KR101465615B1 - Evaporation Deposition Apparatus - Google Patents

Abstract

A vapor deposition apparatus and an operation method thereof according to the present invention are provided. The evaporation apparatus includes a first cavity for containing the evaporation material, a second cavity for receiving the steam through the connection passage with the first cavity, and a second cavity formed at the second cavity, A reflective nozzle including an outlet for radially discharging and formed of a conductor, a reflective nozzle formed of a conductor and connected to the outlet and including a through-hole increasing in diameter, an induction coil surrounding the reflective nozzle and the evaporator, and an alternating- And an AC power source to which the voltage is applied. The induction coil evaporates the evaporation material by induction heating the evaporator and the reflection nozzle, and the steam is discharged through the reflection nozzle.

Description

[0001] Evaporation Deposition Apparatus [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an evaporation deposition apparatus, and more particularly, to an evaporation deposition apparatus using a reflection nozzle.

In the vacuum evaporation deposition, a target substance to be deposited is placed in a chamber of a high vacuum, the deposition target material is heated to evaporate the particles, and the vapor is moved to form a thin film on the substrate.

The evaporation deposition apparatus has a crucible made of a ceramic material and a heating section for heating the crucible. Typically, an evaporation deposition apparatus deposits a thin film on a substrate disposed on an upper surface of a vapor which evaporates upward under gravity against vapor.

However, as the substrate size increases, the bottom-up deposition apparatus has a problem that the substrate is bent. Therefore, a top-down deposition apparatus or a lateral-type deposition apparatus is required.

An organic light emitting diode (OLED) constituting an organic light emitting diode display device typically has a positive electrode formed on an upper portion of a transparent substrate, a hole injection layer (HIL) A hole transport layer (HTL), an emissive layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) are deposited on the electron transport layer. ) Is formed.

Particularly, when a thin film is deposited by a conventional stuttering method, a cathode and an organic light emitting layer may be damaged by plasma and ultraviolet rays. Accordingly, the deposition of the conductive material by the side-by-side or top-down evaporation method without plasma is required.

An object of the present invention is to provide an evaporation deposition apparatus using induction heating and reflection nozzles.

A vapor deposition apparatus according to an embodiment of the present invention includes a first cavity for accommodating an evaporation material, a second cavity for receiving steam through the connection passage with the first cavity, and a second cavity formed in the second cavity An evaporator formed of a conductor including an outlet for discharging the vapor radially through a point source; A reflective nozzle formed of a conductor and connected to the outlet and including a through-hole increasing in diameter; An induction coil surrounding the reflection nozzle and the evaporator; And an AC power source applying AC power to the induction coil, wherein the induction coil induces the evaporator and the reflection nozzle to evaporate the evaporation material, and the steam is discharged through the reflection nozzle.

In an embodiment of the present invention, the reflection nozzle and the evaporator may be welded together and integrated.

In one embodiment of the present invention, the through-hole of the reflection nozzle may have a conical shape, a polygonal conical shape, or a conical shape having a curvature.

In one embodiment of the present invention, the shape of the outlet of the second cavity may be the same as the shape of the through-hole of the reflection nozzle.

The dielectric container may further include a dielectric container disposed inside the induction coil and mounted on a chamber through hole formed in the vacuum chamber to surround the evaporator while maintaining a vacuum therein, And may be arranged to protrude to the outside of the vacuum chamber.

In one embodiment of the present invention, the apparatus may further include a support formed of a dielectric material that supports the evaporator or the reflection nozzle in the dielectric container and extends through a chamber through hole formed in the vacuum chamber.

In one embodiment of the present invention, the apparatus further comprises a gas distributor disposed between the evaporator and the dielectric container, wherein the gas distributor provides an inert gas between the dielectric container and the evaporator, And may be provided on the lower surface of the nozzle.

In an embodiment of the present invention, the inclination angle between the central axis of the through-hole and the inner surface may be between 35 degrees and 55 degrees.

In an embodiment of the present invention, the number of turns per unit length of the induction coil may be greater around the reflective nozzle than around the evaporator.

In one embodiment of the present invention, the outer diameter of the evaporator may be equal to or greater than the outer diameter of the reflective nozzle.

In an embodiment of the present invention, the evaporator is in the shape of a cylinder, and the first cavity is in the shape of a cylinder including a protruding portion with a central portion protruding, the connecting passage is formed through the protruding portion, The cavity may have a spherical or cylindrical shape, and the connecting passage may be disposed at the center of the second cavity. The evaporator may further include a baffle disposed around a connection portion between the second cavity and the connection passage, and the steam may be discharged in a top-down manner.

In an embodiment of the present invention, the evaporator is cylindrical, the first cavity is cylindrical, the second cavity is spherical or cylindrical, And the steam can be discharged side by side.

In one embodiment of the present invention, the evaporator is in the shape of a cylinder, and the first cavity is a cylindrical shape including a protrusion formed at the edge, the connecting passage is formed through the protrusion, The bead may have a spherical or cylindrical shape, and the steam may be discharged in a top-down manner.

In an embodiment of the present invention, the evaporator is cylindrical, the first cavity is cylindrical, the second cavity is spherical or cylindrical, and the connecting passage is formed at a center of the first cavity And the steam can be discharged in a bottom-up manner.

In one embodiment of the present invention, the apparatus may further include a pipe for supplying a carrier gas to the first cavity.

A vapor deposition apparatus according to an embodiment of the present invention includes a first cavity for accommodating an evaporation material, a second cavity for receiving steam through the connection passage with the first cavity, and a second cavity formed in the second cavity An evaporator formed of a dielectric material including an outlet for radially discharging the vapor by a point source; A heating block surrounding the evaporator and formed of a conductor; A reflective nozzle formed of a conductor and connected to the outlet and including a through-hole increasing in diameter; An induction coil surrounding the reflection nozzle and the evaporator; And an AC power source for applying AC power to the induction coil, wherein the induction coil induces the heating block and the reflection nozzle to evaporate the evaporation material, and the steam can be ejected through the reflection nozzle .

A vapor deposition apparatus according to an embodiment of the present invention includes a first cavity for accommodating an evaporation material, a second cavity for receiving steam through the connection passage with the first cavity, and a second cavity formed in the second cavity An evaporator including an outlet for discharging the vapor radially by a point source and formed of a conductor; A reflective nozzle formed of a conductor and connected to the outlet and including a through-hole increasing in diameter; An induction coil surrounding the reflection nozzle and the evaporator; And an AC power source applying AC power to the induction coil, the induction coil induction-heating the evaporator and the reflection nozzle to evaporate the evaporation material, and the steam can be discharged through the reflection nozzle . The method of operation of the evaporation apparatus includes providing the first cavity with a bead-shaped or powder-like evaporation material through the outlet of the evaporator and the connection passage; Mounting the evaporator on a vacuum vessel; Heating the evaporator and the reflective nozzle to melt the evaporation material, and performing evaporation deposition on the substrate through the nozzle.

The evaporation apparatus according to an embodiment of the present invention can generate steam by heating evaporation material stored in the evaporator through induction heating. The vapor is provided to a cavity inside the evaporator, and the vapor may have a characteristic of a point source through a plurality of reflection processes. The vapor ejected radially through the outlet formed in the cavity can uniformly deposit a good thin film on the substrate with a predetermined pattern by the reflective nozzle. Thus, lateral or top-down evaporation deposition on a large area OLED and solar cell substrate may be possible. In addition, damage to the substrate due to radiant heat can be suppressed. Also, it is possible to eliminate the aggregation phenomenon due to the uneven vapor distribution of the conventional top-down evaporation source. In addition, it is possible to prevent the phenomenon that the outlet between the second cavity and the reflection nozzle is clogged by the induction heating, and the phenomenon that the reflection nozzle is coated.

1 is a cross-sectional view illustrating an evaporation deposition apparatus according to an embodiment of the present invention.
2A to 2D are perspective views illustrating a reflection nozzle according to an embodiment of the present invention.
3A is a perspective view illustrating a reflection nozzle according to another embodiment of the present invention.
3B is a cross-sectional view taken along the line I-I 'in FIG. 3A.
4 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.
5 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.
FIG. 6 is a cross-sectional view illustrating the evaporator of FIG. 1;
7 is a cross-sectional view illustrating a vapor deposition apparatus according to another embodiment of the present invention.
8 is a cross-sectional view illustrating a vapor deposition apparatus according to another embodiment of the present invention.
9 is a cross-sectional view illustrating a vapor deposition apparatus according to another embodiment of the present invention.
10 is a partial perspective view illustrating a vapor deposition apparatus according to another embodiment of the present invention.
11A to 11C are plan views showing a substrate according to still another embodiment of the present invention.

A typical evaporation deposition apparatus has a crucible made of a ceramic material and a heating section for heating the crucible. The evaporation deposition apparatus deposits a thin film on a substrate disposed on the upper surface of the vapor evaporated upward due to gravity. The heating unit heats the crucible through heat conduction using radiant heat of the heated hot wire.

In an evaporation deposition method according to an embodiment of the present invention, the evaporation material in the first cavity of the conductive evaporator is heated by induction heating, the evaporation material forming the vapor is introduced into the second cavity, The thin film can be formed by induction heating the bead and providing the substrate with a radial vapor whose outlet is the point source.

When the evaporator is combined into a plurality of parts, the evaporation material can form high pressure steam. Accordingly, the high-pressure steam can flow out through the gap in the joining portion. Further, when the evaporator is cooled, the clearance may be blocked by the solidified evaporation material. Further, most of the steam may flow out through the gap without flowing out through the outlet, and the deposition efficiency may be lowered.

In order to overcome such a problem, the evaporator according to an embodiment of the present invention may be integrally formed. In the case of an integral evaporator, the evaporation material may be made in the form of a small bead and stored in the first cavity through the outlet of the evaporator.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are being provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the components have been exaggerated for clarity. Like numbers refer to like elements throughout the specification.

1 is a cross-sectional view illustrating an evaporation deposition apparatus according to an embodiment of the present invention.

1, the evaporation deposition apparatus 100 includes a first cavity 112 for accommodating a vapor material 111, a second cavity 111 for receiving steam through the first cavity 112 and the connection passage 116, An evaporator 110 formed in the second cavity 118 and including an outlet 119 for discharging the vapor radially by a point source and formed of a conductor, A reflection nozzle 120 formed on the induction coil 120 and including a through hole 120a connected to the outlet and increasing in diameter, an induction coil 140 surrounding the reflection nozzle 120 and the evaporator 110, The induction coil 140 induces the evaporator 110 and the reflection nozzle 120 to induce evaporation of the evaporation material 111 by induction heating the evaporation source 110 and the reflection nozzle 120, , And the steam is discharged through the reflection nozzle (120).

The evaporator 110 may be a generally cylindrical shape, and the evaporator 110 may be deformed into a polygonal columnar shape. The evaporator 110 may be formed as an integral type or a separate type. The material of the evaporator 110 may include metals such as stainless steel, molybdenum, tungsten, and titanium. In the evaporator 110, a first cavity 112, a second cavity 118 disposed below the first cavity 112, and a first cavity 112, which is disposed below the first cavity 112, And a connection channel 116 connecting the two cavities 118 may be formed. The evaporator 110 may be of a separable type processed into a plurality of parts, but may be an integral type in which a plurality of parts are welded to each other. The second cavity 118 may be vertically spaced along the central axis of the evaporator 110 and may be formed below the first cavity 112. The evaporator 110 may be induction-heated by an alternating current flowing in the induction coil 140. The evaporator 110 may be mounted on the upper surface of the vacuum chamber 160.

The evaporation material 111 may be aluminum, ITO, or an organic material. The evaporation material 111 may be stored in the first cavity 112 in the form of a granule or a powder when the evaporator 110 is integrated.

The first cavity 112 may have a cylindrical shape including a projection 114 having a protruding central portion. The protrusion 114 may have a predetermined height. The protrusion 114 may have a cylindrical shape. The protrusion 114 may be disposed on the lower surface of the first cavity 112. The evaporation material 111 may be accommodated in the first cavity 112. In addition, when the evaporation material 111 is melted, the molten liquid may not flow down into the connection passage 116 by the protrusion 114. The evaporation material 111 may be vaporized to generate steam.

The connection passage 116 may extend perpendicular to the central axis of the evaporator 110 through the protrusion 114. The connection passage 116 may extend through the protrusion 114 to connect the first and second cavities 112 and 118 to each other.

The second cavity 118 may be spherical or cylindrical. The connecting passage 116 is disposed at the upper center of the second cavity 118 and the evaporator 110 is disposed around the connecting portion of the second cavity 118 and the connecting passage 116 And may include a baffle 113. The second cavity 118 may receive the steam through the connection passage 116. The baffle 113 may be formed of a conductive material and may be induction-heated. The steam is turned by the baffle 113 to prevent the steam supplied from the connection passage 116 from directly escaping to the outlet 119 of the second cavity 118. The steam may undergo a plurality of scatterings within the second cavity 118. The steam may have a Boltzmann velocity distribution. The shape of the second cavity 118 is not limited to a spherical or cylindrical shape and may be variously changed. The second cavity 118 may have an outlet 119 in a direction opposite to the connecting passage 116. The size of the outlet 119 may be sufficiently small. The vapor reaching the outlet 119 may be effusive. The vapor reaching the outlet 119 may be ejected directly or may be discharged through reflection on the inner surface of the reflection nozzle 120 or the through hole 120a. The depth of the outlet 119 may preferably be thin. Alternatively, the outlet 119 may have the same angle as the inclination angle of the reflective nozzle 120. The shape of the cross section of the outlet 119 may be the same as that of the cross section of the reflection nozzle.

 The second cavity 118 is capable of decomposing the vapors that have accumulated through a large number of scattered vapor into individual atoms or molecules. In addition, the second cavity 118 may be a radial shape by a point source when steam is ejected through the outlet 119. Accordingly, the steam ejected from the outlet 119 may have a uniform angular distribution. At this time, the shape of the outlet 119 may have a polygonal shape as well as a circular shape. The temperature of the second cavity may be heated to be higher than the temperature of the first cavity. The temperatures of the first and second cavities 112 and 118 can be adjusted through the winding per unit length of the induction coil 140.

The reflection nozzle 120 may have a cylindrical shape with a through hole 120a aligned with the outlet 119. [ The reflection nozzle 120 may be formed integrally with the evaporator 110. The outer shape of the reflective nozzle may be the same as the outer shape of the evaporator. The through hole 120a may have a conical shape, a polygonal conical shape, or a conical shape having a curvature. At this time, the shape of the outlet 119 may coincide with the shape of the through hole 120a. For example, when the shape of the outlet 119 is circular, the through hole 120a may be conical, and when the outlet 119 is rectangular, it may be coincident with a quadrangular pyramid. The inclination angle between the central axis of the through hole 120a and the inner surface may be between 35 degrees and 55 degrees. The reflection nozzle 120 is formed of a conductor, and the induction coil 140 can induction-heat the reflection nozzle. The vapor provided on the surface of the through hole 120a can proceed through reflection. The outer diameter of the reflective nozzle 120 may be smaller than the outer diameter of the evaporator 110. The reflective nozzle 120 may be integrally formed by welding with the evaporator 110.

The reflective nozzle 120 may perform a function similar to a refecting cup for reflecting light. Accordingly, the reflection nozzle 120 can deposit a thin film having a uniform thickness on a flat substrate.

The temperature of the reflective nozzle 120 may be higher than the temperature of the evaporator 110. Accordingly, the vapor incident on the reflection nozzle 120 can be reflected on the substrate 174 without being liquefied. The number of turns of the induction coil 140 per unit length may be larger around the reflective nozzle 120 than around the evaporator 110 to increase the temperature of the reflective nozzle 120.

The dielectric vessel 130 may be cylindrical or bell-jar shaped with a lid. The dielectric container 130 may be mounted in the chamber through-hole 162 of the vacuum chamber 160 to maintain a vacuum. The dielectric container 130 may be disposed to protrude out of the vacuum chamber 160.

The reflective nozzle 120 and the evaporator 110 may be disposed in the dielectric container 130. The inner diameter of the dielectric container 130 may be larger than the outer diameter of the evaporator 110. The material of the dielectric container 130 may be ceramic, alumina, quartz, or sapphire. The induction coil 140 may cover the outer surface of the dielectric container 130.

The support 132 may support the evaporator 110 or the reflection nozzle 120 in the dielectric container 130 and may extend through the chamber through hole 162 formed in the vacuum chamber 160. The support portion 132 may be formed of a dielectric material. The support portion 132 may have a cylindrical shape.

The induction coil 140 is in the form of a solenoid and a refrigerant can flow therein. The number of turns per unit length of the induction coil 140 may vary depending on the position. Specifically, the number of revolutions per unit length around the reflective nozzle 120 may be greater than the number of revolutions per unit length around the evaporator 110.

The AC power supply 150 can supply AC power to the induction coil 140. Accordingly, the alternating current flowing in the induction coil 140 can induction-heat the evaporator 110 and the reflection nozzle 120. The frequency of the AC power supply 150 may be several kHz to several MHz. A device (not shown) capable of controlling the temperature of the evaporator may be attached to the evaporator 110.

The substrate 174 is horizontally disposed in the vacuum chamber 160 and the evaporator 110 is disposed on the upper surface of the substrate 174. A mask (not shown) may be disposed on the substrate 174. The substrate 174 and the mask are aligned and can be fixed in close contact with each other in the substrate holder 172.

The evaporator 110 and the reflective nozzle 120 may provide vapor to the substrate 174 in a top-down manner. The vapor reaching the substrate 174 may form a thin film on the substrate 174. The size or the area and shape of the substrate 174 may be determined by the shape of the through hole 120a of the reflective nozzle 120 and the distance between the substrate 174 and the reflective nozzle 120 . When the shape of the through-hole 120a of the outlet 119 and the reflection nozzle 120 is circular and conical, the shape of the thin film to be deposited may be circular. When the shape of the through-hole 120a of the outlet 119 and the reflection nozzle 120 is quadrangular and quadrilateral, the shape of the thin film becomes a quadrilateral.

 When the evaporation material is an electric conductor, both the evaporator 110 and the evaporation material 111 can be directly induction-heated. The vapor material 111 in the first cavity 112 may be vaporized and provided to the second cavity 118 through the connecting passage 116. The vapor reaching the second cavity 118 may have a Boltzmann velocity distribution through a plurality of scattering processes. The vapor may be effused through the outlet of the induction heated second cavity 118. The reflection nozzle 120 connected to the outlet 119 may have a conical shape or a polygonal conical shape through hole 120a to be deposited on the substrate 174 in a predetermined deposition pattern.

When the evaporation material is non-condensing, the evaporation material 111 contained in the first cavity 112 may be heated by the evaporator. Accordingly, the evaporation material 111 may be vaporized and provided to the second cavity 118. The induction-heated second cavity 118 may provide the steam through the outlet while inhibiting the entrapment of steam. Accordingly, the substrate 174 can form a good thin film at a low process temperature without being heated to a high temperature. The outlet of the second cavity 118 may have a circular or polygonal shape and may be connected to a reflective nozzle in the form of a cone or polygonal cone. The reflection nozzle can reflect the discharged steam inward to adjust the discharge angle of the vapor, and the bottom-up, side-view or top-down evaporation deposition apparatus can deposit a uniform thin film on a large-area substrate.

2A to 2D are perspective views illustrating a reflection nozzle according to an embodiment of the present invention.

Referring to FIG. 2A, the reflection nozzle 120 may include a conical through hole 120a formed in a cylindrical shape. The inclination angle [theta] of the through hole 120 may be between 35 degrees and 55 degrees. The outlet 119 of the evaporator 110 may be conical or cylindrical. The size of the outlet 119 may be the same as the size of the inlet of the through hole 120.

Referring to FIG. 2B, the reflection nozzle 220 may include a through-hole 220a having a quadrangular pyramid shape formed in a rectangular or cylindrical shape. The outlet 119 of the evaporator 110 may have a quadrangular pyramid shape or a square pillar shape.

Referring to FIG. 2C, the reflective nozzle 320 may include a conical through-hole 320a having a predetermined thickness and a curvature to more precisely control the thickness of the uniform thin film.

Referring to FIG. 2D, the reflection nozzle 420 may include a hexagonal-shaped through-hole 420a formed in a cylindrical or hexagonal columnar shape. The outlet 119 of the evaporator 110 may be hexagonal or hexagonal.

3A is a perspective view illustrating a reflection nozzle according to another embodiment of the present invention.

3B is a cross-sectional view taken along the line I-I 'in FIG. 3A.

Referring to FIGS. 3A and 3B, the reflection nozzle 520 may include a conical through-hole 520a having a curvature formed inside a cylindrical shape. The auxiliary reflecting portion 521 may be disposed on the central axis of the through hole 520a. The auxiliary reflecting portion may be conical. The auxiliary reflecting portion 521 can be coupled to the inner surface of the through hole 520a by the auxiliary supporting portion 522. [ Accordingly, the particle flux in the center axis direction of the through hole can be reduced. The reflective nozzle 520 can provide a uniform thin film.

4 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 4, the evaporation apparatus 200 includes a first cavity 112 for containing evaporation material, a second cavity 112 for receiving steam through the first cavity 112 and the connection passage 116, And an outlet (119) formed in the second cavity (118) and discharging the vapor radially through a point source, the evaporator (110) being formed of a conductor, A reflective nozzle 120 connected to the outlet 119 and including a through hole 120a whose diameter gradually increases, an induction coil 140 surrounding the reflective nozzle 120 and the evaporator 110, And the induction coil 140 induces the evaporator 110 and the reflection nozzle 120 to induce the evaporation material 111 to evaporate, And is discharged through the nozzle 120.

The evaporator 110 may have a cylindrical shape. The first cavity 112 may have a cylindrical shape including a projection 114 having a protruding central portion. The connection passage 116 may be formed through the protrusion. The second cavity 118 may have a cylindrical shape. The connecting passage 116 is disposed at the center of the second cavity 118 and the evaporator 110 is connected to the first cavity 118 and the connecting passage 116, (113). The steam can be discharged in a top-down manner.

The reflection nozzle 120 may include a conical through hole 120a having a curvature formed inside a cylindrical shape.

A carrier gas may be provided to convey the vapor within the evaporator 110. The carrier gas may be an inert gas. A through hole may be formed on the upper surface of the dielectric container 130. Accordingly, the fives 183 can be inserted through the dielectric container 130. The pipe 183 may be connected to the upper surface of the evaporator 110. Accordingly, the inert gas may be supplied to the first cake box 112 through the pipe 183. The inert gas provided to the first cavity 112 may provide a smooth discharge of vapor through the connection passage 116.

A gas jetting unit 181 may be disposed between the upper surface of the evaporator 110 and the dielectric vessel 130. The gas injecting unit 181 may have a ring shape. The gas injector 181 may receive an inert gas from the outside of the dielectric container. The gas jetting unit 181 may include jet nozzles formed at regular intervals. An inert gas may be provided in the space between the evaporator and the dielectric container. The inert gas may be supplied to the vacuum chamber 160 through the lower surface of the reflective nozzle 120 or the lower surface of the support 132. The inert gas can suppress vapor deposition on the inner surface of the support portion 132 and the lower surface of the reflection nozzle. In addition, the inert gas can control the directionality of the vapor to improve the deposition uniformity of the substrate.

5 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 5, the evaporation apparatus 300 includes a first cavity 112 for accommodating evaporation material, a second cavity 112 for receiving steam through the first cavity 112 and the connection passage 116, And an outlet (119) formed in the second cavity (118) and discharging the vapor radially through a point source, the evaporator (110) being formed of a conductor, A reflection nozzle 120 connected to the outlet 119 and including a through hole 120a gradually increasing in diameter, an induction coil 140 surrounding the reflection nozzle 120 and the evaporator 110, And an alternating-current power source for applying alternating-current power to the battery 140. The induction coil 140 induces the evaporator 110 and the reflection nozzle 120 to evaporate the evaporation material 111 and the vapor is discharged through the reflection nozzle 120.

The evaporator 110 may have a cylindrical shape. The evaporator 110 may include a first cavity 112 and a second cavity 118. The first cavity 112 may have a cylindrical shape including a protrusion 114 formed at an edge thereof. The protrusion 114 may extend along the side wall of the first cavity 112 at the bottom surface of the first cavity 112.

The second cavity 118 may be vertically spaced below the first cavity 112. The connection passage 116 may be formed through the protrusion 114. The second cavity 118 may be spherical. The connection passage 116 may be connected to the edge of the second cavity 118. The connection passage 116 may be formed to be connected to the horizontal axis of the second cavity. Accordingly, the bead-shaped evaporation material can be accommodated in the first cavity 112 through the connection passage 116.

FIG. 6 is a cross-sectional view illustrating the evaporator of FIG. 1;

Referring to Fig. 6, a bead-shaped or blast evaporation material 111a having a diameter smaller than the diameter of the outlet of the evaporator 110 is prepared. The evaporation material 111a may be provided to the reflection nozzle 120 through a funnel. The evaporation material 111a is provided to the first cavity 112 through the outlet 119 of the evaporator 110 and the connection passage 116. [ Then, the evaporator 110 is mounted to the vacuum chamber 160. Next, the evaporator 110 and the reflection nozzle 120 may be heated to melt the bead-shaped evaporation material. Subsequently, evaporation deposition may be performed on the substrate through the reflective nozzle 120.

7 is a cross-sectional view illustrating a vapor deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 7, the evaporation deposition apparatus 400 includes a first cavity 112 for accommodating evaporation material, a second cavity 112 for receiving steam through the first cavity 112 and the connection passage 116, And an outlet (119) formed in the second cavity (118) and discharging the vapor radially through a point source, the evaporator (110) being formed of a conductor, A reflective nozzle 120 connected to the outlet and including a through hole 120a whose diameter gradually increases, an induction coil 140 surrounding the reflective nozzle 120 and the evaporator 110, And an alternating-current power supply 150 for applying alternating-current power. The induction coil 140 induces the evaporator 110 and the reflection nozzle 120 to evaporate the evaporation material 111 and the vapor is discharged through the reflection nozzle 120.

The evaporator 110 may be mounted on a side surface of the vacuum chamber 160. The evaporator 110 may have a cylindrical shape. The evaporator 110 may include a first cavity 112 and a second cavity 118. The first cavity 112 may have a cylindrical shape. The second cavity 118 may be spherical. The second cavity 118 may be disposed below the first cavity 112 in the central axis of the evaporator 110. The connection passage 116 may be disposed at the edge of the first cavity 112. The steam can be discharged sideways through the outlet 119. Vapor may be provided to the second cavity 118 through the connection passage 116. The vapor provided to the second cavity may be ejected through an outlet formed in the lower surface of the second cavity 118.

The substrate 174 is vertically disposed in the vacuum chamber 160 and the evaporator 110 is disposed on a side of the substrate 174 opposite to the substrate 174. The substrate 174 may be fixed to the substrate holder 172 in close contact with the substrate holder 172.

8 is a cross-sectional view illustrating a vapor deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 8, the evaporation apparatus 500 includes a first cavity 112 for containing the evaporation material 111, a second cavity 110 for receiving the steam through the first cavity 112 and the connection passage 116, An evaporator 110 formed in the second cavity 118 and including an outlet 119 for discharging the vapor radially by a point source and formed of a conductor, An induction coil 140 surrounding the reflective nozzle 120 and the evaporator 110, and an induction coil 140 surrounding the induction coil 140. The reflective nozzle 120 includes a through-hole 120a formed therein and increasing in diameter, And an alternating-current power supply 150 for applying alternating-current power. The induction coil 140 induces the evaporator 110 and the reflection nozzle 120 to evaporate the evaporation material 111 and the vapor is discharged through the reflection nozzle 120.

The evaporator 110 may be mounted on the lower surface of the vacuum chamber 160. The evaporator 110 may have a cylindrical shape. The first cavity 112 may have a cylindrical shape. The second cavity 118 may be spherical or cylindrical. The connection passage 116 is formed in the center of the first cavity 112, and the steam can be discharged in a bottom-up manner. The second cavity 118 may include a baffle 113 disposed around the connection passage 116.

The reflective nozzle 120 may be disposed on the outlet 119 and the reflective nozzle 120 may include a through hole 120a having a cylindrical shape and a center. The through-hole may be conical. The outer diameter of the reflective nozzle 120 may coincide with the outer diameter of the evaporator 110.

9 is a cross-sectional view illustrating a vapor deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 9, the evaporation deposition apparatus includes an evaporator, a heating block, a reflection nozzle, an induction coil, and an AC power source. The evaporator includes a first cavity for containing the evaporation material, a second cavity for receiving the steam through the connection passage with the first cavity, and a second cavity formed in the second cavity, And is formed of a dielectric. A heating block surrounds the evaporator and is formed as a conductor. The reflective nozzle includes a through hole formed in a conductor and connected to the outlet and increasing in diameter. The induction coil surrounds the reflection nozzle and the evaporator. The AC power source applies AC power to the induction coil. The induction coil evaporates the evaporation material by induction heating the heating block and the reflection nozzle, and the steam is discharged through the reflection nozzle.

The evaporator may be formed of a ceramic material. The heating block is induction heated by the induction coil, and can heat the evaporator through heat transfer and radiation.

10 is a partial perspective view illustrating a vapor deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 10, the evaporation apparatus may include a plurality of evaporators 110a, 110b, and 110c. The plurality of evaporators 110a, 110b, and 110c may be mounted in a line on the upper surface of the vacuum chamber 160. Accordingly, each evaporator can deposit a thin film on a predetermined area of the substrate. When the outlet of the evaporator is rectangular and the cross-section of the through-hole 120a of the reflective nozzle is rectangular, each evaporator can deposit a thin film on a corresponding divided substrate area.

11A to 11C are plan views showing a substrate according to still another embodiment of the present invention.

Referring to FIG. 11A, each of the through-holes 120a of the reflection nozzle 120 may be assigned to a constant deposition region on the substrate 174. FIG. The outer shape of the reflection nozzle may be a columnar shape. The through hole 120 may have a quadrangular pyramid shape. The shape of the outlet 119 of the evaporator may be a square pillar or a quadrangular pyramid. The cross-section of the through-hole 120a may be rectangular. The through holes 120a, 120b, and 120c may be aligned in a line. The substrate may be a rectangular substrate.

 Referring to FIG. 11B, the through holes 120a may be arranged in a matrix form. The cross-section of the through-hole may be rectangular. The substrate 174 may be a rectangular substrate.

Referring to FIG. 11C, a plurality of evaporators may be mounted in an aligned manner on the upper surface of the vacuum chamber. The through holes 120a may be disposed at the center of the honeycomb shape, so that each evaporator can deposit a thin film on the substrate 174 in a predetermined hexagonal area. When the cross-section of the through-hole 120a of the reflection nozzle is hexagonal, each evaporator can deposit a thin film on a corresponding divided substrate area. The substrate 174 may be a circular substrate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And all of the various forms of embodiments that can be practiced without departing from the technical spirit.

110: Evaporator
111: Evaporation material
112: First Kebitty
116: connection passage
118: Second Kebitty
119: Exit
120: nozzle
120a: Through hole

Claims (17)

A first cavity for containing the evaporation material, a second cavity for receiving the steam through the connection passage with the first cavity, and a second cavity formed in the second cavity and radiating the steam in a radial manner by a point source An evaporator formed of a conductor including an outlet for discharging;
A reflective nozzle formed with a conductor and including a through-hole connected to the outlet;
An induction coil surrounding the reflection nozzle and the evaporator; And
And an AC power source for applying AC power to the induction coil,
Wherein the induction coil evaporates the evaporation material by induction heating the evaporator and the reflection nozzle, and the vapor is discharged through the reflection nozzle. The method according to claim 1,
Wherein the reflection nozzle and the evaporator are welded to each other to be integral with each other. The method according to claim 1,
Wherein the through hole of the reflection nozzle is a conical shape, a polygonal cone shape, or a conical shape having a curvature. The method according to claim 1,
And the shape of the outlet of the second cavity is the same as the shape of the through-hole of the reflection nozzle. The method according to claim 1,
And a dielectric container disposed inside the induction coil and mounted on a chamber through hole formed in the vacuum chamber to surround the evaporator while maintaining a vacuum therein,
Wherein the dielectric container is disposed to protrude out of the vacuum chamber. 6. The method of claim 5,
Further comprising a support formed of a dielectric material that supports the evaporator or the reflective nozzle inside the dielectric container and extends through a chamber through-hole formed in the vacuum chamber. 6. The method of claim 5,
Further comprising a gas distributor disposed between the evaporator and the dielectric vessel,
Wherein the gas distribution portion provides an inert gas between the dielectric container and the evaporator,
Wherein the inert gas is provided on a lower surface of the reflection nozzle. The method according to claim 1,
Wherein an inclination angle between the central axis of the through hole and the inner surface is in a range of 35 degrees to 55 degrees. The method according to claim 1,
Wherein the number of turns per unit length of the induction coil is greater around the reflective nozzle than around the evaporator. The method according to claim 1,
Wherein the outer diameter of the evaporator is equal to or larger than the outer diameter of the reflective nozzle. The method according to claim 1,
The evaporator is cylindrical,
Wherein the first cavity has a cylindrical shape including a protruding portion having a central portion,
Wherein the connection passage is formed through the protrusion,
The second cavity may have a spherical or cylindrical shape,
The connection passage is disposed at the center of the second cavity,
Wherein the evaporator further comprises a baffle disposed about a connection portion of the second cavity and the connection passage,
Wherein the steam is discharged in a top-down manner. The method according to claim 1,
The evaporator is cylindrical,
Wherein the first cavity has a cylindrical shape,
The second cavity may have a spherical or cylindrical shape,
Wherein the connection passage is disposed at an edge of the first cavity,
Wherein the steam is discharged sideways. The method according to claim 1,
The evaporator is cylindrical,
Wherein the first cavity is a cylindrical shape including a protrusion formed at an edge,
Wherein the connection passage is formed through the protrusion,
The second cavity may have a spherical or cylindrical shape,
Wherein the steam is discharged in a top-down manner. The method according to claim 1,
The evaporator is cylindrical,
Wherein the first cavity has a cylindrical shape,
The second cavity may have a spherical or cylindrical shape,
Wherein the connection passage is formed at the center of the first cavity,
Wherein the steam is discharged in a bottom-up manner. The method according to claim 1,
Further comprising a pipe for supplying a carrier gas to the first cavity. A first cavity for containing the evaporation material, a second cavity for receiving the steam through the connection passage with the first cavity, and a second cavity formed in the second cavity and radiating the steam in a radial manner by a point source An evaporator including an outlet for discharging and formed of a dielectric;
A heating block surrounding the evaporator and formed of a conductor;
A reflective nozzle formed with a conductor and including a through-hole connected to the outlet;
An induction coil surrounding the reflection nozzle and the evaporator; And
And an AC power source for applying AC power to the induction coil,
Wherein the induction coil evaporates the evaporation material by induction heating the heating block and the reflection nozzle, and the steam is discharged through the reflection nozzle. A first cavity for containing the evaporation material, a second cavity for receiving the steam through the connection passage with the first cavity, and a second cavity formed in the second cavity and radiating the steam in a radial manner by a point source An evaporator including an outlet for discharging and formed of a conductor; A reflective nozzle formed with a conductor and including a through-hole connected to the outlet; An induction coil surrounding the reflection nozzle and the evaporator; And an alternating-current power source applying AC power to the induction coil, the induction coil induction-heating the evaporator and the reflection nozzle to evaporate the evaporation material, and the steam is evaporated by evaporation through the reflection nozzle A method of operating a device,
Providing an evaporation material in a bead or powder form to the first cavity through the outlet of the evaporator and the connecting passage;
Mounting the evaporator on a vacuum vessel;
Heating the evaporator and the reflection nozzle to melt the evaporation material; and
And performing evaporation deposition on the substrate through the nozzle. ≪ RTI ID = 0.0 > 11. < / RTI >

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