KR101502858B1 - Apparatus and method for washing mask - Google Patents

Abstract

The present invention provides an apparatus for cleaning a mask. The mask cleaning apparatus includes a support plate for supporting the mask, a support plate driver for rotating the support plate, a chemical nozzle for spraying the chemical onto the mask placed on the support plate, a nozzle nozzle driver for driving the chemical nozzle, And a controller for controlling the controller. The controller may control the nozzle driver to position the chemical nozzle so as to spray the chemical directly onto the gluing area where the glues remain on the mask during the cleaning process.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mask cleaning apparatus,

The present invention relates to an apparatus and a method for cleaning a mask, and more particularly, to an apparatus and a method for cleaning a mask by supplying a chemical.

Generally, a mask is used to transfer a circuit pattern to a substrate in the course of an exposure process. The mask is provided in a generally rectangular shape. Generally, a pellicle is attached to protect the optical pattern on the mask. At this time, the pellicle is attached to the mask using a glue. In the future, when the pellicle is removed, glue remains in the edge area of the mask. After removing the pellicle, the above-mentioned glue remaining on the mask must be removed.

Conventionally, the mask is rotated, and a chemical for glue removal is sprayed on the center of the mask. In this case, a large amount of chemicals are used to remove the glue, which damages the pattern.

The present invention provides a mask cleaning apparatus and method capable of selectively cleaning only a glue region in a mask cleaning process.

SUMMARY OF THE INVENTION The present invention provides a mask cleaning apparatus and method for preventing chemicals from penetrating a pattern area in a process of removing glue from a mask.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and the problems not mentioned can be clearly understood by those skilled in the art from the description and the accompanying drawings will be.

The present invention provides a mask cleaning apparatus.

A mask cleaning apparatus according to an embodiment of the present invention includes a support plate for supporting a mask, a support plate driver for rotating the support plate, a chemical nozzle for spraying a chemical onto the mask placed on the support plate, And a controller for controlling the support plate driver and the nozzle driver. The controller may control the nozzle driver to position the chemical nozzle so as to spray the chemical directly onto the gluing area where the glues remain on the mask during the cleaning process.

The glue region includes a first region and a second region, wherein the first region and the second region may be perpendicular when viewed from above.

Wherein the chemical nozzle is provided with a longitudinal direction parallel to the mask, a discharge port of the chemical nozzle is disposed along a longitudinal direction of the chemical nozzle, and the chemical nozzle has a length of the first area and the second area It may be provided with a length corresponding to the long area.

The nozzle driver may further include a rotation driver for rotating the chemical nozzle, wherein the controller positions the chemical nozzle so as to face the first area and injects the chemical into the first area to remove the glue on the first area To rotate both the chemical nozzle and the mask so that the chemical nozzle is positioned to face the second region and then spray the chemical to the second region to remove the glue on the second region, The support plate driver can be controlled.

The support plate driver may rotate the support plate about the central axis of the support plate.

The mask cleaning apparatus may further include a purge gas nozzle for injecting a purge gas, and the chemical nozzle and the purge gas nozzle may be provided in one body.

The purge gas nozzle has a length corresponding to the chemical nozzle and is disposed in parallel with the chemical nozzle, and the purge gas nozzle can be provided closer to the center of the support plate than the chemical nozzle.

The chemical nozzle may be inclined so that the chemical nozzle moves away from the center of the support plate as the discharge port goes downward.

According to an embodiment of the present invention, the nozzle driver further includes a rotation driver for rotating the chemical nozzle, the chemical nozzle is provided in a vertical direction, and the controller controls the chemical nozzle to move the chemical nozzle in the first region And controls the support plate driver and the rotation driver to remove the glue on the first area by spraying the chemical while simultaneously rotating the support plate and the chemical nozzle so that the chemical nozzle moves along the first area .

The controller is configured to spray the chemical while simultaneously rotating the support plate and the chemical nozzle such that the chemical nozzle moves along the second area after the gluing is completed in the first area to remove the glue on the second area The support plate driver and the rotation driver may be controlled.

According to another embodiment, the nozzle driver includes a first driver for linearly moving the chemical nozzle in a first direction parallel to the support plate, the chemical nozzle is provided in the vertical direction, and the controller , The chemical nozzle is positioned on the first region, the support plate is fixed, the chemical nozzle is linearly moved along the first region in the first direction, and the chemical is sprayed to remove the glue on the first region The first driver and the support plate driver may be controlled.

The apparatus of claim 1, wherein the nozzle driver further comprises a rotation driver for rotating the chemical nozzle, wherein the controller rotates both the support plate driver and the chemical nozzle after the glue removal is completed in the first area, The first driver and the second driver to move the chemical nozzle while removing the glue on the second area while the chemical nozzle is linearly moved along the first area along the second area, , And the support plate driver can be controlled. When the support plate is rotated to clean the second area after the first area cleaning, the rotation angle may be 90 °.

According to another embodiment of the present invention, the nozzle driver includes a first driver for linearly moving the chemical nozzle in a first direction parallel to the support plate, the chemical nozzle is provided in a vertical direction, Is configured to rotate the support plate so that the chemical nozzle is positioned on the first area and the chemical nozzle moves along the first area while the chemical nozzle is linearly moved along the first direction, To control the first driver and the support plate driver to remove the glue on the first area.

 Wherein the controller rotates both the support plate driver and the chemical nozzle after the glue removal is completed in the first region to position the chemical nozzle on the second region and thereafter the chemical nozzle moves along the second region The first driver and the support plate driver can be controlled so as to rotate the support plate and simultaneously spray the chemical while the chemical nozzle linearly moves along the first direction to remove the glue on the second area. When the support plate is rotated to clean the second area after the first area cleaning, the rotation angle may be 90 °.

According to another embodiment of the present invention, the nozzle driver further includes a second driver for linearly moving the chemical nozzle in a second direction perpendicular to the first direction parallel to the support plate when the chemical nozzle is viewed from above, After the gluing is completed in the first region, the chemical nozzle is positioned on the second region, the support plate is fixed, and the chemical nozzle is linearly moved in the second direction along the second region to spray the chemical, The first driver, the second driver, and the support plate driver to remove the glue on the second area.

The present invention also provides a mask cleaning method.

The mask cleaning method according to an embodiment of the present invention is a mask cleaning method for removing glue remaining in a gluing area including a first area and a second area perpendicular to the first area on a mask, To face each other; And the chemical nozzle injects the chemical directly to the gluing area to remove the glue.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a first alignment step of positioning the chemical nozzle whose longitudinal direction is provided parallel to the mask so as to face the first area; And a first cleaning step of removing the glue.

A second alignment step of rotating both the chemical nozzle and the support plate after the first cleaning step to position the chemical nozzle so as to face the second area when the chemical nozzle is viewed from above, And a second cleaning step of removing the glue on the second area.

According to another embodiment, there is a first alignment step of positioning the chemical nozzle provided with its longitudinal direction in the vertical direction on the first area, and the mask is fixed and the chemical nozzle is moved in a first direction parallel to the support plate And a first cleaning step of removing the glue of the first area by linearly moving along the first area and spraying the chemical.

A second aligning step of rotating both the mask and the chemical nozzle after the first rinsing step to position the chemical nozzle on the second area; and a second aligning step of fixing the mask and rotating the chemical nozzle in the first direction And a second cleaning step of linearly moving along the second area and spraying the chemical to remove the glue of the second area. When the support plate is rotated to clean the second area after the first area cleaning, the rotation angle may be 90 °.

According to another embodiment of the present invention, after the first cleaning step, the mask is fixed and linearly moves along the second region in a second direction perpendicular to the first direction when the chemical nozzle is viewed from above, And a second cleaning step of spraying a chemical to remove the glue of the second area.

According to another embodiment of the present invention, there is provided a method of manufacturing a chemical nozzle, comprising: a first aligning step of positioning the chemical nozzle provided in a longitudinal direction of the chemical nozzle on the first area; and a second aligning step of simultaneously rotating the support plate and the chemical nozzle, And a first cleaning step of removing the glue on the first area by spraying the chemical along the first area.

And a second cleaning step of spraying the chemical along the first area to remove the glue on the first area while rotating the support plate and the chemical nozzle simultaneously after the first cleaning step, Cleaning method.

According to another embodiment of the present invention, there is provided a cleaning method comprising: a first aligning step of positioning the chemical nozzle provided in a longitudinal direction of the chemical nozzle on the first area; and a second alignment step of rotating the support plate while simultaneously moving the chemical nozzle And a first cleaning step of linearly moving along the first area in one direction and removing the glue of the first area.

A second alignment step of positioning the chemical nozzle on the second area after the first cleaning step and a second alignment step of rotating the support plate while simultaneously moving the chemical nozzle in the first direction parallel to the support plate And a second cleaning step of removing the glue of the second area by linearly moving the second cleaning step. When the support plate is rotated to clean the second area after the first area cleaning, the rotation angle may be 90 °.

According to an embodiment of the present invention, only the gluing area can be selectively cleaned during the cleaning process.

In addition, according to one embodiment of the present invention, it is possible to prevent the chemical from penetrating into the pattern area during cleaning of the glue on the mask and damaging the optical pattern.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a plan view schematically showing a mask.
2 is a front view schematically showing a mask cleaning apparatus according to an embodiment of the present invention.
3 is a top view showing an index module, a lower buffer, and a lower processing module.
4 is a top view showing the transfer frame, top buffer, and top handling module.
5 is a plan view of the mask cleaning apparatus shown in Fig.
Fig. 6 is a side view of the mask cleaning apparatus of Fig. 5;
FIG. 7 is a perspective view showing an example of the glue cleaning unit of FIG. 5; FIG.
FIG. 8 is a view showing a state in which chemical and purge gas are injected in the glue cleaning unit of FIG. 7; FIG.
9 is a view showing a glue cleaning unit according to another embodiment.
10 is a view showing a glue cleaning unit according to another embodiment.
FIG. 11 is a flow chart showing the mask cleaning process according to FIGS. 12 to 15. FIG.
FIGS. 12 to 15 are views sequentially showing the process of removing glue with the mask cleaner of FIG.
16 is a view showing a mask cleaning apparatus according to another embodiment.
17 is a side view of the mask cleaning apparatus according to Fig.
FIG. 18 is a view showing a glue cleaning unit according to FIG. 16; FIG.
19 is a flowchart showing the mask cleaning process according to Figs. 20 to 23. Fig.
FIGS. 20 to 23 are views sequentially showing a process of removing glue using the mask cleaning apparatus of FIG. 16. FIG.
24 is a view showing a mask cleaning apparatus according to another embodiment.
FIG. 25 is a flowchart showing the mask cleaning process according to FIGS. 26 to 29; FIG.
FIGS. 26 to 29 sequentially show a process of removing glue using the mask cleaner of FIG. 24. FIG.
FIG. 30 is a flowchart showing the mask cleaning process according to FIGS. 31 to 33; FIG.
31 to 33 are views for explaining still another embodiment of removing glue using the mask cleaning apparatus of FIG.
34 is a view showing a mask cleaning apparatus according to still another embodiment.
FIG. 35 is a view showing the nozzle driver shown in FIG. 34; FIG.
FIG. 36 is a flowchart showing the mask cleaning process according to FIGS. 37 to 40; FIG.
37 to 40 are views sequentially showing the process of removing glue using the mask cleaner of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified into various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The mask cleaning apparatus of the present invention removes glue from the mask so that the optical pattern is not damaged.

FIG. 1 is a plan view showing an example of a mask 500. FIG. Referring to FIG. 1, a pattern region 520 is present at the center of a mask 500. The glue 540 is present at the edge of the mask 500 so as to surround the pattern surface 520. Hereinafter, the region in which the glue 540 is present is referred to as a glue region. The glue region includes a first region 542, a second region 544, a third region 546, and a fourth region 548. The first region 542 and the third region 546 are spaced apart from each other in parallel. The second region 544 and the fourth region 548 are spaced apart from each other in parallel. The first region 542 and the third region 546 are disposed facing each other and provided with the same length. The second region 544 and the fourth region 548 are disposed facing each other and provided with the same length. The first region 542 and the second region 544 are vertical when viewed from above. The first region 542, the second region 544, the third region 546, and the fourth region 548 are sequentially provided along the counterclockwise direction. The first region 542 may be provided longer than the second region 544.

2 is a front view schematically showing a mask cleaning apparatus 1 according to one embodiment. 3 is a top view showing the index module 10, the lower buffer 60, and the sub-processing module 30. FIG. 4 is a plan view showing the transfer frame 140, the upper buffer 70, and the upper processing module 40. FIG.

2 to 4, the mask cleaning apparatus 1 has an index module 10 and a processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the processing module 20 are arranged will be referred to as the X direction 12. And a direction perpendicular to the plane including the X direction 12 and the Y direction 14 is referred to as the Z direction 16, while the Y direction 14 is referred to as a direction perpendicular to the X direction 12 as viewed from above .

The carrier 18 in which the mask 500 is housed is seated in the load port 120. A plurality of load ports 120 are provided and they are arranged in a line along the Y direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20 and the like. A slot (not shown) is formed in the carrier 18 so as to support the edge of the mask 500. A plurality of slots are provided in the Z direction 16, and the masks 500 are positioned in the carrier so as to be stacked apart from each other along the Z direction 16.

The processing module 20 has an upper processing module 40 and a lower processing module 30. The upper processing module 40 and the lower processing module 30 have a transfer housing 240, a buffer unit 220, and a process housing 260, respectively. The transporting housing 240 is arranged such that its longitudinal direction is parallel to the X-direction 12. Process housings 260 are disposed on one side and the other side of the transfer housing 240 along the Y direction 14, respectively. At one side and the other side of the transfer housing 240, the process housings 260 are provided to be symmetrical with respect to each other with respect to the transfer housing 240. A plurality of process housings 260 are provided on one side of the transfer housing 240. Some of the process housings 260 are disposed along the lengthwise direction of the transfer housing 240. In addition, some of the process housings 260 are stacked together. That is, at one side of the transfer housing 240, the process housings 260 may be arranged in an array of A X B. Where A is the number of process housings 260 provided in a row along the X direction 12 and B is the number of process housings 260 provided in a row along the Y direction 14. [ When four or six process housings 260 are provided on one side of the transfer housing 240, the process housings 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process housings 260 can be increased or decreased. Unlike the above, the process housing 260 may be provided only on one side of the transfer housing 240. Also, unlike the above, the process housing 260 may be provided as a single layer on one side and on both sides of the transfer housing 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer housing 240. The buffer unit 220 provides a space in which the mask 500 remains before the mask is transported between the process housing 260 and the carrier 18. The buffer unit 220 has an upper buffer 70 and a lower buffer 60. The upper buffer 70 is located at the top of the lower buffer 60. The upper buffer 70 is disposed at a height corresponding to the upper processing module 40. The lower buffer 60 is disposed at a height corresponding to the lower processing module 30. Each of the upper buffer 70 and the lower buffer 60 is provided with a slot in which the mask 500 is placed and a plurality of slots are provided so as to be spaced apart along the Z direction 16 with respect to each other. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer housing 240.

The transfer frame 140 carries the mask 500 between the buffer unit 220 and the carrier 18 seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the Y direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved in the Y direction 14 along the index rail 142. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the Z direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b, which is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. And the index arms 144c are stacked so as to be spaced apart from each other along the Z direction 16. Some of the index arms 144c are used when carrying the mask 500 from the processing module 20 to the carrier 18 and the other part of which is transferred from the carrier 18 to the processing module 20 via the mask 500 ). ≪ / RTI > This can prevent the particles generated from the mask 500 before the process processing from adhering to the mask 500 after the process processing in the process of loading and unloading the mask 500 by the index robot 144.

The transfer housing 240 carries the mask 500 between the buffer unit 220 and the process housing 260 and between the process housings 260. The transferring housing 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged such that the longitudinal direction thereof is parallel to the X direction 12. The main robot 244 is mounted on the guide rail 242 and is linearly moved along the X direction 12 on the guide rail 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the Z direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are arranged so as to be spaced apart from each other along the Z direction 16.

In the process housing 260, a mask cleaning apparatus for performing a cleaning process on the mask 500 is provided. The mask cleaning apparatus may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the mask cleaner in each process housing 260 may have the same structure. According to one example, the sub-processing module 40 may include a chamber for performing a wet cleaning process and a chamber for performing a cooling process. The top handling module 30 may include a chamber that performs a dry and functional water cleaning process and a chamber that performs a heating process.

Hereinafter, the mask cleaning apparatus may be a chamber for performing the wet cleaning process described above. An example of a mask cleaning apparatus for removing glue from the mask 500 by using a chemical will be described.

5 is a plan view showing the mask cleaning apparatus 1000 shown in FIG. 6 is a side view showing the mask cleaning apparatus 1000 of FIG.

The mask cleaner 1000 removes glue from the gluing area GA located at the edge of the pattern area PA of the mask 500. [

5, a mask cleaning apparatus 1000 includes a housing 1100, a container 1200, a support member 1300, a cleaning unit 1400, a pattern cleaning unit 1500, and a controller 1600 do.

The housing 1100 provides a closed interior space. A fan filter unit (not shown) is installed on the upper wall of the housing 1100. The fan filter unit generates a downward vertical airflow in the interior space of the housing 1100.

The container 1200 is disposed within the housing 1100. The container 1200 prevents the chemicals used in the process and the fumes generated during the process from splashing or spilling out. The container 1200 has a space in which an upper portion thereof is opened and a mask 500 is processed.

The support member 1300 is placed in the container 1200. The support member 1300 supports the mask 500 during processing. The support member 1300 includes a support plate 1320, a chucking pin 1340, a support shaft 1360, and a support plate driver 1380.

 The support plate 1320 is generally provided in a circular shape. The support plate 1320 has a diameter larger than that of the mask 500. The support plate 1320 supports the mask 500. While the chemical is being supplied, the mask 500 is supported on the support plate 1320 so as to face upward. On the upper surface of the support plate 1320, chucking pins 1340 are provided. The chucking pins 1340 protrude upward from the upper surface of the support plate 1320. The chucking pins 1340 prevent the mask 500 from being laterally displaced from the support plate 1320 by the centrifugal force when the support plate 1320 is rotated. Two chucking pins 1340 are provided at each corner of the mask 500 when the mask 500 is in position on the support plate 1320. [ Therefore, eight chucking pins 1340 are provided in total. The chucking pins 1340 support the four corners of the mask 500 to prevent the mask 500 from being displaced from the correct position. A support shaft 1360 is connected to the lower center of the support plate 1320. The support shaft 1360 supports the support plate 1320. The support shaft 1360 is provided so as to correspond to the center axis of the support plate 1320. A support plate driver 1380 is connected to the lower end of the support shaft 1360. The support plate driver 1380 rotates the support plate 1320. The support shaft 1360 transfers the rotational force of the support plate driver 1380 to the support plate 1320. The support plate driver 1380 is controlled by the controller 1600. The support plate driver 1380 may include a motor.

The elevating unit (not shown) moves the container 1200 up and down so that the relative height of the supporting plate 1320 with respect to the container 1200 is adjusted. The elevating unit lowers the container 1200 so that the support plate 1320 protrudes to the upper portion of the container 1200 when the mask 500 is loaded on the support plate 1320 or unloaded from the support plate 1320.

The glue cleaning unit 1400 is disposed on one side of the container 1200. The glue cleaning unit 1400 supplies the chemical to the upper surface of the mask 500 to remove the glue from the mask 500. The glue cleaning unit 1400 includes a nozzle assembly 1410, a nozzle arm 1420, an arm support shaft 1360, a nozzle driver 1440, a chemical supply 1450, and a purge gas supply 1460.

FIG. 7 is a perspective view of the nozzle assembly 1410, and FIG. 8 is a side view showing the spraying state of the chemical nozzle 1414 and the purge gas nozzle 1417 in the nozzle assembly 1410 of FIG.

Referring to FIG. 7, the nozzle assembly 1410 includes a body 1412, a chemical nozzle 1414, and a purge gas nozzle 1417. A chemical nozzle 1414 and a purge gas nozzle 1417 are provided inside the body 1412. The chemical nozzle 1414 ejects the chemical for glue removal into the glue area. The purge gas nozzle 1417 ejects the purge gas adjacent to the pattern area rather than the chemical nozzle 1414 so that the chemical is not injected into the pattern area. For example, the chemical nozzle 1414 can spray a mixed liquid of sulfuric acid and peroxide (SPM), and the purge gas nozzle 1417 can blow air or an inert gas (N ₂ ).

The body 1412 may be provided in a direction parallel to the support plate 1320 in its longitudinal direction. A first flow path 1415, a second flow path 1418, a first discharge port 1416, and a second discharge port 1419 are formed in the body 1412.

The first flow path 1415 and the first discharge port 1416 function as chemical nozzles 1414. The first flow path 1415 is formed along the longitudinal direction of the body 1412. The first flow path 1415 is connected to the chemical supply line 1454. The first discharge port 1416 is connected to the first flow path 1415 and extends from the first flow path 1415 to the lower end of the body 1412. The first discharge port 1416 may be provided in a plurality of holes. The plurality of holes may be spaced from each other and arranged along the longitudinal direction of the first flow path 1415. Alternatively, one or more first discharge ports 1416 may be provided in a slit shape. The chemical nozzle 1414 may be provided in a length corresponding to the first area 542.

The second flow path 1418 and the second discharge port 1419 function as a purge gas nozzle 1417. [ The second flow path 1418 is provided in parallel with the first flow path 1415 of the body 1412. The second flow path 1418 is connected to the purge gas supply line 1464. The second flow path 1418 is disposed closer to the center of the mask than the first flow path 1415. The second discharge port 1419 is connected to the second flow path 1418 and extends from the second flow path 1418 to the lower end of the body 1412. The second discharge port 1419 may be provided in a plurality of holes. The plurality of holes may be spaced from each other and arranged along the longitudinal direction of the second flow path 1418. Alternatively, one or a plurality of second discharge ports 1419 may be provided in a slit shape. The second discharge port 1419 may be located at a higher height than the first discharge port 1416. The purge gas nozzle 1417 may be provided with a length corresponding to the chemical nozzle 1414. [

The first flow path 1415 and the second flow path 1418 may be provided in an inclined direction away from the center of the support plate 1320 downward.

Although the chemical nozzle 1414 and the purge gas nozzle 1417 are shown as being provided in one body 1412 in the present embodiment, they may be provided in different bodies.

Although the first discharge port 1416 and the second discharge port 1419 are described as being provided obliquely with respect to the support plate in the present embodiment, the first discharge port 7416 and the second discharge port 7419, The longitudinal direction can be provided in the up and down direction. Also, as shown in FIG. 10, it can be provided only as a chemical nozzle 8414 including a first flow path 8415 and a first discharge port 8416 without a purge gas nozzle.

Referring again to FIG. 5, the nozzle arm 1420 is provided in a rod shape and supports the nozzle assembly 1410. The nozzle arm 1420 is disposed in parallel with the support plate 1320 in the longitudinal direction. The nozzle assembly 1410 is coupled to one end of the nozzle arm 1420 and the other end of the nozzle arm 1420 is coupled to the arm support shaft 1430. The arm support shaft 1430 supports the nozzle arm 1420. The nozzle arm 1420 is provided in the vertical direction in its longitudinal direction. The nozzle arm 1420 can be pivotally moved about the arm support shaft 1430 by the nozzle driver 1440. A nozzle driver 1440 is provided at the lower end of the arm support shaft 1430.

The nozzle driver 1440 moves the nozzle assembly 1410 between the standby position and the process position. The standby position is the side position of the housing 1100. The process position is the vertical upper position of the support plate 1320. The process position includes a first process position and a second process position, which will be described later. The first processing position is a position at which the first discharge port 1416 of the chemical nozzle 1414 faces the first area 542 of the mask 500. The second processing position is the position where the first discharge port 1416 of the chemical nozzle 1414 faces the second region 544 of the mask. The nozzle driver 1440 further includes a rotation driver 1442. The rotation driver 1442 rotates the chemical nozzle 1414 around the arm support shaft 1430 as a center axis.

In one example, the nozzle driver 1440 may be provided as an assembly having a motor, a belt, and a pulley.

The chemical supply 1450 includes a chemical supply 1452 and a chemical supply line 1454. A chemical supply line 1454 connects the chemical source 1452 and the chemical nozzle 1414. The chemical stored in the chemical source 1452 is supplied to the chemical nozzle 1414 via the chemical supply line 1454. On the chemical supply line 1454, a valve for opening and closing the chemical supply line 1454 is provided.

The purge gas supply 1460 includes a purge gas supply 1462 and a purge gas supply line 1464. The purge gas supply line 1464 connects the purge gas supply source 1462 and the purge gas nozzle 1417. The purge gas stored in the purge gas supply source 1462 is supplied to the purge gas nozzle 1417 through the purge gas supply line 1464. A valve for opening and closing the purge gas supply line 1464 is provided on the purge gas supply line 1464.

The pattern cleaning unit 1500 is provided on another side of the container 1200. The pattern cleaning unit 1500 supplies the cleaning liquid to the upper center of the mask 500 to clean the pattern. According to one embodiment, the cleaning liquid may include ammonium hydroxide, a mixture of hydrogen peroxide and ultrapure water, a mixture of ammonia and deionized water, and ultrapure water added with carbon dioxide. The cleaning liquid may be injected into the liquid phase or may be injected into the mist by gas pressure.

The controller 1600 controls the nozzle driver 1440 and the support plate driver 1380. The controller 1600 adjusts the rotation timing and the rotation angle of the nozzle assembly 1410 and the mask 500 so that the nozzle assembly 1410 is moved from the first region 542 to the fourth region 548, respectively.

11 to 15, a process of removing the glue 540 of the mask 500 using the mask cleaning apparatus 1000 of FIG. 5 will be described.

FIG. 11 is a flow chart showing the mask cleaning process according to FIGS. 12 to 15. FIG. FIGS. 12 to 15 sequentially illustrate the process of removing the glue with the mask cleaning apparatus 1000 of FIG.

The mask cleaning method includes a first alignment step (step S10), a first cleaning step (step S11), a second alignment step (step S12), a second cleaning step (step S13), and a third alignment step (step S14). A third cleaning step (step S15), a fourth alignment step (step S16), and a fourth cleaning step (step S17).

Referring to Fig. 12, first a first alignment step (step S10) is performed. The chemical nozzle 1414 is rotated by the nozzle driver 1440 so that the chemical nozzle 1414 is positioned facing the first region 542 of the mask 500. At this time, the support plate 1320 can also be rotated. Thereafter, the first cleaning step (step S11) is performed. The first cleaning step (step S11) removes the glue of the first area 542. [ 13, the positions of the support plate 1320 and the chemical nozzle 1414 are fixed, and the chemical nozzle 1414 directly injects the chemical into the first region 542 to remove the glue. After the first cleaning step (step S11) is completed, the second alignment step (step S12) is performed. The controller 1600 simultaneously rotates the chemical nozzle 1414 and the support plate 1320 as shown in FIG. 14 so that the chemical nozzle 1414 faces the second region 544. Thereafter, the second cleaning step (step S13) is performed. The second cleaning step (step S13) removes the glue in the second area 544. As shown in FIG. 15, the support plate 1320 and the chemical nozzle 1414 are fixed in position, and the chemical nozzle 1414 directly injects the chemical into the second region 544 to remove the glue. Thereafter, a third alignment step (step S14) is performed. The chemical nozzle 1414 and the support plate 1320 are simultaneously rotated by the nozzle driver 1440 so that the chemical nozzle 1414 is positioned facing the third region 546 of the mask 500. Thereafter, a third cleaning step (step S15) is performed. The third cleaning step (step S15) removes the glue in the third area 546. [ The respective positions of the support plate 1320 and the chemical nozzle 1414 are fixed and the chemical nozzle 1414 directly injects the chemical into the third region 546 to remove the glue. After the third cleaning step (step S15) is completed, the fourth alignment step (step S16) is performed. The controller 1600 simultaneously rotates the chemical nozzle 1414 and the support plate 1320 so that the chemical nozzle 1414 faces the fourth region 548. Thereafter, a fourth cleaning step (step S17) is performed. The fourth cleaning step (Step S17) removes the glue of the fourth region 548. [ The respective positions of the support plate 1320 and the chemical nozzle 1414 are fixed and the chemical nozzle 1414 directly injects the chemical into the fourth region 548 to remove the glue. From the first cleaning step (step S11) to the fourth cleaning step (step S17), the purge gas is also sprayed together to prevent the chemical from entering the pattern area. Alternatively, the order of the cleaning area may vary.

16 is a view showing another example of the mask cleaning apparatus 2000. Fig.

16, the mask cleaning apparatus 2000 includes a housing 2100, a container 2200, a support member 2300, a pattern cleaning unit 2500, a cleaning unit 2400, and a controller 2600 . The housing 2100, the container 2200, the support member 2300 and the pattern cleaning unit 2500 are connected to the housing 1100, the container 1200, the support member 1300, the pattern cleaning unit 1500, They may have substantially the same or similar structure. The glue cleaner unit 2400 includes a nozzle arm 2420, an arm support shaft 2430, a chemical supply 2450, a purge gas supply 2460, a nozzle driver 2440, and a nozzle assembly 2410. The nozzle arm 2420, the arm support shaft 2430, the chemical supply portion 2450 and the purge gas supply portion 2460 are connected to the nozzle arm 1420, the arm support shaft 1430, the chemical supply portion 1450, The gas supply part 1460, and the nozzle driver 1440, respectively.

Referring to Fig. 17, the nozzle assembly 2410 is provided with its longitudinal direction vertically. The nozzle assembly 2410 includes a body 2412, a chemical nozzle 2414, and a purge gas nozzle 2417. A chemical nozzle 2414 and a purge gas nozzle 2417 are provided inside the body 2412. 18, a first flow path 2415, a second flow path 2418, a first discharge port 2416, and a second discharge port 2419 are formed in the body. The body 2412 may be provided with its longitudinal direction in the up-and-down direction. The up and down direction may be perpendicular to the support plate 2320 and may be provided at an angle.

The first flow path 2415 and the first discharge port 2416 function as chemical nozzles 2414. The first flow path 2415 is formed along the longitudinal direction of the body 2412. The first flow path 2415 is connected to the chemical supply line 2454. The first discharge port 2416 is connected to the first flow path 2415 and extends from the first flow path 2415 to the lower end of the body 2412.

The second flow path 2418 and the second discharge port 2419 function as purge gas nozzles 2417. The second flow path 2418 is parallel to the first flow path 2415 of the body 2412, and the length thereof is correspondingly provided. The second flow path 2418 is connected to the purge gas supply line 2464. The second flow path 2418 is disposed closer to the center of the mask than the first flow path 2415. The second discharge port 2419 is connected to the second flow path 2418 and extends from the second flow path 2418 to the lower end of the body 2412.

The chemical nozzle 2414 and the purge gas nozzle 2417 may be provided so as to be inclined away from the center of the support plate 2320 as the discharge port goes downward. Alternatively, the body 2412 may be provided with only the chemical nozzle 2414 without the purge gas nozzle 2417.

19 is a flowchart showing the mask cleaning process according to FIGS. 20 to 23. FIG. Figs. 20 to 23 are views sequentially showing the process of removing glue using the mask cleaning apparatus 2000 of Fig. 16. Fig.

The mask cleaning method includes a first alignment step (step S20), a first cleaning step (step S21), a second alignment step (step S22), a second cleaning step (step S23), and a third alignment step (step S24). A third cleaning step (step S25), a fourth alignment step (step S26), and a fourth cleaning step (step S27).

Referring to Fig. 20, first a first alignment step (step S20) is performed. The chemical nozzle 2414 is rotated by the nozzle driver 2442 so that the chemical nozzle 2414 is positioned to face one end of the first area 542 of the mask 500. [ At this time, the support plate 2320 can also be rotated. Thereafter, a first cleaning step (step S21) is performed. The first cleaning step (step S21) removes the glue of the first area 542. [ The support plate 2320 and the chemical nozzle 2414 are simultaneously rotated as shown in FIG. 21, and the chemical is directly sprayed to the first region 542 to remove the glue to the other end of the first region 542. The support plate 2320 is rotated clockwise while the chemical nozzle 2414 is rotated clockwise. The first cleaning step (step S21) is completed, and the second alignment step (step S22) is completed as shown in Fig. Thereafter, the second cleaning step (step S23) is performed. Referring to Fig. 23, the second cleaning step (step S23) removes the glue in the second area 544. The support plate 2320 and the chemical nozzle 2414 are simultaneously rotated and the chemical is directly sprayed into the second region 544 to remove the glue to the other end of the second region 544. The support plate 2320 is rotated clockwise while the chemical nozzle 2414 is rotated counterclockwise. The second cleaning step (step S23) is completed, and the third alignment step (step S24) is completed. Thereafter, a third cleaning step (step S25) is performed. The third cleaning step (step S25) removes the glue of the third area 546. [ The support plate 2320 and the chemical nozzle 2414 are simultaneously rotated and the chemical is directly sprayed into the third region 546 to remove the glue to the other end of the third region 546. The support plate 2320 is rotated clockwise while the chemical nozzle 2414 is rotated clockwise. The third cleaning step (step S25) is completed, and the fourth alignment step (step S26) is completed. Thereafter, the fourth cleaning step (step S27) is performed. The fourth cleaning step (step S27) removes the glue in the fourth area 548. [ The support plate 2320 and the chemical nozzle 2414 are simultaneously rotated and the chemical is directly sprayed into the fourth region 548 to remove the glue to the other end of the fourth region 548. The support plate 2320 is rotated clockwise while the chemical nozzle 2414 is rotated counterclockwise. From the first cleaning step (step S21) to the fourth cleaning step (step S27), the purge gas is also sprayed to prevent the chemical from penetrating into the pattern area. Alternatively, the order of the cleaning area may vary.

24 is a view showing another example of the mask cleaning apparatus.

24, the mask cleaning apparatus 3000 includes a housing 3100, a container 3200, a support member 3300, a pattern cleaning unit 3500, a cleaning unit 3400, and a controller 3600 . The housing 3100, the container 3200, the support member 3300 and the pattern cleaning unit 3500 are respectively connected to the housing 2100, the container 2200, the support member 2300, the pattern cleaning unit 2500, They may have substantially the same or similar structure. The glue cleaning unit 3400 includes a nozzle assembly 3410, a nozzle arm 3420, an arm support shaft 3430, a chemical supply 3450, a purge gas supply 3460, and a nozzle driver 3440. The nozzle assembly 3410, the nozzle arm 3420, the arm support shaft 3430, the chemical supply portion 3450 and the purge gas supply portion 3460 are similar to the nozzle assembly 2410, the nozzle arm 2420, The shaft 2430, the chemical feeder 2450, and the purge gas feeder 2460, respectively.

However, the nozzle driver 3440 further includes a first driver 3444. The first driver 3444 linearly moves the chemical nozzle 3414 in a first direction parallel to the support plate 3320. The nozzle driver 3440 may further include a rotation driver 3442. The rotation driver 3442 may have substantially the same or similar structure as the rotation driver 2442 of FIG. The rotation driver 3442 can rotate the chemical nozzle 3414 about the arm support shaft 3430 as a center axis.

Hereinafter, FIG. 25 is a flowchart showing the mask cleaning process according to FIGS. 26 to 29. FIGS. 26 to 29 sequentially illustrate the process of removing glue using the mask cleaner 3000 of FIG.

The mask cleaning method includes a first alignment step (step S30), a first cleaning step (step S31), a second alignment step (step S32), a second cleaning step (step S33), and a third alignment step (step S34). A third cleaning step (step S35), a fourth alignment step (step S36), and a fourth cleaning step (step S37).

Referring to Fig. 26, first a first alignment step (step S30) is performed. The chemical nozzle 3414 is rotated by the nozzle driver 3440 so that the chemical nozzle 3414 is positioned to face one end of the first area 542 of the mask 500. At this time, the support plate 3320 can also be rotated. Thereafter, the first cleaning step (step S31) is performed. The first cleaning step (step S31) removes the glue of the first area 542. [ The support plate 3320 is fixed as shown in FIG. 27, and the chemical nozzle 3414 is linearly moved in the first direction by the first driver 3444. The chemical nozzle 3414 directly injects the chemical into the first region 542 to remove the glue from one end of the first region 542 to the other end. After the first cleaning step (step S31) is completed, the second alignment step (step S32) is performed. The controller 3600 rotates the chemical nozzle 3414 so that the chemical nozzle 3414 can be positioned facing one end of the second region 544 by rotating the support plate 3320 as shown in FIG. Thereafter, the second cleaning step (step S33) is performed. Referring to Fig. 29, the second cleaning step (step S33) removes the glue of the second area 544. The support plate 3320 is fixed, and the chemical nozzle 3414 is linearly moved by the first driver 3444 in the first direction. The chemical nozzle 3414 linearly moves and directs the chemical to the second region 544 to remove glue from one end of the second region 544 to the other end. Thereafter, a third alignment step (step S34) is performed. The controller 3600 rotates the support nozzle 3320 and rotates the chemical nozzle 3414 so that the chemical nozzle 3414 can be positioned facing one end of the third area 546. [ Thereafter, a third cleaning step (step S35) is performed. The third cleaning step (step S35) removes the glue in the third area 546. [ The support plate 3320 is fixed, and the chemical nozzle 3414 is linearly moved by the first driver 3444 in the first direction. The chemical nozzle 3414 directly injects the chemical into the third region 546 to remove glue from one end of the third region 546 to the other end. After the third cleaning step (step S35) is completed, the fourth alignment step (step S36) is performed. The controller 3600 rotates the support nozzle 3320 and rotates the chemical nozzle 3414 so that the chemical nozzle 3414 can be positioned facing one end of the fourth region 548. [ Thereafter, the fourth cleaning step (step S37) is performed. The fourth cleaning step (step S37) removes the glue in the fourth area 548. [ The support plate 3320 is fixed, and the chemical nozzle 3414 is linearly moved by the first driver 3444 in the first direction. The chemical nozzle 3414 linearly moves and directs the chemical to the fourth region 548 to remove glue from one end of the fourth region 548 to the other end. From the first cleaning step (step S31) to the fourth cleaning step (step S37), the purge gas is also sprayed to prevent the chemical from penetrating into the pattern area. Alternatively, the order of the cleaning area may vary. Further, when the support plate 3320 is rotated in each alignment step, its rotation angle may be 90 °.

Hereinafter, FIG. 30 is a flow chart showing the mask cleaning process according to FIGS. 31 to 33. 31 to 33 are views for explaining still another embodiment of removing glue using the mask cleaning apparatus of FIG.

The mask cleaning method includes a first alignment step (step S40), a first cleaning step (step S41), a second alignment step (step S42), a second cleaning step (step S43), and a third alignment step (step S44). A third cleaning step (step S45), a fourth alignment step (step S46), and a fourth cleaning step (step S47).

The first alignment step (step S40) is the same as in Fig. 26 of the above-described embodiment. Hereinafter, the same description will be omitted. After the first alignment step (step S40), the first cleaning step (step S41) proceeds as shown in Fig. The chemical nozzle 4414 is linearly moved in the first direction by the first driver 4444 while the support plate 4320 is rotated. The chemical nozzle 4414 linearly moves and directs the chemical to the first region 542 to remove the glue to the other end of the first region 542. When the first cleaning step (step S41) is completed, the second alignment step (step S42) is completed at the same time as shown in FIG. Thereafter, the second cleaning step (step S43) is performed. Referring to Fig. 33, the second cleaning step (step S43) removes the glue of the second area. As the support plate 4320 is rotated, the chemical nozzle 4414 is linearly moved by the first driver 4444 in the first direction. The chemical nozzle 4414 linearly moves and directs the chemical to the second region 544 to remove the glue to the other end of the second region 544. The second cleaning step (step S43) is completed, and the third alignment step (step S44) is completed. The controller rotates the support nozzle 4320 and rotates the chemical nozzle 4414 so that the chemical nozzle 4414 can be positioned facing one end of the third area 546. Thereafter, the third cleaning step (step S45) is performed. The third cleaning step (step S45) removes the glue of the third area 546. [ The chemical nozzle 4414 is linearly moved in the first direction by the first driver 4444 while the support plate 4320 is rotated. The chemical nozzle 4414 linearly moves and directly injects the chemical into the first region to remove glue from one end of the third region 546 to the other end. The third cleaning step (step S45) is completed, and the fourth alignment step (step S46) is completed. The controller rotates the support nozzle 4320 and rotates the chemical nozzle 4414 so that the chemical nozzle 4414 can be positioned facing one end of the fourth area 548. [ Thereafter, the fourth cleaning step (step S47) is performed. The fourth cleaning step (Step S47) removes the glue of the fourth region 548. [ As the support plate 4320 is rotated, the chemical nozzle 4414 is linearly moved by the first driver 4444 in the first direction. The chemical nozzle 4414 linearly moves and directs the chemical to the fourth region 548 to remove glue from one end of the fourth region 548 to the other end. From the first cleaning step (step S41) to the fourth cleaning step (step S47), the purge gas is also sprayed to prevent the chemical from penetrating into the pattern area. Alternatively, the order of the cleaning area may vary. Further, when the support plate 4320 is rotated in each alignment step, its rotation angle may be 90 °.

34 is a view showing still another example of the mask cleaning apparatus.

34, the mask cleaning apparatus 5000 includes a housing 5100, a container 5200, a supporting member 5300, a cleaning unit 5400, a pattern cleaning unit 5500, and a controller 5600 do. The housing 5100, the container 5200, the supporting member 5300 and the pattern cleaning unit 5500 are respectively connected to the housing 2100, the container 2200, the supporting member 2300, the pattern cleaning unit 2500, They may have substantially the same or similar structure. The glue cleaning unit 5400 includes a nozzle assembly 5410, a nozzle arm 5420, an arm support shaft 5430, a chemical supply 5450, a purge gas supply 5460, and a nozzle driver 5440. The nozzle assembly 5410, the nozzle arm 5420, the arm support shaft 5430, the chemical supply 5450 and the purge gas supply 5460 are connected to the nozzle assembly 2410, the nozzle arm 2420, The shaft 2430, the chemical feeder 2450, and the purge gas feeder 2460, respectively.

Referring to FIG. 35, the nozzle driver 5440 further includes a first driver 5444 and a second driver 5446. The first driver 5444 linearly moves the chemical nozzle 5414 in the first direction parallel to the support plate 5320. The second driver 5446 linearly moves the chemical nozzle 5414 in a second direction perpendicular to the first direction when viewed from above. The nozzle driver 5440 may further include a rotation driver 5442. The rotation driver 5442 may have substantially the same or similar structure as the rotation driver 2442 of FIG. The rotation driver 5442 rotates the chemical nozzle 5414 about the arm support shaft 5430 as a center axis.

Hereinafter, FIG. 36 is a flow chart showing the mask cleaning process according to FIG. 37 to FIG. 37 to 40 are views sequentially showing a process of removing glue using the mask cleaner 5000 of FIG.

The mask cleaning method includes a first alignment step (step S50), a first cleaning step (step S51), a second alignment step (step S52), a second cleaning step (step S53), and a third alignment step (step S54). A third cleaning step (step S55), a fourth alignment step (step S56), and a fourth cleaning step (step S57).

Referring to FIG. 37, first a first alignment step (step S50) is performed. The chemical nozzle 5414 is rotated by the nozzle driver 5440 so that the chemical nozzle 5414 is positioned to face one end of the first area 542 of the mask 500. At this time, the support plate 5320 can also be rotated. Thereafter, the first cleaning step (step S51) is performed. The first cleaning step (step S51) removes the glue of the first area 542. [ The support plate 5320 is fixed as shown in FIG. 38, and the chemical nozzle 5414 is linearly moved in the first direction by the first driver 5444. The chemical nozzle 5414 linearly moves and directs the chemical to the first region 542 to remove glue from one end of the first region 542 to the other end. The first cleaning step (step S51) is completed, and the second alignment step (step S52), in which the chemical nozzle 5414 is positioned facing one end of the second area 544 as shown in FIG. 39, is completed. Thereafter, the second cleaning step (step S53) is performed. Referring to FIG. 40, the second cleaning step (step S53) removes the glue in the second area 544. The support plate 5320 is fixed and the chemical nozzle 5414 is linearly moved in the second direction by the second driver 5446. [ The chemical nozzle 5414 linearly moves and directs the chemical to the second region 544 to remove glue from one end of the second region 544 to the other end. The second cleaning step (step S53) is completed, and the third alignment step (step S54) is completed. Thereafter, a third cleaning step (step S55) is performed. The third cleaning step (step S55) removes the glue in the third area 546. [ The support plate 5320 is fixed, and the chemical nozzle 5414 is linearly moved in the first direction by the first driver 5444. The chemical nozzle 5414 linearly moves and directs the chemical to the third region 546 to remove glue from one end of the third region 546 to the other end. The third cleaning step (step S55) is completed, and the fourth alignment step (step S56) is completed. Thereafter, the fourth cleaning step (step S57) is performed. The fourth cleaning step (step S57) removes the glue in the fourth area 548. [ The support plate 5320 is fixed and the chemical nozzle 5414 is linearly moved in the second direction by the second driver 5446. [ The chemical nozzle 5414 linearly moves and directs the chemical to the fourth region 548 to remove glue from one end of the fourth region 548 to the other end. From the first cleaning step (step S51) to the fourth cleaning step (step S57), the purge gas is also sprayed together to prevent the chemical from entering the pattern area. Alternatively, the order of the cleaning area may vary.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

1000: Mask cleaning device 1200: container
1300: Support member 1320: Support plate
1410: nozzle assembly 1414: chemical nozzle
1440: Nozzle driver 1450: Chemical supplier
1460: purge gas supply unit 1600: controller

Claims (27)

A support plate for supporting the mask;
A support plate driver for rotating the support plate;
A chemical nozzle for spraying the chemical onto the mask placed on the support plate;
A nozzle driver for driving the chemical nozzle; And
A controller for controlling the support plate driver and the nozzle driver;
Wherein the controller controls the nozzle driver to position the chemical nozzle so as to spray the chemical directly onto the gluing area where the glu remains on the mask when the cleaning process is performed,
Wherein the glue region comprises a first region and a second region,
Wherein the first region and the second region are vertical when viewed from above,
Wherein the chemical nozzle is provided so that its longitudinal direction is parallel to the mask,
The discharge port of the chemical nozzle is disposed along the longitudinal direction of the chemical nozzle,
Wherein the chemical nozzle is provided in a length corresponding to an area of the first area and the second area,
The nozzle driver further includes a rotation driver for rotating the chemical nozzle
The controller comprising:
The chemical nozzle is positioned to face the first region and the chemical is sprayed to the first region to remove the glue on the first region,
Rotating both the chemical nozzle and the mask so that the chemical nozzle is positioned to face the second region,
And then controls the rotation driver and the support plate driver to jet the chemical to the second region to remove the glue on the second region.
delete delete delete The method according to claim 1,
Wherein the support plate driver rotates the support plate about a central axis of the support plate.
6. The method according to claim 1 or 5,
Wherein the mask cleaner further comprises a purge gas nozzle for injecting a purge gas,
Wherein the chemical nozzle and the purge gas nozzle are provided in one body.
The method according to claim 6,
The purge gas nozzle has a length corresponding to the chemical nozzle, and is disposed in parallel with the chemical nozzle
Wherein the purge gas nozzle is provided closer to the center of the support plate than the chemical nozzle.
The method according to claim 1,
Wherein the chemical nozzle is provided so as to be inclined so as to be farther from the center of the support plate as the discharge port goes downward.
A support plate for supporting the mask;
A support plate driver for rotating the support plate;
A chemical nozzle for spraying the chemical onto the mask placed on the support plate;
A nozzle driver for driving the chemical nozzle; And
A controller for controlling the support plate driver and the nozzle driver;
Wherein the controller controls the nozzle driver to position the chemical nozzle so as to spray the chemical directly onto the gluing area where the glu remains on the mask when the cleaning process is performed,
Wherein the glue region comprises a first region and a second region,
Wherein the first region and the second region are vertical when viewed from above,
Wherein the nozzle driver further comprises a rotation driver for rotating the chemical nozzle,
The chemical nozzles are provided in the vertical direction in the longitudinal direction
The controller comprising:
Placing the chemical nozzle on the first region
And controls the support plate driver and the rotation driver to remove the glue on the first area by injecting the chemical while simultaneously rotating the support plate and the chemical nozzle so that the chemical nozzle moves along the first area.
10. The method of claim 9,
The controller comprising:
After the glue removal is completed in the first region,
A mask cleaning device for controlling the support plate driver and the rotation driver to remove the glue on the second area by spraying the chemical while simultaneously rotating the support plate and the chemical nozzle so that the chemical nozzle moves along the second area;
A support plate for supporting the mask;
A support plate driver for rotating the support plate;
A chemical nozzle for spraying the chemical onto the mask placed on the support plate;
A nozzle driver for driving the chemical nozzle; And
A controller for controlling the support plate driver and the nozzle driver;
Wherein the controller controls the nozzle driver to position the chemical nozzle so as to spray the chemical directly onto the gluing area where the glu remains on the mask when the cleaning process is performed,
Wherein the glue region comprises a first region and a second region,
Wherein the first region and the second region are vertical when viewed from above,
Wherein the nozzle driver includes a first driver for linearly moving the chemical nozzle in a first direction parallel to the support plate,
Wherein the chemical nozzle is provided in a longitudinal direction thereof in a vertical direction,
The controller comprising:
Placing the chemical nozzle on the first region
A mask for controlling the first driver and the support plate driver so as to remove the glue on the first area by spraying the chemical while linearly moving the chemical nozzle along the first direction along the first area, Cleaning device.
12. The method of claim 11,
Wherein the nozzle driver further comprises a rotation driver for rotating the chemical nozzle,
The controller comprising:
After the gluing is completed in the first region, rotating both the support plate driver and the chemical nozzle to position the chemical nozzle on the second region,
The first actuator, and the support plate so as to remove the glue on the second area by spraying the chemical while linearly moving the chemical nozzle along the first direction along the second area, A mask cleaning apparatus for controlling a driver.
A support plate for supporting the mask;
A support plate driver for rotating the support plate;
A chemical nozzle for spraying the chemical onto the mask placed on the support plate;
A nozzle driver for driving the chemical nozzle; And
A controller for controlling the support plate driver and the nozzle driver;
Wherein the controller controls the nozzle driver to position the chemical nozzle so as to spray the chemical directly onto the gluing area where the glu remains on the mask when the cleaning process is performed,
Wherein the glue region comprises a first region and a second region,
Wherein the first region and the second region are vertical when viewed from above,
Wherein the nozzle driver includes a first driver for linearly moving the chemical nozzle in a first direction parallel to the support plate,
Wherein the chemical nozzle is provided in a longitudinal direction thereof in a vertical direction,
The controller comprising:
Placing the chemical nozzle on the first region,
To move the chemical nozzle along the first region while rotating the support plate and simultaneously spraying the chemical while the chemical nozzle is moving linearly along the first direction to remove the glue on the first region, And the mask plate cleaning device.
14. The method of claim 13,
The controller
After the gluing is completed in the first region, rotating both the support plate driver and the chemical nozzle to position the chemical nozzle on the second region,
Thereafter, the support plate is rotated so that the chemical nozzle moves along the second region, and at the same time, the chemical nozzle linearly moves along the first direction to spray the chemical to remove the glue on the second region, 1 driver and the support plate driver.
12. The method of claim 11,
The nozzle driver further includes a second driver that linearly moves the chemical nozzle in a second direction perpendicular to the first direction parallel to the support plate when the chemical nozzle is viewed from above
The controller comprising:
After the glue removal is completed in the first region,
Wherein the chemical nozzle is located on the second region at the same time that the glue removal is completed in the first region,
Fixing the support plate,
The first driver, the second driver, and the support plate driver to remove the glue on the second area by spraying the chemical while linearly moving the chemical nozzle along the second area in the second direction, .
15. The apparatus according to any one of claims 12 to 14, wherein the rotation angle is 90 DEG when the support plate is rotated for cleaning the second area after the first area cleaning.
A mask cleaning method for removing glue remaining in a gluing area including a first area and a second area perpendicular to the first area on a mask,
Placing a chemical nozzle on the gluing area facing the gluing area;
Wherein the chemical nozzle injects a chemical directly to the gluing area to remove glue,
A first alignment step of positioning the chemical nozzle whose length direction is provided in parallel with the mask so as to face the first area;
And a first cleaning step of spraying the chemical into the first area to remove glue on the first area,
After the first cleaning step,
A second aligning step of rotating both the chemical nozzle and the support plate supporting the mask so that the chemical nozzle faces the second area; And
And a second cleaning step of spraying a chemical in the second area to remove glue on the second area.
delete delete A mask cleaning method for removing glue remaining in a gluing area including a first area and a second area perpendicular to the first area on a mask,
Placing a chemical nozzle on the gluing area facing the gluing area;
Wherein the chemical nozzle injects a chemical directly to the gluing area to remove glue,
A first aligning step of positioning the chemical nozzle provided on the first region in a longitudinal direction thereof; And
A first cleaning step of fixing the mask and linearly moving the chemical nozzle along the first region in a first direction parallel to the support plate supporting the mask and spraying the chemical to remove the glue of the first region; .
21. The method of claim 20,
After the first cleaning step,
A second aligning step of rotating both the mask and the chemical nozzle to position the chemical nozzle so as to face the second area; And
And a second cleaning step of fixing the mask and linearly moving the chemical nozzle along the second area in the first direction and spraying the chemical to remove the glue of the second area.
21. The method of claim 20,
After the first cleaning step,
Wherein the mask is fixed and linearly moves along the second region in a second direction perpendicular to the first direction when the chemical nozzle is viewed from above, and a second region for removing the glue of the second region by spraying the chemical, And a cleaning step.
A mask cleaning method for removing glue remaining in a gluing area including a first area and a second area perpendicular to the first area on a mask,
Placing a chemical nozzle on the gluing area facing the gluing area;
Wherein the chemical nozzle injects a chemical directly to the gluing area to remove glue,
A first aligning step of positioning the chemical nozzle provided on the first region in a longitudinal direction thereof; And
And a first cleaning step of removing the glue on the first area by spraying the chemical along the first area while simultaneously rotating the chemical nozzle and the support plate supporting the mask.
24. The method of claim 23,
After the first cleaning step,
And a second cleaning step of spraying the chemical along the second area to remove the glue on the second area while simultaneously rotating the support plate and the chemical nozzle.
A mask cleaning method for removing glue remaining in a gluing area including a first area and a second area perpendicular to the first area on a mask,
Placing a chemical nozzle on the gluing area facing the gluing area;
Wherein the chemical nozzle injects a chemical directly to the gluing area to remove glue,
A first aligning step of positioning the chemical nozzle provided on the first region in a longitudinal direction thereof; And
And a first cleaning step of rotating the support plate while moving the chemical nozzle linearly along the first area in a first direction parallel to the support plate and removing the glue of the first area.
26. The method of claim 25,
After the first cleaning step,
A second aligning step of positioning the chemical nozzle on the second area; And
And a second cleaning step of rotating the support plate supporting the mask while linearly moving the chemical nozzle along the second area in the first direction and removing the glue of the second area.
27. The method of any one of claims 21 to 26, wherein the rotation angle is 90 DEG when the support plate is rotated to clean the second area after the first area cleaning.

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