JP2015156394A - Luminaire device - Google Patents

Luminaire device Download PDF

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JP2015156394A
JP2015156394A JP2015087863A JP2015087863A JP2015156394A JP 2015156394 A JP2015156394 A JP 2015156394A JP 2015087863 A JP2015087863 A JP 2015087863A JP 2015087863 A JP2015087863 A JP 2015087863A JP 2015156394 A JP2015156394 A JP 2015156394A
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substrate
light
led
mounting
light source
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太郎 高光
Taro Takamitsu
太郎 高光
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To achieve a light distribution of 180 degree or more with respect to an interface joining a translucent globe and a luminaire device body with a simple structure.
SOLUTION: There are provided: a double-sided mountable-type LED substrate 3 including a first luminous face 31a which is a front surface and a second luminous face which is a rear surface, the first luminous face 31a being mounted with an LED element 8a (first light source) and the second luminous face being mounted with an LED element 8b (second light source); and a luminaire device body 50 having an exterior appearance made up of a substrate installation face 44 having an area smaller than the rear surface, a bottom part 45 having an area larger than the substrate installation face 44, and a side face extending from a circumference of the substrate installation face 44 towards a circumference of the bottom part 45. In the luminaire device body 50, the LED substrate 3 is installed by bringing its rear surface into contact with the substrate installation face 44. On the region of the rear surface of the LED substrate 3 which does not come into contact with the substrate installation face 44, the LED element 8b (second light source) is mounted in the region outside of the region on which the LED element 8a (first light source) is mounted when viewed in the axis direction.
COPYRIGHT: (C)2015,JPO&INPIT

Description

この発明は、発光ダイオード素子を用いる照明装置に関するものである。   The present invention relates to a lighting device using a light emitting diode element.

白熱電球に近い広い配光のLED電球を実現するためにいろいろな改良がされてきている。   Various improvements have been made to realize LED light bulbs with a wide light distribution close to incandescent bulbs.

特開2001−243807号公報JP 2001-243807 A 特開2009−4130号公報JP 2009-4130 A 特開2004−296245号公報JP 2004-296245 A 特開2008−103112号公報JP 2008-103112 A 特開2010−129300号公報JP 2010-129300 A 特開2010−157459号公報JP 2010-157459 A 特開2012−181969号公報JP 2012-181969 A

この発明は、発光ダイオード素子を用いて、広い配光の照明装置を実現することを目的とする。   An object of this invention is to implement | achieve the illuminating device of wide light distribution using a light emitting diode element.

本発明に係る照明装置は、第1の光源が表面である第1の発光面に実装され、第2の光源が裏面である第2の発光面に実装される両面実装型の基板と、前記裏面の面積より小さい取付面と、前記取付面に対向する対向面であって前記取付面の面積よりも大きい対向面と、前記取付面の周縁から前記対向面の周縁に向かって広がる側面とからなる外観形状をなし、前記裏面と前記取付面とが当接して前記基板が取り付けられる基板取付台と、を備え、前記基板は、前記裏面の前記取付面と当接しない領域のうち、前記第1の光源が実装される領域より外側の領域に前記第2の光源が実装される。   A lighting device according to the present invention is a double-sided mounting type substrate in which a first light source is mounted on a first light-emitting surface as a front surface, and a second light source is mounted on a second light-emitting surface as a back surface, A mounting surface that is smaller than the area of the back surface, a facing surface that faces the mounting surface and that is larger than the area of the mounting surface, and a side surface that extends from the periphery of the mounting surface toward the periphery of the facing surface. A substrate mounting base on which the back surface and the mounting surface are in contact with each other and the substrate is mounted, wherein the substrate is in the region not contacting the mounting surface on the back surface. The second light source is mounted in a region outside the region where one light source is mounted.

本発明に係る照明装置によれば、第1の光源が表面である第1の発光面に実装され、第2の光源が裏面である第2の発光面に実装される両面実装型の基板と、裏面の面積より小さい取付面と、取付面の面積よりも大きい対向面と、取付面の周縁から前記対向面の周縁に向かって広がる側面とからなる外観形状をなし、前記裏面と前記取付面とが当接して基板が取り付けられる基板取付台とを備え、基板は、裏面の取付面と当接しない領域のうち第1の光源が実装される領域より外側の領域に第2の光源が実装されるので、簡単な構成で、対向面に対して180度以上の配光を実現することができる。   According to the illumination device of the present invention, the first light source is mounted on the first light-emitting surface that is the front surface, and the second light source is mounted on the second light-emitting surface that is the back surface. The outer surface has a mounting surface smaller than the area of the back surface, an opposing surface larger than the area of the mounting surface, and a side surface extending from the periphery of the mounting surface toward the periphery of the opposing surface, and the back surface and the mounting surface And a substrate mounting base on which the substrate is mounted, and the substrate is mounted with the second light source in a region outside the region where the first light source is mounted in the region where the substrate does not contact the back mounting surface. Therefore, light distribution of 180 degrees or more with respect to the opposing surface can be realized with a simple configuration.

実施の形態1の照明装置100の構造図である。1 is a structural diagram of a lighting device 100 according to Embodiment 1. FIG. 実施の形態1の照明装置100において、透光性グローブ10を外した状態の平面図である。FIG. 3 is a plan view of the lighting device 100 according to Embodiment 1 with the translucent globe 10 removed. 実施の形態1の照明装置100の光路の概略図である。FIG. 3 is a schematic diagram of an optical path of lighting apparatus 100 according to Embodiment 1. 実施の形態2に係る照明装置100cの構造図である。FIG. 6 is a structural diagram of an illumination device 100c according to Embodiment 2. 実施の形態2に係る照明装置100cの光路の概略図である。It is the schematic of the optical path of the illuminating device 100c which concerns on Embodiment 2. FIG.

実施の形態1.
(1)第1の実施の形態(図1、図2、図3)
図1は、実施の形態1の照明装置100の構造図である。図2は、実施の形態1の照明装置100において、透光性グローブ10を外した状態の平面図(図1のP方向から見た図)である。図3は、実施の形態1の照明装置100の光路の概略図である。図1〜3を用いて、実施の形態1に係る照明装置100の構成について説明する。
Embodiment 1 FIG.
(1) First embodiment (FIGS. 1, 2, and 3)
FIG. 1 is a structural diagram of the illumination device 100 according to the first embodiment. FIG. 2 is a plan view of the lighting device 100 according to Embodiment 1 with the translucent globe 10 removed (viewed from the direction P in FIG. 1). FIG. 3 is a schematic diagram of an optical path of the illumination device 100 according to the first embodiment. The structure of the illuminating device 100 which concerns on Embodiment 1 is demonstrated using FIGS.

図1に示すように、本実施の形態に係る照明装置100は、口金部7と、外郭部60と、透光性グローブ10と、段差部40と、LED基板3a,3bとを備える。LED基板3(3a,3b)は、発光面31(31a,31b)にLED素子8(8a,8b)を実装する。   As shown in FIG. 1, the illuminating device 100 which concerns on this Embodiment is provided with the nozzle | cap | die part 7, the outer shell part 60, the translucent glove 10, the level | step-difference part 40, and LED board 3a, 3b. LED board 3 (3a, 3b) mounts LED element 8 (8a, 8b) on light emitting surface 31 (31a, 31b).

LED基板3a,3bは、発光面31a,31bではない面(非発光面32a,32b)同士が当接されて固定されている。発光面31a,31bではない面(非発光面32a,32b)同士が当接されて固定されているLED基板3a,3bを、LED基板3と呼ぶ場合もある。LED基板3は基板の一例である。また、LED基板3aの発光面31aは基板の表面の一例であり、LED基板3bの発光面31bは基板の裏面の一例である。   The LED substrates 3a and 3b are fixed by contacting surfaces (non-light emitting surfaces 32a and 32b) that are not the light emitting surfaces 31a and 31b. The LED substrates 3a and 3b in which the surfaces (non-light emitting surfaces 32a and 32b) that are not the light emitting surfaces 31a and 31b are fixed in contact with each other may be referred to as the LED substrate 3. The LED substrate 3 is an example of a substrate. The light emitting surface 31a of the LED substrate 3a is an example of the surface of the substrate, and the light emitting surface 31b of the LED substrate 3b is an example of the back surface of the substrate.

LED基板3は、LED素子8が実装されているLED基板3の発光面31を覆うポリカーボネート製の透光性グローブ10と外郭部60と口金部7とからなる筐体内に設置されている。LEDを点灯する点灯回路基板(図示せず)は筐体を形成する外郭部60の内部に設置されている。   The LED substrate 3 is installed in a housing made of a polycarbonate translucent globe 10 that covers the light emitting surface 31 of the LED substrate 3 on which the LED element 8 is mounted, an outer portion 60, and a base portion 7. A lighting circuit board (not shown) for lighting the LED is installed inside the outer portion 60 forming the casing.

外郭部60の透光性グローブ10側の面にある本体平面板51はアルミニウム製である。本体平面板51は、透光性グローブ10と照明装置本体50とを接合する平面にある。   The main body flat plate 51 on the surface of the outer shell 60 on the translucent globe 10 side is made of aluminum. The main body flat plate 51 is in a plane where the translucent globe 10 and the lighting device main body 50 are joined.

照明装置本体50は、外郭部60の内部に設置されている点灯回路基板と、外郭部60と、口金部7と、本体平面板51などから構成されている。   The illuminating device body 50 includes a lighting circuit board installed inside the outer portion 60, the outer portion 60, the base portion 7, the main body flat plate 51, and the like.

透光性グローブ10は、後述する段差部40と、段差部40に取り付けられたLED基板3とを包み込むように設置される。透光性グローブ10は、例えば、ポリカーボネート製である。透光性グローブ10には、周囲360度、本体平面板の半径S(図1参照)よりも外側に張り出したグローブ張出部11が設けられている。   The translucent globe 10 is installed so as to wrap a stepped portion 40 described later and the LED substrate 3 attached to the stepped portion 40. The translucent glove 10 is made of polycarbonate, for example. The translucent globe 10 is provided with a globe overhanging portion 11 that projects 360 ° around the radius S of the main body plane plate (see FIG. 1).

透光性グローブ10の内部(内面)には光を拡散、反射する酸化チタンなどの光拡散反射剤および光拡散剤が塗布され、光拡散膜2が形成されている。光拡散膜2には、光を反射、拡散する材料であればシリカ、アルミナ等どの材料を用いても構わない。また樹脂自体をフロスト加工しても構わないし光拡散剤を添加した樹脂でも構わない。   The light diffusing film 2 is formed on the inside (inner surface) of the translucent globe 10 by applying a light diffusing reflector such as titanium oxide that diffuses and reflects light and a light diffusing agent. Any material such as silica or alumina may be used for the light diffusion film 2 as long as it reflects and diffuses light. Further, the resin itself may be frosted or may be a resin added with a light diffusing agent.

筐体は、上述したように、透光性グローブ10と、外郭部60と、口金部7とよりなる。外郭部60は、LED素子8を冷却するアルミニウム製の放熱体を兼ねるものであり、複数の放熱体61を有している。   As described above, the housing includes the translucent globe 10, the outer portion 60, and the base portion 7. The outer portion 60 also serves as an aluminum radiator that cools the LED element 8, and includes a plurality of radiators 61.

LED素子8a,8bが実装されたLED基板3a,3bが、筐体内に設置されている。LED点灯する点灯回路基板(図示せず)は筐体を形成する外郭部60(放熱体)の内部に設置されている。   LED substrates 3a and 3b on which the LED elements 8a and 8b are mounted are installed in the housing. A lighting circuit board (not shown) for LED lighting is installed inside an outer portion 60 (heat radiator) forming a casing.

LED基板3(3a,3b)の面をz方向とし、照明装置100の中心軸をx方向とする。
x:LED基板3(3a,3b)の基板面垂直(照明装置軸)方向
z:LED基板3(3a,3b)の基板面水平方向
Let the surface of LED board 3 (3a, 3b) be az direction, and let the center axis | shaft of the illuminating device 100 be an x direction.
x: substrate surface vertical (illumination device axis) direction of LED substrate 3 (3a, 3b) z: substrate surface horizontal direction of LED substrate 3 (3a, 3b)

外郭部60の透光性グローブ10側の円盤面(本体平面板51)はアルミニウム製である。LED素子8a,8bが実装されたLED基板3a,3bは、照明装置100の本体平面板51の上に設けられた段差部40(基板取付台の一例)上に設けられる。   The disk surface (main body flat plate 51) on the translucent globe 10 side of the outer shell 60 is made of aluminum. The LED boards 3a and 3b on which the LED elements 8a and 8b are mounted are provided on a step portion 40 (an example of a board mounting base) provided on the main body plane plate 51 of the lighting device 100.

段差部40は、LED基板3bの発光面31b(基板の裏面)の面積より小さい基板取付面44(取付面の一例)と、基板取付面44に対向する底部45(対向面の一例)であって基板取付面44の面積よりも大きい底部45とを備える。そして、段差部40は、基板取付面44の周縁から底部45の周縁に向かって広がる側面を備える。段差部40は、LED基板3bの発光面31b(基板の裏面)に基板取付面44を当接させてLED基板3を取り付ける基板取付台の一例である。   The stepped portion 40 is a substrate mounting surface 44 (an example of a mounting surface) that is smaller than the area of the light emitting surface 31b (back surface of the substrate) of the LED substrate 3b, and a bottom 45 (an example of the facing surface) that faces the substrate mounting surface 44. And a bottom 45 larger than the area of the board mounting surface 44. The step portion 40 includes a side surface that widens from the periphery of the substrate mounting surface 44 toward the periphery of the bottom portion 45. The stepped portion 40 is an example of a board mounting base on which the LED board 3 is mounted by bringing the board mounting surface 44 into contact with the light emitting surface 31b (back surface of the board) of the LED board 3b.

LED基板3は、LED基板3bの発光面31b(基板の裏面)の領域のうち基板取付面44が当接されていない領域にLED素子8b(光源)が実装される。   In the LED substrate 3, the LED element 8b (light source) is mounted in a region where the substrate mounting surface 44 is not in contact with the light emitting surface 31b (back surface of the substrate) of the LED substrate 3b.

図1に示すように、段差部40の側面は、テーパー状に広がるテーパー面41であり、LED素子8bから発せられる光を反射して透光性グローブ10を通過させる反射面である。   As shown in FIG. 1, the side surface of the stepped portion 40 is a tapered surface 41 that expands in a tapered shape, and is a reflective surface that reflects light emitted from the LED element 8 b and allows the translucent globe 10 to pass.

段差部40は、本体平面板51からLED基板3(3a,3b)に向かうテーパー面41(側面の一例)を有し、円錐形状をしている。段差部40は、透光性グローブ10と反対側にテーパー状に広がっているテーパー面41(テーパー部)を備える。   The stepped portion 40 has a tapered surface 41 (an example of a side surface) from the main body flat plate 51 toward the LED substrate 3 (3a, 3b), and has a conical shape. The stepped portion 40 includes a tapered surface 41 (tapered portion) that extends in a tapered shape on the side opposite to the translucent globe 10.

段差部40は、例えば、熱伝導性のポリブチレンテレフタラート樹脂製である。段差部40のテーパー面41(テーパー部)には光拡散剤が塗布されている。   The step portion 40 is made of, for example, a heat conductive polybutylene terephthalate resin. A light diffusing agent is applied to the tapered surface 41 (tapered portion) of the stepped portion 40.

図2に示すように、基板取付面44、底部45、LED基板3a,3b、本体平面板51はいずれも円形状である。基板取付面44の中心、底部45の中心、LED基板3a,3b、本体平面板51の中心とが重なるように配置される。基板取付面44は、LED基板3bの発光面31b(基板の裏面)の領域のうちの中央の領域に当接され、LED素子8bは、LED基板3bの発光面31b(基板の裏面)の中央の領域を囲むように実装される。   As shown in FIG. 2, the board attachment surface 44, the bottom 45, the LED boards 3a and 3b, and the main body plane plate 51 are all circular. It arrange | positions so that the center of the board | substrate mounting surface 44, the center of the bottom part 45, LED board 3a, 3b, and the center of the main body plane board 51 may overlap. The board mounting surface 44 is in contact with the central area of the light emitting face 31b (back face of the board) of the LED board 3b, and the LED element 8b is the center of the light emitting face 31b (back face of the board) of the LED board 3b. It is implemented so as to surround the area.

図2に示すように、発光面31bの周縁近傍に、基板取付面44が当接されている領域を囲むように、8つのLED素子8bが実装されている。また、LED基板3aの発光面31aには、LED基板3aの発光面31aの中心を囲むように8つのLED素子8aが実装されている。   As shown in FIG. 2, eight LED elements 8b are mounted in the vicinity of the periphery of the light emitting surface 31b so as to surround a region where the substrate mounting surface 44 is in contact. Further, eight LED elements 8a are mounted on the light emitting surface 31a of the LED substrate 3a so as to surround the center of the light emitting surface 31a of the LED substrate 3a.

透光性グローブ10は、基板取付面44に平行な面による断面が環形状である。図1に示すように、LED基板3は、透光性グローブ10の基板取付面44に平行な面による断面のうち、直径が最大となる最大直径の部分(最大直径断面ともいう)と同一面に取り付けられる。   The translucent globe 10 has a ring-shaped cross section by a plane parallel to the substrate mounting surface 44. As shown in FIG. 1, the LED substrate 3 is flush with the maximum diameter portion (also referred to as the maximum diameter cross section) having the largest diameter among the cross sections of the translucent globe 10 parallel to the substrate mounting surface 44. Attached to.

LED基板3a,3bは、照明装置100の本体平面板51の中心位置と透光性グローブ10の頂部を結ぶ線xが、LED基板3a,3bの中心又は中心付近に位置するように配置される。また、LED基板3a,3bは、グローブ張出部11の最大直径の部分に配置される。   The LED boards 3a and 3b are arranged so that a line x connecting the center position of the main body plane plate 51 of the lighting device 100 and the top of the translucent globe 10 is located at or near the center of the LED boards 3a and 3b. . Further, the LED substrates 3 a and 3 b are arranged in the portion of the maximum diameter of the globe projecting portion 11.

図2に示すように、LED基板3a,3bは、円形であり、表面(LED基板3aの発光面31a)に、LED素子8aが複数(例えば、8個)実装される。そして、裏面(LED基板3bの発光面31b)の周囲(縁)に環状にLED素子8bが複数(例えば、8個)実装される。   As shown in FIG. 2, the LED substrates 3a and 3b are circular, and a plurality of (for example, eight) LED elements 8a are mounted on the surface (the light emitting surface 31a of the LED substrate 3a). Then, a plurality of (for example, eight) LED elements 8b are mounted in a ring shape around the back surface (light emitting surface 31b of the LED substrate 3b).

本実施の形態に係るLED基板3(3a,3b)は、アルミニウム製である。図1に示すように、LED基板3aの非発光面32aとLED基板3bの非発光面32bとを合わせることで、金属性の1つのLED基板3を製造する。2つの基板(LED基板3a,LED基板3b)の非発光面32同士を合わせることで、両面にLED素子8を配置することができる。   LED board 3 (3a, 3b) according to the present embodiment is made of aluminum. As shown in FIG. 1, one metallic LED substrate 3 is manufactured by combining the non-light emitting surface 32 a of the LED substrate 3 a and the non-light emitting surface 32 b of the LED substrate 3 b. By combining the non-light emitting surfaces 32 of the two substrates (LED substrate 3a and LED substrate 3b), the LED elements 8 can be arranged on both surfaces.

基板の表面は、上側の面であり、LED基板3aの発光面31aとその外周からはみ出して見えるLED基板3bの非発光面32bである。LED基板3aの直径M(図2参照)は、基板の裏面である下側の面(LED基板3bの発光面31b)の直径L(図2参照)よりも小さい。   The surface of the substrate is the upper surface, which is the light emitting surface 31a of the LED substrate 3a and the non-light emitting surface 32b of the LED substrate 3b that appears to protrude from the outer periphery thereof. The diameter M (see FIG. 2) of the LED substrate 3a is smaller than the diameter L (see FIG. 2) of the lower surface (light emitting surface 31b of the LED substrate 3b) which is the back surface of the substrate.

図2に示すように、LED基板3bの半径Lは、本体平面板51の半径Hの2分の1から4分の3の長さであることが好ましい。半径Lは、半径Hの3分の2の長さでもよい。また、半径Lは、半径Hの2分の1から4分の3の長さ以外の長さでも構わない。   As shown in FIG. 2, the radius L of the LED substrate 3 b is preferably 1/2 to 3/4 of the radius H of the main body plane plate 51. The radius L may be two-thirds the length of the radius H. The radius L may be a length other than one-half to three-fourths of the radius H.

図2に示すように、基板取付面44の半径Tは、LED基板3bの半径Lの2分の1から4分の3の長さであることが好ましい。半径Tは、半径Lの3分の2の長さでもよい。また、半径Tは、半径Lの2分の1から4分の3の長さ以外の長さでも構わない。   As shown in FIG. 2, the radius T of the board mounting surface 44 is preferably half to three quarters of the radius L of the LED board 3b. The radius T may be two-thirds the length of the radius L. Further, the radius T may be a length other than one-half to three-fourths of the radius L.

LED基板3bの発光面31bに対する基板取付面44の占める割合が、小さ過ぎるとLED基板3の放熱が不十分となってしまう。また、LED基板3bの発光面31bに対する基板取付面44の占める割合が大き過ぎると、LED素子8bを実装する領域が狭くなりすぎてしまい、明るさを確保できなくなってしまう。   If the ratio of the substrate mounting surface 44 to the light emitting surface 31b of the LED substrate 3b is too small, the heat dissipation of the LED substrate 3 will be insufficient. Further, if the ratio of the board mounting surface 44 to the light emitting surface 31b of the LED board 3b is too large, the area where the LED element 8b is mounted becomes too narrow, and the brightness cannot be secured.

また、本体平面板51と底部45とはほぼ等しいことが好ましい。図2では、照明装置100をP方向から見た場合に本体平面板51がR1領域分だけやや大きくなっている。この環状のR1領域には、透光性グローブ10が取り付けられることが想定されており、図1に示すように、R1領域は実際には隠れている状態となる。これにより、LED素子8bから発せられる光は全てが直接透光性グローブ10を通過するか、あるいは段差部40のテーパー面41に反射して透光性グローブ10を通過するので、光の無駄がない。   Moreover, it is preferable that the main body flat board 51 and the bottom part 45 are substantially equal. In FIG. 2, when the illumination device 100 is viewed from the P direction, the main body flat plate 51 is slightly larger by the R1 region. It is assumed that the translucent globe 10 is attached to the annular R1 region, and the R1 region is actually hidden as shown in FIG. Thereby, all the light emitted from the LED element 8b passes directly through the translucent globe 10 or is reflected by the tapered surface 41 of the stepped portion 40 and passes through the translucent globe 10, so that light is wasted. Absent.

図2において、点線で囲まれた円形の領域は、段差部40の基板取付面44と、LED基板3bの発光面31b(基板裏面)とが当接している領域である。図1、図2に示すように、LED基板3(3a,3b)は、LED基板3aの発光面31aから透光性グローブ10の方向(上方(図1参照))に光を照射するLED素子8aを、LED基板3aの発光面31aに実装する。また、LED基板3bの発光面31bから本体平面板51の方向に光を照射するLED素子8bを、LED基板3bの発光面31bの領域のうちの基板取付面44に当接されていない領域に実装する。   In FIG. 2, a circular region surrounded by a dotted line is a region where the substrate mounting surface 44 of the stepped portion 40 and the light emitting surface 31 b (substrate back surface) of the LED substrate 3 b are in contact with each other. As shown in FIGS. 1 and 2, the LED substrate 3 (3a, 3b) is an LED element that emits light from the light emitting surface 31a of the LED substrate 3a in the direction of the translucent globe 10 (see above (see FIG. 1)). 8a is mounted on the light emitting surface 31a of the LED substrate 3a. Further, the LED element 8b that emits light in the direction from the light emitting surface 31b of the LED substrate 3b to the main body flat plate 51 is placed in a region that is not in contact with the substrate mounting surface 44 in the region of the light emitting surface 31b of the LED substrate 3b. Implement.

LED基板3bの発光面31bの領域のうちの基板取付面44が当接されていない部分を、段差部40の基板取付面44の周縁から張り出した基板張出部35とする(図1、図2参照)。つまり、LED基板3bの発光面31bから本体平面板51の方向(下方)に光を照射するLED素子8bは、基板張出部35に実装される。   Of the region of the light emitting surface 31b of the LED substrate 3b, a portion where the substrate mounting surface 44 is not in contact is defined as a substrate protruding portion 35 protruding from the peripheral edge of the substrate mounting surface 44 of the stepped portion 40 (FIG. 1, FIG. 2). That is, the LED element 8 b that irradiates light from the light emitting surface 31 b of the LED substrate 3 b in the direction of the main body flat plate 51 (downward) is mounted on the substrate extending portion 35.

段差部40のテーパー面41と本体平面板51(z方向)とがなす角度θ1は、40度から60度であるが、40度から50度が好適である。また、段差部40のテーパー面41とLED基板(z方向)とがなす角度θ2は、140度から120度であるが、140度から130度が好適である。   An angle θ1 formed by the tapered surface 41 of the stepped portion 40 and the main body flat plate 51 (z direction) is 40 degrees to 60 degrees, but 40 degrees to 50 degrees is preferable. The angle θ2 formed by the tapered surface 41 of the stepped portion 40 and the LED substrate (z direction) is 140 degrees to 120 degrees, but 140 degrees to 130 degrees is preferable.

段差部40のテーパー面41と本体平面板51(z方向)とがなす角度θ1は、40度から50度の中でも45度がより好適である。また、段差部40のテーパー面41とLED基板(z方向)とがなす角度θ2は、140度から130度の中でも135度がより好適である。   The angle θ1 formed by the taper surface 41 of the stepped portion 40 and the main body flat plate 51 (z direction) is more preferably 45 ° among 40 ° to 50 °. Further, the angle θ2 formed by the tapered surface 41 of the stepped portion 40 and the LED substrate (z direction) is more preferably 135 degrees out of 140 degrees and 130 degrees.

上述したように、本実施の形態の照明装置100では、2つのLED基板3a,3bを接合することにより、両面にLED素子8を実装した1つのLED基板3を製造している。しかし、両面実装型の基板を用いても良い。その場合は、両面実装型の基板の面積は、LED基板3bの面積(半径L)と同様となるように設計する。   As described above, in the lighting device 100 of the present embodiment, one LED substrate 3 in which the LED elements 8 are mounted on both sides is manufactured by bonding the two LED substrates 3a and 3b. However, a double-sided mounting type substrate may be used. In that case, the area of the double-sided mounting type substrate is designed to be the same as the area (radius L) of the LED substrate 3b.

段差部40の底部45(底面)は、本体平面板51に取り付けられる。段差部40の底部45の面積(半径S)は、本体平面板51の面積(半径H)と同じかやや小さい。段差部40の天部(基板取付面44)から段差部40の底部45に向かって、テーパー面41(斜面)が形成され、段差部40の底部45が本体平面板51に取り付けられる。   A bottom portion 45 (bottom surface) of the stepped portion 40 is attached to the main body plane plate 51. The area (radius S) of the bottom 45 of the stepped portion 40 is the same as or slightly smaller than the area (radius H) of the main body flat plate 51. A taper surface 41 (slope) is formed from the top of the step portion 40 (substrate mounting surface 44) toward the bottom portion 45 of the step portion 40, and the bottom 45 of the step portion 40 is attached to the main body flat plate 51.

LED基板3(3b)には、段差部40より張出した基板張出部35が存在する。基板張出部35とは、LED基板3(3b)の発光面31(31b)の領域のうち段差部40の基板取付面44(天部)から周囲360度はみ出した部分である。   On the LED substrate 3 (3b), there is a substrate overhanging portion 35 overhanging from the stepped portion 40. The board overhanging portion 35 is a portion of the area of the light emitting surface 31 (31b) of the LED board 3 (3b) that protrudes 360 degrees from the board mounting surface 44 (top) of the stepped portion 40.

LED基板3(3a)の透光性グローブ10側(上側)の表面(発光面31a)にLED素子8aが実装され、LED基板3(3b)の段差部40側(下側)の基板張出部35の裏面(LED基板3bの発光面31b)にLED素子8bが実装される。すなわち、LED基板3の両側の面にLED素子8が実装される。   The LED element 8a is mounted on the surface (light emitting surface 31a) on the translucent globe 10 side (upper side) of the LED substrate 3 (3a), and the substrate protrusion on the stepped portion 40 side (lower side) of the LED substrate 3 (3b). The LED element 8b is mounted on the back surface of the portion 35 (the light emitting surface 31b of the LED substrate 3b). That is, the LED elements 8 are mounted on both sides of the LED substrate 3.

本実施の形態によるLED基板3の各面に配置されたLED素子8による光路の概略図を、図3に示す。   FIG. 3 shows a schematic diagram of an optical path by the LED elements 8 arranged on each surface of the LED substrate 3 according to the present embodiment.

LED素子8aから発せられる光L1は、直接、光拡散膜2及び透光性グローブ10に到達し、光拡散膜2及び透光性グローブ10の光拡散作用により拡散されて外部に照射される。   The light L1 emitted from the LED element 8a directly reaches the light diffusion film 2 and the light transmitting globe 10, is diffused by the light diffusion action of the light diffusion film 2 and the light transmitting globe 10, and is irradiated to the outside.

LED素子8bから発せられる光L2は、段差部40のテーパー面41に到達し反射してL21の光路をとる。L21は、光拡散膜2及び透光性グローブ10に到達し、光拡散膜2及び透光性グローブ10の光拡散作用により拡散されて外部に照射される。   The light L2 emitted from the LED element 8b reaches the tapered surface 41 of the step portion 40 and is reflected to take the optical path L21. L21 reaches the light diffusing film 2 and the translucent globe 10, diffuses by the light diffusing action of the light diffusing film 2 and the translucent globe 10, and is irradiated to the outside.

LED素子8bから発せられる光L3は、段差部40のテーパー面41に到達し反射してL31の光路をとる。L31は、光拡散膜2及び透光性グローブ10に到達し、光拡散膜2及び透光性グローブ10の光拡散作用により拡散されて外部に照射される。   The light L3 emitted from the LED element 8b reaches the tapered surface 41 of the stepped portion 40 and is reflected to take the optical path of L31. L31 reaches the light diffusing film 2 and the translucent globe 10, diffuses by the light diffusing action of the light diffusing film 2 and the translucent globe 10, and is irradiated to the outside.

グローブ張出部11、透光性グローブ10内部に塗布された光拡散膜2(光拡散反射剤)および光拡散剤、テーパー状の段差部40によりLED基板の両面に配置されたLED光は、上述したように図3のような光路となり、180°以上の配光を実現するとともに、z方向により多くの光を配光することが出来る。   The LED light disposed on both sides of the LED substrate by the globe overhanging portion 11, the light diffusing film 2 (light diffusive reflecting agent) and the light diffusing agent applied inside the translucent globe 10 and the tapered stepped portion 40, As described above, the optical path is as shown in FIG. 3, and light distribution of 180 ° or more can be realized, and more light can be distributed in the z direction.

本実施の形態に係る照明装置100は、光源が実装された基板と、前記光源を冷却する放熱体と、前記光源を点灯する点灯回路基板と、光源の発光面を覆う透光性のグローブとを備える照明装置において前記光源は前記グローブと前記照明装置本体とを接合する前記照明装置の平面上に設けられた段差部上に設けられた基板上に実装され、前記基板は段差部より張出した張出部が設けられ、前記基板の前記透光性のグローブ側の面と前記基板の段差部側の張出部の面の両方に光源を実装したことを特徴とする。したがって、本実施の形態に係る照明装置100によれば、基板の段差部側の張出部の面に光源を実装したことにより透光性グローブと照明装置本体とを接合する平面上に対し、反透光性グローブ方向にも光が放射され、180以上の配光を実現することができる。   Illumination apparatus 100 according to the present embodiment includes a substrate on which a light source is mounted, a heat radiator that cools the light source, a lighting circuit board that lights the light source, and a translucent glove that covers the light emitting surface of the light source. The light source is mounted on a substrate provided on a step portion provided on a plane of the illumination device that joins the globe and the illumination device main body, and the substrate protrudes from the step portion. An overhang portion is provided, and a light source is mounted on both the surface of the substrate on the translucent globe side and the surface of the overhang portion on the stepped portion side of the substrate. Therefore, according to the lighting device 100 according to the present embodiment, the light source is mounted on the surface of the projecting portion on the stepped portion side of the substrate, so that the translucent globe and the lighting device main body are joined on the plane. Light is also emitted in the direction of the anti-translucent globe, and 180 or more light distributions can be realized.

本実施の形態に係る照明装置100は、前記光源が実装された基板の位置は前記グローブと前記照明装置本体とを接合する前記照明装置の平面の中心位置と前記グローブの頂部を結ぶ線の中心付近に設けられることを特徴とする。したがって、本実施の形態に係る照明装置100によれば、光源を実装する基板を透光性グローブの中央部に設けることで、透光性グローブの基部方向にも光が放射され、180度以上の配光を実現することが出来る。   In the lighting device 100 according to the present embodiment, the position of the substrate on which the light source is mounted is the center of a line connecting the center position of the plane of the lighting device that joins the globe and the lighting device body and the top of the globe. It is provided in the vicinity. Therefore, according to the illumination device 100 according to the present embodiment, by providing the substrate on which the light source is mounted at the center of the translucent globe, light is also emitted toward the base portion of the translucent globe, and 180 degrees or more. Can be realized.

本実施の形態に係る照明装置100は、前記段差部は透光性のグローブと反対側にテーパー状に広がることを特徴とする。したがって、本実施の形態に係る照明装置100によれば、段差部を透光性のグローブと反対側にテーパー状に広げることにより、本体とを接合する平面上に対し、透光性グローブの基部方向にも光が放射され、180°以上の配光を実現するとともに、上記平面方向に従来に比べより多くの光を配光することが出来る。また、テーパー状の段差部は、透光性グローブと照明装置本体とを接合する平面上より上の部分に、両面に光源を実装した基板を搭載する架台の役目をし、かつ当該テーパー状の段差部は、基板張出部下面の光源を反射する反射部を兼ねており、基板下面の段差部と接触固定する面以外の張り出し部分に光源を搭載して段差部に固定されるため、光源が両面実装されているにもかかわらず、簡便かつ強固に段差部に光源基板を固定することができ、更に、当該段差部が反射部を兼ねることにより、基板の直下に反射部を設けることが出来るため、上記の配光を実現できる。   The illumination device 100 according to the present embodiment is characterized in that the stepped portion extends in a tapered shape on the side opposite to the translucent globe. Therefore, according to the lighting device 100 according to the present embodiment, the base of the translucent glove is formed on the plane joining the main body by expanding the stepped portion in a tapered shape on the side opposite to the translucent glove. Light is also emitted in the direction, realizing a light distribution of 180 ° or more, and more light can be distributed in the plane direction than in the past. In addition, the tapered stepped portion serves as a pedestal for mounting a substrate on which light sources are mounted on both sides in a portion above the plane where the translucent globe and the illuminating device body are joined, and the tapered stepped portion. The step portion also serves as a reflection portion that reflects the light source on the lower surface of the substrate overhanging portion, and the light source is mounted on the overhanging portion other than the surface that is fixed in contact with the stepped portion on the lower surface of the substrate. Despite being mounted on both sides, the light source substrate can be easily and firmly fixed to the stepped portion, and the stepped portion also serves as the reflecting portion, thereby providing a reflecting portion directly under the substrate. Therefore, the above light distribution can be realized.

本実施の形態に係る照明装置100は、前記テーパー状の段差部のテーパー面は曲面であることを特徴とする。したがって、本実施の形態に係る照明装置100によれば、テーパー状の段差部を曲面とすることにより光を反射することにより、上記平面方向により多くの光を配光することが出来る。   The illumination device 100 according to the present embodiment is characterized in that the tapered surface of the tapered step portion is a curved surface. Therefore, according to the illumination device 100 according to the present embodiment, it is possible to distribute more light in the planar direction by reflecting light by forming the tapered stepped portion into a curved surface.

本実施の形態に係る照明装置100は、前記段差部は光を反射する部材よりなることを特徴とする。したがって、本実施の形態の照明装置100によれば、テーパー状の段差部のテーパー面が光を反射することにより、透光性グローブの基部方向及び上記平面方向により多くの光を配光することが出来る。   The illumination device 100 according to the present embodiment is characterized in that the step portion is made of a member that reflects light. Therefore, according to the illuminating device 100 of this Embodiment, when the taper surface of a taper-shaped level | step-difference part reflects light, it distributes more light to the base part direction of the translucent glove, and the said plane direction. I can do it.

本実施の形態に係る照明装置100は、前記段差部は光を拡散する部材よりなることを特徴とする。したがって、本実施の形態の照明装置100によれば、テーパー状の段差部のテーパー面が光を拡散することにより、透光性グローブの基部方向及び上記平面方向により多くの光を配光することが出来る。   The illumination device 100 according to the present embodiment is characterized in that the step portion is made of a member that diffuses light. Therefore, according to the illumination device 100 of the present embodiment, the tapered surface of the tapered step portion diffuses light, thereby distributing more light in the base direction of the translucent globe and the plane direction. I can do it.

本実施の形態に係る照明装置100は、前記段差部は表面を研磨して光を反射する金属製であることを特徴とする。したがって、本実施の形態の照明装置100によれば、段差部は表面を研磨して光を反射する金属製とすることにより、透光性グローブの基部方向及び上記平面方向により多くの光を配光することが出来る。   The illumination device 100 according to the present embodiment is characterized in that the stepped portion is made of metal that polishes the surface and reflects light. Therefore, according to the illumination device 100 of the present embodiment, the stepped portion is made of metal that reflects light by polishing the surface, thereby distributing more light in the base direction of the translucent globe and the plane direction. Can shine.

本実施の形態に係る照明装置100は、前記段差部は前記光源を冷却する放熱体を兼ねることを特徴とする。したがって、本実施の形態の照明装置100によれば、段差部は光源を冷却する放熱体を兼ねることにより、より効率的な光源の放熱が可能となる。また、同じ放熱効果の場合、放熱部材の量を減らすことが出来る。   The illumination device 100 according to the present embodiment is characterized in that the step portion also serves as a heat radiator that cools the light source. Therefore, according to the illuminating device 100 of this Embodiment, the level | step-difference part can also thermally radiate a more efficient light source by serving as the heat radiator which cools a light source. Further, in the case of the same heat dissipation effect, the amount of the heat dissipation member can be reduced.

本実施の形態に係る照明装置100は、前記基板はそれぞれの基板の片面に光源を配置した2つの基板の底面を合わせることで基板の両面に光源を配置することを特徴とする。したがって、本実施の形態の照明装置100によれば、基板はそれぞれの基板の片面に光源を配置した2つの基板の底面を合わせることで金属性の基板の両面に光源を配置することができる。   The lighting device 100 according to the present embodiment is characterized in that the light source is disposed on both surfaces of the substrate by aligning the bottom surfaces of the two substrates in which the light source is disposed on one surface of each substrate. Therefore, according to the illumination device 100 of the present embodiment, the substrates can arrange the light sources on both sides of the metallic substrate by matching the bottom surfaces of the two substrates in which the light sources are arranged on one side of each substrate.

実施の形態2.
(2)第2の実施の形態(図4、図5)
図4は、本実施の形態に係る照明装置100cの構造図である。図5は、本実施の形態に係る照明装置100cの光路の概略図である。
Embodiment 2. FIG.
(2) Second embodiment (FIGS. 4 and 5)
FIG. 4 is a structural diagram of the illumination device 100c according to the present embodiment. FIG. 5 is a schematic diagram of an optical path of the illumination device 100c according to the present embodiment.

本実施の形態では、主として、実施の形態1と異なる点について、以下に説明する。本実施の形態に係る照明装置100cと実施の形態1に係る照明装置100との相違点は、主に、段差部40cの凹曲面部41cの形状と、透光性グローブ10cの形状である。その他の同一の構成部分については、同一の符号を付し、その説明を省略する。   In the present embodiment, points different from the first embodiment will be mainly described below. The difference between the lighting device 100c according to the present embodiment and the lighting device 100 according to the first embodiment is mainly the shape of the concave curved surface portion 41c of the stepped portion 40c and the shape of the translucent globe 10c. Other identical components are denoted by the same reference numerals and description thereof is omitted.

本実施の形態の透光性グローブ10cは、半球状である。透光性グローブ10cには、本体平面板51の直径よりも外側に張り出したグローブ張出部11(図1参照)がない。   The translucent glove 10c of the present embodiment is hemispherical. The translucent glove 10 c does not have the glove overhanging portion 11 (see FIG. 1) that projects outward from the diameter of the main body flat plate 51.

LED基板3(3a,3b)は、照明装置100cの本体平面板51の中心位置と透光性グローブ10cの頂部を結ぶ線xの中心又は中心付近に設けられる。   LED board 3 (3a, 3b) is provided in the center of the line x which connects the center position of the main body plane board 51 of the illuminating device 100c, and the top part of the translucent glove 10c, or center vicinity.

段差部40cは、アルミニウム製であり、LED素子8a,8bを冷却するアルミニウム製の放熱体を兼ねている。段差部40cは、本体平面板51のz方向の360度いずれの方向から見ても、凹曲面を形成している。段差部40cは、ラッパ形状、富士山形状をしており、なだらかな裾野を有している。   The stepped portion 40c is made of aluminum, and also serves as an aluminum radiator that cools the LED elements 8a and 8b. The step portion 40 c forms a concave curved surface when viewed from any direction of 360 degrees in the z direction of the main body flat plate 51. The stepped portion 40c has a trumpet shape and a Mt. Fuji shape, and has a gentle skirt.

段差部40cの凹曲面を形成する凹曲面部41cは、光を反射するよう研磨により、表面をミラー状にした反射面43cを有する。段差40c部の凹曲面部41cは、凹面鏡として機能する。   The concave curved surface portion 41c forming the concave curved surface of the stepped portion 40c has a reflective surface 43c having a mirror-like surface by polishing so as to reflect light. The concave curved surface portion 41c of the step 40c portion functions as a concave mirror.

段差部40cの凹曲面部41cと本体平面板51(z方向)とがなす初期角度θ3は、0度から10度である。また、段差部40cの凹曲面部41cとLED基板3(3a,3b)(z方向)とがなす初期角度θ4は、90度から100度である。段差部40cの凹曲面部41cと本体平面板51(z方向)とがなす角度は、θ3から徐々に拡大し、その後、急勾配になって、段差部40cの凹曲面部41cとLED基板3(3a,3b)(z方向)とがなす角度θ4になる。   The initial angle θ3 formed by the concave curved surface portion 41c of the stepped portion 40c and the main body plane plate 51 (z direction) is 0 to 10 degrees. The initial angle θ4 formed by the concave curved surface portion 41c of the stepped portion 40c and the LED substrate 3 (3a, 3b) (z direction) is 90 degrees to 100 degrees. The angle formed by the concave curved surface portion 41c of the stepped portion 40c and the main body flat plate 51 (z direction) gradually increases from θ3, and then becomes a steep slope to form the concave curved surface portion 41c of the stepped portion 40c and the LED substrate 3. The angle θ4 formed by (3a, 3b) (z direction) is obtained.

透光性グローブ10cはポリカーボネート樹脂製であり、光拡散剤が添加されている。透光性グローブ10cは、実施の形態1において説明した透光性グローブ10と同一のものでも構わない。   The translucent globe 10c is made of polycarbonate resin, and a light diffusing agent is added. The translucent glove 10c may be the same as the translucent glove 10 described in the first embodiment.

本実施の形態によるLED基板3(3a,3b)の各面に配置されたLED素子8(8a,8b)による光路の概略図を図5に示す。   FIG. 5 shows a schematic diagram of an optical path by the LED elements 8 (8a, 8b) arranged on each surface of the LED substrate 3 (3a, 3b) according to the present embodiment.

LED素子8aから発せられる光L4は、直接、透光性グローブ10cに到達し、透光性グローブ10の光拡散作用により拡散されて外部に照射される。   The light L4 emitted from the LED element 8a directly reaches the translucent globe 10c, is diffused by the light diffusing action of the translucent globe 10, and is irradiated to the outside.

LED素子8bから発せられる光L5は、段差部40cの凹曲面部41cに到達し、凹面鏡作用により反射してL51の光路をとる。L51は、透光性グローブ10cに到達し、透光性グローブ10cの光拡散作用により拡散されて外部に照射される。   The light L5 emitted from the LED element 8b reaches the concave curved surface portion 41c of the stepped portion 40c, is reflected by the concave mirror action, and takes the optical path of L51. L51 reaches the translucent globe 10c, is diffused by the light diffusing action of the translucent globe 10c, and is irradiated to the outside.

LED素子8bから発せられる光L6は、段差部40cの凹曲面部41cに到達し、凹面鏡作用により反射してL61の光路をとる。L61は、透光性グローブ10cに到達し、透光性グローブ10cの光拡散作用により拡散されて外部に照射される。   The light L6 emitted from the LED element 8b reaches the concave curved surface portion 41c of the stepped portion 40c, is reflected by the concave mirror action, and takes the optical path of L61. L61 reaches the translucent globe 10c, is diffused by the light diffusing action of the translucent globe 10c, and is irradiated to the outside.

光拡散剤を添加した樹脂製グローブ(透光性グローブ10c)と、曲面(凹曲面)を形成したテーパー状の段差部40cによりLED基板3(3a,3b)の両面に配置されたLED素子8a,8bの光は、図5のような光路となり、180°以上の配光を実現するとともに、上記z方向により多くの光を配光することが出来る。   LED elements 8a disposed on both sides of the LED substrate 3 (3a, 3b) by a resin-made globe (translucent globe 10c) to which a light diffusing agent is added and a tapered step portion 40c having a curved surface (concave surface). , 8b has an optical path as shown in FIG. 5, and a light distribution of 180 ° or more can be realized, and more light can be distributed in the z direction.

本実施の形態に係る照明装置100cは、前記テーパー状の段差部のテーパー面は曲面であることを特徴とする。したがって、本実施の形態に係る照明装置100cによれば、テーパー状の段差部を曲面(凹曲面)として光を反射することにより、上記平面方向により多くの光を配光することが出来る。   The illumination device 100c according to the present embodiment is characterized in that the tapered surface of the tapered step portion is a curved surface. Therefore, according to the illumination device 100c according to the present embodiment, it is possible to distribute more light in the planar direction by reflecting light with a tapered stepped portion as a curved surface (concave surface).

本実施の形態に係る照明装置100cは、前記段差部は表面を研磨して光を反射する金属製であることを特徴とする。したがって、本実施の形態に係る照明装置100cによれば、段差部は表面を研磨して光を反射する金属製とすることにより、透光性グローブの基部方向及び上記平面方向により多くの光を配光することが出来る。   The illumination device 100c according to the present embodiment is characterized in that the stepped portion is made of metal that polishes the surface and reflects light. Therefore, according to the illuminating device 100c which concerns on this Embodiment, a level | step-difference part grind | polishes the surface, and makes it metal from the light reflection, Therefore, more light is transmitted to the base direction of a translucent glove, and the said plane direction. Can distribute light.

以上、実施の形態1〜2について説明したが、これらの2つの実施の形態を組み合わせて実施しても構わない。あるいは、これらのうち、1つの実施の形態を部分的に実施しても構わない。あるいは、これらの2つの実施の形態を部分的に組み合わせて実施しても構わない。   Although Embodiments 1 and 2 have been described above, these two embodiments may be combined. Alternatively, one of these embodiments may be partially implemented. Alternatively, these two embodiments may be partially combined.

上記した形態では、表面と裏面とを備える基板と、前記裏面の面積より小さい取付面と、前記取付面に対向する対向面であって前記取付面の面積よりも大きい対向面と、前記取付面の周縁から前記対向面の周縁に向かって広がる側面とを備え、前記裏面に前記取付面を当接させて前記基板を取り付ける基板取付台とを備え、前記基板は、前記裏面の領域のうち前記取付面が当接されていない領域に光源が実装される照明装置の一例を説明した。   In the above-described form, a substrate having a front surface and a back surface, a mounting surface that is smaller than the area of the back surface, a facing surface that faces the mounting surface and is larger than the area of the mounting surface, and the mounting surface A side surface that widens from the periphery of the counter surface toward the periphery of the facing surface, and includes a substrate mounting base that attaches the substrate by contacting the mounting surface to the back surface, An example of a lighting device in which a light source is mounted in a region where the mounting surface is not in contact has been described.

また、前記取付面は、前記裏面の領域のうちの中央の領域に当接され、前記光源は、前記中央の領域を囲むように実装される照明装置の一例を説明した。   Moreover, the said mounting surface contact | abutted to the center area | region of the area | regions of the said back surface, and demonstrated the example of the illuminating device mounted so that the said light source might surround the said center area | region.

また、前記基板取付台と前記基板取付台に取り付けられた前記基板とを覆う透光性のグローブを備え、前記基板取付台の側面は、前記光源から発せられる光を反射して前記グローブを通過させる反射面である照明装置の一例を説明した。   The substrate mounting table includes a translucent globe that covers the substrate mounting table and the substrate mounted on the substrate mounting table, and the side surface of the substrate mounting table reflects the light emitted from the light source and passes through the globe. An example of a lighting device that is a reflecting surface to be performed has been described.

また、前記グローブは、前記取付面に平行な面による断面が環形状であり、前記基板は、前記グローブの前記断面のうち直径が最大となる最大直径断面と同一面に取り付けられる照明装置の一例を説明した。   In addition, the globe has an annular cross section by a plane parallel to the mounting surface, and the substrate is an example of a lighting device that is mounted on the same plane as the maximum diameter cross section having the maximum diameter among the cross sections of the globe. Explained.

また、前記基板取付台の側面は、テーパー状である照明装置の一例を説明した。   Moreover, the side surface of the said board | substrate mounting base demonstrated an example of the illuminating device which is a taper shape.

また、前記基板取付台は、前記対向面と前記側面との角度が40度から60度である照明装置の一例を説明した。   Moreover, the said board | substrate mounting base demonstrated an example of the illuminating device whose angle of the said opposing surface and the said side surface is 40 to 60 degree | times.

また、前記基板取付台の側面は、凹曲面である照明装置の一例を説明した。   Moreover, the example of the illuminating device whose side surface of the said board | substrate mounting base is a concave curved surface was demonstrated.

また、前記取付面と前記対向面と前記基板とは円形状であり、前記基板の半径は、前記対向面の半径の2分の1から4分の3の長さであり、前記取付面の半径は、前記基板の半径の2分の1から4分の3の長さである照明装置の一例を説明した。   In addition, the mounting surface, the facing surface, and the substrate are circular, and the radius of the substrate is 1/2 to 3/4 of the radius of the facing surface, An example of a lighting device in which the radius is 1/2 to 3/4 the radius of the substrate has been described.

2 光拡散膜、3,3a,3b LED基板、7 口金部、8,8a,8b LED素子、10,10c 透光性グローブ、11 グローブ張出部、31 発光面、32 非発光面、35 基板張出部、40,40c 段差部、41 テーパー面、41c 凹曲面部、42 反射面、43 光拡散膜、43c 反射面、44 基板取付面、45 底部、50 照明装置本体、51 本体平面板、60 外郭部、61 放熱体、100,100c 照明装置。   2 light diffusion film, 3, 3a, 3b LED substrate, 7 base part, 8, 8a, 8b LED element, 10, 10c translucent globe, 11 globe overhang, 31 light emitting surface, 32 non-light emitting surface, 35 substrate Overhang part, 40, 40c Step part, 41 Tapered surface, 41c Concave surface part, 42 Reflecting surface, 43 Light diffusion film, 43c Reflecting surface, 44 Substrate mounting surface, 45 Bottom part, 50 Illuminating device main body, 51 Main body flat plate, 60 outer part, 61 radiator, 100, 100c lighting device.

Claims (7)

第1の光源が表面である第1の発光面に実装され、第2の光源が裏面である第2の発光面に実装される両面実装型の基板と、
前記裏面の面積より小さい取付面と、前記取付面に対向する対向面であって前記取付面の面積よりも大きい対向面と、前記取付面の周縁から前記対向面の周縁に向かって広がる側面とからなる外観形状をなし、前記裏面と前記取付面とが当接して前記基板が取り付けられる基板取付台と、
を備え、
前記基板は、
前記裏面の前記取付面と当接しない領域のうち、前記第1の光源が実装される領域より外側の領域に前記第2の光源が実装される照明装置。
A double-sided mounting type substrate in which a first light source is mounted on a first light-emitting surface as a front surface and a second light source is mounted on a second light-emitting surface as a back surface;
A mounting surface that is smaller than the area of the back surface, a facing surface that faces the mounting surface and is larger than the area of the mounting surface, and a side surface that extends from the periphery of the mounting surface toward the periphery of the facing surface. A board mounting table on which the back surface and the mounting surface are in contact with each other and the board is mounted;
With
The substrate is
The lighting device in which the second light source is mounted in a region outside the region in which the first light source is mounted in a region of the back surface that does not contact the mounting surface.
前記取付面は、前記裏面の領域のうちの中央の領域に当接され、
前記第2の光源は、前記中央の領域を囲むように実装される請求項1に記載の照明装置。
The mounting surface is in contact with a central region of the back surface region,
The lighting device according to claim 1, wherein the second light source is mounted so as to surround the central region.
前記照明装置は、前記基板取付台と前記基板取付台に取り付けられた前記基板とを覆う透光性のグローブを備え、
前記基板取付台の側面は、前記光源から発せられる光を前記グローブに向けて反射させる反射面である請求項1または2に記載の照明装置。
The lighting device includes a light-transmitting glove that covers the substrate mounting base and the substrate attached to the substrate mounting base.
The lighting device according to claim 1, wherein the side surface of the substrate mounting base is a reflecting surface that reflects light emitted from the light source toward the globe.
前記グローブは、前記取付面に平行な面による断面が環形状であり、
前記基板は、前記グローブの前記断面のうち直径が最大となる最大直径断面と同一面に取り付けられる請求項3に記載の照明装置。
The globe has a ring-shaped cross section by a plane parallel to the mounting surface,
The lighting device according to claim 3, wherein the substrate is attached to the same plane as a maximum diameter section having a maximum diameter among the sections of the globe.
前記側面は、テーパー状である請求項1から4のいずれか1項に記載の照明装置。   The lighting device according to claim 1, wherein the side surface is tapered. 前記側面は、凹曲面である請求項1から4のいずれか1項に記載の照明装置。   The lighting device according to claim 1, wherein the side surface is a concave curved surface. 前記取付面と前記対向面と前記基板とは円形状であり、
前記グローブは、前記対向面の周縁に接合され、
前記対向面の周縁は、前記基板および前記取付面よりも半径が大きい請求項3または4に記載の照明装置。
The mounting surface, the facing surface and the substrate are circular,
The globe is joined to the periphery of the facing surface,
5. The lighting device according to claim 3, wherein a peripheral edge of the facing surface has a radius larger than that of the substrate and the mounting surface.
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JP2018195440A (en) * 2017-05-17 2018-12-06 合同会社エイアイテクノ Light emitting diode lighting device and manufacturing method of the same and mounting structure and manufacturing method of the same

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JP2012248533A (en) * 2011-05-25 2012-12-13 Seoul Semiconductor Co Ltd Led lamp

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JP2012248533A (en) * 2011-05-25 2012-12-13 Seoul Semiconductor Co Ltd Led lamp

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KR101620496B1 (en) * 2015-09-21 2016-05-12 (주)티플러스조명 LED lighting device using heat sink for reflector
JP2018195440A (en) * 2017-05-17 2018-12-06 合同会社エイアイテクノ Light emitting diode lighting device and manufacturing method of the same and mounting structure and manufacturing method of the same

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