KR101613357B1 - 구리 합금판, 그리고 그것을 구비하는 대전류용 전자 부품 및 방열용 전자 부품 - Google Patents

구리 합금판, 그리고 그것을 구비하는 대전류용 전자 부품 및 방열용 전자 부품 Download PDF

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Publication number
KR101613357B1
KR101613357B1 KR1020140085005A KR20140085005A KR101613357B1 KR 101613357 B1 KR101613357 B1 KR 101613357B1 KR 1020140085005 A KR1020140085005 A KR 1020140085005A KR 20140085005 A KR20140085005 A KR 20140085005A KR 101613357 B1 KR101613357 B1 KR 101613357B1
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KR
South Korea
Prior art keywords
mass
copper alloy
electronic component
annealing
rolling
Prior art date
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KR1020140085005A
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English (en)
Korean (ko)
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KR20150034078A (ko
Inventor
아키히로 가키타니
Original Assignee
제이엑스 킨조쿠 가부시키가이샤
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Publication of KR20150034078A publication Critical patent/KR20150034078A/ko
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Publication of KR101613357B1 publication Critical patent/KR101613357B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020140085005A 2013-09-25 2014-07-08 구리 합금판, 그리고 그것을 구비하는 대전류용 전자 부품 및 방열용 전자 부품 KR101613357B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-199026 2013-09-25
JP2013199026A JP5470499B1 (ja) 2013-09-25 2013-09-25 銅合金板、並びに、それを備える大電流用電子部品及び放熱用電子部品

Publications (2)

Publication Number Publication Date
KR20150034078A KR20150034078A (ko) 2015-04-02
KR101613357B1 true KR101613357B1 (ko) 2016-04-18

Family

ID=50749768

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140085005A KR101613357B1 (ko) 2013-09-25 2014-07-08 구리 합금판, 그리고 그것을 구비하는 대전류용 전자 부품 및 방열용 전자 부품

Country Status (4)

Country Link
JP (1) JP5470499B1 (zh)
KR (1) KR101613357B1 (zh)
CN (1) CN104451241B (zh)
TW (1) TWI509090B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105088010B (zh) * 2015-08-31 2017-08-25 河南科技大学 一种高强高导稀土铜锆合金及其制备方法
JP2017057476A (ja) 2015-09-18 2017-03-23 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
TW202035722A (zh) * 2019-03-25 2020-10-01 日商Ｊｘ金屬股份有限公司 銅合金板、通電用電子零件及散熱用電子零件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008127605A (ja) 2006-11-17 2008-06-05 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板
JP2010248592A (ja) 2009-04-17 2010-11-04 Hitachi Cable Ltd 銅合金の製造方法及び銅合金

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
CN1688732B (zh) * 2002-09-13 2010-05-26 Gbc金属有限责任公司 时效硬化型铜基合金及其制备工艺
CN100345988C (zh) * 2005-12-13 2007-10-31 江苏科技大学 高强度铜合金导电丝材及生产方法
CN101956094B (zh) * 2010-10-15 2011-11-30 哈尔滨工业大学深圳研究生院 一种高强高导弥散强化铜合金的制备方法
JP6222885B2 (ja) * 2011-11-10 2017-11-01 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP2013117060A (ja) * 2011-12-05 2013-06-13 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008127605A (ja) 2006-11-17 2008-06-05 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板
JP2010248592A (ja) 2009-04-17 2010-11-04 Hitachi Cable Ltd 銅合金の製造方法及び銅合金

Also Published As

Publication number Publication date
TWI509090B (zh) 2015-11-21
CN104451241B (zh) 2017-06-20
TW201512429A (zh) 2015-04-01
CN104451241A (zh) 2015-03-25
JP5470499B1 (ja) 2014-04-16
JP2015063741A (ja) 2015-04-09
KR20150034078A (ko) 2015-04-02

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