KR101652120B1 - 광 반도체 소자용 다이본드제 조성물 및 상기 조성물을 이용하여 이루어지는 광 반도체 장치 - Google Patents

광 반도체 소자용 다이본드제 조성물 및 상기 조성물을 이용하여 이루어지는 광 반도체 장치 Download PDF

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KR101652120B1
KR101652120B1 KR1020100103247A KR20100103247A KR101652120B1 KR 101652120 B1 KR101652120 B1 KR 101652120B1 KR 1020100103247 A KR1020100103247 A KR 1020100103247A KR 20100103247 A KR20100103247 A KR 20100103247A KR 101652120 B1 KR101652120 B1 KR 101652120B1
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formula
mass
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KR1020100103247A
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KR20110044708A (ko
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미유끼 와까오
요시히라 하마모또
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신에쓰 가가꾸 고교 가부시끼가이샤
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020100103247A 2009-10-23 2010-10-22 광 반도체 소자용 다이본드제 조성물 및 상기 조성물을 이용하여 이루어지는 광 반도체 장치 KR101652120B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009244803 2009-10-23
JPJP-P-2009-244803 2009-10-23
JPJP-P-2010-141750 2010-06-22
JP2010141750A JP5278384B2 (ja) 2009-10-23 2010-06-22 光半導体素子用ダイボンド剤組成物及び該組成物を用いてなる光半導体装置

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KR20110044708A KR20110044708A (ko) 2011-04-29
KR101652120B1 true KR101652120B1 (ko) 2016-08-29

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JP2018188563A (ja) * 2017-05-09 2018-11-29 株式会社ダイセル 絶縁膜形成用組成物、絶縁膜、及び絶縁膜を備えた半導体デバイス
KR102560345B1 (ko) * 2017-05-17 2023-07-28 주식회사 다이셀 접착제용 경화성 조성물, 접착 시트, 경화물, 적층물 및 장치
JP7172805B2 (ja) * 2019-04-02 2022-11-16 信越化学工業株式会社 付加硬化型シリコーン接着剤組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005343998A (ja) * 2004-06-02 2005-12-15 Asahi Kasei Corp 発光素子封止用樹脂組成物

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Publication number Priority date Publication date Assignee Title
DE4328466C1 (de) 1993-08-24 1995-04-13 Siemens Ag Siloxanhaltiges Gießharzsystem
JP2006282988A (ja) 2005-03-08 2006-10-19 Sanyo Chem Ind Ltd 光半導体素子封止用エポキシ樹脂組成物
CN100410320C (zh) * 2005-12-09 2008-08-13 中国科学院化学研究所 耐紫外和高温老化的有机硅环氧树脂组合物
JP2008045088A (ja) 2006-08-21 2008-02-28 Sekisui Chem Co Ltd 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005343998A (ja) * 2004-06-02 2005-12-15 Asahi Kasei Corp 発光素子封止用樹脂組成物

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CN102040939B (zh) 2014-05-07
KR20110044708A (ko) 2011-04-29
CN102040939A (zh) 2011-05-04

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