KR101497779B1 - 마이크로렌즈 제조 장치 및 제조 방법 - Google Patents

마이크로렌즈 제조 장치 및 제조 방법 Download PDF

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Publication number
KR101497779B1
KR101497779B1 KR1020127020904A KR20127020904A KR101497779B1 KR 101497779 B1 KR101497779 B1 KR 101497779B1 KR 1020127020904 A KR1020127020904 A KR 1020127020904A KR 20127020904 A KR20127020904 A KR 20127020904A KR 101497779 B1 KR101497779 B1 KR 101497779B1
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South Korea
Prior art keywords
lens
carrier wafer
die
microlens
carrier
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Korean (ko)
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KR20120125287A (ko
Inventor
엔리히 탈너
마르쿠스 윔프링거
미카엘 카스트
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에베 그룹 게엠베하
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0012Arrays characterised by the manufacturing method
    • G02B3/0031Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00365Production of microlenses
    • B29D11/00375Production of microlenses by moulding lenses in holes through a substrate
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
KR1020127020904A 2010-03-31 2010-03-31 마이크로렌즈 제조 장치 및 제조 방법 Active KR101497779B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2010/002065 WO2011120538A1 (de) 2010-03-31 2010-03-31 Verfahren und vorrichtung zur herstellung einer mikrolinse

Publications (2)

Publication Number Publication Date
KR20120125287A KR20120125287A (ko) 2012-11-14
KR101497779B1 true KR101497779B1 (ko) 2015-03-04

Family

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Application Number Title Priority Date Filing Date
KR1020127020904A Active KR101497779B1 (ko) 2010-03-31 2010-03-31 마이크로렌즈 제조 장치 및 제조 방법

Country Status (8)

Country Link
US (3) US9052422B2 (https=)
EP (2) EP3460538B1 (https=)
JP (1) JP5611445B2 (https=)
KR (1) KR101497779B1 (https=)
CN (2) CN107272090A (https=)
SG (1) SG183819A1 (https=)
TW (2) TWI617430B (https=)
WO (1) WO2011120538A1 (https=)

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WO2011120538A1 (de) * 2010-03-31 2011-10-06 Ev Group Gmbh Verfahren und vorrichtung zur herstellung einer mikrolinse
TWI492839B (zh) * 2012-04-02 2015-07-21 Himax Tech Ltd 晶圓級光學元件的製造方法及結構
US20160327747A1 (en) * 2013-11-08 2016-11-10 Empire Technology Development Llc Printed ball lens and methods for their fabrication
GB2531744B (en) 2014-10-28 2017-11-22 Chiaro Tech Ltd Method and apparatus for monitoring the pelvic floor muscles
CN105818405B (zh) * 2016-04-20 2019-02-22 北京羽扇智信息科技有限公司 一种在可穿戴设备的外壳上形成透镜的方法
US10657674B2 (en) 2016-06-17 2020-05-19 Immersive Robotics Pty Ltd. Image compression method and apparatus
DE102016113471B4 (de) 2016-07-21 2022-10-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optischen bauelementen
JP6987518B2 (ja) 2017-01-26 2022-01-05 ソニーセミコンダクタソリューションズ株式会社 積層レンズ構造体およびその製造方法、並びに電子機器
JP6976688B2 (ja) 2017-01-26 2021-12-08 ソニーセミコンダクタソリューションズ株式会社 カメラモジュールおよびその製造方法、並びに電子機器
AU2018218182B2 (en) 2017-02-08 2022-12-15 Immersive Robotics Pty Ltd Antenna control for mobile device communication
US10416432B2 (en) 2017-09-04 2019-09-17 International Business Machines Corporation Microlens adapter for mobile devices
JP7249716B2 (ja) * 2017-05-25 2023-03-31 インターナショナル・ビジネス・マシーンズ・コーポレーション モバイル・デバイス用のマイクロレンズ・アダプタ
US12096031B2 (en) 2017-06-05 2024-09-17 Immersive Robotics Pty Ltd. Method and apparatus for digital content stream compression and decompression
CN111699693A (zh) 2017-11-21 2020-09-22 因默希弗机器人私人有限公司 用于数字现实的图像压缩
EP3714598A4 (en) 2017-11-21 2021-03-31 Immersive Robotics Pty Ltd SELECTING A FREQUENCY COMPONENT FOR IMAGE COMPRESSION
EP3792046A1 (de) 2019-09-12 2021-03-17 Technische Hochschule Wildau Verfahren zur herstellung asymmetrischer oder asphärischer linsen sowie leuchteinheit mit einer derart hergestellten linse
US12355984B2 (en) 2019-10-18 2025-07-08 Immersive Robotics Pty Ltd Content compression for network transmission

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US6805902B1 (en) * 2000-02-28 2004-10-19 Microfab Technologies, Inc. Precision micro-optical elements and the method of making precision micro-optical elements
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
JP2009153178A (ja) * 2002-09-17 2009-07-09 Anteryon Bv カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
WO2010033211A1 (en) * 2008-09-18 2010-03-25 Tessera North America, Inc. Recessed optical surfaces

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US4154506A (en) * 1976-08-12 1979-05-15 Izon Corporation Projection lens plate for microfiche
JPH04326031A (ja) 1991-04-25 1992-11-16 Mitsubishi Electric Corp 半導体圧力センサ
JPH04326301A (ja) * 1991-04-26 1992-11-16 Ricoh Co Ltd マイクロレンズアレイ及びその製造方法
JP3067114B2 (ja) * 1991-06-04 2000-07-17 ソニー株式会社 マイクロレンズ形成方法
EP0753765B1 (en) 1995-07-11 2002-12-18 Interuniversitair Micro-Elektronica Centrum Vzw Method for forming multiple-layer microlenses and use thereof
US5853960A (en) 1998-03-18 1998-12-29 Trw Inc. Method for producing a micro optical semiconductor lens
US6049430A (en) 1998-11-12 2000-04-11 Seagate Technology High numerical aperture objective lens manufacturable in wafer form
US6846137B1 (en) 2000-10-31 2005-01-25 Eastman Kodak Company Apparatus for forming a microlens mold
JP2002372473A (ja) * 2001-04-12 2002-12-26 Fuji Electric Co Ltd 半導体センサ収納容器およびその製造方法、並びに半導体センサ装置
US6814901B2 (en) * 2001-04-20 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing microlens array and microlens array
TW527859B (en) * 2002-04-18 2003-04-11 Hon Hai Prec Ind Co Ltd Method of fabricating a can for optical module
WO2008133864A2 (en) 2007-04-23 2008-11-06 Tessera North America, Inc. Mass production of micro-optical devices, corresponding tools, and resultant structures
EP2165225A4 (en) 2007-07-03 2012-05-09 Optomecha Co Ltd COMPOSED LENS UNIT AND CAMERA MODULE COMPOSED OF DIFFERENT MATERIALS AND METHOD OF MANUFACTURING THEREOF
NL1034496C2 (nl) * 2007-10-10 2009-04-16 Anteryon B V Werkwijze voor het vervaardigen van een samenstel van lenzen, alsmede een camera voorzien van een dergelijk samenstel.
TWI478808B (zh) * 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
US7920328B2 (en) * 2008-02-28 2011-04-05 Visera Technologies Company Limited Lens module and a method for fabricating the same
US7888758B2 (en) 2008-03-12 2011-02-15 Aptina Imaging Corporation Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure
JP2009279790A (ja) * 2008-05-20 2009-12-03 Sharp Corp レンズ及びその製造方法、並びに、レンズアレイ、カメラモジュール及びその製造方法、電子機器
JP2009300596A (ja) 2008-06-11 2009-12-24 Sharp Corp プラスチックレンズ、成形金型、およびプラスチックレンズの製造方法
WO2011120538A1 (de) * 2010-03-31 2011-10-06 Ev Group Gmbh Verfahren und vorrichtung zur herstellung einer mikrolinse

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805902B1 (en) * 2000-02-28 2004-10-19 Microfab Technologies, Inc. Precision micro-optical elements and the method of making precision micro-optical elements
JP2009153178A (ja) * 2002-09-17 2009-07-09 Anteryon Bv カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
WO2010033211A1 (en) * 2008-09-18 2010-03-25 Tessera North America, Inc. Recessed optical surfaces

Also Published As

Publication number Publication date
CN102812387A (zh) 2012-12-05
TWI617430B (zh) 2018-03-11
SG183819A1 (en) 2012-10-30
CN107272090A (zh) 2017-10-20
TW201136755A (en) 2011-11-01
EP3460538A1 (de) 2019-03-27
US20150231840A1 (en) 2015-08-20
EP2553503A1 (de) 2013-02-06
WO2011120538A1 (de) 2011-10-06
EP2553503B1 (de) 2018-12-19
US20130037975A1 (en) 2013-02-14
US9052422B2 (en) 2015-06-09
TW201639695A (zh) 2016-11-16
EP3460538B1 (de) 2021-03-03
KR20120125287A (ko) 2012-11-14
US10279551B2 (en) 2019-05-07
JP2013525828A (ja) 2013-06-20
US20180229458A1 (en) 2018-08-16
JP5611445B2 (ja) 2014-10-22
TWI554385B (zh) 2016-10-21

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