KR101544496B1 - Probe pin device and ultra low leakage current probe card for DC prameter test - Google Patents

Abstract

Disclosed are a probe for DC parameter test and a probe card comprising the same. The probe for DC parameter test and the probe card comprising the same according to the present invention includes: a main circuit board; a sub circuit board combined to an aperture of the main circuit board; a probe block contacting a bottom of the sub circuit board; and the probe formed on the lower part of the probe block to contact an object. The probe includes: a fixing part which is attached to the probe block and is formed at one side; a beam which is formed along the side on a bottom of the fixing part; and a tip part which is formed vertically to the end of the beam downward and becomes sharper as going downward. Accordingly, the present invention can assure stable driving and electrical signal transfer characteristics and a long lifetime by the probe structure which has strong contact force of being able to permeate a natural oxide of a semiconductor wafer pad surely when contacting the pad and also disperses stress properly. And because it is possible to minimize a scrub mark, high electrical characteristics can be obtained with low costs without using an additional expensive space transformer as being able to cope with a micro pad.

Description

Technical Field [0001] The present invention relates to a probe probe for DC parameter testing and an ultra-low leakage current probe card having the probe probe.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe probe for DC parameter testing and an ultra-low leakage current probe card having the probe probe. More particularly, the present invention relates to a probe probe for DC parameter testing, The present invention relates to an ultra-fine leakage current probe probe and a probe card having the same.

Typical semiconductor devices are subjected to a product test to determine the final package, that is, the process yield and the abnormality of the electrical signal, after the completion of the process of the wafer unit. The probe card, which contacts the pad surface of the device to be measured, Is used.

As a prior art relating to a probe card, a "probe card" of Korean Patent Registration No. 1047537, which is filed by the present inventor, is disclosed.

The prior art has a subcircuit board for connecting a main circuit board and a space transformer to a probe card that can be easily connected by a wire, thereby shortening a working time and preventing an operation error.

On the other hand, probe cards are one of the important measurement elements of semiconductor wafers.

Among these items, tests for DC parameters and ultrasmall signal measurement require that the current and the fine signal in picoseconds (pA) be measured, so that the IC can be tested only when there is little leakage current generated from the probe card.

Therefore, the probe card for the DC parameter test should have a low leakage current characteristic of a maximum of several picoseconds, or more preferably, a few tens of femtoseconds or less.

However, the probe probe formed on the probe card in the related art does not provide sufficient contact force and stable characteristics of electric preference transfer, and the pad has a large damage.

In addition, since the size and pitch of the pads are becoming smaller in the prior art, it is difficult to cope with a pad size of 50 micrometers or less and a fine pad pitch of 100 micrometers or less.

In addition, due to the nature of the DC parameter test, the contamination of the tip greatly affects the test results, so that the contact portion of the tip of the tip is often cleaned through a wear sheet or the like.

The present invention has been made in order to solve the problems of the prior art, and it is an object of the present invention to minimize scrub marks generated by penetrating a natural oxide film of a pad upon contact with a semiconductor wafer pad, to have strong contact force and stable electrical signal transmission characteristics, These structural features provide a probe probe for DC parameter test and an ultra-low leakage current probe card with high mechanical and electrical characteristics, ensuring high reliability even under harsh test conditions by appropriately dispersing stress. It has its purpose.

According to an aspect of the present invention, there is provided a semiconductor device comprising a main circuit board, a sub circuit board coupled to an opening of the main circuit board, a probe block contacting the lower surface of the sub circuit board, Wherein the probe tip is formed with a fixing part attached to the probe block at one side thereof and a beam is formed laterally integrally with the lower part of the fixing part, And a tip portion is formed in a downward direction. The probe tip for a DC parameter test and the probe card having the probe tip can be achieved by the probe tip.

Wherein the beam is formed to have a predetermined horizontal length and has a bridge connected to the fixing portion at one end thereof, the bridge being deflected to one side of the fixing portion, and a first extension for connecting the bridge and one end of the beam, And a tip portion is formed perpendicularly to a lower portion of the second expanding portion, and a sharp tip is formed at a lower end of the tip portion.

The beam includes a first hole formed at the center of the long hole in the longitudinal direction and communicating with both ends of the long hole, and a second hole formed in the second extended portion and a second hole formed in the first extended portion .

The tip portion is vertically formed and a sharp tip is formed at an end thereof.

Wherein the beam has a first inclined portion inclined downwardly and a second inclined portion inclined downwardly in a direction opposite to the first inclined portion, and a bridge connected to the fixing portion is formed at one end of the first inclined portion, A first extension portion connecting the bridge and one end of the first inclined portion is formed and a second extension portion is formed at the other end of the first inclined portion connected to the second inclined portion, A tip portion is formed, and a sharp tip is formed at a lower end of the tip portion.

The fixing part has a plurality of fixing pins vertically formed to be connected to the fine holes formed in the probe block and has a longer length than the fixing pin on the other side of the upper part and is coupled to the sub circuit board through the probe block, And a signal line for transmitting the signal is formed.

And a groove is formed at a connection portion between the lower end of the fixing pin and the fixing portion.

The main circuit board has a plurality of channels circumferentially arranged on an outer periphery of the main circuit board. Each of the plurality of channels includes a guard, a signal formed at the center of the guard, and a groove formed between the guard and the signal, Thereby minimizing a leakage current generated between the electrodes.

According to the present invention, it is possible to ensure stable driving, electrical signal transmission characteristics, and high durability due to a probe structure in which a strong contact force capable of reliably penetrating a natural oxide film of a pad when contacting a semiconductor wafer pad can be obtained, have.

In addition, the scrub marks can be minimized, and thus it is possible to cope with the increasingly smaller pads, and it is possible to achieve high electrical characteristics at a low price without using expensive expensive transducer parts.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a first embodiment of a probe probe for DC parameter testing according to the present invention;
2 shows a second embodiment of a probe tip for a DC parameter test according to the present invention,
3 is a view showing a modification of the first embodiment of the probe probe for DC parameter testing according to the present invention,
FIG. 4 is a diagram illustrating an example of a probe tip including a fixed portion and wires of various shapes for realizing a fine pitch without using a space converter, according to a first embodiment of a probe tip for DC parameter testing according to the present invention;
FIG. 5 is an exploded perspective view showing a probe card having a probe probe for DC parameter testing according to the present invention. FIG.
6 is a combined sectional view showing a probe card having a probe probe for DC parameter testing according to the present invention,
FIG. 7 is a partially enlarged view showing a 'channel' by enlarging a part of FIG. 6; FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. It does not mean anything.

In addition, the sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, and the terms defined specifically in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user, operator It should be noted that the definitions of these terms should be made on the basis of the contents throughout this specification.

FIG. 1 is a view showing a first embodiment of a probe for a DC parameter test according to the present invention, FIG. 2 is a view showing a second embodiment of a probe for a DC parameter test according to the present invention, and FIG. 3 is a view showing a modification of the first embodiment of the probe for a DC parameter test according to the present invention. FIG. 4 is a schematic view of a probe tip for a DC parameter test according to the present invention, FIG. 1 is an exploded perspective view showing a probe card having a probe for a DC parameter test according to the present invention, and FIG. 6 is an exploded perspective view showing a probe card having a probe for a DC parameter test according to the present invention. FIG. 7 is a cross-sectional view illustrating a probe card having a probe for a DC parameter test according to the present invention. It is a partially enlarged view illustrating a '.

5 to 7, a probe card having a probe tip for a DC parameter test according to the present invention includes a main circuit board 2, a sub-circuit (not shown) coupled to an opening of the main circuit board 2, A probe block 6 contacting the lower surface of the sub circuit board 4 and probe probes A1 and A2 formed below the probe block 6 to be brought into contact with the object, .

The probe probes A1 and A2 have bar-shaped fixing portions 82 and 82a formed on one side thereof so as to be attached to the bottom surface of the probe block 6, The beam 84 and 84a are integrally formed in the lateral direction and include tip portions 86 and 86a vertically downwardly formed at the ends of the beams 84 and 84a and being formed to be sharply downward.

The probe probes are categorized into two types, which will be referred to as a first embodiment (A1) and a second embodiment (A2).

The probe probe A1 according to the first embodiment is formed such that the beam 84 has a horizontal length. This is a cantilever type.

A bridge 85 connected to the fixing portion 82 is formed at one end of the beam 84 and preferably the bridge 85 is connected to one side of the fixing portion 82 in a deflected manner.

A circular first extension portion 842 is formed to connect one end of the bridge 85 to one end of the beam 84 and a second extension portion 844 is formed in the other end portion in a circular shape.

A tip portion 86 is vertically formed on the lower portion of the second extension portion 844 and a sharp tip 861 is formed on the lower end of the tip portion 86.

The beam 84 has a first hole 845 formed at the center of a long hole 840 in the longitudinal direction and formed at both ends of the long hole 840 and formed in the first extension 842, A second hole 846 formed in the second extension 844 is formed.

By taking the structure of the double beam in which the elongated hole 840 is formed, warping does not occur when a large overdriving application is applied while maintaining a high pad contact force.

3, a plurality of fixing pins 822 vertically formed to be connected to the fine holes formed in the probe block 6 are formed on one upper side of the fixing portion 82, A signal line 900 is formed which is longer than the probe block 822 and penetrates the probe block 6 to be coupled to the sub circuit board 4 to transmit a signal.

A groove 824 is formed at a connection portion between the lower end of the fixing pin 822 and the fixing portion 82. That is, the C-shaped groove 824 is formed by pulling both sides of the root portion of the fixing pin 822 inwardly.

By forming the grooves 824 in this manner, a tension can be provided to closely contact the substrate when the fixing pin 822 is inserted into the fine holes formed in the probe block 6, and a plurality of probe probes A1 The entire height of each of the tips 861 of the first and second plates 861 and 862 can be uniformly formed.

Also, the beam 84 according to the first embodiment may be modified into various forms as shown in FIG.

This shows that it is possible to select the number of fixing pins 822 to be increased or decreased or changed.

As shown in FIG. 4, in order to manufacture a probe card, various types of probe probes having different positions of a fixing part and a wiring part are designed to be able to cope with a fine pad pitch without using a separate space changer A modification can be made.

On the other hand, the probe probe A2 according to the second embodiment has an inverted portion 850a formed in the middle of the beam 84a as shown in FIG.

That is, the beam 84a according to the second embodiment includes a first inclined portion 810a inclined downward and a second inclined portion 830a inclined downward in a direction opposite to the first inclined portion 810a And,

A bridge 85a connected to the fixing portion 82a is formed at one end of the first inclined portion 810a,

A first extension 842a connecting the bridge 85a and one end of the first inclined portion 810a is formed.

A second extending portion 844a is formed at the other end of the first inclined portion 810a and connected to the second inclined portion 830a and a tip portion 86a is formed perpendicularly to the lower portion of the second inclined portion 830a. And a sharp tip 861a is formed at the lower end of the tip portion 86a.

The fixing portion 82a has a plurality of fixing pins 822a vertically formed to be connected to the fine holes formed in the probe block 6 and has a longer length than the fixing pins 822a on the upper side, And a signal line 900a penetrating the probe block 6 and coupled to the sub circuit board 4 to transmit a signal is formed.

In the fixing pin 822a, a groove 824 is formed at a connection portion between the lower end of the fixing pin 822 and the fixing portion 82a (the groove 824 has a constituent code shown in FIG. 3) . That is, the C-shaped groove 824 is formed by pulling inward both sides of the root portion of the fixing pin 822a.

By forming the grooves 824 in this manner, the fixing pin 822a can be inserted into the fine holes formed in the probe block 6 to provide a tension to be brought into close contact with the substrate, and a plurality of probe probes 8 The entire height of each of the tips 861 of the first and second plates 861 and 862 can be uniformly formed.

A probe card with a probe tip for DC parameter testing according to the present invention is shown in detail in FIGS.

A probe card according to the present invention includes a main circuit board 2, a sub circuit board 4 coupled to an opening of the main circuit board 2, a probe block 4 contacting a lower surface of the sub circuit board 4, And probe probes A1 and A2 formed below the probe block 6 to be in contact with the object.

A plurality of channels 3 are circumferentially formed on the outer periphery of the surface of the main circuit board 2.

Each of the plurality of channels 3 is made of a conductive material and includes a guard 32 formed in a substantially elliptical shape as shown in FIG. 5, a signal 34 formed at the center of the guard 32, And a groove (36) formed between the guard (32) and the signal (34) at an engaging angle.

Thus, the leakage current generated between adjacent channels 3 can be minimized by forming the grooves 36.

The probe block 6 is made of a material having a high resistance and easy to be drilled and minimizes a leakage current, and is preferably made of ceramic or engineering plastic.

In the center of the probe tip A1, a fine hole 60 to which the probe tip A1 is coupled is formed to fix the probe tip A1, and the probe tip A1 is connected to an external wire so as to be energized.

The energization is performed by connecting the signal lines 900 and 900a of the probe probes A1 and A2 to the via holes on the sub circuit board 4 by being soldered and passing the coaxial cable through the wiring on the sub circuit board 4, Lt; / RTI >

After the epoxy is applied to the fine holes 60, the probe probe A1 is inserted and adhered and fixed.

Alternatively, it is possible to press the probe tip A1 into the fine hole 60 without epoxy and fix it.

The sub circuit board 4 is formed to have a thickness smaller than the thickness of the main circuit board 2, and the length from the probe tip A1 to the wiring can be the shortest.

And a bottom fixing means 5 coupled to a lower surface of the main circuit board 2 to fix and hold the probe block 6 and the sub circuit board 4 therein.

The bottom fixing means 5 is formed with a base 52 for inserting the sub circuit board 4 and a ring hole formed at the center so as to expose the probe block 6 so as to have a ring shape, Is an aluminum alloy or sus-based metal material which is good and easy to process.

And an upper fixing means 7 coupled to an upper surface of the main circuit board 2.

The upper fixing means 7 is ring-shaped with a larger diameter than the opening 20 of the main circuit board 2 and the top cover 72 is coupled to the upper portion. The material of the upper fixing means 7 is flat, Aluminum alloy or stainless steel.

In addition, the probe probe according to the present invention is manufactured by a MEMS process, more specifically, a LIGA and LIGA-like process, and the material can be made of Ni-Co material or the corresponding material in consideration of electrical and mechanical characteristics.

In order to manufacture a probe card according to the present invention, a probe probe having two or more kinds of fixing parts and wiring positions different from each other is required as shown in FIG. 4, It is possible to cope with the pitch, and the manufacturing cost can be greatly reduced.

Further, the shape of the probe probe according to the present invention can be applied not only to the low leakage current probe card but also to the general probe card, except for the fixing portion.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the invention, It is obvious that the claims fall within the scope of the claims.

2: main circuit board 3; channel
4: sub circuit board 6; Probe block
8: Probe probe 32: Guard
34: Signal 36: Home

Claims (7)

A sub-circuit board connected to an opening of the main circuit board, and a probe block contacting the lower surface of the sub-circuit board,
A fixing part attached to the probe block is formed on one side,
A beam is integrally formed in the lower portion of the fixing portion in a lateral direction,
And a tip portion formed to be vertically downwardly formed at an end portion of the beam and being sharply pointed downward,
The beam is formed to have a predetermined length horizontally,
A bridge connected to the fixing part at one end is formed, the bridge is biased to one side of the fixing part,
A first extension portion connecting the bridge and one end of the beam is formed,
And a second extension part is formed at the other end,
A tip portion is formed vertically below the second extension portion,
And a sharp tip is formed on the lower end of the tip portion. delete The method according to claim 1,
The beam is formed with a long hole in the longitudinal direction,
A first hole formed in the first extension portion and a second hole formed in the second extension portion so as to communicate with both ends of the elongated hole; and a second hole formed in the second extension portion. A sub-circuit board connected to an opening of the main circuit board, and a probe block contacting the lower surface of the sub-circuit board,
A fixing part attached to the probe block is formed on one side,
A beam is integrally formed in the lower portion of the fixing portion in a lateral direction,
And a tip portion formed to be vertically downwardly formed at an end portion of the beam and being sharply pointed downward,
Wherein the beam has a first inclined portion inclined downwardly and a second inclined portion inclined downwardly in a direction opposite to the first inclined portion,
A bridge connected to the fixing portion is formed at one end of the first inclined portion,
A first extension part connecting the bridge and one end of the first inclined part is formed,
A second extension part is formed at the other end of the first inclined part at a portion connected to the second inclined part,
A tip portion is formed perpendicularly to a lower portion of the second inclined portion,
And a sharp tip is formed on the lower end of the tip portion. The method according to claim 1 or 4,
The fixed portion
A plurality of vertically formed fixing pins are formed on one upper side,
And a signal line which is longer than the fixing pin and is connected to the sub circuit board through the probe block to transmit a signal is formed on the upper side of the probe block. 6. The method of claim 5,
And a groove is formed at a connection portion between the lower end of the fixing pin and the fixing portion. A probe card comprising the probe according to any one of claims 1 to 4,
The main circuit board
A plurality of channels are arranged in the circumferential direction on the outer periphery of one surface,
Each of the plurality of channels
A signal formed at the center of the guard and a groove formed between the guard and the signal are formed so as to minimize the leakage current generated between the channels, the probe card having the probe for a DC parameter test.

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