KR101648869B1 - Touch Sensor for Touch Screen Panel, Manufacturing Method of Cover for Touch Screen Panel and Touch Screen Panel comprising the Cover Film - Google Patents

Abstract

The present invention relates to a touch sensor for a touch screen panel, a method of manufacturing the touch sensor panel, and a touch screen panel including the touch sensor panel. The touch sensor panel is formed by printing a seed layer formed of conductive ink or conductive paste on a transparent substrate, The plating layer is deposited on the seed layer to manufacture a touch sensor for a touch screen panel, thereby simplifying the process of forming a circuit pattern for touch sensing, reducing manufacturing cost, and improving productivity.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch sensor for a touch screen panel, a manufacturing method thereof, and a touch screen panel including the touch sensor.

The present invention relates to a touch sensor for a touch screen panel, and more particularly, to a touch sensor which has a strong adhesion to a transparent substrate, a simple manufacturing method and can precisely form a fine line width, a manufacturing method thereof, and a touch Screen panel.

Generally, a touch screen panel is manufactured by attaching a touch sensor having a transparent electrode to a transparent glass to a cover glass.

The touch sensor is manufactured by coating a transparent film with an electrode material, for example, ITO (Indium Tin Oxide) on one surface, and forming a sensing electrode by an etching process.

1, the touch screen panel 1 includes two touch sensors 1c and a tempered glass 1d covering the touch sensor 1c using a transparent adhesive layer 1b on a display panel 1a. Are stacked in this order.

That is, in a typical touch screen panel, two touch sensors for a touch screen panel in which an ITO sensing electrode is formed on a film substrate and a GFF system using a tempered glass 1d are mainly used. An X-axis sensor or a Y-axis sensor is formed on each of the two sensors.

However, in the conventional touch sensor for a touch screen panel in which a sensing electrode is formed of ITO on a film substrate, the resistance of the ITO (Indium Tin Oxide) electrode is high in a screen of 13 inches or more.

In addition, indium, which is a main material of indium tin oxide (ITO), is depleted in rare elements, and due to limited reserves, the price is high, which causes the manufacturing cost of the touch screen panel to increase.

In addition, ITO (Indium Tin Oxide) electrodes are difficult to apply a flexible substrate at a high process temperature, and cracks are frequently generated due to poor mechanical properties, which is unsuitable for use in a flexible display.

In addition, when dry deposition is performed, wastewater generated by the etching process is discharged to cause environmental pollution, and indium is diffused into the organic layer when the OLED is applied.

In particular, ITO (Indium Tin Oxide) electrodes on a 13 inch or larger touch screen panel have a problem of excessive power consumption due to high resistance.

In addition, a touch sensor can be manufactured by forming AgNW (Silver nano Wire) on the entire surface of a transparent film and forming a transparent electrode by etching. When a transparent electrode is formed using AgNW (Silver nano Wire) The touch speed is excellent but the transparency is low.

In addition, most conventional touch sensors undergo a process such as exposure, development, and etching. In this case, scratches or the like are generated on the substrate of the transparent film, and optical deterioration due to such damage occurs.

In addition, since the conventional touch screen panel includes two touch sensors 1c each having an X-axis sensor and a Y-axis sensor formed on a transparent film, the manufacturing process is complicated, the manufacturing cost is high and the thickness is slim .

Korean Patent Laid-Open Publication No. 2013-0131647 discloses an electrode-window integrated touch screen panel and a touch screen display device including the touch screen panel.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a touch sensing circuit pattern having a fine line width, The present invention provides a touch sensor for a touch screen panel that increases durability and secures operation reliability of a product through a stable touch speed and multi-touch, a manufacturing method thereof, and a touch screen panel including the same.

According to an aspect of the present invention, there is provided a touch sensor for a touch screen panel, including: a transparent substrate; And

And a touch sensing circuit pattern formed on the transparent substrate and configured to sense a touch on the touch screen panel,

The touch sensing circuit pattern may include a seed layer formed of conductive ink or conductive paste and having a light reflectance of 30% or less; And

And a plating layer laminated on the seed layer.

According to an aspect of the present invention, there is provided a method of manufacturing a touch sensor for a touch screen panel, including: forming a seed layer on a transparent substrate;

Forming a circuit cover layer having a circuit pattern hole in the shape of a touch sensing circuit pattern on the seed layer;

Plating the circuit pattern hole to form a plating layer; And

And etching the circuit cover layer to form a circuit pattern for touch sensing,

The step of forming the seed layer is characterized in that the conductive ink or conductive paste having a light reflectance of 30% or less is formed by coating on the substrate.

According to an aspect of the present invention, there is provided a method of manufacturing a touch sensor for a touch screen panel, including: forming a seed layer on a transparent substrate;

An etching step of removing the portion of the seed layer excluding the portion of the circuit pattern for touch sensing; And

And plating the seed layer remaining on the transparent substrate in the etching step,

The step of forming the seed layer is characterized in that the conductive ink or conductive paste having a light reflectance of 30% or less is formed by coating on the substrate.

In the step of forming the seed layer in the present invention, the seed layer may be formed by printing the entire surface of the transparent substrate with gravure printing.

In the present invention, the step of forming the seed layer may include a step of drying the conductive ink or the conductive paste applied on the transparent substrate, or a step of drying and firing the conductive ink or the conductive paste applied on the transparent substrate .

In the present invention, the conductive ink or the conductive paste may include conductive powder, and the conductive powder may be at least one selected from the group consisting of Cr powder, Mo powder, Ti powder, W powder, NiCr) powder, and a titanium tungsten alloy (TiW) powder.

In the present invention, the conductive ink or the conductive paste may include a conductive powder and a blackening agent.

In the present invention, the blackening agent may include any one of carbon black (carbon black) and carbon nanotubes.

In the present invention, the conductive ink may be at least one of a carbon black ink and a carbon nanotube ink. The conductive paste may be at least one of a carbon black paste and a carbon nanotube paste. .

In the present invention, the step of forming the seed layer may further include forming a plating-affinity layer on the seed layer before the step of forming the circuit cover layer.

In the present invention, the step of forming the seed layer may further include forming a plating-affinity layer on the seed layer before the etching step.

In the present invention, the step of forming the plating-friendly layer may include a step of forming the plating-friendly layer by depositing a plating layer on the plating-friendly layer, the plating layer being formed of at least one selected from the group consisting of Cu powder, Ni powder, Ag powder, Au powder, Sn powder, (Pd) powder may be coated on the seed layer and dried.

In the present invention, the step of forming the circuit cover layer may include: forming a photoresist layer on the seed layer; And patterning the circuit pattern hole in the shape of the circuit pattern for touch sensing on the photoresist layer.

In the present invention, the etching step may include: forming a photosensitive layer on the photosensitive conductive layer; Exposing the photosensitive layer and developing it with a developing solution to simultaneously remove a portion of the photosensitive layer and the photosensitive conductive layer except a pattern corresponding to the circuit pattern for touch sensing; Etching the deposited thin film layer into a circuit pattern of a touch sensing pattern; And removing the remaining photosensitive layer covering the deposited thin film layer after the etching process.

According to another aspect of the present invention, there is provided a touch screen panel including: a display panel unit for outputting a screen;

A touch screen panel cover substrate for covering and protecting a screen of the display panel unit; And

And a touch sensing circuit pattern interposed between the display panel unit and the touch screen panel cover substrate to detect a touch on the touch screen panel,

The touch sensing circuit pattern may include a seed layer formed of conductive ink or conductive paste and having a light reflectance of 30% or less; And

And a plating layer laminated on the seed layer.

The present invention has the effect of simplifying the process of forming a circuit pattern for touch sensing, reducing manufacturing cost, and improving productivity by forming a seed layer for preventing irregular reflection of light from conductive ink or conductive ink.

The present invention has the effect of adjusting the resistance of the electrode and alleviating light scattering, thereby improving the operation reliability of the product through stable touch speed and multi-touch.

The present invention has the effect of easily forming a fine circuit with a thickness of 5 占 퐉 or less on a substrate and accurately forming a fine line width of 15 占 퐉 or less and preferably 3 占 퐉 or less according to the circuit design and improving transparency.

1 is a view showing an example of a conventional touch screen panel
2 is a cross-sectional view illustrating an embodiment of a touch sensor for a touch screen panel according to the present invention.
3 is a sectional view showing another embodiment of the touch sensor for a touch screen panel according to the present invention
4 and 5 are sectional views showing still another embodiment of a touch sensor for a touch screen panel according to the present invention
6 is a perspective view illustrating a touch sensor for a touch screen panel according to an embodiment of the present invention.
7 and 8 are cross-sectional views illustrating another embodiment of a touch sensor for a touch screen panel according to the present invention
9 to 13 are schematic views showing an embodiment of a touch screen panel according to the present invention
FIG. 14 is a flowchart illustrating a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention.
15 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention shown in Fig.
16 is a process diagram showing another embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention
FIG. 17 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention shown in FIG. 16
18 is a process diagram illustrating still another embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention
19 is a flowchart showing another embodiment of a method for manufacturing a touch sensor for a touch screen panel according to the present invention
FIG. 20 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention shown in FIG. 19

The present invention will now be described in detail with reference to the accompanying drawings. Hereinafter, a repeated description, a known function that may obscure the gist of the present invention, and a detailed description of the configuration will be omitted. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

2 to 5 are cross-sectional views illustrating a touch sensor according to an embodiment of the present invention. Referring to FIGS. 2 to 5, a touch sensor for a touch screen panel according to an embodiment of the present invention includes a transparent substrate And a touch sensing circuit pattern 20 formed on the transparent substrate 10 and configured to sense a touch on the touch screen panel.

The touch-sensing circuit pattern 20 is formed to have a fine width that can not be recognized by a human eye, and has a line width of 15 mu m or less, preferably 3 mu m or less.

The transparent substrate 10 may be a transparent PI film or may be one of a PEN (polyethylene naphthalate) film, a PET (polyethylene terephthalate) film, a PC (Polycarbonate) film and a PSS A transparent plastic film such as engineering plastic can be used.

The transparent substrate 10 may be a tempered glass or a reinforced coating film in which a reinforcing coating layer for increasing hardness is formed on the surface of a film substrate. The film substrate may be a transparent PI film, or may be one of PEN (Polyethylene Naphthalate) film, PET (polyethylene terephthalate) film, PC (Polycarbonate) film and PSS (Poly styrene sulfonate) It should be noted that any modification capable of a reinforced coating can be carried out.

The reinforcing coating layer may be coated with a resin including silicon (Si) or ceramics, or may be a coating layer by vacuum deposition. In addition, the hardening of one side of the film substrate may be increased to increase the scratches and cracks It should be noted that any coating layer that enhances durability can be implemented.

Preferably, the reinforcing coating layer has a thickness of 0.3 mm or less so that the reinforcing coating layer can be applied to a flexible touch screen panel.

The transparent substrate 10 may be a touch screen panel cover substrate that covers and protects the screen of the display panel unit in the touch screen panel, and the touch screen panel cover substrate is preferably the tempered glass or the reinforced coating film .

The transparent substrate 10 may be formed by integrally forming a touch-sensitive circuit pattern 20 directly on one surface of the touch screen panel cover substrate with the touch screen panel cover substrate to reduce the thickness of the touch screen panel, Light weight.

In this case, one surface of the touch screen panel cover substrate is a surface facing the inner surface of the touch screen panel, that is, the display panel unit. When the touch screen panel cover substrate is mounted on the display panel unit, .

The touch sensing circuit pattern 20 includes a seed layer 1; And a plating layer (2) which is plated and laminated on the seed layer (1).

The seed layer 1 is formed of a conductive ink or a conductive paste and has a light reflectance of 30% or less.

The seed layer 1 may be formed of a conductive ink or a conductive paste.

It is preferable that the conductive ink or the conductive paste has a role of reducing the diffuse reflection of light by forming the seed layer 1 in a black color system.

The conductive powder may be at least one selected from the group consisting of Cr powder, Mo powder, Ti powder, W powder, NiCr powder, Powder, a titanium tungsten alloy (TiW) powder, a silver powder, a copper powder, a gold powder, and an aluminum powder. It is to be noted that the conductive ink or the conductive paste includes at least one of conductive powders having excellent conductivity, and the conductive ink or the conductive paste may be mixed with two conductive powders.

The conductive ink or the conductive paste may include a black conductive powder and a blackening agent, and the conductive powder may be at least one of silver powder, copper powder, gold powder, and aluminum powder.

Also, the blackening agent is contained in the conductive ink or conductive paste so that the conductive ink or the conductive paste has a light reflectance of 30% or less. The black ink may contain at least one of carbon black (carbon black) And it is preferable that the conductive ink or the conductive paste is a black color, that is, any one capable of forming a light reflectance of 30% or less can be applied and excellent conductivity is more preferable.

The conductive ink may be at least one of a carbon black ink and a carbon nanotube ink, and the conductive paste may be at least one of a carbon black paste and a carbon nanotube paste.

The seed layer 1 is formed by drying or firing a conductive ink or a conductive paste. It is preferable that the seed layer 1 is made to lower the resistance by firing the conductive ink or the conductive paste to increase the adhesion with the substrate.

The plating layer 2 may be one of gold (Au), silver (Ag) and copper (Cu), and may be an alloy containing at least one of gold (Au), silver (Ag) Lt; / RTI >

The plating layer 2 serves to lower the resistance of the circuit pattern 20 for touch sensing and to adjust the overall resistance of the circuit pattern 20 for touch sensing to a low level. ) Can be adjusted.

2 and 3, the touch sensing circuit pattern 20 includes a seed layer 1; And a plating layer (2) formed by plating on the seed layer (1). The plating layer 2 is formed on the seed layer 1 so as to cover only the top surface of the seed layer 1 except for the periphery of the seed layer 1.

The plating layer 2 is formed so as to cover only the upper surface of the seed layer 1 except for the periphery of the seed layer 1 and to be laminated on the seed layer 1, The resistance of the circuit pattern 20 can be adjusted.

The plating layer 2 is formed to cover only the upper surface of the seed layer 1 except the periphery of the seed layer 1 so that it does not affect the line width of the circuit pattern 20 for the touch sensing, The fine line width can be precisely realized with the designed line width, and it is possible to adjust the resistance so that the resistance within the allowable range can be precisely satisfied at the same time.

4 and 5, the plating layer 2 is formed to surround the outer periphery of the seed layer 1, and has a shape covering the surface and both sides of the seed layer 1, for example. It is possible.

3 and 5, the touch sensing circuit pattern 20 according to the present invention further includes a plating affinity layer 3 laminated between the seed layer 1 and the plating layer 2 .

The plating affinity layer 3 can smoothly coat the seed layer 1 and increase the bonding force between the plating layer 2 and the seed layer 1 to increase the bonding strength between the plating layer 2 and the seed layer 1, The durability is further improved and the shape of the circuit pattern 20 for touch detection can be maintained even in the deformation of the transparent substrate 10 such as the warpage of the transparent substrate 10. [

The plating friendly layer 3 may be formed of a conductive ink containing a plating-friendly metal powder or an electroconductive paste. The plating-friendly metal powder may be copper (Cu), nickel (Ni), silver (Ag) (Au), tin (Sn), aluminum (Al), and palladium (Pd), and at least two powders may be used in combination.

The plating-friendly layer 3 is formed by drying or firing a conductive ink or a conductive paste containing a plating-friendly metal powder.

The plating-friendly layer 3 is preferably formed of a conductive ink or conductive paste containing a metal powder having a strong affinity to the metal forming the plating layer 2, preferably the same metal as the metal forming the plating layer 2 Do.

3, the plating layer 2 is formed on the periphery of the plating affinity layer 3 and the seed layer 1, that is, the periphery of the plating affinity layer 3 and the side surface of the seed layer 1, Sensitive circuit pattern 20, the fine line width can be precisely realized with the line width determined at the time of designing, so that the resistance within the permissible range at the same time The resistance can be adjusted to meet the exact requirement.

5, the plating affinity layer 3 is laminated on the seed layer 1, and the plating layer 2 is formed by laminating the plating affinity layer 3 and the seed layer 1 Shape. More specifically, the surface and both sides of the plating-affinity layer 3, and both side surfaces of the seed layer 1, respectively.

6, the touch sensing circuit pattern 20 is formed in a circuit shape capable of sensing a touch, and includes an X-axis sensing circuit unit 21 including a plurality of X- Axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the Y-axis direction.

Wherein the transparent substrate 10 includes a first transparent substrate 12 and a second transparent substrate 13 and the touch sensing circuit pattern 20 is provided on the first transparent substrate 12, Axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced in the Y-axis direction and a plurality of Y-axis electrodes spaced longitudinally from the second transparent substrate 13, As an example.

A plurality of X-axis electrodes spaced in the lateral direction and a plurality of Y-axis electrodes spaced in the longitudinal direction are connected to an external circuit through a silver trace electrode, and an electrostatic multi-touch control unit is exemplified as the external circuit. The multi-touch control unit is electrically connected to the main process of the corresponding electronic device.

The X-axis electrode and the Y-axis electrode have a shape in which a plurality of touch sensor electrodes formed in a rhombic metal mesh shape are electrically connected to each other.

Hereinafter, in FIG. 7 to FIG. 13, the line width and the line-to-line spacing of the touch-sensing circuit pattern 20 are shown for clarification of the configuration of the present invention and are different from actual ones.

In implementing the touch sensor for the touch screen panel according to the present invention, it is confirmed that the touch sensing circuit pattern 20 can be variously modified in the actual touch screen panel so as to have an interval with a fine line width having transparency do.

7, the touch sensing circuit pattern 20 includes an X-axis sensing circuit unit 21 including a plurality of X-axis electrodes spaced apart from each other on one of both surfaces of the transparent substrate 10, Axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction and provided on the other of the two surfaces of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are provided on both sides of the transparent substrate 10 to reduce the material cost, reduce the thickness of the touch screen panel, The weight can be reduced.

The X-axis sensing circuit portion 21 or the Y-axis sensing circuit portion 22 may include a seed layer 1 made of conductive ink or conductive paste having a reflectance of 30% or less; And a plating layer 2 laminated on the seed layer 1 circuit layer and being laminated between the seed layer 1 and the plating layer 2.

It is noted that the embodiments of the seed layer (1), the plating layer (2) and the plating-friendly layer (3) are omitted as described above.

8, an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced apart in the lateral direction, which is the touch sensing circuit pattern 20, and a plurality of Y- The sensing circuit portion 22 may be formed on the same surface of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed on either side of the transparent substrate 10 to reduce the material cost and improve the optical characteristics. And the weight of the touch screen panel can be reduced.

9 to 13, a touch screen panel according to an embodiment of the present invention includes a display panel unit 30 for outputting a screen image; And a touch screen panel cover base material (11) covering and protecting a screen of the display panel unit (30); And a touch sensing circuit pattern 20 interposed between the display panel unit 30 and the touch screen panel cover substrate 11 and configured to sense a touch on the touch screen panel.

The touch screen panel cover base material 11 may be a tempered glass made of a transparent base material 10 or a reinforced coating film having a hard coating layer formed on the surface of the film base material. The pattern 20 includes the seed layer 1, the plating-affinity layer 3, and the plating layer 2, and the embodiments thereof are described above as being described above, but the overlapping substrate is omitted.

9, a touch screen panel according to an exemplary embodiment of the present invention includes a first transparent substrate 10, which is spaced apart from the display panel unit 30 and the touch screen panel cover substrate 11, (12) and a second transparent substrate (13), wherein the touch sensing circuit pattern (20) is formed on the first transparent substrate (12) and includes a plurality of X- Axis sensing circuit portion 22 including a plurality of Y-axis electrodes provided in the axis sensing circuit portion 21 and the second transparent substrate 13 and spaced longitudinally.

A first transparent substrate 12 spaced apart from the display panel unit 30, the touch screen panel cover substrate 11, the display panel unit 30, and the touch screen panel cover substrate 11; The second transparent substrate 13 is adhered to each other with a transparent adhesive layer 40, and the transparent adhesive layer 40 is an OCA (Optically Clear Adhesive) OCA film.

The transparent adhesive layer 40 is formed between the touch screen panel cover base material 11 and the first transparent material 12, between the first transparent material 12 and the second transparent material 13, And is interposed between the display panel unit 30 and the second transparent substrate 13, respectively.

10, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover base material 11, The X-axis sensing circuit unit 21 includes a plurality of X-axis electrodes spaced apart from each other and disposed on either one of the touch screen panel cover substrate 11 and the transparent substrate 10, And a Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced apart from each other and provided on the other side of the touch screen panel cover substrate 11 and the transparent substrate 10 .

One surface of the touch screen panel is provided with one of the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 and the X-axis sensing circuit portion 21 and the Y And the other one of the axis sensing circuit portions 22 is provided.

The transparent substrate 10 spaced apart from the display panel unit 30, the touch screen panel cover substrate 11, the display panel unit 30, and the touch screen panel cover substrate 11 is transparent And the transparent adhesive layer 40 is an OCA (Optically Clear Adhesive) OCA film.

The transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

11, the touch sensing circuit pattern 20 includes an X-axis sensing circuit unit including a plurality of X-axis electrodes spaced apart from each other in a lateral direction and provided on one surface of the touch screen panel cover base material 11 21 and a Y-axis sensing circuit 22 including a plurality of longitudinally spaced Y-axis electrodes.

The touch sensing circuit pattern 20 is formed on the one surface of the touch screen panel cover base material 11 so that the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed together, The thickness of the touch screen panel can be reduced, and the weight of the touch screen panel can be reduced.

The display panel unit 30 and the touch screen panel cover substrate 11 are attached to each other with a transparent adhesive layer 40 and the transparent adhesive layer 40 is an OCA optically clear adhesive (OCA) film.

12, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover base material 11, The sensing circuit pattern 20 includes an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced laterally and a Y-axis sensing circuit portion 22 including a plurality of Y- And the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 may be formed on the same surface of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed on the same surface of the transparent substrate 10 to reduce the material cost and improve the optical characteristics , The thickness of the touch screen panel can be reduced, and the weight of the touch screen panel can be reduced.

A transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

13, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover base material 11, The circuit pattern 20 is provided on the other surface of the transparent substrate 10 and includes an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced apart in a lateral direction, Axis sensing circuit portion 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction.

A transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are provided on both sides of the transparent substrate 10 to reduce the material cost, reduce the thickness of the touch screen panel, The weight can be reduced.

The X-axis sensing circuit portion 21 or the Y-axis sensing circuit portion 22 of FIGS. 6 to 13 is formed of a conductive ink or a conductive ink, and has a seed layer 1 having a light reflectance of 30% or less; And a plating layer 2 formed by plating on the seed layer 1 and a plating affinity layer 3 stacked between the seed layer 1 and the plating layer 2. [

It is noted that the embodiments of the seed layer (1), the plating layer (2) and the plating-friendly layer (3) are omitted as described above.

14 and 15, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes forming a seed layer 1 on a transparent substrate 10 (S100) (S200) of forming a circuit cover layer (4) having a circuit pattern hole (4b) for exposing the seed layer (1) in the shape of a touch sensing circuit pattern (20) (S300) plating the plating layer (2) so that the plating layer (2) is formed on the seed layer (1) exposed by the hole (4b) and removing the circuit cover layer (4) And etching (S400).

The step (S100) of forming the seed layer 1 is formed by applying a conductive ink or conductive paste having a light reflectance of 30% or less on the substrate.

More specifically, the step (S100) of forming the seed layer (1) may include printing the conductive ink or conductive paste having a light reflectance of 30% or less on the transparent substrate by gravure printing to form the seed layer For example.

The step (S100) of forming the seed layer 1 may include a step of drying the conductive ink or the conductive paste printed on the transparent substrate 10 or the step of drying the conductive ink or the conductive paste And then drying and firing.

The conductive powder may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), silver powder, copper powder, gold powder, and aluminum powder. It is to be noted that the conductive ink or the conductive paste includes at least one of conductive powders having excellent conductivity, and the conductive ink or the conductive paste may be mixed with two conductive powders.

The conductive ink or the conductive paste may include a black conductive powder and a blackening agent, and the conductive powder may be at least one of silver powder, copper powder, gold powder, and aluminum powder.

The blackening agent is contained in the conductive ink or conductive paste such that the conductive ink or the conductive paste is formed to have a light reflectance of 30% or less. The blackening agent is, for example, carbon black or carbon nanotube , And conductive ink or conductive paste can be used to form a black color, that is, a material capable of forming a light reflectance of 30% or less, and more preferably excellent in conductivity.

The conductive ink may be any one of carbon black ink and carbon nanotube ink, and the conductive paste may be a carbon black paste or a carbon nanotube paste.

The seed layer 1 is formed by printing conductive ink or conductive paste, followed by drying or firing. It is preferable that the seed layer 1 is made to lower the resistance by firing the conductive ink or the conductive paste to increase the adhesion with the substrate.

The step S200 of forming the circuit cover layer 4 includes a step S210 of forming a photoresist layer on the seed layer 1, a step of forming a circuit pattern 20 for touch sensing on the photoresist layer, (Step S220) of patterning the circuit pattern hole 4b in the shape of the circuit pattern hole 4b.

The photoresist layer 4a may be formed by applying a dry film or a photoresist liquid.

Since the dry film is uniform in thickness and does not require a separate drying step as compared with the photoresist layer 4a formed by applying the photoresist liquid, the manufacturing process can be simplified and the circuit electrode can be uniformly formed And it is advantageous to miniaturize the line width of the circuit electrode so that the circuit pattern hole 4b having a line width of 15 m or less can be formed more easily.

In the step S210 of forming the photoresist layer 4a, a photoresist layer 4a may be formed by a comma roll coating, a gravure coating, a doctor blade method, a spraying method, or an electrospinning method.

The electrospinning forms the electrospun photoresist layer 4a to 1 to 10 mu m. Wherein the electrospinning comprises: an electric spray nozzle; and spraying the photosensitive polymer solution onto the seed layer (1) by spraying the photosensitive polymer solution with the electric spray nozzle with the electric power source applied to the seed layer (1) Thereby forming a radiation photoresist layer 4a.

Since the electrospinning contains electric charge in the photosensitive polymer to be injected, the electrospun photoresist layer 4a can be formed of a thin film having a thickness of 5 탆 or less by dispersing the photosensitive polymer solution while being sprayed without aggregation.

The electrospinning forms the electrospinning photoresist layer 4a on the seed layer 1 with the electric power applied to the seed layer 1, The photosensitive resin fibers are uniformly applied to the seed layer 1 by a potential difference, and strongly adhered and applied.

When the photoresist layer 4a is formed by electrospinning, the photoresist layer 4a applied by electrospinning must be cured. The photoresist layer 4a may be cured by ultraviolet (UV) curing, laser curing, Cure by ebeam curing or the like.

In the patterning step S220, the photoresist layer 4a is exposed with the mask 5 covering only the portion where the circuit pattern hole 4b is formed, and then developed with a developing solution to be hardened by exposure That is, only the portion covered by the mask 5 is dissolved by the developing solution to form the circuit pattern hole 4b in the photoresist layer 4a.

The photoresist layer 4a is changed to an insoluble state in which a portion exposed by exposure is not dissolved by a developing solution.

That is, in the exposure process, a portion of the photoresist layer 4a not covered by the mask 5, that is, a portion not subjected to light so that only a portion irradiated with light is not dissolved by the developer, To be dissolved.

The process of developing with the developing solution is performed by developing only the part of the photoresist layer 4a that is not insoluble in the usable state, that is, the part corresponding to the circuit pattern hole 4b, and forms the circuit pattern hole 4b do.

The plating step S300 is an example of performing electrolytic plating or electroless plating of gold (Au), silver (Ag), or copper (Cu), and the circuit pattern hole 4b is formed by electrolytic plating or electroless plating. The plating layer 2 is formed. The plating step S300 may be performed by forming the plating layer 2 on the seed layer 1 with the photoresist layer 4a as a barrier in the circuit pattern hole 4b, The plating layer 2 is not formed on the side surface of the seed layer 1 to form a plating layer 2 having a fine line width that matches the line width of the circuit pattern hole 4b.

The etching step S400 is performed by removing the photoresist layer 4a and etching the seed layer 1 with the plating layer 2 as a barrier so that the seed layer 1 covers the plating layer 2, And has a line width corresponding to the line width.

Therefore, it is possible to form the circuit pattern 20 for touch sensing having the correct line width coinciding with the circuit pattern hole 4b.

16 and 17, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes forming the circuit cover layer 4 after forming the seed layer 1 (S100) (S110) on the seed layer (1) before forming the plating-friendly layer (3).

The circuit cover layer (4) is formed on the seed layer (1) on the upper surface of the plating-friendly layer (3).

The step S110 of forming the plating affinity layer 3 may include a step of forming the plating affinity layer 3 by using a metal such as copper , And palladium (Pd) powder may be coated on the seed layer (1) and dried to form the plating-friendly layer (3). Alternatively, the plating-friendly layer (3) The layer 3 may be formed.

The step of forming the plating-friendly layer 3 (S110) comprises forming the plating-friendly layer 3 on the seed layer 1 by printing, preferably gravure printing, on the conductive ink or conductive paste containing the plating- As an example.

The seed layer (1) and the plating affinity layer (3) may be fired together. For example, the seed layer 1 is formed by printing with conductive ink or conductive paste, followed by drying, and the plating affinity layer 3 is printed on the seed layer 1 with conductive ink or conductive paste to form Dried, and fired, the seed layer 1 and the plating-friendly layer 3 can be simultaneously fired.

The photoresist layer 4a is formed on the upper surface of the plating affinity layer 3 in step S210 and the patterning process S220 is performed on the mask 5, Except that the portion where the circuit pattern hole 4b is formed is covered with the photoresist layer 4a so as to cover the photoresist layer 4a and then developed with a developing solution so that only the portion changed to the usable state by exposure is exposed to the photoresist layer 4a Thereby forming the circuit pattern hole 4b.

In the patterning process (S220), the mask 5 has a hole for exposing a portion where the circuit pattern hole 4b is formed.

The photoresist layer 4a is changed to an available state in which a portion exposed by exposure is dissolved by a developing solution.

That is, in the exposure process, a portion of the photoresist layer 4a that is not covered by the mask 5, that is, a portion to which light is applied, is in an available state to be dissolved by the developer, Is kept in an insoluble state that is not dissolved by the developer.

The process of developing with the developing solution is performed by developing only the part of the photoresist layer 4a that is not insoluble in the usable state, that is, the part corresponding to the circuit pattern hole 4b, and forms the circuit pattern hole 4b do.

The plating step S300 is an example of performing electrolytic plating or electroless plating of gold (Au), silver (Ag), or copper (Cu), and the circuit pattern hole 4b is formed by electrolytic plating or electroless plating. The plating layer 2 is formed. The plating step S300 may be performed by forming the plating layer 2 with the photoresist layer 4a as a barrier in the circuit pattern hole 4b to form the seed layer 1 and the plating- And the plating layer 2 is not formed around the side faces of the seed layer 1 and the plating affinity layer 3 so as to be precisely and precisely aligned with the line width of the circuit pattern hole 4b Thereby forming a plating layer 2 having a line width.

The etching step S400 may include removing the photoresist layer 4a and etching the plating affinity layer 3 and the seed layer 1 using the plating layer 2 as a barrier, (3) and the seed layer (1) have a line width corresponding to the plating layer (2).

Therefore, it is possible to form the circuit pattern 20 for touch sensing having the correct line width coinciding with the circuit pattern hole 4b.

Referring to FIG. 18, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes: forming a seed layer 1 on a transparent substrate 10 (S100); An etching step (S150) of removing the portion of the seed layer (1) excluding the portion of the circuit pattern for touch sensing; And plating the seed layer 1 remaining on the transparent substrate 10 in the etching step S150 (S300).

The step of forming the seed layer (1) is formed by printing a conductive ink or conductive paste having a light reflectance of 30% or less on the substrate.

More specifically, the step of forming the seed layer (1) is an example in which the transparent substrate is overprinted with gravure printing using a conductive ink or conductive paste of 30% or less.

The step (S100) of forming the seed layer 1 may include a step of drying the conductive ink or the conductive paste printed on the transparent substrate 10 or the step of drying the conductive ink or the conductive paste And then drying and firing.

The conductive powder may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), silver powder, copper powder, gold powder, and aluminum powder. It is to be noted that the conductive ink or the conductive paste includes at least one of conductive powders having excellent conductivity, and the conductive ink or the conductive paste may be mixed with two conductive powders.

The conductive ink or the conductive paste may include a black conductive powder and a blackening agent, and the conductive powder may be at least one of silver powder, copper powder, gold powder, and aluminum powder.

The blackening agent is contained in the conductive ink or the conductive paste so that the conductive ink or the conductive paste has a light reflectance of 30% or less. The black ink may include any one of carbon black or carbon nanotubes. And it is preferable that the conductive ink or the conductive paste is a black-based color, that is, any material capable of forming a light reflectance of 30% or less can be applied and excellent conductivity is more preferable.

The conductive ink may be any one of carbon black ink and carbon nanotube ink, and the conductive paste may be a carbon black paste or a carbon nanotube paste.

The seed layer 1 is formed by printing conductive ink or conductive paste, followed by drying or firing. It is preferable that the seed layer 1 is made to lower the resistance by firing the conductive ink or the conductive paste to increase the adhesion with the substrate.

The etching step S150 includes the steps of forming a photoresist layer 4a on the seed layer 1 (S151); A step (S152) of exposing and developing the photoresist layer 4a to form a cover pattern 4c corresponding to the circuit pattern for touch sensing in the photoresist layer 4a; And etching the remaining portion of the seed layer 1 except the portion covered by the cover pattern 4c (S153).

In addition, the etching step S150 may further include a step (S154) of removing the cover pattern 4c stacked on the etched seed layer 1 (S154).

More specifically, in the process of forming the cover pattern 4c (S152), the mask 5 having the pattern holes 5a corresponding to the touch sensing circuit pattern is formed on the photoresist layer 4a, Covering the layer 4a and then exposing it to light so as to cure only the portion to which the light is applied so as not to be dissolved by the developing solution, and to dissolve the light-free portion by the developing solution. That is, only the portion corresponding to the pattern hole 5a in the photoresist layer 4a, that is, the cover pattern 4c is left, and the remaining portion is dissolved and removed by the developer.

The photoresist layer 4a may be formed by applying a dry film or a photoresist liquid.

The photoresist layer 4a may be formed by spraying, coater, gravure, and electrospinning.

The electrospinning forms the electrospun photoresist layer 4a to 1 to 10 mu m. Wherein the electrospinning comprises: an electric spray nozzle; and spraying the photosensitive polymer solution onto the seed layer (1) by spraying the photosensitive polymer solution with the electric spray nozzle with the electric power source applied to the seed layer (1) Thereby forming a radiation photoresist layer 4a.

Since the electrospinning contains electric charge in the photosensitive polymer to be injected, the electrospun photoresist layer 4a can be formed of a thin film having a thickness of 5 탆 or less by dispersing the photosensitive polymer solution while being sprayed without aggregation.

The electrospinning forms the electrospinning photoresist layer 4a on the seed layer 1 with the electric power applied to the seed layer 1, The photosensitive resin fibers are uniformly applied to the seed layer 1 by a potential difference, and strongly adhered and applied.

When the electrospinning photoresist layer 4a is formed by electrospinning, the electrospinning photoresist layer 4a applied by electrospinning must be cured and the electrospinning photoresist layer 4a should be cured by ultraviolet (UV) Laser curing, ebeam curing, and the like.

The plating step S300 may be performed by electrolytically plating or electroless plating the seed layer 1 with gold (Au), silver (Ag), or copper (Cu).

19 and 20, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes: forming the seed layer 1 (S100) after the etching step (S150) (S110) of forming a plating affinity layer (3) on the layer (1).

The step S110 of forming the plating affinity layer 3 may include a step of forming the plating affinity layer 3 by using a metal such as copper , And palladium (Pd) powder may be coated on the seed layer (1) and dried to form the plating-friendly layer (3). Alternatively, the plating-friendly layer (3) The layer 3 may be formed.

The step of forming the plating-friendly layer 3 (S110) comprises forming the plating-friendly layer 3 on the seed layer 1 by printing, preferably gravure printing, on the conductive ink or conductive paste containing the plating- As an example.

The seed layer (1) and the plating affinity layer (3) may be fired together. For example, the seed layer 1 is formed by printing with conductive ink or conductive paste, followed by drying, and the plating affinity layer 3 is printed on the seed layer 1 with conductive ink or conductive paste to form The seed layer 1 and the plating-friendly layer 3 can be fired at the same time.

The etching step S150 is carried out by removing the portion of the plating-affinity layer 3 and the seed layer 1 except for the touch-sensitive circuit pattern portion, and the specific method is omitted for the overlapping substrate described above .

In the plating step S300, plating is performed in a state where the plating affinity layer 3 is laminated on the seed layer 1 to cover the plating affinity layer 3 and the seed layer 1 The plating layer 2 is formed, and gold (Au), silver (Ag), or copper (Cu) is electroplated or electrolessly plated.

The present invention has the effect of simplifying the electrode circuit formation process, reducing manufacturing cost, and improving productivity by forming a seed layer for preventing irregular reflection of light from conductive ink or conductive ink.

The present invention has the effect of adjusting the resistance of the electrode and alleviating light scattering, thereby improving the operation reliability of the product through stable touch speed and multi-touch.

The present invention has the effect of easily forming a fine circuit with a thickness of 5 占 퐉 or less on a substrate and accurately forming a fine line width of 15 占 퐉 or less and preferably 3 占 퐉 or less according to the circuit design and improving transparency.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. will be.

1: seed layer 2: plated layer
3: plating-friendly layer 4: circuit cover layer
4a: photoresist layer 4b: circuit pattern hole
10: transparent substrate 11: touch screen panel cover substrate
12: first transparent substrate 13: second transparent substrate
20: Circuit pattern for touch detection 21: X-axis sensing circuit
22: Y-axis sensing circuit unit 30: Display panel unit
40: transparent adhesive layer

Claims (23)

Transparent substrate; And
And a touch sensing circuit pattern formed on the transparent substrate and configured to sense a touch on the touch screen panel,
The touch sensing circuit pattern may include a seed layer formed of conductive ink or conductive paste and having a light reflectance of 30% or less; And
And a plating layer laminated on the seed layer by plating. The method according to claim 1,
Wherein the conductive ink or the conductive paste includes a conductive powder,
Wherein the conductive powder is at least one of a Cr powder, a Mo powder, a Ti powder, a W powder, a NiCr powder, and a Ti tungsten alloy powder. Touch sensor for touch screen panel. The method according to claim 1,
Wherein the conductive ink or the conductive paste includes a conductive powder and a blackening agent. The method of claim 3,
Wherein the blackening agent comprises at least one of carbon black and carbon nanotubes. The method according to claim 1,
Wherein the conductive ink is at least one of a carbon black ink and a carbon nanotube ink,
Wherein the conductive paste is at least one of carbon black paste and carbon nanotube paste. The method according to claim 1,
And a plating-affinity layer laminated between the seed layer and the plating layer,
Wherein the plating affinity layer is formed of a conductive ink containing a plating-friendly metal powder or an electroconductive paste. The method according to claim 6,
The plating-friendly metal powder is characterized in that it contains powder of at least one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium A touch sensor for a touch screen panel. The method according to claim 1,
Wherein the plating layer is formed to cover only the upper surface of the seed layer except the periphery of the seed layer. Forming a seed layer on the transparent substrate;
Forming a circuit cover layer having a circuit pattern hole in the shape of a touch sensing circuit pattern on the seed layer;
Plating the circuit pattern hole to form a plating layer; And
And etching the circuit cover layer to form a circuit pattern for touch sensing,
Wherein the forming of the seed layer is performed by printing a conductive ink or conductive paste having a light reflectance of 30% or less on the substrate. Forming a seed layer on the transparent substrate;
An etching step of removing the portion of the seed layer excluding the portion of the circuit pattern for touch sensing; And
And plating the seed layer remaining on the transparent substrate in the etching step,
Wherein the forming of the seed layer is performed by applying a conductive ink or a conductive paste having a light reflectance of 30% or less on the substrate. 11. The method according to claim 9 or 10,
Wherein the forming of the seed layer comprises printing the entire surface of the transparent substrate with gravure printing to form the seed layer. 11. The method according to claim 9 or 10,
The step of forming the seed layer may include a step of drying the conductive ink or the conductive paste applied on the transparent substrate or a step of drying and firing the conductive ink or the conductive paste applied on the transparent substrate A method of manufacturing a touch sensor for a touch screen panel. 11. The method according to claim 9 or 10,
Wherein the conductive ink or the conductive paste includes a conductive powder,
The conductive powder may include at least one of a Cr powder, a Mo powder, a Ti powder, a W powder, a NiCr powder, and a Ti tungsten alloy powder. Wherein the touch sensor is a touch sensor. 11. The method according to claim 9 or 10,
Wherein the conductive ink or the conductive paste includes a conductive powder and a blackening agent. 15. The method of claim 14,
Wherein the blackening agent comprises at least one of carbon black and carbon nanotubes. 11. The method according to claim 9 or 10,
Wherein the conductive ink is at least one of a carbon black ink and a carbon nanotube ink,
Wherein the conductive paste is at least one of carbon black paste and carbon nanotube paste. 10. The method of claim 9,
And forming a plating affinity layer on the seed layer before forming the circuit cover layer after the forming of the seed layer. 11. The method of claim 10,
And forming a plating affinity layer on the seed layer before the etching step after forming the seed layer. The method according to claim 17 or 18,
The step of forming the plating affinity layer may include a step of forming the plating affinity layer by depositing a plating layer on the plating layer in the order of copper (Cu) powder, nickel (Ni) powder, silver (Ag), gold (Au), tin Wherein the seed layer is coated with a conductive ink or conductive paste containing at least one of the conductive paste or the conductive paste and dried. 10. The method of claim 9,
Wherein forming the circuit cover layer comprises:
Forming a photoresist layer on the seed layer; And
And patterning a circuit pattern hole in a shape of a circuit pattern for touch sensing on the photoresist layer. 11. The method of claim 10,
Wherein the etching step comprises:
Forming a photoresist layer on the seed layer;
Exposing and developing the photoresist layer to form a cover pattern corresponding to a circuit pattern for touch detection in the photoresist layer; And
And etching the remaining portion of the seed layer except the portion covered by the cover pattern. delete delete

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