KR101628807B1 - Manufacturing Method of Touch Sensor for Touch Screen Panel - Google Patents

Abstract

The present invention relates to a method of manufacturing a touch sensor for a touch screen panel, which comprises forming a seed layer on a transparent substrate, forming an electrosensitive layer on the seed layer by electrospinning, It is possible to easily form a fine circuit with a thickness of 5 탆 or less on the substrate for a touch screen panel by forming a circuit pattern for sensing and to simplify the process of forming a circuit pattern for touch sensing to reduce manufacturing cost, , The resistance of the circuit pattern for touch sensing can be adjusted, and light scattering is relieved to ensure the reliability of the product through stable touch speed and multi-touch.

Description

Technical Field [0001] The present invention relates to a manufacturing method of a touch screen panel,

The present invention relates to a touch sensor for a touch screen panel, and more particularly, to a method of manufacturing a touch sensor for a touch screen panel that is simple in manufacturing method and capable of accurately forming a fine line width.

Generally, a touch screen panel is manufactured by attaching a touch sensor having a transparent electrode to a transparent glass to a cover glass.

The touch sensor is manufactured by coating a transparent film with an electrode material, for example, ITO (Indium Tin Oxide) on one surface, and forming a sensing electrode by an etching process.

1, the touch screen panel 1 includes two touch sensors 1c and a tempered glass 1d covering the touch sensor 1c using a transparent adhesive layer 1b on a display panel 1a. Are stacked in this order.

That is, in a typical touch screen panel, two touch sensors for a touch screen panel in which an ITO sensing electrode is formed on a film substrate and a GFF system using a tempered glass 1d are mainly used. An X-axis sensor or a Y-axis sensor is formed on each of the two sensors.

However, in the conventional touch sensor for a touch screen panel in which a sensing electrode is formed of ITO on a film substrate, the resistance of the ITO (Indium Tin Oxide) electrode is high in a screen of 13 inches or more.

In addition, indium, which is a main material of indium tin oxide (ITO), is depleted in rare elements, and due to limited reserves, the price is high, which causes the manufacturing cost of the touch screen panel to increase.

In addition, ITO (Indium Tin Oxide) electrodes are difficult to apply a flexible substrate at a high process temperature, and cracks are frequently generated due to poor mechanical properties, which is unsuitable for use in a flexible display.

In addition, when dry deposition is performed, wastewater generated by the etching process is discharged to cause environmental pollution, and indium is diffused into the organic layer when the OLED is applied.

In particular, ITO (Indium Tin Oxide) electrodes on a 13 inch or larger touch screen panel have a problem of excessive power consumption due to high resistance.

In addition, a touch sensor can be manufactured by forming AgNW (Silver nano Wire) on the entire surface of a transparent film and forming a transparent electrode by etching. When a transparent electrode is formed using AgNW (Silver nano Wire) The touch speed is excellent but the transparency is low.

In addition, most conventional touch sensors undergo a process such as exposure, development, and etching. In this case, scratches or the like are generated on the substrate of the transparent film, and optical deterioration due to such damage occurs.

In addition, since the conventional touch screen panel includes two touch sensors 1c each having an X-axis sensor and a Y-axis sensor formed on a transparent film, the manufacturing process is complicated, the manufacturing cost is high and the thickness is slim .

Korean Patent Laid-Open Publication No. 2013-0131647 discloses an electrode-window integrated touch screen panel and a touch screen display device including the touch screen panel.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and it is an object of the present invention to provide an electrode circuit by applying a photosensitive polymer through electrospinning to simplify the process, thereby reducing manufacturing cost and easily forming a microcircuit having a desired thickness And a method of manufacturing a touch sensor for a touch screen panel.

According to an aspect of the present invention, there is provided a method of manufacturing a touch sensor for a touch screen panel, including: forming a seed layer on a transparent substrate;

Forming an electrospun photosensitive layer on the seed layer by electrospinning;

Forming a circuit pattern hole in the form of a circuit pattern for touch sensing on the electrosensitive layer;

Plating the circuit pattern hole to form a plating layer; And

And etching the part of the seed layer so as to form a circuit pattern for touch detection by removing the electrosensitive photosensitive layer.

According to another aspect of the present invention, there is provided a method of manufacturing a touch sensor for a touch screen panel, including: forming a seed layer on a transparent substrate;

Forming an electrospun photosensitive layer on the seed layer by electrospinning;

Removing the other part of the electrosensitive photosensitive layer while leaving only the portion of the circuit pattern for touch detection;

An etching step of removing the remaining portion of the seed layer except for the touch-sensitive circuit pattern portion; And

And plating the seed layer remaining on the transparent substrate in the etching step.

In the step of forming the seed layer in the present invention, a conductive ink or a conductive paste having a light reflectance of 30% or less can be applied on the substrate.

In the step of forming the seed layer in the present invention, the seed layer may be formed by printing the entire surface of the transparent substrate with gravure printing.

In the present invention, the step of forming the seed layer may include a step of drying the conductive ink or the conductive paste applied on the transparent substrate, or a step of drying and firing the conductive ink or the conductive paste applied on the transparent substrate .

In the present invention, the conductive ink or the conductive paste includes a conductive powder, and the conductive powder is selected from the group consisting of Cr powder, Mo powder, Ti powder, W powder, NiCr powder, Powder, and a titanium tungsten alloy (TiW) powder.

In the present invention, the conductive ink or the conductive paste may include a conductive powder and a blackening agent.

In the present invention, the blackening agent may include at least one of carbon black (carbon black) and carbon nanotubes.

In the present invention, the conductive ink may be at least one of a carbon black ink and a carbon nanotube ink, and the conductive paste may be at least one of a carbon black paste and a carbon nanotube paste .

In the step of forming the seed layer in the present invention, a deposited thin film layer may be formed by vapor deposition.

In the present invention, the deposition may be any one of evaporation, ebeam deposition, laser deposition, sputtering, and arc ion plating.

In the present invention, the deposited thin film layer may be any one of Cr, Mo, Ti, W, NiCr, TiW, and Cu. .

In the present invention, the step of forming the deposited thin film layer may include thermal deposition of copper (Cu).

In the step of forming the seed layer in the present invention, the target material may be sputtered in an oxygen gas atmosphere or a nitrogen gas atmosphere to form an oxide film or a nitride film on one surface of the transparent substrate.

An embodiment of the method for manufacturing a touch sensor for a screen panel according to the present invention further includes forming a plating affinity layer on the seed layer after forming the seed layer and before forming the electrosensitive layer can do.

In the present invention, the step of forming the plating-friendly layer may include the steps of forming a plating-friendly layer on the substrate by using a plating solution containing copper (Cu) powder, Ni powder, Ag powder, Au powder, Sn powder, Pd) powder may be coated on the seed layer and dried.

In the present invention, the step of forming the plating-friendly layer may form the plating-friendly layer by vacuum deposition.

In the present invention, the step of forming the plating-friendly layer may be performed using any one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al) May be vacuum-deposited to form a plating-friendly layer on the seed layer.

The present invention has the effect of easily forming a fine circuit with a thickness of 5 탆 or less on a substrate for a touch screen panel by using electrospinning.

In addition, the present invention simplifies the process of forming a circuit pattern for touch sensing through a photolithography process, thereby reducing manufacturing cost and improving productivity.

The present invention is capable of adjusting the resistance of a circuit pattern for touch sensing and relieving scattering of light, thereby securing the reliability of the product through stable touch speed and multi-touch.

1 is a view showing an example of a conventional touch screen panel
2 is a flow chart illustrating an embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention.
FIG. 3 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention,
4 is a flowchart showing another embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention
5 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention,
6 is a process diagram illustrating still another embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention.
FIG. 7 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention shown in FIG.
FIG. 8 is a flow chart showing another embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention.
FIG. 9 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention shown in FIG.
10 is a cross-sectional view illustrating one embodiment of a touch sensor for a touch screen panel manufactured by the method for manufacturing a touch sensor panel for a touch screen panel according to the present invention
11 is a sectional view showing another embodiment of a touch sensor for a touch screen panel manufactured by the method for manufacturing a touch sensor panel for a touch screen panel according to the present invention
12 and 13 are sectional views showing still another embodiment of a touch sensor for a touch screen panel manufactured by the method for manufacturing a touch sensor panel for a touch screen panel according to the present invention
FIG. 14 is a perspective view illustrating an embodiment of a touch sensor for a touch screen panel manufactured by the method for manufacturing a touch sensor panel for a touch screen panel according to the present invention.
15 and 16 are sectional views showing another embodiment of a touch sensor for a touch screen panel manufactured by the method for manufacturing a touch sensor panel for a touch screen panel according to the present invention
17 to 21 are schematic views showing an embodiment of a touch screen panel to which a touch sensor for a touch screen panel manufactured by the method for manufacturing a touch sensor panel for a touch screen panel according to the present invention is applied

The present invention will now be described in detail with reference to the accompanying drawings. Hereinafter, a repeated description, a known function that may obscure the gist of the present invention, and a detailed description of the configuration will be omitted. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

The line width and the distance between the touch sensing circuit patterns 20 shown in FIGS. 2 to 21 are shown for clarifying the configuration of the present invention, and are different from actual ones. In the manufacturing method and the touch sensor for a touch screen panel manufactured by the method, it is confirmed that the touch sensing circuit pattern can be variously modified so as to have an interval with a fine line width having transparency invisible in an actual touch screen panel do.

2 and 3, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes forming a seed layer 1 on a transparent substrate 10 (S100) (S300) of forming a circuit pattern hole in the form of a touch-sensitive circuit pattern on the electrosensitive layer (4) by forming an electrospun photosensitive layer (4) by electrospinning on the substrate (1) (S400) of forming a plating layer (2) in the circuit pattern hole (S400), removing a part of the seed layer (1) so as to form the touch sensing circuit pattern (S500).

The transparent substrate 10 may be a transparent PI film or may be one of a PEN (polyethylene naphthalate) film, a PET (polyethylene terephthalate) film, a PC (Polycarbonate) film and a PSS A transparent plastic film such as engineering plastic can be used.

The transparent substrate 10 may be a tempered glass or a reinforced coating film in which a reinforcing coating layer for increasing hardness is formed on the surface of a film substrate. The film substrate may be a transparent PI film, or may be one of PEN (Polyethylene Naphthalate) film, PET (polyethylene terephthalate) film, PC (Polycarbonate) film and PSS (Poly styrene sulfonate) It should be noted that any modification capable of a reinforced coating can be carried out.

The reinforcing coating layer may be coated with a resin including silicon (Si) or ceramics, or may be a coating layer by vacuum deposition. In addition, the hardening of one side of the film substrate may be increased to increase the scratches and cracks It should be noted that any coating layer that enhances durability can be implemented.

Preferably, the reinforcing coating layer has a thickness of 0.3 mm or less so that the reinforcing coating layer can be applied to a flexible touch screen panel.

The transparent substrate 10 may be a touch screen panel cover substrate that covers and protects the screen of the display panel unit in the touch screen panel, and the touch screen panel cover substrate is preferably the tempered glass or the reinforced coating film .

The transparent substrate 10 may be formed by integrally forming a touch-sensitive circuit pattern 20 directly on one surface of the touch screen panel cover substrate with the touch screen panel cover substrate to reduce the thickness of the touch screen panel, Light weight.

In this case, one surface of the touch screen panel cover substrate is a surface facing the inner surface of the touch screen panel, that is, the display panel unit. When the touch screen panel cover substrate is mounted on the display panel unit, .

The step (S100) of forming the seed layer 1 is formed by applying a conductive ink or conductive paste having a light reflectance of 30% or less on the substrate.

More specifically, the step (S100) of forming the seed layer (1) includes a step of printing a conductive ink or conductive paste having a light reflectance of 30% or less on the transparent substrate (10) by gravure printing to form the seed layer ) Is formed as an example.

The step (S100) of forming the seed layer 1 may include a step of drying the conductive ink or the conductive paste printed on the transparent substrate 10 or the step of drying the conductive ink or the conductive paste And then drying and firing.

The conductive powder may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), silver powder, copper powder, gold powder, and aluminum powder. It is to be noted that the conductive ink or the conductive paste includes at least one of conductive powders having excellent conductivity, and the conductive ink or the conductive paste may be mixed with two conductive powders.

The conductive ink or the conductive paste may include a black conductive powder and a blackening agent, and the conductive powder may be at least one of silver powder, copper powder, gold powder, and aluminum powder.

The blackening agent is contained in the conductive ink or conductive paste such that the conductive ink or the conductive paste is formed to have a light reflectance of 30% or less. The blackening agent is, for example, carbon black or carbon nanotube , And conductive ink or conductive paste can be used to form a black color, that is, a material capable of forming a light reflectance of 30% or less, and more preferably excellent in conductivity.

In addition, the conductive ink may be any one of carbon black ink and carbon nanotube ink, and the conductive paste may be a carbon black paste or a carbon nanotube paste.

The seed layer 1 is formed by printing conductive ink or conductive paste, followed by drying or firing. It is preferable that the seed layer 1 is made to lower the resistance by firing the conductive ink or the conductive paste to increase the adhesion with the substrate.

In the step of forming the seed layer 1, the seed layer 1 is formed by vacuum-depositing a conductor to a predetermined thickness or less to form a seed layer 1 having a black-based color And the conductor is a metal such as copper (Cu), nickel (Ni), chrome (Cr), tungsten (W), molybdenum (Mo), aluminum (Al)

In the step S100 of forming the seed layer 1, it is preferable to use a metal having a black-based color when vacuum-deposited to a predetermined thickness or less.

For example, when copper is thermally deposited on the base material 1 for the touch screen panel to a thickness of 10 nm, a seed layer 1 having a black-based color is formed.

In step S100 of forming the seed layer 1, a black seed layer 1 is formed by thermally depositing a metal with a thickness of 10 nm to 50 nm on one surface of the substrate 1 for a touch screen panel .

The step of forming the seed layer 1 (S100) may be performed by forming a deposited thin film layer by vacuum deposition. The vacuum deposition may be performed by evaporation, ebeam deposition, laser deposition, Sputtering, or arc ion plating. [0043] As shown in FIG.

The vacuum deposition may be performed using any one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), and copper (Cu) , An alloy containing at least two of titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW) and copper (Cu), or an alloy of molybdenum (Mo), titanium (Ti), tungsten ), Nickel chromium (NiCr), titanium tungsten alloy (TiW), and copper (Cu) as a target material.

The step (S100) of forming the seed layer (1) is preferably a thermal deposition of copper (Cu). The deposited thin film layer 1 formed by thermally depositing Cu is plated in a plating-friendly manner in step S400, and the plating layer 2 formed in the plating step S400 And has a black color upon thermal vapor deposition.

In the step S100 of forming the seed layer 1, the target material may be vacuum-deposited in an oxygen gas atmosphere or a nitrogen gas atmosphere to form an oxide film or a nitride film.

That is, the step (S100) of forming the seed layer 1 may be performed by sputtering a target material such as titanium, chromium, copper, nickel, aluminum, silver or carbon or the like in an oxygen gas atmosphere or a nitrogen gas atmosphere, An oxide film or a nitride film may be formed on one surface of the substrate 10.

Step (S100), the titanium (TiO _2), chromium oxide (CrO _2), copper (CuO), nickel oxide (NiO), aluminum oxide (Al ₂ O ₃₎ of forming the oxide layer (1), An oxide film such as titanium oxide (TiN) or copper nitride (CuN) can be sputtered as a target material by sputtering an oxide such as silver oxide (AgO) with a target material to form an oxide film on one surface of the transparent substrate 10 A nitride film can be formed on one surface of the transparent substrate 10.

This makes it possible to firmly and firmly attach the oxide film or the nitride film to the transparent substrate 10, and to easily form the oxide film or the nitride film on the one surface of the transparent substrate 10 with a predetermined thickness.

The oxide film or the nitride film has a reflectance of 30% or less, thereby preventing glare due to reflection of the electrode and enhancing adhesion between the electrode and the transparent substrate 10.

The seed layer 1 has a black-based color, that is, a light reflectance is formed to be 30% or less to remove light reflection phenomenon and reduce irregular reflection of light, thereby improving visibility.

The step S200 of forming the electroscopic photosensitive layer 4 forms the electrosensitive photosensitive layer 4 to a thickness of 1 to 10 mu m. Wherein the electrospinning comprises: an electric spray nozzle; and spraying the photosensitive polymer solution onto the seed layer (1) by spraying the photosensitive polymer solution with the electric spray nozzle with the electric power source applied to the seed layer (1) The radiation-sensitive layer 4 is formed.

Since the electrospinning contains electric charge in the photosensitive polymer to be injected, the photosensitive polymer solution is sprayed and is not agglomerated and smoothly dispersed, so that the electrosensitive photosensitive layer 4 can be formed with a thin film having a thickness of 5 탆 or less.

Since the electrospinning layer 4 is formed on the seed layer 1 with the electric power applied to the seed layer 1, The fibers are uniformly applied to the seed layer 1 by a potential difference, and strongly adhered and applied.

When the electrospinning photosensitive layer 4 is formed by electrospinning, the electrospinning photosensitive layer 4 applied by electrospinning must be cured. The electrospinning photosensitive layer 4 is cured by ultraviolet (UV) curing, laser Curing, ebeam curing or the like.

The step of forming the circuit pattern hole (S300) forms the circuit pattern hole by patterning the electrosensitive layer (4) in the shape of a touch sensing circuit pattern (20) designed as a touch sensing circuit.

That is, the step (S300) of forming the circuit pattern hole is performed by exposing the electrosensitive photosensitive layer 4 with the mask 5 covering only the portion where the circuit pattern hole 4b is formed, The circuit pattern hole 4b is formed in the electrosensitive photosensitive layer 4 by causing only the portion that is not cured by exposure and is masked by the mask 5 to be dissolved by the developing solution.

The electrosensitive photosensitive layer 4 is an example in which a portion exposed by exposure is changed to an insoluble state in which it is not dissolved by a developing solution.

That is, in the step of exposing, a portion of the electroosmotic photosensitive layer 4 not covered by the mask 5, that is, a portion not subjected to light so that only a portion irradiated with light is not dissolved by the developer, To be dissolved.

In the process of developing with the developer, only the part corresponding to the circuit pattern hole 4b, which is not insoluble in the electrically-radiation-sensitive layer 4 but is in the usable state, is removed from the circuit pattern hole 4b .

The plating step S400 may be performed by electrolytic plating or electroless plating of gold (Au), silver (Ag), or copper (Cu), and the circuit pattern hole 4b may be formed by electrolytic plating or electroless plating. The plating layer 2 is formed. The plating step S400 may be performed by forming the plating layer 2 in the circuit pattern hole 4b with the electrosensitive photosensitive layer 4 as a barrier so that the plating layer 2 is formed only on the seed layer 1, The plating layer 2 is not formed on the side surface of the seed layer 1 to form a plating layer 2 having a fine line width that matches the line width of the circuit pattern hole 4b.

The etching step S500 may include removing the electrosensitive photosensitive layer 4 and etching the seed layer 1 with the plating layer 2 as a barrier so that the seed layer 1 covers the plating layer 2 And a line width corresponding to the line width. That is, in the step of etching (S500), the plating layer (2) is used as a barrier to remove the touch sensing circuit pattern portion from the seed layer (1).

Therefore, it is possible to form the circuit pattern 20 for touch sensing having the correct line width coinciding with the circuit pattern hole 4b.

4 and 5, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes: forming the seed layer 1 (S100) (S110) forming a plating-affinity layer (3) on the seed layer (1) before the forming step (S200).

The electrosensitive photosensitive layer 4 is formed on the seed layer 1 on the upper surface of the plating-friendly layer 3.

The step S110 of forming the plating affinity layer 3 may include a step of forming the plating affinity layer 3 by using a metal such as copper , And palladium (Pd) powder may be coated on the seed layer (1) and dried to form the plating-friendly layer (3). Alternatively, the plating-friendly layer (3) The layer 3 may be formed.

The step of forming the plating-friendly layer 3 (S110) comprises forming the plating-friendly layer 3 on the seed layer 1 by printing, preferably gravure printing, on the conductive ink or conductive paste containing the plating- As an example.

The seed layer (1) and the plating affinity layer (3) may be fired together. For example, the seed layer 1 is formed by printing with conductive ink or conductive paste, followed by drying, and the plating affinity layer 3 is printed on the seed layer 1 with conductive ink or conductive paste to form Dried, and fired, the seed layer 1 and the plating-friendly layer 3 can be simultaneously fired.

In addition, the step (S110) of forming the plating-friendly layer 3 may form the plating-friendly layer 3 by vacuum deposition.

The vacuum deposition may be one of evaporation, ebeam deposition, laser deposition, sputtering, and arc ion plating, for example. The step (S110) of forming the plating affinity layer 3 may include forming a plating affinity layer 3 on the substrate 1 by using a metal such as Cu, Ni, Ag, Au, Sn, Al, It is preferable to form the plating-friendly layer 3 on the seed layer 1 by vacuum-depositing any one of them.

The vacuum deposition can easily form the plating affinity layer 3 on the deposited thin film layer 1, simplifying the manufacturing process, reducing the manufacturing cost, and controlling the fine thickness of the plating affinity layer 3 It is easy.

The step S200 of forming the electroscopic photosensitive layer 4 forms the electroscopic photosensitive layer 4 on the upper surface of the plating affinity layer 3 and the other embodiments are the same as described above, It is omitted.

It is to be noted that the embodiment of forming the circuit pattern hole (S300) is the same as that described above and is omitted as a duplicate substrate.

The plating step S400 may be performed by electrolytic plating or electroless plating of gold (Au), silver (Ag), or copper (Cu), and the circuit pattern hole 4b may be formed by electrolytic plating or electroless plating. The plating layer 2 is formed. The plating step S400 may be performed by forming the plating layer 2 with the electrosensitive photosensitive layer 4 as a barrier in the circuit pattern hole 4b to form the seed layer 1 and the plating- 3), and the plating layer 2 is not formed on the side surfaces of the seed layer 1 and the plating-friendly layer 3, so that the plating layer 2 is not formed around the side surfaces of the seed layer 1 and the plating- Thereby forming a plating layer 2 having a fine line width.

The etching step S500 may include removing the electrosensitive photosensitive layer 4 and etching the plating affinity layer 3 and the seed layer 1 using the plating layer 2 as a barrier, So that the layer (3) and the seed layer (1) have a line width corresponding to the plating layer (2).

Therefore, it is possible to form the circuit pattern 20 for touch sensing having the correct line width coinciding with the circuit pattern hole 4b.

6 and 7, a method of manufacturing a touch sensor for a touch screen panel according to another embodiment of the present invention includes forming a seed layer 1 on a transparent substrate 10 (S100) A step S200 of forming an electroscopic photosensitive layer 4 by electrospinning on the seed layer 1, a step S310 of removing the other part of the electrosensitive photosensitive layer 4, An etching step S320 for removing the remaining portion of the seed layer 1 except for the touch sensing circuit pattern portion and the step of forming the seed layer 1 left on the transparent substrate 10 in the etching step S320. (S400).

It is to be noted that the embodiment of forming the seed layer 1 (S100) and the step S200 of forming the electrosensitive layer (4) are omitted from the overlapping substrate as described above.

(S310) of removing only the portion of the circuit pattern for touch sensing in the electroscopically sensitive layer (4) by exposing and developing the electroscopically sensitive layer (4) A cover pattern 4c corresponding to the circuit pattern for touch detection is formed, and the remaining portion is removed.

More specifically, the step S310 of leaving only the part of the circuit pattern for touch sensing and removing the other part (S310) may include a step of forming a mask 5a having a pattern hole 5a corresponding to the circuit pattern for touch sensing on the electrosensitive layer 4 (5) covers the electrosensitive photosensitive layer (4) and exposes it to light to cure only the portion to which the light is applied so as not to be dissolved by the developer, and the light-free portion is dissolved by the developer. That is, only the portion corresponding to the pattern hole 5a, that is, the cover pattern 4c, is left in the electrosensitive layer 4 and the remaining portion is dissolved and removed by the developer.

In the etching step, the cover pattern 4c is used as a barrier to remove the portion of the seed layer 1 excluding the touch-sensitive circuit pattern portion.

Also, after the etching step, the cover pattern 4c stacked on the seed layer 1 etched before the plating step is removed.

The plating step S400 may be performed by electrolytically plating or electroless plating gold (Au), silver (Ag), or copper (Cu) on the seed layer 1 that is etched to correspond to the circuit pattern for touch sensing For example.

8 and 9, a method for fabricating a touch sensor for a touch screen panel according to an embodiment of the present invention includes: forming a seed layer 1 (S100) (S110) of forming a plating affinity layer (3) on the layer (1).

It is to be noted that the embodiment of forming the plating affinity layer 3 (S110) is the same as that described above and is omitted as a duplicate substrate.

In the etching step S320, the plating-friendly layer 3 and the seed layer 1 are removed except for the touch-sensitive circuit pattern portion, and a detailed method is omitted for the overlapping substrate described above .

The plating step S400 may be performed by plating the plating affinity layer 3 on the seed layer 1 to cover the plating affinity layer 3 and the seed layer 1 The plating layer 2 is formed, and gold (Au), silver (Ag), or copper (Cu) is electroplated or electrolessly plated.

The touch sensor for a touch screen panel according to the present invention is manufactured by the method for manufacturing a touch sensor for a touch screen panel according to the present invention.

10 to 13, a touch sensor for a touch screen panel according to an embodiment of the present invention is provided on a transparent substrate 10 and the transparent substrate 10, And a circuit pattern 20 for touch sensing formed thereon.

The touch-sensing circuit pattern 20 is formed to have a fine width that can not be recognized by a human eye, and has a line width of 15 mu m or less, preferably 3 mu m or less.

It is to be noted that the embodiment of the transparent substrate 10 is omitted as a duplicated substrate as described above.

The touch sensing circuit pattern 20 includes a seed layer 1; And a plating layer (2) which is plated and laminated on the seed layer (1).

The seed layer 1 is formed of a conductive ink or a conductive paste and has a light reflectance of 30% or less.

The seed layer 1 may be formed of a conductive ink or a conductive paste.

It is preferable that the conductive ink or the conductive paste has a role of reducing the diffuse reflection of light by forming the seed layer 1 in a black color system.

The conductive powder may be at least one selected from the group consisting of Cr powder, Mo powder, Ti powder, W powder, NiCr powder, Powder, a titanium tungsten alloy (TiW) powder, a silver powder, a copper powder, a gold powder, and an aluminum powder. It is to be noted that the conductive ink or the conductive paste includes at least one of conductive powders having excellent conductivity, and the conductive ink or the conductive paste may be mixed with two conductive powders.

The conductive ink or the conductive paste may include a black conductive powder and a blackening agent, and the conductive powder may be at least one of silver powder, copper powder, gold powder, and aluminum powder.

Also, the blackening agent is contained in the conductive ink or conductive paste so that the conductive ink or the conductive paste has a light reflectance of 30% or less. The black ink may contain at least one of carbon black (carbon black) And it is preferable that the conductive ink or the conductive paste is a black color, that is, any one capable of forming a light reflectance of 30% or less can be applied and excellent conductivity is more preferable.

The conductive ink may be at least one of a carbon black ink and a carbon nanotube ink, and the conductive paste may be at least one of a carbon black paste and a carbon nanotube paste.

The seed layer 1 is formed by drying or firing a conductive ink or a conductive paste. It is preferable that the seed layer 1 is made to lower the resistance by firing the conductive ink or the conductive paste to increase the adhesion with the substrate.

The seed layer 1 may be a deposited thin film layer formed through vacuum deposition and the deposited thin film layer may be made of chromium (Cr). Examples of the seed layer include molybdenum (Mo), titanium (Ti) (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), copper (Cu), or a mixture of at least two of the alloys (TiW) Or an alloy including at least one of them. The metal thin film layer 2 uses a metal having excellent adhesion with the substrate 1 for the touch screen panel and minimizing light scattering.

The deposited thin film layer is deposited on the transparent substrate 10 by vacuum deposition and has a strong adherence to the transparent substrate 10 so that it is not separated from the transparent substrate 10 by bending deformation of the transparent substrate 10, It can be kept attached to the transparent substrate 10.

Preferably, the deposited thin film layer uses a deep color metal that absorbs light, and more preferably, a black color after the deposition, that is, a metal having a light reflectance of 30% or less is preferably used.

The deposited thin film layer has a light reflectance of 30% or less to minimize scattering of light to increase transparency and prevent glare, thereby improving the visibility of the touch screen panel.

The seed layer 1 preferably has a thickness of 500 Å to 10,000 Å, and the seed layer 1 has a thickness of 1000 Å.

Preferably, the seed layer 1 is thermally deposited copper, and the copper (Cu) is plated-friendly and has a strong bonding force with the plating layer 2 as well as a black color upon thermal deposition.

The seed layer (1) is an oxide film or may be a nitride film, and the oxide is titanium oxide (TiO _2), chromium (CrO _2), copper oxide (CuO), nickel (NiO), alumina oxide (Al ₂ O ₃ ) And silver oxide (AgO), and the nitride film is one example of titanium nitride (TiN) or copper nitride (CuN).

The plating layer 2 may be one of gold (Au), silver (Ag) and copper (Cu), and may be an alloy containing at least one of gold (Au), silver (Ag) Lt; / RTI >

The plating layer 2 serves to lower the resistance of the circuit pattern 20 for touch sensing and to adjust the overall resistance of the circuit pattern 20 for touch sensing to a low level. ) Can be adjusted.

10 and 11, the touch sensing circuit pattern 20 includes a seed layer 1; And a plating layer (2) formed by plating on the seed layer (1). The plating layer 2 is formed on the seed layer 1 so as to cover only the top surface of the seed layer 1 except for the periphery of the seed layer 1.

The plating layer 2 is formed so as to cover only the upper surface of the seed layer 1 except for the periphery of the seed layer 1 and to be laminated on the seed layer 1, The resistance of the circuit pattern 20 can be adjusted.

The plating layer 2 is formed to cover only the upper surface of the seed layer 1 except the periphery of the seed layer 1 so that it does not affect the line width of the circuit pattern 20 for the touch sensing, The fine line width can be precisely realized with the designed line width, and it is possible to adjust the resistance so that the resistance within the allowable range can be precisely satisfied at the same time.

12 and 13, the plating layer 2 is formed to surround the outer periphery of the seed layer 1, and has a shape covering the surface and both sides of the seed layer 1, for example. It is possible.

11 and 13, the touch sensing circuit pattern 20 according to the present invention further includes a plating affinity layer 3 laminated between the seed layer 1 and the plating layer 2 .

The plating affinity layer 3 can smoothly coat the seed layer 1 and increase the bonding force between the plating layer 2 and the seed layer 1 to increase the bonding strength between the plating layer 2 and the seed layer 1, The durability is further improved and the shape of the circuit pattern 20 for touch detection can be maintained even in the deformation of the transparent substrate 10 such as the warpage of the transparent substrate 10. [

The plating friendly layer 3 may be formed of a conductive ink containing a plating-friendly metal powder or an electroconductive paste. The plating-friendly metal powder may be copper (Cu), nickel (Ni), silver (Ag) (Au), tin (Sn), aluminum (Al), and palladium (Pd), and at least two powders may be used in combination.

The plating-friendly layer 3 is formed by drying or firing a conductive ink or a conductive paste containing a plating-friendly metal powder.

The plating-friendly layer 3 is preferably formed of a conductive ink or conductive paste containing a metal powder having a strong affinity to the metal forming the plating layer 2, preferably the same metal as the metal forming the plating layer 2 Do.

The plating affinity layer 3 may be formed by vacuum depositing any one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd) Or the like.

11, the plating layer 2 is formed on the surface of the plating-friendly layer 3 and the periphery of the seed layer 1, that is, the side of the plating layer 3 and the side of the seed layer 1, Sensitive circuit pattern 20, the fine line width can be precisely realized with the line width determined at the time of designing, so that the resistance within the permissible range at the same time The resistance can be adjusted to meet the exact requirement.

13, the plating affinity layer 3 is laminated on the seed layer 1, and the plating layer 2 is formed by laminating the plating affinity layer 3 and the seed layer 1 Shape. More specifically, the surface and both sides of the plating-affinity layer 3, and both side surfaces of the seed layer 1, respectively.

14, the touch sensing circuit pattern 20 is formed in a circuit shape capable of sensing a touch, and includes an X-axis sensing circuit portion 21 including a plurality of X- Axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the Y-axis direction.

Wherein the transparent substrate 10 includes a first transparent substrate 12 and a second transparent substrate 13 and the touch sensing circuit pattern 20 is provided on the first transparent substrate 12, Axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced in the Y-axis direction and a plurality of Y-axis electrodes spaced longitudinally from the second transparent substrate 13, As an example.

A plurality of X-axis electrodes spaced in the lateral direction and a plurality of Y-axis electrodes spaced in the longitudinal direction are connected to an external circuit through a silver trace electrode, and an electrostatic multi-touch control unit is exemplified as the external circuit. The multi-touch control unit is electrically connected to the main process of the corresponding electronic device.

The X-axis electrode and the Y-axis electrode are formed in a rhombic metal mesh shape. The X-axis sensing circuit portion 21 has a plurality of X-axis electrodes formed in a rhombic metal mesh shape electrically connected to each other And the Y-axis sensing circuit portion 22 has a plurality of Y-axis electrodes formed in a rhombic metal mesh shape electrically connected to each other.

15, the touch sensing circuit pattern 20 includes an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced apart from each other on one of both surfaces of the transparent substrate 10, Axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction and provided on the other of the two surfaces of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are provided on both sides of the transparent substrate 10 to reduce the material cost, reduce the thickness of the touch screen panel, The weight can be reduced.

16, an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced apart in the lateral direction, which is the touch sensing circuit pattern 20, and a plurality of Y- The sensing circuit portion 22 may be formed on the same surface of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed on either side of the transparent substrate 10 to reduce the material cost and improve the optical characteristics. And the weight of the touch screen panel can be reduced.

The method for manufacturing a touch sensor for a touch screen panel according to the present invention is characterized in that the X-axis sensing circuit portion 21 or the Y-axis sensing circuit portion 22 is formed on a transparent substrate 10, Axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 may be formed on one surface of the transparent substrate 10 and the X-axis sensing circuit portion 21 and the Y- Axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 may be formed on one side of the transparent substrate 10 and the X side sensing circuit portion 22 may be formed on the opposite side of the transparent substrate 10, Axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 may be formed.

17 to 21, an embodiment of a touch screen panel to which a touch sensor for a touch screen panel of the present invention is applied includes a display panel unit 30 for outputting a screen; And a touch screen panel cover base material (11) covering and protecting a screen of the display panel unit (30); And a touch sensing circuit pattern 20 interposed between the display panel unit 30 and the touch screen panel cover substrate 11 and configured to sense a touch on the touch screen panel.

The touch-sensing circuit pattern 20 is formed to have a fine width that can not be recognized by a human eye, and has a line width of 15 mu m or less, preferably 3 mu m or less.

The touch screen panel cover base material 11 may be a tempered glass made of a transparent base material 10 or a reinforced coating film having a hard coating layer formed on the surface of the film base material. The pattern 20 includes the seed layer 1, the plating-affinity layer 3, and the plating layer 2, and the embodiments thereof are described above as being described above, but the overlapping substrate is omitted.

17, a touch screen panel according to an exemplary embodiment of the present invention includes a first transparent substrate 30, which is spaced apart from the display panel unit 30 and the touch screen panel cover substrate 11, (12) and a second transparent substrate (13), wherein the touch sensing circuit pattern (20) is formed on the first transparent substrate (12) and includes a plurality of X- Axis sensing circuit portion 22 including a plurality of Y-axis electrodes provided in the axis sensing circuit portion 21 and the second transparent substrate 13 and spaced longitudinally.

A first transparent substrate 12 spaced apart from the display panel unit 30, the touch screen panel cover substrate 11, the display panel unit 30, and the touch screen panel cover substrate 11; The second transparent substrate 13 is adhered to each other with a transparent adhesive layer 40, and the transparent adhesive layer 40 is an OCA (Optically Clear Adhesive) OCA film.

The transparent adhesive layer 40 is formed between the touch screen panel cover base material 11 and the first transparent material 12, between the first transparent material 12 and the second transparent material 13, And is interposed between the display panel unit 30 and the second transparent substrate 13, respectively.

18, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover substrate 11, The X-axis sensing circuit unit 21 includes a plurality of X-axis electrodes spaced apart from each other and disposed on either one of the touch screen panel cover substrate 11 and the transparent substrate 10, And a Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced apart from each other and provided on the other side of the touch screen panel cover substrate 11 and the transparent substrate 10 .

One surface of the touch screen panel is provided with one of the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 and the X-axis sensing circuit portion 21 and the Y And the other one of the axis sensing circuit portions 22 is provided.

The transparent substrate 10 spaced apart from the display panel unit 30, the touch screen panel cover substrate 11, the display panel unit 30, and the touch screen panel cover substrate 11 is transparent And the transparent adhesive layer 40 is an OCA (Optically Clear Adhesive) OCA film.

The transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

19, the touch sensing circuit pattern 20 includes an X-axis sensing circuit unit including a plurality of X-axis electrodes spaced apart from each other in a lateral direction and provided on one surface of the touch screen panel cover base material 11 21 and a Y-axis sensing circuit 22 including a plurality of longitudinally spaced Y-axis electrodes.

The touch sensing circuit pattern 20 is formed on the one surface of the touch screen panel cover base material 11 so that the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed together, The thickness of the touch screen panel can be reduced, and the weight of the touch screen panel can be reduced.

The display panel unit 30 and the touch screen panel cover substrate 11 are attached to each other with a transparent adhesive layer 40 and the transparent adhesive layer 40 is an OCA optically clear adhesive (OCA) film.

20, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover base material 11, The sensing circuit pattern 20 includes an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced laterally and a Y-axis sensing circuit portion 22 including a plurality of Y- And the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 may be formed on the same surface of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed on the same surface of the transparent substrate 10 to reduce the material cost and improve the optical characteristics , The thickness of the touch screen panel can be reduced, and the weight of the touch screen panel can be reduced.

A transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

21, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover base material 11, The circuit pattern 20 is provided on the other surface of the transparent substrate 10 and includes an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced apart in a lateral direction, Axis sensing circuit portion 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction.

A transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are provided on both sides of the transparent substrate 10 to reduce the material cost, reduce the thickness of the touch screen panel, The weight can be reduced.

The X-axis sensing circuit portion 21 or the Y-axis sensing circuit portion 22, which is the touch sensing circuit pattern 20 of FIGS. 6 to 21, includes a seed layer 1 formed on a transparent substrate 10; And a plating layer 2 formed by plating on the seed layer 1 and a plating affinity layer 3 stacked between the seed layer 1 and the plating layer 2. [

It is noted that the embodiments of the seed layer (1), the plating layer (2) and the plating-friendly layer (3) are omitted as described above.

The present invention has the effect of easily forming a fine circuit with a thickness of 5 탆 or less on a substrate for a touch screen panel by using electrospinning.

In addition, the present invention simplifies the process of forming a circuit pattern for touch sensing through a photolithography process, thereby reducing manufacturing cost and improving productivity.

The present invention is capable of adjusting the resistance of a circuit pattern for touch sensing and relieving scattering of light, thereby securing the reliability of the product through stable touch speed and multi-touch.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. will be.

1: seed layer 2: plated layer
3: plating-friendly layer 4: electrospinning photosensitive layer
10: transparent substrate 11: touch screen panel cover substrate
12: first transparent substrate 13: second transparent substrate
20: Circuit pattern for touch detection 21: X-axis sensing circuit
22: Y-axis sensing circuit unit 30: Display panel unit
40: transparent adhesive layer

Claims (18)

Forming a seed layer on the transparent substrate;
Forming an electrospun photosensitive layer on the seed layer by electrospinning;
Forming a circuit pattern hole in the form of a circuit pattern for touch sensing on the electrosensitive layer;
Plating the circuit pattern hole to form a plating layer; And
And etching the part of the seed layer so as to form a circuit pattern for touch detection by removing the electrosensitive photosensitive layer,
Wherein the forming of the seed layer comprises coating a conductive ink or conductive paste having a light reflectance of 30% or less on the transparent substrate. Forming a seed layer on the transparent substrate;
Forming an electrospun photosensitive layer on the seed layer by electrospinning;
Removing the other part of the electrosensitive photosensitive layer while leaving only the portion of the circuit pattern for touch detection;
An etching step of removing remaining portions of the seed layer except for a portion of the circuit pattern for touch sensing; And
And plating the seed layer remaining on the transparent substrate in the etching step,
Wherein the forming of the seed layer comprises coating a conductive ink or conductive paste having a light reflectance of 30% or less on the transparent substrate. delete 3. The method according to claim 1 or 2,
Wherein the forming of the seed layer comprises printing the entire surface of the transparent substrate with gravure printing to form the seed layer. 3. The method according to claim 1 or 2,
The step of forming the seed layer may include a step of drying the conductive ink or the conductive paste applied on the transparent substrate or a step of drying and firing the conductive ink or the conductive paste applied on the transparent substrate A method of manufacturing a touch sensor for a touch screen panel. 3. The method according to claim 1 or 2,
Wherein the conductive ink or the conductive paste includes a conductive powder,
The conductive powder may include at least one of a Cr powder, a Mo powder, a Ti powder, a W powder, a NiCr powder, and a Ti tungsten alloy powder. Wherein the touch sensor is a touch sensor. 3. The method according to claim 1 or 2,
Wherein the conductive ink or the conductive paste includes a conductive powder and a blackening agent. 8. The method of claim 7,
Wherein the blackening agent comprises at least one of carbon black and carbon nanotubes. 3. The method according to claim 1 or 2,
Wherein the conductive ink is at least one of a carbon black ink and a carbon nanotube ink,
Wherein the conductive paste is at least one of a carbon black paste and a carbon nanotube paste. 3. The method according to claim 1 or 2,
Wherein the forming of the seed layer comprises forming a deposited thin film layer through deposition. 11. The method of claim 10,
Wherein the deposition is performed by any one of evaporation, ebeam deposition, laser deposition, sputtering, and arc ion plating. Way. 11. The method of claim 10,
Wherein the deposited thin film layer is any one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW) A method of manufacturing a touch sensor for a screen panel. 11. The method of claim 10,
Wherein the step of forming the deposited thin film layer comprises thermally depositing copper (Cu). 3. The method according to claim 1 or 2,
Wherein the forming of the seed layer comprises sputtering a target material in an oxygen gas atmosphere or a nitrogen gas atmosphere to form an oxide film or a nitride film on one surface of the transparent substrate. 3. The method according to claim 1 or 2,
And forming a plating-affinity layer on the seed layer before forming the electrosensitive photosensitive layer after the step of forming the seed layer. 16. The method of claim 15,
The step of forming the plating affinity layer may include a step of forming a plating-friendly layer by depositing a plating layer on the substrate, the plating layer being formed of a material selected from the group consisting of Cu powder, Ni powder, Ag powder, Au powder, Sn powder, Al powder, And a conductive paste containing at least one of the conductive ink and the conductive paste is applied on the seed layer and dried. 16. The method of claim 15,
Wherein the step of forming the plating affinity layer forms the plating affinity layer by vacuum deposition. 16. The method of claim 15,
The step of forming the plating affinity layer may be performed by vacuum depositing any one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd) And forming a plating affinity layer on the seed layer.

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