KR101642303B1

KR101642303B1 - holder for plating wafer

Info

Publication number: KR101642303B1
Application number: KR1020150071698A
Authority: KR
Inventors: 김정호; 한수욱; 박장호; 임정운; 임주영; 이승진; 김종섭
Original assignee: 한국광기술원
Priority date: 2015-05-22
Filing date: 2015-05-22
Publication date: 2016-07-26

Abstract

The present invention relates to a holder for plating a wafer wherein a semiconductor chip formed to be driven through an electrode supports a number of array wafers. The holder of the present invention comprises: a base plate; at least one support bar combined to the base plate through a combining member, through a first and a second combining holes formed on the base plate separately from each other; and a pressurizing piece installed in the support bar to pressurize the wafer mounted on the base plate elastically. According to the holder for plating the wafer of the present invention, as an elastic bias is able to vertically be applied to the wafer and is able to be released, the holder provides an advantage of being able to suppress damage to the wafer and to easily adjust a position elastically contacting the wafer.

Description

Holder for wafer plating {holder for plating wafer}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a holder for wafer plating, and more particularly, to a holder for wafer plating capable of performing plating by stably supporting a wafer.

A wafer holder for fixing a wafer formed up to an electrode in a plating liquid during a manufacturing process of a semiconductor device is disclosed in Korean Patent Publication No. 2000-0021919.

However, the wafer holder has a structure in which one end of the electrode pin holding the wafer in a pressurized state is fixed to the fixing plate and the other end is opened to press the wafer, so that the pressing force of the wafer can not be easily adjusted when the elastic force is repeatedly used There are disadvantages.

In addition, the electrode pin has a structure in which only one end is fixed and is rotated in the form of a hinge, and the wafer may be damaged when the other end contacts and separates from the wafer.

It is an object of the present invention to provide a holder for a wafer plating capable of suppressing damage to a wafer by allowing an elastic bias to be applied or released in a direction perpendicular to the wafer .

It is still another object of the present invention to provide a holder for wafer plating capable of easily adjusting a position at which the wafer is elastically contacted.

According to an aspect of the present invention, there is provided a holder for plating a wafer, the holder comprising: a base plate; a plurality of semiconductor chips formed on the wafer; At least one support bar coupled to the base plate through a coupling member through first and second coupling holes formed to be spaced apart from each other on the base plate; And a pressing piece mounted on the support bar so as to elastically press the wafer placed on the base plate.

Wherein the support bar is formed with a constraining groove with a lower opening formed along the longitudinal direction thereof, the pushing piece being restrained by the constraining groove of the support bar and being slidably mounted along the longitudinal direction; And a spring coupled to a bottom surface of the sliding body to apply an elastic bias to the wafer.

The first and second coupling holes formed on the base plate are formed with threads on the inner circumferential surface thereof, and the coupling member is engaged with the first and second coupling holes through the supporting bar.

According to an aspect of the present invention, the support bar includes: a horizontal plate extending along the longitudinal direction; First and second side plates extending downward from both ends of the horizontal plate; And first and second restricting ribs protruding in a direction in which the mutually-spaced ends of the first and second side plates approach each other to form the restricting grooves.

According to the holder for wafer plating of the present invention, it is possible to apply and release the elastic bias perpendicularly to the wafer, thereby suppressing the damage of the wafer, and advantageously resiliently adjusting the position of contact with the wafer to provide.

1 is a perspective view showing a holder for a wafer plating according to the present invention,
FIG. 2 is a sectional view showing a state in which the wafer is mounted in the holder of FIG. 1 and is accommodated in the electroplating bath.

Hereinafter, the holder for wafer plating according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a holder for plating a wafer according to the present invention, and FIG. 2 is a sectional view showing a state in which a wafer is mounted on the holder of FIG. 1 and accommodated in an electroplating bath.

1 and 2, a holder 10 for plating a wafer according to the present invention includes a base plate 20, two support bars 30, and a pressing piece 50.

The base plate 20 is formed in a plate shape, and a seating groove 22 is formed at the center of the base plate 20, on which the wafer to be plated 70 can be placed.

The base plate 20 is formed with first and second engagement holes 24 and 25 for separating the support bars 30 from each other along the direction crossing the seating grooves 22 .

The first and second coupling holes 24 and 25 are formed with threads on the inner peripheral surface.

The support bars 30 are coupled to the base plate 20 through screws 60 that are applied as coupling members to the base plate 20 through first and second coupling holes 24 and 25 formed to be spaced apart from each other.

In the illustrated example, two support bars 30 can be mounted on the base plate 20, and three or more support bars 30 can be applied.

The support bar 30 has a structure in which a constraining groove 36 is provided along the longitudinal direction so as to be able to move by sliding along the longitudinal direction while restraining the pressing member 50 to be described later.

The supporting bar 30 is divided into a horizontal plate 31 extending in the longitudinal direction and a pair of first and second vertical plates 31 and 32 extending downward from both ends of the horizontal plate 31, T "-shaped restraining groove 36 protruding in the direction in which the second side plates 32, 33 approach each other at the ends of the first and second side plates 32, 33, And the first and second restricting ribs 34 and 35 are formed.

On the horizontal plate 31 of the supporting bar 60, two insertion holes 38 into which the screws 60 can be inserted are spaced apart from each other in correspondence with the separation distance of the first and second coupling holes 24 and 25, Respectively.

The pressing piece 50 is mounted through the restricting groove 36 of the supporting bar 30 so as to elastically press the wafer 70 seated in the seating groove 22 of the base plate 20 in the vertical direction have.

The pushing piece 50 is divided into a sliding body 51 and a spring 52.

The sliding body 51 is formed in a rectangular shape so as to be restrained in the restricting groove 36 of the support bar 30 and to be slid along the longitudinal direction.

The width of the sliding body 51 is smaller than the width of the first and second side plates 32 and 33 so as to be confined in the restricting groove 36 and the distance between the first and second restricting ribs 34 and 35 Width.

One end of the spring 52 is coupled to the bottom surface of the sliding body 51 so as to apply an elastic bias to the wafer 70 and extends downward.

Needless to say, the other end of the spring 52 may be formed in a circular orbit.

The supporting bar 30 and the pressing piece 50 are formed of a conductive material capable of conducting electricity.

The adjustment of the height of the support bar 30 from the base plate 20 in the holder 10 may be performed by adjusting the entry length of the screw 60 into the first and second engagement holes 24 and 25.

On the other hand, the wafer 70 has a structure in which a plurality of semiconductor chips 72 formed to be able to be driven through the exposed electrodes 73 are arrayed.

The process of plating the electrode 73 of the wafer 70 by electroplating will be described below.

First, the base plate 20 seats the wafer 70 in the seating groove 22.

Next, the pushing piece 50 accommodated in the support bar 30 is moved along the longitudinal direction to adjust the loading position so as to be located at an appropriate portion electrically connected to the electrode 73 of the wafer 70, and then the screw 60 ) To tighten the wafer 70 so as to apply an appropriate elastic force.

Thereafter, the positive (+) power supply line extending from the power supply 130 is accommodated in the plating tank 100 containing the plating solution 110, and the negative (-) power supply line is connected to the plating solution 110 And then performing plating.

The wafer holder 10 for wafer plating is configured such that the supporting bar 30 is vertically moved up and down with respect to the base plate 20 so that the pressing piece 50 can press- It is possible to easily control the contact position of the pressing piece 50 even when the pressing force is easily adjusted and the position of the electrically conductive contact is different according to the wafer 70. [

20: base plate 30: support bar
50: pressing piece 51: sliding body
52: spring

Claims

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A holder for plating the electrodes of a wafer having a plurality of semiconductor chips formed to be able to be driven through electrodes,
A base plate;
At least one support bar coupled to the base plate through a coupling member through first and second coupling holes formed to be spaced apart from each other on the base plate;
And a pressing piece mounted on the supporting bar so as to elastically press the wafer placed on the base plate,
Wherein the support bar is formed with a restraint groove with its bottom opened along the longitudinal direction,
The pressing piece
A sliding body restrained by the restraining groove of the supporting bar and slidably mounted along the longitudinal direction;
And a spring coupled to a bottom surface of the sliding body to apply an elastic bias to the wafer,
Wherein the first and second coupling holes formed on the base plate are formed with threads on an inner peripheral surface thereof,
Wherein the engaging member is a screw engaged with the first and second engaging holes through the supporting bar,
The support bar
A horizontal plate extending along the longitudinal direction;
First and second side plates extending downward from both ends of the horizontal plate;
And first and second constraining ribs protruding in a direction in which the mutual distances approach each other at ends of the first and second side plates to form the constraining grooves.