KR101655437B1 - N2 purge nozzle for leak prevention - Google Patents

N2 purge nozzle for leak prevention Download PDF

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Publication number
KR101655437B1
KR101655437B1 KR1020150076367A KR20150076367A KR101655437B1 KR 101655437 B1 KR101655437 B1 KR 101655437B1 KR 1020150076367 A KR1020150076367 A KR 1020150076367A KR 20150076367 A KR20150076367 A KR 20150076367A KR 101655437 B1 KR101655437 B1 KR 101655437B1
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KR
South Korea
Prior art keywords
nozzle
foup
front opening
purge
opening unified
Prior art date
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KR1020150076367A
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Korean (ko)
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KR20160080053A (en
Inventor
강재호
박대정
권기대
Original Assignee
주식회사 싸이맥스
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Publication of KR20160080053A publication Critical patent/KR20160080053A/en
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Publication of KR101655437B1 publication Critical patent/KR101655437B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Abstract

The present invention relates to an N2 purge nozzle of an LPM (Load Port Module) for supplying N2 to a FOUP (Front Opening Unified Pod) of a semiconductor wafer processing apparatus, comprising: a nozzle pad coupled to an upper end of the nozzle; And a rubber pad coupled to the upper side of the nozzle pad and having a diaphragm penetrating the upper and lower sides to prevent leaking while expanding the diaphragm by N2 purge pressure, And a protrusion for supporting the N2 purge nozzle is protruded downward. According to the present invention, when the front opening unified pod (FOUP) is placed on the LPM (Load Port Module), the spring of the nozzle is contracted and the front opening unified pod (FOUP) N2 is supplied to various kinds of FOUP (Front Opening Unified Pod) with no nozzle change, and N2 is supplied without leakage. N2 purge diaphragm is deformed to conform to N2 inlet of FOUP (Front Opening Unified Pod) It is possible to provide an N2 purge nozzle having a leak preventive function that can be maintained.

Description

N2 PURGE NOZZLE FOR LEAK PREVENTION [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an N2 purge nozzle for supplying N2 into a front opening unified foam (FOUP) in a LPM (Load Port Module) of a wafer processing apparatus for semiconductor processing, FOUP (Front Opening Unified Pod) is placed in the LPM (Load Port Module) with the nozzle pressed without level change, and it can be mounted on the LPM (Load Port Module) N2 fuzzy nozzle with leakage prevention function that supplies N2 without leak to opening unified pod and shape can be deformed to conform to N2 inlet of FOUP (FOUP) through diaphragm during purge of N2 .

The present invention relates to an N2 purge nozzle for supplying N2 into a FOUP (Front Opening Unified Pod) in a LPM (Load Port Module) of a wafer processing apparatus for semiconductor processing.

As a background of the present invention, as disclosed in Korean Patent Laid-Open Publication No. 10-2013-0138660, a door of a front opening unified pod (FOUP) is opened at a door portion of a load port, (For example, nitrogen or inert gas) by a purge nozzle provided on the side of the semiconductor manufacturing apparatus with respect to the opening in a state in which the internal space of the semiconductor manufacturing apparatus is communicated with the internal space of the semiconductor manufacturing apparatus, A load port having a purging device for blowing in a pod is disclosed.

Existing N2 fuzzy nozzles can be replaced with different types of N2 fuzzy nozzles depending on the type and shape of the FOUP (Front Opening Unified Pod) when the Front Opening Unified Pod (FOUP) lands on the LPM (Load Port Module) There was a problem.

When the FOUP (Front Opening Unified Pod) is mounted on the LPM (Load Port Module), the FOUP moves downward and comes into contact with the LPM.

At this time, if the FOUP (Front Opening Unified Pod) moves less or moves further than the position corresponding to the LPM (Load Port Module), leakage and breakage occur.

It is an object of the present invention, which is devised to solve the problems described above, to provide an N2 purge nozzle of a LPM (Load Port Module) for supplying N2 to a FOUP (Front Opening Unified Pod) of a semiconductor wafer processing apparatus, The N2 purge nozzle expands the N2 inlet hole of the FOUP (Front Opening Unified Pod) and expands the N2 inlet hole and the airtight hole To thereby prevent leakage, and to provide a N2 purge nozzle having a leak prevention function.

It is a further object of the present invention to provide a method and a device for forming a protrusion at the lower end of the diaphragm so that when the front opening unified pod (FOUP) is seated on the LPM (Load Port Module) To prevent leakage of the diaphragm by urging the diaphragm of the N2 purge nozzle to prevent the leakage of the diaphragm, and to provide a N2 purge nozzle having a leak prevention function capable of preventing leakage.

It is a further object of the present invention to provide a method and apparatus for forming a protrusion on an upper side of a nozzle and coupling a holder with a spring to allow upward and downward reciprocal movement by a spring, whereby a front opening unified pod (FOUP) The front opening unified pod presses the N2 purge nozzle and the nozzle is contracted by the spring to move the nozzle downward and the nozzle is broken by the pushing And to provide a N2 purge nozzle having a leak preventing function capable of preventing leakage without changing the level of the nozzle.

According to an aspect of the present invention, there is provided an N2 purge nozzle of an LPM (Load Port Module) for supplying N2 to a FOUP (Front Opening Unified Pod) of a semiconductor wafer processing apparatus, A nozzle pad coupled to the top of the nozzle; And a rubber pad coupled to the upper side of the nozzle pad and having a diaphragm penetrating the upper and lower sides to prevent leaking while expanding the diaphragm by N2 purge pressure, And a protrusion for supporting the protrusion is formed to protrude downward.

delete

A holder coupled to the LPM (Load Port Module) and having a through hole through which the nozzle is inserted, a first latching jaw formed at an upper end of the through hole, and a second latching jaw formed at a lower end thereof; A spring inserted into the holder and fixed between the first engaging jaw and the second engaging jaw; And a third latching protrusion formed on the upper side of the nozzle and having an upper end abutting against the first latching jaw and a lower end abutting against the upper end of the spring.

In addition, the holder is divided into an upper holder and a lower holder and is screwed.

Further, the upper holder includes a bushing which is inserted downward and seated in the first latching jaw.

As described above, according to the present invention, in an N2 purge nozzle of an LPM (Load Port Module) that supplies N2 to a FOUP (Front Opening Unified Pod) of a semiconductor wafer processing apparatus, a nozzle pad is coupled to an upper end of an N2 purge nozzle, When the N2 purge nozzle is pushed to the N2 inlet hole of the FOUP (Front Opening Unified Pod) by the rubber pad having the diaphragm formed at the upper end of the nozzle pad, the diaphragm expands due to the air pressure when the N2 purge nozzle is hermetically contacted with the N2 inlet hole, It is possible to provide an N2 purge nozzle having a leak prevention function that can prevent the leak.

According to the present invention, by forming the protrusion at the lower end of the diaphragm, when the FOUP (Front Opening Unified Pod) is seated on the LPM (Load Port Module), the front opening unified pod (FOUP) It is possible to provide an N2 purge nozzle having a leak prevention function that prevents the diaphragm from being struck by pressing the diaphragm of the N2 purge nozzle to prevent leakage.

According to the present invention, the protrusion is formed on the upper side of the nozzle, and the holder with the spring is coupled to allow the reciprocating movement by the spring so that the FOUP (Front Opening Unified Pod) The front opening unified pod presses the N2 purge nozzle and the nozzle is contracted by the spring to move the nozzle downward, thereby preventing the nozzle from being damaged by the pushing It is possible to provide an N2 purge nozzle having a leak prevention function capable of preventing leakage without changing the level of the nozzle.

1 is a view showing a semiconductor wafer processing apparatus according to a preferred embodiment of the present invention.
2 is a plan view showing a LPM (Load Port Module) according to a preferred embodiment of the present invention.
3 is a perspective view showing an N2 purge nozzle having a leak preventing function according to a preferred embodiment of the present invention.
4 is a cross-sectional view illustrating an N2 purge nozzle having a leak prevention function according to a preferred embodiment of the present invention.
5 is a rear perspective view of a rubber pad according to a preferred embodiment of the present invention.
6 is a cross-sectional view of a rubber pad according to a preferred embodiment of the present invention.
7 is a view showing a state of use of a rubber pad according to a preferred embodiment of the present invention.
8 is a view showing a state of use of a rubber pad according to a preferred embodiment of the present invention.
FIG. 9 is a view illustrating a force applied to the N2 purge nozzle having a leak prevention function from above, according to a preferred embodiment of the present invention. FIG.
10 is a view illustrating a state in which a nozzle pad is moved by a spring according to a preferred embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings.

The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the drawings for explaining an N2 purge nozzle having a leak prevention function according to embodiments of the present invention.

FIG. 1 is a diagram illustrating a front opening unified voice (FOUP) 1 and a load port module (LPM) 2 according to a preferred embodiment of the present invention. Port Module 2 shown in FIG.

3 to 4 are a perspective view and a cross-sectional view illustrating an N2 purge nozzle 100 having a leak preventing function according to a preferred embodiment of the present invention.

The N2 purge nozzle 100 having a leak prevention function according to the preferred embodiment of the present invention is provided with an LPM (Load Port Module) 2 for supplying N2 to a FOUP (Front Opening Unified Pod) In the N2 purge nozzle 100, a nozzle pad 110 and a rubber pad 120 are included.

The nozzle pad 110 is coupled to the upper end of the nozzle.

The nozzle fitting 170 is coupled to the lower end of the nozzle, and the nozzle fitting 170 is coupled to the N2 supply device.

The rubber pad 120 is coupled to the upper side of the nozzle pad 110 and a diaphragm 122 passing through the upper and lower sides is formed so that the diaphragm 122 is inflated by the N2 purge pressure to prevent leakage.

When the front opening unified pod (FOUP) 1 is mounted on the LPM (Load Port Module) 2, the front pad 11 is moved to the lower side of the rubber pad 120 and the FOUP N2 inlet port (4) of the Unified Pod (1) and N2 purge nozzle (100) are in contact with each other.

However, when the N2 inlet hole 4 of the front opening unified pod 1 is moved less than the distance that the N2 inlet nozzle 4 seals with the N2 purge nozzle 100, a space is formed between the N2 inlet hole 4 and the nozzle, The diaphragm 122 of the rubber pad 120 prevents leakage.

The diaphragm 122 is expanded by the air pressure generated when N2 is supplied from the N2 purge nozzle 100 to the N2 inlet hole 4 of the front opening unified pod 1, To prevent leakage.

5 to 6 are a rear perspective view and a cross-sectional view of a rubber pad 120 according to a preferred embodiment of the present invention.

The rubber pad 120 is formed with a protrusion 124 protruding downward to support the diaphragm 122 striking.

When the FOUP (Front Opening Unified Pod) 1 is mounted on a LPM (Load Port Module) 2, the rubber pad 120 is connected to a front opening unified Pod (FOUP) 1 via a LPM The diaphragm 122 of the rubber pad 120 is collapsed by the front opening unified pod (FOUP) 1 and is broken or leaked.

At this time, the protrusion 124 supports the diaphragm 122 to be struck.

7 to 8 are views showing the state of use of the rubber pad 120 according to the preferred embodiment of the present invention.

The diaphragm 122 of the rubber pad 120 is compressed to the N2 inlet hole 4 of the FOUP 1 by expanding the diaphragm 122 by the air pressure generated when supplying N2 To prevent leakage.

FIG. 9 is a view showing a state in which a force is applied to an N2 purge nozzle 100 having a leak preventing function according to a preferred embodiment of the present invention from above.

10 is a view showing a state in which the nozzle pad 110 is moved by the spring 140 according to the preferred embodiment of the present invention.

The N2 purge nozzle 100 having a leak preventive function according to the preferred embodiment of the present invention may further include a holder 130, a spring 140, and a third latching jaw 150 to further maximize leak prevention.

The holder 130 is coupled to the inside of the LPM (Load Port Module) 2 and is coupled to the lower portion of the LPM (Load Port Module) 2 by a coupling groove 138 of the holder 130, And fastened. A through hole 132 through which the nozzle is inserted is formed. A first locking protrusion 134 is formed at an upper end of the through hole 132 and a second locking protrusion 136 is formed at a lower end.

The spring 140 is inserted into the holder 130 and fixed between the first and second stopping jaws 134 and 136.

The third locking protrusion 150 protrudes outwardly from the upper side of the nozzle so that its upper end is in contact with the first locking protrusion 134 and its lower end is in contact with the upper end of the spring 140 to be fixed.

When the front opening unified pod (FOUP) 1 is placed on the LPM (Load Port Module) 2, the FOUP (Front Opening Unified Pod) 1 is moved downward and the N2 purge nozzle 100 (Front Opening Unified Pod) 1 is moved to the N2 purge nozzle (FOUP) 1 when the FOUP (Front Opening Unified Pod) 1 is moved more than the N2 purge nozzle 100, 100 to cause leakage or damage to the N2 purge nozzle 100. [

At this time, the N2 purge nozzle 100 is driven by the elastic force of the spring 140 by the FOUP (Front Opening Unified Pod) 1 so that the rubber pad 120 and the nozzle pad 110, Is kept moving to the lower side to maintain a constant compression to prevent leakage and breakage.

The holder 130 is divided into an upper holder 130a and a lower holder 130b so that the upper holder 130a and the lower holder 130b may be screwed together.

In addition, the bushing 160 inserted into the lower holder 130a and seated on the first latching jaw 134 is engaged to maximize the prevention of leakage.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and range of the claims and the equivalents thereof are included in the scope of the present invention Should be interpreted.

1: Front Opening Unified Pod (FOUP)
2: LPM (Load Port Module) 3: Exhaust nozzle device
4: N2 inlet hole 10: Nozzle
100: N2 purge nozzle 110: nozzle pad
120: rubber pad 122: diaphragm
124: projection 130: holder
130a: upper holder 130b: lower holder
132: through hole 134: first stopping jaw
136: second engaging jaw 138: engaging groove
140: spring 150: third hook jaw
160: Bushing 170: Nozzle fitting

Claims (5)

1. An N2 purge nozzle of an LPM (Load Port Module) for supplying N2 to a front opening unified pod (FOUP) of a semiconductor wafer processing apparatus,
A nozzle pad coupled to an upper end of the nozzle;
And a diaphragm coupled to the upper side of the nozzle pad and having upper and lower sides penetrated to prevent leaking while expanding the diaphragm by N2 purge pressure,
Wherein the rubber pad has protrusions protruding downward to support the diaphragm striking the N2 purge nozzle. delete The method according to claim 1,
A holder coupled to the inside of the LPM (Load Port Module) and having a through hole through which the nozzle is inserted, a first latching jaw formed at an upper end of the through hole, and a second latching jaw formed at a lower end thereof;
A spring inserted into the holder and fixed between the first engaging jaw and the second engaging jaw;
And a third locking protrusion formed on the upper side of the nozzle and having an upper end abutting against the first locking protrusion and a lower end abutting against the upper end of the spring. The connector according to claim 3,
And the upper holder and the lower holder are separated and threadedly coupled to each other. [5] The apparatus of claim 4,
And a bushing inserted into a lower portion of the bushing to be seated in the first engaging jaw.
KR1020150076367A 2014-12-29 2015-05-29 N2 purge nozzle for leak prevention KR101655437B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20140191767 2014-12-29
KR1020140191767 2014-12-29

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KR20160080053A KR20160080053A (en) 2016-07-07
KR101655437B1 true KR101655437B1 (en) 2016-09-08

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180067427A (en) 2016-12-12 2018-06-20 주식회사 기가레인 Nozzle assembly for load port
KR20200027229A (en) 2018-09-04 2020-03-12 주식회사 저스템 Nozzle pad for supplying gas and apparatus for supplying gas for wafer container comprising the same
KR102172808B1 (en) 2020-09-09 2020-11-02 주식회사 보부하이테크 Nozzle Pad for Gas Port of Load Port
KR20220122259A (en) 2021-02-26 2022-09-02 제노스 주식회사 N2 purge system having vacuum suction pad

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019100448A1 (en) * 2019-01-10 2020-07-16 Fabmatics Gmbh Interface device for a rinsing unit for rinsing a wafer container

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277687A (en) * 2008-05-12 2009-11-26 Shin Etsu Polymer Co Ltd Valve mechanism and substrate storage container
JP2011187539A (en) * 2010-03-05 2011-09-22 Sinfonia Technology Co Ltd Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277687A (en) * 2008-05-12 2009-11-26 Shin Etsu Polymer Co Ltd Valve mechanism and substrate storage container
JP2011187539A (en) * 2010-03-05 2011-09-22 Sinfonia Technology Co Ltd Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180067427A (en) 2016-12-12 2018-06-20 주식회사 기가레인 Nozzle assembly for load port
KR20200027229A (en) 2018-09-04 2020-03-12 주식회사 저스템 Nozzle pad for supplying gas and apparatus for supplying gas for wafer container comprising the same
KR102172808B1 (en) 2020-09-09 2020-11-02 주식회사 보부하이테크 Nozzle Pad for Gas Port of Load Port
KR20220122259A (en) 2021-02-26 2022-09-02 제노스 주식회사 N2 purge system having vacuum suction pad

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