KR101620496B1 - LED lighting device using heat sink for reflector - Google Patents

LED lighting device using heat sink for reflector Download PDF

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Publication number
KR101620496B1
KR101620496B1 KR1020150133048A KR20150133048A KR101620496B1 KR 101620496 B1 KR101620496 B1 KR 101620496B1 KR 1020150133048 A KR1020150133048 A KR 1020150133048A KR 20150133048 A KR20150133048 A KR 20150133048A KR 101620496 B1 KR101620496 B1 KR 101620496B1
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KR
South Korea
Prior art keywords
heat sink
led
weight
circuit board
heat
Prior art date
Application number
KR1020150133048A
Other languages
Korean (ko)
Inventor
동우승
권경준
Original Assignee
(주)티플러스조명
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Priority to KR1020150133048A priority Critical patent/KR101620496B1/en
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Publication of KR101620496B1 publication Critical patent/KR101620496B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21K9/30—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/04—Controlling the distribution of the light emitted by adjustment of elements by movement of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21Y2101/02—

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED lighting apparatus having a heat sink serving as a reflection plate, and more particularly, to an LED lighting apparatus having a heat sink having a novel structure using a heat sink, .
To this end, the present invention provides a heat sink comprising: a base heat sink; a heat sink integrally formed on the circumferential surface of the base heat sink and formed of a plurality of heat sinks for both of the reflector plates bent at a desired angle toward a desired direction; A circuit board mounted on the bottom surface of the base heat dissipation plate, the circuit board being mounted on the top surface and the bottom surface with LEDs; Wherein the heat sink and the reflector plate are bent at an angle reflecting the light of the LED attached on the upper surface of the circuit board in a desired direction.

Description

Technical Field [0001] The present invention relates to an LED lighting device using a heat sink,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED lighting apparatus having a heat sink serving as a reflection plate, and more particularly, to an LED lighting apparatus having a heat sink having a novel structure using a heat sink, .

LED (Light Emitting Diode) has a low power consumption, low power consumption, no need for preheating time, fast lighting and extinction speed, strong shock and safety due to no gas or filament, and long service life. It is possible to display a color lighting effect.

Although the LED has been widely used in recent years due to its many advantages, it has a disadvantage in that it generates heat due to driving because it is a kind of semiconductor device.

Accordingly, in order to efficiently discharge the heat emitted from the LED to the outside, the LED lighting apparatus is equipped with a heat sink, which is a kind of heat releasing means.

However, most of the heat sink functions to discharge the heat generated from the LED module to the outside through contact with the outside air. However, simply increasing the contact area with the outside air has a limitation in increasing the heat radiation efficiency have.

In addition, the existing heat sink is located at a specific point where the light is emitted from the LED, and merely performs a heat emitting function, which is a disadvantage that it hinders the LED light from being emitted in all directions.

Korean Patent Laid-Open Publication No. 10-2013-0015653 (2013.02.14) Korean Patent Laid-Open Publication No. 10-2013-0015656 (Feb.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to improve the structure of the heat sink to a structure capable of maximizing the heat radiation effect by increasing the contact area with outside air, The LED lighting device according to claim 1, wherein the reflector has a light-emitting surface.

According to an aspect of the present invention, there is provided a heat sink comprising: a base heat sink; a heat sink integrally formed on a circumferential surface of the base heat sink, the heat sink including a plurality of heat sinks for both reflecting plates bent at a desired angle toward a desired direction; And a circuit board attached to the bottom surface of the base heat dissipating plate, wherein the heat dissipating vane is formed by bending the light of the LED attached to the upper surface of the circuit board at an angle reflecting the light in a desired direction And an LED lighting device having a heat sink serving as a reflection plate.

Particularly, the LEDs attached to the upper surface of the circuit board are arranged between the heat radiating blades serving as both the reflector plates when the heat radiating blades serving as the reflector plate are spread to be flush with the base heat sink.

Preferably, the circuit board has an upper circuit board on which an LED is mounted, and a lower circuit board on which an LED is mounted, laminated on the circuit board.

Further, the heat radiating blades combined with the reflector are bent at an angle to be wrapped by the housing for the LED lighting apparatus.

Through the above-mentioned means for solving the problems, the present invention provides the following effects.

First, since the heat emitted from the LED can be directly absorbed from the heat dissipating blade for both the base heat dissipating plate and the reflector, the heat dissipating path can be maximized by shortening the heat dissipating path.

Second, in addition to the LED light attached to the bottom surface of the circuit board, the LED light applied to the upper surface of the circuit board is reflected in the other direction in the heat sink for the reflection plate, The light irradiation rate can be maximized.

FIG. 1 is a front view and a plan view showing an LED module in a configuration of an LED lighting apparatus having a heat sink serving as a reflection plate according to the present invention,
FIG. 2 is a perspective view illustrating a state that a heat sink serving as a reflector according to the present invention is combined with an LED module,
FIG. 3 is a bottom view and a plan view showing a state in which a heat sink serving as a reflection plate and a heat sink according to the present invention are combined with an LED module,
4 is a perspective view showing a state in which a heat sink combined with a reflector according to the present invention is combined with an LED module,
5 and 6 are sectional views showing an LED lighting device having a heat sink serving as a reflection plate according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention can maximize the heat radiation effect by allowing the heat emitted from the LED to be emitted through the heat sink and the heat sink for both the base heat sink and the reflector. In particular, the LED light attached to the upper surface of the circuit board in the heat sink, It is a point of maximizing the light irradiation rate of the LED illuminating device because the irradiation angle of the LED has a broadband irradiation angle.

FIG. 1 is a front view and a plan view showing an LED module in a configuration of an LED lighting device having a heat sink serving as a reflection plate according to the present invention, FIG. 2 is a view illustrating a state in which the heat sink, FIG. 3 is a bottom view and a plan view showing a state in which a heat sink serving also as a reflector according to the present invention is coupled with an LED module. FIG.

2, the heat sink 10 serving as a reflection plate of the present invention is made of a thin plate type using an aluminum material having a high thermal conductivity and includes a base heat sink 12 to which a circuit board 20 of an LED module is attached, And a plurality of heat radiating blades 14 serving as both of the reflector plates.

More specifically, the heat sink 10 includes an aluminum thin plate having a predetermined size and a plurality of heat radiating blades 14 serving as a plurality of reflector plates at an outer peripheral portion of the base heat sink 12, And punching the aluminum foil into the punching die so that the aluminum foil is integrally formed.

2, the heat sink 10 includes a circular base heat sink 12 to which the circuit board 22 of the LED module 20 is directly attached, And a plurality of heat radiating blades (14) which are integrally formed on the circumferential surface so as to be able to bend at a desired angle toward a desired direction.

A plurality of heat radiating blades 14 serving as both of the reflector plates of the heat sink 10 are integrally formed at an outer peripheral portion of the base heat sink 12 so as to be equally spaced. Is bent in conformity with the inner wall surface shape (e.g., a curved shape, a straight shape, a streamlined cross-sectional shape, or the like) of the housing (not shown) of the lighting apparatus, and more preferably bent in a direction to reflect the LED light.

In one embodiment, as shown in Fig. 4, the heat radiating vanes 14 for both the reflector plates can be bent at the same angle all at once using a normal bending punch.

Hereinafter, the structure of the LED lighting apparatus of the present invention using the heat sink combined with the reflector will be described in the order of assembly.

Referring to FIG. 1, the LED module 20 is provided.

The LED module 20 includes a circuit board 22 having a predetermined area connected to a power supply unit and an LED 26 attached to the bottom and top surfaces of the circuit board 22.

Next, the LED module 20 is attached to the heat sink 10 described above.

2 and 3, the upper surface of the circuit board 22 of the LED module 20 is bonded to the bottom surface of the base heat sink 12 of the heat sink 10 by using a thermally conductive adhesive resin The LEDs 26 attached to the bottom surface of the circuit board 22 are arranged so as to be irradiated in a downward direction so that the LEDs attached to the upper surface of the circuit board 22 are irradiated with light It is possible to arrange it.

The LEDs 26 attached to the upper surface of the circuit board 22 are arranged between the heat radiating blades 14 serving as both the reflective plates when the heat radiating blades 14 serving as the reflector plate are spread to be flush with the base heat sinks 12. [ .

Then, as shown in FIG. 4, the heat radiating blades 14 serving as the reflection plate of the heat sink 10 are bent at a desired angle toward the upper surface of the base heat sink 12, and are preferably surrounded by the inner wall surface of the housing The folds are bent at an angle.

More preferably, the heat radiating vane (14) serving as both the reflector plate is bent at an angle to reflect the LED light attached to the upper surface of the circuit board (22) in a desired direction.

Next, as shown in FIGS. 5 and 6, the heat sink 10 including the base heat sink 12 with the LED module 20 and the heat sink vane 14 serving as the reflector plate is housed in the housing for the LED lighting apparatus The LED lighting apparatus having the heat sink serving as both the reflector of the present invention is completed.

Therefore, the base heat sink 12 of the heat sink 10 is in direct contact with the LED module 20, thereby easily absorbing the heat emitted from the LED 26 and passing through the heat sink vane 14 Can be released.

5 and 6, when the heat radiating blades 14 serving as both the reflector plates of the heat sink 10 are arranged in a desired direction from the LED 26 attached to the upper surface of the circuit board 22 .

That is, in addition to the light of the LED 26 attached to the bottom surface of the circuit board 22, the light reflected by the LED 26 attached to the upper surface of the circuit board 22 is reflected by the heat- , The irradiation angle of the LEDs has a wideband irradiation angle, and the light irradiation rate of the LED lighting device can be maximized.

6, the circuit board 22 of the LED module 20 is mounted on the upper surface of the upper circuit board 22a with the LED 26 and the lower circuit board 22b with the LED 26 attached on the lower surface thereof. ) Can be applied as a laminated structure.

On the other hand, a coating layer containing a silicon component may be formed on the surface of the LED 26. The coating layer suppresses adhesion of microorganisms and floating matters to the LED 26 so as not to lower the illuminance of the LED 26,

A method of preparing the coating solution of the coating layer will be briefly described. First, dimethyldichlorosilane solution is dissolved in ethyl acetate at a volume ratio of 2-5% to prepare a coating solution. At this time, if the content of the dimethyldichlorosilane solution is less than 2%, the coating effect can not be sufficiently obtained, and if it exceeds 5%, the coating layer becomes too thick and the efficiency drops.

In view of the coating time and the coating thickness, it is preferable that the viscosity of the solution is in the range of 0.8-2 cp (centipoise). This is because if the viscosity is too low, the coating time must be long. If the viscosity is too high, the coating may become thick and dry, and non-uniform coating may cause the sensor to come out.

In the present invention, the surface of the LED 26 is coated to a thickness of 1 탆 or less with the coating solution prepared as described above. At this time, if the thickness of the coating layer exceeds 1 탆, the roughness is rather lowered. Therefore, in the present invention, the thickness of the coating layer is limited to 1 탆 or less. As a coating method having the above-described thickness, a spray method in which the surface of the LED 26 is sprayed about 2-3 times may be used.

Since the coating layer for preventing adhesion of microorganisms and floating matters is coated on the surface of the LED 26 as described above, the illuminance of the LED 26 is not lowered, thereby extending the service life of the LED 26.

In addition, the surface of the heat sink 10 is coated with a perfume material having a function such as a treatment for respiratory diseases, thereby relieving the fatigue of the operator and promoting health.

The functional oil may be mixed with 95 to 97% by weight of the perfume material, 3 to 5% by weight of the functional oil, 30% by weight of the lavender spike, 30% by weight of the lime- 20% by weight of Manuka, and 20% by weight of Inula.

It is preferable that the functional oil is mixed in an amount of 3 to 5% by weight based on the perfume. If the mixing ratio of the functional oil is less than 3 wt%, the effect is insignificant. If the mixing ratio of the functional oil exceeds 5 wt%, the function is not greatly improved, but the manufacturing cost is greatly increased.

Among the functional oils, Lavender Spike is mainly composed of pinene, camphene, myrcene, etc. It has good effect on pain relief, antidote, decongestion, sterilization and wound healing.

Lime blossom oil has good effects on stroke or heat stroke, epilepsy, dizziness, migraine and hypertension, and especially works to raise blood pressure due to psychological stress.

Manuka (Manuka) is a major chemical ingredient that can be caryophyllene, geraniol, pinene, etc., and is effective in preventing respiratory infections such as colds, coughs, bronchitis and rhinitis.

Inula is effective for treatment of respiratory-related diseases such as chronic cough, dry cough, sputum as well as asthma and bronchitis pneumonia.

Since the functional oil is coated on the surface of the heat sink 10, it contributes to restoration of the fatigue of the operator during the fabrication and assembly of the heat sink 10 and improves health.

And, the housing can be made of duck tile cast iron. This dough tile cast iron is heated to 1600 ~ 1650 캜 to be molten, then subjected to desulfurization treatment, spherodizing treatment agent containing 0.3 ~ 0.7% by weight of magnesium, spheronized at 1500 ~ 1550 캜, and heat treated.

Dough tile cast iron is a cast iron in which graphite is spherically crystallized during the solidification process by adding magnesium and the like to the molten metal of the common gray cast iron, so the shape of the graphite is spherical compared to gray cast iron. Since the ductile cast iron has a less notch effect, the stress concentration phenomenon is reduced and the strength and toughness are greatly improved.

In the housing of the present invention, the dough tile cast iron is heated to 1600 to 1650 占 폚 to be molten, then subjected to a desulfurization treatment, and a spheroidizing treatment agent containing about 0.3 to 0.7% by weight of magnesium is put into a spheroidizing treatment at 1500 to 1550 占 폚, .

Here, when the cast iron of the duck tile is heated to less than 1600 ° C, the entire structure is not sufficiently melted. If the cast iron is heated above 1650 ° C, unnecessary energy is wasted. Therefore, it is desirable to heat the dirt tile cast iron to 1600 ~ 1650 ℃.

If the amount of magnesium is less than 0.3 wt%, the effect of injecting the spheroidizing agent is negligible. If the amount of magnesium is more than 0.7 wt%, the effect of injecting spheroidizing agent There is a problem in that an expensive material cost is increased. Therefore, the mixing ratio of magnesium in the spheroidizing agent is preferably about 0.3 to 0.7% by weight.

When the spheroidizing treatment agent is injected into the molten dull tile cast iron, it is subjected to spheroidizing treatment at 1500~1550 ° C. If the spheroidizing treatment temperature is lower than 1500 ° C., the spheroidizing treatment is not properly performed. If the spheroidizing treatment temperature is higher than 1550 ° C., the spheroidizing treatment effect is not greatly improved, but unnecessary energy is wasted. Therefore, the spheroidization treatment temperature is preferably 1500 to 1550 ° C.

Since the housing of the present invention is made of the cast iron of the present invention, the stress concentration phenomenon is reduced because the notch effect is small, and the strength and toughness are greatly improved.

Further, RD (Polymerized trimethyl dihydroquinoline) may be added to the thermally conductive adhesive resin in order to increase the oxidation resistance. Such RD increases ozone resistance and oxidation resistance and prevents corrosion and oxidation of the thermally conductive adhesive resin.

The present invention preferably includes 0.4 to 1.2 parts by weight of RD in the thermally conductive adhesive resin. This is because if the addition amount of RD is less than the above-mentioned range, it is difficult to obtain oxidation resistance, and if it exceeds the above-mentioned range, the density and firmness of the tissue are affected.

In the present invention, since RD is further added to the thermally conductive adhesive resin, the oxidation resistance is greatly improved, and thus the service life of the product can be maximized.

A discoloring portion whose color changes according to the temperature can be applied to one side of the heat sink 10. The discoloring portion is coated on the surface of the heat sink 10 with two or more color-change materials whose color changes when the temperature is equal to or higher than a predetermined temperature, and is separated into two or more sections according to the temperature change, And a protective film layer is coated on the discolored portion to prevent the discolored portion from being damaged.

Here, the discoloring portion may be formed by coating a temperature-discoloring material having a discoloration temperature of 40 DEG C or more and 60 DEG C or more, respectively. The discoloring portion is for detecting a change in temperature of the paint due to a change in color depending on the temperature of the heat sink 10.

The discoloring portion may be formed by coating a heat discoloration material having a color change on the heat sink 10 when the discoloring portion is heated to a predetermined temperature or more. In addition, the temperature discoloring substance is generally composed of a microcapsule structure having a size of 1 to 10 탆, and the microcapsules can exhibit a colored and transparent color due to the bonding and separation phenomenon depending on the temperature of the electron donor and the electron acceptor.

In addition, the temperature-changing materials can change color quickly and have various coloring temperatures such as 40 ° C, 60 ° C, 70 ° C, and 80 ° C, and such coloring temperature can be easily adjusted by various methods. Such a temperature-coloring material may be various kinds of temperature-coloring materials based on principles such as molecular rearrangement of an organic compound and spatial rearrangement of an atomic group.

For this purpose, it is preferable that the discoloring portion is formed so as to be separated into two or more sections according to the temperature change by coating two or more temperature discoloring materials having different discoloration temperatures. The temperature-coloring layer preferably uses a temperature-coloring material having a relatively low temperature of the discoloration temperature and a temperature-discoloring material having a relatively high discoloration temperature, more preferably a discoloration temperature of not lower than 40 ° C and not lower than 60 ° C A color change portion can be formed by using a temperature coloring material.

Accordingly, the temperature change of the heat sink 10 can be checked step by step, so that the temperature change of the paint can be detected. Thus, it is possible to test and confirm whether or not the heat radiation is performed optimally in the heat sink 10, It is possible to prevent the LED 26 from being damaged.

In addition, the protective film layer is coated on the discolored portion to prevent the discolored portion from being damaged due to the external impact, and it is easily confirmed whether the discolored portion is discolored or not, and at the same time, the transparent discoloration material .

Further, the heat sink 10 may be coated with a coating composition for preventing corrosion. The coating composition for corrosion prevention includes a water-soluble resin and a melamine derivative.

Therefore, it is effective to provide a coating composition capable of imparting abrasion resistance, stain resistance, and non-sticking property, as well as corrosion prevention of the heat sink 10. The heat sink 10 coated with the coating composition for corrosion prevention of the present invention, Is chemically stable, so that no surface gloss or appearance change occurs.

The water-soluble resin in the coating composition for corrosion prevention according to the present invention may contain a glycidyl ether compound such as a polyfunctional aliphatic glycidyl ether compound, an arylalkyl glycidyl ether compound and the like and an organic solvent such as ethanolamine, diethanol Amine, triethanolamine and the like, and more preferably one or more glycidyl ether compounds selected from glycidyl ether compounds having two or more oxirane groups and alkane amide It is preferable that the reactive resin is a norepine.

Examples of the glycidyl ether compound having two or more oxirane groups usable in the present invention include bisphenol A diglycidyl ether and Bis phenol F type diglycidyl ether. F type diglycidyl ether, phenol novolac type glycidyl ether, resorcinol diglycidyl ether, cresol novolac type glycidyl ether, ), Bisphenol novolac type glycidyl ether, triphenyl propane triglycidyl ether, triglycidyl ether of tri (p-hydroxyphenyl) ethane ( Triglycidyl ether of tris (p-hydroxy phenyl) ethane, triglycidyl ether of trihydroxy biphenyl, bisglycosyl F triglycidyl ether (Tetraglycid yl ether of bis resorcinol F), and polyglycidyl ether of tetraphenylene ethane; Diglycidyl aniline, diglycidyl toluidine, triglycidyl p-amino phenol, and tetraglycidyl diamino diphenyl methane ); And the like; 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and ethylene glycol diglycidyl ether. diglycidyl ether, polyethylene glycol diglycidyl ether, diglycidyl ether dimethylol cyclohexane, and octafluoropentyl glycidyl ether, and the like. Alcohol derivatives; Organic acid derivatives such as diglycidyl 1,2-cyclohexane dicarboxylate and the like; Dipentene dioxide, Dicyclo pentadiene dioxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylic acid (3,4-epoxy cyclohexylmethyl-3,4- epoxy cyclohexane carboxylate, and the like.

Examples of the alkanolamine include monoethanol amine, diethanol amine, propanol amine, 2-amino-2-methyl-1,3-propanediol, 1-propanediol, 2-amino-2-methyl-1-propanediol, etc., and monoalkylamines may be used instead of the alkanolamines. amine, and alkoxy alkyl monoamine may also be used.

At this time, it is preferable that the glycidyl ether compound and the alkanolamine are mixed at a weight ratio of 0.05: 99.5 to 99.5: 0.05, respectively.

The glycidyl ether compound is preferably an arylalkyl glycidyl ether substituted with fluorine in order to enhance the stain resistance of the coating composition for corrosion prevention of the present invention. The glycidyl ether compound And alkanolamine may be used singly or in combination.

The water-soluble resin may be used alone or in combination of two or more in order to enhance the characteristics of the coating composition for corrosion prevention of the present invention.

Also, the melamine derivative is preferably hexa alkylated-hexamethylol melamine such as hexamethylated-hexamethylol melamine. It is preferable that the melamine derivative is hexamethylated-hexamethylol melamine.

In addition to the above components, the coating composition for corrosion prevention of the present invention may further include other additives such as a catalyst, a surface conditioner, an emulsifier, an antimicrobial agent, an antifungal agent, a colorant (coloring agent) But is not limited thereto.

Glycidyl ethers, especially phenolic glycidyl ethers, are abundant in chemical reactions and are excellent in adhesiveness, electrical properties, heat resistance, and chemical resistance. They are used in adhesives, formers, coatings, insulating materials, composites and other resins It is widely used in various industrial fields such as modified materials.

Alkanolamine is widely used as a corrosion inhibitor or an emulsifier. The melamine derivative has a hexagonal heterocyclic structure as a curing agent, thereby giving excellent lubrication properties, and after crosslinking reaction Improves water resistance and imparts chemical stability by forming ether bridges.

In the present invention, by utilizing these properties, that is, excellent adhesiveness of glycidyl ether, thermal stability, chemical resistance, dimensional stability, corrosion resistance of alkanolamine, and excellent lubrication characteristics of melamine derivatives, (10) A coating composition for preventing corrosion can be provided.

In addition, the coating composition for corrosion prevention according to the present invention is characterized in that it contains melamine derivatives 1 to 10 (based on 100 parts by weight of a water-soluble resin composition prepared by mixing 70 to 99% by weight of glycidyl ether and 1 to 30% by weight of alkanolamine, By weight.

The coating composition for preventing corrosion according to the present invention as described above is applied to the surface of the aluminum heat sink 10 as a thin film to exhibit corrosion resistance, abrasion resistance, stain resistance, and non-sticking property.

At this time, there is no particular limitation on the method of applying the coating composition for corrosion prevention, but it is preferable that the coating is applied so that the dry film thickness of the aluminum heat sink 10 is 10 to 30 탆. If the dry film thickness is less than 10 탆, the life cycle can be shortened. If the dry film thickness exceeds 30 탆, there is no problem in function but the economic advantage is reduced.

The heat sink 10 coated with the coating composition for anticorrosion is air-dried for 10 to 30 minutes and then cured at 100 to 200 ° C, preferably 150 to 180 ° C for 10 to 50 minutes to obtain a non- It is possible to obtain a coated film.

According to the present invention as described above, the heat sink 10 made of an aluminum material has an effect of providing a coating composition capable of imparting abrasion resistance, stain resistance, and non-sticking property as well as corrosion prevention.

Further, the heat sink 10 to which the corrosion-resistant coating composition of the present invention is applied is chemically stable, and the surface gloss and appearance change are not observed at all.

10: Heatsink
12: Base heat sink
14: Combination heat sink
20: LED module
22: circuit board
22a: upper circuit board
22b: Lower circuit board
26: LED

Claims (4)

A heat sink 10 having a base heat sink 12 and a plurality of heat radiating blades 14 integrally formed on a circumferential surface of the base heat sink 12 and bent at a desired angle toward a desired direction;
And a circuit board (22) mounted on the bottom surface of the base heat sink (12) with LEDs (26) attached on the top and bottom surfaces thereof;
The heat radiating blades 14 serving as the reflection plate are bent at an angle reflecting the light of the LEDs 26 attached to the upper surface of the circuit board 22 in a desired direction;
The LEDs 26 attached to the upper surface of the circuit board 22 are arranged between the heat radiating blades 14 serving as both the reflectors when the heat radiating blades 14 serving as the reflector plate are spread to be flush with the base heat sink 12;
The circuit board 22 is laminated with an upper circuit board 22a having an LED 26 on its top surface and a lower circuit board 22b having an LED 26 on its bottom surface;
The heat radiating blades (14) serving as the reflection plate are bent at an angle wrapped by the housing for the LED lighting device;
A coating layer containing a silicone component is formed on the surface of the LED 26. A dimethyldichlorosilane solution is dissolved in ethyl acetate in a volume ratio of 2-5% to prepare a coating solution. The coating solution has a viscosity of 0.8 Coating the surface of the LED 26 with a coating solution having a thickness of 1 탆 or less and spraying the surface of the LED 26 by spraying method 2-3 times;
A perfume material mixed with a functional oil is coated on the surface of the heat sink 10, and a mixing ratio of the perfume material and the functional oil is mixed with 95 to 97% by weight of the perfume material and 3 to 5% by weight of the functional oil , The functional oil is composed of 30% by weight of lavender spikes, 30% by weight of lime isobaric oil, 20% by weight of Manuka and 20% by weight of Ennula;
The housing is made of duck tile cast iron. The cast iron of the duck tile is heated to 1600 ~ 1650 캜 to be molten, then subjected to desulfurization treatment, and a spheroidizing agent containing 0.3 ~ 0.7 wt% Followed by heat treatment;
To the thermally conductive adhesive resin attached to the upper surface of the circuit board 22, RD (Polymerized trimethyl dihydroquinoline) is added to increase the oxidation resistance, and 0.4 to 1.2 parts by weight of RD is contained in the thermally conductive adhesive resin;
A discoloring portion changing color depending on the temperature is coated on one side of the heat sink 10, and a protective film layer is coated on the discoloring portion to prevent the discoloration portion from being damaged;
The heat sink (10) is coated with a coating composition, wherein the coating composition comprises a water soluble resin and a melamine derivative, wherein the water soluble resin is a polyfunctional aliphatic glycidyl ether compound, an arylalkyl glycidyl ether ether compound is reacted with an alkanol amine of ethanolamine, diethanolamine or triethanolamine, and the melamine derivative is a hexa-alkylated-hexamethylol melamine ), And the coating composition is prepared by mixing 1 to 10 parts by weight of a melamine derivative with respect to 100 parts by weight of a water-soluble resin composition prepared by mixing 70 to 99% by weight of glycidyl ether and 1 to 30% by weight of alkanolamine And is applied on the surface of the aluminum heat sink 10 such that the thickness of the coating composition is 10 to 30 mu m, And the sink 10 is air-dried for 10 to 30 minutes and then cured at 100 to 200 ° C for 10 to 50 minutes. delete delete delete
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Publication number Priority date Publication date Assignee Title
KR102512417B1 (en) 2022-05-11 2023-03-23 (주) 넥스원이노베이션 Plate-shaped heat sink with heat dissipation coating

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Publication number Priority date Publication date Assignee Title
WO2013132549A1 (en) 2012-03-07 2013-09-12 パナソニック株式会社 Lamp
JP2015156394A (en) * 2015-04-22 2015-08-27 三菱電機照明株式会社 Luminaire device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013132549A1 (en) 2012-03-07 2013-09-12 パナソニック株式会社 Lamp
JP5291266B1 (en) * 2012-03-07 2013-09-18 パナソニック株式会社 lamp
JP2015156394A (en) * 2015-04-22 2015-08-27 三菱電機照明株式会社 Luminaire device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102512417B1 (en) 2022-05-11 2023-03-23 (주) 넥스원이노베이션 Plate-shaped heat sink with heat dissipation coating

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