KR101540137B1 - 다중 빔 천공 시스템 - Google Patents

다중 빔 천공 시스템 Download PDF

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Publication number
KR101540137B1
KR101540137B1 KR1020107014374A KR20107014374A KR101540137B1 KR 101540137 B1 KR101540137 B1 KR 101540137B1 KR 1020107014374 A KR1020107014374 A KR 1020107014374A KR 20107014374 A KR20107014374 A KR 20107014374A KR 101540137 B1 KR101540137 B1 KR 101540137B1
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KR
South Korea
Prior art keywords
beams
pulse
ratio
pulse energy
holes
Prior art date
Application number
KR1020107014374A
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English (en)
Korean (ko)
Other versions
KR20100113068A (ko
Inventor
베니 나베흐
즈비 코틀러
하니나 고란
Original Assignee
오르보테크 엘티디.
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Publication of KR20100113068A publication Critical patent/KR20100113068A/ko
Application granted granted Critical
Publication of KR101540137B1 publication Critical patent/KR101540137B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Lasers (AREA)
KR1020107014374A 2008-01-10 2009-01-11 다중 빔 천공 시스템 KR101540137B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2027308P 2008-01-10 2008-01-10
US61/020,273 2008-01-10

Publications (2)

Publication Number Publication Date
KR20100113068A KR20100113068A (ko) 2010-10-20
KR101540137B1 true KR101540137B1 (ko) 2015-07-28

Family

ID=40853536

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020107014374A KR101540137B1 (ko) 2008-01-10 2009-01-11 다중 빔 천공 시스템
KR1020107015335A KR101528385B1 (ko) 2008-01-10 2009-01-11 다중 미러 조정 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020107015335A KR101528385B1 (ko) 2008-01-10 2009-01-11 다중 미러 조정 시스템

Country Status (5)

Country Link
US (2) US8390795B2 (zh)
JP (2) JP5443390B2 (zh)
KR (2) KR101540137B1 (zh)
CN (2) CN101909804B (zh)
WO (2) WO2009087638A2 (zh)

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CN103066479A (zh) * 2012-12-14 2013-04-24 青岛镭创光电技术有限公司 激光晶体装配装置及方法
CN103394809A (zh) * 2013-08-06 2013-11-20 孙树峰 汽车喷油器微细喷油孔飞秒激光高效精密加工装置及方法
EP2902148B1 (en) 2013-11-25 2019-08-28 Preco, Inc. High density galvo housing for use with multiple laser beams ; galvo system and laser beam processing system with such housing
CN103658975B (zh) * 2013-12-03 2017-02-15 张立国 一种激光分束加工装置
US10239155B1 (en) * 2014-04-30 2019-03-26 The Boeing Company Multiple laser beam processing
US9269149B2 (en) 2014-05-08 2016-02-23 Orbotech Ltd. Calibration of a direct-imaging system
KR102353254B1 (ko) * 2014-08-07 2022-01-18 오르보테크 엘티디. 리프트 인쇄 시스템
WO2016063270A1 (en) 2014-10-19 2016-04-28 Orbotech Ltd. Llift printing of conductive traces onto a semiconductor substrate
US10451953B2 (en) 2014-11-12 2019-10-22 Orbotech Ltd. Acousto-optic deflector with multiple output beams
KR102282860B1 (ko) 2015-01-19 2021-07-28 오르보테크 엘티디. 희생 지지부를 가진 3차원 금속 구조물의 프린팅
US10471538B2 (en) * 2015-07-09 2019-11-12 Orbotech Ltd. Control of lift ejection angle
KR102546450B1 (ko) 2015-11-22 2023-06-21 오르보테크 엘티디. 프린팅된 3-차원 구조들의 표면 특성들의 제어
PL3523083T3 (pl) * 2016-11-18 2024-02-05 Ipg Photonics Corporation System i sposób laserowej obróbki materiałów
TW201901887A (zh) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
US10330460B2 (en) 2017-06-13 2019-06-25 Raytheon Company Calibration method and system for a fast steering mirror
CN107199408A (zh) * 2017-07-25 2017-09-26 英诺激光科技股份有限公司 采用多束超快激光减小切割锥度提升切割速度的方法
CN107907876A (zh) * 2017-11-27 2018-04-13 合肥通彩自动化设备有限公司 一种激光定位系统及方法
EP3521483A1 (en) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lift deposition apparatus and method

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US20040206734A1 (en) * 2003-03-10 2004-10-21 Siemens Vdo Automotive Corporation Laser machining system for forming multiple machining spots by a single laser
JP2005074479A (ja) * 2003-09-01 2005-03-24 Sumitomo Heavy Ind Ltd レーザ加工装置、及びレーザ加工方法

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US4822974A (en) * 1988-02-18 1989-04-18 United Technologies Corporation Laser hold drilling system with lens and two wedge prisms including axial displacement of at least one prism
JP3691221B2 (ja) * 1997-09-24 2005-09-07 三菱電機株式会社 レーザ加工方法
DE19831340C1 (de) * 1998-07-13 2000-03-02 Siemens Ag Verfahren und Anordnung zum Kalibrieren einer Laserbearbeitungsmaschine zum Bearbeiten von Werkstücken
JP3553451B2 (ja) * 2000-02-18 2004-08-11 独立行政法人 科学技術振興機構 光干渉断層像観測装置
US6433043B1 (en) 2000-11-28 2002-08-13 Transitions Optical, Inc. Removable imbibition composition of photochromic compound and kinetic enhancing additive
CN1131122C (zh) * 2001-05-10 2003-12-17 中国科学技术大学 一种激光打孔装置及其二步打孔方法
US7642484B2 (en) 2001-06-13 2010-01-05 Orbotech Ltd Multiple beam micro-machining system and method
US7065121B2 (en) * 2001-07-24 2006-06-20 Gsi Group Ltd. Waveguide architecture, waveguide devices for laser processing and beam control, and laser processing applications
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
KR100759544B1 (ko) 2001-09-24 2007-09-18 삼성에스디아이 주식회사 이중 다이나믹 포커스 전자총
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US20040206734A1 (en) * 2003-03-10 2004-10-21 Siemens Vdo Automotive Corporation Laser machining system for forming multiple machining spots by a single laser
JP2005074479A (ja) * 2003-09-01 2005-03-24 Sumitomo Heavy Ind Ltd レーザ加工装置、及びレーザ加工方法

Also Published As

Publication number Publication date
US20100282726A1 (en) 2010-11-11
JP2011523373A (ja) 2011-08-11
US8390795B2 (en) 2013-03-05
CN101910787B (zh) 2013-03-13
WO2009087638A2 (en) 2009-07-16
WO2009087639A3 (en) 2010-03-11
JP5443390B2 (ja) 2014-03-19
US8395083B2 (en) 2013-03-12
JP2011510817A (ja) 2011-04-07
KR20100102654A (ko) 2010-09-24
WO2009087638A3 (en) 2010-03-11
JP5659020B2 (ja) 2015-01-28
KR20100113068A (ko) 2010-10-20
CN101910787A (zh) 2010-12-08
CN101909804A (zh) 2010-12-08
CN101909804B (zh) 2014-10-22
KR101528385B1 (ko) 2015-06-11
US20100328643A1 (en) 2010-12-30
WO2009087639A2 (en) 2009-07-16

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