JP2017181960A - Photosensitive resin composition, photosensitive resin film, production method of cured product, laminate, and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent pattern formability even when a photosensitive layer as thick as 70 μm or more is to be formed, and also having suppressed tackiness, a photosensitive resin film, a production method of a cured product, a laminate, and an electronic component.SOLUTION: The photosensitive resin composition comprises the following components: (A) a high molecular weight material having a photopolymerizable functional group and a carbon-nitrogen bond; (B) a high molecular weight material having a glass transition temperature of 70 to 150°C and having no carbon-nitrogen bond; (C) a low molecular weight material having a photopolymerizable functional group; and (D) a photopolymerization initiator.SELECTED DRAWING: None

Description

  The present disclosure relates to a photosensitive resin composition, a photosensitive resin film, a method for producing a cured product, a laminate, and an electronic component.

  In the field of manufacturing semiconductor integrated circuits (LSIs) or wiring boards, photosensitive materials are used as resists for producing conductor patterns. For example, in the manufacture of a wiring board, a resist is formed using a photosensitive resin composition, and then a conductor pattern, a metal post, and the like are formed by plating. More specifically, a photosensitive layer is formed on a support (substrate) using a photosensitive resin composition, the photosensitive layer is exposed through a predetermined mask pattern, and then a conductor pattern, a metal post A resist pattern (resist) is formed by developing so that a portion for forming a film can be selectively removed (peeled). Next, a conductor such as copper is formed on the removed portion by plating, and then the resist pattern is removed, whereby a wiring board having a conductor pattern, a metal post, and the like can be manufactured.

Conventionally, a thick conductor pattern and a metal post have been produced by growing a metal plating after removing the resist pattern. In order to meet such a demand, for example, a thick photosensitive resist having a thickness of about 30 μm and a photosensitive layer having a thickness of about 65 μm has been used (see Patent Documents 1 and 2).
Also, in recent years, the conductor layer has a thickness of 150 μm by performing plating while destroying the layer existing in the direction in which selective plating growth is desired among the dilute metal ion layers with a plating solution in order to further improve the performance. Attempts have been made to make the film as thick as possible (see Patent Document 3).

Japanese Patent Laying-Open No. 2015-034926 JP 2014-074744 A JP 2014-080674 A

However, in the conventional thick-film photosensitive resist, for example, when formation of a thick photosensitive layer of 70 μm or more is required, it is difficult for light to pass to the bottom, and the pattern shape may deteriorate. In addition, in the method described in Patent Document 3, since the plating proceeds while partially destroying the diluted metal ion layer, it is difficult to stably form an excellent pattern. Therefore, even when a photosensitive layer having a thickness of 70 μm, 150 μm thicker than the conventional one, or more (thickness in the direction perpendicular to the substrate) is formed, the photosensitivity having excellent pattern forming properties. There is a need for a resist.
In addition, when a film-like or liquid photosensitive resin composition is used in a production process with a view to mass production, the surface adhesiveness of the photosensitive layer (tackiness; in the case of a liquid photosensitive resin composition, If the photosensitive layer has a high tackiness), the production apparatus is likely to be contaminated, and production may be interrupted in order to clean the apparatus, or a defect may occur in the photosensitive layer. Therefore, productivity is poor, and it is difficult to industrially mass-produce, so that it is required to reduce tackiness after coating.

  Therefore, the problem to be solved by the present disclosure has been made in view of the above circumstances. For example, even when a thick photosensitive layer of 70 μm or more is formed, the present disclosure has an excellent pattern formability and is tacky. To provide a photosensitive resin composition, a photosensitive resin film, a method for producing a cured product, a laminate, and an electronic component (hereinafter sometimes referred to as “photosensitive resin composition etc.”). It is.

  As a result of intensive studies to solve the above problems, the present inventors have found that the problem can be solved by a photosensitive resin composition having the following constitution. The present disclosure provides the following photosensitive resin composition and the like.

[1] Component (A): high molecular weight body having a photopolymerizable functional group and a carbon-nitrogen bond, and component (B): a glass transition temperature of 70 to 150 ° C. and high without carbon-nitrogen bond A photosensitive resin composition comprising a molecular weight body, (C) component: a low molecular weight body having a photopolymerizable functional group, and (D) component: a photopolymerization initiator.
[2] The photosensitive resin composition according to the above [1], wherein the component (A) includes a high molecular weight body having a (meth) acryloyl group as a photopolymerizable functional group.
[3] The photosensitive resin composition according to the above [1] or [2], wherein the component (A) includes a high molecular weight body having a urethane bond as a carbon-nitrogen bond.
[4] The above [1] to [1], wherein the component (A) includes a high molecular weight polymer having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton. 3]. The photosensitive resin composition according to any one of [3].
[5] The photosensitive resin composition according to any one of [1] to [4], wherein the component (B) contains a high molecular weight body having an ethylenically unsaturated group.
[6] In any one of the above [1] to [5], the component (B) contains a high molecular weight polymer having at least one skeleton selected from the group consisting of an alicyclic skeleton and an aromatic ring skeleton. The photosensitive resin composition as described.
[7] Component (C) is (C1) component: low molecular weight body having an isocyanuric ring, (C2) component: low molecular weight body having a urethane bond, and (C3) component: low molecular weight having an alicyclic skeleton. The photosensitive resin composition in any one of said [1]-[6] containing at least 1 sort (s) chosen from the group which consists of a body.

[8] The component (D) according to any one of [1] to [7], wherein the component (D) includes a compound represented by the following general formula (D1) or a compound represented by the following general formula (D2). Photosensitive resin composition.

(R ^D1 , R ^D2 and R ^D3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and R ^D4 and R ^D5 each independently represent A hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, each of R ^{D1 to} R ^D5 other than a hydrogen atom has a substituent. May be.)

(R ^D6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group, and R ^D7 and R ^D8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or 6 to 12 carbon atoms. R ^D7 and R ^D8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms other than hydroxyl groups and hydrogen atoms. R ^{D6 to} R ^D8 may each have a substituent, and the amino group having a substituent may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms. .
R ^D9 is independently a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or an organic group having 1 to 10 carbon atoms that may contain one or more selected from an oxygen atom, a nitrogen atom, and a sulfur atom. Indicates a group. )

[9] The photosensitive resin composition according to any one of [1] to [8], further comprising (E) component: a silane compound.
[10] The photosensitive resin composition according to the above [9], wherein the component (E) contains a silane compound having a thiol group.
[11] A photosensitive resin film having a photosensitive layer using the photosensitive resin composition according to any one of [1] to [10].
[12] A step of providing a photosensitive layer on the substrate using the photosensitive resin composition according to any one of [1] to [10] or the photosensitive resin film according to [11], Curing having a step of irradiating at least a part of the layer with actinic rays to form a photocured portion, and a step of removing at least a portion other than the photocured portion of the photosensitive layer and forming a resin pattern in order Manufacturing method.
[13] The method for producing a cured product according to [12], further including a step of heat-treating the resin pattern.
[14] The method for producing a cured product according to the above [12] or [13], wherein the resin pattern has a thickness of 70 μm or more and 300 μm or less.
[15] A laminate comprising a cured product of the photosensitive resin composition according to any one of [1] to [10].
[16] The laminate according to [15], wherein the cured product has a thickness of 70 μm or more and 300 μm or less.
[17] An electronic component comprising a cured product of the photosensitive resin composition according to any one of [1] to [10].

  According to the present disclosure, for example, it is possible to provide a photosensitive resin composition or the like that has excellent pattern forming properties and suppressed tackiness even when a thick photosensitive layer of 70 μm or more is formed.

It is a schematic diagram of the mask for resolution evaluation used in the Example.

Hereinafter, the present disclosure will be described in detail.
In this specification, the numerical range indicated using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively. In addition, in the numerical ranges described stepwise in the present specification, the upper limit value or lower limit value of a numerical range of a certain step may be replaced with the upper limit value or lower limit value of the numerical range of another step. In the numerical range described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
“(Meth) acrylic acid” means at least one of “acrylic acid” and “methacrylic acid” corresponding thereto, and the same applies to other similar expressions such as (meth) acrylate.

[Photosensitive resin composition]
A photosensitive resin composition according to an embodiment of the present disclosure (hereinafter, may be simply referred to as the present embodiment) includes (A) component: a high molecular weight body having a photopolymerizable functional group and a carbon-nitrogen bond, Component (B): a high molecular weight substance having a glass transition temperature of 70 to 150 ° C. and having no carbon-nitrogen bond (hereinafter sometimes referred to as “high Tg high molecular weight substance (B)”); Component C): a low molecular weight substance having a photopolymerizable functional group (hereinafter sometimes simply referred to as “low molecular weight substance (C)”), and component (D): a photopolymerization initiator, It is a photosensitive resin composition.
In the present specification, the “solid content” is a non-volatile content excluding volatile substances such as water and solvent contained in the photosensitive resin composition, and is volatilized when the resin composition is dried. Ingredients that remain without being included, and also include those that are liquid, syrupy, and waxy at room temperature. In this specification, room temperature refers to 25 ° C.
Hereinafter, each component will be described.

<(A) component: high molecular weight body>
The photosensitive resin composition of this embodiment contains the high molecular weight body which has a photopolymerizable functional group and a carbon-nitrogen bond as (A) component. “High molecular weight body” means a compound having a weight average molecular weight (Mw) of 2,000 or more. In the present specification, the value of the weight average molecular weight is a value obtained by standard polystyrene conversion using tetrahydrofuran (THF) by a gel permeation chromatograph (GPC) method.
Examples of the photopolymerizable functional group contained in the component (A) include (meth) acryloyl groups; ethylenically unsaturated groups such as alkenyl groups such as vinyl groups and allyl groups. From the viewpoint of improving the pattern forming property, a high molecular weight body having a (meth) acryloyl group as a photopolymerizable functional group may be included, and a high molecular weight body having a urethane bond as a carbon-nitrogen bond may be further included. Examples of the high molecular weight body having a (meth) acryloyl group include (meth) acrylate, and examples of those having a urethane bond as a carbon-nitrogen bond include (meth) acrylate having a urethane bond (hereinafter, “ May be referred to as “urethane (meth) acrylate”).
The component (A) has at least one photopolymerizable functional group and at least one carbon-nitrogen bond. The number of photopolymerizable functional groups possessed by the high molecular weight material is not particularly limited, but is appropriately selected from 2 to 24 and 2 to 15 in one molecule from the viewpoint of improving pattern formation and heat resistance. Moreover, it can select from 4-12 and 6-10 suitably from a viewpoint which stabilizes the physical property and characteristic of the hardened | cured material obtained, and reduces tackiness.
The component (A) may include a high molecular weight body having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton.

Examples of the high molecular weight urethane (meth) acrylate include a reaction product of (meth) acrylate having a hydroxyl group and an isocyanate compound having an isocyanate group.
Examples of the (meth) acrylate having a hydroxyl group include compounds having at least one hydroxyl group and at least one (meth) acryloyl group in one molecule. More specifically, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2- Hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy- Monofunctional (meth) acrylates such as 3- (2-naphthoxy) propyl (meth) acrylate, ethoxylated forms thereof, propoxylated forms thereof, ethoxylated propoxylated forms thereof, and caprolactone modified forms thereof; trimethylol Propane (meta) acrelan , Difunctional (meth) acrylates such as glycerin di (meth) acrylate, bis (2- (meth) acryloyloxyethyl) (2-hydroxyethyl) isocyanurate, ethoxylated products thereof, propoxylated products thereof, these Ethoxylated propoxylated products thereof, and modified caprolactone thereof: cyclohexanedimethanol type epoxy di (meth) acrylate, tricyclodecane dimethanol type epoxy di (meth) acrylate, hydrogenated bisphenol A type epoxy di (meth) acrylate, hydrogenated bisphenol F type epoxy di (meth) acrylate, hydroquinone type epoxy di (meth) acrylate, resorcinol type epoxy di (meth) acrylate, catechol type epoxy di (meth) acrylate, bisphenol A type epoxy di (medium) ) Acrylate, bisphenol F type epoxy di (meth) acrylate, bisphenol AF type epoxy di (meth) acrylate, biphenol type epoxy di (meth) acrylate, fluorene bisphenol type epoxy di (meth) acrylate, isocyanuric acid monoallyl type epoxy di (meth) acrylate, etc. Functional epoxy (meth) acrylate; trifunctional or higher (meth) such as ditrimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, etc. Acrylates, ethoxylated products thereof, propoxylated products thereof, ethoxylated propoxylated products thereof, and modified products of caprolactone thereof; Three or more functional epoxy (meth) acrylates such as a novolac type epoxy (meth) acrylate, a cresol novolac type epoxy poly (meth) acrylate, an isocyanuric acid type epoxy tri (meth) acrylate; trimethylolpropane tri (meth) acrylate, ditri And hydroxypropylated compounds such as methylolpropane tetra (meth) acrylate.
These can be used alone or in combination of two or more.

Here, the (meth) acrylate ethoxylated product, propoxylated product, ethoxylated propoxylated product, and hydroxypropylated product are each, for example, an alcohol compound (or a phenol compound) that is a raw material of the (meth) acrylate. It is obtained by using as a raw material one or more ethylene oxide groups, propylene oxide groups, ethylene oxide groups and propylene oxide groups, and hydroxypropyl groups.
The caprolactone-modified product is obtained by using, as a raw material, a product obtained by modifying an alcohol compound (or a phenol compound) that is a raw material for the (meth) acrylate with ε-caprolactone, for example.

  Examples of the isocyanate compound having an isocyanate group include compounds having at least one isocyanate group in one molecule, and may be compounds having 1 to 3 isocyanate groups in one molecule. More specifically, aliphatic monoisocyanate compounds such as ethyl isocyanate, propyl isocyanate, butyl isocyanate, octadecyl isocyanate, 2-isocyanatoethyl (meth) acrylate; alicyclic monoisocyanate compounds such as cyclohexyl isocyanate; aromatics such as phenyl isocyanate Monoisocyanate compounds such as aliphatic monoisocyanate compounds; aliphatic diisocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, decamethylene diisocyanate, dodecamethylene diisocyanate; 1,3-bis (isocyanatomethyl) cyclohexane , Isophorone diisocyanate, 2,5-bis (isocyanatomethyl) norbornene Bis (4-isocyanatocyclohexyl) methane, 1,2-bis (4-isocyanatocyclohexyl) ethane, 2,2-bis (4-isocyanatocyclohexyl) propane, 2,2-bis (4-isocyanatocyclohexyl) ) Alicyclic diisocyanate compounds such as hexafluoropropane and bicycloheptane triisocyanate; 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 2,4′-diphenylmethane diisocyanate, 4, Diisocyanates such as aromatic diisocyanate compounds such as 4'-diphenylmethane diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate, hydrogenated xylylene diisocyanate, naphthalene-1,5-diisocyanate Over DOO compound, uretdione dimer of these diisocyanate compounds, isocyanurate type, and the like multimers such as biuret-type trimer. These can be used alone or in combination of two or more, and the two or three isocyanate compounds constituting the multimer may be the same or different.

  Among them, from the viewpoint of improving pattern forming properties, it may be appropriately selected from diisocyanate compounds such as aliphatic diisocyanate compounds, alicyclic diisocyanate compounds, aromatic diisocyanate compounds, and multimers of these diisocyanate compounds, and in particular, hexamethylene diisocyanate. , Isophorone diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 2,4′-diphenylmethane diisocyanate, 4,4′-diphenylmethane diisocyanate, and isocyanurate type multimers ( What is necessary is just to select suitably from isocyanurate type polyisocyanate).

  The reaction product of the above (meth) acrylate having a hydroxyl group and an isocyanate compound has a (meth) acryloyl group as a photopolymerizable functional group and a urethane bond as a carbon-nitrogen bond, and more Specifically, for example, an organic group derived from a (meth) acrylate having a hydroxyl group in the molecule (that is, 1 to 5 (meta) which is a residue obtained by removing the hydroxyl group from the above-mentioned (meth) acrylate having a hydroxyl group. ) An organic group having an acryloyl group), a urethane bond, and an organic group derived from the above isocyanate compound (that is, a chain hydrocarbon skeleton, an oil, which is a residue obtained by removing the isocyanate group from the above isocyanate compound) It can also be said to be an organic group having a cyclic skeleton or an aromatic ring skeleton). These organic groups may be the same or different.

  As a urethane (meth) acrylate having a high molecular weight, from the viewpoint of improving pattern formation, for example, a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule and a diol compound, A reaction product obtained by reacting a (meth) acrylate having a hydroxyl group may be included.

Diisocyanate compounds such as aliphatic diisocyanate compounds, alicyclic diisocyanate compounds, and aromatic diisocyanate compounds among the compounds exemplified as the isocyanate compound as the isocyanate compound having at least two isocyanate groups in one molecule used here. Moreover, multimers such as uretdione type dimers, isocyanurate types and biuret type trimers of these diisocyanate compounds may be mentioned.
The above isocyanate compounds can be used alone or in combination of two or more.

Examples of the diol compound include diol compounds having 1 to 20 carbon atoms, specifically, ethylene glycol, diethylene glycol, propanediol, dipropylene glycol, butanediol, pentanediol, isopentylglycol, hexanediol. Linear or branched saturated diol compounds such as nonanediol, decanediol, dodecanediol, dimethyldodecanediol, and octadecanediol; linear such as butenediol, pentenediol, hexenediol, methylpentenediol, and dimethylhexenediol Or branched unsaturated diol compounds; various cyclohexanediols, various cyclohexanedimethanols, various tricyclodecanedimethanols, hydrogenated bisphenol A, hydrogenated bisphenols Diol compound having an alicyclic skeleton such Lumpur F and the like. Here, the saturated diol compound and the unsaturated diol compound are collectively referred to as a diol compound having a chain hydrocarbon skeleton.
The above diol compounds can be used alone or in combination of two or more.

The diol compound having a chain hydrocarbon skeleton has 1 to 20 carbon atoms and 2 to 16 carbon atoms from the viewpoint of improving pattern formation and increasing the glass transition point (Tg) after polymerization to improve water resistance. 2-14 saturated diol compounds, and more specifically, ethylene glycol and octadecanediol may be selected as appropriate.
Moreover, as a diol compound which has an alicyclic skeleton, it is C5-C20, 5-C5 from a viewpoint which improves pattern formation property and raises the glass transition point (Tg) after superposition | polymerization and improves water resistance. It may be appropriately selected from diol compounds having an alicyclic skeleton of 18, 6 to 16, and more specifically, various cyclohexanediols such as 1,3-cyclohexanediol and 1,4-cyclohexanediol, What is necessary is just to select suitably from various cyclohexane dimethanols, such as cyclohexane dimethanol and 1, 4- cyclohexane dimethanol.

  Examples of the (meth) acrylate having a hydroxyl group used herein include those exemplified as the (meth) acrylate used in the reaction product of the above-mentioned (meth) acrylate having a hydroxyl group and an isocyanate compound having an isocyanate group. Can be mentioned.

  As a reaction product obtained by reacting a (meth) acrylate having a hydroxyl group with a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule and a diol compound, for example, the following general formula ( Examples thereof include those having the structural unit represented by 1).

In general formula (1), X ₁ represents a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, and Y ₁ represents a chain hydrocarbon skeleton or an alicyclic skeleton. The divalent organic group which has. Moreover, when (A) component has two or more said structural units, several X < ₁ >, Y < ₁ > may be the same or different. That is, examples of the component (A) include those having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton.

Examples of the divalent organic group of X _1, exemplified as the compound having the isocyanate groups, aliphatic diisocyanate compounds, alicyclic diisocyanate compounds, and organic radical derived from an aromatic diisocyanate compound, i.e., from the above isocyanate compounds Examples thereof include a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, which is a residue excluding an isocyanate group. Further, the divalent organic group represented by X ₁ may be these residues themselves, or a residue derived from an isocyanate compound derivative such as a polyaddition product of the above isocyanate compound and a diol compound. May be.
X ₁ is a divalent organic group having an alicyclic skeleton from the viewpoints of improving pattern formation and improving the transparency, water resistance, and moisture resistance of the resin composition in a balanced manner. It may be a divalent organic group having an alicyclic skeleton, which is the residue of isophorone diisocyanate represented by (2).

As the divalent organic group having a chain hydrocarbon skeleton of Y ₁ or an alicyclic skeleton, a diol compound having a chain hydrocarbon skeleton exemplified as the diol compound, and a diol having an alicyclic skeleton An organic group derived from a compound, that is, a divalent organic group having a chain hydrocarbon skeleton or an alicyclic skeleton, which is a residue obtained by removing a hydroxyl group from the above diol compound.
Among them, as a divalent organic group having a chain hydrocarbon skeleton, from the viewpoint of improving the pattern forming property and improving the water resistance by increasing the glass transition point (Tg) after polymerization, the carbon number is 1 -20, 2-16, or 2-14 from the residue obtained by removing the hydroxyl group from the saturated diol compound. More specifically, ethylene glycol or octadecandiol may be selected from the residue obtained by removing the hydroxyl group. That's fine. From the same viewpoint, the divalent organic group having an alicyclic skeleton is a residue obtained by removing a hydroxyl group from a diol compound having an alicyclic skeleton having 5 to 20, 5 to 18, or 6 to 16 carbon atoms. What is necessary is just to select suitably from group, More specifically, various cyclohexane diols, such as 1, 3- cyclohexane diol and 1, 4- cyclohexane diol, 1, 3- cyclohexane dimethanol, 1, 4- cyclohexane dimethanol, etc. What is necessary is just to select suitably from the residue remove | excluding the hydroxyl group from various cyclohexanedimethanol.

  As a reaction product obtained by reacting a (meth) acrylate having a hydroxyl group with a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule and a diol compound, specifically, for example, And compounds represented by the following general formulas (3) and (4).

In General Formulas (3) and (4), n ₁ and n ₂ each independently represents an integer of 3 to 20.

  Moreover, as an isocyanate compound, as the reaction product when an isocyanurate type trimer (isocyanurate type triisocyanate), which is a trimer of diisocyanate, is used, for example, the following general formulas (5) and (6) And the compounds shown.

In General Formulas (5) and (6), n ₃ and n ₄ each independently represents an integer of 2 to 20.

As a commercial item containing the urethane acrylate which has a structural unit represented by the said General formula (1), UN-953: (The number of functional groups: 20, weight average molecular weight: 14,000-40,000), UN- 954: (number of functional groups: 6, weight average molecular weight: 4,500), H-219 (number of functional groups: 9, weight average molecular weight: 25,000 to 50,000), UN-333 (number of functional groups: 2, Mw: 5,000), UN-1255 (functional group number: 2, Mw: 8,000), UN-904 (functional group number: 10, Mw: 4,900), UN-2600 (functional group number: 2, Mw: 2, 500), UN-6200 (functional group number: 2, Mw: 6,500), UN-9000 PEP (functional group number: 2, Mw: 5,000), UN-9200A (functional group number: 2, Mw: 15,000) , UN- 320HS (functional group number: 15, Mw: 4,900), UN-6301 (functional group number: 2, Mw: 33,000) (all are trade names, manufactured by Negami Industrial Co., Ltd.), EBECRYL 8405 (urethane acrylate / 1 , 6-hexanediol diacrylate = 80/20 addition reaction product, number of functional groups: 4, Mw: 2,700) (trade name, manufactured by Daicel Ornex Co., Ltd.).
Moreover, as a commercial item containing the urethane methacrylate which has a structural unit represented by the said General formula (1), UN-6060PTM (functional group number: 2, Mw: 6,000, a brand name, Negami Kogyo Co., Ltd. make, for example) ) And other commercial products. In the above description, the number of functional groups in parentheses and Mw are the total number and weight average molecular weight of (meth) acryloyl groups contained in urethane (meth) acrylate, respectively.

Moreover, as a commercial item containing the urethane acrylate represented by the said General formula (3), UN-952 (functional group number: 10, Mw: 6,500-11,000) is, for example, General Formula (6) As a commercial item containing the urethane acrylate represented, for example, commercial items, such as UN-905 (the number of functional groups: 15, Mw: 40,000-200,000), are mentioned. Made by Co., Ltd.).
Among these, UN-952 is particularly preferable from the viewpoints of pattern formability and photosensitivity.

The total number of (meth) acryloyl groups (number of photopolymerizable functional groups) contained in the high molecular weight urethane (meth) acrylate is 2 to 24 or 2 to 20 in one molecule from the viewpoint of improving pattern formation and heat resistance. Alternatively, it may be appropriately selected from 2 to 15, and may be appropriately selected from 4 to 15 or 6 to 12 from the viewpoint of stabilizing the physical properties and characteristics of the obtained cured product.
If the number of photopolymerizable functional groups is 2 or more, the heat resistance and rigidity of the cured product at a high temperature can be improved together with pattern formation. On the other hand, if the number of photopolymerizable functional groups is 24 or less, the rigidity of the cured product is improved and the adhesion to the substrate and the like is improved. Moreover, it can be set as a resin composition having an appropriate viscosity, the coatability is improved, and when the resin composition after application is irradiated with light, only the surface portion is easily photocured rapidly and the inside Can suppress the phenomenon that photocuring does not proceed sufficiently, and an excellent resolution can be obtained. Therefore, even when a thick photosensitive layer is formed, an excellent pattern formability can be obtained. Furthermore, after at least one of photocuring and thermal curing is performed, the remaining of unreacted (meth) acryloyl groups can be reduced, and fluctuations in physical properties and characteristics of the obtained cured product can be further suppressed.

The weight average molecular weight of the high molecular weight body is 2,000 or more, and may be 2,500 or more, or 3,000 or more from the viewpoint of improving the coating property and resolution of the resin composition. Furthermore, 3,500 or more may be used from the viewpoint of improving developability and compatibility. On the other hand, the upper limit of the weight average molecular weight may be 40,000 or less, or 30,000 or less from the viewpoint of improving the coatability and resolution of the resin composition, and further improving developability and compatibility. From the viewpoint of 20,000, it may be 20,000 or less.
When the weight average molecular weight is 2,000 or more, since the occurrence of dripping of the applied composition can be suppressed when applied onto a substrate, excellent film formability can be obtained. Moreover, it is easy to form a thick photosensitive layer, and it is possible to suppress the problem that the stress of the resin due to curing shrinkage increases and the reliability decreases.
On the other hand, when the weight average molecular weight is 40,000 or less, the coating property is improved, a thick photosensitive layer is easily formed, and the pattern forming property is improved. Moreover, since the solubility with respect to a developing solution also becomes favorable, the outstanding resolution can be expressed. Furthermore, the transparency of the cured product is improved, and a cured product having excellent transmittance required as a transparent material can be obtained.

What is necessary is just to select content of (A) component suitably from 10 mass% or more, 30 mass% or more, or 40 mass% or more on the basis of the solid content whole quantity of the photosensitive resin composition. If content is 10 mass% or more, applicability | paintability will improve and even if it is a case where a thick photosensitive layer is formed, the outstanding pattern formation property will be obtained.
In consideration of the pattern forming property, coating property, and physical properties and characteristics required for the cured product of the resin composition, the upper limit of the content of the component (A) is the solid content of the photosensitive resin composition. What is necessary is just to select suitably from 95 mass% or less, 85 mass% or less, or 75 mass% or less on the basis of the whole quantity.
Further, the content of the high molecular weight urethane (meth) acrylate in the component (A) is 70 to 100% by mass, 80 based on the total solid content of the component (A) from the viewpoint of improving the pattern formability. What is necessary is just to select suitably from -100 mass%, 90-100 mass%, 95-100 mass%, or 100 mass% (total amount).

<(B) component: high Tg high molecular weight body>
The photosensitive resin composition of this embodiment contains the high molecular weight body which has a glass transition temperature of 70-150 degreeC, and does not have a carbon-nitrogen bond as (B) component. The “high molecular weight body” is the same as defined in the component (A). By containing the component (B), the photosensitive resin composition has a tack suppressing effect.
The high Tg high molecular weight body (B) may contain an ethylenically unsaturated group from the viewpoints of pattern formation and tackiness. Examples of the ethylenically unsaturated group include a (meth) acryloyl group and a vinyl group. From the viewpoint of pattern formation, a (meth) acryloyl group may be used.
The high Tg high molecular weight substance (B) may contain a high molecular weight substance having at least one kind of skeleton selected from the group consisting of an alicyclic skeleton and an aromatic ring skeleton. From the viewpoint of reducing the properties, a high molecular weight body having an alicyclic skeleton may be contained.

The high molecular weight body having an alicyclic skeleton includes, for example, part of an acid group derived from an acid group-containing acrylic resin (b1) having no carbon-nitrogen bond and an alicyclic ring having no carbon-nitrogen bond. It can manufacture by making the epoxy group derived from a formula epoxy group containing unsaturated compound (b2) react.
Examples of the acid group-containing acrylic resin (b1) having no carbon-nitrogen bond include an acid having an ethylenically unsaturated group and monomers such as an ester of (meth) acrylic acid, a vinyl aromatic compound, and a polyolefin compound. A copolymer obtained by copolymerizing one or two or more selected ones can be used. Specifically, an acid having an ethylenically unsaturated group such as (meth) acrylic acid, 2-carboxyethyl (meth) acrylate, 2-carboxypropyl (meth) acrylate, (anhydrous) maleic acid, and the like as an essential component. Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, stearyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl ( Esters of (meth) acrylic acid such as (meth) acrylate; vinyl aromatic compounds such as styrene, α-methylstyrene, vinyltoluene, p-chlorostyrene; monomers of polyolefin compounds such as butadiene, isoprene, chloroprene, and methyliso Ropeniruketon, vinyl acetate, one or two or more monomers by copolymerizing a copolymer selected from other monomers such as vinyl propionate.
The acid value of the component (b1) may be 15 mgKOH / g or more, or 40 to 500 mgKOH / g. Since the component (b1) has such an acid value, a sufficient amount of acid groups remains in the component (B) even after reacting the component (b1) with the component (b2) described later. Become.

  As the alicyclic epoxy group-containing unsaturated compound (b2) having no carbon-nitrogen bond, a compound having one ethylenically unsaturated group and an alicyclic epoxy group in one molecule is preferable. Specific examples include compounds represented by any of the following formulas (I) to (X).

Here, R ⁴ is independently a hydrogen atom or a methyl group. R ⁵ is independently an aliphatic saturated hydrocarbon group.
As the aliphatic saturated hydrocarbon group represented by R ⁵ , a linear or branched alkylene group having 1 to 6 carbon atoms, a cycloalkylene group having 3 to 8 carbon atoms, an arylene group having 6 to 14 carbon atoms, and Examples thereof include divalent organic groups composed of these combinations. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a tetramethylene group, an ethylethylene group, a pentamethylene group, and a hexamethylene group. Examples of the cycloalkylene group include a cyclopentylene group, a cyclohexylene group, and a cyclooctylene group. Examples of the arylene group include a phenylene group and a naphthylene group. The divalent organic group comprising a combination thereof, for example, -CH ₂ - phenylene group _-CH 2 -, - CH ₂ - cyclohexylene group -CH ₂ - and the like.
R ⁵ is methylene group, ethylene group, propylene group, tetramethylene group, ethylethylene group, pentamethylene group, hexamethylene group, phenylene group, cyclohexylene, from the viewpoint of pattern formation and reduction of tackiness. Group, —CH ₂ -phenylene group —CH ₂ —, methylene group, ethylene group, propylene group or methylene group may be used.

The alicyclic epoxy group-containing unsaturated compound (b2) having no carbon-nitrogen bond may be a compound represented by the formula (III) from the viewpoint of pattern formation.
As the high Tg high molecular weight product (B), a commercially available product may be used, and examples thereof include (ACA) Z250 of Cyclomer P series (manufactured by Daicel Ornex Co., Ltd., acid value 101.7 mgKOH / g). . (ACA) Z250 is a resin composed of three structural units represented by the following formula, which is generated by a reaction between an acid group-containing acrylic resin and an alicyclic epoxy group-containing unsaturated compound.

(In the formula, R ⁴ represents a hydrogen atom or a methyl group. R ⁶ represents an alkyl group having 1 to 6 carbon atoms or a hydroxyalkyl group having 1 to 6 carbon atoms.)

Although the glass transition temperature of a high Tg high molecular weight body (B) is 70-150 degreeC, 100-150 degreeC may be sufficient, 115-150 degreeC may be sufficient, and 125-150 degreeC may be sufficient. . Here, the glass transition temperature of the high Tg high molecular weight body (B) is a value measured by the following method.
(Measurement method of glass transition temperature of high Tg high molecular weight product (B))
As a pretreatment for the measurement, the component (B) is heated at 120 ° C. for 3 hours and then cooled to prepare a sample.
Using 10 mg of the sample, the temperature was raised at a temperature range of 25 to 200 ° C. and a heating rate of 20 ° C./min under a nitrogen stream with a differential scanning calorimeter (trade name: DSC-50, manufactured by Shimadzu Corporation). And the influence of solvents and the like is eliminated. After cooling to 25 ° C., the temperature is raised again under the same conditions, and the temperature at which the baseline starts to be offset is defined as the glass transition temperature.

  Further, the weight average molecular weight of the high Tg high molecular weight product (B) may be 3,000 to 50,000, 4,000 to 40,000, or 5,000 to 30,000. There may be. If it is 3,000 or more, the tack suppression effect tends to increase, and if it is 50,000 or less, the resolution tends to be good.

  In the photosensitive resin composition of the present embodiment, the content of the high Tg high molecular weight (B) is such that the component (A) and the high Tg high molecular weight (B) are used from the viewpoint of pattern formation and reduction of tackiness. 5) to 60 parts by mass, 5 to 40 parts by mass, or 5 to 30 parts by mass.

<(C) component: low molecular weight body>
The photosensitive resin composition of this embodiment contains the low molecular weight body which has a photopolymerizable functional group as (C) component. The “low molecular weight body” means a compound having a weight average molecular weight of less than 2,000. Here, even if the low molecular weight substance having a photopolymerizable functional group has a silicon atom, the low molecular weight substance having a photopolymerizable functional group is not a silane compound of the component (E) described later. It is classified into component (C) with priority given to certain things.
Examples of the photopolymerizable functional group contained in the component (C) include (meth) acryloyl groups; ethylenically unsaturated groups such as alkenyl groups such as vinyl groups and allyl groups. (B) component should just be a low molecular weight body which has at least 1 photopolymerizable functional group, and (C) component is a (meth) acryloyl group as a photopolymerizable functional group from a viewpoint of improving pattern formation property. You may have. The component (C) may have two or more photopolymerizable functional groups or 2 to 5 photopolymerizable functional groups from the viewpoint of improving pattern formation.
In the photosensitive resin composition of the present embodiment, as the component (C), the component (C1): a low molecular weight body having an isocyanuric ring, the component (C2): a low molecular weight body having a urethane bond, and the component (C3): fat It is preferable to contain at least one selected from the group consisting of low molecular weight compounds having a cyclic skeleton. When the photosensitive resin composition of the present embodiment contains at least one of these, the adhesiveness of the electronic component with the substrate or the like tends to be improved, and excellent pattern formability tends to be obtained. In addition, in the case of a low molecular weight substance having two or more of an isocyanuric ring, a urethane bond, and an alicyclic skeleton, it is classified as a component (C1) as long as it has at least an isocyanuric ring. When it has an alicyclic skeleton, it is classified as component (C2) with priority given to having a urethane bond. That is, a low molecular weight substance having an alicyclic skeleton without having an isocyanuric ring and a urethane bond is classified as a component (C3).

((C1) component: low molecular weight product having an isocyanuric ring)
The component (C1) may have two or more photopolymerizable functional groups, may have 2 to 5 photopolymerizable functional groups, and is photopolymerized from the viewpoint of improving pattern formability. The functional group may have two or three, or may have three.
The photopolymerizable functional group of the component (C1) has been described as the photopolymerizable functional group contained in the component (C) described above. From the viewpoint of improving pattern formability, It may have a (meth) acryloyl group.
Examples of the component (C1) include compounds represented by the following general formula (7).

(In the general formula (7), R ⁷ , R ⁸ and R ⁹ each independently represent an alkylene group having 1 to 6 carbon atoms, R ¹⁰ and R ¹¹ each independently represent a hydrogen atom or a methyl group, R ¹² represents a hydrogen atom or a (meth) acryloyl group.)

In General Formula (7), the alkylene group having 1 to 6 carbon atoms represented by R ⁷ , R ^8, and R ⁹ may be an alkylene group having 1 to 4 carbon atoms, or an alkylene group having 1 to 3 carbon atoms. There may be.
Examples of the alkylene group having 1 to 6 carbon atoms include a methylene group, an ethylene group, a propylene group, a butylene group, an isopropylene group, an isobutylene group, a t-butylene group, a pentylene group, and a hexylene group. From the viewpoint of improving pattern formability, an ethylene group may be used.
In General Formula (7), R ¹⁰ and R ¹¹ each independently represent a hydrogen atom or a methyl group, and may be a hydrogen atom from the viewpoint of improving pattern formation.
In General Formula (7), R ¹² represents a hydrogen atom or a (meth) acryloyl group, and may be a (meth) acryloyl group from the viewpoint of improving pattern formation.

  The compound represented by the general formula (7) may be one or more selected from the group consisting of a compound represented by the following formula (7-1) and a compound represented by the following formula (7-2). The compound represented by the following formula (7-1) may be used from the viewpoint of improving the pattern forming property.

  The weight average molecular weight of the component (C1) is less than 2,000, and may be appropriately selected from 200 to 1,500, 300 to 1,000, or 350 to 600 from the viewpoint of improving pattern formability. Good.

As the component (C1), a commercially available product may be used. Examples of commercially available products include “A-9300” (compound represented by the above formula (7-1)) manufactured by Shin-Nakamura Chemical Co., Ltd., and “M-215” manufactured by Toagosei Co., Ltd. (the above formula ( 7-2)) and the like.
(C1) A component can be used individually or in combination of 2 or more types.

((C2) component: low molecular weight substance having urethane bond)
The component (C2) may have two or more photopolymerizable functional groups, or may have 2 to 6 photopolymerizable functional groups, from the viewpoint of improving pattern formability. You may have four and you may have two photopolymerizable functional groups.
The photopolymerizable functional group of the component (C2) is described as the photopolymerizable functional group contained in the component (C) described above, and from the viewpoint of improving pattern formation, It may have a (meth) acryloyl group.
In the present specification, the (C2) component having a (meth) acryloyl group as a photopolymerizable functional group may be simply referred to as “low molecular weight urethane (meth) acrylate”.

  Examples of the low molecular weight urethane (meth) acrylate include a reaction product of a hydroxyl group-containing (meth) acrylate and an isocyanate group-containing isocyanate compound. Here, examples of the (meth) acrylate having a hydroxyl group and an isocyanate compound include the acrylate having a hydroxyl group and the isocyanate compound exemplified as those used for the production of a high molecular weight product. Here, examples of the one that is appropriately selected from the viewpoint of improving the pattern formability include the same one that is appropriately selected as the one used for the production of the high molecular weight from the same viewpoint.

In addition, as a low molecular weight urethane (meth) acrylate, a hydroxyl group-containing (meth) acrylate is reacted with a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule and a diol compound. The reaction product obtained is used. Here, as an isocyanate compound having at least two isocyanate groups in one molecule, a diol compound, and a (meth) acrylate having a hydroxyl group, an isocyanate group in one molecule exemplified as one used for the production of a high molecular weight compound. An isocyanate compound having at least two, a diol compound, and a (meth) acrylate having a hydroxyl group. Here, examples of the one that is appropriately selected from the viewpoint of improving the pattern formability include the same one that is appropriately selected as the one used for the production of the high molecular weight from the same viewpoint.
Examples of the reaction product include those having a structural unit represented by the following general formula (8).

In General Formula (8), X ₂ represents a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, and Y ₂ represents a chain hydrocarbon skeleton or an alicyclic skeleton. The divalent organic group which has. That is, examples of the component (C2) include those having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton. Examples of X ₂ and Y ₂ are the same as X ₁ and Y ₁ in the general formula (1).
From the viewpoint of improving the pattern forming property and improving the transparency, water resistance, and moisture resistance of the resin composition in a well-balanced manner, X ₂ is a divalent organic group having a chain hydrocarbon skeleton and a branched chain. What is necessary is just to select suitably from the bivalent organic group which has a chain | strand-shaped hydrocarbon frame | skeleton, the branched C2-C12 alkylene group, for example, the residue of the said aliphatic diisocyanate compound. From the same viewpoint, Y ₂ may be appropriately selected from a divalent organic group having an alicyclic skeleton, for example, a residue of a diol compound having the alicyclic skeleton.

  Specific examples of the low molecular weight urethane (meth) acrylate include urethane acrylate represented by the following general formula (9).

In Chemical Formula (9), _{n 5} is an integer of 1-4. R ¹³ and R ¹⁴ are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and a plurality of R ¹³ and R ¹⁴ are each an alkyl group having 1 to 4 carbon atoms. .
Of the urethane acrylate represented by the chemical formula (9), X _{2 in the} general formula (8) is a residue of trimethylhexamethylene diisocyanate, which is a divalent organic group having a chain hydrocarbon skeleton, and Y ₂ As a commercially available product containing urethane acrylate having a structural unit that is a residue of cyclohexanedimethanol of a divalent organic group having an alicyclic skeleton, for example, TMCH-5R (trade name, number of functional groups: 2, Mw : 950, manufactured by Hitachi Chemical Co., Ltd.) and the like.
Moreover, as a commercial item containing the urethane (meth) acrylate which has a structural unit represented by the said General formula (8), KRM8452 (the number of functional groups: 10, Mw: 1,200, Daicel Ornex Co., Ltd. make), UN Commercial products such as -3320HA (functional group number: 6, Mw: 1,500, manufactured by Negami Kogyo Co., Ltd.), UN-3320HC (functional group number: 6, Mw: 1,500, manufactured by Negami Kogyo Co., Ltd.), and the like. In the above description, the number of functional groups and Mw in parentheses are the total number and weight average molecular weight of (meth) acryloyl groups contained in urethane (meth) acrylate, respectively.

The weight average molecular weight of the component (C2) is less than 2,000, may be 1,500 or less from the viewpoint of improving adhesion, and is 1,000 or less from the viewpoint of improving resolution. Also good. On the other hand, the lower limit of the weight average molecular weight may be appropriately used according to the desired purpose, but may be 500 or more or 700 or more from the viewpoint of film formability.
By containing the component (C2) as the component (C), the effect of improving the pattern forming property is increased.

((C3) component: low molecular weight product having an alicyclic skeleton)
The component (C3) may have two or more photopolymerizable functional groups, may have 2 to 4 photopolymerizable functional groups, and is photopolymerized from the viewpoint of improving pattern formability. May have two functional groups.
The photopolymerizable functional group of the component (C3) is described as the photopolymerizable functional group contained in the component (C) described above. From the viewpoint of improving the pattern formability, It may have a (meth) acryloyl group.
Although it does not restrict | limit especially as an alicyclic skeleton which (C3) component has, For example, a C5-C20 alicyclic hydrocarbon skeleton is mentioned. The alicyclic hydrocarbon skeleton is at least one selected from the group consisting of a cyclopentane skeleton, a cyclohexane skeleton, a cyclooctane skeleton, a cyclodecane skeleton, a norbornane skeleton, a dicyclopentane skeleton, and a tricyclodecane skeleton. Also good. Among these, a tricyclodecane skeleton may be used from the viewpoint of improving pattern formability.

The weight average molecular weight of the component (C3) is less than 2,000, may be 1,500 or less from the viewpoint of improving adhesion, and is 1,000 or less from the viewpoint of improving resolution. Or 500 or less. On the other hand, the lower limit of the weight average molecular weight can be appropriately used according to the desired purpose, but may be 150 or more or 200 or more from the viewpoint of film formability.
The component (C3) may be tricyclodecane dimethanol diacrylate from the viewpoint of pattern formation.
As the component (C3), a commercially available product may be used. Examples of commercially available products include A-DCP (tricyclodecane dimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.).

The content (total content) of the component (C) is suitably 3% by mass or more, 5% by mass or more, 10% by mass or more, or 20% by mass or more based on the total solid content of the photosensitive resin composition. You may choose. When the content of the component (C) is 3% by mass or more, excellent pattern formability can be obtained even when a thick photosensitive layer is formed, and excellent rigidity of the cured product can be obtained. From the same viewpoint, the upper limit value of the content of the component (C) is suitably from 70% by mass or less, 60% by mass or less, or 50% by mass or less, based on the total solid content of the photosensitive resin composition. Just choose.
The content of the component (C) based on 100 parts by mass of the total solid content of the component (A) and the component (B) is 20 to 120 parts by mass, 25 from the viewpoint of improving the pattern formability and the rigidity of the cured product. What is necessary is just to select suitably from -100 mass parts or 30-80 mass parts.

The total content of the components (C1) to (C3) in the component (C) is 50% by mass or more, 70% by mass or more, 80% by mass or more, 90% by mass or more, 95% by mass or more, or substantially. It can select suitably from 100 mass%.
When using at least 2 or more types of said (C1) component-(C3) component, content of (C2) component in solid content whole quantity of (C) component is 30 mass% or more, 50 mass% As mentioned above, you may select suitably from 60 mass% or more and 70 mass% or more. When the content of the component (C2) is 30% by mass or more, excellent pattern formability can be obtained even when a thick photosensitive layer is formed, and excellent rigidity of the cured product can be obtained. From the same viewpoint, the upper limit value of the component (C2) may be appropriately selected from 90% by mass or less, 85% by mass or less, and 80% by mass or less.

<(D) component: Photopolymerization initiator>
The photosensitive resin composition of this embodiment contains a photoinitiator as (D) component. The component (D) is not particularly limited as long as at least one of the components (A) to (C) can be polymerized, and can be appropriately selected from commonly used photopolymerization initiators. From the viewpoint of improving pattern formation, those that generate free radicals with actinic rays, such as acylphosphine oxides, oxime esters, aromatic ketones, quinones, alkylphenones, imidazoles, acridines, phenylglycines And photopolymerization initiators such as coumarins and coumarins.

  The acylphosphine oxide photopolymerization initiator has an acylphosphine oxide group [> P (═O) —C (═O) —R], for example, (2,6-dimethoxybenzoyl) -2,4. , 6-pentylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("IRGACURE-TPO" (manufactured by BASF)), ethyl-2 , 4,6-trimethylbenzoylphenyl phosphinate, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide ("IRGACURE-819" (manufactured by BASF)), (2,5-dihydroxyphenyl) diphenylphosphine Oxide, (p-hydroxyphenyl) di E cycloalkenyl phosphine oxide, bis (p- hydroxyphenyl) phenylphosphine oxide, tris (p- hydroxyphenyl) phosphine oxide, and the like.

  The oxime ester photopolymerization initiator is a photopolymerization initiator having an oxime ester bond. For example, 1,2-octanedione-1- [4- (phenylthio) phenyl] -2- (O-benzoyloxime) ( Trade name: OXE-01, manufactured by BASF), 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] ethanone 1- (O-acetyloxime) (trade name: OXE) -02, manufactured by BASF), 1-phenyl-1,2-propanedione-2- [O- (ethoxycarbonyl) oxime] (trade name: Quanture-PDO, manufactured by Nippon Kayaku Co., Ltd.), and the like.

  Examples of the aromatic ketone photopolymerization initiator include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4 -Methoxy-4'-dimethylaminobenzophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one ("IRGACURE-651" (manufactured by BASF)), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one (“IRGACURE-369” (manufactured by BASF)), 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one ("IRGACURE-907" (manufactured by BASF)) and the like.

  Examples of the quinone photopolymerization initiator include 2-ethylanthraquinone, phenanthrenequinone, 2-t-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2 , 3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone, etc. It is done.

  Examples of the alkylphenone photopolymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin phenyl ether, 2,2-dimethoxy-1,2-diphenylethane-1- ON (“IRGACURE-651” (manufactured by BASF)), 1-hydroxy-cyclohexyl-phenyl-ketone (“IRGACURE-184” (manufactured by BASF)), 2-hydroxy-2-methyl-1-phenyl-propane- 1-one (“IRGACURE-1173” (manufactured by BASF)), 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one (“IRGACURE- 2959 "(manufactured by BASF)), 2-H Doxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one (“IRGACURE-127” (manufactured by BASF)) and the like Can be mentioned.

  Examples of imidazole photopolymerization initiators include 2,4,5-triarylimidazole dimers such as 2- (2-chlorophenyl) -1- [2- (2-chlorophenyl) -4,5-diphenyl. -1,3-diazol-2-yl] -4,5-diphenylimidazole, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5- Di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- And (p-methoxyphenyl) -4,5-diphenylimidazole dimer.

  Examples of the acridine photopolymerization initiator include 9-phenylacridine, 1,7-bis (9,9′-acridinyl) heptane, and the like.

  Examples of the phenylglycine photopolymerization initiator include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine.

  Examples of the coumarin photopolymerization initiator include 7-amino-4-methylcoumarin, 7-dimethylamino-4-methylcoumarin, 7-diethylamino-4-methylcoumarin, and 7-methylamino-4-methylcoumarin. 7-ethylamino-4-methylcoumarin, 7-dimethylaminocyclopenta [c] coumarin, 7-aminocyclopenta [c] coumarin, 7-diethylaminocyclopenta [c] coumarin, 4,6-dimethyl-7- Ethylaminocoumarin, 4,6-diethyl-7-ethylaminocoumarin, 4,6-dimethyl-7-diethylaminocoumarin, 4,6-dimethyl-7-dimethylaminocoumarin, 4,6-diethyl-7-ethylaminocoumarin 4,6-diethyl-7-dimethylaminocoumarin, 2,3,6,7,10,11-hex Hydro-1H, 5H-cyclopenta [3,4] [1] benzopyrano- [6,7,8-ij] quinolizine 12 (9H) -one, 7-diethylamino-5 ′, 7′-dimethoxy-3,3 ′ -Carbonylbiscoumarin, 3,3′-carbonylbis [7- (diethylamino) coumarin], 7-diethylamino-3-thienoxysilkine and the like.

  Among these (D) photopolymerization initiators, from the viewpoint of improving pattern formation, a compound represented by the following general formula (D1) or a compound represented by the following general formula (D2) may be used. .

(R ^D1 , R ^D2 and R ^D3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and R ^D4 and R ^D5 each independently represent A hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, each of R ^{D1 to} R ^D5 other than a hydrogen atom has a substituent. May be.)

(R ^D6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group, and R ^D7 and R ^D8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or 6 to 12 carbon atoms. R ^D7 and R ^D8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms other than hydroxyl groups and hydrogen atoms. R ^{D6 to} R ^D8 may each have a substituent, and the amino group having a substituent may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms. .
R ^D9 is independently a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or an organic group having 1 to 10 carbon atoms that may contain one or more selected from an oxygen atom, a nitrogen atom, and a sulfur atom. Indicates a group. )

In General Formula (D1), R ^D1 , R ^D2, and R ^D3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms.
The alkyl group having 1 to 6 carbon atoms represented by R ^D1 , R ^D2 and R ^D3 may be an alkyl group having 1 to 3 carbon atoms or an alkyl group having 1 or 2 carbon atoms. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, an n-heptyl group, and an n-hexyl group.
The alkoxy group having 1 to 6 carbon atoms represented by R ^D1 , R ^D2 and R ^D3 may be an alkoxy group having 1 to 3 carbon atoms, or may be an alkoxy group having 1 or 2 carbon atoms. Examples of the alkoxy group include methoxy group, ethoxy group, propyloxy group, isopropyloxy group, n-butoxy group, tert-butoxy group and the like.
Among these groups, R ^D1 , R ^D2, and R ^D3 may be a methyl group from the viewpoint of improving pattern formation.

In General Formula (D1), R ^D4 and R ^D5 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms. .
The alkyl group having 1 to 6 carbon atoms and the alkoxy group having 1 to 6 carbon atoms represented by R ^D4 and R ^D5 are described in the same manner as in R ^D1 , R ^D2, and R ^D3 .
The aryl group having 6 to 12 carbon atoms represented by R ^D4 and R ^D5 may be an aryl group having 6 to 10 carbon atoms or an aryl group having 6 to 8 carbon atoms. Examples of the aryl group include a phenyl group and a naphthyl group.

Examples of the substituent that R ^{D1 to} R ^D5 may have include a halogen atom, a carboxy group, a hydroxy group, an amino group, a mercapto group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms. Group, an aryl group having 6 to 12 carbon atoms, and the like. R ^D1 to R ^D5 is the substituent which may have an alkyl group, an alkoxy group and aryl group, an alkyl group described as R ^D1 to R ^D5, are the same as those of the alkoxy group and an aryl group .

In General Formula (D2), R ^D6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group.
The alkoxy group represented by R ^D6 is described in the same manner as in R ^D1 , R ^D2 and R ^D3 in the general formula (D1).
Among these groups, R ^D6 may be a hydroxyl group from the viewpoint of improving pattern forming properties.

In General Formula (D2), R ^D7 and R ^D8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or an aryl group having 6 to 12 carbon atoms. .
^Examples of the alkyl group, alkoxy group and aryl group represented by R ^D7 and R ^D8 include the same alkyl groups, alkoxy groups and aryl groups represented by R ^{D1 to} R ^D5 in formula (D1).
R ^D7 and R ^D8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms.
The cyclic structure may be a C4-10 cyclic structure or a C5-8 cyclic structure.
The cyclic structure may be an alicyclic structure from the viewpoint of improving pattern forming properties, and examples of the alicyclic structure include a cyclopentane structure, a cyclohexane structure, a cycloheptane structure, and a cyclooctane structure. In addition, these alicyclic structures may contain carbon atoms to which R ^D7 and R ^D8 are directly bonded.

The substituent that R ^{D6 to} R ^D8 may have is described in the same manner as the substituent that R ^{D1 to} R ^D5 in General Formula (D1) may have.
However, in the amino group having a substituent, the substituents may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms.
The cyclic structure formed by the substituent of the amino group may be a cyclic structure having 3 to 10 carbon atoms or a cyclic structure having 3 to 5 carbon atoms.
The cyclic structure may be a 5- to 10-membered ring containing a nitrogen atom of the amino group, a 5- to 7-membered ring containing a nitrogen atom of the amino group, or a 6-membered ring containing the nitrogen atom of the amino group. It may be a ring. Furthermore, these cyclic structures may contain hetero atoms other than nitrogen atoms such as oxygen atoms. Specific examples of the cyclic structure formed by the substituent of the amino group include a structure (morpholino group) represented by the following formula (D3).

In General Formula (D2), R ^D9 may independently include one or more selected from a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or an oxygen atom, a nitrogen atom, and a sulfur atom. An organic group having 1 to 10 carbon atoms is shown.
The organic group having 1 to 10 carbon atoms represented by ^RD9 may be an organic group having 1 to 6 carbon atoms or an organic group having 1 to 4 carbon atoms.
The organic group having 1 to 10 carbon atoms represented by ^RD9 may be a hydrocarbon group such as an alkyl group, an alkenyl group, and an aryl group. Examples of these alkyl group, alkenyl group and aryl group include the same alkyl groups, alkenyl groups and aryl groups as those represented by R ^{D1 to} R ^D5 in formula (D1).
As a C1-C10 organic group containing the oxygen atom which ^RD9 represents, a C1-C10 alkoxy group etc. are mentioned, for example.
As a C1-C10 organic group containing the nitrogen atom which ^RD9 represents, group represented by the said general formula (D3) is mentioned, for example.
As a C1-C10 organic group containing the sulfur atom which ^RD9 represents, alkylthio groups, such as a methylthio group, etc. are mentioned, for example.

  The content of component (D) is such that the absorbance with respect to light having a wavelength of 365 nm is 0.35 or less at a thickness of the photosensitive layer formed by the photosensitive resin composition (thickness after drying) of 50 μm, 0.3 or less. May be appropriately selected from the amount that becomes 0.2, the amount that becomes 0.2 or less, or the amount that becomes 0.1 or less. With the above content, for example, even when a pattern is formed with a thick photosensitive layer of 70 μm or more, the light can easily pass to the bottom of the photosensitive layer (the surface of the photosensitive layer on the substrate side). Can be improved. Here, the absorbance is, for example, using a UV-visible spectrophotometer (product name: “U-3310 Spectrophotometer”, manufactured by Hitachi High-Technologies Corporation), using a polyethylene terephthalate film alone as a reference, and having a wavelength of 365 nm. Absorbance with respect to light can be measured.

  The content of the component (D) may be appropriately determined depending on the absorbance at a thickness of 50 μm of the photosensitive layer, and is usually 0.05 to 20% by mass, 0.05 to 20% based on the total solid content of the photosensitive resin composition. What is necessary is just to select suitably from 10 mass%, 0.1-7 mass%, 0.1-5 mass%, or 0.1-3 mass%. By setting it as the said content, the sensitivity of the photosensitive resin composition can be improved, the deterioration of a resist shape can be suppressed, and pattern formation property can be improved.

  Further, in addition to the above component (D), three compounds such as N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine, etc. (D ′) photopolymerization initiation assistants such as secondary amines may be used alone or in combination of two or more.

<(E) component: Silane compound>
Moreover, the photosensitive resin composition of this embodiment can further contain (E) a silane compound. As the component (E), a known silane coupling agent can be used. The component (E) can improve the adhesion of the electronic component to the substrate. In particular, the substrate is a substrate containing silicon (for example, a glass substrate, a silicon wafer, an epoxy resin-impregnated glass cloth substrate, etc.). Is valid. Examples of the silane coupling agent include: alkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane; (meth) acryloxypropyltrimethoxysilane, (meth) acryloxypropylmethyldimethoxysilane (Meth) acryloyl group-containing alkoxysilanes such as γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N- (1, Amine-based alkoxysilanes such as 3-dimethylbutylidene) propylamine; γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, glycidoxypropylmethyldiethoxysilane, Glycidoxy group-containing alkoxysilanes such as sidoxypropylmethyldiisopropenoxysilane; Alicyclic epoxy group-containing alkoxysilanes such as 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3-ureidopropyltriethoxysilane Ureido group-containing alkoxysilanes; mercapto group-containing alkoxysilanes such as 3-mercaptopropyltrimethoxysilane and 3-mercaptopropylmethyldimethoxysilane; carbamate group-containing alkoxysilanes such as triethoxysilylpropylethylcarbamate; 3- (triethoxysilyl) And polybasic acid anhydride group-containing alkoxysilanes such as propyl succinic anhydride. These can be used alone or in combination of two or more.
From the viewpoint of further improving adhesiveness, (meth) acryloyl group-containing alkoxysilanes such as (meth) acryloxypropyltrimethoxysilane, (meth) acryloxypropylmethyldimethoxysilane, glycidoxypropyltrimethoxysilane, glycidoxy Silane coupling agents having an ethylenically unsaturated group in the molecule, such as glycidoxy group-containing alkoxysilanes such as propylmethyldiethoxysilane and glycidoxypropylmethyldiisopropenoxysilane, may be used.

  When the photosensitive resin composition of this embodiment contains (E) component, content of (E) component is 0.05-15 mass% on the basis of the solid content whole quantity of the photosensitive resin composition, 0 What is necessary is just to select suitably from 0.1-10 mass%, 0.1-7 mass%, 1-7 mass%, or 1-5 mass%. By setting it as the said content, deterioration of a resist shape can be suppressed and pattern formation property can be improved.

<(F) component: thermal radical polymerization initiator>
Moreover, the photosensitive resin composition of this embodiment can contain the (F) thermal radical polymerization initiator further. There is no restriction | limiting in particular as (F) component, For example, (alpha), (alpha) '-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, t-butyl cumyl peroxide, di-t-butyl peroxide, etc. Dialkyl peroxides; ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide; 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy)- 2-methylcyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-hexyl) Peroxy) -3,3,5-trimethylcyclohexane and other peroxy Tar; hydroperoxide such as p-menthane hydroperoxide; diacyl peroxide such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, benzoyl peroxide; bis (4-t-butylcyclohexyl) peroxydicarbonate, Peroxycarbonates such as di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-3-methoxybutyl peroxycarbonate; t-butyl peroxypivalate, t-hexyl peroxypi Valate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy -2-ethylhexyl Sanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butyl peroxylaurate, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-butyl peroxybenzoate, t-hexyl peroxybenzoate, 2,5-dimethyl-2 , 5-bis (benzoylperoxy) hexane, peroxide-based polymerization initiators such as peroxyesters such as t-butylperoxyacetate, 2,2′-azobisisobutyronitrile, 2,2′-azobis (2,4-dimethylvaleronitrile), 2,2'-azo Scan (4-methoxy-2'-dimethylvaleronitrile) azo polymerization initiators, and the like.

  As the component (F), a peroxide polymerization initiator and a dialkyl peroxide polymerization initiator, particularly dicumyl peroxide can be selected from the viewpoint of improving the pattern forming property. Moreover, (F) component can be used individually or in combination of 2 or more types.

  When the photosensitive resin composition of this embodiment contains (F) component, the content is 0.1-10 mass% on the basis of the solid content whole quantity of the photosensitive resin composition, 0.2-5. What is necessary is just to select suitably from the mass% or 0.3-1.5 mass%. By setting it as the above content, the heat resistance of the photosensitive resin composition is improved, and the reliability when used as a permanent film is improved.

<(G) component: inorganic filler>
The photosensitive resin composition of the present embodiment may contain a component (G) for the purpose of further improving various properties such as adhesion between the photosensitive resin composition and the substrate, heat resistance, and rigidity of the cured product. it can.
Examples of the component (G) include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), titania (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), zirconia (ZrO ₂ ), and silicon nitride (Si ₃ N). ₄ ), barium titanate (BaO.TiO ₂ ), barium carbonate (BaCO ₃ ), magnesium carbonate (MgCO ₃ ), aluminum hydroxide (Al (OH) ₃ ), magnesium hydroxide (Mg (OH) ₂ ), titanium Lead oxide (PbO · TiO ₂ ), lead zirconate titanate (PZT), lead lanthanum zirconate titanate (PLZT), gallium oxide (Ga ₂ O ₃ ), spinel (MgO · Al ₂ O ₃ ), mullite (3Al ₂ O ₃ · 2SiO _2), cordierite _{(2MgO · 2Al 2 O 3 ·} 5SiO 2), talc (3MgO · 4SiO ₂ · H ₂ O), aluminum titanate (TiO ₂ · Al ₂ O ₃ ), yttria-containing zirconia (Y ₂ O ₃ · ZrO ₂ ), barium silicate (BaO · 8SiO ₂ ), boron nitride (BN), calcium carbonate (CaCO ₃ ), barium sulfate (BaSO ₄ ), calcium sulfate (CaSO ₄ ), zinc oxide (ZnO), magnesium titanate (MgO · TiO ₂ ), hydrotalcite, mica, calcined kaolin, carbon (C), etc. Can be used. These inorganic fillers can be used alone or in combination of two or more.

  The average particle diameter of the component (G) is appropriately selected from 0.01 to 3 μm, 0.01 to 2 μm, or 0.02 to 1 μm from the viewpoint of improving adhesiveness, heat resistance, and rigidity of the cured product. That's fine. Here, the average particle diameter of (G) component is an average particle diameter of the inorganic filler in the state disperse | distributed in the photosensitive resin composition, and is set as the value obtained by measuring as follows. First, after diluting (or dissolving) the photosensitive resin composition 1000 times with methyl ethyl ketone, using a submicron particle analyzer (trade name: N5, manufactured by Beckman Coulter Co., Ltd.), conforming to the international standard ISO 13321. Then, the particles dispersed in the solvent at a refractive index of 1.38 are measured, and the particle size at an integrated value of 50% (volume basis) in the particle size distribution is taken as the average particle size. Further, the component (G) contained in the photosensitive layer provided on the carrier film or the cured film of the photosensitive resin composition is also diluted (or dissolved) to 1000 times (volume ratio) using a solvent as described above. Then, it can be measured by using the submicron particle analyzer.

  When the photosensitive resin composition of this embodiment contains the component (G), the content is based on the total solid content of the photosensitive resin composition, and the upper limit is 10% by mass or less, 5% by mass or less, or The lower limit may be appropriately selected from 1% by mass or less, the lower limit may be appropriately selected from over 0% by mass, and may be 0% by mass (that is, it may not be included). Thus, by substantially not containing the component (G), the transparency of the photosensitive resin composition is improved. For example, even when a pattern is formed with a thick photosensitive layer of 70 μm or more, the photosensitive layer Since the light easily passes through to the bottom of the substrate (the surface on the substrate side of the photosensitive layer), the pattern formability is improved.

<Other additives>
The photosensitive resin composition of the present embodiment further contains additives such as a sensitizer, a heat-resistant high molecular weight body, a thermal crosslinking agent, and an adhesion aid other than the component (E) as necessary. Can do.

  Examples of the sensitizer include sensitization of pyrazolines, anthracenes, xanthones, oxazoles, benzoxazoles, thiazoles, benzothiazoles, triazoles, stilbenes, triazines, thiophenes, naphthalimides, etc. Agents. These can be used alone or in combination of two or more.

  Examples of the heat-resistant high molecular weight substance include polyoxazole and precursors thereof, phenol novolac, cresol novolac and other novolac resins, polyamide, which have high heat resistance and are used as engineering plastics from the viewpoint of improving processability. Examples include imide and polyamide. These can be used alone or in combination of two or more.

  As the thermal crosslinking agent, from the viewpoint of improving the rigidity of the cured product, for example, an epoxy resin, a phenol resin substituted with a methylol group and an alkoxymethyl group at the α-position, and a group consisting of a methylol group and an alkoxymethyl group at the N-position Examples include melamine resin substituted with at least one selected, urea resin, and the like. These can be used alone or in combination of two or more.

  The content of these other additives is not particularly limited as long as it does not inhibit the effect of the photosensitive resin composition of the present embodiment, and is, for example, 0 based on the total solid content of the photosensitive resin composition. What is necessary is just to select suitably from 0.1-10 mass%, 0.3-5 mass%, or 0.5-5 mass%.

<Diluent>
A diluent can be used in the photosensitive resin composition of the present embodiment as necessary. Examples of the diluent include alcohols having 1 to 6 carbon atoms such as isopropanol, isobutanol and t-butanol; amides such as N, N-dimethylformamide, N, N-dimethylacetamide and N-methylpyrrolidone; Sulfur atom-containing compounds such as sulfoxide and sulfolane; esters such as γ-butyrolactone and dimethyl carbonate; cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate And polar solvents such as esters such as propylene glycol monoethyl ether acetate. These can be used alone or in combination of two or more.

What is necessary is just to select the usage-amount of a diluent suitably from the quantity from which content of the solid content total amount in the photosensitive resin composition will be 50-90 mass%, 60-80 mass%, or 65-75 mass%. That is, what is necessary is just to select suitably content of the diluent in the photosensitive resin composition in the case of using a diluent from 10-50 mass%, 20-40 mass%, or 25-35 mass%. By making the usage-amount of a diluent into the said range, the applicability | paintability of the photosensitive resin composition improves and formation of a higher definition pattern is attained.
For example, when a photosensitive layer having a thickness of 70 μm or more is to be formed, the viscosity at 25 ° C. of the photosensitive resin composition is 0.5 to 20 Pa · s in consideration of ease of formation of the photosensitive layer, or The amount can be 1 to 10 Pa · s.

  The photosensitive resin composition of the present embodiment comprises the above components (A) to (D), (E) to (G) components, other additives, and diluents used as desired. It can be obtained by uniformly kneading and mixing with a bead mill or the like.

The photosensitive resin composition of the present embodiment may be used as a liquid or a film.
When used as a liquid, the method for applying the photosensitive resin composition of the present embodiment is not particularly limited, and examples thereof include a printing method, a spin coating method, a spray coating method, a jet dispensing method, an ink jet method, and a dip coating method. Various coating methods are mentioned. Among these, from the viewpoint of forming a thick photosensitive layer more easily, a printing method or a spin coating method may be selected as appropriate.
Moreover, when using as a film form, it can use in the form of the photosensitive resin film mentioned later, for example, In this case, a photosensitive layer of desired thickness can be formed by laminating | stacking using a laminator etc.

  The absorbance with respect to light having a wavelength of 365 nm at a thickness (thickness after drying) of the photosensitive layer formed by the photosensitive resin composition of the present embodiment is 0.35 or less, 0.3 or less, 0.2 or less It can be suitably selected from 0.1 or less. When the absorbance of the photosensitive layer at a thickness of 50 μm is 0.35 or less, for example, even when a pattern is formed with a thick photosensitive layer of 70 μm or more, the bottom of the photosensitive layer (on the substrate side of the photosensitive layer). Since the light easily passes to the surface), the pattern forming property can be improved. The absorbance with respect to light having a wavelength of 365 nm when the thickness of the photosensitive layer is 50 μm may be obtained by converting the absorbance measured for the photosensitive layer other than the thickness of 50 μm into the absorbance of 50 μm in thickness based on Lambert Beer's law. it can.

[Photosensitive resin film]
The photosensitive resin film of this embodiment has a photosensitive layer using the photosensitive resin composition of this embodiment. The photosensitive resin film of this embodiment may have a carrier film. In this specification, the term “layer” includes not only a structure having a shape formed on the entire surface but also a structure having a shape formed on a part when observed as a plan view.

  The photosensitive resin film of the present embodiment is formed by, for example, applying the photosensitive resin composition of the present embodiment on a carrier film by the above various coating methods to form a coating film, and then drying the coating film. A photosensitive layer can be formed and manufactured. Moreover, when the photosensitive resin composition of this embodiment contains a diluent, you may remove at least one part of this diluent in the case of drying.

  The coating film can be dried using hot air drying, a far infrared ray, or a dryer using near infrared rays, and the drying temperature is from 60 to 120 ° C., 70 to 110 ° C., or from 90 to 110 ° C. What is necessary is just to select suitably. Moreover, what is necessary is just to select suitably from 1 to 60 minutes, 2 to 30 minutes, or 5 to 20 minutes as drying time. If it is dried under the above conditions, when the photosensitive resin composition of the present embodiment contains a diluent, at least a part of the diluent can be removed.

Examples of the carrier film include resin films such as polyester resin films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN), and polyolefin resin films such as polypropylene and polyethylene. From the viewpoint of improving the mechanical strength and heat resistance of the photosensitive resin film, a polyester resin film may be selected.
The thickness of the carrier film may be appropriately selected from 10 μm to 3 mm or 10 to 200 μm in consideration of handleability and the like.

  The thickness of the photosensitive layer may be appropriately selected from 1 to 500 μm, 10 to 300 μm, or 30 to 100 μm. By setting the thickness to 30 μm or more, for example, when forming a photosensitive layer having a thickness of 150 μm or more, the number of operations by laminating or the like can be further reduced, and by setting the thickness to 100 μm or less, the photosensitive resin film can be wound. When wound on the core, the deformation of the photosensitive layer due to the difference in stress between the inside and the outside of the core can be further reduced. Considering the effect that the photosensitive resin composition of this embodiment has an excellent pattern forming property even when a thick photosensitive layer is formed, it may be 70 μm or more, and the thickness exceeds 100 μm. There may be. In addition, the photosensitive layer having a thickness of 70 μm or more is, for example, by bonding a film formed with a photosensitive layer on a carrier film and a film formed with a photosensitive layer on a protective layer to be described later, A photosensitive resin film having a thick photosensitive layer and a protective layer in this order can be obtained.

  Moreover, the photosensitive resin film of this embodiment can also laminate | stack a protective layer on the surface on the opposite side to the surface which contact | connects the carrier film of a photosensitive layer. As the protective layer, for example, a resin film such as polyethylene or polypropylene may be used. Moreover, the same resin film as the carrier film mentioned above may be used, and a different resin film may be used.

[Method for producing cured product]
The method for producing a cured product according to the present embodiment includes a step of providing a photosensitive layer using a photosensitive resin composition or a photosensitive resin film of the present embodiment on a substrate (photosensitive layer forming step), and at least one of the photosensitive layers. A step of irradiating the part with actinic rays to form a photocured portion (exposure step), and a step of removing at least a portion other than the photocured portion of the photosensitive layer to form a resin pattern (removal step) Have in order. Moreover, it has the process (heating process) which heat-processes the said resin pattern further as needed. The method for producing a cured product according to this embodiment makes it possible to form a desired pattern. For example, even if a thick photosensitive layer of 70 μm or more is formed, the photosensitive material according to this embodiment has excellent pattern formability. For example, a desired pattern can be formed by a thick cured product having a thickness of 70 μm or more. In this specification, the term “process” is not limited to an independent process, and even if it cannot be clearly distinguished from other processes, if the intended action of the process is achieved, the “process” include.

(Photosensitive layer forming process)
In the formation of the photosensitive layer, the photosensitive layer can be formed by applying or laminating the photosensitive resin composition or photosensitive resin film of the present embodiment on a substrate.
Examples of the substrate include glass substrates, silicon wafers, metal oxide insulators such as TiO ₂ and SiO ₂ , silicon nitride, ceramic piezoelectric substrates, and epoxy resin impregnated glass cloth substrates.

When a photosensitive resin composition is applied to a substrate to form a photosensitive layer, the photosensitive resin composition dissolved in the above diluent and in the form of a solution may be applied to the substrate, and applied as necessary. The resulting coating film may be dried. Application | coating and drying may be performed with the various application | coating methods described about preparation of said photosensitive resin film, and the drying method of a coating film.
In the case of using a photosensitive resin film, the photosensitive layer can be formed by a laminating method using a laminator or the like.

The thickness of the photosensitive layer provided on the substrate varies depending on the forming method (coating method or lamination method), the solid content concentration and viscosity of the photosensitive resin composition, etc., but as the lower limit of the thickness of the photosensitive layer after drying, What is necessary is just to select suitably from 10 micrometers or more, 30 micrometers or more, 50 micrometers or more, 70 micrometers or more, 100 micrometers or more, more than 100 micrometers, or 150 micrometers or more. The upper limit is not particularly limited as long as the resin pattern can be formed, but may be appropriately selected from, for example, 500 μm or less, 300 μm or less, or 250 μm or less. The thickness of the photosensitive layer may be appropriately selected from the above range depending on the application, and when used for an electronic component or the like, the lower limit may be appropriately selected from 70 μm or more, more than 100 μm, or 150 μm or more, and the upper limit may be 500 μm. Hereinafter, it may be appropriately selected from 300 μm or less or 250 μm or less.
In the method for producing a cured product of the present embodiment, a photosensitive layer is formed using the photosensitive resin composition of the present embodiment, so that a thick photosensitive layer can be formed. For example, when a photosensitive layer having a thickness of 150 μm or more is formed, it is not formed by a single application (and drying if necessary) or by lamination, but is applied a plurality of times (and as necessary) until a desired thickness is obtained. Drying) or lamination may be repeated.

(Exposure process)
In the exposure step, at least part of the photosensitive layer provided on the substrate in the photosensitive layer forming step is irradiated with actinic rays as necessary, and the exposed portion is photocured to form a cured portion. When irradiating with actinic rays, the photosensitive layer may be irradiated with actinic rays through a mask having a desired pattern. Moreover, such as LDI (Laser Direct Imaging) exposure method, DLP (Digital Light Processing) exposure method, etc. Actinic rays may be irradiated by a direct drawing exposure method.
Moreover, you may perform post-exposure heating (PEB: Post exposure bake) after exposure using a hotplate, a dryer, etc. from a viewpoint of improving pattern formation property. The drying conditions are not particularly limited, but may be performed at a temperature of 60 to 120 ° C. or 70 to 110 ° C. for a time of 15 seconds to 5 minutes or 30 seconds to 3 minutes.

Exposure amount of active ray ^{is, 10~2,000mJ / cm 2, 100~1,500mJ /} cm 2, or, may be suitably selected from 300~1,000mJ / cm ^2. Examples of actinic rays used include ultraviolet rays, visible rays, electron beams, and X-rays. As the light source, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a halogen lamp, or the like can be used.

(Removal process)
In the removal step, at least a part of the portion (unexposed portion) other than the cured portion of the photosensitive layer formed in the exposure step is removed to form a resin pattern. The removal of the unexposed portion may be performed using a developer such as an organic solvent.
Examples of the organic solvent include ethanol, cyclohexanone, cyclopentanone, propylene glycol methyl ether acetate, N-methylpyrrolidone and the like. Among these, cyclopentanone can be used from the viewpoint of development speed. These can be used alone or in combination of two or more.
Further, various commonly used additives may be added to the organic solvent used as the developer.

  After removing the unexposed areas with a developer, if necessary, wash with water, alcohol such as methanol, ethanol, isopropyl alcohol, n-butyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol dimethyl ether acetate, etc. (rinse) May be.

(Heating process)
A heating process is a process employ | adopted as needed, and is a process of heat-processing the resin pattern formed at the removal process, and forming hardened | cured material. The heat treatment is preferably performed for 1 to 2 hours while selecting the heating temperature and gradually increasing the temperature. What is necessary is just to select heating temperature suitably from 120-240 degreeC, 140-230 degreeC, or 150-220 degreeC. In addition, when the temperature is raised stepwise, for example, at least one of around 120 ° C. and around 160 ° C., after heat treatment for 10 to 50 minutes or 20 to 40 minutes, at around 220 ° C., 30 to 100 Heat treatment may be performed for a minute or for 50 to 70 minutes.

  The thickness of the obtained resin pattern is the same as the thickness of the photosensitive layer after drying, and the lower limit is suitably 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more. What is necessary is just to select, and what is necessary is just to select suitably from 500 micrometers or less, 300 micrometers or less, or 250 micrometers or less as an upper limit. The thickness of the resin pattern may be appropriately selected from the above range depending on the application, and when used for an electronic component or the like, the lower limit may be appropriately selected from 70 μm or more, more than 100 μm, or 150 μm or more, and the upper limit may be 500 μm. Hereinafter, it may be appropriately selected from 300 μm or less and 250 μm or less.

[Laminate]
The laminate of the present embodiment is provided with a cured product of the photosensitive resin composition of the present embodiment. For example, various types of substrates, such as a substrate used in the method for producing the cured product and a carrier film of the photosensitive resin film, are used. The thing provided with this hardened | cured material on a support body is mentioned. The cured product of the photosensitive resin composition of the present embodiment can be formed by, for example, the above-described method for producing a cured product of the present embodiment.

  The thickness of the cured product in the laminate of the present embodiment may be appropriately selected from 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more as the lower limit, and the upper limit is 500 μm or less, 300 μm. What is necessary is just to select suitably below or 250 micrometers or less. The thickness of the cured product may be appropriately selected from the above range depending on the application, and when used for an electronic component or the like, the lower limit may be appropriately selected from 70 μm or more, more than 100 μm, or 150 μm or more, and the upper limit may be 500 μm. Hereinafter, it may be appropriately selected from 300 μm or less and 250 μm or less.

The cured product provided on the substrate obtained by the above-described method for producing a cured product uses the photosensitive resin composition of the present embodiment. For example, even with a thick photosensitive layer of 70 μm or more, excellent pattern formability can be obtained. Therefore, for example, with the trend toward downsizing and higher performance of electronic devices, it is possible to meet the demand for electronic circuit boards that require a thick cured product to be provided in a finer pattern on the board. . In addition, for example, in a plating process in the manufacture of an electronic circuit board, a decrease in yield due to a short circuit between wirings can be suppressed by using a cured product formed from the photosensitive resin composition of the present embodiment as an insulating film. it can.
Therefore, the laminated body of this embodiment is used as an electronic component such as an electronic circuit board in a mobile terminal such as a mobile phone.

  Hereinafter, although the objective and advantage of this embodiment will be described more specifically based on examples and comparative examples, this embodiment is not limited to the following examples. In addition, the measuring method of the weight average molecular weight of each component and the measuring method of the glass transition temperature of a high Tg high molecular weight body (B) are as follows.

(Measurement of weight average molecular weight)
The weight average molecular weight is a value determined by standard polystyrene conversion by the GPC method using the following apparatus, and was measured using a solution in which 0.5 mg of polymer was dissolved in 1 mL of tetrahydrofuran (THF).
Device name: HLC-8320GPC manufactured by Tosoh Corporation
Column: Gelpack R-420, R-430, and R-440 (three-piece connection)
Detector: RI detector Column temperature: 40 ° C
Eluent: THF
Flow rate: 1 ml / min Standard material: Polystyrene

(Measurement of glass transition temperature of high Tg high molecular weight substance (B))
As a pretreatment for the measurement, the high Tg high molecular weight body (B) was heated at 120 ° C. for 3 hours and then cooled to prepare a sample.
Using 10 mg of the sample, the temperature was raised at a temperature range of 25 to 200 ° C. and a heating rate of 20 ° C./min under a nitrogen stream with a differential scanning calorimeter (trade name: DSC-50, manufactured by Shimadzu Corporation). Then, the temperature was cooled to 25 ° C., and the temperature was raised again under the same conditions, and the temperature at which the baseline deviation started was defined as the glass transition temperature.

(Examples 1-6, Comparative Examples 1-4)
A composition was blended according to the blending composition shown in Table 1, and kneaded with a three-roll mill to prepare a photosensitive resin composition. N, N-dimethylacetamide was added so that the solid content concentration was 60% by mass to obtain a photosensitive resin composition.

  Next, each evaluation was performed by the method shown below using the photosensitive resin composition obtained above. The evaluation results are shown in Table 1.

[Preparation of photosensitive resin film]
A polyethylene terephthalate film (trade name: A-4100, manufactured by Teijin Ltd.) having a thickness of 50 μm is used as a carrier film, and the resin compositions of Examples and Comparative Examples are dried on the carrier film so that the thickness after drying becomes 50 μm. Was applied uniformly. Subsequently, the photosensitive layer was formed by heating and drying at 100 degreeC for 15 minute (s) using a hot air convection dryer, and the photosensitive resin film which has a carrier film and a photosensitive layer was produced.

[Evaluation of pattern formability]
Orientation where the photosensitive layer of the photosensitive resin film is positioned on the glass epoxy substrate side on a glass epoxy substrate (obtained by etching copper of MCL-E-679F (trade name, manufactured by Hitachi Chemical Co., Ltd.)) And the carrier film was removed. Lamination was performed at 60 ° C. using a laminator. Next, the photosensitive resin film is again laminated on the photosensitive layer by the above-described method, the carrier film is removed, and this is repeated three times to form a photosensitive layer having a thickness of 200 μm and the carrier film on the glass epoxy substrate. The laminated body provided was obtained.
On the carrier film of the laminate, a mask for resolution evaluation (line width: 5 μm, 8 μm, 10 μm, 15 μm, 20 μm, 25 μm, all line spaces are 200 μm) having the pattern shape shown in FIG. Further, an i-line filter (manufactured by Asahi Spectroscopy Co., Ltd .: HB-0365) was placed thereon and exposed using a high precision parallel exposure machine (manufactured by Mikasa Co., Ltd.). In this case, by dividing the laminate into four regions, with the amount of different exposure the four regions ^{(300mJ / cm 2, 600mJ /} cm 2, 1,000mJ / cm 2, 1,400mJ / cm 2), the wavelength 365 nm ( Exposure with i-line) light. The sample after exposure was heated after exposure for 1 minute on a hot plate at 90 ° C.
Thereafter, the carrier film was removed, and development was performed by immersing in a developer (cyclopentanone) for 20 minutes. The developed pattern was dried at room temperature for 30 minutes and observed with a metal microscope to evaluate the pattern formability. Evaluation was performed according to the following criteria. Here, “formable” means that the unexposed part is removed cleanly and the line part (exposed part) does not have a defect such as a fall. The evaluation results are shown in Table 1.
A: It was possible to form with a line width of 5 to 10 μm.
B: Although it could not be formed with a line width of 5 to 10 μm, it could be formed with a line width of 15 to 20 μm.
C: Could not be formed with a line width of 20 μm or less, or the photosensitive layer was peeled off after development.

[Evaluation of tackiness]
When producing the photosensitive resin film, a finger tack test was performed on the film after application of the photosensitive resin composition. The case where stickiness was not felt was evaluated as A, and the case where stickiness was felt was evaluated as C. The results are shown in Table 1.

[Measurement of absorbance]
For the photosensitive resin film obtained in [Preparation of photosensitive resin film], the absorbance of the photosensitive layer with respect to light having a wavelength of 365 nm was measured at a thickness of the photosensitive layer (thickness after drying) of 50 μm. Specifically, the absorbance (Abs) at a wavelength of 365 nm was measured using an ultraviolet-visible spectrophotometer (product name: “U-3310 Spectrophotometer”, manufactured by Hitachi High-Technologies Corporation). For reference, a polyethylene terephthalate (PET) film alone was used. The measurement results are shown in Table 1.

[Evaluation of insulation reliability]
The insulation reliability was evaluated by a high temperature and high humidity bias test. On the comb-shaped copper electrode of the evaluation device TEG (Test Element Group) (trade name: WALTS-KIT EM0101JY, manufactured by WALTS, L / S = 40 μm / 15 μm), the thickness of 50 μm obtained in Examples 1 to 6 The photosensitive resin film was attached at 60 ° C. using a laminator with the photosensitive layer facing the comb copper electrode side. Next, after exposure at an exposure amount of 1,000 mJ / cm ² with i-line, heating was performed on a hot plate at 90 ° C. for 1 minute. Thereafter, the sample was further heated in an oven at 200 ° C. for 1 hour, and then cooled to room temperature to obtain a measurement sample.
A lead wire was attached to the electrode portion of the TEG of the obtained measurement sample with solder, and a high temperature and high humidity bias test was performed [voltage: 5 V (direct current), test time: 100 hours, 85 ° C., 85% RH (high temperature high Wet machine (manufactured by ESPEC) is used)].
As a result, each of the measurement samples obtained using the photosensitive resin films of Examples 1 to 6 has a resistance value of 1.0 × 10 ⁷ Ω or more at a test time of 100 hours, and is sufficiently insulated. It was confirmed that it was excellent in reliability.

Details of each material in Table 1 are as follows.
[(A) component]
UN-952: Urethane acrylate (manufactured by Negami Kogyo Co., Ltd., trade name, number of functional groups: 10, weight average molecular weight: 9,000, a reaction product of an acrylate having a hydroxyl group and a diisocyanate compound, and an acryloyl group in the molecule (It has a photopolymerizable functional group), a urethane bond (carbon-nitrogen bond), a chain hydrocarbon skeleton, and an alicyclic hydrocarbon skeleton.)

[Component (B)]
Z250: Cyclomer P (ACA) Z250 (manufactured by Daicel Ornex Co., Ltd., three structural units represented by the following formulas produced by the reaction of an acid group-containing acrylic resin and an alicyclic epoxy group-containing unsaturated compound) Resin (weight average molecular weight: 19,000 to 25,000)).

(In the formula, R ⁴ represents a hydrogen atom or a methyl group. R ⁶ represents an alkyl group having 1 to 6 carbon atoms or a hydroxyalkyl group having 1 to 6 carbon atoms.)

[Component (C)]
TMCH-5R: urethane acrylate (manufactured by Hitachi Chemical Co., Ltd., trade name, number of functional groups: 2, weight average molecular weight: 950, acryloyl group (photopolymerizable functional group) in the molecule, urethane bond (carbon-nitrogen bond), (It is a compound having a chain hydrocarbon skeleton and an alicyclic hydrocarbon skeleton, and corresponds to the component (C2).)
A-9300: Isocyanuric acid ethylene oxide-modified triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 423, a compound represented by the formula (7-1) and corresponding to the component (C1))
A-DCP: Tricyclodecane dimethanol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)

[(D) component]
I-819: “IRGACURE-819” (trade name, manufactured by BASF) which is bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide
TPO: “IRGACURE-TPO” (trade name, manufactured by BASF) which is 2,4,6-trimethylbenzoyldiphenylphosphine oxide
I-184: “IRGACURE-184” (trade name, manufactured by BASF) which is 1-hydroxy-cyclohexyl-phenyl-ketone
OXE-01: “IRGACURE-OXE-01” (trade name, manufactured by BASF) which is 1,2-octanedione-1- [4- (phenylthio) phenyl] -2- (O-benzoyloxime)

[(E) component]
KBM-803: 3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.)

From Table 1, it was confirmed that the photosensitive resin compositions of the present embodiments of Examples 1 to 5 have small tackiness and excellent pattern formability. In particular, Examples 2 to 5 resulted in very excellent pattern forming properties.
On the other hand, it turned out that Comparative Examples 1-3 which does not contain (B) component have a large tackiness, and it is difficult to raise productivity. In particular, in Comparative Example 1, the pattern formability was poor at any exposure amount. Moreover, when the resin composition of Comparative Example 4 containing no component (A) was used, the pattern formability was poor at any exposure dose.

Claims (17)

  (A) component: a high molecular weight body having a photopolymerizable functional group and a carbon-nitrogen bond; and (B) component: a high molecular weight body having a glass transition temperature of 70 to 150 ° C. and having no carbon-nitrogen bond. (C) component: The low molecular weight body which has a photopolymerizable functional group, (D) component: The photosensitive resin composition containing: a photoinitiator.   The photosensitive resin composition of Claim 1 in which the said (A) component contains the high molecular weight body which has a (meth) acryloyl group as a photopolymerizable functional group.   The photosensitive resin composition of Claim 1 or 2 in which the said (A) component contains the high molecular weight body which has a urethane bond as a carbon-nitrogen bond.   The component (A) includes a high molecular weight polymer having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton. The photosensitive resin composition according to item.   The photosensitive resin composition of any one of Claims 1-4 in which the said (B) component contains the high molecular weight body which has an ethylenically unsaturated group.   The photosensitivity of any one of Claims 1-5 in which the said (B) component contains the high molecular weight body which has at least 1 sort (s) of skeleton chosen from the group which consists of an alicyclic skeleton and an aromatic ring skeleton. Resin composition.   The component (C) is composed of the component (C1): a low molecular weight product having an isocyanuric ring, the component (C2): a low molecular weight product having a urethane bond, and the component (C3): a low molecular weight product having an alicyclic skeleton. The photosensitive resin composition of any one of Claims 1-6 containing the at least 1 sort (s) chosen from a group. The photosensitive resin composition according to claim 1, wherein the component (D) includes a compound represented by the following general formula (D1) or a compound represented by the following general formula (D2). object.

(R ^D1 , R ^D2 and R ^D3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and R ^D4 and R ^D5 each independently represent A hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, each of R ^{D1 to} R ^D5 other than a hydrogen atom has a substituent. May be.)

(R ^D6 represents a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an amino group, and R ^D7 and R ^D8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or 6 to 12 carbon atoms. R ^D7 and R ^D8 may be bonded to each other to form a cyclic structure having 3 to 16 carbon atoms other than hydroxyl groups and hydrogen atoms. R ^{D6 to} R ^D8 may each have a substituent, and the amino group having a substituent may be bonded to each other to form a cyclic structure having 3 to 12 carbon atoms. .
R ^D9 is independently a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or an organic group having 1 to 10 carbon atoms that may contain one or more selected from an oxygen atom, a nitrogen atom, and a sulfur atom. Indicates a group. )   The photosensitive resin composition of any one of Claims 1-8 which further contains (E) component: a silane compound.   The photosensitive resin composition of Claim 9 in which the said (E) component contains the silane compound which has a thiol group.   The photosensitive resin film which has a photosensitive layer using the photosensitive resin composition of any one of Claims 1-10.   The process of providing a photosensitive layer using the photosensitive resin composition of any one of Claims 1-10, or the photosensitive resin film of Claim 11 on a board | substrate, At least one part of this photosensitive layer A method for producing a cured product, comprising sequentially irradiating actinic rays to form a photocured portion, and removing at least a portion other than the photocured portion of the photosensitive layer to form a resin pattern.   Furthermore, the manufacturing method of the hardened | cured material of Claim 12 which has the process of heat-processing the said resin pattern.   The manufacturing method of the hardened | cured material of Claim 12 or 13 whose thickness of the said resin pattern is 70 micrometers or more and 300 micrometers or less.   A laminate comprising a cured product of the photosensitive resin composition according to any one of claims 1 to 10.   The laminate according to claim 15, wherein the cured product has a thickness of 70 μm or more and 300 μm or less.   An electronic component provided with the hardened | cured material of the photosensitive resin composition of any one of Claims 1-10.