KR101650195B1 - 화학 기계 연마 패드 제조 조립체 - Google Patents

화학 기계 연마 패드 제조 조립체 Download PDF

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Publication number
KR101650195B1
KR101650195B1 KR1020090065203A KR20090065203A KR101650195B1 KR 101650195 B1 KR101650195 B1 KR 101650195B1 KR 1020090065203 A KR1020090065203 A KR 1020090065203A KR 20090065203 A KR20090065203 A KR 20090065203A KR 101650195 B1 KR101650195 B1 KR 101650195B1
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KR
South Korea
Prior art keywords
backing plate
layer
wraparound
chemical mechanical
mechanical polishing
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KR1020090065203A
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English (en)
Korean (ko)
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KR20100009505A (ko
Inventor
미쉘 옌센
존 지포드 노우랜드
브렌다 하딩
캐롤 코더
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20100009505A publication Critical patent/KR20100009505A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020090065203A 2008-07-18 2009-07-17 화학 기계 연마 패드 제조 조립체 Active KR101650195B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/175,965 US7645186B1 (en) 2008-07-18 2008-07-18 Chemical mechanical polishing pad manufacturing assembly
US12/175,965 2008-07-18

Publications (2)

Publication Number Publication Date
KR20100009505A KR20100009505A (ko) 2010-01-27
KR101650195B1 true KR101650195B1 (ko) 2016-08-22

Family

ID=41259313

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090065203A Active KR101650195B1 (ko) 2008-07-18 2009-07-17 화학 기계 연마 패드 제조 조립체

Country Status (6)

Country Link
US (2) US7645186B1 (https=)
EP (1) EP2145731B1 (https=)
JP (1) JP5457093B2 (https=)
KR (1) KR101650195B1 (https=)
CN (1) CN101628395B (https=)
TW (1) TWI460051B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150118944A1 (en) * 2013-01-31 2015-04-30 Ebara Corporation Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad
CA2938974C (en) 2014-02-07 2023-08-22 Gojo Industries, Inc. Compositions and methods with efficacy against spores and other organisms
US20160144477A1 (en) 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US20230398659A1 (en) * 2022-06-09 2023-12-14 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing Pad for Chemical Mechanical Polishing and Method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007512971A (ja) 2003-12-03 2007-05-24 アプライド　マテリアルズ　インコーポレイテッド 電気化学機械的処理のためのパッドアセンブリ
JP2007518277A (ja) 2004-01-09 2007-07-05 マイポックス インターナショナル コーポレーション Ｃｍｐパッドをラミネートする層状支持体及び方法
JP2007203394A (ja) 2006-01-31 2007-08-16 Nitta Haas Inc 研磨パッド

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US2644280A (en) * 1950-09-13 1953-07-07 Carborundum Co Sanding disk accessory
US4263755A (en) * 1979-10-12 1981-04-28 Jack Globus Abrasive product
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4932163A (en) * 1989-08-29 1990-06-12 Chilton Douglas L Dust control system for an abrasive grinder
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5222331A (en) * 1990-04-10 1993-06-29 Minnesota Mining And Manufacturing Company Abrading assembly
US5507906A (en) * 1990-04-13 1996-04-16 M. J. Woods, Inc. Method for making multilayer pad
TW332162B (en) * 1996-02-01 1998-05-21 Yanase Kk The rotary grinding tool composed by central & grinding component, and by screw or other fastening device to hold component with central component together.
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6224474B1 (en) * 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
US7077733B1 (en) * 2000-08-31 2006-07-18 Micron Technology, Inc. Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support
US6616519B2 (en) * 2001-09-14 2003-09-09 Saint-Gobain Abrasives Technology Company Sanding system
JP2006513573A (ja) * 2003-01-10 2006-04-20 スリーエム イノベイティブ プロパティズ カンパニー 化学的機械的平坦化用途向けのパッド構成体
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7101275B2 (en) * 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US20060135051A1 (en) * 2004-12-20 2006-06-22 Cabot Microelectronics Corporation Polishing pad with removal features
US7549914B2 (en) * 2005-09-28 2009-06-23 Diamex International Corporation Polishing system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007512971A (ja) 2003-12-03 2007-05-24 アプライド　マテリアルズ　インコーポレイテッド 電気化学機械的処理のためのパッドアセンブリ
JP2007518277A (ja) 2004-01-09 2007-07-05 マイポックス インターナショナル コーポレーション Ｃｍｐパッドをラミネートする層状支持体及び方法
JP2007203394A (ja) 2006-01-31 2007-08-16 Nitta Haas Inc 研磨パッド

Also Published As

Publication number Publication date
CN101628395B (zh) 2012-01-11
JP5457093B2 (ja) 2014-04-02
JP2010028112A (ja) 2010-02-04
US7794562B2 (en) 2010-09-14
CN101628395A (zh) 2010-01-20
US20100051198A1 (en) 2010-03-04
TWI460051B (zh) 2014-11-11
TW201006608A (en) 2010-02-16
US20100015902A1 (en) 2010-01-21
EP2145731B1 (en) 2012-02-29
EP2145731A1 (en) 2010-01-20
KR20100009505A (ko) 2010-01-27
US7645186B1 (en) 2010-01-12

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