KR101616493B1 - Touch Sensor for Touch Screen Panel and Manufacturing Method Thereof - Google Patents

Abstract

The present invention relates to a touch sensor for a touch screen panel, a method of manufacturing the touch sensor panel, and a touch screen panel including the touch sensor panel. The touch sensor panel includes a transparent substrate, a primer layer for increasing adhesion with the transparent substrate, The deposited conductive layer is etched to form a circuit pattern for touch sensing by removing the circuit pattern portion for touch sensing, thereby enhancing the adhesion of the circuit pattern for touch sensing with the transparent substrate It is possible to precisely form a circuit pattern for touch detection having a fine line width of 3 mu m or less which is not visually recognizable by a human eye and to increase the durability of a circuit pattern for touch detection and to form a circuit pattern for touch detection without further plating This simplifies manufacturing cost and improves productivity.

Description

Technical Field [0001] The present invention relates to a touch sensor for a touch screen panel,

The present invention relates to a touch sensor for a touch screen panel, and more particularly, to a touch sensor for a touch screen panel, which forms a circuit pattern for touch sensing with enhanced adhesion to a transparent substrate, And a manufacturing method thereof.

Generally, a touch screen panel is manufactured by attaching a touch sensor having a transparent electrode to a transparent glass to a cover glass.

The touch sensor is manufactured by coating a transparent film with an electrode material, for example, ITO (Indium Tin Oxide) on one surface, and forming a sensing electrode by an etching process.

1, the touch screen panel 1 includes two touch sensors 1c and a tempered glass 1d covering the touch sensor 1c using a transparent adhesive layer 1b on a display panel 1a. Are stacked in this order.

That is, in a typical touch screen panel, two touch sensors for a touch screen panel in which an ITO sensing electrode is formed on a film substrate and a GFF system using a tempered glass 1d are mainly used. An X-axis sensor or a Y-axis sensor is formed on each of the two sensors.

However, in the conventional touch sensor for a touch screen panel in which a sensing electrode is formed of ITO on a film substrate, the resistance of the ITO (Indium Tin Oxide) electrode is high in a screen of 13 inches or more.

In addition, indium, which is a main material of indium tin oxide (ITO), is depleted in rare elements, and due to limited reserves, the price is high, which causes the manufacturing cost of the touch screen panel to increase.

In addition, ITO (Indium Tin Oxide) electrodes are difficult to apply a flexible substrate at a high process temperature, and cracks are frequently generated due to poor mechanical properties, which is unsuitable for use in a flexible display.

In addition, when dry deposition is performed, wastewater generated by the etching process is discharged to cause environmental pollution, and indium is diffused into the organic layer when the OLED is applied.

In particular, ITO (Indium Tin Oxide) electrodes on a 13 inch or larger touch screen panel have a problem of excessive power consumption due to high resistance.

In addition, a touch sensor can be manufactured by forming AgNW (Silver nano Wire) on the entire surface of a transparent film and forming a transparent electrode by etching. When a transparent electrode is formed using AgNW (Silver nano Wire) The touch speed is excellent but the transparency is low.

In addition, most conventional touch sensors undergo a process such as exposure, development, and etching. In this case, scratches or the like are generated on the substrate of the transparent film, and optical deterioration due to such damage occurs.

In addition, since the conventional touch screen panel includes two touch sensors 1c each having an X-axis sensor and a Y-axis sensor formed on a transparent film, the manufacturing process is complicated, the manufacturing cost is high and the thickness is slim .

Korean Patent Laid-Open Publication No. 2013-0131647 discloses an electrode-window integrated touch screen panel and a touch screen display device including the touch screen panel.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a touch sensing circuit pattern having a fine line width, And to provide a touch sensor for a touch screen panel and a method of manufacturing the touch sensor, which increases the durability and secures reliability of operation of the product through stable touch speed and multi-touch.

According to an aspect of the present invention, there is provided a touch sensor for a touch screen panel, including: a transparent substrate; And

And a touch sensing circuit pattern formed on the transparent substrate and configured to sense a touch on the touch screen panel,

The touch-sensitive circuit pattern may include:

A primer layer adhered on the transparent substrate; And

And a deposition conductive layer formed by being deposited on the primer layer.

According to an aspect of the present invention, there is provided a method of manufacturing a touch sensor for a touch screen panel, the method comprising: forming a primer layer on the transparent substrate to increase adhesion with the transparent substrate;

Forming a deposition conductive layer on the primer layer by vapor deposition;

And etching the conductive layer for removing the touch sensing circuit pattern portion from the deposited conductive layer.

In the present invention, the primer layer may be acrylic polyurethane.

In the present invention, the primer layer may be formed with a reflectance of 30% or less by including a pigment in the primer resin material.

In the present invention, the deposition conductive layer may be formed of any one of copper (Cu), silver (Ag), gold (Au), aluminum (Al), copper (Cu), silver (Ag) Al). ≪ / RTI >

In the present invention, the touch sensing circuit pattern may further include a deposition seed layer formed between the primer layer and the deposition conductive layer and having a light reflectance of 30% or less by vapor deposition.

In the present invention, the deposition seed layer may be any one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr), and titanium tungsten alloy And may be an alloy containing at least one of Mo, Ti, W, Ni, NiCr, and TiW.

In the present invention, the deposition seed layer may be an oxide film or a nitride film.

In the present invention, the oxide film may be any one of titanium oxide (TiO ₂ ), chromium oxide (CrO ₂ ), copper oxide (CuO), nickel oxide (NiO), aluminum oxide (Al ₂ O ₃ ), and silver oxide have.

The present invention can enhance the adhesion of a circuit pattern for touch sensing with a transparent substrate to precisely form a circuit pattern for touch detection having a fine line width of 3 μm or less without visibility by a human eye, It has an effect of increasing durability.

The present invention ensures reliable operation of the product through stable touch speed and multi-touch, and it can be stably applied to a flexible display because the circuit pattern for touch detection is not damaged even in a warp deformation, and a stable touch speed of a flexible display and a multi- The operation reliability of the product can be secured.

The present invention has the effect of forming a circuit pattern for touch detection without additional plating, simplifying the process, reducing manufacturing cost, and improving productivity.

1 is a view showing an example of a conventional touch screen panel
2 is a cross-sectional view illustrating an embodiment of a touch sensor for a touch screen panel according to the present invention.
3 is a cross-sectional view showing another embodiment of a touch sensor for a touch screen panel according to the present invention
4 is a perspective view illustrating a touch sensor for a touch screen panel according to an embodiment of the present invention.
5 and 6 are sectional views showing another embodiment of the touch sensor for a touch screen panel according to the present invention
7 to 11 are schematic views illustrating an embodiment of a touch screen panel according to the present invention.
12 is a flow chart illustrating a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention.
13 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention,
14 is a flowchart showing another embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention
15 is a schematic view of a method of manufacturing a touch sensor for a touch screen panel according to the present invention shown in Fig.

The present invention will now be described in detail with reference to the accompanying drawings. Hereinafter, a repeated description, a known function that may obscure the gist of the present invention, and a detailed description of the configuration will be omitted. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

The line width and the interval between the touch-sensing circuit patterns 20 shown in FIGS. 2 to 15 are shown for clarification of the configuration of the present invention, and are different from actual ones. The touch sensing circuit pattern 20 may be variously modified so as to have an interval with a fine line width having transparency invisible in an actual touch screen panel in the manufacturing method and the touch sensor for a touch screen panel manufactured thereby .

2 and 3 are sectional views showing a touch sensor according to an embodiment of the present invention. Referring to FIG. 2, a touch sensor for a touch screen panel according to an embodiment of the present invention includes a transparent substrate 10, And a touch sensing circuit pattern 20 formed on the transparent substrate 10 and configured to sense a touch on the touch screen panel.

The touch-sensing circuit pattern 20 is formed to have a fine width that can not be recognized by a human eye, and has a line width of 15 mu m or less, preferably 3 mu m or less.

The transparent substrate 10 may be a transparent PI film or may be one of a PEN (polyethylene naphthalate) film, a PET (polyethylene terephthalate) film, a PC (Polycarbonate) film and a PSS A transparent plastic film such as engineering plastic can be used.

The transparent substrate 10 may be a tempered glass or a reinforced coating film in which a reinforcing coating layer for increasing hardness is formed on the surface of a film substrate. The film substrate may be a transparent PI film, or may be one of PEN (Polyethylene Naphthalate) film, PET (polyethylene terephthalate) film, PC (Polycarbonate) film and PSS (Poly styrene sulfonate) It should be noted that any modification capable of a reinforced coating can be carried out.

The reinforcing coating layer may be coated with a resin including silicon (Si) or ceramics, or may be a coating layer by vacuum deposition. In addition, the hardening of one side of the film substrate may be increased to increase the scratches and cracks It should be noted that any coating layer that enhances durability can be implemented.

Preferably, the reinforcing coating layer has a thickness of 0.3 mm or less so that the reinforcing coating layer can be applied to a flexible touch screen panel.

The transparent substrate 10 may be a touch screen panel cover substrate that covers and protects the screen of the display panel unit in the touch screen panel, and the touch screen panel cover substrate is preferably the tempered glass or the reinforced coating film .

The transparent substrate 10 may be formed by integrally forming a touch-sensitive circuit pattern 20 directly on one surface of the touch screen panel cover substrate with the touch screen panel cover substrate to reduce the thickness of the touch screen panel, Light weight.

In this case, one surface of the touch screen panel cover substrate is a surface facing the inner surface of the touch screen panel, that is, the display panel unit. When the touch screen panel cover substrate is mounted on the display panel unit, .

The touch-sensitive circuit pattern 20 includes a primer layer 1 for increasing adhesion with the transparent substrate 10 during deposition; And a deposition conductive layer formed by being deposited on the primer layer (1). The touch-sensing circuit pattern 20 is formed to have a fine width that can not be recognized by a human eye, and has a line width of 15 mu m or less, preferably 3 mu m or less.

The primer layer is sandwiched between the transparent substrate and the deposition conductive layer so that the deposition conductive layer is directly deposited on the transparent substrate while the deposition conductive layer is stuck more firmly on the transparent substrate .

The primer layer 1 is disposed between the deposition conductive layer 2 and the transparent substrate 10 so that the deposition conductive layer 2 is firmly adhered to the transparent substrate 10 For example, acrylic polyurethane.

It is preferable that the primer layer (1) contains a black pigment in a primer resin material to form a black color, that is, a reflectance of 30% or less. This is to improve the visibility of the touch screen panel by increasing the transparency and preventing the glare by minimizing light scattering by forming a light reflectance of 30% or less.

It is noted that the primer resin material is a heat-resistant liquid resin, and any resin material capable of enhancing the adhesion of the deposition conductive layer 2 on the transparent substrate 10 can be used.

The deposition conductive layer 2 is formed on the primer layer 1 through vacuum deposition and may be formed of copper (Cu), for example, silver (Ag), gold (Au), aluminum ) Or an alloy containing at least one of copper (Cu), silver (Ag), gold (Au), and aluminum (Al), or carbon nanotubes having excellent ductility.

3, the touch sensing circuit pattern 20 may further include a deposition seed layer 3 laminated between the primer layer 1 and the deposition conductive layer 2 and formed by vapor deposition desirable.

That is, the deposition conductive layer 2 is deposited on the primer layer 1 on the upper surface of the deposition seed layer 3.

Preferably, the deposition seed layer 3 is formed by vapor deposition, and it is preferable to use a deep-color metal that absorbs light. More preferably, the deposition seed layer 3 is formed of a conductive material containing a metal having a light reflectance of 30% .

The deposition seed layer 3 is formed with a light reflectance of 30% or less to minimize scattering of light to increase transparency and prevent glare, thereby improving the visibility of the touch screen panel.

The deposition seed layer 3 may be formed of one selected from the group consisting of molybdenum (Mo), titanium (Ti), tungsten (W), nickel (Ni) ) Or a titanium tungsten alloy (TiW), or at least one of molybdenum (Mo), titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr), and titanium tungsten alloy Alloy has a light reflectance of 30% or less, thereby reducing diffuse reflection of light, minimizing scattering of light to increase transparency, and preventing glare, thereby improving the visibility of the touch screen panel.

The deposition seed layer 3 may be an oxide film or a nitride film and the oxide film may be formed of titanium oxide (TiO ₂ ), chromium oxide (CrO ₂ ), copper oxide (CuO), nickel oxide (NiO) ₂ O ₃ ) or silver oxide (AgO), and the nitride film may be titanium nitride (TiN) or copper nitride (CuN).

The oxide film and the nitride film have a light reflectance of 30% or less, thereby reducing irregular reflection of light, minimizing scattering of light to increase transparency, and preventing glare, thereby improving the visibility of the touch screen panel.

4, the touch sensing circuit pattern 20 is formed in a circuit shape capable of sensing a touch, and includes an X-axis sensing circuit unit 21 including a plurality of X- Axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the Y-axis direction.

Wherein the transparent substrate 10 includes a first transparent substrate 12 and a second transparent substrate 13 and the touch sensing circuit pattern 20 is provided on the first transparent substrate 12, Axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced in the Y-axis direction and a plurality of Y-axis electrodes spaced longitudinally from the second transparent substrate 13, As an example.

A plurality of X-axis electrodes spaced in the lateral direction and a plurality of Y-axis electrodes spaced in the longitudinal direction are connected to an external circuit through a silver trace electrode, and an electrostatic multi-touch control unit is exemplified as the external circuit. The multi-touch control unit is electrically connected to the main process of the corresponding electronic device.

The X-axis electrode and the Y-axis electrode are formed in a rhombic metal mesh shape. The X-axis sensing circuit portion 21 has a plurality of X-axis electrodes formed in a rhombic metal mesh shape electrically connected to each other And the Y-axis sensing circuit portion 22 has a plurality of Y-axis electrodes formed in a rhombic metal mesh shape electrically connected to each other.

5, the touch sensing circuit pattern 20 includes an X-axis sensing circuit unit 21 including a plurality of X-axis electrodes spaced apart from each other on one of both surfaces of the transparent substrate 10, Axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction and provided on the other of the two surfaces of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are provided on both sides of the transparent substrate 10 to reduce the material cost, reduce the thickness of the touch screen panel, The weight can be reduced.

The X-axis sensing circuit portion 21 or the Y-axis sensing circuit portion 22 includes a deposition thin-film layer 1 formed through vapor deposition; And a plating layer 2 formed by plating on the circuit layer of the deposited thin film layer 1 and a plating affinity layer 3 laminated between the deposited thin film layer 1 and the plating layer 2 .

6, an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced apart in the lateral direction, which is the touch-sensing circuit pattern 20, and a plurality of Y- The sensing circuit portion 22 may be formed on the same surface of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed on either side of the transparent substrate 10 to reduce the material cost and improve the optical characteristics. And the weight of the touch screen panel can be reduced.

7 to 11, a touch screen panel according to an embodiment of the present invention includes a display panel unit 30 for outputting a screen image; And a touch screen panel cover base material (11) covering and protecting a screen of the display panel unit (30); And a touch sensing circuit pattern 20 interposed between the display panel unit 30 and the touch screen panel cover substrate 11 and configured to sense a touch on the touch screen panel.

The touch screen panel cover base material 11 may be a tempered glass with a transparent base material 10 or a reinforced coating film having a hard coating layer formed on the surface of the film base material.

7, a touch screen panel according to an exemplary embodiment of the present invention includes a first transparent substrate 12 disposed to be spaced apart from the display panel unit 30 and the touch screen panel cover substrate 11, (12) and a second transparent substrate (13), wherein the touch sensing circuit pattern (20) is formed on the first transparent substrate (12) and includes a plurality of X- Axis sensing circuit portion 22 including a plurality of Y-axis electrodes provided in the axis sensing circuit portion 21 and the second transparent substrate 13 and spaced longitudinally.

A first transparent substrate 12 spaced apart from the display panel unit 30, the touch screen panel cover substrate 11, the display panel unit 30, and the touch screen panel cover substrate 11; The second transparent substrate 13 is adhered to each other with a transparent adhesive layer 40, and the transparent adhesive layer 40 is an OCA (Optically Clear Adhesive) OCA film.

The transparent adhesive layer 40 is formed between the touch screen panel cover base material 11 and the first transparent material 12, between the first transparent material 12 and the second transparent material 13, And is interposed between the display panel unit 30 and the second transparent substrate 13, respectively.

8, the touch screen panel according to an exemplary embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover substrate 11, The X-axis sensing circuit unit 21 includes a plurality of X-axis electrodes spaced apart from each other and disposed on either one of the touch screen panel cover substrate 11 and the transparent substrate 10, And a Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced apart from each other and provided on the other side of the touch screen panel cover substrate 11 and the transparent substrate 10 .

One surface of the touch screen panel is provided with one of the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 and the X-axis sensing circuit portion 21 and the Y And the other one of the axis sensing circuit portions 22 is provided.

The transparent substrate 10 spaced apart from the display panel unit 30, the touch screen panel cover substrate 11, the display panel unit 30, and the touch screen panel cover substrate 11 is transparent And the transparent adhesive layer 40 is an OCA (Optically Clear Adhesive) OCA film.

The transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

9, the touch sensing circuit pattern 20 includes an X-axis sensing circuit unit including a plurality of X-axis electrodes spaced apart from each other in a lateral direction and provided on one surface of the touch screen panel cover base material 11 21 and a Y-axis sensing circuit 22 including a plurality of longitudinally spaced Y-axis electrodes.

The touch sensing circuit pattern 20 is formed on the one surface of the touch screen panel cover base material 11 so that the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed together, The thickness of the touch screen panel can be reduced, and the weight of the touch screen panel can be reduced.

The display panel unit 30 and the touch screen panel cover substrate 11 are attached to each other with a transparent adhesive layer 40 and the transparent adhesive layer 40 is an OCA optically clear adhesive (OCA) film.

10, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover base material 11, The sensing circuit pattern 20 includes an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced laterally and a Y-axis sensing circuit portion 22 including a plurality of Y- And the X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 may be formed on the same surface of the transparent substrate 10.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are formed on the same surface of the transparent substrate 10 to reduce the material cost and improve the optical characteristics , The thickness of the touch screen panel can be reduced, and the weight of the touch screen panel can be reduced.

A transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

11, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 spaced apart from the touch screen panel cover base material 11, The circuit pattern 20 is provided on the other surface of the transparent substrate 10 and includes an X-axis sensing circuit portion 21 including a plurality of X-axis electrodes spaced apart in a lateral direction, Axis sensing circuit portion 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction.

A transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

The touch screen panel cover base material 11 is integrally provided on one surface of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 to reduce material cost, provide high transparency, The thickness can be reduced, and the weight of the touch screen panel can be reduced.

The X-axis sensing circuit portion 21 and the Y-axis sensing circuit portion 22 are provided on both sides of the transparent substrate 10 to reduce the material cost, reduce the thickness of the touch screen panel, The weight can be reduced.

4 to 11, the X-axis sensing circuit portion 21 or the Y-axis sensing circuit portion 22, which is the touch sensing circuit pattern 20, is provided with a primer layer (not shown) for increasing the adhesion with the transparent substrate 10 One); And a deposition conductive layer (2) formed by being deposited on the primer layer (1), wherein the deposition seed layer (3) is laminated between the primer layer (1) and the deposition conductive layer It is possible.

It is to be noted that the embodiments of the primer layer 1, the deposition conductive layer 2 and the deposition seed layer 3 are omitted as described above.

12 and 13, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes a step of forming a primer layer (not shown) for increasing adhesion with the transparent substrate 10 (S200) forming a deposition conductive layer (2) on the primer layer (1) by vapor deposition; and forming a conductive layer (2) on the primitive layer (1) (Step S300).

The step of forming the primer layer 1 may include forming a primer layer 1 for enhancing adhesion between the substrate 10 for the touch screen panel and the deposition layer during the vacuum deposition, As shown in Fig. The primer layer (1) is an acrylic polyurethane.

The step (100) of forming the primer layer (1) is an example of applying the liquid primer agent and drying or heat-treating the primer agent to cure the primer agent.

It is preferable that the primer layer (1) includes a black pigment in a primer resin material so that a black color, that is, a reflectance of 30% or less is formed. This is to improve the visibility of the touch screen panel by increasing the transparency and preventing the glare by minimizing light scattering by forming a light reflectance of 30% or less.

It is noted that the primer resin material is a heat-resistant liquid resin, and any resin material capable of enhancing the adhesion of the deposition conductive layer 2 on the transparent substrate 10 can be used.

In the step S200 of forming the deposition conductive layer 2, the deposition conductive layer 2 may be formed by vacuum deposition. The vacuum deposition may be performed by evaporation, ebeam deposition, laser laser deposition, sputtering, or arc ion plating, as an example.

The step S200 of forming the deposition conductive layer 2 may be performed using a metal having high conductivity such as copper (Cu), silver (Ag), gold (Au), aluminum , An alloy containing at least one of gold (Au) and aluminum (Al), or a carbon nanotube having excellent ductility as a target material.

The step of etching (S300) comprises: a step (S310) of forming a photoresist layer (4) on the deposition conductive layer (2); A step S320 of exposing and developing the photoresist layer 4 to form a cover pattern 4a corresponding to the touch-sensitive circuit pattern 20 of the photoresist layer 4; (S330) of removing the portion of the conductive layer (2) and the primer layer (1) except for the portion of the circuit pattern for touch sensing (20) with the cover pattern (4a) as a barrier.

More specifically, in the step of forming the cover pattern 4a (S320), a mask 5 having a pattern hole 5a corresponding to the touch sensing circuit pattern 20 is formed on the photoresist layer 4 The photoresist layer 4 is covered and then exposed to light so as to cure only the portion to which the light is applied so as not to be dissolved by the developer, and the portion to which no light is applied is dissolved by the developer. That is, only the portion corresponding to the pattern hole 5a in the photoresist layer 4, that is, the cover pattern 4a is left, and the remaining portion is dissolved and removed by the developer.

The photoresist layer 4 may be formed by applying a dry film or photoresist liquid.

The photoresist layer 4 may be formed by any one of spraying, coater, gravure, and electrospinning.

The electrospinning forms the electrospun photoresist layer 4 to 1 to 10 mu m. Wherein the electrospinning comprises an electric spraying nozzle and spraying the photosensitive polymer solution with compressed air with the electric spraying nozzle while the electric power is applied to the primer layer (1) Thereby forming a radiation photoresist layer 4.

Since the electrospinning contains electric charges in the photosensitive polymer to be injected, the electrospun photoresist layer 4 can be formed of a thin film having a thickness of 5 탆 or less by dispersing the photosensitive polymer solution while being sprayed without aggregation.

In the electrospinning, since the electrospinning photoresist layer 4 is formed on the deposition conductive layer 2 with the electric power source applied to the deposition conductive layer 2, The resulting photosensitive resin is uniformly applied to the primer layer 1 by a potential difference, and strongly adhered and applied.

The electrospinning photoresist layer 4 applied with electrospinning should be cured when the electrospinning photoresist layer 4 is formed by electrospinning and the electrospinning photoresist layer 4 should be cured by ultraviolet (UV) Laser curing, ebeam curing, and the like.

The etching step S300 includes a step S340 of removing the cover pattern 4a stacked on the etching conductive layer 2 that has been etched.

12 and 13, a method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention includes forming the deposition conductive layer 2 after forming the primer layer 1 (S100) (S110) forming a deposition seed layer (3) on the primer layer (1) before the step (S200) of forming the seed layer (3).

The deposition seed layer 3 may be formed by depositing a seed layer 3 by a vacuum deposition method. The vacuum deposition may be performed by evaporation, ebeam deposition, laser laser deposition, sputtering, or arc ion plating, as an example.

The vacuum deposition may be performed using any one of molybdenum (Mo), titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr), and titanium tungsten alloy (TiW) An alloy containing at least one of titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr) and titanium tungsten alloy (TiW) is preferably used as a target material.

In the step of forming the deposition seed layer 3 (S110), the target material may be vacuum-deposited in an oxygen gas atmosphere or a nitrogen gas atmosphere to form an oxide film or a nitride film.

That is, the step of forming the deposition seed layer 3 (S110) may be performed by using any one of molybdenum (Mo), titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr), titanium tungsten alloy Or a metal such as an alloy containing at least any one of molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr) and titanium tungsten alloy (TiW) An oxide film or a nitride film may be formed on one surface of the transparent substrate 10 by sputtering in an atmosphere or a nitrogen gas atmosphere.

Step (S110), the titanium oxide (TiO _2), chromium (CrO _2), copper oxide (CuO), nickel (NiO), alumina oxide (Al ₂ O ₃₎ to form said depositing a seed layer (3) And an oxide such as silver oxide (AgO) may be sputtered with a target material to form an oxide film on one surface of the transparent substrate 10 and a nitride such as titanium nitride (TiN) or copper nitride (CuN) A nitride film may be formed on one surface of the transparent substrate 10 by sputtering.

This makes it possible to firmly and firmly attach the oxide film or the nitride film to the transparent substrate 10, and to easily form the oxide film or the nitride film on the one surface of the transparent substrate 10 with a predetermined thickness.

The deposition seed layer 3 has a reflectance of 30% or less, thereby eliminating light reflection phenomenon and reducing irregular reflection of light, thereby improving the visibility. In addition, the deposition seed layer 3 is formed of the deposition conductive layer 2 and the transparent substrate 10, .

After the deposition seed layer 3 is formed (S110), the deposition conductive layer 2 is formed (S200), and the step (S200) of forming the deposition conductive layer 2 is performed It is to be noted that the examples are omitted as duplicated materials as described above.

The etching step S300 may be performed by forming the touch sensing circuit pattern 20 on the deposition conductive layer 2, the deposition seed layer 3 and the primer layer 1 using the cover pattern 4a as a barrier, And the specific method is omitted as a duplicated substrate as described above.

The present invention is characterized in that the adhesive force of the circuit pattern 20 for touch sensing with the transparent substrate 10 is enhanced to precisely form the touch sensing circuit pattern 20 having a fine line width of 3 m or less, And increases the durability of the circuit pattern 20 for touch sensing.

The present invention ensures reliable operation of the product through stable touch speed and multi-touch, and it is possible to stably apply the circuit pattern 20 to the flexible display, And multi-touch.

The present invention forms a circuit pattern 20 for touch sensing without additional plating, thereby simplifying the process, reducing manufacturing cost, and improving productivity.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. will be.

1: primer layer 2: deposited conductive layer
3: deposition seed layer 4: photoresist layer
4a: cover pattern 5: mask
10: transparent substrate 11: touch screen panel cover substrate
12: first transparent substrate 13: second transparent substrate
20: Circuit pattern for touch detection 21: X-axis sensing circuit
22: Y-axis sensing circuit unit 30: Display panel unit
40: transparent adhesive layer

Claims (20)

Transparent substrate; And
And a touch sensing circuit pattern formed on the transparent substrate and configured to sense a touch on the touch screen panel,
The touch-sensitive circuit pattern may include:
A primer layer adhered on the transparent substrate; And
And a deposition conductive layer formed by being deposited on the primer layer,
Wherein the primer layer includes a pigment in a primer resin material and has a reflectance of 30% or less. The method according to claim 1,
Wherein the primer layer is acrylic polyurethane. delete The method according to claim 1,
The deposition conductive layer may be formed of any one of copper (Cu), silver (Ag), gold (Au), and aluminum (Al), or one of copper (Cu), silver (Ag), gold (Au) Wherein the alloy is an alloy containing at least one of the metals. Transparent substrate; And
And a touch sensing circuit pattern formed on the transparent substrate and configured to sense a touch on the touch screen panel,
The touch-sensitive circuit pattern may include:
A primer layer adhered on the transparent substrate;
A deposition conductive layer formed on the primer layer; And
Wherein the touch sensing circuit pattern includes a deposition seed layer formed between the primer layer and the deposition conductive layer and having a light reflectance of 30% or less by evaporation. 6. The method of claim 5,
The deposition seed layer may be any one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr), and titanium tungsten alloy (TiW) Wherein the alloy is an alloy containing at least one of titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr), and titanium tungsten alloy (TiW). 6. The method of claim 5,
Wherein the deposition seed layer is an oxide film or a nitride film. 8. The method of claim 7,
Wherein the oxide film is any one of titanium oxide (TiO ₂ ), chromium oxide (CrO ₂ ), copper oxide (CuO), nickel oxide (NiO), aluminum oxide (Al ₂ O ₃ ), and silver oxide Touch sensor for touch screen panel. Forming a primer layer on the transparent substrate to increase the adhesion with the transparent substrate upon deposition;
Forming a deposition conductive layer on the primer layer by vapor deposition;
And removing a portion of the deposited conductive layer excluding the portion of the circuit pattern for touch sensing,
Wherein the forming of the primer layer comprises:
Applying a liquid primer agent, and drying or heat-treating the primer agent to cure the primer agent,
Wherein the primer agent comprises a pigment in a primer resin material and has a reflectance of 30% or less. delete 10. The method of claim 9,
Wherein the primer agent is acrylic polyurethane. delete 10. The method of claim 9,
The deposition conductive layer may be formed by depositing the deposition conductive layer using any one of evaporation, ebeam deposition, laser deposition, sputtering, and arc ion plating. Wherein the first electrode is formed by vapor deposition. 10. The method of claim 9,
The deposition conductive layer may be formed using any one of copper (Cu), silver (Ag), gold (Au), and aluminum (Al) (Au), and aluminum (Al) is used as a target material. 10. The method of claim 9,
Wherein the step of etching comprises:
Forming a photoresist layer on the deposition conductive layer;
Exposing and developing the photoresist layer to form a cover pattern corresponding to a circuit pattern for touch detection in the photoresist layer; And
Wherein the step of removing the touch sensing circuit pattern portion includes removing the touch sensing circuit pattern portion from the deposition conductive layer and the primer layer by using the cover pattern as a barrier. 16. The method of claim 15,
Wherein the photoresist layer is formed of any one of spraying, coater, gravure, and electrospinning. Forming a primer layer on the transparent substrate to increase the adhesion with the transparent substrate upon deposition;
Forming a deposition conductive layer on the primer layer by vapor deposition; And
And removing a portion of the deposited conductive layer excluding a part of the circuit pattern for touch sensing,
Further comprising forming a deposition seed layer having a reflectance of 30% or less on the primer layer before forming the deposition conductive layer after forming the primer layer,
Wherein the etching step removes a portion of the deposition seed layer and the deposition conductive layer except for a portion of the circuit pattern for touch sensing. 18. The method of claim 17,
The deposition seed layer may be formed by depositing the deposition seed layer by any one of evaporation, ebeam deposition, laser deposition, sputtering, and arc ion plating, Wherein the touch panel is formed of a metal. 18. The method of claim 17,
The step of forming the deposition seed layer may be performed by using any one of Cr, Mo, Ti, W, Ni, NiCr, and TiW. An alloy containing at least one of molybdenum (Mo), titanium (Ti), tungsten (W), nickel (Ni), nickel chromium (NiCr) and titanium tungsten alloy (TiW) Wherein the touch sensor is a touch sensor. 18. The method of claim 17,
Wherein the deposition seed layer is formed by sputtering an oxide or nitride on a target material to form an oxide film or a nitride film on the transparent substrate.

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