TW201546336A - An electroplating holder and an assembly of the electroplating holder and the electroplating rack - Google Patents

An electroplating holder and an assembly of the electroplating holder and the electroplating rack Download PDF

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Publication number
TW201546336A
TW201546336A TW103120356A TW103120356A TW201546336A TW 201546336 A TW201546336 A TW 201546336A TW 103120356 A TW103120356 A TW 103120356A TW 103120356 A TW103120356 A TW 103120356A TW 201546336 A TW201546336 A TW 201546336A
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Taiwan
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electroplating
plating
workpiece
positioning
fixture
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TW103120356A
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Chinese (zh)
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TWI504785B (en
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Po-Cheng Huang
Cheng-Yi Lin
Hui-Ju Yang
Yen-Ju Chen
Shu-Hsuan Chang
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Taiwan Green Point Entpr Co
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Publication of TWI504785B publication Critical patent/TWI504785B/en
Publication of TW201546336A publication Critical patent/TW201546336A/en

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Abstract

An electroplating holder adapted to be coupled to an electroplating rack is provided. The electroplating holder includes a plurality pairs of position units. The electroplating holder is adapted to hold at least one workpiece. The electroplating holder includes a plate body, a plurality of limiting units, and a pair of positioning portions. The plate body has a plurality of holes, and is adapted to support the workpiece thereon. When the workpiece is mounted on the plate body, the limit units extend through at least two selected ones of the holes, and clamp two opposite sides of the plate body. The positioning portions are coupled to the position units of the electroplating rack and form the two opposite sides of the plate body. An assembly of the electroplating holder and the electroplating rack is also provided.

Description

電鍍治具及電鍍治具與電鍍掛架的組合 Electroplating fixture and combination of electroplating fixture and plating rack

本發明是有關於一種電鍍治具及電鍍治具與電鍍掛架的組合,特別是指一種適用於電鍍製程的輔助工具的電鍍治具及電鍍治具與電鍍掛架的組合。 The invention relates to a combination of a plating fixture and a plating fixture and a plating rack, in particular to a plating fixture suitable for an auxiliary tool of an electroplating process, and a combination of a plating fixture and a plating rack.

進行電鍍製程之前,需將待電鍍工件定位於電鍍治具,再將電鍍治具放置於一電鍍掛架上,接著將電鍍掛架、電鍍治具及待電鍍工件置入一電鍍裝置進行電鍍。然而,現有的電鍍掛架及電鍍治具對於不同待電鍍工件,皆須重新設計,才能符合待電鍍工件的定位方式及電鍍圖案,導致電鍍製程的成本增加。 Before the electroplating process, the workpiece to be electroplated is positioned on the electroplating fixture, and then the electroplating fixture is placed on a plating rack, and then the electroplating rack, the electroplating fixture and the workpiece to be electroplated are placed in a plating apparatus for electroplating. However, the existing plating racks and electroplating fixtures must be redesigned for different workpieces to be plated in order to conform to the positioning mode and plating pattern of the workpiece to be electroplated, resulting in an increase in the cost of the electroplating process.

因此,本發明之目的,即在提供一種通用型的電鍍治具及電鍍治具與電鍍掛架的組合。 Accordingly, it is an object of the present invention to provide a general-purpose electroplating jig and a combination of a plating jig and a plating rack.

於是,本發明電鍍治具,適用結合於一電鍍掛架,此電鍍掛架包括多數對定位單元,且此電鍍治具供至少一待電鍍工件以可分離方式結合於此電鍍治具,此電鍍治具包含: 一板體,供待電鍍工件設置且開設有多數開孔;多數個限位單元,當待電鍍工件設置於板體上時,多數個限位單元係供選擇性穿設於多數開孔的其中至少二者,且至少分別夾持待電鍍工件的兩相異側;及一對定位部,分別形成於板體的兩相異側,用以結合於電鍍掛架的其中一對定位單元。 Therefore, the electroplating jig of the present invention is suitable for being combined with a plating rack, the plating rack includes a plurality of pairs of positioning units, and the electroplating jig is provided for at least one workpiece to be electroplated to be detachably coupled to the electroplating jig. The fixture contains: a plate body for the workpiece to be plated and provided with a plurality of openings; a plurality of limit units, when the workpiece to be plated is disposed on the plate body, a plurality of limit units are selectively disposed in the plurality of openings At least two, and at least two sides of the workpiece to be plated are respectively clamped; and a pair of positioning portions are respectively formed on opposite sides of the plate body for coupling to one of the positioning units of the plating rack.

於是,本發明一種電鍍治具與電鍍掛架的組合,包含:上述電鍍治具,供至少一待電鍍工件藉由可分離方式結合於其上;一電鍍掛架,包括一導電架體,包覆一絕緣層,並界定多數供該電鍍治具放置的電鍍區,多數對定位單元,分別設置於導電架體的多數電鍍區處,對應的各對定位單元用以與電鍍治具的各對定位部相結合,使電鍍治具可分離地結合於導電架體的其中一電鍍區,及多數電鍍針,分別設置於各該電鍍區,各電鍍針的一端具一絕緣包覆之電連部,且另一端具一外露的導接部,各電連部電連接導電架體,各導接部用以抵接於設於電鍍區之電鍍治具上的待電鍍工件。 Therefore, the combination of the electroplating jig and the electroplating rack comprises: the electroplating jig for at least one workpiece to be electroplated to be detachably coupled thereto; and a plating rack comprising a conductive frame, the package Covering an insulating layer and defining a plurality of electroplating zones for the electroplating fixtures, most of the positioning units are respectively disposed at a plurality of electroplating zones of the conductive frame body, and the corresponding pairs of positioning units are used for each pair of electroplating fixtures The positioning portion is combined to enable the electroplating fixture to be detachably coupled to one of the electroplating regions of the conductive frame body, and a plurality of electroplating pins are respectively disposed in each of the electroplating regions, and one end of each of the electroplating pins has an insulated and electrically connected portion The other end has an exposed guiding portion, and each of the electrical connecting portions is electrically connected to the conductive frame body, and each of the guiding portions is for abutting against the workpiece to be plated on the plating fixture provided on the plating zone.

本發明之功效在於:透過選擇適當限位單元將待電鍍工件定位於板體,再將電鍍治具的定位部定位於電 鍍掛架,繼而將電鍍針移到待電鍍工件的適當處,將不使用的電鍍針的導接部加以絕緣包覆,能達通用型的電鍍治具及電鍍掛架。 The utility model has the advantages that: the workpiece to be electroplated is positioned on the plate body by selecting an appropriate limiting unit, and the positioning portion of the electroplating fixture is positioned on the electric device. The plating rack is then moved to the appropriate place of the workpiece to be electroplated, and the guiding portion of the unused electroplating needle is insulated and covered to obtain a general-purpose electroplating fixture and a plating rack.

此種特定的電鍍治具設計具有可調式的限位單元,透過調整每一個限位單元定位於待電鍍工件的周緣,可使不同尺寸的待電鍍工件共用相同尺寸的電鍍治具,增加電鍍治具使用上的靈活度。此外,可將不同尺寸的待電鍍工件同時定位於板體,達到通用型電鍍治具的功用。 The specific electroplating fixture design has an adjustable limiting unit. By adjusting each limiting unit to be positioned on the periphery of the workpiece to be electroplated, different sizes of electroplating workpieces can share the same size electroplating fixture and increase electroplating treatment. Flexibility in use. In addition, different sizes of workpieces to be electroplated can be simultaneously positioned on the board body to achieve the function of the general-purpose electroplating fixture.

本發明之另一功效在於:依常規待電鍍工件的寬度或長度來設計通用型電鍍治具的尺寸,藉由將待電鍍工件卡合於通用型電鍍治具的至少一對邊,再將電鍍治具的定位部定位於前述的通用型電鍍掛架,能達成通用型的電鍍治具及電鍍掛架。 Another effect of the present invention is that the size of the general-purpose electroplating jig is designed according to the width or length of the workpiece to be electroplated, and the electroplating workpiece is engaged with at least one pair of sides of the general-purpose electroplating jig, and then electroplating is performed. The positioning part of the jig is positioned on the above-mentioned general-purpose plating rack, and a general-purpose electroplating jig and a plating rack can be achieved.

此種特定的電鍍治具設計,可避免待電鍍工件因受外力地施壓而變形。換句話說,在電鍍製程中,待電鍍工件只受到電鍍針所施壓的力,此種電鍍治具的設計適合剛性較弱的待電鍍工件可分離地放置於其上。 This particular electroplating fixture design prevents the workpiece to be electroplated from being deformed by the application of external force. In other words, in the electroplating process, the workpiece to be electroplated is only subjected to the force exerted by the electroplated needle, and the electroplating jig is designed to be detachably placed on the workpiece to be electroplated which is less rigid.

1‧‧‧電鍍治具 1‧‧‧Electroplating fixture

11‧‧‧板體 11‧‧‧ board

110‧‧‧長邊側 110‧‧‧ long side

111‧‧‧短邊側 111‧‧‧ Short side

112‧‧‧第一孔 112‧‧‧ first hole

113‧‧‧第一長孔 113‧‧‧First long hole

114‧‧‧第二長孔 114‧‧‧Second long hole

115‧‧‧第三長孔 115‧‧‧ third long hole

116‧‧‧L形孔 116‧‧‧L-shaped holes

117‧‧‧T形孔 117‧‧‧T-shaped holes

118‧‧‧U形孔部 118‧‧‧U-shaped hole

119‧‧‧L形孔部 119‧‧‧L-shaped hole

12‧‧‧限位單元 12‧‧‧Limited unit

121‧‧‧擋塊 121‧‧‧blocks

122‧‧‧鎖固件 122‧‧‧Locker

123、323‧‧‧鎖固螺絲 123,323‧‧‧Locking screws

124、324‧‧‧螺母 124, 324‧‧‧ nuts

13‧‧‧定位部 13‧‧‧ Positioning Department

130‧‧‧L形孔 130‧‧‧L-shaped holes

131‧‧‧定位孔 131‧‧‧Positioning holes

132‧‧‧定位凹槽 132‧‧‧ positioning groove

14‧‧‧基板 14‧‧‧Substrate

141‧‧‧外周緣壁 141‧‧‧ outer peripheral wall

142‧‧‧頂緣壁 142‧‧‧Top edge wall

143‧‧‧前表面 143‧‧‧ front surface

144‧‧‧內周緣壁 144‧‧‧ inner perimeter wall

145‧‧‧後表面 145‧‧‧Back surface

15‧‧‧圍繞框 15‧‧‧round box

151‧‧‧下框壁 151‧‧‧ Lower frame wall

152‧‧‧側框壁 152‧‧‧ side frame wall

16‧‧‧柵板 16‧‧‧ Grid

17‧‧‧限位件 17‧‧‧Limited parts

18‧‧‧承載空間 18‧‧‧ Carrying space

181‧‧‧前開口 181‧‧‧ front opening

182‧‧‧上開口 182‧‧‧Opening

19‧‧‧流通空間 19‧‧‧Circulation space

191‧‧‧流通口 191‧‧‧ Circulation

2‧‧‧待電鍍工件 2‧‧‧Working parts to be plated

3‧‧‧電鍍掛架 3‧‧‧Electroplating rack

31‧‧‧導電架體 31‧‧‧ Conductive frame

310‧‧‧承載框 310‧‧‧ bearing frame

311‧‧‧主立桿 311‧‧‧Main pole

312‧‧‧側立桿 312‧‧‧ Side pole

313‧‧‧掛勾 313‧‧‧hook

314‧‧‧電鍍區 314‧‧‧ plating area

315‧‧‧貫孔 315‧‧‧through holes

316‧‧‧橫連接桿 316‧‧‧ transverse connecting rod

32‧‧‧定位單元 32‧‧‧ Positioning unit

321‧‧‧定位勾 321‧‧‧ positioning hook

322‧‧‧螺鎖件 322‧‧‧ Screw locks

323‧‧‧鎖固螺絲 323‧‧‧Locking screws

324‧‧‧螺母 324‧‧‧ nuts

325‧‧‧墊塊 325‧‧‧ pads

33‧‧‧電鍍針 33‧‧‧Electroplating needle

331‧‧‧導接部 331‧‧‧Guidance

332‧‧‧電連部 332‧‧‧Electrical Department

本發明之其他的特徵及功效,將於參照圖式的較佳實施例詳細說明中清楚地呈現,其中:圖1是一平面示意圖,說明本發明電鍍治具與電鍍掛架的組合的一第一較佳實施例,且定位於一待電鍍工件於一電鍍治具;圖2是一立體圖,說明電鍍治具的板體; 圖3至圖6是說明擋塊的平面示意圖;圖7是一平面分解示意圖,說明鎖固件;圖8是一立體圖,說明該電鍍掛架;圖9是一立體圖,說明一電鍍針;圖10是一側視圖,說明該電鍍掛架定位十組電鍍治具的組立關係;圖11是一平面示意圖,說明該電鍍掛架定位五組電鍍治具,且電鍍治具定位待電鍍工件的實施態樣;圖12是一平面示意圖,說明該待電鍍工件的尺寸稍大,微調定位勾的位置至板體的短邊側,仍可定位板體;圖13是一立體圖,說明本發明電鍍治具與電鍍掛架的組合的一第二較佳實施例,其中電鍍掛架定位一電鍍治具,且電鍍治具定位於一待電鍍工件;圖14是一平面示意圖,其中僅顯示該電鍍治具的板體;圖15是一平面示意圖,說明本發明電鍍治具與電鍍掛架的組合的一第三較佳實施例,其中電鍍掛架定位一電鍍治具,且電鍍治具定位於一待電鍍工件;圖16是一平面示意圖,其中僅顯示部分電鍍掛架;圖17是一部分立體示意圖,說明電鍍掛架的定位單元定位二電鍍治具的L形孔;圖18是一立體圖,說明本發明電鍍治具與電鍍掛架的組合的一第四較佳實施例,其中電鍍掛架的與二電鍍治具的組立關係; 圖19是一平面示意圖,其中僅顯示一電鍍治具;及圖20是一平面示意圖,說明各電鍍治具分別定位一待電鍍工件。 Other features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention, wherein: Figure 1 is a schematic diagram showing a combination of the electroplating fixture of the present invention and a plating rack. a preferred embodiment, and positioned in a plated workpiece to be electroplated; FIG. 2 is a perspective view of the plate body of the electroplating fixture; 3 to FIG. 6 are schematic plan views illustrating a stopper; FIG. 7 is a plan exploded view showing the fastener; FIG. 8 is a perspective view showing the plating hanger; FIG. 9 is a perspective view illustrating a plating needle; It is a side view showing the assembly relationship of the electroplating rack positioning ten sets of electroplating fixtures; FIG. 11 is a plan view showing the five sets of electroplating fixtures for positioning the electroplating racks, and the electroplating fixtures are positioned to perform the electroplated workpieces. Figure 12 is a schematic plan view showing that the size of the workpiece to be plated is slightly larger, and the position of the positioning hook is finely adjusted to the short side of the plate body, and the plate body can still be positioned; Fig. 13 is a perspective view showing the electroplating fixture of the present invention A second preferred embodiment of the combination with the electroplating gantry, wherein the electroplating gantry is positioned with a plating fixture, and the electroplating fixture is positioned on a workpiece to be electroplated; FIG. 14 is a plan view showing only the electroplating fixture Figure 15 is a plan view showing a third preferred embodiment of the combination of the electroplating jig and the electroplating pylon of the present invention, wherein the electroplating gantry is positioned with a plating fixture, and the electroplating fixture is positioned Plasterer Figure 16 is a plan view showing only a part of the plating rack; Figure 17 is a partial perspective view showing the positioning unit of the plating rack positioning the L-shaped hole of the electroplating fixture; Figure 18 is a perspective view showing the plating of the present invention A fourth preferred embodiment of the combination of the jig and the electroplating rack, wherein the electroplating rack is in a group relationship with the second electroplating fixture; Figure 19 is a plan view showing only one electroplating jig; and Figure 20 is a plan view showing that each electroplating jig is positioned to respectively position a workpiece to be plated.

在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

下列較佳實施例的說明是參考附加的圖式,用以例示本發明可用以實施之特定實施例。本發明所提到的方向用語,例如「頂端」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而非用來限制本發明。 The following description of the preferred embodiments is provided to illustrate the specific embodiments of the invention. The directional terminology referred to in the present invention, such as "top" or the like, refers only to the direction of the additional drawing. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

參閱圖1與圖2,本發明電鍍治具及電鍍治具與電鍍掛架的組合之第一較佳實施例,適用定位至少一待電鍍工件2。待電鍍工件2是一殼體或板體,其具有至少一部份為導體。電鍍治具與電鍍掛架的組合包含多數個電鍍治具1及一電鍍掛架3。以下為方便說明,僅先介紹單一電鍍治具1。 Referring to FIG. 1 and FIG. 2, a first preferred embodiment of the combination of the electroplating jig and the electroplating jig and the electroplating gantry of the present invention is suitable for locating at least one workpiece 2 to be electroplated. The workpiece 2 to be plated is a casing or plate having at least a portion of a conductor. The combination of the electroplating fixture and the electroplating rack comprises a plurality of electroplating fixtures 1 and a plating rack 3. The following is a convenient description, only the single electroplating fixture 1 will be introduced first.

電鍍治具1包含一板體11、多數個限位單元12,及一定位部13。板體11概呈一矩形板體,供待電鍍工件2設置且開設有多數開孔,並包括二相間隔的長邊側110、二分別連接長邊側110的短邊側111。在本實施例中,多數開孔為多數個相間隔且貫穿的第一孔112、多數個相間隔且貫穿的第一長孔113、多數個相間隔且貫穿的第二長孔114、多數個相間隔且貫穿的第三長孔115、多數個相 間隔且貫穿的L形孔116,及多數個相間隔且貫穿的T形孔117。定位部13,分別形成於板體11的兩相異側,用以結合於電鍍掛架3的其中一定位單元32,且定位部13為至少一對,而對應的定位單元32也是至少一對。在本實施例中,定位部13具有四個分別貫穿板體11且位於板體11兩相反側的定位孔131。在本實施例中,定位孔131分別鄰近於板體11的二相間隔的短邊側111之邊緣處。 The electroplating fixture 1 includes a plate body 11, a plurality of limiting units 12, and a positioning portion 13. The plate body 11 has a rectangular plate body, and is provided with a plurality of openings for the workpiece 2 to be plated, and includes two sides of the long side 110 and two short sides 111 respectively connected to the long sides 110. In this embodiment, the plurality of openings are a plurality of first holes 112 that are spaced apart and penetrated, a plurality of first long holes 113 that are spaced apart and penetrated, a plurality of second long holes 114 that are spaced apart and penetrated, and a plurality of a third long hole 115 spaced apart and penetrating, a plurality of phases The L-shaped apertures 116 are spaced apart and therethrough, and a plurality of T-shaped apertures 117 that are spaced apart and therethrough. The positioning portions 13 are respectively formed on the opposite sides of the plate body 11 for coupling to one of the positioning units 32 of the plating rack 3, and the positioning portion 13 is at least one pair, and the corresponding positioning unit 32 is also at least one pair. . In the present embodiment, the positioning portion 13 has four positioning holes 131 respectively penetrating the plate body 11 and located on opposite sides of the plate body 11. In the present embodiment, the positioning holes 131 are respectively adjacent to the edges of the two-phase spaced short side 111 of the board body 11.

在本實施例中,第一孔112為圓孔,第一孔112的數量為十五個。第一長孔113為縱向長孔,第一長孔113的數量為二個。第二長孔114為橫向長孔,第二長孔114的數量為四個。各第三長孔115具有一U形孔部118,及二個自U形孔部118兩相反側向外延伸的L形孔部119,第三長孔115的數量為三個。T形孔117的數量為二個,以及L形孔116的數量為四個。其中,一第三長孔115與五個第一孔112同一列排列組合成第一組,以及二第二長孔114與一第一長孔113同一列排列組合成第二組,兩相鄰的第一組之間排列有一第二組。在本實施例中,每一第一組的五個第一孔112以平行短邊側111的排列方向間隔排列於對應的第三長孔115的各孔隙間。每一第二組的兩個第二長孔114分別鄰近二相間隔長邊側110的邊緣處,且各第二長孔114的長度延伸方向與對應的長邊側110平行。 In this embodiment, the first hole 112 is a circular hole, and the number of the first holes 112 is fifteen. The first long hole 113 is a longitudinal long hole, and the number of the first long holes 113 is two. The second long hole 114 is a lateral long hole, and the number of the second long holes 114 is four. Each of the third elongated holes 115 has a U-shaped hole portion 118 and two L-shaped hole portions 119 extending outward from opposite sides of the U-shaped hole portion 118. The number of the third long holes 115 is three. The number of T-shaped holes 117 is two, and the number of L-shaped holes 116 is four. Wherein, a third long hole 115 and five first holes 112 are arranged in the same column to form a first group, and two second long holes 114 are arranged in the same column as a first long hole 113 to form a second group, two adjacent A second group is arranged between the first groups. In the present embodiment, the five first holes 112 of each first group are arranged between the respective holes of the corresponding third elongated holes 115 at intervals of the arrangement direction of the parallel short sides 111. The two second elongated holes 114 of each second group are respectively adjacent to the edges of the two-phase spaced long sides 110, and the length extension directions of the second long holes 114 are parallel to the corresponding long sides 110.

各L形孔116、各T形孔117,及各定位孔131分別鄰近對應的短邊側111。各T形孔117位於對應的二個L形孔116之間,且各T形孔117之末端鄰近對應的短邊側 111之邊緣處。 Each of the L-shaped holes 116, each of the T-shaped holes 117, and each of the positioning holes 131 are adjacent to the corresponding short side 111. Each T-shaped hole 117 is located between the corresponding two L-shaped holes 116, and the end of each T-shaped hole 117 is adjacent to the corresponding short side At the edge of 111.

各限位單元12包括一擋塊121,及一鎖固件122。當待電鍍工件2設置於板體11上時,多數限位單元12係供選擇性穿設於多數開孔的其中至少二者,且至少分別夾持待電鍍工件2的兩相異側。此外,板體11具有複數對開孔,當待電鍍工件2設置於板體11上時,限位單元12係選擇性穿設於複數對開孔的其中一對開孔。 Each of the limiting units 12 includes a stopper 121 and a locking member 122. When the workpiece 2 to be plated is disposed on the plate body 11, the plurality of limiting units 12 are selectively disposed through at least two of the plurality of openings, and at least respectively clamp the opposite sides of the workpiece 2 to be plated. In addition, the plate body 11 has a plurality of split holes. When the workpiece 2 to be plated is disposed on the plate body 11, the limiting unit 12 selectively passes through a pair of openings of the plurality of split holes.

其中,擋塊121可在使用狀態中抵靠於選定的第一孔112、第一長孔113、第二長孔114、第三長孔115、L形孔116及T形孔117其中之一者位於板體11開口處上緣,且抵靠於待電鍍工件2周緣,再由鎖固件122穿過擋塊121與選定的第一孔112、第一長孔113、第二長孔114、第三長孔115、L形孔116及T形孔117其中之一者,藉此將擋塊121鎖固於板體11上,此時,待電鍍工件2便能被擋塊121穩固地夾持並定位於板體11上。擋塊121為如圖3所示的同心圓擋塊、如圖4所示的偏心圓擋塊、如圖5所示的方形擋塊,及如圖6所示長條擋塊其中之一,可視實際使用需求選擇適當形狀之擋塊121。 The stopper 121 can abut against one of the selected first hole 112, the first long hole 113, the second long hole 114, the third long hole 115, the L-shaped hole 116 and the T-shaped hole 117 in the use state. The upper edge of the opening of the plate body 11 and the periphery of the workpiece 2 to be plated, and then the fastener 122 passes through the block 121 and the selected first hole 112, the first long hole 113, the second long hole 114, One of the third long hole 115, the L-shaped hole 116 and the T-shaped hole 117, thereby locking the stopper 121 to the plate body 11, and at this time, the workpiece 2 to be plated can be firmly clamped by the stopper 121. Hold and position on the board body 11. The stopper 121 is a concentric circular stopper as shown in FIG. 3, an eccentric circular stopper as shown in FIG. 4, a square stopper as shown in FIG. 5, and one of the long stoppers as shown in FIG. A suitable shape of the stopper 121 can be selected according to actual use requirements.

如圖1與圖7所示,各鎖固件122具有一鎖固螺絲123,及一鎖固於鎖固螺絲123並抵於板體11的螺母124。各擋塊121與各螺母124分別位於板體11的相反兩面,且各鎖固件122可滑移地固定於選定的各開孔。在本實施例中,各鎖固螺絲123穿伸擋塊121與選定的第一孔112、第一長孔113、第二長孔114、第三長孔115、L形孔 116及T形孔117其中一者後,藉由與擋塊121位於板體11相反側的螺母124予以鎖固。 As shown in FIG. 1 and FIG. 7 , each of the locking members 122 has a locking screw 123 and a nut 124 that is locked to the locking screw 123 and abuts against the plate body 11 . Each of the stoppers 121 and the respective nuts 124 are respectively located on opposite sides of the plate body 11, and each of the lock members 122 is slidably fixed to the selected openings. In this embodiment, each of the locking screws 123 extends through the block 121 and the selected first hole 112, the first long hole 113, the second long hole 114, the third long hole 115, and the L-shaped hole. One of the 116 and the T-shaped holes 117 is then locked by a nut 124 on the opposite side of the plate body 11 from the stopper 121.

如圖1、圖2與圖7所示,由於待電鍍工件2的外型以矩形輪廓為主,且待電鍍工件2的擺設方向大都是以橫向或縱向為主,因此,本實施例的板體11是以縱向長孔及橫向長孔兩種孔的形狀為基礎,以此來設計出第一長孔113及第二長孔114,並且藉由兩種孔的形狀相互配合來設計出第三長孔115、L形孔116及T形孔117。藉由第一長孔113、第二長孔114、第三長孔115、L形孔116及T形孔117的形狀設計,使得使用者能依照待電鍍工件2的外型或尺寸大小,將各限位單元12與適當位置的第一長孔113、第二長孔114、第三長孔115、L形孔116及T形孔117其中一者相配合來夾持定位待電鍍工件2,且各限位單元12能沿著相對應配合之孔的形狀而相對於板體11移動,以調整鎖固的位置,藉此,能增加使用上的彈性及靈活性。 As shown in FIG. 1 , FIG. 2 and FIG. 7 , since the shape of the workpiece 2 to be plated is mainly a rectangular profile, and the orientation of the workpiece 2 to be plated is mostly in the horizontal or vertical direction, the plate of the embodiment is The body 11 is based on the shapes of two types of holes, a longitudinal long hole and a lateral long hole, to design the first long hole 113 and the second long hole 114, and the two holes are designed to match each other. Three long holes 115, L-shaped holes 116 and T-shaped holes 117. The shape of the first long hole 113, the second long hole 114, the third long hole 115, the L-shaped hole 116 and the T-shaped hole 117 is designed so that the user can follow the shape or size of the workpiece 2 to be plated. Each of the limiting units 12 cooperates with one of the first long hole 113, the second long hole 114, the third long hole 115, the L-shaped hole 116 and the T-shaped hole 117 at an appropriate position to clamp and position the workpiece 2 to be plated. Moreover, each of the limiting units 12 can move relative to the plate body 11 along the shape of the corresponding matching hole to adjust the position of the locking, thereby increasing the flexibility and flexibility in use.

參閱圖1與圖8,電鍍掛架3與一電鍍裝置電連接。電鍍裝置包括一容置電鍍液的電鍍槽、一陰極,及至少一陽極。陰極耦接待電鍍工件2。陽極設置於電鍍槽內並耦接一電鍍金屬。陽極面對待電鍍工件2的一待鍍面。當施予外加電壓於陰極與陽極時,電鍍金屬會析出帶正電荷的電鍍金屬離子,而待電鍍工件2表面聚集帶負電荷的電子。電鍍金屬離子被電子吸引並藉由電鍍液而流向待電鍍工件2表面,以在待電鍍工件2表面與電子結合而沉積 於待電鍍工件2表面形成鍍膜。 Referring to Figures 1 and 8, the plating rack 3 is electrically connected to a plating apparatus. The electroplating apparatus includes a plating tank for accommodating the plating solution, a cathode, and at least one anode. The cathode coupling receives the plated workpiece 2. The anode is disposed in the plating tank and coupled to a plating metal. The anode surface is to be plated with a surface to be plated. When an applied voltage is applied to the cathode and the anode, the plating metal precipitates a positively charged plating metal ion, and the surface of the workpiece 2 to be plated concentrates the negatively charged electron. The electroplated metal ions are attracted by electrons and flow to the surface of the workpiece 2 to be electroplated by the plating solution to deposit on the surface of the workpiece 2 to be electroplated and combined with electrons. A coating is formed on the surface of the workpiece 2 to be plated.

電鍍掛架3包含一導電架體31、多數對定位單元32,及多數隻具有絕緣包覆的電鍍針33。導電架體31,包覆一絕緣層,並界定多數供電鍍治具1放置的電鍍區314。在本實施例中,導電架體31包括一沿縱向延伸的主立桿311、一設置於主立桿311上的承載框310,及一連接主立桿311頂端的掛勾313。在本實施例中,承載框310具有二分別間隔位於主立桿311相反側且沿縱向延伸的側立桿312,及二分別沿橫向延伸的橫連接桿316,二橫連接桿316分別連接於二側立桿312頂端及二側立桿312底端。主立桿311與承載框310共同界定多數個沿縱向排列的電鍍區314(如圖8所示的虛線標示處)。掛勾313掛設於電鍍裝置且與電鍍裝置電連接。主立桿311與承載框310在其表面覆蓋絕緣層以避免在電鍍過程中表面形成鍍層。 The plating rack 3 includes a conductive frame 31, a plurality of pairs of positioning units 32, and a plurality of plated pins 33 having only an insulating coating. The conductive frame body 31 is covered with an insulating layer and defines a plating zone 314 in which a plurality of power supply plating fixtures 1 are placed. In this embodiment, the conductive frame body 31 includes a main vertical rod 311 extending in the longitudinal direction, a bearing frame 310 disposed on the main vertical rod 311, and a hanging hook 313 connecting the top end of the main vertical rod 311. In this embodiment, the carrying frame 310 has two side uprights 312 respectively spaced apart from the opposite sides of the main upright 311 and extending in the longitudinal direction, and two transverse connecting rods 316 extending respectively in the lateral direction, and the two transverse connecting rods 316 are respectively connected to The top of the two side poles 312 and the bottom ends of the two side poles 312. The main upright 311 and the carrier frame 310 together define a plurality of longitudinally aligned plating zones 314 (shown by dashed lines in FIG. 8). The hook 313 is attached to the plating device and electrically connected to the plating device. The main upright 311 and the carrier frame 310 are covered with an insulating layer on their surfaces to avoid plating on the surface during electroplating.

每一電鍍區314設置一定位單元32,此一定位單元32數量為至少一對,且藉由電鍍治具1的定位部13與對應的電鍍區314上的定位單元32相結合,進而將電鍍治具1定位於電鍍掛架3上,使電鍍治具1可分離地結合於導電架體31的其中一電鍍區314。此外,定位單元32分別設置於承載框310,且電鍍針33分別設置於主立桿311上。在本實施例中,各定位單元32具有四個定位勾321,此四個定位勾321設置於二側立桿312上,每兩個定位勾321上下相間隔地設置於對應的側立桿312,各定位勾321由承載框310所構成的平面垂直向外延伸並且穿伸於電鍍 治具1的對應定位孔131。定位勾321具有彈性,能略為調整定位位置。 Each of the plating zones 314 is provided with a positioning unit 32. The number of the positioning units 32 is at least one pair, and the positioning portion 13 of the plating fixture 1 is combined with the positioning unit 32 on the corresponding plating zone 314 to further electroplating. The jig 1 is positioned on the plating rack 3 such that the electroplating jig 1 is detachably coupled to one of the electroplating regions 314 of the conductive frame body 31. In addition, the positioning units 32 are respectively disposed on the carrying frame 310, and the plating pins 33 are respectively disposed on the main uprights 311. In this embodiment, each positioning unit 32 has four positioning hooks 321 disposed on the two side uprights 312, and each of the two positioning hooks 321 is disposed at a distance from the corresponding side uprights 312. Each positioning hook 321 extends vertically outward from the plane formed by the bearing frame 310 and extends through the plating Corresponding positioning holes 131 of the jig 1 . The positioning hook 321 has elasticity and can slightly adjust the positioning position.

電鍍針33一端具有一外露的導接部331,另一端具一絕緣包覆之電連部332(見圖9,且電連部332僅標示於圖8與圖9)。導接部331用以抵接於設於電鍍區314之電鍍治具1上的待電鍍工件2。電連部332電連接導電架體31並位於主立桿311上,且每一電鍍區314設置至少一電鍍針33,各電鍍針33具有撓性以及可手工成型(hand-shapable)特性。 The plating pin 33 has an exposed guiding portion 331 at one end and an insulating coated electrical connection portion 332 at the other end (see FIG. 9, and the electrical connecting portion 332 is only shown in FIGS. 8 and 9). The guiding portion 331 is for abutting against the workpiece 2 to be plated on the plating fixture 1 provided on the plating zone 314. The electrical connector 332 is electrically connected to the conductive frame 31 and located on the main pole 311, and each plating zone 314 is provided with at least one plating pin 33, each of which has flexibility and hand-shaptable characteristics.

手工成型的定義為用手或手工具將材料彎曲改變所需要的形狀,而能定位成型。在本實施例中,電鍍針33選自銅合金材料,並具有高強度、高電導率,及優越的折彎加工特性,而能具有撓性及手工成型特性。每一電鍍區314設置六隻電鍍針33,其中三隻電鍍針33位於主立桿311與靠近電鍍區314頂緣區,另外三隻位於主立桿311與靠近電鍍區314底緣區。但是,每一電鍍區314也可以僅設置一電鍍針33,也可依實際情形調整每一電鍍區314的電鍍針33設置數量。而每一電鍍區314設置六隻電鍍針33設計原則,為根據待電鍍工件2的圖案、導電線路或是天線元件的需求而設計,且對於待電鍍工件2表面形成鍍膜不會有過多的干涉。 Hand-formed is defined as the shape required to bend a material by hand or hand tool to change shape. In the present embodiment, the electroplated needle 33 is selected from a copper alloy material and has high strength, high electrical conductivity, and superior bending processing characteristics, and can have flexibility and hand-forming characteristics. Each of the plating zones 314 is provided with six electroplated pins 33, wherein three electroplating pins 33 are located in the top edge of the main upright 311 and adjacent to the plating zone 314, and the other three are located in the bottom edge of the main upright 311 and the vicinity of the plating zone 314. However, each plating zone 314 may also be provided with only one plating pin 33, and the number of plating pins 33 of each plating zone 314 may be adjusted according to actual conditions. Each plating zone 314 is provided with six plating pins 33 design principles, which are designed according to the requirements of the pattern of the workpiece 2 to be plated, the conductive lines or the antenna elements, and do not interfere excessively on the surface of the workpiece 2 to be plated. .

參閱圖8與圖10,在本實施例中,電鍍區314位於主立桿311與承載框310所構成平面的相異兩側,且每側各分別設置五個電鍍區314。在本實施例中,以電鍍 治具1板體11的各短邊側111(參閱圖2)定位於相對應的側立桿312上,此種緊密的排列具有較高的經濟效益。 Referring to FIG. 8 and FIG. 10, in the embodiment, the plating zone 314 is located on opposite sides of the plane formed by the main upright 311 and the carrier frame 310, and five plating zones 314 are respectively disposed on each side. In this embodiment, electroplating The short sides 111 (see FIG. 2) of the jig 11 of the jig 1 are positioned on the corresponding side uprights 312, and such a tight arrangement has high economic efficiency.

參閱圖11,以下說明利用電鍍治具1定位待電鍍工件2,再將電鍍治具1定位於電鍍掛架3進行電鍍作業。參閱圖1與圖2,首先,將待電鍍工件2置放於電鍍治具1的板體11上,依待電鍍工件2與電鍍治具1的相互配置狀況,選擇適當的擋塊121定位於板體11且抵靠於待電鍍工件2周緣。擋塊121提供了阻擋待電鍍工件2的滑移並提供定位的功能。 Referring to FIG. 11, the following description uses the electroplating jig 1 to position the workpiece 2 to be electroplated, and then positions the electroplating jig 1 on the plating rack 3 for electroplating. Referring to FIG. 1 and FIG. 2, first, the workpiece 2 to be plated is placed on the plate body 11 of the electroplating jig 1, and according to the mutual arrangement condition of the electroplated workpiece 2 and the electroplating jig 1, an appropriate stopper 121 is selected and positioned. The plate body 11 abuts against the periphery of the workpiece 2 to be plated. The stopper 121 provides a function of blocking the slip of the workpiece 2 to be plated and providing positioning.

參閱圖1、圖2及圖7,接著,以鎖固件122的鎖固螺絲123穿過擋塊121與選定的第一孔112、第一長孔113、第二長孔114、第三長孔115、L形孔116及T形孔117其中之一者後,並與一抵於板體11的螺母124鎖固在一起,進而將待電鍍工件2定位於電鍍治具1上。其中,擋塊121與螺母124分別抵於板體11相反側。 Referring to FIG. 1 , FIG. 2 and FIG. 7 , the locking screw 123 of the locking member 122 passes through the stopper 121 and the selected first hole 112 , the first long hole 113 , the second long hole 114 , and the third long hole . 115, one of the L-shaped hole 116 and the T-shaped hole 117, and locked with a nut 124 that abuts the plate body 11, thereby positioning the workpiece 2 to be plated on the plating fixture 1. The stopper 121 and the nut 124 respectively abut against the opposite side of the plate body 11.

擋塊121可配合第一孔112、第一長孔113、第二長孔114、第三長孔115、L形孔116及T形孔117其中之一者的位置,並選擇適當的尺寸與形狀來定位待電鍍工件2。在電鍍製程中,電鍍液易殘留於待電鍍工件2與擋塊121相接觸區,增加後續處理殘留電鍍液的困擾。較佳地,圖3之同心圓擋塊121與圖4之偏心圓擋塊121因為與待電鍍工件2周緣的接觸面積較少,是優先選擇使用的對象。 The stopper 121 can match the position of one of the first hole 112, the first long hole 113, the second long hole 114, the third long hole 115, the L-shaped hole 116 and the T-shaped hole 117, and select an appropriate size and Shape to position the workpiece 2 to be plated. In the electroplating process, the plating solution is liable to remain in the contact area between the workpiece 2 to be plated and the stopper 121, thereby increasing the trouble of the subsequent treatment of the residual plating solution. Preferably, the concentric circular block 121 of FIG. 3 and the eccentric circular stop 121 of FIG. 4 are preferred objects for use because of the small contact area with the periphery of the workpiece 2 to be plated.

參閱圖1、圖8及圖10,接著,將電鍍掛架3 的定位單元32的定位勾321分別穿伸電鍍治具1的板體11的定位孔131,而將電鍍治具1定位於電鍍掛架3。 Referring to Figures 1, 8, and 10, next, the plating rack 3 will be The positioning hooks 321 of the positioning unit 32 respectively extend through the positioning holes 131 of the plate body 11 of the plating fixture 1 to position the plating fixture 1 on the plating rack 3.

繼而,利用工具將電鍍針33移到待電鍍工件2的待電鍍區,且將不需要的電鍍針33的導接部331加以絕緣包覆,以避免在電鍍過程中表面形成鍍層,而影響了電鍍針33的壽命,並避免此些的電鍍針33的導接部331刮傷待電鍍工件2。參閱圖1與圖11,待每一個電鍍治具1定位至少一待電鍍工件2,且電鍍治具1定位於電鍍掛架3,皆設定完成後,放入電鍍裝置即進行電鍍作業。換句話說,如果是尺寸較小的待電鍍工件2,可將多個待電鍍工件2定位於同一塊電鍍治具1上。 Then, the electroplating needle 33 is moved to the area to be electroplated of the workpiece 2 to be electroplated by a tool, and the guiding portion 331 of the unnecessary electroplating needle 33 is insulated and covered to avoid the formation of a plating layer during the electroplating process, thereby affecting the plating. The life of the electroplated needle 33 is maintained, and the lead portion 331 of the electroplated needle 33 is prevented from scratching the workpiece 2 to be plated. Referring to FIG. 1 and FIG. 11, each electroplating fixture 1 is positioned to at least one workpiece 2 to be electroplated, and the electroplating fixture 1 is positioned on the electroplating rack 3, and after being set, the electroplating operation is performed by placing the electroplating device. In other words, if the workpiece 2 to be electroplated is small in size, a plurality of workpieces 2 to be electroplated can be positioned on the same electroplating jig 1.

參閱圖1與圖2,須說明的是,電鍍治具1的板體11在設計時,考慮能增加電鍍液的流動性且在不影響板體11強度的前提下,排列不同數目及位置的第一長孔113、第二長孔114、第三長孔115、L形孔116及T形孔117,以使待電鍍工件2的鍍膜更佳均勻。 Referring to FIG. 1 and FIG. 2, it should be noted that the plate body 11 of the electroplating jig 1 is designed to increase the fluidity of the plating solution and to arrange different numbers and positions without affecting the strength of the plate body 11. The first long hole 113, the second long hole 114, the third long hole 115, the L-shaped hole 116 and the T-shaped hole 117 are used to make the plating film of the workpiece 2 to be plated more uniform.

具體來說,由於板體11的中央部分,電鍍液的流動性較差,而透過第一長孔113為縱向長孔而能提高電鍍液的流動性。在本實施例中,此縱向第一長孔113與板體11的短邊側111邊緣線平行,且主要以第三長孔115及配合擋塊121的設計,使大部分的待電鍍工件2得到牢靠地定位,當然,若遇特別尺寸的待電鍍工件2,可選擇第一長孔113、第二長孔114、L形孔116及T形孔117與配合擋塊121,以使本發明的電鍍治具1成為可應用於多種 待電鍍工件2的通用型電鍍治具1。 Specifically, the fluidity of the plating solution is poor due to the central portion of the plate body 11, and the fluidity of the plating solution can be improved by the first long hole 113 being a longitudinally long hole. In this embodiment, the longitudinal first long hole 113 is parallel to the edge line of the short side 111 of the plate body 11, and is mainly designed with the third long hole 115 and the matching block 121, so that most of the workpiece to be plated 2 Obtaining a secure positioning, of course, if a workpiece 2 to be electroplated of a particular size is selected, the first long hole 113, the second long hole 114, the L-shaped hole 116 and the T-shaped hole 117 and the mating stop 121 may be selected to enable the present invention Electroplating fixture 1 becomes applicable to a variety of A general-purpose electroplating jig 1 for the workpiece 2 to be electroplated.

最後,因為電鍍掛架3的電鍍針33是設置在電鍍區314的中央,對於待電鍍工件2的不同的電鍍位置,如是偏於待電鍍工件2的某一側,電鍍針33皆能移動至待電鍍位置,以使本發明的電鍍掛架3成為可配合待電鍍工件2設置的通用型電鍍掛架3。此外,當電鍍針33的導接部331經長期使用磨損後,可透過研磨的方式使其導接部331回復可使用狀態,直到電鍍針33經多次研磨變短而無法接觸待電鍍工件2時,才須製作新的電鍍掛架3。透過通用型的電鍍治具1及通用型的電鍍掛架3,不須要對不同尺寸的待電鍍工件2設計特定電鍍治具1及電鍍掛架3,能大幅降低電鍍製程的成本,並且縮短製作特定電鍍治具1及電鍍掛架3的等待時間,提高了電鍍效率。 Finally, since the plating needle 33 of the plating rack 3 is disposed at the center of the plating zone 314, the plating needle 33 can be moved to a different plating position of the workpiece 2 to be plated, such as to a side of the workpiece 2 to be plated. The position to be plated is such that the plating rack 3 of the present invention becomes a general-purpose plating rack 3 that can be placed in conjunction with the workpiece 2 to be plated. In addition, when the guiding portion 331 of the electroplating needle 33 is worn out for a long period of time, the guiding portion 331 can be returned to the usable state by grinding, until the electroplating needle 33 is shortened by multiple times and cannot contact the workpiece to be plated 2 Only when a new plating rack 3 is required. Through the general-purpose electroplating jig 1 and the general-purpose electroplating rack 3, it is not necessary to design a specific electroplating jig 1 and a plating rack 3 for different sizes of the workpiece 2 to be plated, which can greatly reduce the cost of the electroplating process and shorten the production. The waiting time of the specific plating jig 1 and the plating rack 3 improves the plating efficiency.

若僅須電鍍一待電鍍工件2,則僅須將待電鍍工件2定位於電鍍治具1,而電鍍治具1可分離地結合於導電架體31的其中一電鍍區314。待電鍍工件2藉以可分離地接觸其中之一電鍍針33的導接部331。 If only the workpiece 2 to be electroplated has to be electroplated, only the workpiece 2 to be electroplated has to be positioned on the electroplating fixture 1, and the electroplating fixture 1 is detachably coupled to one of the electroplating regions 314 of the conductive frame 31. The workpiece 2 to be plated is thereby detachably contacted with the guiding portion 331 of one of the plating pins 33.

參閱圖2與圖12,如果待電鍍工件2的尺寸稍大,當待電鍍工件2擺放至電鍍治具1的板體11時,已經干涉了部分的定位勾321與定位孔131的定位關係,此時,藉助定位勾321的彈性,微調定位勾321的位置由朝待電鍍工件2方向改為朝相反方向至板體11的短邊側111邊緣處,仍可定位板體11於導電架體31的電鍍區314上。 Referring to FIG. 2 and FIG. 12, if the size of the workpiece 2 to be plated is slightly larger, when the workpiece 2 to be plated is placed on the plate 11 of the plating fixture 1, the positioning relationship between the positioning hook 321 and the positioning hole 131 has been interfered. At this time, by the elasticity of the positioning hook 321 , the position of the fine adjustment positioning hook 321 is changed from the direction of the workpiece 2 to be plated to the opposite direction to the edge of the short side 111 of the plate body 11 , and the plate body 11 can still be positioned on the conductive frame. On the plating zone 314 of the body 31.

值得說明的是,如圖1所示的電鍍治具1具有 可調式的限位單元12,透過調整每一個限位單元12定位於待電鍍工件2的周緣,可使不同尺寸的待電鍍工件2共用相同尺寸的電鍍治具1,增加電鍍治具1使用上的靈活度。 It is worth noting that the electroplating fixture 1 shown in FIG. 1 has The adjustable limiting unit 12 can be positioned on the periphery of the workpiece 2 to be plated by adjusting each of the limiting units 12, so that the workpieces 2 to be plated of different sizes can share the same size of the plating fixture 1 and the electroplating fixture 1 can be used. Flexibility.

參閱圖13與圖14,是本發明電鍍治具與電鍍掛架的組合之第二較佳實施,其與第一較佳實施例大致相同,主要差異在於電鍍治具1。本實施例電鍍治具1的結構是提供讓不同尺寸的待電鍍工件2定位的通用型電鍍治具1。 Referring to Figures 13 and 14, a second preferred embodiment of the combination of the electroplating jig and the electroplating pylon of the present invention is substantially the same as the first preferred embodiment, the main difference being the electroplating jig 1. The structure of the electroplating jig 1 of the present embodiment is to provide a general-purpose electroplating jig 1 for positioning different sizes of the workpiece 2 to be plated.

電鍍治具1的板體11僅包括多數個相間隔且貫穿的第一孔112。在本實施例中,第一孔112皆為圓孔,其中,第一孔112的排列型態概呈縱向排列,每四個第一孔112排成一列組合成第一組,每五個第一孔112排成一列組合成第二組,每一第一組的四個第一孔112以及每一第二組的五個第一孔112皆是以平行短邊側111的排列方向間隔排列,並且第一組的四個第一孔112及第二組的五個第一孔112是相互交錯排列。 The plate body 11 of the electroplating jig 1 includes only a plurality of first holes 112 spaced apart and penetrating. In this embodiment, the first holes 112 are all circular holes, wherein the arrangement patterns of the first holes 112 are arranged in a longitudinal direction, and each of the four first holes 112 is arranged in a row to form a first group, each of which is five A hole 112 is arranged in a row and combined into a second group. The four first holes 112 of each first group and the five first holes 112 of each second group are arranged at intervals of the arrangement direction of the parallel short sides 111. And the four first holes 112 of the first group and the five first holes 112 of the second group are staggered with each other.

在每兩個鄰近於短邊側111的兩個定位孔131與最鄰近於前述短邊側111的第一組第一孔112之間設置有三個第一孔112,前述三個第一孔112是以平行短邊側111的排列方向間隔排列,前述三個第一孔112與兩個定位孔131是相互交錯排列。另一方面,在定位部13的二個定位孔131之間且分別鄰近短邊側111之處排列了三個彼此相間隔的第一孔112。 Three first holes 112 are disposed between each of the two positioning holes 131 adjacent to the short side 111 and the first group of first holes 112 adjacent to the short side 111, and the three first holes 112 are provided. The three first holes 112 and the two positioning holes 131 are alternately arranged in the arrangement direction of the parallel short sides 111. On the other hand, three first holes 112 spaced apart from each other are arranged between the two positioning holes 131 of the positioning portion 13 and adjacent to the short side 111, respectively.

本發明第二較佳實施利用電鍍治具1定位待電鍍工件2,再將電鍍治具1定位於電鍍掛架3進行電鍍作業。除了鎖固件122穿伸擋塊121與穿伸定位於選定的第一孔112的接合方式,其餘方式與第一較佳實施例大致相同,不再贅述。 The second preferred embodiment of the present invention utilizes the electroplating jig 1 to position the workpiece 2 to be electroplated, and then positions the electroplating jig 1 on the electroplating rack 3 for electroplating. The rest of the manner is substantially the same as that of the first preferred embodiment except for the engagement of the locking member 122 and the extending position of the locking member 121 in the selected first hole 112, and details are not described herein again.

須說明的是,如果待電鍍工件2尺寸比較特殊,使得待電鍍工件2的周緣與選定第一孔112間的距離過大,並且現有的擋塊121尺寸無法配合待電鍍工件2的周緣與選定第一孔112間的距離,此時可另外製作符合特定尺寸的擋塊121。 It should be noted that if the size of the workpiece 2 to be plated is relatively special, the distance between the periphery of the workpiece 2 to be plated and the selected first hole 112 is too large, and the size of the existing stopper 121 cannot match the circumference of the workpiece 2 to be plated and the selected portion. The distance between one hole 112, at this time, a stopper 121 conforming to a specific size can be additionally produced.

參閱圖15至圖17,是本發明電鍍治具與電鍍掛架的組合之第三較佳實施例,其與第一較佳實施例大致相同,差異處說明如下。 Referring to Figures 15 through 17, a third preferred embodiment of the combination of the electroplating jig and the electroplating pylon of the present invention is substantially the same as the first preferred embodiment, and the differences are as follows.

在本實施例中,定位部13具有四個L形孔130,各L形孔130形成於對應的長邊側110與對應的短邊側111銜接的角隅處。電鍍掛架3的導電架體31的側立桿312具有多數貫孔315。此多數貫孔315相對設置於各電鍍區314上,各定位單元32具有四個相間隔的螺鎖件322及八個相間隔的墊塊325。各墊塊325被對應的電鍍治具1的板體11以及對應的側立桿312所夾持。各定位單元32可將位於導電架體31相反兩側且相對應的二電鍍治具1鎖固。 In the present embodiment, the positioning portion 13 has four L-shaped holes 130, and each of the L-shaped holes 130 is formed at a corner where the corresponding long side 110 and the corresponding short side 111 are engaged. The side uprights 312 of the conductive frame body 31 of the plating rack 3 have a plurality of through holes 315. The plurality of through holes 315 are oppositely disposed on the respective plating regions 314. Each of the positioning units 32 has four spaced apart screw members 322 and eight spaced spacer blocks 325. Each pad 325 is held by the plate body 11 of the corresponding plating fixture 1 and the corresponding side upright 312. Each positioning unit 32 can lock the corresponding two electroplating fixtures 1 on opposite sides of the conductive frame body 31.

各螺鎖件322具一相配合的鎖固螺絲323及一螺母324。各鎖固螺絲323以垂直二側立桿312所構成平面 之方向,穿過一選定電鍍治具1的L形孔130、墊塊325,及貫孔315,並透過貫孔315繼續穿過另一墊塊325、另一電鍍治具1的L型孔130,進而與一抵壓於電鍍治具1的螺母324相鎖固在一起,而將二電鍍治具1相對應定位於導電架體31相異兩側。換句話說,鎖固螺絲323與螺母324分別抵壓於二相對應的電鍍治具1的板體11上。其中,螺鎖件322與墊塊325選自絕緣材料。 Each of the screw locks 322 has a matching locking screw 323 and a nut 324. Each locking screw 323 is formed by a plane formed by two vertical poles 312 The direction passes through the L-shaped hole 130, the spacer 325, and the through hole 315 of the selected electroplating jig 1 and continues through the through hole 315 through the other pad 325 and the L-shaped hole of the other electroplating jig 1 130, and then locked together with a nut 324 that is pressed against the plating fixture 1, and the two electroplating fixtures 1 are correspondingly positioned on opposite sides of the conductive frame body 31. In other words, the locking screw 323 and the nut 324 are respectively pressed against the plate body 11 of the corresponding electroplating jig 1 . The screw member 322 and the spacer 325 are selected from an insulating material.

在本實施例中,墊塊325位於電鍍治具1與導電架體31的側立桿312之間,使電鍍治具1與導電架體31之間具有緩衝空間,以增進電鍍液的流通性,而得到一均勻鍍膜層。此外,利用一螺鎖件322可同時定位於導電架體31相反兩側且相對應的二電鍍治具1,也就是導電架體31的前後兩側。此種設置可減少螺鎖件322的需求量,進而降低生產成本。 In this embodiment, the spacer 325 is located between the plating fixture 1 and the side upright 312 of the conductive frame 31, so as to have a buffer space between the plating fixture 1 and the conductive frame 31 to improve the flowability of the plating solution. And a uniform coating layer is obtained. In addition, a screw lock 322 can be simultaneously positioned on opposite sides of the conductive frame body 31 and corresponding to the two electroplating fixtures 1, that is, the front and rear sides of the conductive frame body 31. This arrangement reduces the amount of screw lock 322 required, thereby reducing production costs.

本發明第三較佳實施利用電鍍治具1定位待電鍍工件2,再將電鍍治具1定位於電鍍掛架3進行電鍍作業。除了定位方式是用螺鎖外,其餘方式與第一較佳實施例大致相同,不再贅述。 The third preferred embodiment of the present invention utilizes the electroplating jig 1 to position the workpiece 2 to be electroplated, and then positions the electroplating jig 1 on the electroplating pylon 3 for electroplating. The rest of the method is substantially the same as that of the first preferred embodiment except that the positioning method is a screw lock, and details are not described herein again.

依上所述,第一、二、三實施例皆透過選擇適當擋塊121將待電鍍工件2定位於板體11,再將電鍍治具1的定位部13定位於電鍍掛架,繼而將電鍍針33移到待電鍍工件2的適當處,將不使用的電鍍針33的導接部331加以絕緣包覆,而成為通用型的電鍍治具1及電鍍掛架3。 According to the above description, the first, second and third embodiments respectively position the workpiece 2 to be electroplated on the plate body 11 by selecting an appropriate stopper 121, and then position the positioning portion 13 of the electroplating jig 1 on the plating rack, and then electroplating. The needle 33 is moved to an appropriate position of the workpiece 2 to be plated, and the conductive portion 331 of the unused plating needle 33 is insulated and coated to form a general-purpose plating fixture 1 and a plating hanger 3.

參閱圖18至圖20,是本發明電鍍治具與電鍍 掛架的組合之第四較佳實施例,其與第一較佳實施例大致相同,差異處說明如下。 Referring to Figures 18 to 20, the electroplating fixture and electroplating of the present invention A fourth preferred embodiment of the combination of pylons is substantially the same as the first preferred embodiment, and the differences are explained below.

在本實施例中,電鍍治具1概呈一矩形,並包括一板體11、一限位單元12,及一定位部13。板體11具有一基板14及一柵板16。在本實施例中,限位單元12具有一圍繞框15及兩個限位件17。 In the present embodiment, the electroplating fixture 1 has a rectangular shape and includes a plate body 11, a limiting unit 12, and a positioning portion 13. The board body 11 has a substrate 14 and a grid 16. In this embodiment, the limiting unit 12 has a surrounding frame 15 and two limiting members 17 .

基板14具有一呈U形狀的外周緣壁141、一連接U形外周緣壁141兩頂端的頂緣壁142,及一前表面143。圍繞框15呈一開口朝上的U形狀,圍繞框15凸伸出基板14的前表面143,外周緣壁141與圍繞框15的外壁面共平面,圍繞框15與基板14共同界定出一用以承載待電鍍工件2的承載空間18。藉由圍繞框15卡合待電鍍工件2周緣,使得待電鍍工件2能定位於承載空間18內。 The substrate 14 has a U-shaped outer peripheral wall 141, a top edge wall 142 connecting the top ends of the U-shaped outer peripheral wall 141, and a front surface 143. A U-shape is formed around the frame 15 with an opening facing upward, and the front surface 143 of the substrate 14 is protruded around the frame 15. The outer peripheral wall 141 is coplanar with the outer wall surface surrounding the frame 15, and the frame 15 and the substrate 14 are defined together. To carry the load-bearing space 18 of the workpiece 2 to be electroplated. By engaging the periphery of the workpiece 2 to be plated around the frame 15, the workpiece 2 to be plated can be positioned within the load-bearing space 18.

基板14還具有一位於外周緣壁141與頂緣壁142內側的內周緣壁144,且外周緣壁141、頂緣壁142與內周緣壁144共同界定出一中空框體,柵板16連接於基板14的內周緣壁144,柵板16後平面(圖未示)與基板14的一後表面145共平面,且柵板16前平面與基板14內周緣壁144共同界定出一流通空間19。即基板14的內周緣壁144界定出一與承載空間18相連通且位於柵板16前側的流通空間19。在本實施例中,柵板16由一個橫向柵板與兩個相間隔縱向柵板與內周緣壁144相互連結所組成,而基板14的內周緣壁144與柵板16共同界定出複數個彼此相間隔的流通口191,流通口191用以使流通空間19與電鍍治具1 的外部空間相連通,藉此,電鍍液可經由流通口191流入流通空間19內,以增加電鍍液的流動性及流動範圍,使得電鍍液能均勻地流動至待電鍍工件2的表面上,讓待電鍍工件2表面電鍍後能形成一層均勻的鍍膜。 The substrate 14 further has an inner peripheral wall 144 located inside the outer peripheral wall 141 and the top edge wall 142, and the outer peripheral wall 141, the top edge wall 142 and the inner peripheral wall 144 together define a hollow frame, and the grid 16 is connected to The inner peripheral wall 144 of the substrate 14 and the rear plane (not shown) of the grid 16 are coplanar with a rear surface 145 of the substrate 14, and the front plane of the grid 16 and the inner peripheral wall 144 of the substrate 14 define a flow space 19. That is, the inner peripheral wall 144 of the substrate 14 defines a flow space 19 that communicates with the load bearing space 18 and is located on the front side of the grid plate 16. In the present embodiment, the grid 16 is composed of a transverse grid and two spaced apart longitudinal grids and an inner peripheral wall 144, and the inner peripheral wall 144 of the substrate 14 and the grid 16 define a plurality of mutually The flow port 191 is spaced apart, and the flow port 191 is used to make the flow space 19 and the plating fixture 1 The external space is connected, whereby the plating solution can flow into the circulation space 19 via the flow port 191 to increase the fluidity and flow range of the plating solution, so that the plating solution can uniformly flow to the surface of the workpiece 2 to be plated, so that After the surface of the workpiece 2 to be electroplated is electroplated, a uniform coating can be formed.

需說明的是,流通口191的設計數量不以本實施例的數量為限,可視需求設為一個或是多個。此外,藉由柵板16連接於基板14內周緣壁144的設計方式,能提升電鍍治具1的結構強度,以避免電鍍治具1因強度不足而產生變形的情形。 It should be noted that the number of the design of the flow port 191 is not limited to the number of the embodiment, and one or more can be set as needed. Further, by the design in which the grid plate 16 is connected to the inner peripheral wall 144 of the substrate 14, the structural strength of the plating jig 1 can be improved to prevent the plating jig 1 from being deformed due to insufficient strength.

圍繞框15具有一下框壁151,及兩分別連接於下框壁151相異兩端點的側框壁152。兩限位件17凸設於基板14的前表面143且鄰近於頂緣壁142,兩限位件17彼此相間隔且分別鄰近於兩側框壁152,各限位件17呈一凸柱狀。此外,圍繞框15前表面的內緣邊線以及兩限位件17前表面下緣邊線共同界定出一與承載空間18相連通的前開口181,基板14的頂緣壁142邊線以及兩限位件17相對應的內側壁之間共同界定出一與承載空間18相連通的上開口182。欲將待電鍍工件2組裝於電鍍治具1時,使用者可將待電鍍工件2經由前開口181安裝於承載空間18內,使下框壁151、兩側框壁152以及兩限位件17分別夾持於待電鍍工件2周緣,藉此,使得待電鍍工件2能穩固地定位於承載空間18內。欲將待電鍍工件2拆離電鍍治具1時,使用者可將手指穿伸入上開口182內並將待電鍍工件2頂側朝前開口181方向扳動,能將待電鍍工件2與兩 限位件17分離,使得使用者可經由前開口181將待電鍍工件2移離承載空間18。 The surrounding frame 15 has a lower frame wall 151 and two side frame walls 152 respectively connected to different ends of the lower frame wall 151. The two limiting members 17 are protruded from the front surface 143 of the substrate 14 and adjacent to the top edge wall 142. The two limiting members 17 are spaced apart from each other and adjacent to the two side frame walls 152, and each of the limiting members 17 has a convex column shape. . In addition, the inner edge line around the front surface of the frame 15 and the lower edge edge of the front surface of the two limiting members 17 jointly define a front opening 181 communicating with the bearing space 18, a top edge wall 142 of the substrate 14 and two limiting members. An upper opening 182 that communicates with the load bearing space 18 is defined by a corresponding inner side wall. When the workpiece 2 to be plated is to be assembled to the plating fixture 1, the user can install the workpiece 2 to be plated into the bearing space 18 via the front opening 181, so that the lower frame wall 151, the two side frame walls 152, and the two limiting members 17 They are respectively clamped on the circumference of the workpiece 2 to be plated, whereby the workpiece 2 to be plated can be stably positioned in the bearing space 18. When the workpiece 2 to be electroplated is to be detached from the electroplating fixture 1, the user can insert the finger into the upper opening 182 and pull the top side of the workpiece 2 to be plated toward the front opening 181, and the workpiece to be electroplated can be 2 and 2 The limiting member 17 is separated such that the user can move the workpiece 2 to be plated away from the bearing space 18 via the front opening 181.

電鍍治具1的定位部13具有多數個定位凹槽132。在本實施例中,定位凹槽132的數量為八個,當然,也可視實際須求調整定位凹槽132的數量。電鍍治具1的各側邊分別具有兩個定位凹槽132。首先說明的是上下各兩個的定位凹槽132,其中兩個定位凹槽132是由基板14的頂緣壁142朝下框壁151向下凹陷所形成,另外兩個定位凹槽132則是由下框壁151底面及基板14的外周緣壁141底面朝頂緣壁142向上凹陷所形成。接著說明的是左右各兩個的定位凹槽132,其中兩個定位凹槽132是由對應的一個側框壁152外壁面及基板14的外周緣壁141朝另一個側框壁152向內凹陷所形成,另外兩個定位凹槽132是由對應的另一個側框壁152外壁面及基板14的外周緣壁141朝另一個側框壁152向內凹陷所形成。各定位單元32的四個定位勾321分別穿伸於左右各兩個的定位凹槽132並夾持電鍍治具1。須說明的是,由於每一個電鍍掛架3的導電架體31的承載框310的長度及寬度尺寸皆配合電鍍治具1的尺寸做調整,且如果電鍍掛架3的各定位單元32的四個定位勾321是分別位於電鍍治具1的上下兩相反側,則各定位單元32的四個定位勾321分別穿伸於上下各兩個的定位凹槽132並夾持電鍍治具1。 The positioning portion 13 of the electroplating jig 1 has a plurality of positioning grooves 132. In the present embodiment, the number of the positioning grooves 132 is eight. Of course, the number of the positioning grooves 132 may be adjusted as needed. Each side of the electroplating jig 1 has two positioning grooves 132. Firstly, two positioning grooves 132 are provided, wherein two positioning grooves 132 are formed by recessing the top edge wall 142 of the substrate 14 toward the lower frame wall 151, and the other two positioning grooves 132 are The bottom surface of the lower frame wall 151 and the bottom surface of the outer peripheral edge wall 141 of the substrate 14 are recessed upward toward the top edge wall 142. Next, two positioning grooves 132 are illustrated, wherein the two positioning grooves 132 are recessed inwardly from the outer wall surface 152 of the corresponding one side frame wall 152 and the outer peripheral wall 141 of the substrate 14 toward the other side frame wall 152. The other two positioning grooves 132 are formed by recessing the outer wall surface 152 of the corresponding other side frame wall 152 and the outer peripheral wall 141 of the substrate 14 toward the other side frame wall 152. The four positioning hooks 321 of each positioning unit 32 respectively extend through the two positioning grooves 132 on the left and right sides and sandwich the plating fixture 1. It should be noted that since the length and the width dimension of the bearing frame 310 of the conductive frame body 31 of each plating rack 3 are adjusted according to the size of the plating fixture 1, and if the positioning units 32 of the plating rack 3 are four The positioning hooks 321 are respectively located on the opposite sides of the upper and lower sides of the electroplating jig 1 , and the four positioning hooks 321 of each positioning unit 32 respectively extend through the two positioning grooves 132 of the upper and lower sides and sandwich the electroplating jig 1 .

本實施例依常規待電鍍工件2的寬度或長度來設計通用型電鍍治具1的尺寸,藉由將待電鍍工件2卡合 於通用型電鍍治具1的至少一對邊,再將電鍍治具1的定位部13定位於前述第一實施例的通用型電鍍掛架3,使之成為通用型電鍍治具1及電鍍掛架3。 In this embodiment, the size of the general-purpose electroplating jig 1 is designed according to the width or length of the workpiece 2 to be electroplated, by clamping the workpiece 2 to be plated. Positioning portion 13 of electroplating jig 1 is positioned on general-purpose electroplating gantry 3 of the first embodiment in at least one pair of general-purpose electroplating jigs 1, so that it becomes a general-purpose electroplating jig 1 and electroplating Shelf 3.

此外,由於如圖20所示的第四較佳實施例的電鍍治具1的承載空間18是針對特定的待電鍍工件2設計,藉由此種特定的電鍍治具1的設計,可避免上述待電鍍工件2受外力的施壓而變形。換句話說,在電鍍製程中,上述的待電鍍工件2只受到電鍍針33所施壓的力,因此電鍍治具1的設計適合剛性較弱的待電鍍工件2可分離地放置於其上。 In addition, since the bearing space 18 of the electroplating jig 1 of the fourth preferred embodiment shown in FIG. 20 is designed for a specific workpiece 2 to be electroplated, the design of the specific electroplating jig 1 can be avoided. The workpiece 2 to be plated is deformed by the application of an external force. In other words, in the electroplating process, the above-mentioned workpiece 2 to be electroplated is only subjected to the force applied by the electroplating needle 33, so that the electroplating jig 1 is designed to be detachably placed on the workpiece 2 to be plated which is less rigid.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.

1‧‧‧電鍍治具 1‧‧‧Electroplating fixture

11‧‧‧板體 11‧‧‧ board

12‧‧‧限位單元 12‧‧‧Limited unit

121‧‧‧擋塊 121‧‧‧blocks

122‧‧‧鎖固件 122‧‧‧Locker

13‧‧‧定位部 13‧‧‧ Positioning Department

2‧‧‧待電鍍工件 2‧‧‧Working parts to be plated

3‧‧‧電鍍掛架 3‧‧‧Electroplating rack

31‧‧‧導電架體 31‧‧‧ Conductive frame

311‧‧‧主立桿 311‧‧‧Main pole

312‧‧‧側立桿 312‧‧‧ Side pole

314‧‧‧電鍍區 314‧‧‧ plating area

32‧‧‧定位單元 32‧‧‧ Positioning unit

321‧‧‧定位勾 321‧‧‧ positioning hook

33‧‧‧電鍍針 33‧‧‧Electroplating needle

331‧‧‧導接部 331‧‧‧Guidance

Claims (9)

一種電鍍治具,適用結合於一電鍍掛架,該電鍍掛架包括多數對定位單元,且該電鍍治具供至少一待電鍍工件以可分離方式結合於該電鍍治具,該電鍍治具包含:一板體,供該待電鍍工件設置且開設有多數開孔;多數個限位單元,當該待電鍍工件設置於該板體上時,該等限位單元係供選擇性穿設於該等開孔的其中至少二者,且至少分別夾持該待電鍍工件的兩相異側;及一對定位部,分別形成於該板體的兩相異側,用以結合於該電鍍掛架的其中一對該定位單元。 An electroplating fixture is suitable for being combined with a plating rack, the plating rack includes a plurality of pairs of positioning units, and the electroplating fixture is configured to detachably bond the at least one workpiece to be electroplated to the electroplating fixture, the electroplating fixture comprising a plate body for the workpiece to be plated and provided with a plurality of openings; a plurality of limiting units, when the workpiece to be plated is disposed on the plate, the limiting units are selectively disposed on the plate And at least two of the openings, and at least respectively clamping the two opposite sides of the workpiece to be plated; and a pair of positioning portions respectively formed on opposite sides of the plate for coupling to the plating hanger One of the pair of positioning units. 如請求項1所述電鍍治具,其中,各該限位單元包括一擋塊及一鎖固件,各該擋塊抵靠於該板體並抵靠於該待電鍍工件周緣,而各該鎖固件穿過對應的該擋塊與選定的該開孔,使對應的該擋塊鎖固於該板體上。 The electroplating fixture of claim 1, wherein each of the limiting units comprises a stopper and a locking member, each of the blocking members abutting against the plate body and abutting the periphery of the workpiece to be plated, and each of the locking members The firmware passes through the corresponding one of the stops and the selected opening, so that the corresponding block is locked to the plate. 如請求項2所述電鍍治具,其中,該等擋塊為同心圓擋塊、偏心圓擋塊、方形擋塊,及長條擋塊其中之一。 The electroplating jig according to claim 2, wherein the stoppers are one of a concentric circular block, an eccentric circular stopper, a square stopper, and a long stopper. 如請求項2所述電鍍治具,其中,各該鎖固件具有一鎖固螺絲,及一鎖固於該鎖固螺絲並抵於該板體的螺母,各該擋塊與各該螺母分別位於該板體的相反兩面,且各該鎖固件可滑移地固定於選定的各該開孔。 The electroplating jig according to claim 2, wherein each of the locks has a locking screw, and a nut that is locked to the locking screw and abuts the plate body, and each of the stoppers and the nut are respectively located The opposite sides of the plate body, and each of the fasteners is slidably fixed to each of the selected openings. 如請求項1所述電鍍治具,其中,該板體係具有複數對該等開孔,當該待電鍍工件設置於該板體上時,該等限位單元係選擇性穿設於該等複數對開孔的其中一對開孔。 The electroplating jig according to claim 1, wherein the plate system has a plurality of such openings, and when the workpiece to be electroplated is disposed on the plate, the limiting units are selectively disposed in the plurality of One pair of openings for the opening. 一種電鍍治具與電鍍掛架的組合,包含:如請求項1至5之任一項所述的電鍍治具,供至少一待電鍍工件藉由可分離方式結合於其上;一電鍍掛架,包括:一導電架體,包覆一絕緣層,並界定多數供該電鍍治具放置的電鍍區,多數對定位單元,分別設置於該導電架體的該等電鍍區處,對應的各該對定位單元用以與該電鍍治具的該對定位部相結合,使該電鍍治具可分離地結合於該導電架體的其中一該電鍍區,及多數電鍍針,分別設置於各該電鍍區,各該電鍍針的一端具一絕緣包覆之電連部,且另一端具一外露的導接部,各該電連部電連接該導電架體,各該導接部用以抵接於設於該電鍍區的該電鍍治具上的該待電鍍工件。 A combination of a plating fixture and a plating rack, comprising: the electroplating fixture according to any one of claims 1 to 5, wherein at least one workpiece to be electroplated is detachably coupled thereto; a plating rack The method includes: a conductive frame covering an insulating layer, and defining a plurality of plating regions for the plating fixture, and a plurality of positioning units are respectively disposed at the plating regions of the conductive frame, corresponding to each The positioning unit is configured to be coupled to the pair of positioning portions of the electroplating jig such that the electroplating jig is detachably coupled to one of the electroplating regions of the conductive frame body, and a plurality of electroplating pins are respectively disposed on each of the electroplating electrodes Each of the plating pins has an insulated and electrically connected portion, and the other end has an exposed connecting portion, and each of the electrical connecting portions is electrically connected to the conductive frame, and each of the guiding portions is used for abutting The workpiece to be electroplated on the electroplating fixture provided in the electroplating zone. 如請求項6所述電鍍治具與電鍍掛架的組合,其中,該導電架體包括一縱向延伸的主立桿,及一設置於該主立桿上的承載框,該主立桿與該承載框共同界定該等沿縱向排列的電鍍區,該等定位單元分別設置於該承載框,且該等電鍍針分別設置於該主立桿上。 The combination of the electroplating fixture and the electroplating rack of claim 6, wherein the conductive frame body comprises a longitudinally extending main pole, and a bearing frame disposed on the main pole, the main pole and the The carrying frames collectively define the electroplating zones arranged in the longitudinal direction. The positioning units are respectively disposed on the carrying frame, and the electroplating pins are respectively disposed on the main pole. 如請求項6所述電鍍治具與電鍍掛架的組合,其中,該電鍍掛架還包括相對設置於各該電鍍區的多數個貫孔,該等定位單元具多數個螺鎖件與多數個墊塊,該等墊塊位於該等電鍍治具與該導電架體之間,各該螺鎖件穿過至少一 該電鍍治具對應的該定位部、對應的該等墊塊及對應的該貫孔。 The combination of the electroplating fixture and the electroplating rack of claim 6, wherein the electroplating rack further comprises a plurality of through holes disposed opposite to the electroplating zones, the positioning units having a plurality of screw locks and a plurality of a spacer, the spacer is located between the electroplating fixture and the conductive frame, and each of the screw members passes through at least one The electroplating fixture corresponds to the positioning portion, the corresponding spacers and the corresponding through holes. 如請求項7所述電鍍治具與電鍍掛架的組合,其中,各該定位單元具有由該承載框所構成的平面向外延伸,且分別穿伸於各該定位孔的定位勾。 The combination of the electroplating jig and the electroplating gantry according to claim 7, wherein each of the positioning units has a positioning hook formed by the plane formed by the carrying frame and extending through the positioning holes.
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