WO2017213277A1

WO2017213277A1 - Deposition apparatus using top-down evaporation

Info

Publication number: WO2017213277A1
Application number: PCT/KR2016/006111
Authority: WO
Inventors: 김정형; 서인용
Original assignee: 주식회사 파인에바
Priority date: 2016-06-09
Filing date: 2016-06-09
Publication date: 2017-12-14

Abstract

The present invention provides a deposition apparatus and method using top-down evaporation. The deposition apparatus using top-down evaporation comprises: a dielectric tube mounted around a through hole formed in an upper plate of a vacuum container; an induction coil arranged to surround the dielectric tube; an alternating current power supply for providing alternating current power to the induction coil; and an evaporation unit which is disposed inside the dielectric tube, is induction-heated by the induction coil, receives a deposition material, and discharges the deposition material. The evaporation unit includes: a deposition material receiving space; a gas guiding part protruding from the lower surface of the deposition material receiving space and having a through hole at the center thereof; and a cover part covering the gas guiding part and formed of a conductive material. The cover part is submerged in the deposition material, and the deposition material is injected through the through hole of the gas guiding part.

Description

Top Down Evaporation Deposition Device

The present invention relates to a top-down evaporation deposition apparatus, and more particularly to an evaporation deposition apparatus for depositing a large amount of organic material.

Vacuum evaporation deposits a target material to be deposited inside a high vacuum chamber, heats the deposition target material to evaporate the particles, and moves the vapor to form a thin film on the substrate.

The evaporation deposition apparatus has a crucible of ceramic material and a heating unit for heating the crucible. In general, the evaporation deposition apparatus deposits a thin film on a substrate disposed on the upper surface of vapor evaporated against gravity upwardly.

However, as the size of the substrate increases, the bottom-up deposition apparatus has a problem in that the substrate is bent. Therefore, a top down deposition apparatus or a side deposition apparatus is required. In the organic light emitting diode (OLED) constituting the organic light emitting diode display, an anode is generally formed on an upper portion of a transparent substrate, and a hole injection layer (HIL) is sequentially formed on the anode. A hole transport layer (HTL), an organic emission layer (EML), an electron transport layer (ETL) and an electron injection layer (EIL) are deposited, and a cathode is formed on the electron transport layer. ) Has a formed structure.

Deposition of organic materials by top-down evaporation is required.

One technical problem to be solved by the present invention is to provide a temperature gradient to provide a technique for preventing the organic material deterioration by temperature during the organic material down deposition.

Top-down evaporation deposition apparatus according to an embodiment of the present invention comprises a dielectric tube mounted around the through hole formed in the upper plate of the vacuum vessel; An induction coil disposed to surround the dielectric tube; An alternating current power supply for providing alternating current power to said induction coil; And an evaporator disposed inside the dielectric tube and induction heated by the induction coil to receive deposition material and to discharge the deposition material. The evaporator comprises a deposition material receiving space; A gas guide part protruding from a lower surface of the deposition material accommodating space and including a through hole at a center thereof; And a cover part formed of a conductor covering the gas guide part. The cover part is locked by the deposition material, and the deposition material is injected through the through hole of the gas guide part.

In one embodiment of the present invention, it may further include a heat insulating tube disposed to surround the side of the deposition material receiving space.

In one embodiment of the present invention, the side of the evaporator further comprises a groove formed along the circumference, the groove may reduce the heat transfer of the insulating tube and the side of the evaporator.

In one embodiment of the present invention, it may further include a heat insulating cover portion disposed on the cover portion to suppress heat transfer to the deposition material.

In one embodiment of the present invention, the evaporator comprises: a first cylinder having a first diameter on the deposition material receiving space; And a second cylinder having a second diameter smaller than the first diameter under the deposition material accommodating space. The induction coil may be arranged to surround the second cylindrical portion.

In one embodiment of the present invention, the upper portion of the evaporator may include a plurality of trenches extending in the central axis direction.

In one embodiment of the present invention, it may further include an electric field shield disposed on the upper outer peripheral surface of the dielectric tube.

In one embodiment of the present invention, the gas guide portion has a ring shape of a rectangular cross-sectional structure, the upper surface of the gas guide portion may have a sawtooth shape.

In one embodiment of the present invention, the gas guide portion includes a plurality of lower ring structure having a different diameter, the upper surface of the lower ring structure may have a sawtooth shape.

In one embodiment of the present invention, the upper ring structure may increase in height as the diameter decreases.

In one embodiment of the present invention, the cover portion may have a disk-shaped, cone-shaped or truncated cone-shaped body.

In one embodiment of the present invention, the cover portion includes a plurality of upper ring structure on the lower surface, the upper ring structure is a rectangular cross-sectional structure, the lower surface of the upper ring structure may have a sawtooth shape.

In one embodiment of the present invention, the evaporator may further include a cavity connected to the through hole of the gas guide part and formed under the through hole.

The cavity may include an outlet, and the deposition material may be injected through the outlet.

In one embodiment of the present invention, it may further include a nozzle unit for injecting the deposition material injected from the evaporator to the vacuum container.

In one embodiment of the present invention, the evaporator is a ferrule (ferrule) disposed on the upper surface of the deposition material receiving space; And it may further include a top plate for pressing the ferrule.

The top-down evaporation deposition apparatus according to an embodiment of the present invention may include an evaporation unit for receiving an organic material and induction heating, a dielectric tube surrounding the evaporation unit, and an induction coil surrounding the dielectric tube. The evaporation deposition method of the evaporation deposition apparatus comprises the steps of accommodating the organic material inside the evaporator; Locally heating the organic material by providing a vertical temperature gradient depending on the location of the evaporator; And depositing the organic material on the substrate by spraying the sublimed organic material in the vacuum container into the vacuum container.

Evaporation deposition apparatus according to an embodiment of the present invention can accommodate a large amount of organic material at once and can be used for a long time. Thus, the number of opening of the process chamber is reduced, thereby reducing the maintenance cost. In addition, since organic deterioration can be prevented, the cost of expensive organics can be reduced.

1A is a cross-sectional view illustrating an evaporation deposition apparatus according to an embodiment of the present invention.

FIG. 1B is a view for explaining the gas guide part and the lid part of FIG. 1.

2A is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 2B is a perspective view illustrating the gas guide part and the lid part of FIG. 2A. FIG.

3 to 5 are cross-sectional views illustrating evaporation deposition apparatuses according to other embodiments of the present invention.

6A is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

6B is a perspective view illustrating the evaporation unit of FIG. 6A.

7 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

8A is a perspective view illustrating a linear evaporation deposition apparatus according to an embodiment of the present invention.

FIG. 8B is a cross-sectional view taken along the length direction of the linear evaporation deposition apparatus of FIG. 8A.

FIG. 8C is a cross-sectional view taken along the width direction of the linear evaporation deposition apparatus of FIG. 8A.

FIG. 8D is an exploded perspective view of the nozzle block and the buffer block of FIG. 8A.

8E is a plane view illustrating the distance between the induction heating coil and the nozzle block.

8F is a plan view illustrating the arrangement of the through nozzles.

9A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 9B is a perspective view taken along a length direction of the linear evaporation deposition apparatus of FIG. 9A.

FIG. 9C is a cross-sectional view illustrating the steam providing unit of FIG. 9A. FIG.

FIG. 9D is a perspective view illustrating the steam providing unit of FIG. 9A. FIG.

10A is a cross-sectional view cut in the longitudinal direction in the linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 10B is a cross-sectional view illustrating a vapor providing unit of the linear evaporation deposition apparatus of FIG. 10A.

FIG. 10C is a perspective view illustrating a steam guide part of the steam providing part of FIG. 10B.

11A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 11B is a longitudinal cross-sectional view of the linear evaporation deposition apparatus of FIG. 11A.

12A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 12B is a cross-sectional view taken along the width direction of the linear evaporation deposition apparatus of FIG. 12A.

12C is a cut perspective view illustrating the conductive crucible of FIG. 12B.

13A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 13B is a cross-sectional view cut along the length direction of the linear evaporation deposition apparatus of FIG. 13A.

14A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 14B is a longitudinal cross-sectional view of the linear evaporation deposition apparatus of FIG. 14A.

15A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 15B is a cross-sectional view taken along the width direction of the linear evaporation deposition apparatus of FIG. 15A.

16A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 16B is a cross-sectional view taken in the width direction of the linear evaporation deposition apparatus of FIG. 16A.

17A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 17B is a longitudinal cross-sectional view of the linear evaporation deposition apparatus of FIG. 17A.

18A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 18B is a cross-sectional view taken in the width direction of the linear evaporation deposition apparatus of FIG. 18A.

18C is a cutaway perspective view illustrating the linear evaporation deposition apparatus of FIG. 18A.

19A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

19B is a longitudinal cross-sectional view of the linear evaporation deposition apparatus of FIG. 19A.

20A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

20B is a cross-sectional view cut along the length direction of the linear evaporation deposition apparatus of FIG. 20A.

21 is a cross-sectional view showing the shape of a through nozzle according to an embodiment of the present invention.

22A is a perspective view illustrating a conductive crucible module of a linear evaporation deposition apparatus according to an embodiment of the present invention.

FIG. 22B is a longitudinal cross-sectional view of the linear evaporation deposition apparatus of FIG. 22A.

22C is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 22A taken along the width direction.

FIG. 22D illustrates an electrical connection of an induction heating coil of the linear evaporation deposition apparatus of FIG. 22A.

FIG. 22E is an exploded perspective view illustrating a coupling relationship between conductive crucible modules of the linear evaporation deposition apparatus of FIG. 22A.

FIG. 23 illustrates electrical connection of conductive crucible modules according to another embodiment of the present invention.

24A and 24B are views illustrating electrical connection of conductive crucible modules according to another embodiment of the present invention.

25A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

25B is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 25A taken along the width direction.

25C is a cut away perspective view of the conductive crucible module of the linear evaporation deposition apparatus of FIG. 25A.

26A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 26B is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 26A taken along the width direction.

27A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 27B is a longitudinal cross-sectional view of the linear evaporation deposition apparatus of FIG. 27A.

28A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 28B is a longitudinal cross-sectional view of the linear evaporation deposition apparatus of FIG. 28A.

FIG. 28C is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 28A taken along the width direction.

28D and 28E illustrate the electrical connection of the conductive crucible module of the linear evaporation deposition apparatus of FIG. 28A.

29A-29D illustrate electrical connections of a linear evaporation deposition apparatus including a buffer block.

30A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

30B is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 30A taken along the width direction.

30C is a cutaway perspective view of the conductive crucible portion of the linear evaporation deposition apparatus of FIG. 30A.

31A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 31B is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 31A taken along the width direction.

32A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

32B is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 32A taken along the width direction.

33A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

33B is a cross-sectional view of the linear evaporation deposition apparatus of FIG. 33A taken along the width direction.

33C is a cut away perspective view of the conductive crucible module of the linear evaporation deposition apparatus of FIG. 33A.

34A is a conceptual diagram illustrating a linear evaporation deposition apparatus according to an embodiment of the present invention.

34B is a plan view illustrating a nozzle block of the linear evaporation deposition apparatus of FIG. 34A.

35A is a perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

35B is a conceptual diagram illustrating the linear evaporation deposition apparatus of FIG. 35A.

35C is an exploded perspective view illustrating the linear evaporation apparatus of FIG. 35A.

36A is a cutaway perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

36B is a conceptual diagram illustrating the linear evaporation deposition apparatus of FIG. 36A.

37A is a cutaway perspective view illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 37B is a conceptual diagram illustrating the linear evaporation deposition apparatus of FIG. 37A.

38A and 38B are plan views illustrating the through nozzles of the linear evaporation deposition apparatus according to another embodiment of the present invention.

39 is a conceptual view illustrating a through nozzle of the linear evaporation deposition apparatus according to another embodiment of the present invention.

40 is a conceptual diagram illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention.

As the evaporation vessel containing the organics becomes larger, the organics can be easily deteriorated by the thermal energy of the evaporation vessel. Therefore, in large evaporation vessels, there is a need for a method of locally heating an evaporation vessel to selectively evaporate or sublimate only a portion of the organics.

In a top-down evaporation deposition apparatus according to an embodiment of the present invention, the evaporation vessel containing the organic material may be configured to have a temperature gradient. Accordingly, vapor is generated at the lower surface of the evaporation vessel, and the steam may exit the discharge port formed to protrude from the lower surface of the evaporation vessel. Therefore, the evaporation deposition apparatus can store a large amount of organic material at one time and use it for a long time.

The easiest way to give a temperature gradient to the deposition material is to place an induction coil in the position to be heated. However, since the induction coil generates an induction electric field in the surrounding space, it is difficult to selectively heat the desired position. The body of the evaporation vessel is formed integrally and has high thermal conductivity. Therefore, even when a part of the evaporation vessel is locally heated, the evaporation vessel is entirely heated by heat conduction. Therefore, the evaporation material contained in the deposition material accommodating space in the evaporation container has a possibility of being heated and deteriorated as a whole. Accordingly, what is needed is a method of locally heating the deposition material.

According to one embodiment of the invention, an insulating tube is inserted into the side of the deposition material receiving space for local heating of the evaporating material. The adiabatic tube can minimize heat transfer from the heated evaporation vessel. Thus, the overall heating of the evaporating material is suppressed. In addition, an empty space may be formed between the insulating tube and the evaporation vessel to prevent thermal contact between the insulating tube and the evaporator.

According to an embodiment of the present invention, the evaporator has a first cylindrical portion having a first diameter and a second cylindrical portion having a second diameter smaller than the first diameter.

An induction coil wraps around the second cylindrical portion. Accordingly, the heated second cylindrical portion can be locally heated by suppressing heat transfer.

According to an embodiment of the present invention, the evaporation unit may be formed by bonding different materials having different electrical conductivity. Accordingly, the site with high electrical conductivity can be selectively heated further. Thus, the evaporation material can be locally heated.

According to one embodiment of the present invention, an electric field shield formed of a conductor surrounding an upper surface of the evaporation vessel is disposed. An induction coil wraps the dielectric tube underneath the electric field shield. Accordingly, the induction electric field by the induction coil may be configured to heat the upper portion of the evaporation vessel and the electric field shield. The electric field shield is thermally insulated from the evaporation vessel. Accordingly, the induction coil may locally heat only the lower portion of the evaporation vessel.

According to an embodiment of the present invention, a gas guide part and a cover part for heating and discharging evaporation material are disposed in the deposition material accommodating space. The gas guide part and the cover part may be formed of a conductor having high thermal conductivity. However, a heat insulating member may be disposed on the cover portion to suppress unnecessary heating of the evaporation material. The heat insulating member may suppress heat transfer between the heated lid and the deposition material.

According to an embodiment of the present invention, the gas guide part and the cover part may discharge the sublimed evaporated material in the form of a gas without directly discharging the evaporated material in the solid state. The gas guide portion and the lid portion may be discharged by diffusion with a plurality of curtains on the gas path. To this end, the gas guide portion and the cover portion may include a sawtooth trench or hole to provide a gas diffusion path.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the invention will be fully conveyed to those skilled in the art. In the drawings, the components are exaggerated for clarity. Portions denoted by like reference numerals denote like elements throughout the specification.

Hereinafter, an embodiment of a top-down evaporation deposition apparatus will be described.

FIG. 1B is a view for explaining the gas guide part and the lid part of FIG. 1.

1A and 1B, an evaporation deposition apparatus 1100 includes a dielectric tube 1110 mounted around a through hole formed in an upper plate of a vacuum vessel, and an induction coil 1140 disposed to surround the dielectric tube 1110. An AC power source 1150 for providing AC power to the induction coil 1140, and disposed inside the dielectric tube 1110 and induction heated by the induction coil 1140 to receive the deposition material 1010. And an evaporator 1120 for discharging the deposition material.

The evaporator 1120 may include a deposition material accommodating space 1126, a gas guide part 1180 including a through hole 1127 protruding from a lower surface of the deposition material accommodating space 1126 and a center thereof, and the gas guide. The cover part 1190 is formed of a conductor covering the part 1180. The cover part 1190 is locked by the deposition material 110, and the deposition material is injected through the through hole 1127 of the gas guide part 1180. The insulation tube 1122 is disposed to surround the side of the deposition material receiving space 1126.

The vacuum container 1160 may be formed of a conductive material. The vacuum container 1160 may be a chamber having a hexahedron structure. At least one through hole 1162 may be formed on an upper surface of the vacuum container 1160. An evaporator 1120 may be mounted at each of the through holes 1162. The evaporator 1120 may deposit an organic material thin film on the substrate 1174 in a downward manner.

The vacuum container 1160 may include a substrate holder 1172 therein and a substrate 1174 mounted on the substrate holder 1172. The substrate 1174 may be a glass substrate or a plastic substrate including an organic light emitting diode. The substrate 1174 may be a quadrangular substrate.

Dielectric tube 1110 may be quartz, ceramic, or alumina. The dielectric tube 1110 may be cup-shaped or bell-jar. A lower surface of the dielectric tube 1110 may be coupled around the through hole 1162 to maintain a vacuum. The dielectric tube 1110 may be provided with a washer-shaped support portion on the lower surface. The support portion may maintain a vacuum through the vacuum container and the O-ring.

Induction coil 1140 may be arranged to locally heat the evaporator 1110. In detail, the induction coil 1140 may heat the evaporator 1120 of the lower portion of the deposition material accommodating space 1126. Accordingly, the deposition material contained in the deposition material accommodation space may be locally heated. The induction coil 1140 may heat the lower part of the evaporator, the cavity 1129, and the nozzle part 1130.

The AC power supply 1150 provides current to both ends of the induction coil 1140.

The frequency of the AC power supply 1150 may be several hundred Hz to several MHz.

The evaporator 1120 may be a metal or a metal alloy having high electrical conductivity.

In detail, the evaporator 1120 may be aluminum, copper, or stainless steel. Power consumption by induction heating may be proportional to electrical conductivity. Thus, the portion to be heated may be formed of a material having high electrical conductivity. Specifically, using a brazing technique, a soldering technique, or a welding technique, an evaporation section of locally different electrical conductivity can be realized. Specifically, the evaporation unit around the induction coil 1140 may be formed of a high electrical conductivity material, and the upper end of the evaporation unit requiring low temperature may be formed of a material having a relatively low electrical conductivity.

The evaporator 1120 may have a cylindrical shape and include a deposition material accommodating space 1126 therein. The deposition material 1010 may be stored in the deposition material accommodation space 1126. The deposition material 1010 may be an organic material used for an organic light emitting diode. Specifically, the organic material may include Tris (8-hydroxyquinolinato) aluminum (Al (C9H6NO) 3). The organic material is a solid at room temperature, and the organic material may be sublimed or evaporated near 300 degrees Celsius. In order to accommodate a large amount of deposition material, the deposition material accommodation space 1126 may extend in a vertical direction in a cylindrical structure.

The gas guide part 1180 may be disposed to protrude from the lower surface of the deposition material accommodating space 1126. The gas guide part 1180 may be integrally formed with the evaporation part. The gas guide part 1180 may include a through hole 1127 at the center of the protruding portion. The protruding portion may function as a jaw to prevent the deposition material 110 from overflowing. The gas guide part 1180 may be formed of a metal having the same material as that of the body of the evaporator 1120. The gas guide part 1180 may have a ring shape having a rectangular cross-sectional structure. An upper surface of the gas guide part 1180 may have a sawtooth shape 1180a. The side of the gas guide portion may be filled with evaporation material. As the gas guide part and the side wall of the evaporator are heated, the evaporated or sublimed evaporation material may diffuse into the gas guide part.

The cover part 1190 may be formed of a conductive material having high electrical conductivity. The cover portion may have a truncated cone shell shape. The cover part 1190 may cover the gas guide part 1180 and be formed of a conductor. The cover part 1190 may be heated through thermal contact with an induction electric field or the gas guide part 1180. Accordingly, the deposition material may not be deposited on the cover part 1190. When storing a large amount of deposition material, the cover part 1190 may be locked by the deposition material.

The cover part 1190 and the gas guide part 1180 may be coupled to each other to provide a gas passage. Accordingly, the deposition material may be injected through the through hole 1127 of the gas guide unit 1180. The gas guide part 1180 and the cover part 1190 may be heated to about 300 degrees Celsius.

On the other hand, the heat insulating cover 198 may be disposed on the cover 1190 so that the cover 1190 does not heat the deposition material on the cover 1190. The heat insulation cover part 1198 may be in the form of a truncated cone shell. The heat insulating cover part 1198 may be an insulator. Specifically, the heat insulating cover portion 1198 having good heat insulating properties may be a heat insulating material made of quarts, a porous insulator, or a glass fiber material.

The insulation tube 1122 may be disposed to surround the sidewall of the deposition material accommodation space 1126. The insulating tube 1122 may have a cylindrical shape. The lower side surface of the deposition material accommodating space may have an inclined portion 1126a. Accordingly, the bottom surface of the insulation tube 1122 may be aligned in contact with the inclined portion 1126a. The heat insulation tube 1122 may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

Grooves 121 formed in the circumferential direction may be formed between the heat insulation tube and the inner wall of the evaporator. The groove 1121 may minimize heat transfer between the heat insulation tube 1122 and the sidewall of the evaporator 1120.

A ferrule 1123 and a top plate 1124 for pressing the ferrule 1123 may be disposed on an upper surface of the evaporator 1120. The upper plate 1124 may be coupled to the body of the evaporator 1120 to press the ferrule 1123. Accordingly, the deposition material accommodating space 1126 may be sealed by the ferrule. The ferrule may have a truncated cone shape.

The evaporator 1120 may include a cavity 1129 connected to the through hole 1127. The cavity may be in the form of an integrating sphere. The cavity may be formed under the evaporator. The cavity 1129 may include an inlet and an outlet 1129a, and the inlet may coincide with the through hole 1127. The cavity 1129 and the evaporator 1120 may be integrally manufactured. The material of the cavity 1129 and the material of the evaporator 1120 may be the same. A baffle 1128 may be disposed near the inlet of the cavity 1129. The baffle 1128 is formed of a conductive material and may be made of the same material as the evaporator 1120. The baffle may be heated by an induction electric field or heat transfer.

The baffle 1128 may prevent the agglomerated deposition material provided through the inlet from being directly discharged through the outlet 1129a. The deposition material or the evaporating gas incident on the baffle 1128 may be evaporated to perform a plurality of reflections in the cavity 1129. The outlet 1129a of the cavity 1129 may be disposed to face the inlet.

The outlet 1129a of the cavity may be connected to the nozzle unit 1130. The nozzle unit 1130 may be formed of a conductor and simultaneously heated by the induction coil 1140. The nozzle unit 1130 may be manufactured separately from the evaporator 1120 and may be coupled to a lower surface of the evaporator 1120. The nozzle unit 1130 may include a through hole 1132 having a conical shape. The small diameter portion may be connected to the outlet 1129a of the cavity. The deposition material or the evaporation gas may be injected in the direction of the vacuum container through the through hole 1132.

In order to suppress thermal contact between the evaporator and the vacuum container, the insulating member 1134 may support the lower surface of the evaporator 1120 or the lower surface of the nozzle unit 1130. The insulating member 1134 may be quartz, ceramic, or alumina. The heat insulating member may have a cylindrical shape.

The evaporator may have a temperature gradient in the vertical direction. Accordingly, the evaporator can accommodate a large amount of organic material for a long time without deterioration.

Descriptions overlapping with those described in FIGS. 1A and 1B will be omitted.

2A and 2B, the top-down evaporation deposition apparatus 1200 surrounds the dielectric tube 1110 and the dielectric tube 1110 mounted around the through hole 1162 formed in the upper plate of the vacuum container 1160. An induction coil 1140 disposed so as to be disposed, an AC power source 1150 providing AC power to the induction coil 1140, and an induction heating disposed by the induction coil 1140 and disposed inside the dielectric tube 1110. And an evaporator 1220 that receives the deposition material and discharges the deposition material. The evaporator 1220 may include a deposition material accommodating space 1126, a gas guide part 1280 protruding from a lower surface of the deposition material accommodating space 1126 and including a through hole 1127 at a center thereof, and the gas guide. The cover part 1290 formed of a conductor covering the part 1280 is included. The cover part 1290 may be locked by the deposition material 110, and the deposition material may be injected through the through hole 1127 of the gas guide part 1280. The insulation tube 1122 is disposed to surround the side of the deposition material receiving space 1126.

The gas guide part 1280 may include a plurality of

lower ring structures

1282, 1284, and 1286 having different diameters. The heights of the plurality of

lower ring structures

1282, 1284, 1286 may all be the same. The gas guide part 1280 may be formed of a conductor. The gas guide part 1280 may be directly heated by an induction electric field or indirectly by heat transfer. The number of rings may be three. The upper surface of the lower ring structure may have a sawtooth shape (1282a, 1284a, 1286a). Alternatively, the first upper ring structure 1282 may have a first radius and include a through hole 1127 at the center thereof. An upper surface of the first upper ring structure 1282 may include a sawtooth shape 1282a. The second upper ring structure 1284 can have a second radius that is greater than the first radius. An upper surface of the second upper ring structure 1284 may include a sawtooth shape 1284a. The third upper ring structure 1286 may have a third radius greater than the second radius. An upper surface of the third upper ring structure may include a tooth tooth 1286a. Gas may move inward through the sawtooth shape.

The cover part 1290 may be heated through thermal contact with the gas guide part 1280 or by an induction electric field. The lower surface of the cover portion 1290 may contact the lower surfaces between the rings of the gas guide portion 1280. The cover part 1290 may include a disk-shaped body and a plurality of lower ring structures 1292 and 294 on a lower surface thereof, and the lower ring structure may have a rectangular cross-sectional structure. The lower surface of the lower ring structure may have a sawtooth shape (1292a). The heights of the plurality of lower ring structures 1292 and 294 may be the same. The cover part 1290 may have a first upper ring structure 1292 having a predetermined radius on a lower surface of a disc-shaped body. The second upper ring structure 1294 may be disposed outside the first upper ring structure 1292. The first upper ring structure and the second upper ring structure may have a sawtooth shape on a lower surface thereof. Accordingly, the gas may flow inward along the sawtooth shape.

The insulation cover part 1298 may be disposed on the cover part 1290. The heat insulating cover part 1298 may be formed of a heat insulating material of a conical shape. The insulation cover part 1298 may be in the form of a cone shell. The insulation cover part 1298 may suppress heat transfer between the cover part 1290 and the deposition material 1010. The cone shape may also provide a structure in which the deposition material flows down. In order to align the insulation cover portion and the cover portion, the insulation cover portion 1298 may include an upper alignment member 1298a. In addition, the cover part 1290 may also include a lower alignment member 1296.

3 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 3, the top-down evaporation deposition apparatus 1300 is disposed to surround the dielectric tube 1110 and the dielectric tube 1110 mounted around the through-hole 1162 formed in the upper plate of the vacuum container 1160. An induction coil 1140, an AC power source 1150 for providing AC power to the induction coil 1140, and disposed inside the dielectric tube 1110 and induction heated by the induction coil 1140 and depositing material ( 1010 and an evaporator 1320 for discharging the deposition material. The evaporator 1320 may include a deposition material accommodating space 1126, a gas guide part 1380 protruding from a lower surface of the deposition material accommodating space 1126, including a through hole 1127 at a center thereof, and the gas guide. The cover 1390 is formed of a conductor covering the portion 1380. The cover part 1390 may be locked by the deposition material 1010, and the deposition material may be injected through the through hole 1127 of the gas guide part 1380. The insulation tube 1122 is disposed to surround the side of the deposition material receiving space 1126.

The gas guide part 1380 may include a plurality of lower ring structures having different diameters. The height of the lower ring structure may increase gradually as it progresses toward the center. The gas guide part 1380 may be formed of a conductor. The gas guide unit 1380 may be directly heated by an induction electric field or indirectly by heat transfer. The number of rings may be three. The upper surface of the lower ring structure may have a sawtooth shape. Alternatively, the first upper ring structure may have a first radius and include a through hole at the center thereof. An upper surface of the first upper ring structure may include a sawtooth shape. The second upper ring structure may have a second radius greater than the first radius. The upper surface of the second upper ring structure may include a sawtooth shape. The third upper ring structure may have a third radius greater than the second radius. An upper surface of the third upper ring structure may include a tooth tooth 1380a. Gas may move inward through the sawtooth shape.

The cover part 1390 may be heated through thermal contact with the gas guide part 1380 or by an induction electric field. The lower surface of the cover 1390 may contact the lower surfaces between the rings of the gas guide. The cover part 1390 may include a cylindrical body and a plurality of lower ring structures disposed on the lower surface of the body. The lower ring structure may have a rectangular cross-sectional structure. The lower surface of the lower ring structure may have a sawtooth shape 1390a. The height of the plurality of lower ring structures may increase as they move to the center. The cover part may have a first upper ring structure having a predetermined radius on a lower surface of the disc-shaped body. The second upper ring structure may be disposed outside the first upper ring structure. The first upper ring structure and the second upper ring structure may have a sawtooth shape on a lower surface thereof. Accordingly, the gas may flow inward along the sawtooth shape.

The heat insulating cover part 1398 may be disposed on the cover part 1380. The heat insulation cover part may be formed of a conical heat insulating material. The insulation cover portion 1398 may have a cone shell shape. The thermal insulation cover may suppress heat transfer between the cover and the deposition material. The cone shape may also provide a structure in which the deposition material flows down. In order to align the insulation cover portion and the cover portion, the insulation cover portion may include an upper alignment member. In addition, the cover part may also include a lower alignment member.

4 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 4, the top-down evaporation deposition apparatus 1400 includes a dielectric tube 1110 mounted around a through hole formed in the upper plate of the vacuum container 1160 and an induction coil 1140 disposed to surround the dielectric tube 1110. ), An AC power supply 1150 for providing AC power to the induction coil 1140, and an evaporation unit disposed inside the dielectric tube and induction heated by the induction coil to receive deposition material and discharge the deposition material ( 1420). The evaporator 1420 covers the deposition material accommodating space 1126, the gas guide part 1280 protruding from the lower surface of the deposition material accommodating space and including a through hole at the center, and the gas guide part 1280. And cover portion 1290 formed of a conductive conductor. The cover part 1290 may be locked by the deposition material 110, and the deposition material 1010 may be injected through a through hole of the gas guide part. The insulation tube 1122 is disposed to surround the side surface of the deposition material receiving space 1126.

The evaporator 1420 may not include a cavity at a lower portion thereof. In addition, the evaporator 1420 may be formed of a material having a different electrical conductivity by welding or brazing. Specifically, the portion to be heated around the gas guide portion and the lid portion may be formed of a first material of high electrical conductivity, and the other regions may be formed of a material having low electrical conductivity. In detail, the evaporation unit 1420 may include a first container 1420a formed of a first material and a second container 1420b formed of a second material. The second container is disposed on top of the first container and can be manufactured integrally by brazing or welding. Thus, the electrical conductivity varies with location, so local heating can be provided.

5 is a cross-sectional view illustrating an evaporation deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 5, the top-down evaporation deposition apparatus 1500 includes a dielectric tube 1110 mounted around a through hole formed in a top plate of a vacuum vessel, an induction coil 1140 disposed to surround the dielectric tube 1110, and An AC power supply 1150 for providing AC power to an induction coil, and an evaporation unit disposed inside the dielectric tube 1110 and induction heated by the induction coil 1140 to receive deposition material and discharge the deposition material ( 1520). The evaporator 1520 is formed of a deposition material accommodating space 1126, a gas guide part 1380 protruding from a lower surface of the deposition material accommodating space and including a through hole at a center thereof, and a conductor covering the gas guide part. The cover 1390 is included. The cover part 1390 may be locked by the deposition material, and the deposition material may be injected through the through hole 1127 of the gas guide part 1380. The insulation tube 1122 is disposed to surround the side of the deposition material receiving space 1126. The evaporator 1520 may not include a cavity at a lower portion thereof.

6B is a perspective view illustrating the evaporation unit of FIG. 6A.

6A and 6B, the top-down evaporation deposition apparatus 1600 includes a dielectric tube 1110 mounted around a through hole formed in the upper plate of the vacuum container 1160 and an induction disposed to surround the dielectric tube 1110. A coil 1140, an AC power source 1150 for providing AC power to the induction coil 1140, and disposed inside the dielectric tube 1110 and induction heated by the induction coil to receive a deposition material, and deposit a deposition material. And an evaporator 1620 for discharging 110. The evaporator 1620 covers the deposition material accommodating space 1126, the gas guide part 1380 protruding from the lower surface of the deposition material accommodating space and including a through hole at the center thereof, and the gas guide part 1380. The cover 1390 is formed of a conductive conductor. The cover part 1390 may be locked by the deposition material, and the deposition material may be injected through the through hole 1127 of the gas guide part. The insulation tube 1122 is disposed to surround the side of the deposition material receiving space 1126.

The evaporator 1620 may include a first cylindrical part 1620a having a first diameter above the deposition material accommodating space 1126, and a second diameter having a second diameter smaller than the first diameter below the deposition material accommodating space. It may include a cylindrical portion 1620b. The induction coil 1140 may be disposed to surround the second cylindrical portion 1620b. An upper portion of the evaporator may include a plurality of trenches 1620c extending in the central axis direction. The first cylindrical portion 1620a may include a plurality of trenches 1620c extending in the central axis direction. The trench 1620c may interfere with the flow of induced currents, thereby preventing ohmic heating. The space between the second cylindrical portion 1620b and the dielectric tube 1110 may reduce heat transfer. Accordingly, the first cylindrical portion 1620a and the second cylindrical portion 1620b may have a temperature gradient.

The electric field shield 1112 may be disposed on an upper outer circumferential surface of the dielectric tube 1110. The electric field shielding part 1112 may absorb an induction electric field and suppress heating of an evaporation part therein. The electric field shield may be formed of a cylindrical conductive material. The electric field shield may be grounded. Thus, a temperature gradient can be provided along the vertical direction of the evaporator.

Referring to FIG. 7, a plurality of evaporation deposition modules may be arranged in a matrix form on the upper plate of the vacuum container 1160. The evaporation deposition module 1101 includes a dielectric tube 1110 mounted around a through hole 1162 formed in a top plate of a vacuum vessel, an induction coil 1140 disposed to surround the dielectric tube, and an alternating current power to the induction coil. It may include an AC power supply 1150 for providing, and an evaporator 1620 disposed inside the dielectric tube and induction heated by the induction coil to receive the deposition material and discharge the deposition material. The shape of the evaporator can be variously modified to provide a temperature gradient.

Hereinafter, a linear evaporation deposition apparatus will be described.

8E is a plan view for explaining a gap between the induction heating coil and the nozzle block.

8F is a plan view illustrating the arrangement of the through nozzles.

8A to 8F, the linear evaporation deposition apparatus 2100 includes a buffer space 2112 extending along a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. A buffer block 2110 formed; A nozzle block 2120 inside the vacuum vessel 2144, having a rectangular parallelepiped shape extending in the first direction and including a plurality of through nozzles 2122 and mounted to the buffer block and formed of a conductive material; An induction heating coil 2132 disposed in the vacuum vessel 2144 to surround the nozzle block 2120 and the buffer block 2110 and induction heating the nozzle block 2120 and the buffer block 2110; 134); And an AC power supply 2136 supplying AC power to the

induction heating coils

2132 and 2134. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles 2122 are formed in a second direction communicating with the buffer space 2112 of the buffer block and perpendicular to the first direction, respectively, and spaced apart in the first direction. The vapor of the buffer space is discharged.

The deposition material 2010 may be an organic material used for the organic light emitting diode. Specifically, the organic material may include Tris (8-hydroxyquinolinato) aluminum (Al (C9H6NO) 3). The organic material is a solid in powder form at room temperature, and the organic material may be sublimed or evaporated at around 300 degrees Celsius. The vapor providing unit 2160 may be used to receive a large amount of deposition material and provide steam to the buffer space. The buffer block 2110 may receive steam formed of a deposition material from the steam providing unit 2160 and distribute the steam to the plurality of through nozzles 2122. When the buffer block 2110 and the steam providing unit 2160 are spatially separated from each other, even when the buffer block 2110 has a temperature distribution according to a position, a uniform pressure is provided in the buffer space 2112. And a uniform thin film can be deposited.

In a conventional linear evaporation deposition apparatus, the crucible receives and heats the deposition material. Linear nozzles are in direct communication with the crucible. In this case, when the crucible has a temperature distribution according to the position, the deposition material at a particular position having a locally high temperature is quickly consumed, and the pressure is reduced in the consumed region. Uneven temperature distribution or pressure distribution inhibits uniform deposition. In particular, the heating means of the conventional crucible uses a resistive heating wire, the resistive heating wire may provide a spatial temperature difference according to the contact state with the crucible.

According to an embodiment of the present invention, the steam providing unit 2160 and the buffer block 2110 for distributing steam are separated from each other, so that the steam providing unit 2160 efficiently generates only the steam, and the buffer block ( 2110 distributes the steam efficiently. Using an induction heating method, the induction heating coil is disposed to surround the buffer block 2110 and / or the nozzle block 2120 while extending along the extending direction of the buffer block 2110.

Accordingly, the

induction heating coils

2132 and 2134 may be disposed adjacent to the buffer block 2110 and / or the nozzle block 2120 to perform efficient induction heating. As the

induction heating coils

2132 and 2134 are disposed in the vacuum container 2144, efficient heating of the buffer block and the nozzle block is possible. In addition, the structure of the buffer block, the nozzle block, the vapor providing unit may be variously modified.

The

induction heating coils

2132 and 2134 may have a pipe shape or a band shape, and refrigerant may flow in the induction heating coil. In addition, the induction electric field generated by the induction heating coils 2132 and 134 directly and spatially uniformly heats the outer peripheral surfaces of the buffer block 2110 and the nozzle block 2120 in a non-contact manner. Thus, the temperature nonuniformity due to contact is eliminated, the heating stability is improved, and the mechanical configuration is simple. The

induction heating coils

2132 and 2134 are spaced apart from the buffer block 2110 and the nozzle block 2120. The support 2133 fixes the

induction heating coils

2132 and 2134. The support 2133 may be formed of an insulator, and the support 2133 may be made of ceramic or alumina. In addition, the nozzle block 2120 and the buffer block 2110 may be disposed in a non-contact manner with the

induction heating coils

2132 and 2134, so that the nozzle block 2120 and the buffer block 2110 may be easily disassembled and combined.

According to an embodiment of the present invention, the nozzle block 2120 may include a plurality of through nozzles 2122 arranged linearly. Conventional linear nozzles include pipes for each nozzle. The pipe-shaped nozzle is difficult to be heated independently by resistive heating. Since the resistive heating is performed by heat conduction by contact, the conventional pipe-shaped nozzle is indirectly heated through heat conduction by heating of the crucible. Therefore, independent temperature control of the pipe-shaped nozzle is difficult. Accordingly, the pipe-shaped nozzle may be blocked by deposition.

According to one embodiment of the present invention, the nozzle block 2120 is in the form of a rectangular parallelepiped extending in the first direction, and the plurality of through nozzles 2122 are linearly arranged in the nozzle block 2120. Thus, the induction heating coil can directly and directly heat the entire nozzle block 2120. The

induction heating coils

2132 and 2134 may provide a temperature gradient between the nozzle block 2120 and the buffer block 2110. Accordingly, the nozzle block 2120 may solve the clogging phenomenon due to deposition. In addition, the temperature distribution in the longitudinal direction of the nozzle block 2120 may be performed by adjusting the distance between the nozzle induction heating coil 2132 and the nozzle block 2120. For example, the distance d2 between the nozzle induction heating coil 2132 and the nozzle block 2120 at the center portion of the nozzle block is greater than the distance d1 at the edge portion of the nozzle block 2120. It can be designed to be.

The vacuum container 2144 may be formed of a conductive material. The vacuum container 2144 may be a chamber having a rectangular parallelepiped structure. The vacuum container 2144 may be evacuated in a vacuum state by a vacuum pump. The vacuum container 2144 may include a substrate holder (not shown) and a substrate 2146 mounted on the substrate holder. The vacuum container 2144 may include a shadow mask disposed on the front surface of the substrate to perform patterning.

The substrate 2146 may be a glass substrate or a plastic substrate including an organic light emitting diode. The substrate 2146 may be a quadrangular substrate.

The nozzle block 2120 of the linear evaporation deposition apparatus 2100 may discharge the steam in a bottom-up manner against gravity. Specifically, the gravity direction g may be a second negative direction (negative y-axis direction). The through nozzle 2122 may discharge steam to the substrate 2146 disposed above the inner side of the vacuum container 2144 against gravity.

In the case of the bottom-up evaporation deposition apparatus, the through nozzle 2122 discharges steam toward the upper surface of the vacuum vessel, and in the case of the top-down evaporation deposition apparatus, the through nozzle 2122 discharges steam towards the lower surface of the vacuum vessel, In the case of the lateral evaporation deposition apparatus, the through nozzle 2122 may discharge steam toward the side of the vacuum container.

The steam providing unit 2160 may be disposed around a side of the buffer block 2110 in the first direction (x-axis direction) and provide the steam to the buffer space 2112 in the first direction. . The vapor providing unit 2160 may receive a solid or liquid deposition material 2010 and heat the deposition material 2010 to provide steam to the buffer space 2112. The steam providing unit 2160 may provide steam through both ends or one end of the buffer block 2110 in the first direction. The steam providing unit 2160 may include a separate heating means, and the heating means may be induction heating or resistive heating.

When the steam is provided through both ends of the buffer block 2110, the length of the buffer block 2110 may be several tens of centimeters to several meters. In this case, the cross-sectional area perpendicular to the longitudinal direction of the buffer block may be sufficiently larger than the total cross-sectional area of the through nozzles. Accordingly, the buffer space can maintain a uniform pressure.

The vapor providing unit 2160 extends in the second direction, accommodates the deposition material 2010, heats the deposition material 2010 to generate the steam, and through the upper portion of the second direction. A conductive crucible 2166 for providing steam to the buffer block 2110; A conductive pipe 2162 connecting the upper side of the conductive crucible 2166 and the lengthwise side surface of the buffer block 2110 with each other; An auxiliary induction heating coil (2164) disposed to surround the conductive crucible (2166) and inductively heating the conductive crucible (2166); And an auxiliary AC power supply 2168 supplying AC power to the auxiliary induction heating coil 2164.

The steam providing unit 2160 may include a valve for controlling the flow rate of the steam. The valve may be a throttle valve or a butterfly valve. The valve may be installed in the conductive pipe. The conductive crucible 2166 may have a cylindrical or polygonal cylindrical shape having both ends blocked. The conductive crucible may extend in a second direction (y-axis direction). The conductive crucible 2166 may be sealed with the conductive pipe 2162 by a coupling means. The conductive pipe 2162 may have a 90 degree elbow shape. The conductive pipe 2162 may connect an upper side of the conductive crucible and a side of the buffer block 2110 in a first direction. The auxiliary induction heating coil 2164 may be a solenoid coil surrounding the conductive crucible and / or the conductive pipe. The auxiliary induction heating coil 2164 may be connected to the auxiliary AC power supply 2168 to receive AC power. The auxiliary induction heating coil 2164 may induce heating of the conductive crucible and / or the conductive pipe to generate steam. The auxiliary induction heating coil 2164 may be disposed to surround the conductive crucible 2166 in a non-contact manner. The auxiliary induction heating coil 2164 may be in the form of a pipe or strip through which a refrigerant flows. A thermocouple measuring the temperature of the conductive crucible 2166 may be attached to the conductive crucible, and the auxiliary AC power supply may be controlled to maintain a specific set temperature.

The buffer block 2110 may be formed of a metal material having high electrical conductivity. For example, the buffer block 2110 may be stainless steel, copper, tantalum, titanium, tungsten, or nickel. The buffer block 2110 may extend in the first direction (x-axis direction). The second direction (y-axis direction) may be opposite to the gravity direction (g direction).

An alignment groove 2113 extending in the first direction may be disposed on an upper surface of the buffer block 2110. A through slit 2114 extending in the first direction may be disposed in the alignment groove 2113. The nozzle block 2120 may be inserted into the alignment groove 2113 to be fixed by means of welding or the like. Accordingly, steam in the buffer space 2112 of the buffer block may be discharged in the second direction through the through slit 2114 and the through nozzles 2122.

Outlets of the through nozzles 2122 of the nozzle block may be disposed toward the second direction. The nozzle block 2120 may have a rectangular parallelepiped shape extending in a first direction. The length of the nozzle block 2120 may be several tens of cm and several meters. The nozzle block 2120 may have a width of several millimeters to several centimeters. The height of the nozzle block 2120 may be several millimeters to several tens of millimeters. The width of the nozzle block 2120 may be smaller than the height of the nozzle block.

The nozzle block 2120 may be disposed on an upper surface of the buffer block 2110, and the buffer block 2110 and the nozzle block 2120 may be integrally formed. The width of the nozzle block 2120 in the third direction (z-axis direction) may be smaller than the width of the buffer block.

The plurality of through nozzles 2122 may discharge the vapor upwardly in a direction opposite to the gravity direction to deposit organic materials on the substrate 2146 disposed above the vacuum container.

Preferably, the through nozzle 2122 may have a cylindrical shape penetrating the nozzle block 2120. An aspect ratio of the through nozzle may be 5 to 100. The through nozzle 2122 may have a diameter of several hundred micrometers to several millimeters. An interval between neighboring through nozzles 2122 may be 1.2 to 5 times the diameter of the through nozzle. It may be preferable that the diameter of the through nozzle 2122 is smaller than the average free path of steam. When the nozzle block 2120 is in the form of a rectangular parallelepiped extending in the first direction, the nozzle block 2120 may be heated as a whole so that the through nozzles may maintain a uniform temperature as a whole.

The sum of the cross-sectional areas of the through nozzles 2122 may be smaller than the cross-sectional area of the nozzle block. Accordingly, the steam may maintain a spatially constant pressure inside the buffer block.

The plurality of through nozzles 2122 communicate with the buffer space 2112 of the buffer block, are respectively formed along the second direction (y-axis direction), and are spaced apart in the first direction (x-axis direction) to be parallel to each other. It arrange | positions and discharges the vapor of the said buffer space 2112.

The through nozzles 2122 may be arranged to be aligned in a first direction.

The through nozzle may be arranged in one row, two rows, or three rows. In the case of three lines, the first line and the third line may be arranged to be offset in the second line and the first direction.

The density of the through nozzles 2122 may be greater than a central portion of the nozzle block at both ends of the nozzle block 2120 in the first direction. Accordingly, depending on the position, a uniform thin film can be deposited.

According to a modified embodiment of the present invention, the diameter of the through nozzle 2122 may be larger than the central portion of the nozzle block at both ends in the first direction of the nozzle block.

The nozzle block 2120 may be formed of the same material as the buffer block 2110. The nozzle block 2120 may be manufactured integrally with the buffer block 2110 by welding techniques. Temperature measuring means for measuring temperature may be disposed in the nozzle block and the buffer block, respectively. The temperature measuring means may be a thermocouple. The nozzle block 2120 and the buffer block 2110 may be controlled to maintain a set temperature, respectively.

The buffer block 2110 and the nozzle block 2120 may be inductively heated. For induction heating, an induction heating coil and an alternating current power source can be used. The frequency of the AC power supply 2136 may be several tens of kHz to several MHz. Induction heating coils 2132 and 2134 may receive power from the AC power supply 2136 to inductively heat the buffer block and the nozzle block.

The induction heating coils 2132 and 134 may be insulated from the buffer block 2110 and the nozzle block 2120. For insulation, the

induction heating coils

2132 and 2134 may be spaced apart from the buffer block and the nozzle block. The support 2133 may support and fix the

induction heating coils

2132 and 2134. The support part 2133 may be formed of an insulator such as ceramic or alumina. The induction heating coil may be in the form of a pipe having a rectangular cross section, in the form of a pipe having a circular cross section, or in the form of a strip. The spacing between the induction heating coil and the buffer block and the nozzle block may be designed differently depending on the position for temperature control. The

induction heating coils

2132 and 2134 may include a buffer block induction heating coil 2134 disposed to surround the buffer block and a nozzle block induction heating coil 2132 disposed to surround the nozzle block.

The buffer block induction heating coil 2134 and the nozzle block induction heating coil 2132 may be connected in series.

The vertical distance between the induction heating coils 2132 and 134 and the buffer block 2110 or the vertical distance between the induction heating coils 2132 and 134 and the nozzle block 2110 proceeds along the first direction. can be changed.

The heat reflection unit 2150 may be disposed to surround the nozzle block 2120 and the buffer block 2110. The heat reflection unit 2150 may reflect the radiant energy of the heated nozzle block to not be emitted to the outside. The heat reflection unit 2150 may be manufactured by bending a metal plate having high reflection efficiency. Cooling pipes 2152 through which a coolant flows may be installed outside the heat reflection unit 2150.

The linear evaporation deposition apparatus 2100 may include the nozzle block 2120 and a linear movement unit 2170 that provides linear movement to the nozzle block. The linear movement unit 2170 may provide a linear motion (z-axis linear motion) to the nozzle block and the buffer block. Accordingly, the linearly moving nozzle block 2120 may deposit a uniform thin film on all surfaces of the substrate while the substrate 2146 is fixed.

9A to 9D, the linear evaporation deposition apparatus 2200 has a buffer space 2112 extending along a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. A buffer block 2110 formed; A nozzle block 2120 having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles 2122 and mounted to the buffer block 2110 and formed of a conductor material; An induction heating coil (2132, 2134) disposed inside the vacuum vessel (2144) to surround the nozzle block (2120) and the buffer block (2110) and induction heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the

induction heating coils

2132 and 2134. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction communicating with the buffer space of the buffer block and perpendicular to the first direction, spaced apart from each other in the first direction, and arranged in parallel with each other. To discharge.

The nozzle block 2120 has a predetermined length in the first direction (x-axis direction), a predetermined height in a second direction (y-axis direction) perpendicular to the first direction, and the first and second directions. It has a predetermined width in the third direction (z-axis direction) perpendicular to the direction. The plurality of through nozzles 2122 are respectively formed in a second direction (y-axis direction) in communication with the buffer space 2112 of the buffer block and perpendicular to the first direction, and spaced apart in the first direction. They are arranged next to each other, and discharge the vapor of the buffer space.

The nozzle block 2120 of the linear evaporation deposition apparatus 2200 may discharge the steam upwardly with respect to the gravity direction, which is a negative second direction. In detail, the gravity direction may be a negative y-axis direction. The through nozzle 2122 may discharge steam to the substrate 2146 disposed above the inner side of the vacuum container against gravity.

The steam providing unit 2260 may be disposed around the side surface of the buffer block in the first direction, and provide the steam to the buffer space in the first direction (x-axis direction). The vapor providing unit 2260 may receive a solid or liquid deposition material, and heat the deposition material to provide steam to the buffer space 2112. The steam providing unit 2260 may provide steam through both ends or one end of the buffer block in the first direction. The steam providing unit 2260 may include a separate heating means, and the heating means may be induction heating or resistive heating.

The vapor providing unit 2260 extends in the second direction, receives the deposition material, heats the deposition material to generate the steam, and directs the vapor to the buffer block through a lower portion of the second direction. A conductive crucible 2266 to provide; A conductive pipe 2226 connecting the lower side of the conductive crucible and the side surface in the longitudinal direction of the buffer block; An auxiliary induction heating coil 2264 disposed to surround the conductive crucible and inductively heating the conductive crucible; And an auxiliary AC power supply 2268 supplying AC power to the auxiliary induction heating coil.

The steam providing unit 2260 may include a valve for controlling the flow rate of the steam. The valve may be a throttle valve. The conductive crucible may have a cylindrical or polygonal cylindrical shape. The conductive crucible 2266 may extend in a second direction (y-axis direction). The conductive crucible 2266 may be sealed with the conductive pipe 2262 by a coupling means. The conductive pipe 2262 may connect a lower surface of the conductive crucible 2266 and a side surface of the buffer block 2110 in a first direction. The auxiliary induction heating coil 2264 may be a solenoid type coil surrounding the conductive crucible and / or the conductive pipe. The auxiliary induction heating coil 2264 may be connected to the auxiliary AC power supply 2268 to receive AC power. The auxiliary induction heating coil 2264 may induce heating of the conductive crucible and / or the conductive pipe to generate steam.

The conductive crucible 2266 may include a conductive crucible body 2284, a steam guide part 2231, a conductive cover part 2228, and an insulating cover part 2285. The conductive crucible body 2284 includes a deposition material accommodating space 2284a extending in the second direction (y-axis direction) and accommodating the deposition material, and may be formed of a cylindrical conductive material. The steam guide part 2231 may include a protrusion 2228a protruding from a lower surface of the conductive crucible body 2284 and a discharge through hole 2231b penetrating the protrusion. The conductive cover part 2228 is disposed in the deposition material accommodating space 2284a and covers the discharge through-hole 2228b of the vapor guide part 2231 and has a truncated circular cone shell shape. Can be formed. The insulation cover part 2285 may be disposed in the deposition material accommodating space 2284a, may cover the conductive cover part 2228, have a truncated cone shape, and may be formed of an insulator. The protruding portion of the steam guide portion 2231 may include an opening 2231c communicating with the discharge through hole.

The auxiliary induction heating coil 2264 may selectively heat the lower portion of the conductive crucible body 2284. When the conductive crucible body 2284 accommodates a large amount of deposition material, the deposition material 2010 may be thermally denatured. Therefore, in order to suppress thermal denaturation of the deposition material, the auxiliary induction heating coil 2264 may mainly heat around the steam guide portion 2231 under the conductive crucible body 2284. Accordingly, the deposition material 2010 accommodated on the vapor guide part 2231 may not be thermally modified.

The conductive crucible body 2284 may have a cylindrical shape and include a deposition material accommodating space 2284a therein. The deposition material 2010 may be stored in the deposition material accommodating space 2284a. The deposition material 2010 may be an organic material used for an organic light emitting diode. The deposition material accommodating space 2284a may extend in the second direction (vertical direction) in a cylindrical structure.

The vapor guide part 2231 may be disposed to protrude from a lower surface of the deposition material accommodating space 2284a. The steam guide part 2231 may be integrally formed with the conductive crucible body 2284. The steam guide part 2231 may include a discharge through hole 2231b at the center of the protrusion. The protrusion 2228a may function as a jaw to prevent the deposition material 2010 from overflowing. The steam guide part 2231 may be formed of a metal having the same material as the conductive crucible body. The steam guide part 2231 may have a ring shape having a rectangular cross-sectional structure. The upper surface of the steam guide portion 2231 may have a sawtooth opening 2228c. The side surface of the vapor guide portion 2231 may be filled with a deposition material. As the sidewalls of the vapor guide portion 2281 and the conductive crucible body 2284 are inductively heated, vaporized or sublimed deposition material may be sprayed along the vapor guide portion 2231.

The conductive cover 2228 may be formed of a conductive material having high electrical conductivity. The conductive cover portion may have a truncated circular cone shell shape. The conductive cover part 2228 may cover the vapor guide part 2231 and be formed of a conductor. The conductive cover part 2228 may be heated by induction electric field or thermal contact with the steam guide part 2231. Accordingly, the deposition material may not be deposited on the conductive cover 2228. When storing a large amount of deposition material, the conductive cover 2228 may be locked by the deposition material.

The conductive cover portion 2228 and the steam guide portion 2231 may be coupled to each other to provide a movement passage of steam. Accordingly, the deposition material may be sprayed through the torch through hole 2281b of the vapor guide part 2231. The steam guide portion 2231 and the conductive cover portion 2228 may be heated to about 300 degrees Celsius.

On the other hand, the heat insulating cover 2285 may be disposed on the conductive cover 2228 so that the conductive cover 2228 does not heat the deposition material on the conductive cover 2228. The thermal insulation cover 2285 may be in the form of a truncated circular cone shell. The heat insulation cover part 2285 may be an insulator. Specifically, the heat insulating cover portion 2285 having good heat insulating properties may be a heat insulating material made of quarts, a porous insulator, or a glass fiber material.

The insulation tube 2287 may be disposed to surround the sidewall of the deposition material accommodating space 2284a. The insulating tube 2287 may have a cylindrical shape. The lower side surface of the deposition material accommodation space may have an inclined portion 2284b. Accordingly, the lower surface of the insulation tube 2287 may be aligned in contact with the inclined portion 2284b. The insulation tube 2287 may be a quarts, a porous insulator, or a glass fiber insulation.

Grooves 2286 formed in a circumferential direction may be formed between the insulating tube and the inner wall of the conductive crucible body. The groove 2286 may minimize heat transfer between the insulating tube 2287 and the sidewall of the conductive crucible body 2284.

A ferrule 2288 and a top plate 2289 for pressing the ferrule 2288 may be disposed on an upper surface of the conductive crucible body 2284. The upper plate 2289 may be coupled to the conductive crucible body to press the ferrule 2288. Accordingly, the deposition material accommodating space 2284a may be sealed by the ferrule. The ferrule may have a truncated cone shape.

10A to 10C, the linear evaporation deposition apparatus 2300 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block 2120 inside the vacuum vessel 2144, having a rectangular parallelepiped shape extending in the first direction and including a plurality of through nozzles 2122 and mounted to the buffer block 2110 and formed of a conductor material; An induction heating coil (2132, 2134) disposed inside the vacuum vessel (2144) to surround the nozzle block (2120) and the buffer block (2110) and induction heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block of the linear evaporation deposition apparatus 2300 may discharge the steam upward. In detail, the gravity direction may be a negative y-axis direction. The through nozzle may discharge steam to a substrate disposed above the inner side of the vacuum container against gravity.

The steam providing unit 2360 may provide the steam to the buffer space 2112 in the first direction (x-axis direction). The vapor providing unit 2360 may receive a solid or liquid deposition material and heat the deposition material 2010 to provide steam to the buffer space 2112. The steam providing unit 2360 may provide steam through both ends or one end of the buffer block in the first direction. The steam providing unit 2360 includes a separate heating means, and the heating means may be induction heating or resistive heating.

The steam providing unit 2360 may provide the steam to the buffer space in the first direction (x-axis direction) at a side surface disposed at the end of the first direction of the buffer block 2112. The vapor providing unit 2360 may receive a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space. The steam providing unit may provide steam to the buffer block through both ends or one end. The vapor providing portion includes a separate heating means, which may be induction heating or resistive heating.

The vapor providing unit 2360 extends in the second direction, receives the deposition material, heats the deposition material 2010 to generate the steam, and stores the vapor through the lower portion of the second direction. A conductive crucible 2366 for providing the block 2110; A conductive pipe 2236 connecting the lower side of the conductive crucible 2366 and the side surface in the longitudinal direction of the buffer block; An auxiliary induction heating coil 2364 disposed to surround the conductive crucible and inductively heating the conductive crucible; And an auxiliary AC power supply 2368 supplying AC power to the auxiliary induction heating coil.

The steam providing unit 2360 may include a valve for controlling the flow rate of the steam. The valve may be a throttle valve or a butterfly valve.

The conductive crucible 2366 may have a cylindrical or polygonal cylindrical shape. The conductive crucible may extend in a second direction (y-axis direction). The conductive crucible 2366 may be sealed by the conductive pipe 2362 and the gasket and the coupling means. The conductive pipe 2362 may connect the lower surface of the conductive crucible 2268 and the side surface of the buffer block 2110 with each other. The auxiliary induction heating coil 2364 may be a solenoid type coil surrounding the conductive crucible and / or the conductive pipe. The auxiliary induction heating coil 2364 may be connected to the auxiliary AC power supply 2368 to receive AC power. The auxiliary induction heating coil 2364 may induce heating of the conductive crucible and / or the conductive pipe to generate steam.

The auxiliary induction heating coil 2364 may selectively heat the lower surface of the conductive crucible body 2342. When the conductive crucible body 2338 accommodates a large amount of deposition material, the deposition material 2010 may be thermally denatured. Therefore, in order to suppress thermal denaturation of the deposition material, the auxiliary induction heating coil may mainly heat around the vapor guide portion of the lower portion of the conductive crucible body. Accordingly, the deposition material accommodated above the vapor guide part may not be thermally modified.

The conductive crucible 2366 may include a conductive crucible body 2384, a steam guide part 2381, a conductive cover part 2382, and an insulating cover part 2385. The conductive crucible body 2384 may include a deposition material accommodating space 2384a extending in the second direction and accommodating the deposition material therein and may be formed of a cylindrical conductive material. The steam guide part 2381 may include a lower cylindrical part 2381a protruding from a lower surface of the conductive crucible body and having discharge cylinders 2381b passing through the center of the lower cylindrical part. have. The conductive cover 2382 may be disposed in the deposition material accommodating space and may include a disc 2382a and an upper cylindrical part 2382b formed of the same concentric cylinders coupled to the bottom surface of the disc. The heat insulating cover part 2385 may be disposed in the deposition material accommodating space and cover the conductive cover part, and may have a conical shape and may be formed of an insulator. The upper cylindrical portion 2382b and the lower cylindrical portion 2381a may be alternately disposed depending on the diameter. The lower cylindrical portion of the steam guide portion may include a lower opening 2381c to communicate with the discharge through hole 2381b. The upper cylindrical portion 2382b of the conductive cover portion may include an upper opening 2382c to communicate with the discharge through hole 2381b. The steam may be provided to the discharge through hole 2381b through the lower opening and the upper opening. The vapor may be provided to the buffer space through the discharge through hole 2381b and discharged through the through nozzles.

The conductive crucible body 2384 may have a cylindrical shape and include a deposition material accommodating space 2384a therein. The deposition material 2010 may be stored in the deposition material accommodating space 2384a. The deposition material 2010 may be an organic material used for an organic light emitting diode. The deposition material accommodating space 2384a may extend in the second direction (vertical direction) in a cylindrical structure.

The vapor guide portion 2381 may be disposed to protrude from the lower surface of the deposition material accommodating space 2384a and may be formed of concentric cylinders. The steam guide part 2381 may be integrally formed with the conductive crucible body 2338. The steam guide part 2381 may include a discharge through hole 2381b at the center of the lower cylindrical part. The lower cylindrical portion 2381a may function as a jaw to prevent the deposition material 2010 from overflowing. The steam guide part 2381 may be formed of a metal having the same material as the conductive crucible body. The upper surface of the steam guide portion 2381 may have a sawtooth lower opening 2381c. The side surface of the vapor guide portion 2381 may be filled with a deposition material. As the sidewalls of the vapor guide portion 2381 and the conductive crucible body 2384 are inductively heated, evaporated or sublimed deposition material may be sprayed along the vapor guide portion 2381.

The conductive cover part 2382 may be formed of a conductive material having high electrical conductivity. The conductive cover part may be composed of a disc and an upper cylindrical part disposed on a lower surface of the disc and having a concentric axis. The conductive cover part 2382 may cover the vapor guide part 2381 and be formed of a conductor. The conductive cover part 2382 may be heated by inductive electric field or thermal contact with the steam guide part 2381. Accordingly, the deposition material may not be deposited on the conductive cover portion 2382. When storing a large amount of deposition material, the conductive cover 2382 may be locked by the deposition material.

The conductive cover portion 2382 and the steam guide portion 2381 may be coupled to each other to provide a passage for moving the steam. Accordingly, the deposition material may be injected through the discharge through hole 2381b of the vapor guide part 2381. The steam guide part 2381 and the conductive cover part 2382 may be heated to about 300 degrees Celsius.

On the other hand, the heat insulating cover 2385 may be disposed on the conductive cover 2323 so that the conductive cover 2382 does not heat the deposition material on the conductive cover 2382. The thermal insulation cover 2385 may be in the form of a circular cone shell.

The insulation cover portion 2385 may be an insulator. Specifically, the heat insulating cover 2585 having good heat insulating properties may be a quarts, a porous insulator, or a heat insulating material made of glass fiber. The insulation cover portion 2385 may include an alignment member 2385a for aligning with the conductive cover portion.

The insulation tube 2387 may be disposed to surround sidewalls of the deposition material accommodating space 2384a. The insulating tube 2387 may have a cylindrical shape. The lower side surface of the deposition material accommodation space may have an inclined portion 2384b. Accordingly, the bottom surface of the insulation tube 2387 may be aligned in contact with the inclined portion 2384b. The insulation tube 2387 may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

Grooves 2386 formed in the circumferential direction may be formed between the insulating tube and the inner wall of the conductive crucible body. The groove 2386 may minimize heat transfer between the heat insulation tube 2387 and the sidewall of the conductive crucible body 2384.

A ferrule 2388 and a top plate 2389 for pressing the ferrule 2388 may be disposed on an upper surface of the conductive crucible body 2384. The upper plate 2389 may be coupled to the conductive crucible body to press the ferrule 2388. Accordingly, the deposition material accommodating space 2384a may be sealed by the ferrule. The ferrule may have a truncated cone shape.

11A and 11B, the linear evaporation deposition apparatus 2400 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block of the linear evaporation deposition apparatus 2400 may discharge the vapor from the bottom up. The gravity direction may be a negative y-axis direction. The through nozzle may discharge steam to the substrate 2146 disposed above the inner side of the vacuum container against gravity.

The steam providing unit 2460 may provide the steam to the buffer space in the first direction (x-axis direction) on the side of the buffer block in the first direction. The vapor providing unit 2460 may receive a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space. The steam providing unit may provide steam to the buffer block through both ends or one end. The vapor providing portion includes a separate heating means, which may be induction heating or resistive heating.

The steam providing unit 2460 may include a conductive crucible 2466, a conductive pipe 2246, an auxiliary induction heating coil 2464, and an auxiliary AC power supply 2468.

The conductive crucible 2466 is spaced apart in the second direction and extends in the first direction (x-axis direction) in parallel with the buffer block and is disposed at a lower position than the buffer block and accommodates the deposition material 2010. A deposition material accommodating space 2466a may be included, and may have a rectangular parallelepiped shape for discharging the vapor through a side surface of the first direction. The conductive pipe 2442 may have a “U” shape that connects the side surface of the conductive crucible 2466 in the first direction and the side surface of the buffer block 2110 in the first direction. The auxiliary induction heating coil 2464 may be disposed to surround the conductive crucible 2466 and inductively heat the conductive crucible 2466. The auxiliary AC power supply 2468 may include an auxiliary AC power supply supplying AC power to the auxiliary induction heating coil 2464.

The conductive crucible 2466 includes a deposition material accommodating space 2466a therein and may be formed of a conductive material. The conductive crucible may have a rectangular cylinder shape extending in the first direction. The conductive crucible 2466 may be sealed with the conductive pipe 2462 by a coupling means. The conductive pipe 2246 may connect a side surface of the conductive crucible and a side surface of the buffer block to each other. The auxiliary induction heating coil 2464 may be a coil surrounding the conductive crucible and / or the conductive pipe. The auxiliary induction heating coil 2464 may be connected to the auxiliary AC power supply 2468 to receive AC power. The auxiliary induction heating coil 2464 may induce heating of the conductive crucible and / or the conductive pipe to generate steam.

As the conductive crucible 2466 and the buffer block 2110 are disposed separately from each other up / down, the temperature of the conductive crucible and the temperature of the buffer block may be set differently. Specifically, the temperature of the nozzle block may be set higher than the temperature of the buffer block, the temperature of the buffer block may be set higher than the temperature of the conductive crucible. Accordingly, the evaporation site and the vapor distribution site are spatially separated from each other, thereby enabling uniform deposition and convenient maintenance.

12C is a cut perspective view illustrating the conductive crucible of FIG. 12B.

12A to 12C, the linear evaporation deposition apparatus 2500 has a buffer space extending along a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block 2120 may discharge the steam upwardly with respect to the gravity direction, which is the negative second direction. The steam providing unit 2560 may be disposed in parallel with the buffer block, extend in the first direction, and provide the steam to the buffer space in the third direction. The vapor providing unit 2560 may receive a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space.

The vapor providing unit 2560 is a conductive crucible 2566 formed of a conductive material and extending in the first direction; A connection block (2562) formed of a conductive material and connecting the lower surface of the conductive crucible (2566) and the lower side of the buffer block to communicate with each other; An auxiliary induction heating coil (2564) disposed around the conductive crucible (2566) and the connection block (2562) to inductively heat the conductive crucible; And an auxiliary AC power supply 2568 supplying AC power to the auxiliary induction heating coil.

The conductive crucible 2566 may include a conductive crucible body 2584, a steam guide part 2611, a conductive cover part 2252, and an insulating cover part 2585. The conductive crucible body 2566 may have a rectangular parallelepiped shape extending in the first direction and formed of a conductive material and including a deposition material accommodating space 2584a accommodating the deposition material. The steam guide portion 2861 may protrude from the lower surface of the conductive crucible body and extend in the first direction, and a plurality of discharge through holes penetrating the protrusion and spaced apart from the first direction. 2581b). The conductive cover 2258 may extend in the first direction and be disposed in the deposition material accommodating space to cover the discharge through hole of the vapor guide part and be formed of a conductor. The insulating cover 2585 may be disposed in the deposition material accommodating space and may cover the conductive cover and be formed of an insulator. The protrusions 2581 of the steam guide part may include openings 2601c communicating with the discharge through holes 2571b, respectively. The opening 2581c may penetrate the protrusion 2581 in the third direction.

The steam may be provided to the discharge through hole 2571b through the opening 2561c. The vapor may be provided to the buffer space through the discharge through hole 2571b and discharged through the through nozzles.

The conductive crucible body 2584 may have a rectangular parallelepiped shape extending in the first direction, and include a deposition material accommodating space 2584a therein. The deposition material 2010 may be stored in the deposition material accommodating space 2584a. The deposition material 2010 may be an organic material used for an organic light emitting diode. The deposition material accommodation space 2584a may extend in the first direction in a rectangular cylinder structure.

The vapor guide portion 2571 may protrude from the lower surface of the deposition material accommodating space 2584a and may extend in the first direction. The steam guide portion 2571 may be integrally formed with the conductive crucible body 2584. The steam guide part 2571 may include a discharge through hole 2571b penetrating the protrusion and spaced apart at regular intervals in the first direction. The protrusion 2561a may function as a jaw to prevent the deposition material 2010 from overflowing. The steam guide portion 2571 may be formed of a metal having the same material as the conductive crucible body. The upper surface of the steam guide portion 2581 may have an opening 2601c extending in the third direction. The side surface of the vapor guide portion 2581 may be filled with a deposition material. As the sidewalls of the vapor guide portion 2581 and the conductive crucible body 2584 are induction heated, evaporated or sublimed deposition material may be sprayed along the vapor guide portion 2581.

The conductive cover portion 2258 may be formed of a conductive material having high electrical conductivity. The conductive cover portion may be in the form of a plate extending in the first direction and bent.

The conductive cover 2258 covers the vapor guide portion 2581 and may be formed of a conductor. The conductive cover 2258 may be heated by induction electric field or thermal contact with the vapor guide portion 2801. Accordingly, the deposition material may not be deposited on the conductive cover 2258. When the large amount of deposition material is stored, the conductive cover 2258 may be locked by the deposition material.

The conductive cover 2258 and the steam guide portion 2581 may be coupled to each other to provide a movement passage of steam. Accordingly, the deposition material may be injected through the torch through hole 2571b of the vapor guide portion 2581. The steam guide portion 2581 and the conductive cover portion 2258 may be heated to about 300 degrees Celsius.

Meanwhile, the thermal insulation cover 2585 may be disposed on the conductive cover 2258 so that the conductive cover 2258 does not heat the deposition material on the conductive cover 2258. The insulation cover portion 2585 may have a plate shape extending in the first direction. The heat insulation cover 2585 may be an insulator. Specifically, the heat insulating cover 2585 having good heat insulating properties may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

The insulating plate 2587 may be disposed along the sidewall of the deposition material accommodating space 2584a. The lower side surface of the deposition material accommodation space may have an inclined portion 2584b. The heat insulating plate 2587 may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

Grooves 586 and 586 may be formed between the insulating plate and the inner wall of the conductive crucible body. The groove 2586 may minimize heat transfer between the heat insulation plate 2587 and the sidewall of the conductive crucible body 2584.

The sealing plate 2588 and an upper plate 2589 for pressing the sealing plate 2588 may be disposed on an upper surface of the conductive crucible body 2584. The upper plate 2589 may be coupled to the conductive crucible body to press the sealing plate 2588. Accordingly, the deposition material accommodating space 2584a may be sealed by the sealing plate. The sealing plate and the upper plate may have a plate shape extending in the first direction.

13A to 13B, the linear evaporation deposition apparatus 2600 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block 2120 may discharge the steam in a downward direction in a gravity direction, which is a positive second direction. The steam providing unit 2660 may provide the steam to the buffer space in the first direction at the side of the first direction of the buffer block. The vapor providing unit may receive a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space.

The vapor providing unit 2660 extends in the second direction, and includes a conductive crucible 2166 which receives the deposition material 2010 and heats the deposition material to generate the steam; A conductive pipe 2162 connecting the upper side of the conductive crucible and the side in the longitudinal direction of the buffer block; An auxiliary induction heating coil 2164 disposed to surround the conductive crucible and inductively heating the conductive crucible; And an auxiliary AC power supply 2168 supplying AC power to the auxiliary induction heating coil.

Referring to FIGS. 14A to 14B, the linear evaporation deposition apparatus 2700 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block 2120 may discharge the steam in a downward direction in a gravity direction, which is a positive second direction. The steam providing unit 2760 may provide the steam to the buffer space in the first direction at the side of the first direction of the buffer block. The vapor providing unit 2760 may store a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space.

The steam providing unit 2760 extends in the second direction, and includes a conductive crucible 2266 for storing the vapor deposition material and heating the vapor deposition material to generate the vapor; A conductive pipe 2276 connecting the lower side of the conductive crucible and the side of the buffer block in a first direction; An auxiliary induction heating coil (2264) disposed to surround the conductive crucible (2266) and inductively heating the conductive crucible; And an auxiliary AC power supply 2268 supplying AC power to the auxiliary induction heating coil.

The conductive crucible 2266 may include a conductive crucible body 2284, a steam guide part 2231, a conductive cover part 2228, and an insulating cover part 2285. The conductive crucible body 2284 includes a deposition material accommodating space 2284a extending in the second direction and accommodating the deposition material, and may be formed of a cylindrical conductive material. The steam guide part 2231 may include a protrusion 2231a protruding from a lower surface of the conductive crucible body and a discharge through hole 2231b penetrating the protrusion. The conductive cover 2228 is disposed in the deposition material receiving space, covers the discharge through hole of the vapor guide part, has a truncated circular cone shell shape, and may be formed of a conductor. The insulation cover part 2285 may be disposed in the deposition material accommodating space, cover the conductive cover part, form a truncated cone shape, and be formed of an insulator. The protrusion of the steam guide part may include an opening communicating with the discharge through hole.

15A to 15B, the linear evaporation deposition apparatus 2800 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block 2122 may discharge the steam in a downward direction in a gravity direction, which is a positive second direction. The steam providing unit 2860 may be disposed in parallel with the buffer block and extend in the first direction, and provide the steam to the buffer space in the third direction. The vapor providing unit 2860 may receive a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space.

The steam providing unit 2860 is formed of a conductive material and has a conductive crucible 2866 extending in the first direction; A connection block 2862 connecting the upper side of the conductive crucible in the third direction and the upper side of the buffer block to communicate with each other; An auxiliary induction heating coil (2864) disposed around the conductive crucible and the connection block and inductively heating the conductive crucible; And an auxiliary AC power supply 2868 for supplying AC power to the auxiliary induction heating coil.

The conductive crucible 2866 extends in a first direction and is formed of a conductive material, and may have a rectangular parallelepiped shape. The conductive crucible 2866 may include a deposition material accommodation space accommodating the deposition material and extending in the first direction.

The connection block 2862 may connect the upper side of the conductive crucible and the upper side of the buffer block to each other in a third direction. The connection block 2862 may extend in the first direction and be formed of a conductive material.

The auxiliary induction heating coil 2864 extends in a first direction and may be disposed to surround the connection block and the conductive crucible.

16A to 16B, the linear evaporation deposition apparatus 2900 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block 2120 may discharge the steam in a downward direction in a gravity direction, which is a positive second direction. The steam providing unit 2960 may be disposed on an upper surface of the buffer block, extend in the first direction, and provide the steam in the second direction to the buffer space. The vapor providing unit 2960 may receive a deposition material in a solid or liquid state, and heat the deposition material to provide steam to the buffer space.

The steam providing unit 2960 may include a conductive crucible 2566 formed of a conductive material and extending in the first direction; An auxiliary induction heating coil 2564 disposed around the conductive crucible and inductively heating the conductive crucible; And an auxiliary AC power supply 2568 supplying AC power to the auxiliary induction heating coil.

The conductive crucible 2566 may include a conductive crucible body 2584, a steam guide part 2601, a conductive cover part 2252, and an insulating cover part 2585. The conductive crucible body 2584 may extend in the first direction and be formed of a conductive material, and may have a rectangular parallelepiped shape including a deposition material accommodation space accommodating the deposition material. The steam guide portion 2601 extends in the first direction and protrudes from the lower surface of the conductive crucible body 261 and a plurality of discharge through holes disposed through the protrusion and spaced apart in the first direction ( 2581b). The conductive cover portion 2258 extends in the first direction and is disposed in the deposition material accommodating space, covers the discharge through holes of the vapor guide portion, and may be formed of a conductor. The thermal insulation cover 2585 may be disposed in the deposition material accommodation space, cover the conductive cover, and be formed of an insulator. The protrusions of the steam guide part may include openings 2611c communicating with the discharge through holes, respectively.

17A to 17B, the linear evaporation deposition apparatus 3000 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil.

The nozzle block 2120 may discharge the steam in a lateral manner with respect to the gravity direction, which is a positive first direction. The steam providing unit 3060 may be disposed on a lower side of the first direction of the buffer block and provide the steam to the buffer space in the first direction. The vapor providing unit 3060 may store a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space.

The steam providing unit 3060 extends in the first direction and includes a cylindrical conductive crucible 2266 for accommodating the deposition material and heating the deposition material to generate the steam; A conductive pipe 3062 connecting the lower surface of the conductive crucible and the lower surface in the longitudinal direction of the buffer block to each other; An auxiliary induction heating coil 2264 disposed to surround the conductive crucible and inductively heating the conductive crucible; And an auxiliary AC power supply 2268 supplying AC power to the auxiliary induction heating coil.

The conductive crucible 2266 may include a conductive crucible body 2284, a steam guide part 2231, a conductive cover part 2228, and an insulating cover part 2285. The conductive crucible body 2284 extends in the first direction and includes a deposition material accommodation space accommodating the deposition material therein and may be formed of a cylindrical conductive material. The steam guide part 2231 may include a protrusion 2231a protruding from a lower surface of the conductive crucible body and a discharge through hole 2231b penetrating the protrusion. The conductive cover 2228 may be disposed in the deposition material accommodating space and may cover the discharge through hole of the vapor guide part, form a truncated circular cone shell, and be formed of a conductor. The insulation cover part 2285 may be disposed in the deposition material accommodating space, cover the conductive cover part, form a truncated cone shape, and be formed of an insulator.

The protrusion of the vapor guide part may include an opening 2231c communicating with the through hole.

18A to 18C, the linear evaporation deposition apparatus 3100 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block 2120 may discharge the steam in a lateral manner with respect to the gravity direction, which is a positive third direction. The steam providing unit 3160 may extend along the first direction and provide the steam to the buffer space in the second direction. The vapor providing unit 3160 may store a deposition material in a solid or liquid state and heat the deposition material to provide steam to the buffer space.

The steam providing unit 3160 may include a conductive crucible 2566 extending in a first direction and accommodating the deposition material and heating the deposition material to generate the steam; An auxiliary induction heating coil 2564 extending in the first direction to surround the conductive crucible and inductively heating the conductive crucible; And an auxiliary AC power supply 2568 supplying AC power to the auxiliary induction heating coil.

The conductive crucible 2566 may include a conductive crucible body 2584, a steam guide part 2611, a conductive cover part 2252, and an insulating cover part 2585. The conductive crucible body 2584 may have a rectangular parallelepiped shape extending in the first direction and formed of a conductive material and including a deposition material accommodating space 2584a accommodating the deposition material. The steam guide portion 2601 extends in the first direction and protrudes from the lower surface of the conductive crucible body 261 and a plurality of discharge through holes disposed through the protrusion and spaced apart in the first direction ( 2581b). The conductive cover 2258 may be formed of a conductor extending in the first direction and disposed in the deposition material accommodating space and covering the discharge through hole of the vapor guide part. The thermal insulation cover 2585 may be disposed in the deposition material accommodation space, cover the conductive cover, and be formed of an insulator. The protrusion of the steam guide part may include an opening 2601c communicating with the discharge through holes, respectively.

8 and 19A to 19B, the linear evaporation deposition apparatus 3200 has a buffer space extending along a first direction (x-axis direction) inside the vacuum vessel 2144 and is made of a conductive material. A buffer block 2110 formed of; A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block 2120 may be disposed to be inserted into the buffer block. An upper surface of the nozzle block may coincide with an upper surface of the buffer block. The nozzle block 2120 may discharge the steam upwardly with respect to the gravity direction, which is the negative second direction. The nozzle block 2120 may be integrally formed with the buffer block 2110. The buffer block may have a rectangular parallelepiped shape extending in the first direction. The width of the nozzle block may be smaller than the width of the buffer block.

According to a modified embodiment of the present invention, a part of the nozzle block 2120 may be disposed to be inserted into the buffer block, and an upper surface of the nozzle block may be higher than an upper surface of the buffer block.

20A to 20B, the linear evaporation deposition apparatus 3300 has a buffer space extending in a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. (2110); A nozzle block (2120) having a rectangular parallelepiped shape extending in the first direction in the vacuum container and including a plurality of through nozzles and mounted to the buffer block and formed of a conductive material; An induction heating coil (2132, 2134) disposed in the vacuum vessel to surround the nozzle block and the buffer block and inductively heating the nozzle block and the buffer block; And an AC power supply 2136 supplying AC power to the induction heating coil. The nozzle block 2120 has a predetermined length in the first direction, a predetermined height in a second direction perpendicular to the first direction, and a predetermined length in a third direction perpendicular to the first direction and the second direction. It has a width. The plurality of through nozzles are respectively formed in a second direction in communication with the buffer space of the buffer block and perpendicular to the first direction, spaced apart in the first direction, and disposed side by side to each other, and vapor in the buffer space. To discharge.

The nozzle block of the linear evaporation deposition apparatus 3300 may discharge the steam upward. The gravity direction g may be in the negative y-axis direction. The through nozzle may discharge steam to a substrate disposed above the inner side of the vacuum container against gravity.

The steam providing unit 3360 may provide the steam to the buffer space in the first direction (x-axis direction) at a side of the buffer block in the first direction. The vapor providing unit 3360 may receive a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space. The steam providing unit may provide steam to the buffer block through both ends or one end. The vapor providing portion includes a separate heating means, which may be induction heating or resistive heating.

The steam providing unit 3360 may include a conductive crucible 2466, a conductive pipe 3332, an auxiliary induction heating coil 2464, and an auxiliary AC power supply 2468.

The conductive crucible 2466 includes a deposition material accommodating space spaced apart in the second direction and extending in the first direction parallel to the buffer block and disposed at a lower position than the buffer block and accommodating the deposition material. It may have a rectangular parallelepiped shape for discharging the steam through the side of the first direction. The conductive pipe 3332 may connect an upper surface of the conductive crucible 2466 and a lower surface of the buffer block to each other. The auxiliary induction heating coil 2464 may be disposed to surround the conductive crucible and inductively heat the conductive crucible. The auxiliary AC power supply 2468 may include an auxiliary AC power supply for supplying AC power to the auxiliary induction heating coil.

8 and 21, the linear evaporation deposition apparatus 2100 has a buffer space 2112 extending along a first direction (x-axis direction) inside the vacuum container 2144 and is formed of a conductive material. A buffer block 2110 formed; A nozzle block 2120 inside the vacuum vessel 2144, having a rectangular parallelepiped shape extending in the first direction and including a plurality of through nozzles 2122 and mounted to the buffer block and formed of a conductive material; An induction heating coil 2132 disposed to enclose the nozzle block 2120 and the buffer block 2110 in the vacuum vessel 2144 and inductively heating the nozzle block 2120 and the buffer block 2110; 134); And an AC power supply 2136 supplying AC power to the

induction heating coils

For example, the through nozzle (a) comprises a steam inlet, a steam connection, and a steam outlet, the steam inlet gradually decreases in diameter as it proceeds in the discharge direction, and the steam connection has a constant diameter, and the steam outlet The diameter may gradually increase as the discharge direction progresses.

For example, the through nozzle (b) includes a steam inlet and a steam outlet, the steam inlet gradually decreases in diameter as it proceeds in the discharge direction, and the steam outlet may have a constant diameter as it progresses in the discharge direction. have.

For example, the through nozzle c may have a diameter gradually decreasing along the discharge direction.

For example, the through nozzle (d) may include a steam inlet having a constant diameter as it proceeds in the discharge direction and a steam outlet that gradually increases in diameter as it proceeds in the discharge direction.

For example, the through nozzle e may have a diameter gradually increasing in the discharge direction.

For example, the through nozzle f may include at least one or more portions whose diameters gradually increase in diameter and suddenly decrease in diameter as they progress in the discharge direction.

For example, the through nozzle g may be disposed such that a hole having a constant diameter is inclined at an arrangement plane of the nozzle block.

For example, the through nozzle h may include a nozzle inlet having a constant diameter and a nozzle outlet having a constant diameter having a diameter larger than the diameter of the nozzle inlet. A washer-shaped intermediate nozzle having a diameter smaller than the diameter of the nozzle inlet may be disposed at the boundary between the nozzle inlet and the nozzle outlet.

For example, the through nozzle i may include a nozzle inlet having a constant diameter and a nozzle outlet gradually decreasing in diameter as it proceeds in the discharge direction.

According to a modified embodiment of the present invention, the shape of the through nozzle may be variously modified.

Hereinafter, a linear evaporation deposition apparatus including a plurality of linear evaporation sources will be described.

22A to 22E, the linear evaporation deposition apparatus 4100 includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4102a and 4102b disposed inside the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

4102a and 4102b includes a conductive crucible part 4160 extending in the first direction and accommodating the deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4160 and inductively heating the conductive crucible portion 4160; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part 4160 and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block 4120. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

The deposition material 4010 may be an organic material, a conductive material, or an insulating material used for the organic light emitting diode. The deposition material 4010 may be variously changed according to a process used. Specifically, the organic material may include Tris (8-hydroxyquinolinato) aluminum (Al (C9H6NO) 3). When the deposition material 4010 is an organic material, the organic material is a solid in powder form at room temperature, and the organic material may be sublimed or evaporated near 300 degrees Celsius. The conductive crucible 4160 may be used to receive a large amount of deposition material. When the deposition material 4010 is a conductive material, the conductive material may be aluminum powder.

In a conventional linear evaporation deposition apparatus, the crucible receives and heats the deposition material. Linear nozzles are in direct communication with the crucible. In this case, when the crucible has a temperature distribution according to the position, the deposition material at a specific position locally high in temperature is quickly consumed, and the pressure decreases in the consumed region. Uneven temperature distribution or pressure distribution inhibits uniform deposition. In particular, the heating means of the conventional crucible uses a resistive heating wire, the resistive heating wire may provide a spatial temperature difference according to the contact state with the crucible. The resistive heating wire is difficult to disassemble and couple to the crucible for recharging.

According to one embodiment of the invention, a plurality of conductive crucible modules are disposed inside the vacuum vessel, induction heated and aligned in a first direction. The induction heating coil may include a conductive crucible induction heating coil for induction heating the conductive crucible and a nozzle block induction heating coil for induction heating the nozzle block. The conductive crucible module can stably perform impedance matching by reducing the inductance of the induction heating coil, and can be easily combined with each module to increase the processing area.

The induction heating coil extends along the length direction (first direction, x-axis direction) of the nozzle block 4120 and is disposed to surround the conductive crucible portion 4160 and / or the nozzle block 4120. Accordingly, the

induction heating coils

4132 and 4134 may be disposed adjacent to the conductive crucible part 4160 and / or the nozzle block 4120 to perform efficient induction heating. As the

induction heating coils

4132 and 4134 are disposed in the vacuum container 4144, the conductive crucible portion 4160 and the nozzle block 4120 may be efficiently heated. In addition, structures of the nozzle block 4120 and the conductive crucible 4160 may be variously modified.

The

induction heating coils

4132 and 4134 may have a pipe shape or a band shape, and refrigerant may flow in the induction heating coil. In addition, the induction electric field generated by the

induction heating coils

4132 and 4134 directly and spatially uniformly heats the outer circumferential surfaces of the conductive crucible portion 4160 and the nozzle block 4120 in a non-contact manner. Thus, the temperature nonuniformity due to contact is eliminated, the heating stability is improved, and the mechanical configuration is simple. The

induction heating coils

4132 and 4134 are spaced apart from the conductive crucible part 4160 and the nozzle block 4120. The support 4133 fixes the

induction heating coils

4132 and 4134. The support 4133 may be formed of an insulator, and the support 4133 may be made of ceramic or alumina. In addition, the nozzle block 4120 and the conductive crucible portion 4160 are disposed in a non-contact manner with the

induction heating coils

4132 and 4134, so that they can be easily disassembled and coupled.

According to an embodiment of the present invention, the nozzle block 4120 may include a plurality of through nozzles 4122 arranged linearly. Conventional linear nozzles include a pipe that protrudes from nozzle to nozzle. The pipe-shaped nozzle is difficult to be heated independently by resistive heating. Since the resistive heating is performed by heat conduction by contact, the conventional protruding pipe-shaped nozzle is indirectly heated through heat conduction by heating of the crucible. Therefore, independent temperature control of the pipe-shaped nozzle is difficult. Accordingly, the pipe-shaped nozzle may be blocked by deposition.

According to one embodiment of the present invention, the nozzle block 4120 is in the form of a rectangular parallelepiped extending in the first direction, and the plurality of through nozzles 4122 are linearly arranged in the nozzle block 4120. Thus, the induction heating coil can directly and directly heat the entire nozzle block 4120. The

induction heating coils

4132 and 4134 may provide a temperature gradient between the nozzle block 4120 and the conductive crucible portion 4160. Accordingly, the nozzle block 4120 may solve the clogging phenomenon due to deposition. In addition, the temperature distribution in the longitudinal direction of the nozzle block 4120 may be performed by adjusting a distance between the nozzle induction heating coil 4132 and the nozzle block 4120. For example, the spacing between the nozzle induction heating coil 4132 and the nozzle block 4120 at the central portion of the nozzle block may be designed to be greater than the spacing at the edge of the nozzle block 4120. .

The space temperature controller 4140 may be a yoke made of a magnetic material. The magnetic body constrains the magnetic flux and controls the space between the space temperature controller 4140 and the

induction heating coils

4132 and 4134 so that the space temperature controller 4140 is a spatial distribution or spatial temperature of the induction electric field. You can control the distribution. The space temperature controller 4140 may include a moving unit for adjusting the interval. The space temperature controller 4140 may be spaced apart from the induction heating coil in a second direction to restrain the magnetic flux.

The vacuum container 4144 may be formed of a conductive material. The vacuum container 4144 may be a chamber having a rectangular parallelepiped structure. The vacuum container 4144 may be evacuated in a vacuum state by a vacuum pump. The vacuum container 4144 may include a substrate holder (not shown) and a substrate 4146 mounted to the substrate holder. The vacuum container 4144 may include a shadow mask disposed on the front surface of the substrate to perform patterning.

The substrate 4146 may be a glass substrate or a plastic substrate including an organic light emitting diode. The substrate 4146 may be a quadrangular substrate.

The nozzle block 4120 of the linear evaporation deposition apparatus 4100 may discharge the steam in a bottom-up manner against gravity. Specifically, the gravity direction g may be a second negative direction (negative y-axis direction). The through nozzle 4122 may discharge steam to the substrate 4146 disposed above the inner side of the vacuum container 4144 against gravity.

In the case of the bottom-up evaporation deposition apparatus, the through nozzle 4122 discharges steam toward the upper surface of the vacuum vessel. In the case of the top-down evaporation deposition apparatus, the through nozzle 4122 discharges steam toward the lower surface of the vacuum vessel. In the case of the lateral evaporation deposition apparatus, the through nozzle 4122 may discharge steam toward the side of the vacuum vessel.

The conductive crucible 4160 may be formed of a metal material having high electrical conductivity. For example, the conductive crucible portion 4160 may be stainless steel, copper, tantalum, titanium, tungsten, or nickel. The conductive crucible 4160 may extend in the first direction (x-axis direction). The second direction (y-axis direction) may be opposite to the gravity direction (g direction). The conductive crucible part 4160 may have a rectangular parallelepiped shape extending in the first direction.

The conductive crucible part 4160 may have an alignment groove 4165 extending in a first direction on an upper surface thereof. A through slit 4166 extending in the first direction may be disposed in the alignment groove 4165. The nozzle block 4120 may be inserted into the alignment groove 4165 to be fixed by means of welding or the like. Accordingly, the vapor of the deposition material accommodating space 4160a of the conductive crucible part 4160 may be discharged in the second direction through the through slit 4166 and the through nozzles 4122.

Outlets of the through nozzles 4122 of the nozzle block may be disposed toward the second direction. The nozzle block 4120 may have a rectangular parallelepiped shape extending in a first direction. The length of the nozzle block 4120 may be several tens of cm and several meters. The nozzle block 4120 may have a width of several millimeters to several centimeters. The height of the nozzle block 4120 may be several millimeters to several tens of millimeters. The width of the nozzle block 4120 may be smaller than the height of the nozzle block.

The nozzle block 4120 may be disposed on an upper surface of the conductive crucible portion 4160, and the conductive crucible portion 4160 and the nozzle block 4120 may be integrally formed. The width of the nozzle block 4120 in the third direction (z-axis direction) may be smaller than the width of the conductive crucible portion 4160.

The plurality of through nozzles 4122 may discharge the vapor upwards in a direction opposite to the gravity direction to deposit organic materials on the substrate 4146 disposed above the vacuum container.

Preferably, the through nozzle 4122 may have a cylindrical shape penetrating the nozzle block 4120. An aspect ratio of the through nozzle may be 5 to 100. The through nozzle 4122 may have a diameter of several hundred micrometers to several millimeters. The spacing between neighboring through nozzles 4122 may be 1.2 to 5 times the diameter of the through nozzles. It may be preferable that the diameter of the through nozzle 4122 is smaller than the average free path of steam. When the nozzle block 4120 is in the form of a rectangular parallelepiped extending in the first direction, the nozzle block 4120 may be heated as a whole, and the through nozzles may maintain a uniform temperature as a whole.

The sum of the cross-sectional areas of the through nozzles 4122 may be smaller than the cross-sectional area cut in the width direction of the conductive crucible 4160. Accordingly, the steam can maintain a spatially constant pressure inside the conductive crucible portion.

The plurality of through nozzles 4122 are in communication with the deposition material storage space 4160a of the conductive crucible portion, are formed along the second direction (y-axis direction), and are spaced apart in the first direction (x-axis direction). Arranged in parallel with each other, the vapor of the deposition material accommodating space 4160a is discharged.

The through nozzles 4122 may be arranged to be aligned in a first direction. The through nozzle may be arranged in one row, two rows, or three rows. In the case of three lines, the first line and the third line may be arranged to be offset in the second line and the first direction. The diameter or density of the plurality of through nozzles 4122 of the nozzle block may be greater at both ends in the first direction than the center of the arranged nozzle blocks. Accordingly, depending on the position, a uniform thin film can be deposited. When there are two

conductive crucible modules

4102a and 4102b, the right side of the first conductive crucible module 4102a and the left side of the second conductive crucible module 4102b may have a larger nozzle diameter. Alternatively, when there are two

conductive crucible modules

4102a and 4102b, the right side of the first conductive crucible module 4102a and the left side of the second conductive crucible module 4102b may have a higher nozzle density.

According to a modified embodiment of the present invention, the diameter of the through nozzle 4122 may be larger than the central portion of the nozzle block at both ends of the arrayed nozzle block in the first direction.

The nozzle block 4120 may be formed of the same material as the conductive crucible part 4160. The nozzle block 4120 may be integrally manufactured by the conductive crucible part 4160 and welding techniques. Temperature measuring means for measuring temperature may be disposed in the nozzle block and the conductive crucible part, respectively. The temperature measuring means may be a thermocouple. The nozzle block 4120 and the conductive crucible 4160 may be controlled to maintain a set temperature, respectively.

The conductive crucible part 4160 and the nozzle block 4120 may be inductively heated. For induction heating,

induction heating coils

4132 and 4134 and alternating current power 4136 may be used. The frequency of the AC power supply 4336 may be several tens of kHz to several MHz. The nozzle block induction heating coil 4132 and the conductive crucible induction heating coil 4134 may be connected to each other in series and then connected to the AC power supply 4136. The AC power supply 4136 may supply power to the nozzle block induction heating coil 4132 and the conductive crucible induction heating coil 4134 through an impedance matching circuit 4137. The impedance matching circuit may have a structure such as a transformer. The AC power supply 4136 may be disposed outside the vacuum container 4144, and the impedance matching circuit 4137 may be disposed inside the vacuum container 4144.

The

induction heating coils

4132 and 4134 may be insulated from the conductive crucible part 4160 and the nozzle block 4120. For insulation, the

induction heating coils

4132 and 4134 may be spaced apart from the conductive crucible portion and the nozzle block. The support part 4133 may support and fix the

induction heating coils

4132 and 4134. The support part 4133 may be formed of an insulator such as ceramic or alumina. The induction heating coil may be in the form of a pipe having a rectangular cross section, in the form of a pipe having a circular cross section, or in the form of a strip. The spacing between the induction heating coil and the conductive crucible portion 4 or the nozzle block may be designed differently depending on the position for temperature control. The

induction heating coils

4132 and 4134 may include a crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4160 and a nozzle block induction heating coil 4132 disposed to surround the nozzle block 4120. It may include. The conductive crucible induction heating coil 4134 and the nozzle block induction heating coil 4132 may be connected in series.

The vertical distance between the

induction heating coils

4132 and 4134 and the conductive crucible portion or the vertical distance between the

induction heating coils

4132 and 4134 and the nozzle block 4120 may be changed as it proceeds along the first direction. Can be.

Each conductive crucible module may be installed for each module. Each conductive crucible module may include an AC power source.

The heat reflection unit 4150 may be disposed to surround the conductive crucible modules. The heat reflection unit 4150 may reflect the radiant energy of the heated conductive crucible module not to be emitted to the outside. The heat reflection unit 4150 may be manufactured by bending a metal plate having high reflection efficiency. Cooling pipes 4152 through which a refrigerant flows may be installed outside the heat reflection unit 4150.

The linear evaporation deposition apparatus 4100 may include a linear motion unit 4170 that provides linear motion to the conductive crucible module. The linear movement unit 4170 may provide a linear movement (linear movement in the z-axis direction) to the nozzle block and the conductive crucible portion 4160. Accordingly, the nozzle block 4120 linearly moving may deposit a uniform thin film on all surfaces of the substrate while the substrate 4146 is fixed.

Referring to FIGS. 22 and 23, the linear evaporation deposition apparatus 4100a includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4102a and 4102b includes a conductive crucible part 4160 extending in the first direction and accommodating the deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4160 and inductively heating the conductive crucible portion 4160; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

When two

conductive crucible modules

4102a and 4102b are disposed, there is one AC power supply 4136. One AC power supply 4136 supplies nozzle block induction heating coils 4132 and conductive crucible induction heating coils 4134.

The nozzle block induction heating coil 4132 and the conductive crucible induction heating coil 4134 of each of the conductive crucible modules are connected in series with each other. The AC power supply 4136 may distribute power for each module to the nozzle block induction heating coil and the conductive crucible induction heating coil.

22, 24A, and 24B, the linear evaporation deposition apparatus 4100b includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4102a, 4102b, 4102c disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

4102a, 4102b, and 4102c includes a conductive crucible portion 4160 extending in the first direction and accommodating a deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4160 and inductively heating the conductive crucible portion 4160; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

The second conductive crucible module 4102b is disposed between the first conductive crucible module 4102a and the third conductive crucible module. The spatial distribution or shape of the through nozzle 4122 of the second conductive crucible module 4102b may be set differently from the spatial distribution or shape of the through nozzle 4122 of the first conductive crucible module 4102a and the third conductive crucible module. Can be. Accordingly, a uniform thin film may be deposited along the first direction.

For example, the nozzle diameters of the left side of the first conductive crucible module 4102a and the third conductive crucible module 4102c may be larger than the diameters of the second conductive crucible module 4102b.

In addition, the nozzle densities of the left side of the first conductive crucible module 4102a and the third conductive crucible module 4102c may be greater than the density of the second conductive crucible module 4102b.

25C is a cutaway perspective view of the conductive crucible module of the linear evaporation deposition apparatus of FIG. 25A.

25A to 25C, the linear evaporation deposition apparatus 4200 includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4202a and 4202b disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

4202a and 4202b includes a conductive crucible portion 4260 extending in the first direction and accommodating a deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4260 and inductively heating the conductive crucible portion 4260; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side to discharge the steam.

The

conductive crucible modules

4202a and 4202b may provide steam to the substrate in a top-down manner against gravity. The nozzle block 4120 of the linear evaporation deposition apparatus 4200 may discharge the vapor downward in the direction of gravity. Specifically, the gravity direction g may be a second direction (positive y-axis direction). The through nozzle 4122 may discharge steam to the substrate 4146 disposed below the inner side of the vacuum container 4144 in the direction of gravity.

The through nozzle may discharge the steam in a downward direction in the gravity direction, which is the second positive direction.

The conductive crucible part 4260 may include a crucible body 4264, a steam guide part 4421, a conductive cover part 4426, and an insulating cover part 4265. The crucible body 4264 may include a deposition material accommodating space 4260a extending in the first direction. The vapor guide portion 4421 passes through the protrusion 4241a protruding from the lower surface of the deposition material accommodating space 4260a and the guide through hole 4421b respectively aligned with the through nozzle 4122. ) May be provided. The conductive cover part 4426 may cover the vapor guide part 4421. The heat insulation cover part 4265 may cover the conductive cover part 4426. The steam guide part 4421 may include a guide opening 4421c for communicating the protrusion part 4421a and the guide through hole 4421b. The guide through hole 4421b may be aligned with the through nozzle 4122.

The steam may be provided to the guide through hole 4421b through the guide opening 4421c. The steam may be discharged through the guide through hole 4421b and the through nozzle 4122. The diameter of the guide through hole 4421b may be larger than the diameter of the through nozzle 4122.

The crucible body 4264 may have a rectangular parallelepiped shape extending in the first direction and include a deposition material accommodating space 4260a therein. The deposition material 4010 may be stored in the deposition material accommodation space 4260a. The deposition material 4010 may be an organic material used for an organic light emitting diode. The deposition material accommodating space 4260a may extend in the first direction in a rectangular cylinder structure.

The vapor guide portion 4421 may protrude in a second direction from the lower surface of the deposition material accommodating space 4260a and may extend in the first direction. The steam guide part 4421 may be integrally formed with the crucible body 4264. The steam guide part 4421 may include a guide through hole 4421b penetrating the protrusion part 4421a in a second direction and spaced apart at regular intervals in the first direction. The protrusion 4421a may function as a jaw to prevent the deposition material 4010 from overflowing. The steam guide portion 4421 may be formed of a metal having the same material as the crucible body. The upper surface of the steam guide portion 4421 may have a guide opening 4421c extending in a third direction. The side of the vapor guide portion 4421 may be filled with a deposition material. As the sidewalls of the vapor guide portion 4421 and the crucible body 4264 are induction heated, evaporated or sublimed deposition material may be sprayed along the guide through hole 4421b and the through nozzle 4122.

The conductive cover part 4426 may be formed of a conductive material having high electrical conductivity. The conductive cover portion may be in the form of a plate extending in the first direction and bent.

The conductive cover part 4426 may cover the vapor guide part 4421 and be formed of a conductor. The conductive cover part 4426 may be heated by induction electric field or thermal contact with the steam guide part 4421. Accordingly, the deposition material may not be deposited on the conductive cover portion 4426. When storing a large amount of deposition material, the conductive cover portion 4426 may be locked by the deposition material.

The conductive cover portion 4426 and the steam guide portion 4421 may be coupled to each other to provide a movement passage of steam. Accordingly, the deposition material may be injected through the guide through hole 4421b of the vapor guide part 4421. The steam guide part 4421 and the conductive cover part 4426 may be heated to about 300 degrees Celsius.

On the other hand, the heat insulating cover 4265 may be disposed on the conductive cover portion 4426 so that the conductive cover portion 4426 does not heat the deposition material on the conductive cover portion 4426. The insulation cover part 4265 may have a plate shape extending in the first direction. The thermal insulation cover 4265 may be an insulator. Specifically, the heat insulating cover 4265, which has good heat insulating properties, may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

The heat insulation plate 4267 may be disposed along sidewalls of the deposition material accommodating space 4260a. The lower side surface of the deposition material accommodating space may have a groove to insert the heat insulating plate. The heat insulating plate 4267 may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

Grooves 4264a may be formed between the heat insulating plate 4267 and the inner wall of the crucible body 4264. The groove 4264a may minimize heat transfer between the heat insulation plate 4267 and the sidewall of the crucible body 4264.

An upper plate 4269 may be disposed on the upper surface of the crucible body 4264 to press the sealing plate 4268 and the sealing plate 4268. The upper plate 4269 may be coupled to the crucible body to press the sealing plate 4268. Accordingly, the deposition material accommodating space 4260a may be sealed by the sealing plate. The sealing plate and the upper plate may have a plate shape extending in the first direction.

Referring to FIGS. 26A and 26B, the linear evaporation deposition apparatus 4400 includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4402a and 4402b disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

4402a and 4402b includes a conductive crucible unit 4460 extending in the first direction and accommodating the deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4560 and inductively heating the conductive crucible portion 4460; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

The through nozzle 4122 may discharge the steam in a lateral manner with respect to the gravity direction g, which is the positive third direction. The gravity direction is the third direction, and the nozzle block 4120 may be disposed to extend in a direction perpendicular to gravity at an upper side surface of the conductive crucible portion 4460.

The

conductive crucible modules

4402a and 4402b may provide vapor to the substrate in a lateral manner. The conductive crucible portion 4460 includes a deposition material accommodating space 4460a extending in the first direction, and the nozzle block 4120 is disposed to protrude in two directions from an upper side of the conductive crucible 4460. And discharge the steam in the second direction perpendicular to the direction of gravity.

Referring to FIGS. 27A and 27B, the linear evaporation deposition apparatus 4500 may include a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4502a and 4502b disposed inside the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

4502a and 4502b includes a conductive crucible portion 4560 extending in the first direction and accommodating a deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4560 and inductively heating the conductive crucible portion 4560; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side to discharge the steam.

The nozzle block 4120 may be inserted into the conductive crucible portion 4560, and the conductive crucible induction heating coil 4134 and the nozzle block induction heating coil 4132 may be integrated.

The nozzle block 4120 may be disposed to be inserted into the conductive crucible portion 4560. An upper surface of the nozzle block 4120 may coincide with an upper surface of the conductive crucible portion 4560. In this case, the conductive crucible induction heating coil and the nozzle block induction heating coil may be integrated to surround the conductive crucible portion 4560.

The nozzle block 4120 of the linear evaporation deposition apparatus 4500 may discharge the steam in a bottom-up manner against gravity. Specifically, the gravity direction g may be a second negative direction (negative y-axis direction). The through nozzle 4122 may discharge steam to the substrate 4146 disposed above the inner side of the vacuum container 4144 against gravity.

28A to 28E, the linear evaporation deposition apparatus 4700 includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4702a and 4702b disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

4702a and 4702b includes a conductive crucible portion 4760 extending in the first direction and accommodating the deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4760 and inductively heating the conductive crucible portion 4760; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

The

conductive crucible module

4702a and 4702b includes a buffer block 4138 having a buffer space extending along the first direction and formed of a conductive material; And a buffer block induction heating coil 4139 disposed to surround the buffer block and inductively heating the buffer block. The buffer block 4138 transfers the vapor provided by the conductive crucible portion 4760 to the nozzle block 4120.

The

conductive crucible modules

4702a and 4702b may include an AC power supply 4336 for supplying power to the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 connected in series with the conductive crucible module; And an auxiliary AC power supply 4768 for supplying power to the conductive crucible induction heating coil 4134 of the conductive crucible module.

The conductive crucible portion 4760 is disposed under the buffer block 4138 and provides the vapor to the buffer space in the second direction. The nozzle block 4120 is disposed on an upper portion of the buffer block and discharges the steam upwardly in a direction opposite to the gravity direction. The conductive crucible portion 4760 accommodates a solid or liquid deposition material, and heats the deposition material to provide steam to the buffer space.

According to one embodiment of the present invention, a plurality of

conductive crucible modules

4702a, 4702b are disposed inside the vacuum vessel 4144 to be induction heated and aligned in a first direction. The induction heating coil includes a conductive crucible induction heating coil 4134 for induction heating the conductive crucible, a buffer block induction heating coil 4139 for induction heating the buffer block, and a nozzle block induction heating coil for induction heating the nozzle block ( 4132). The conductive crucible module can stably perform impedance matching by reducing the inductance of the induction heating coil, and can be easily combined with each module to increase the processing area.

The nozzle block induction heating coil 4132 is disposed to surround the nozzle block 4120 while extending along an extension direction (fourth direction, x-axis direction) of the nozzle block 4120. Accordingly, the nozzle block induction heating coil 4132 may be disposed adjacent to the nozzle block 4120 to perform efficient induction heating. As the nozzle block induction heating coil 4132 is disposed inside the vacuum container 4144, the nozzle block 4120 may be efficiently heated. In addition, structures of the nozzle block 4120 and the conductive crucible 4160 may be variously modified.

The nozzle block induction heating coil 4132 may have a pipe shape or a band shape, and refrigerant may flow in the nozzle block induction heating coil. In addition, the induction electric field generated by the nozzle block induction heating coil 4132 is non-contact, and directly and spatially uniformly heats along the outer circumferential surface of the nozzle block 4120. Thus, the temperature nonuniformity due to contact is eliminated, the heating stability is improved, and the mechanical configuration is simple. The nozzle block induction heating coil 4132 is spaced apart from the nozzle block 4120.

The nozzle block 4120 may include a plurality of through nozzles 4122 arranged linearly. Conventional linear nozzles include pipes for each nozzle. The pipe-shaped nozzle is difficult to be heated independently by resistive heating. Since the resistive heating is performed by heat conduction by contact, the conventional pipe-shaped nozzle is indirectly heated through heat conduction by heating of the crucible. Therefore, independent temperature control of the pipe-shaped nozzle is difficult. Accordingly, the pipe-shaped nozzle may be blocked by deposition.

According to one embodiment of the present invention, the nozzle block 4120 is in the form of a rectangular parallelepiped extending in the first direction, and the plurality of through nozzles 4122 are linearly arranged in the nozzle block 4120. Accordingly, the nozzle block induction heating coil may directly and directly heat the entire nozzle block 4120. In addition, the temperature distribution in the longitudinal direction of the nozzle block 4120 may be performed by adjusting a distance between the nozzle block induction heating coil 4132 and the nozzle block 4120. For example, the spacing between the nozzle block induction heating coil 4132 and the nozzle block 4120 at the center portion of the nozzle block may be designed to be greater than the spacing at the edge of the nozzle block 4120. have.

The nozzle block 4120 of the linear evaporation deposition apparatus 4700 may discharge the steam in a bottom-up manner against gravity. Specifically, the gravity direction 4g may be a negative second direction (four y-axis directions). The through nozzle 4122 may discharge steam to the substrate 4146 disposed above the inner side of the vacuum container 4144 against gravity.

The conductive crucible 4760 may be formed of a metal material having high electrical conductivity. For example, the conductive crucible portion 4760 may be stainless steel, copper, tantalum, titanium, tungsten, or nickel. The conductive crucible portion 4760 may extend in the first direction (x-axis direction). The second direction (y-axis direction) may be opposite to the gravity direction (g direction). The conductive crucible portion 4760 may have a rectangular parallelepiped shape extending in the first direction.

The conductive crucible portion 4760 may have a rectangular parallelepiped shape extending in a first direction, and a slit 4471 extending in the first direction may be disposed on an upper surface of the conductive crucible portion 4760. Through the slit 4471, steam may be delivered to the buffer block.

The buffer block 4138 may be aligned with the conductive crucible and extend in the first direction. A buffer slit 4138a extending in the first direction may be disposed on an upper surface of the buffer block so that the lower surface of the nozzle block 4120 may be coupled thereto.

The nozzle block 4120 may be disposed on an upper surface of the buffer block 4138. The conductive crucible part 4760, the buffer block 4138, and the nozzle block 4120 may be integrally formed. The width of the nozzle block 4120 in the third direction (z-axis direction) may be smaller than the width of the buffer block 4138.

The plurality of through nozzles 4122 may discharge the steam upwardly in a direction opposite to the gravity direction to deposit organic materials on the substrate 4146 disposed above the vacuum container.

The sum of the cross-sectional areas of the through nozzles 4122 may be smaller than the cross-sectional area cut in the width direction of the buffer block 4138. Accordingly, the vapor may maintain a spatially constant pressure inside the buffer block 4138.

The plurality of through nozzles 4122 are in communication with the buffer space of the buffer block 4138, are respectively formed along the second direction (y-axis direction), and are spaced apart in the first direction (x-axis direction) and are parallel to each other. Is disposed, and the steam is discharged.

The through nozzles 4122 may be arranged to be aligned in a first direction. The through nozzle may be arranged in one row, two rows, or three rows. In the case of three lines, the first line and the third line may be arranged to be offset in the second line and the first direction. The diameter or density of the plurality of through nozzles 4122 of the nozzle block may be greater at both ends of the first direction than at the center of the nozzle block. Accordingly, depending on the position, a uniform thin film can be deposited.

According to a modified embodiment of the present invention, the diameter of the through nozzle 4122 may be larger than the central portion of the nozzle block at both ends in the first direction of the nozzle block.

The nozzle block 4120 may be formed of the same material as the buffer block 4138. The nozzle block 4120 may be manufactured integrally with the buffer block 4138 by welding techniques. Temperature measuring means for measuring temperature may be disposed in the nozzle block and the buffer block 4138, respectively. The temperature measuring means may be a thermocouple. The nozzle block 4120 and the buffer block 4138 may be controlled to maintain a set temperature, respectively.

The conductive crucible part 4760, the buffer block 4138, and the nozzle block 4120 may be inductively heated. For induction heating, an induction heating coil and an alternating current power source can be used. The frequency of the AC power supply 4336 may be several tens of kHz to several MHz. The nozzle block induction heating coil 4132 and the buffer block induction heating coil 4139 may be connected in series with each other and then connected to the AC power supply 4136. The AC power supply 4136 may supply power to the nozzle block induction heating coil 4132 and the buffer block induction heating coil 4139 through an impedance matching circuit 4137. The impedance matching circuit may have a structure such as a transformer. The AC power supply 4136 may be disposed outside the vacuum container 4144, and the impedance matching circuit 4137 may be disposed inside the vacuum container 4144.

The conductive crucible induction heating coil 4134 may be disposed to surround the conductive crucible portion 4760 and may be connected to the auxiliary AC power source 4768 through the auxiliary impedance matching circuit 4767.

The

induction heating coils

4132 and 139 may be insulated from the buffer block 4138 and the nozzle block 4120. For insulation, the

induction heating coils

4132 and 139 may be spaced apart from the buffer block 4138 and the nozzle block. The conductive crucible induction heating coil 4134 may be insulated from the conductive crucible portion 4760.

The heat reflection unit 4150 may be disposed to surround the

conductive crucible modules

4702a and 4702b. The heat reflection unit 4150 may reflect the radiant energy of the heated conductive crucible module not to be emitted to the outside. The heat reflection unit 4150 may be manufactured by bending a metal plate having high reflection efficiency. Cooling pipes 4152 through which a refrigerant flows may be installed outside the heat reflection unit 4150.

The linear evaporation deposition apparatus 4700 may include a linear motion unit that provides a linear motion to the conductive crucible module. The linear motion part may provide a linear motion (z-axis linear motion) to the nozzle block, the buffer block, and the conductive crucible part 4760. Accordingly, the nozzle block 4120 linearly moving may deposit a uniform thin film on all surfaces of the substrate while the substrate 4146 is fixed.

28 and 29A, the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 of the

conductive crucible modules

4702a and 4702b may be connected in series. The power distributor 4135 may distribute power to the conductive crucible induction heating coil 4134 connected in parallel with the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 connected in series. The AC power supply 4136 distributes power to the conductive crucible induction heating coil 4134 connected in parallel with the buffer block induction heating coil and the nozzle block

induction heating coil

4139 and 4132 connected in series through the power distribution unit 4135. Can be. The power distribution unit 4135 may include a variable capacitor, and the variable reactance may distribute power by changing an impedance.

28 and 29B, the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 of the

conductive crucible modules

4702a and 4702b may be connected in series. The AC power supply 4136 may supply power to the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 connected in series through an impedance matching unit 4137. The auxiliary AC power source 4768 may supply power to the conductive crucible induction heating coil 4134 through the auxiliary impedance matching unit 4671.

The AC power supply 4136 may supply power to the buffer block induction heating coils and the nozzle block

induction heating coils

4132 and 139 of the plurality of conductive crucible modules 4702a and 702b connected in parallel. The auxiliary AC power source 4768 may supply power to the conductive crucible induction heating coil 4134 of the plurality of

conductive crucible modules

4702a and 4702b connected in parallel.

28 and 29C, the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 of the

conductive crucible modules

4702a and 4702b may be connected in series. The AC power supply 4136 may supply power to the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 connected in series. The power distribution unit 4135 may distribute power to the serially connected buffer block induction heating coil and the nozzle block

induction heating coil

4139 and 4132 and the conductive crucible induction heating coil 4134. The buffer block induction heating coils and the nozzle block

induction heating coils

4132 and 139 of the plurality of conductive crucible modules may be connected in parallel to each other. The conductive crucible induction heating coils 4134 of the plurality of conductive crucible modules may be connected in parallel to each other.

28 and 29D, the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 of the

conductive crucible modules

4702a and 4702b may be connected in parallel. The AC power supply 4136 may supply power to the buffer block induction heating coil 4139 and the nozzle block induction heating coil 4132 connected in parallel. The power distributor 4135 may distribute power to the buffer block induction heating coil and nozzle block

induction heating coils

4139 and 4135 and the conductive crucible induction heating coil 4134 connected in parallel. The buffer block induction heating coils and the nozzle block

induction heating coils

4139 and 4135 of the plurality of conductive crucible modules may be connected in parallel to each other. The conductive crucible induction heating coils 4134 of the plurality of conductive crucible modules may be connected in parallel to each other.

30A to 30C, the linear evaporation deposition apparatus 4900 includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

4902a and 4902b disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

4902a and 4902b includes a conductive crucible portion 4960 extending in the first direction and accommodating the deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible portion 4960 and inductively heating the conductive crucible portion 4960; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side to discharge the steam.

The

conductive crucible modules

4902a and 4902b are connected to each other to connect the conductive crucible part 4960 and the buffer block 4138 that extend in parallel to each other in a third direction perpendicular to the first and second directions. (4962). The conductive crucible induction heating coil 4134 may be disposed to surround the connection block 4962. The connection block 4962 may connect the buffer block and the conductive crucible to each other.

The

conductive crucible modules

4902a and 4902b are connected to each other to connect the conductive crucible part 4960 and the buffer block 4138 that extend in parallel to each other in a third direction perpendicular to the first and second directions. (4962). The conductive crucible induction heating coil 4134 may be disposed to surround the connection block 4962. The connection block 4962 may connect the buffer block 4138 and the conductive crucible portion 4960 with each other.

The conductive crucible portion 4960 extends in the first direction and is formed of a conductive material, and has a rectangular parallelepiped conductive crucible body 4984 including a deposition material accommodation space accommodating the deposition material; A vapor guide part 4981 which protrudes from a lower surface of the conductive crucible body and includes a plurality of discharge through holes penetrating through the protrusions and spaced apart from each other in the first direction; A conductive cover portion 4982 extending in the first direction and disposed in the deposition material accommodation space and covering the discharge through hole of the vapor guide portion and formed of a conductor; And an insulation cover portion 4985 disposed in the deposition material accommodation space and covering the conductive cover portion and formed of an insulator. The protrusion of the steam guide part may include an opening 4981c that communicates with the discharge through hole 4981b, respectively.

The nozzle block 4120 may discharge the steam upwardly with respect to the gravity direction, which is the negative second direction. The conductive crucible portion 4960 may be disposed in parallel with the buffer block, extend in the first direction, and provide the vapor to the buffer space in the third direction. The conductive crucible unit 4960 may receive a solid or liquid deposition material and heat the deposition material to provide steam to the buffer space.

The conductive crucible portion 4960 may include a conductive crucible body 4842, a steam guide portion 4818, a conductive cover portion 4828, and a thermal insulation cover portion 4859. The conductive crucible body 4984 may have a rectangular parallelepiped shape extending in the first direction and formed of a conductive material, and including a deposition material accommodating space 4984a accommodating the deposition material. The steam guide portion 4981 protrudes from a lower surface of the conductive crucible body and extends in the first direction, and a plurality of discharge through holes penetrating the protrusion and spaced apart in the first direction. 4981b). The conductive cover portion 4982 may extend in the first direction and be disposed in the deposition material accommodating space to cover the discharge through hole of the vapor guide portion and be formed of a conductor. The insulation cover portion 4985 may be disposed in the deposition material accommodating space and may cover the conductive cover portion and be formed of an insulator. The protrusion 4981a of the steam guide part may include an opening 4981c communicating with the discharge through hole 4981b, respectively. The opening 4981c may penetrate the protrusion 4981a in the third direction.

The steam may be provided to the discharge through hole 4981b through the opening 4981c. The steam may be provided to the buffer space through the discharge through hole 4981b and discharged through the through nozzles.

The conductive crucible body 4984 may have a rectangular parallelepiped shape extending in the first direction, and include a deposition material accommodating space 4984a therein. The deposition material 4010 may be stored in the deposition material accommodating space 4984a. The deposition material 4010 may be an organic material used for an organic light emitting diode. The deposition material accommodating space 4984a may extend in the first direction in a rectangular cylinder structure.

The vapor guide portion 4981 may protrude from the lower surface of the deposition material accommodating space 4848a and may extend in the first direction. The steam guide portion 4981 may be integrally formed with the conductive crucible body 4848. The steam guide portion 4981 may include a discharge through hole 4981b that passes through the protrusion and is spaced at a predetermined interval in the first direction. The protrusion 4981a may function as a jaw to prevent the deposition material 4010 from overflowing. The steam guide portion 4981 may be formed of a metal having the same material as the conductive crucible body. The upper surface of the steam guide portion 4981 may have an opening 4981c extending in the third direction. The side surface of the vapor guide portion 4981 may be filled with a deposition material. As the sidewalls of the vapor guide portion 4981 and the conductive crucible body 4848 are induction heated, vaporized or sublimed deposition material may be sprayed along the vapor guide portion 4981.

The conductive cover portion 4982 may be formed of a conductive material having high electrical conductivity. The conductive cover portion may be in the form of a plate extending in the first direction and bent. The conductive cover portion 4982 may cover the vapor guide portion 4981 and be formed of a conductor. The conductive cover portion 4982 may be heated by induction electric field or thermal contact with the steam guide portion 4981. Accordingly, the deposition material may not be deposited on the conductive cover portion 4982. When accommodating a large amount of deposition material, the conductive cover 4982 may be locked by the deposition material.

The conductive cover 4982 and the steam guide portion 4981 may be coupled to each other to provide a passage for moving the steam. Accordingly, the deposition material may be injected through the torch through hole 4981b of the vapor guide portion 4981. The steam guide portion 4981 and the conductive cover portion 4982 may be heated to about 300 degrees Celsius. Meanwhile, the conductive cover 4982 is deposited on the conductive cover 4982.

Insulating cover portion 4985 may be disposed on the conductive cover portion 4982 so as not to heat the material. The insulation cover portion 4985 may have a plate shape extending in a first direction. The heat insulation cover portion 4985 may be an insulator. Specifically, the heat insulating cover portion 4985, which has good heat insulating properties, may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

Insulating plate 4987 may be disposed along sidewalls of the deposition material accommodating space 4984a. The insulation plate 4987 may be a quarts, a porous insulator, or a heat insulating material made of glass fiber.

Grooves may be formed between the insulating plate and the inner wall of the conductive crucible body. The groove may minimize heat transfer between the heat insulation plate 4987 and sidewalls of the conductive crucible body 4848.

An upper surface 4989 of the conductive crucible body 4984 may be disposed on the sealing plate 4888 and the sealing plate 4888. The upper plate 4989 may be combined with the conductive crucible body to press the sealing plate 4888. Accordingly, the deposition material accommodating space 4984a may be sealed by the sealing plate. The sealing plate and the upper plate may have a plate shape extending in the first direction.

An AC power supply 4136 supplies power to the nozzle block induction heating coil 4132 and the buffer block induction heating coil 4139, and an auxiliary AC power supply 4946 supplies power to the conductive crucible induction heating coil 4134. Can be.

31A and 31B, the linear evaporation deposition apparatus 5000 includes a vacuum container 4144 for storing a substrate 4146 therein and evacuating it in a vacuum state; And a plurality of conductive crucible modules 5002a and 5002b disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the conductive crucible modules 5002a and 5002b includes a conductive crucible 5050 extending in the first direction and accommodating the deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible 5050 and inductively heating the conductive crucible 5050; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

The conductive crucible modules 5002a and 5002b include a buffer block 4138 having a buffer space extending along the first direction and formed of a conductive material; And a buffer block induction heating coil 4139 disposed to surround the buffer block and inductively heating the buffer block. The buffer block 4138 transfers the steam provided by the conductive crucible part 41060 to the nozzle block 4120.

The conductive crucible modules 5002a and 5002b are connected to each other to connect the conductive crucible parts 5060 and the buffer block 4138 that extend in parallel to each other in a third direction perpendicular to the first and second directions. 5062 may be included. The conductive crucible induction heating coil 4134 may be disposed to surround the connection block 41062. The connection block 5032 may connect the buffer block and the conductive crucible to each other.

The nozzle block 4120 may discharge steam in the direction of gravity. The conductive crucible portion 5060 accommodates evaporation deposition material and heats it to vaporize. The vapor is provided to the buffer block via the connection block. Vapor provided to the buffer block is discharged through the through nozzles 4122.

The AC power supply 4136 supplies power to the nozzle block induction heating coil 4132 and the buffer block induction heating coil 4139, and the auxiliary AC power supply 5068 supplies power to the conductive crucible induction heating coil 4134. Can be.

32A and 32B, the linear evaporation deposition apparatus 5100 includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

5102a and 5102b disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

5102a and 5102b includes a conductive crucible part 5160 extending in the first direction and accommodating the deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible part 5160 and inductively heating the conductive crucible part 5160; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

The

conductive crucible modules

5102a and 5102b include a buffer block 4138 having a buffer space extending along the first direction and formed of a conductive material; And a buffer block induction heating coil 4139 disposed to surround the buffer block and inductively heating the buffer block. The buffer block delivers the vapor provided by the conductive crucible part to the nozzle block.

The conductive crucible portion 5160 is disposed above the buffer block 4138 and provides the vapor to the buffer space in the second direction. The nozzle block 4120 is disposed below the buffer block 4138 and discharges the vapor downward in the direction of gravity. The conductive crucible part 5160 accommodates a solid or liquid deposition material, and heats the deposition material to provide steam to the buffer space.

The conductive crucible part 5160 extends in the first direction and is formed of a conductive material, and has a rectangular parallelepiped conductive crucible body 5518 including a deposition material accommodation space accommodating the deposition material; A steam guide part including a protrusion 5181a extending in the first direction and protruding from the lower surface of the conductive crucible body and a plurality of discharge through holes 551b penetrating the protrusion and spaced apart in the first direction. 5181; A conductive cover portion 5222 extending in the first direction and disposed in the deposition material receiving space and covering the discharge through holes of the vapor guide portion and formed of a conductor; And a heat insulation cover part 5185 disposed in the deposition material accommodation space and covering the conductive cover part 5852 and formed of an insulator. The protrusion 5181a of the steam guide portion 5801 includes openings 5181c communicating with the discharge through holes, respectively.

The AC power supply 4136 supplies power to the nozzle block induction heating coil 4132 and the buffer block induction heating coil 4139, and the auxiliary AC power supply 5168 supplies power to the conductive crucible induction heating coil 4134. Can be.

33A to 33C, the linear evaporation deposition apparatus 5200 includes a vacuum container 4144 that houses a substrate 4146 therein and is evacuated in a vacuum state; And a plurality of

conductive crucible modules

5202a and 5202b disposed in the vacuum vessel 4144 and inductively heated and aligned in a first direction. Each of the

conductive crucible modules

5202a and 5202b includes a conductive crucible portion 5260 extending in the first direction and accommodating a deposition material 4010 in a deposition material accommodation space and heating the deposition material to generate steam; A conductive crucible induction heating coil 4134 disposed to surround the conductive crucible part 5260 and inductively heating the conductive crucible part 5260; A nozzle block 4120 extending along the first direction and including a plurality of through nozzles 4122 and receiving steam from the conductive crucible part and formed of a conductive material; And a nozzle block induction heating coil 4132 disposed to surround the nozzle block and heating the nozzle block. The plurality of through nozzles 4122 are formed along a second direction perpendicular to the first direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge the steam.

The

conductive crucible modules

5202a and 5202b may include a buffer block 4138 having a buffer space extending along the first direction and formed of a conductive material; And a buffer block induction heating coil 4139 disposed to surround the buffer block and inductively heating the buffer block. The buffer block 4138 delivers the vapor provided by the conductive crucible part to the nozzle block 4120.

The conductive crucible part 5260 is disposed above the buffer block and provides the vapor to the buffer space in the third direction. The nozzle block 4120 is disposed on an upper side of the buffer block 4120 and discharges the vapor in a lateral manner perpendicular to the direction of gravity. The conductive crucible part 5260 accommodates a solid or liquid deposition material, and heats the deposition material to provide steam to the buffer space.

The conductive crucible part 5260 is formed of a conductive material and extends in the first direction, and has a rectangular parallelepiped conductive crucible body 5284 including a deposition material accommodating space accommodating the deposition material; A vapor guide portion 5301 extending in the first direction and including a protrusion protruding from the lower surface of the conductive crucible body and a plurality of discharge through holes spaced apart from the protrusion in the first direction; A conductive cover portion 5302 formed in a conductor extending in the first direction and disposed in the deposition material accommodation space and covering the discharge through hole of the vapor guide portion; And an insulation cover portion 5285 disposed in the deposition material accommodation space and covering the conductive cover portion and formed of an insulator. The protrusion 5281a of the steam guide portion 5281 includes openings 5301c communicating with the discharge through holes 5301b, respectively.

The AC power supply 4136 supplies power to the nozzle block induction heating coil 4132 and the buffer block induction heating coil 4139, and the auxiliary AC power supply 5268 supplies power to the conductive crucible induction heating coil 4134. Can be.

Hereinafter, a linear evaporation deposition apparatus including a hopper and a nozzle will be described.

34A and 34B, the linear evaporation deposition apparatus 6100 is disposed inside the vacuum container 6160 and receives the evaporation material 6010 in powder form and opens and closes the evaporation material 6010 downward. A hopper 6140 discharged through the hopper receives the evaporation material 6010 from the hopper to heat the evaporation material 6010 to generate steam, and the first direction (x-axis direction) inside the vacuum vessel 6160. A buffer block 6110 formed of a conductor material and having a buffer space 6112 extending along the circumference thereof, and a predetermined length along the first direction (x-axis direction) inside the vacuum container 6160, the first A rectangular parallelepiped shape having a constant width in a second direction (y-axis direction) perpendicular to the direction, and a constant height in a third direction (z-axis direction) perpendicular to the first direction and the second direction, the plurality of through nozzles And included in the buffer block 6110. And a nozzle block 6120 formed of a conductive material, and heating means 6130 disposed to surround the nozzle block and the buffer block in the vacuum container and to heat the nozzle block and the buffer block. .

The plurality of through nozzles 6122 communicate with the buffer space 6112 of the buffer block, are formed along the third direction (z-axis direction), and are spaced apart from each other in the first direction (x-axis direction) and are parallel to each other. It arrange | positions and discharges the steam of the said buffer space 6112.

The evaporation material 6010 may be an organic material used for the organic light emitting diode. Specifically, the organic material may include Tris (8-hydroxyquinolinato) aluminum (Al (C9H6NO) 3). The organic material is a solid in powder form at room temperature, and the organic material may be sublimed or evaporated at around 300 degrees Celsius. The hopper 6112 may be used to store a large amount of evaporation material and control the amount provided to the buffer space.

The vacuum container 6160 may be formed of a conductive material. The vacuum container 6160 may be a chamber having a rectangular parallelepiped structure. The vacuum container 6160 may be evacuated to a vacuum state by a vacuum pump. The vacuum container 6160 may include a substrate holder (not shown) 6 and a substrate 6162 mounted on the substrate holder. The vacuum container may include a shadow mask disposed on the front surface of the substrate to perform patterning.

The substrate 6162 may be a glass substrate or a plastic substrate including an organic light emitting diode. The substrate 6162 may be a quadrangular substrate.

The hopper 6140 may provide the evaporation material to the buffer block 6110. The number of hoppers may be one or plural. In the case of a plurality of hoppers, the hoppers may be spaced apart in the first direction (x-axis direction) at regular intervals to release the evaporation material into the buffer space 6112 of the buffer block 6110.

The hopper 6140 may store the evaporation material 6010 in a large amount and discharge a predetermined amount. The hopper 6140 may extend in the first direction, and the lower surface of the hopper may include an inclined surface that is inclined with respect to the ground surface. Accordingly, the evaporation material may be discharged through the discharge port 6143 along the inclined surface. The hopper 6140 may be easily disassembled / coupled to the buffer block.

The hopper 6140 is an opening and closing to open and close the receiving body portion (6147) having an inclined surface (6141) in the lower portion extending in the first direction, the discharge port (6143) disposed in the lower portion of the inclined surface; The means 6162 may include a vibrating part 6146 for providing vibration energy to the inclined surface, and a load cell 6145 for measuring the mass of the evaporated material contained in the accommodating body part 6147.

The accommodating body part 6147 may include an upper body part having a rectangular parallelepiped extending in the first direction and a lower body part which is continuously connected to the upper body part and extends in the first direction. An upper surface of the accommodation body portion 6147 may be lower than an upper surface of the nozzle block 6120.

The discharge port 6143 may adjust the discharge amount through the opening and closing means 6162.

The vibrator 6146 may provide vibration energy to the inclined surface to provide a flow of the evaporation material.

The load cell 6145 may measure the mass or weight of the hopper. The vibrator 6146 may generate sound waves or ultrasonic waves. When the evaporation material is sufficiently filled in the receiving body portion, the sound wave may pass through the evaporation material and be reflected from the opposite wall to return. On the other hand, when the evaporation material is empty inside the receiving body portion, the sound wave does not transmit the vacuum state. Therefore, by measuring the characteristics of the reflected wave of the vibrating unit with time, an approximate timing of exchanging the evaporation material contained in the receiving body portion can be derived.

The buffer block 6110 includes one buffer space 6112 extending in a first direction (x-axis direction). The buffer space 6112 serves to distribute steam to the plurality of through nozzles 6222. When there is only one buffer space 6112, the pressure inside the buffer space may be substantially the same. Thus, when the temperature of the buffer block 6110 is constant, the amount of vapor to be effused may depend on the diameter of the through nozzle.

The buffer block 6110 may be formed of a metal material having high electrical conductivity. For example, the buffer block 6110 may be stainless steel, copper, tantalum, titanium, tungsten, or nickel. The buffer block 6110 may extend in the first direction (x-axis direction). When the third direction (z-axis direction) is a direction opposite to the gravity direction (g direction), the buffer block (in the plane yz defined by the second direction and a third direction perpendicular to the second direction) The cross section of 6110 may comprise an “L” shape. The buffer block 6110 may include a vertical portion 6114 parallel to the third direction and a horizontal portion 6161 parallel to the second direction. The horizontal portion 6161 may receive the evaporation material from the hopper 6150.

The nozzle block 6120 may be disposed on an upper surface of the vertical portion 6114 of the buffer block 6110, and the buffer block 6110 and the nozzle block 6120 may be integrally formed. One end of the plurality of through nozzles 6112 may be exposed to an upper surface of the nozzle block forming the same plane. The width of the nozzle block 6120 in the second direction (y axis direction) may be smaller than the width of the vertical portion 6114 of the buffer block.

The plurality of through nozzles 6112 may discharge the vapor upwardly in a direction opposite to the gravity direction to deposit organic materials on the substrate 6162 disposed above the vacuum container.

Preferably, the through nozzle may have a cylindrical shape penetrating the nozzle block. An aspect ratio of the through nozzle may be 5 to 100.

The through nozzle may have a diameter of several hundred micrometers to several millimeters. The spacing between neighboring through nozzles may be 1.2 to 5 times the diameter of the through nozzle.

It may be desirable for the diameter of the through nozzle to be smaller than the mean free path of steam.

When the nozzle block is in the form of a rectangular parallelepiped extending in the first direction, the nozzle block may be heated as a whole so that the through nozzles may maintain a uniform temperature as a whole.

The sum of the cross-sectional areas of the through nozzles 6222 may be smaller than the cross-sectional area in the width and height directions of the nozzle block (the cross-sectional area of the nozzle block in the plane defined by the second and third directions). Accordingly, the steam may maintain a spatially constant pressure inside the buffer block.

The plurality of through nozzles 6222 communicate with the buffer space 6112 of the buffer block, are formed along the third direction (z-axis direction), and are spaced apart in the first direction (x-axis direction) and are parallel to each other. It arrange | positions and discharges the steam of the said buffer space 6112.

The nozzle block 6120 may be formed of the same material as the buffer block 6110. The nozzle block 6120 may be manufactured integrally with the buffer block 6110 by welding techniques. Temperature measuring means for measuring temperature may be disposed in the nozzle block and the buffer block, respectively. The temperature measuring means may be a thermocouple.

The heating means 6130 may inductively heat the buffer block 6110 and the nozzle block 6120 or use a resistive heating wire. In the case of the resistive heating wire, a DC power source or an AC power source may be used. The resistive heating wire may be installed to be directly in the nozzle block and the buffer block or embedded in the buffer block.

In the case of induction heating, an alternating current power source can be used. In the case of the induction heating, the frequency of the AC power source may be several tens of kHz to several MHz. The induction heating coil may receive power from the AC power source to inductively heat the buffer block and the nozzle block. The induction heating coil may be insulated from the buffer block and the nozzle block. For insulation, the induction heating coil may be spaced apart from the buffer block and the nozzle block. The induction heating coil may be in the form of a pipe having a rectangular cross section or a pipe having a circular cross section.

The heat reflection part 6150 may be disposed to surround the side surface of the nozzle block 6120 and the buffer block 6110. The heat reflection part 6150 may reflect the radiant energy of the heated nozzle block so as not to be emitted to the outside. The heat reflection part 6150 may be manufactured by bending a metal plate having high reflection efficiency. Cooling pipes 6152 through which a refrigerant flows may be installed outside the heat reflection unit 6150. The hopper 6140 may be disposed inside or outside the heat reflection part 6150.

The linear evaporation deposition apparatus 6100 may include a linear motion unit that provides a linear motion to the nozzle block 6120. The linear motion part may provide a linear motion (y-axis linear motion) to the nozzle block, the buffer block, and the hopper. Accordingly, the nozzle block 6120 that moves linearly may deposit a uniform thin film on all surfaces of the substrate 6162 while the substrate 6162 is fixed.

According to a modified embodiment of the present invention, the nozzle block, the buffer block, and the hopper may be fixed inside the vacuum container, and the substrate 6162 and the substrate holder may linearly move.

35A to 35C, the linear evaporation deposition apparatus 6200 is disposed inside the vacuum vessel 6160 and receives the evaporation material 6010 in powder form and discharges the evaporation material downward through the opening and closing means. A hopper 6240, provided with the evaporation material from the hopper, and heating the evaporation material to generate steam and having a buffer space 6212 extending along the first direction inside the vacuum vessel 6160 and conducting A buffer block 6210 formed of a sieve material, a constant length in the vacuum container along the first direction, a constant width in a second direction (y-axis direction) perpendicular to the first direction, and the first direction and A rectangular parallelepiped shape having a constant height in a third direction (z-axis direction) perpendicular to the second direction, including a plurality of through nozzles 6222, mounted to the buffer block 6210, and made of a conductive material. Formed furnace Block 6120 and heating means 6230 arranged to surround the nozzle block 6120 and the buffer block 6210 inside the vacuum vessel and to heat the nozzle block 6120 and the buffer block 6210. ).

The plurality of through nozzles 6222 communicate with the buffer space 6212 of the buffer block, are formed along the third direction (z-axis direction), and are spaced apart in the first direction (x-axis direction) and are parallel to each other. It arrange | positions and discharges the steam of the said buffer space 6212.

The hopper 6240 may provide the evaporation material 6010 to the buffer block 6210. The number of hoppers 6240 may be one. The hopper may receive a large amount of the evaporation material and discharge in a predetermined amount. The hopper 6240 may extend in the first direction (x-axis direction) that is the same as the direction in which the buffer block extends, and the bottom surface of the hopper may include a low inclined surface 6241 adjacent to the nozzle block. Accordingly, the evaporation material may be discharged through the discharge port 6203 along the inclined surface 6241. The hopper 6240 may be easily disassembled / coupled to the buffer block 6210. The hopper 6240 may be insulated from the portion where the hopper and the buffer block is coupled so as to insulate the heated buffer block.

The manner in which the hopper 6240 releases the evaporation material to the buffer block may be variously modified as long as the evaporation material is dropped using gravity and / or vibration energy.

The hopper 6250 includes an accommodating body part 6477 having an inclined surface 6241 at a lower portion thereof, an ejection opening 6241 disposed at a lower portion of the inclined surface, opening and closing means 6242 for opening and closing the discharge opening, and vibration energy at the inclined surface. It may include a vibrating portion (6246) for providing a, and a load cell (6245) for measuring the mass of the evaporation material contained in the receiving body portion.

The discharge hole 6203 may have a slit shape extending in the first direction. The discharge port 6203 may be opened and closed by the opening and closing means 6242 in the form of a sliding door.

The accommodating body part 6247 may include an upper body part having a rectangular parallelepiped extending in the first direction and a lower body part which is continuously connected to the upper body part and extends in the first direction. The upper surface of the receiving body portion may be lower than the upper surface of the nozzle block.

The opening and closing means 6242 may adjust the discharge amount emitted by opening and closing the discharge port 6203. In addition, the vibrating unit may provide a vibration energy to the inclined surface to adjust the discharge amount to discharge the discharge port. The opening and closing means may be disposed under the side of the receiving body portion and may have a shape such as a sliding door.

The vibrator 6262 may provide vibration energy to the inclined surface 6241 to provide a flow of the evaporation material.

The load cell 6245 may quantitatively measure the mass or weight of the hopper. By using the weight measured by the load cell, the opening and closing degree of the opening and closing means and the strength of the vibration energy of the vibration unit can be controlled. In addition, by using the weight measured by the load cell, it is possible to derive the replacement time of the evaporated material contained in the receiving body portion.

The manner and position of the load cell 6245 to measure the weight of the evaporation material may vary.

On the other hand, the vibrator 6246 may generate sound waves or ultrasonic waves.

If the evaporation material is sufficiently filled with the receiving body portion, the sound wave is the

It can penetrate the evaporation material and reflect back from the opposite wall. On the other hand, when the evaporation material is empty inside the receiving body portion, the sound wave does not transmit the vacuum state. Therefore, by measuring the characteristics of the reflected wave of the vibrating unit with time, an approximate timing of exchanging the evaporation material contained in the receiving body portion can be derived.

The support 6242 may support the lower surface of the housing body 6245.

The load cell 6245 may be disposed on an upper surface of the support part 6204 and a lower surface of the receiving body part 6477.

The buffer block 6210 includes one buffer space 6212 extending in a first direction (x-axis direction). The buffer space 6212 may perform a function of heating and vaporizing the evaporation material and distributing steam to a plurality of through nozzles. When there is only one buffer space, the pressure inside the buffer space is substantially the same. Thus, the amount of vapor effused may depend on the diameter of the through nozzle.

The buffer block 6210 may be formed of a metal material having high electrical conductivity. For example, the buffer block 6210 may be stainless steel, copper, tantalum, titanium, tungsten, or nickel. The buffer block may extend in the first direction.

When the third direction (z-axis direction) is the direction opposite to the gravity direction (g direction), the buffer block 6210 extends in parallel to the vertical portion 6214 and parallel to the second direction. A horizontal portion 6216, and a protrusion portion 6218 continuously connected to the horizontal portion and extending in parallel to the third direction and protruding from the horizontal portion. An alignment groove 6214a extending in the first direction may be disposed on an upper surface of the vertical portion 6214. A through slit 6214b extending in the first direction may be disposed in the alignment groove. The nozzle block 6210 may be inserted into the alignment groove 6214a to be formed by welding or the like. Accordingly, the vapor of the buffer space of the buffer block may be discharged in the third direction through the through slit 6214b and the through nozzles 6222.

The protruding portion 6218 and the vertical portion 6214 may extend in the z-axis direction in parallel to each other at both ends of the horizontal portion. An opening 6618a communicating with the discharge part 6203 of the hopper may be disposed at a side surface of the protruding portion 6218. The opening may have a rectangular shape extending in the first direction.

The protruding portion 6218 may be provided with the evaporation material from the hopper 6240. For example, the evaporation material may be provided from the side surface of the protruding portion 6218.

The nozzle block 6120 may be disposed on an upper surface of the vertical portion 6212 of the buffer block, and the buffer block 6210 and the nozzle block 6120 may be integrally formed. One end of the plurality of through nozzles may be exposed to an upper surface of the nozzle block forming the same plane. The width of the nozzle block 6120 in the second direction may be smaller than the width of the vertical portion 6214 of the buffer block.

The plurality of through nozzles 6222 may discharge the vapor upwardly in a direction opposite to the gravity direction to deposit the organic material on the substrate disposed on the nozzle block 6120. The through nozzle 6122 may have a cylindrical shape, and an aspect ratio of the through nozzle may be 5 to 100. The through nozzle 6122 may have a diameter of several hundred micrometers to several millimeters. The spacing between neighboring through nozzles may be 1.2 to 10 times the diameter of the through nozzle.

The plurality of through nozzles 6222 are in communication with the buffer space of the buffer block 6212, are formed along the third direction, are spaced apart from each other in the first direction, and are disposed side by side, and discharge steam in the buffer space. do.

The nozzle block 6120 may be formed of the same material as the buffer block 6210. The nozzle block 6120 may be integrally manufactured by the buffer block and welding techniques.

The heating means 6230 may inductively heat the buffer block 6210 and the nozzle block 6120. The heating means 6230 is arranged to surround the nozzle block 6120 and the buffer block 6210, and induction heating coils 6252 and 6244 for induction heating the nozzle block and the buffer block, and the induction heating coil. AC power supply 6236 for supplying AC power to 6623,6234. Refrigerant may flow inside the

induction heating coils

6322 and 6244.

The induction heating coils 6322 and 6204 may include a nozzle induction heating coil 6322 disposed to surround the nozzle block 6120 and a buffer induction heating coil 6204 disposed to surround the buffer block 6210. Can be. The nozzle induction heating coil 6322 may be disposed to surround the nozzle block 6120 while extending in a first direction in which the nozzle block extends. In addition, the buffer induction heating coil 6244 may be disposed to surround the buffer block 6210 while extending in a first direction in which the buffer block 6210 extends.

The induction heating coils 6322 and 6204 may be formed of copper pipes or bent by bending a linear plate of copper material. The nozzle induction heating coil 6252 and the buffer induction heating coil 6244 may be electrically connected in series. In the case of induction heating, an alternating current power source can be used. In the case of the induction heating, the frequency of the AC power source may be several tens of kHz to several MHz. The induction heating coil may be insulated from the buffer block and the nozzle block.

The reflective block 6150 may be disposed to surround the side surface of the nozzle block 6120 and the buffer block 6210. The heat reflection part 6150 may reflect the radiant energy of the heated nozzle block and the buffer block not to be emitted to the outside. The heat reflection part 6150 may be a metal plate material having high reflection efficiency. The heat reflection part 6150 may be manufactured by bending a metal plate. Cooling pipes 6152 through which a refrigerant flows may be installed outside the heat reflection unit 6150. The hopper 6240 may be disposed outside the heat reflection part 6150. Alternatively, the hopper 6240 may be disposed inside the heat reflection part 6150.

The linear evaporation deposition apparatus may include a linear motion portion 6270 that provides linear motion to the nozzle block. The linear movement part 6270 may provide linear motion to the nozzle block 6120, the buffer block 6210, and the hopper 6240.

Referring to FIGS. 36A and 36B, the linear evaporation deposition apparatus 6300 is disposed inside the vacuum vessel 6160 and accommodates the evaporation material 6010 in powder form and opens and closes the evaporation material 6010 downward. A hopper 6240 releasing through 6242, a buffer space 6312 provided with the evaporation material from the hopper 6240 to heat the evaporation material to generate steam and extending along the first direction inside the vacuum vessel. And a buffer block 6310 formed of a conductive material, a predetermined length along the first direction, a constant width in a second direction perpendicular to the first direction, and the first inside of the vacuum container 6160. A nozzle block 6320 having a rectangular parallelepiped shape having a constant height in one direction and a third direction perpendicular to the second direction, including a plurality of through nozzles, mounted to the buffer block 6310, and formed of a conductive material. ), And award And a heating means 6330 disposed to surround the nozzle block 6320 and the buffer block 6310 inside the vacuum chamber and to heat the nozzle block and the buffer block.

The plurality of through nozzles 6322 communicate with the buffer space 6312 of the buffer block 6310, are formed along the third direction, and are spaced apart from each other in the first direction (x-axis direction). The vapor of the buffer space 6312 is discharged.

The plurality of through nozzles 6322 may discharge the vapor in a downward direction toward the direction of gravity to deposit organic materials on a substrate disposed below the nozzle block 6320.

The hopper 6240 may provide the evaporation material to the buffer block 6310. The number of hoppers may be one. The hopper 6310 may receive a large amount of the evaporated material and discharge a predetermined amount. The hopper 6310 may extend in the first direction that is the same as the direction in which the buffer block extends, and a lower surface of the hopper may include an inclined surface 6241 with a low nozzle block side. Accordingly, the evaporation material may be discharged through the discharge port 6203 along the inclined surface. The hopper 6240 may be easily disassembled / coupled to the buffer block. The hopper 6240 may be insulated from the portion where the hopper and the buffer block is coupled so as to insulate the heated buffer block.

The manner in which the hopper releases the evaporation material to the buffer block may be variously modified as long as the evaporation material is dropped using gravity and / or vibration energy.

The hopper 6240 extends in the first direction and opens and closes to open and close the receiving body part 6245 having an inclined surface 6241 at the lower portion, a discharge port 6203 disposed at a lower portion of the inclined surface, and the discharge port 6203. The means 6242 may include a vibrating part 6262 for providing vibration energy to the inclined surface, and a load cell 6245 for measuring the mass of the evaporated material contained in the receiving body part.

The discharge port 6203 may be in the form of a rectangular slit extending in the first direction. The opening and closing means 6242 may open and close the discharge port 6203 while moving in the third direction.

The accommodating body part 6247 may include an upper body part having a rectangular parallelepiped extending in the first direction and a lower body part which is continuously connected to the upper body part and extends in the first direction.

The opening and closing means 6624 may adjust the discharge amount emitted by opening and closing the discharge port 6203. In addition, the vibrator 6246 may provide vibration energy to the inclined surface to adjust the discharge amount of the discharge port. The opening and closing means 6242 may be disposed below the side surface of the housing body and may have a shape such as a sliding door. The vibrator 6246 may provide vibration energy to the inclined surface to provide a flow of the evaporation material.

The support 6242 may support the lower surface of the housing body 6245. The load cell 6245 may be disposed on an upper surface of the support part 6204 and a lower surface of the receiving body part 6477. The support 6242 may be mounted inside the heat reflector 6350. The heat reflection part 6350 may reflect the radiant energy emitted from the heated portion, and support the hopper 6240 against gravity.

The buffer block 6310 includes one buffer space 6312 extending in the first direction. The buffer space 6312 serves to distribute steam to the plurality of through nozzles. The buffer block 6312 may be formed of a metal material having high electrical conductivity. For example, the buffer block 6312 may be stainless steel, copper, tantalum, titanium, tungsten, or nickel. The buffer block 6312 may extend in the first direction.

When the third direction (z-axis direction) is opposite to the direction of gravity, the nozzle block 6320 may be disposed on the bottom surface of the buffer block 6310. The buffer block 6310 may have a rectangular parallelepiped shape having a constant length in the first direction, a constant width in the second direction, and a constant height in the third direction. The buffer block 6310 may include a partition 6311 extending in the first direction in a plane defined by the first direction and the third direction within the buffer block 6310. The partition 6311 may include an opening 6311a to provide steam to the nozzle block. The opening 6311a may have a slit shape and may extend in the first direction. The partition 6311 may extend in a first direction from an inner lower surface of the buffer block. In addition, the partition 6311 may extend in a first direction from an inner upper surface of the buffer block 6310. Accordingly, the partition wall can prevent the evaporation material in the form of powder provided by the hopper directly provided to the nozzle block. The partition may have various shapes.

The nozzle block 6320 may be disposed on a bottom surface of the buffer block 6310. The buffer block and the nozzle block may be integrally formed. One end of the plurality of through nozzles 6322 may be exposed to a lower surface of the nozzle block 6320 forming the same plane. The width of the nozzle block 6320 in the second direction (y-axis direction) may be smaller than the width of the buffer block 6310. The plurality of through nozzles 6322 may discharge the vapor downward in the direction of gravity to deposit organic materials on the substrate disposed under the nozzle block. The through nozzle 6322 may have a cylindrical shape, and an aspect ratio of the through nozzle 6322 may be 5 to 100. The through nozzle may have a diameter of several hundred micrometers to several millimeters. The spacing between neighboring through nozzles may be 1.2 to 10 times the diameter of the through nozzle.

The plurality of through nozzles 6322 communicate with the buffer space 6312 of the buffer block, are formed along the third direction, are spaced apart from each other in the first direction, and are disposed side by side to each other. Discharge toward.

The nozzle block 6320 may be formed of the same material as the buffer block. The nozzle block may be integrally manufactured by the buffer block and welding techniques.

The heating unit 6330 may inductively heat the buffer block 6310 and the nozzle block 6320. The heating means 6330 is disposed to surround the nozzle block and the buffer block and supplies AC power to the induction heating coils 6332 and 6340 for induction heating the nozzle block and the buffer block, and the induction heating coil. AC power 636 may be included. Refrigerant may flow inside the

induction heating coils

6332 and 6334.

The induction heating coils 6332 and 6342 may include a nozzle induction heating coil 6332 disposed to surround the nozzle block and a buffer induction heating coil 6340 disposed to surround the buffer block. The nozzle induction heating coil 6332 may be disposed to surround the nozzle block 6320 while extending in a first direction in which the nozzle block extends. The buffer induction heating coil 6340 may be disposed to surround the buffer block 6310 while extending in a first direction in which the buffer block extends.

The induction heating coil may be formed of a copper pipe, or may be manufactured by bending a linear sheet of copper material. In the case of induction heating, an alternating current power source can be used. In the case of the induction heating, the frequency of the AC power source may be several tens of kHz to several MHz. The induction heating coil may be insulated from the buffer block and the nozzle block.

The reflective block 6350 may be disposed to surround side surfaces of the nozzle block and the buffer block. The heat reflection part 6350 may reflect the radiant energy of the heated nozzle block and the buffer block not to be emitted to the outside. The heat reflection part may be manufactured by bending a metal plate material having high reflection efficiency. Cooling pipes through which a refrigerant flows may be installed outside the heat reflection unit. The hopper may be disposed inside the heat reflection portion. In addition, the reflective block 6350 may support the hopper 6240, the nozzle block 6320, and the buffer block 6310.

The linear evaporation deposition apparatus may include a linear motion part 6370 that provides a linear motion to the nozzle block. The linear motion part 6370 may provide linear motion to the nozzle block, the buffer block, and the hopper.

Referring to FIGS. 37A and 37B, the linear evaporation deposition apparatus 6400 is disposed inside the vacuum vessel 6160 and accommodates the evaporation material 6010 in powder form and discharges the evaporation material downward through the opening and closing hand. A hopper 6240 and a buffer space provided with the evaporation material from the hopper 6240 to heat the evaporation material to generate steam and extend along a first direction (x-axis direction) inside the vacuum vessel 6160. A buffer block 6410 formed of a conductive material, a predetermined length in the vacuum container along the first direction, a constant width in a second direction perpendicular to the first direction (y-axis direction), and the Nozzle having a rectangular parallelepiped shape having a constant height in a third direction (z-axis direction) perpendicular to the first direction and the second direction, comprising a plurality of through nozzles, mounted to the buffer block, and formed of a conductive material block( 6420, and heating means 6230 disposed to enclose the nozzle block and the buffer block in the vacuum container and to heat the nozzle block and the buffer block.

The plurality of through nozzles 6422 communicate with the buffer space 6412 of the buffer block, are formed along the third direction, and are spaced apart from each other in the first direction, and are arranged side by side. Discharge the steam.

A plurality of through nozzles 6422 may discharge the vapor in a lateral manner perpendicular to gravity to deposit organic matter on the substrate 6162 disposed on the side surface of the vacuum container.

The hopper 6240 may provide the evaporation material to the buffer block 6410. The number of hoppers may be one. The hopper 6410 may store a large amount of the evaporated material and discharge the same in a predetermined amount. The hopper 6410 may extend in the first direction that is the same as the direction in which the buffer block extends, and the lower surface of the hopper may include a lower inclined surface 6241 at the nozzle block side. Accordingly, the evaporation material may be discharged through the discharge port 6203 along the inclined surface. The hopper 6240 may be easily disassembled / coupled to the buffer block. The hopper 6240 may be insulated from the portion where the hopper and the buffer block is coupled so as to insulate the heated buffer block.

The hopper 6240 includes an accommodating body part 6477 having an inclined surface at a lower portion thereof, a discharge opening 6241 disposed at a lower portion of the inclined surface, opening and closing means 6242 for opening and closing the discharge opening, and providing vibration energy to the inclined surface. It may include a vibrating portion (6246), and a load cell (6245) for measuring the mass of the evaporation material contained in the receiving body portion.

The discharge hole 6203 may have a slit shape extending in the first direction. The discharge port may be opened and closed by the opening and closing means 6624.

The opening and closing means 6242 may adjust the discharge amount emitted by opening and closing the discharge port. In addition, the vibrator 6246 may provide vibration energy to the inclined surface to adjust the discharge amount of the discharge port. The opening and closing means 6242 may be disposed below the side surface of the housing body and may have a shape such as a sliding door. The vibrator 6246 may provide vibration energy to the inclined surface to provide a flow of the evaporation material.

The load cell 6245 may quantitatively measure the mass or weight of the hopper. By using the weight measured by the load cell, the opening and closing degree of the closure means and the strength of the vibration energy of the vibration unit can be controlled. In addition, by using the weight measured by the load cell, it is possible to derive the replacement time of the evaporated material contained in the receiving body portion.

The buffer block 6410 includes one buffer space 6412 extending in the first direction. The buffer space 6412 functions to distribute steam to the plurality of through nozzles 6422. When the buffer space 6412 is one, the pressure inside the buffer space is substantially the same. Thus, the amount of vapor ejected 6effusion may depend on the diameter of the through nozzle.

The buffer block 6410 may be formed of a metal material having high electrical conductivity. For example, the buffer block 6410 may be stainless steel, copper, tantalum, titanium, tungsten, or nickel. The buffer block may extend in the first direction.

The plurality of through nozzles 6422 may discharge the vapor in a vertically lateral manner so as to deposit an organic material on the substrate 6162 disposed on the side surface of the vacuum container 6160.

When the second direction (y-axis direction) is opposite to the gravity direction, the nozzle block 6620 may be disposed on the side surface of the buffer block 6410. The buffer block 6410 has a constant length in the first direction (x-axis direction), has a constant width in the second direction (y-axis direction), and has a constant height in the third direction (z-axis direction). The branches may be cuboid shaped. The buffer block 6410 may include a partition 6411 extending in the first direction in a plane (xy plane) defined by the first direction and the second direction inside the buffer block. The partition 6411 may include an opening 6411a so that steam may be provided to the nozzle block.

The nozzle block 6410 may be disposed on a side surface of the buffer block, and the buffer block and the nozzle block may be integrally formed. One end of the plurality of through nozzles may be exposed to side surfaces of the nozzle block forming the same plane. The width of the nozzle block in the second direction may be smaller than the width of the buffer block. The plurality of through nozzles 6422 may discharge the vapor in a lateral manner perpendicular to the direction of gravity to deposit organic materials on the substrate 6162 spaced apart from the side of the nozzle block. The through nozzle 6422 may have a cylindrical shape, and an aspect ratio of the through nozzle may be 5 to 100. The through nozzle may have a diameter of several hundred micrometers to several millimeters. The spacing between neighboring through nozzles may be 1.2 to 10 times the diameter of the through nozzle.

The plurality of through nozzles 6422 communicate with the buffer space 6412 of the buffer block, are formed along the third direction (z-axis direction), and are spaced apart from each other in the first direction, and are arranged side by side. Steam in the space 6412 is discharged.

The nozzle block 6420 may be formed of the same material as the buffer block. The nozzle block 6420 may be integrally manufactured with the buffer block 6410 by welding techniques.

The heating means 6230 may inductively heat the buffer block and the nozzle block. The heating means 6230 is arranged to surround the nozzle block and the buffer block and supplies AC power to the

induction heating coils

6432 and 6434 for induction heating the nozzle block and the buffer block, and the induction heating coil. AC power source 6436 may be included. A refrigerant may flow inside the induction heating coil.

The

induction heating coils

6432 and 6434 may include a nozzle induction heating coil 6432 disposed to surround the nozzle block and a buffer induction heating coil 6434 disposed to surround the buffer block. The

induction heating coils

6432 and 6434 may be disposed to surround the nozzle block and the buffer block while extending in a first direction in which the nozzle block extends. The induction heating coil may be formed of a copper pipe, or may be manufactured by bending a linear sheet of copper material. In the case of induction heating, an alternating current power source can be used. In the case of the induction heating, the frequency of the AC power source may be several tens of kHz to several MHz. The induction heating coil may be insulated from the buffer block and the nozzle block.

The reflective block 6250 may be disposed to surround the nozzle block and the buffer block except for a through nozzle through which steam is discharged. The heat reflection unit 6650 may reflect the radiant energy of the heated nozzle block to the outside. The heat reflection part may be a metal plate material having high reflection efficiency. The heat reflection part may be manufactured by bending a metal plate. Cooling pipes through which a refrigerant flows may be installed outside the heat reflection unit. The hopper may be disposed inside or outside the heat reflection portion. The heat reflection part 6250 may support the hopper, the buffer block, and the nozzle block.

The linear evaporation deposition apparatus may include a linear motion portion 6706 that provides linear motion to the nozzle block. The linear motion unit may provide linear motion to the nozzle block, the buffer block, and the hopper.

38A and 38B are plan views illustrating the through nozzles of the linear evaporation deposition apparatus according to another embodiment of the present invention. Descriptions overlapping with those described in FIG. 34 will be omitted.

34 and 38A, the linear evaporation deposition apparatus 6100a is disposed inside the vacuum vessel 6160 and receives the evaporation material 6010 in powder form and opens and closes the evaporation material 6010 downward. A hopper 6140 discharged through the hopper receives the evaporation material 6010 from the hopper to heat the evaporation material 6010 to generate steam, and the first direction (x-axis direction) inside the vacuum vessel 6160. A buffer block 6110 formed of a conductor material and having a buffer space 6112 extending along the circumference thereof, and a predetermined length along the first direction (x-axis direction) inside the vacuum container 6160, the first A rectangular parallelepiped shape having a constant width in a second direction (y-axis direction) perpendicular to the direction, and a constant height in a third direction (z-axis direction) perpendicular to the first direction and the second direction, the plurality of through nozzles And included in the buffer block 6110. And a nozzle block 6120 formed of a conductive material, and heating means 6130 disposed to surround the nozzle block and the buffer block in the vacuum container and to heat the nozzle block and the buffer block. .

The heating means 6130 is arranged to surround the nozzle block and the buffer block, and

induction heating coils

6132 and 6132 for induction heating the nozzle block and the buffer block and alternating current for supplying alternating current power to the induction heating coil. Include the power source.

The

induction heating coils

6132 and 6134 include a nozzle induction heating coil 6132 surrounding the nozzle block and a buffer induction heating coil 6134 surrounding the buffer block. An interval between the induction heating coil, the nozzle block, and the buffer block may be changed at least once while extending in the first direction (x-axis direction). For example, an interval between the nozzle block and the nozzle induction heating coil 6132 at an intermediate point between the nozzle block and the buffer block may be larger than other portions. In addition, the distance between the buffer block and the buffer induction heating coil 6134 at an intermediate point between the nozzle block and the buffer block may be larger than other portions.

The plurality of through nozzles 6222 may include a first row arranged side by side in a first direction, a second row disposed on the left side of the first row, and a third row disposed on the right side of the first row. have. The nozzles of the second row and the nozzles of the third row may be aligned with each other in a second direction. The nozzles in the first row may be disposed between neighboring nozzles in the second row. The distances between neighboring through nozzles may all be the same.

Referring to FIG. 38B, in the linear evaporation deposition apparatus 6100b, the plurality of through nozzles 6222 may be disposed in a first direction. Near both ends of the nozzle block 6120, the density or number of the through nozzles 6222 may increase. Accordingly, the reduction of the deposition rate at the edge of the nozzle block can be compensated. The plurality of through nozzles 6222 may have the same diameter.

According to a modified embodiment of the present invention, the plurality of through nozzles 6222 may increase the diameter of the through nozzles near both ends of the nozzle block without changing the nozzle density. Accordingly, the reduction of the deposition rate at the edge of the nozzle block can be compensated.

39 is a conceptual view illustrating a through nozzle of the linear evaporation deposition apparatus according to another embodiment of the present invention. Descriptions overlapping with those described in FIG. 35 are omitted.

35 and 39, the linear evaporation deposition apparatus 6200a is disposed inside the vacuum vessel 6160 and receives the evaporation material 6010 in powder form and discharges the evaporation material downward through the opening and closing means. A hopper 6240, provided with the evaporation material from the hopper, and heating the evaporation material to generate steam and having a buffer space 6212 extending along the first direction inside the vacuum vessel 6160 and conducting A buffer block 6210 formed of a sieve material, a constant length in the vacuum container along the first direction, a constant width in a second direction (y-axis direction) perpendicular to the first direction, and the first direction and A rectangular parallelepiped shape having a constant height in a third direction (z-axis direction) perpendicular to the second direction, including a plurality of through nozzles 6212, mounted to the buffer block 6210, and made of a conductive material. Formed nozzle A lock 6120 and heating means 6230 arranged to surround the nozzle block 6120 and the buffer block 6210 inside the vacuum vessel and to heat the nozzle block 6120 and the buffer block 6210. ).

When the third direction (z-axis direction) is a direction opposite to the gravity direction (g direction), the buffer block 6210 is parallel to the vertical portion 6214 extending in parallel to the third direction, and parallel to the second direction. It may include an extending horizontal portion 6216.

An opening 6207 may be disposed at an upper surface of the horizontal portion 6216 to communicate with the discharge part 6203 of the hopper. The opening 6207 may have a rectangular shape extending in the first direction. The horizontal portion 6216 may receive the evaporation material from the hopper 6240.

40 is a conceptual diagram illustrating a linear evaporation deposition apparatus according to another embodiment of the present invention. Descriptions overlapping with those described in FIG. 34 will be omitted.

Referring to FIG. 40, the linear evaporation deposition apparatus 6100 is disposed inside the vacuum container 6160 and receives the evaporation material 6010 in powder form and discharges the evaporation material 6010 downward through the opening and closing means. Hopper 6140 receives the evaporation material 6010 from the hopper and heats the evaporation material 6010 to generate steam and along the first direction (x-axis direction) inside the vacuum vessel 6160. A buffer block 6110 having an extended buffer space 6112 and formed of a conductive material, and having a predetermined length along the first direction (x-axis direction) inside the vacuum container 6160 and perpendicular to the first direction. A plurality of through nozzles 6222 having a rectangular parallelepiped shape having a predetermined width in one second direction (y-axis direction) and a constant height in a third direction (z-axis direction) perpendicular to the first direction and the second direction. It includes, and is mounted to the buffer block 6110, And And a nozzle block 6120a formed of a conductive material, and heating means 6130 disposed to surround the nozzle block and the buffer block in the vacuum container and to heat the nozzle block and the buffer block.

The nozzle block 6120a may be disposed to be inserted into the buffer block 6110. For example, the nozzle block 6120a may be inserted into an upper surface of the vertical portion 6114 of the buffer block 6110. The nozzle block 6120a and the buffer block 6110 may be integrally manufactured. The heating means may simultaneously heat the nozzle block 6120a and the buffer block 6110.

While the invention has been shown and described with respect to certain preferred embodiments thereof, the invention is not limited to these embodiments, and has been claimed by those of ordinary skill in the art to which the invention pertains. It includes all the various forms of embodiments that can be implemented without departing from the spirit.

Claims

A dielectric tube mounted around the through hole formed in the upper plate of the vacuum vessel;

An induction coil disposed to surround the dielectric tube;

An alternating current power supply for providing alternating current power to said induction coil; And

An evaporator disposed inside the dielectric tube and induction heated by the induction coil to receive a deposition material and to discharge the deposition material,

The evaporation unit:

A deposition material receiving space;

A gas guide part protruding from a lower surface of the deposition material accommodating space and including a through hole at a center thereof; And

A cover part formed of a conductor covering the gas guide part,

The cover part is locked by the deposition material,

And the deposition material is injected through the through-holes of the gas guide part.
The method of claim 1,

A top down evaporation deposition apparatus, further comprising a heat insulation tube disposed to surround the side of the deposition material receiving space.
The method of claim 1,

Further comprising a groove formed along the circumference on the side of the evaporator,

The groove is a top-down evaporation deposition apparatus, characterized in that for reducing the heat transfer of the insulating tube and the side of the evaporator.
The method of claim 1,

A top-down evaporation deposition apparatus, characterized in that further comprising a heat insulation cover portion disposed on the cover portion to suppress heat transfer to the deposition material.
The method of claim 1,

The evaporation unit:

A first cylinder portion having a first diameter on the deposition material accommodating space; And

A second cylindrical part having a second diameter smaller than the first diameter under the deposition material accommodating space;

And the induction coil is arranged to surround the second cylindrical portion.
The method of claim 5,

The top of the evaporator is a top-down evaporation deposition apparatus comprising a plurality of trenches extending in the central axis direction.
According to claim 1,

And further comprising an electric field shield disposed on the upper outer circumferential surface of the dielectric tube.
According to claim 1,

The gas guide portion is a ring shape of a rectangular cross-sectional structure,

The top surface of the gas guide portion is a top down evaporation deposition apparatus characterized in that it has a sawtooth shape.
According to claim 1,

The gas guide portion includes a plurality of lower ring structures having different diameters,

The top surface of the lower ring structure is a top down evaporation deposition apparatus characterized in that it has a sawtooth shape.
According to claim 1,

The top ring structure is a top down evaporation deposition apparatus, characterized in that the height increases as the diameter decreases.
According to claim 1,

Top cover evaporation deposition apparatus characterized in that it has a disk-shaped, cone-shaped or truncated cone-shaped body.
The method of claim 11, wherein

The cover portion includes a plurality of upper ring structure on the lower surface,

The upper ring structure is a rectangular cross-sectional structure,

The bottom surface of the upper ring structure is a top down evaporation deposition apparatus characterized in that it has a sawtooth shape.
According to claim 1,

The evaporator further includes a cavity connected to the through hole of the gas guide part and formed under the through hole.

The cavity comprises an outlet,

And the deposition material is sprayed through the outlet.
According to claim 1,

And a nozzle unit for injecting the deposition material injected from the evaporator into the vacuum container.
According to claim 1,

The evaporator is:

A ferrule disposed on an upper surface of the deposition material accommodating space; And

A top down evaporation deposition apparatus further comprises a top plate for pressing the ferrule.
In the evaporation deposition method of the evaporation deposition apparatus comprising an evaporation unit for storing an organic material and induction heating, a dielectric tube surrounding the evaporation unit, and an induction coil surrounding the dielectric tube,

Storing the organic material inside the evaporator;

Locally heating the organic material by providing a vertical temperature gradient depending on the location of the evaporator; And

And depositing the organic material on the substrate by spraying the sublimed organic material in the vacuum container in the lower part of the evaporator.