KR101587808B1 - 패턴화된 구조적 도메인들을 포함하는 화학-기계적 평탄화 패드 - Google Patents

패턴화된 구조적 도메인들을 포함하는 화학-기계적 평탄화 패드 Download PDF

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KR101587808B1
KR101587808B1 KR1020117018544A KR20117018544A KR101587808B1 KR 101587808 B1 KR101587808 B1 KR 101587808B1 KR 1020117018544 A KR1020117018544 A KR 1020117018544A KR 20117018544 A KR20117018544 A KR 20117018544A KR 101587808 B1 KR101587808 B1 KR 101587808B1
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KR20110124227A (ko
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폴 리페브레
아눕 매튜
스캇 씬 치아오
광웨이 우
데이비드 애덤 웰스
오스카 케이. 슈
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에프엔에스테크 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020117018544A 2009-01-27 2010-01-27 패턴화된 구조적 도메인들을 포함하는 화학-기계적 평탄화 패드 Active KR101587808B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14755109P 2009-01-27 2009-01-27
US61/147,551 2009-01-27

Publications (2)

Publication Number Publication Date
KR20110124227A KR20110124227A (ko) 2011-11-16
KR101587808B1 true KR101587808B1 (ko) 2016-01-22

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KR1020117018544A Active KR101587808B1 (ko) 2009-01-27 2010-01-27 패턴화된 구조적 도메인들을 포함하는 화학-기계적 평탄화 패드

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US (2) US8435099B2 (https=)
EP (1) EP2382651A4 (https=)
JP (1) JP5543494B2 (https=)
KR (1) KR101587808B1 (https=)
CN (1) CN102301455A (https=)
SG (1) SG173452A1 (https=)
TW (1) TWI517230B (https=)
WO (1) WO2010088246A1 (https=)

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JP6067481B2 (ja) * 2013-05-23 2017-01-25 株式会社東芝 研磨パッド、研磨方法、および研磨パッドの製造方法
CN103753382B (zh) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 一种抛光垫及其制备方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
TWI548481B (zh) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 拋光墊及其製造方法
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN115816291B (zh) * 2022-12-09 2026-02-06 万华化学集团电子材料有限公司 一种具有改善边缘效应的化学机械抛光垫、制备方法及其应用

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JP2006140240A (ja) * 2004-11-11 2006-06-01 Renesas Technology Corp 研磨パッド、研磨装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
WO2010088246A1 (en) 2010-08-05
KR20110124227A (ko) 2011-11-16
JP5543494B2 (ja) 2014-07-09
JP2012516247A (ja) 2012-07-19
US20130244548A1 (en) 2013-09-19
TWI517230B (zh) 2016-01-11
CN102301455A (zh) 2011-12-28
EP2382651A1 (en) 2011-11-02
US8435099B2 (en) 2013-05-07
SG173452A1 (en) 2011-09-29
EP2382651A4 (en) 2013-01-16
US20100221985A1 (en) 2010-09-02
TW201034792A (en) 2010-10-01
US9162341B2 (en) 2015-10-20

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