)

[(B) component]
A-9300: Isocyanuric acid ethylene oxide-modified triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 423, a compound represented by the formula (7-1), corresponding to the component (B1)).
A-DCP: tricyclodecane dimethanol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., corresponding to component (B3))
TMCH-5R: urethane acrylate (manufactured by Hitachi Chemical Co., Ltd., trade name, number of functional groups: 2, weight average molecular weight: 950, acryloyl group (photopolymerizable functional group) in the molecule, urethane bond (carbon-nitrogen bond), A compound having a chain hydrocarbon skeleton and an alicyclic hydrocarbon skeleton, which corresponds to the component (B2).)
FA-324A: EO-modified bisphenol A diacrylate (manufactured by Hitachi Chemical Co., Ltd., trade name, number of functional groups: 2, weight average molecular weight (Mw): 512)
KMB-503: Methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., trade name)

[(C) component]
I-184: 1-hydroxy-cyclohexyl-phenyl-ketone "IRGACURE-184" (trade name, manufactured by BASF)
I-819: "IRGACURE-819" (manufactured by BASF, trade name) which is bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide.
-TPO: "IRGACURE-TPO" which is 2,4,6-trimethylbenzoyldiphenylphosphine oxide (manufactured by BASF, trade name)

（式中、Ｒ^Ｄ１は水素原子又はメチル基を表す。Ｒ^Ｄ３は炭素数１〜６のアルキル基または炭素数１〜６のヒドロキシアルキル基を表す。）[(D) component]
Z250: Cyclomer P (ACA) Z250 (manufactured by Daicel Ornex Co., Ltd., three structural units represented by the following formulas, which are produced by the reaction of an acid group-containing acrylic resin and an alicyclic epoxy group-containing unsaturated compound Resin (weight average molecular weight: 19,000 to 25,000)).

(In the formula, R ^D1 represents a hydrogen atom or a methyl group. R ^D3 represents an alkyl group having 1 to 6 carbon atoms or a hydroxyalkyl group having 1 to 6 carbon atoms.)

[(E) component]
KBM-803:3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.)

From Table 1, it is confirmed that the photosensitive resin compositions of the present embodiment of Examples 1 to 15 have excellent pattern formability, and particularly in Examples 2 to 15, the effect of suppressing tackiness is large. Was done. Among them, Examples 3, 6 to 10 and 12 to 15 resulted in having very excellent pattern formability.
On the other hand, from Table 2, when the resin compositions of Comparative Examples 1 to 5 containing no component (A) and the resin composition of Comparative Example 6 containing no component (B) were used, Also in the exposure amount, the pattern formability was poor.

Claims (17)

(A) component: a high molecular weight substance having a photopolymerizable functional group and a carbon-nitrogen bond, (B) component: a low molecular weight substance having a photopolymerizable functional group, and (C) component: a photopolymerization initiator , (E) component: containing a silane compound ,
Wherein component (A) has a 6 or more ethylenically unsaturated groups as a photopolymerizable functional group, and viewed including the high polymer has a weight average molecular weight of 2,500 or more,
A photosensitive resin composition in which the component (E) contains a silane compound having a thiol group . The photosensitive resin composition according to claim 1, wherein the component (A) contains a high molecular weight compound having a (meth)acryloyl group as a photopolymerizable functional group. The photosensitive resin composition according to claim 1 or 2, wherein the component (A) contains a high molecular weight compound having a urethane bond as a carbon-nitrogen bond. The component (A) includes a high molecular weight compound having 6 to 30 ethylenically unsaturated groups as a photopolymerizable functional group and having a weight average molecular weight of 2,500 to 100,000. The photosensitive resin composition according to any one of 3 above. The component (A) includes a high molecular weight product having 6 to 8 ethylenically unsaturated groups as a photopolymerizable functional group and having a weight average molecular weight of 2,500 to 50,000. 4. The photosensitive resin composition according to any one of 4 above. The component (A) includes a high molecular weight polymer having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton. The photosensitive resin composition according to the item. The component (B) contains at least one selected from the group consisting of a low molecular weight substance having a urethane bond, a low molecular weight substance having an isocyanuric ring, and a low molecular weight substance having an alicyclic skeleton. 7. The photosensitive resin composition according to any one of 6 above. The photosensitive resin composition according to any one of claims 1 to 6, wherein the component (B) further contains a low molecular weight compound having at least one ethylenically unsaturated group and a urethane bond. The photosensitive resin composition according to any one of claims 1 to 8, wherein the component (C) contains a compound represented by the following general formula (C1) or a compound represented by the following general formula (C2). Stuff.

(R ^C1 , R ^C2 and R ^C3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and R ^C4 and R ^C5 are each independently, A hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and each of R ^{C1 to} R ^C5 other than a hydrogen atom has a substituent. It may be.)

(R ^C6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group, and R ^C7 and R ^C8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkyl group having 6 to 12 carbon atoms. Or an alkoxy group having 1 to 8 carbon atoms, R ^C7 and R ^C8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms. Each of R ^{C6 to} R ^C8 may have a substituent, and in the amino group having a substituent, the substituents may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms. ..
Each R ^C9 independently has a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or 1 to 10 carbon atoms which may contain one or more atoms selected from an oxygen atom, a nitrogen atom and a sulfur atom. Represents an organic group of. ) Component (D): The photosensitive resin composition according to any one of claims 1 to 9, further comprising a high molecular weight polymer having a glass transition temperature of 70 to 150°C and having no carbon-nitrogen bond. Stuff. Having a photosensitive layer using the photosensitive resin composition according to any one of claims 1-10, the photosensitive resin film. On a substrate, claim photosensitive resin composition according to any one of 1-10, or a step of providing a photosensitive layer using the photosensitive resin film according to claim 11, at least a portion of the photosensitive layer A method for producing a cured product, which comprises a step of irradiating an actinic ray on the substrate to form a photo-cured portion, and a step of removing at least a portion of the photosensitive layer other than the photo-cured portion to form a resin pattern. Furthermore, the manufacturing method of the hardened|cured material of Claim 12 which has the process of heat-processing the said resin pattern. The thickness of the resin pattern is 70μm or more 300μm or less, method for producing a cured product according to claim 12 or 13. Laminate comprising a cured product of the photosensitive resin composition according to any one of claims 1-10. The laminate according to claim 15 , wherein the cured product has a thickness of 70 μm or more and 300 μm or less. Electronic component comprising a cured product of the photosensitive resin composition according to any one of claims 1-10.

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