KR101447888B1 - Substrate treating apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus capable of minimizing problems such as a decrease in durability due to thermal deformation of a lifting unit provided at a lower portion of a process chamber for elevating and lowering a substrate holder by heat transmitted from a process chamber of the substrate processing apparatus .

Description

[0001] DESCRIPTION [0002] Substrate treating apparatus [

The present invention relates to a substrate processing apparatus. More particularly, the present invention relates to a substrate processing apparatus capable of minimizing problems such as a decrease in durability due to thermal deformation of a lifting unit provided at a lower portion of a process chamber for elevating and lowering a substrate holder by heat transmitted from a process chamber of the substrate processing apparatus, ≪ / RTI >

In general, in order to deposit a thin film having a predetermined thickness on a substrate (e.g., a wafer, a plastic substrate, or a glass), a physical vapor deposition (PVD) method using physical impulse such as sputtering And a chemical vapor deposition (CVD) method using a chemical reaction can be used.

Here, the chemical vapor deposition method is a method in which a predetermined thin film is formed on a substrate through a chemical reaction of gaseous raw material (process gas) supplied to the process chamber, and the step coverage of the thin film formed on the substrate (Step Coverage), uniformity, and mass productivity, which are the most widely used. The chemical vapor deposition process may be performed by a chemical vapor deposition process such as LPCVD (Low Pressure Chemical Vapor Deposition), APCVD (Atmospheric Pressure Chemical Vapor Deposition), LTCVD (Low Temperature Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), MOCVD ), And so on.

For example, in the case of a chemical vapor deposition process, a substrate holder on which a substrate to be deposited is mounted may be provided with a heater. In order to maintain a constant distance from the substrate during the substrate loading / , And a lifting unit for lifting and lowering the substrate holder.

Also, the temperature in the process chamber is often maintained at a high temperature for a continuous deposition process or the like.

Thus, the process chamber maintained at a high temperature can be thermally expanded, and the bottom of the process chamber can be expanded in the horizontal direction by this thermal expansion.

Horizontal expansion or contraction of the process chamber lower surface supports the process chamber and substrate substrate holder vertically and makes it difficult to twist the shafts of the lifting unit performing the lift function in a horizontal direction or maintain a vertical state.

Problems related to the thermal deformation of the process chamber may cause a problem of lowering the durability of the guide bushes and the like mounted when the shafts are vertically penetrated through the plates constituting the lifting unit.

The present invention provides a substrate processing apparatus capable of minimizing problems such as a decrease in durability due to thermal deformation of a lifting unit provided at a lower portion of a process chamber for raising and lowering a substrate holder by heat transmitted from a process chamber of the substrate processing apparatus And to solve the problem.

According to an aspect of the present invention, there is provided a substrate processing apparatus including a processing chamber in which a deposition process is performed, a lead shielding an upper portion of the processing chamber, a substrate holder in which a substrate to be deposited is placed in the process chamber, And thermal deformation buffering means for buffering the horizontal expansion or contraction deformation of the lifting unit in accordance with the thermal deformation of the bottom surface of the process chamber, the sliding deformation being mounted on the lifting unit and slidable in a predetermined direction A substrate processing apparatus is provided.

The lifting unit includes at least one lifting shaft for supporting the lower surface of the substrate holder so that the substrate holder can be lifted and lowered, a lower end of the lifting shaft is fixed, At least one guide shaft disposed vertically through the lifting plate and guiding the lifting operation of the lifting plate, and an upper plate to which the upper end of the guide shaft is fixed.

Here, the upper end of the sliding member of the thermal strain buffer means may be fixed to the lower surface of the process chamber through the upper plate.

The thermal deformation buffering means includes a bracket member for supporting a lower end of the sliding member such that a lower end of the sliding member is allowed to slide in a predetermined range, and a sliding plate to which the bracket member is fixed and is engaged with the upper plate. .

The bracket member supporting the sliding member so as to be slidable may be fastened by the fastening member in a state of being seated in a seating groove formed in a bottom surface of the sliding plate.

The sliding plate and the upper plate may be coupled by a height adjusting bolt to adjust the height between the sliding plate provided below the upper plate and the upper plate or the process chamber.

The plurality of thermal deformation buffering means may be provided, and a plurality of the sliding plates constituting each of the thermal deformation buffering means may be fastened at a position spaced apart from the upper plate.

Further, at least two of the sliding members are provided in one of the sliding plates via the respective bracket members, and the sliding directions of the respective sliding members may be different from each other.

Here, the sliding member may be fastened to the lower surface of the process chamber by a fastening member penetrating the inside of the bracket member and the sliding member.

The predetermined direction may be the direction of the center of the substrate holder or the direction of the driving shaft of the driving unit.

The sliding member may be mounted on the bracket member so as to be slidable in the longitudinal direction of the sliding member.

Here, the sliding direction of the sliding member in the opening formed in the bracket member, the sliding plate, and the upper plate may be greater than a width of a long side of the sliding member.

The substrate processing apparatus according to the present invention minimizes problems such as a decrease in durability due to thermal deformation of a lifting unit provided at a lower portion of a process chamber for raising and lowering a substrate holder by heat transmitted from the process chamber.

Specifically, in the substrate processing apparatus according to the present invention, the process chamber and the upper plate of the guide shaft are connected to each other with the upper plate fixed thereon, and the thermal strain buffering means absorbs and buffers the horizontal thermal expansion of the process chamber, It is possible to minimize the torsion in the horizontal direction applied to the guide shaft or the like constituting the lifting unit.

Further, according to the substrate processing apparatus of the present invention, since the horizontal direction twisting and the like applied to the guide shaft constituting the lifting unit can be minimized, the durability of the bushing or the like provided in the guide shaft or the like can be improved, Savings and efficiency of the process.

1 is a side view of a substrate processing apparatus according to the present invention and a downward perspective view of the substrate processing apparatus with the lid removed.
Fig. 2 shows an upward perspective view showing the combination of the lifting unit constituting the substrate processing apparatus according to the present invention, the processing chamber, and the substrate substrate holder.
Fig. 3 shows a perspective view of a lifting unit constituting the substrate processing apparatus according to the present invention.
Fig. 4 shows a perspective view of the lifting unit shown in Fig. 3 with the top plate removed.
Fig. 5 shows a thermal strain buffering means constituting the substrate processing apparatus according to the present invention.
Fig. 6 shows a sliding member and a bracket member constituting the thermal deformation buffering means shown in Fig.
Fig. 7 shows a sliding plate constituting the thermal strain buffering means shown in Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals designate like elements throughout the specification.

Fig. 1 shows a side view of the substrate processing apparatus 1 according to the present invention and a downward perspective view of the substrate processing apparatus 1 with the lid 100 removed. 1 (b) is a bottom perspective view of the substrate processing apparatus 1 in a state where the lead 100 is removed. FIG. 1 (a) is a side view of the substrate processing apparatus 1 according to the present invention, / RTI >

A substrate processing apparatus according to the present invention includes a process chamber 200 in which a deposition process is performed, a lead 100 that shields an upper portion of the process chamber 200, a substrate holder 400 in which a substrate to be deposited is placed, , A lifting unit (300) for lifting and lowering the substrate holder (400), and a sliding member mounted on the lifting unit (300) and slidable in a predetermined direction, (Not shown) for buffering the horizontal expansion or shrinkage deformation of the lifting unit 300.

The process chamber 200 may have a deposition space on the inside thereof where deposition is performed. The lead 100 may include an injector for closing the process chamber 200 and supplying a process gas to supply the process gases required for the deposition process.

The substrate holder 400 for supporting a substrate to be deposited may include a substrate holder 400 for holding a substrate to be deposited, the substrate holder 400 for holding a substrate to be deposited, (Not shown).

The substrate processing apparatus 1 shown in FIG. 1 may be a deposition apparatus for depositing a thin film having a predetermined thickness on a substrate (for example, a wafer, a plastic substrate, or a glass) In the illustrated embodiment, the substrate holder 400 is shown to have a rectangular shape, but the present invention is not limited thereto and a circular substrate holder 400 may be provided.

The substrate processing apparatus 1 according to the present invention may include a lifting unit 300 that supports the process chamber 200 and lifts and drives the substrate holder 400 provided inside the process chamber 200 .

The lifting unit 300 needs a function of lifting the substrate holder 400 in the process of adjusting the distance of the substrate to be deposited or the distance between the injector and the substrate.

Accordingly, the lifting unit 300 may be provided to lift the substrate holder 400 inside the process chamber 200 while supporting the process chamber 200.

Each of the plates constituting the lifting unit 300 may have a shape corresponding to the shape of the substrate holder 400 or the process chamber 200 and each of the shafts constituting the lifting unit 300 Or may be provided in corner areas or in corner areas of each plate.

2 shows an upward perspective view showing the combination of the lifting unit 300 constituting the substrate processing apparatus 1 according to the present invention and the processing chamber 200 and the substrate substrate holder 400. As shown in Fig. 2 (a) shows a state in which the lifting unit 300 supports the process chamber 200 in a state where the process chamber 200 of the substrate processing apparatus 1 is provided, and FIG. 2 (b) Shows a state in which the lifting unit 300 supports the substrate holder 400 with the process chamber 200 of the substrate processing apparatus 1 removed.

The lifting unit 300 constituting the substrate processing apparatus according to the present invention includes at least one lifting shaft 310 for supporting the lower surface of the substrate loading table 400 so that the substrate loading table 400 can be elevated, A lifting plate 340 fixed to the lower end of the lifting plate 340 and driven by the drive unit driving the substrate lifting table 340 and a lifting plate 340 disposed vertically through the lifting plate 340, At least one guide shaft 320 guiding the guide shaft 320, and an upper plate 330 to which the upper end of the guide shaft 320 is fixed.

In the embodiment shown in FIG. 2, four of the lifting shafts 310 may be configured to connect and support the lifting plate 340 and the substrate holder 400.

In this case, the lifting shaft 310 may be connected to the substrate holder 400 through a lower surface of the process chamber.

The driving shaft 610 constituting the driving unit is driven by a motor or the like and provided at a lower portion of the center of the substrate placing table 400 to provide a driving force to the substrate placing table 400, Can be driven.

Since the substrate holder 400 and the lifting plate 340 may have a rectangular shape, four lifting shafts 310 may be provided perpendicularly to the edge regions of the lifting plate 340 and the substrate holder 400 It is possible to support the ascending and descending processes of the substrate rest 400.

When the driving unit is driven, the lifting plate 340 can be lifted and lowered together with the substrate holder 400, and the driving of the lifting plate 340 is indirectly supported A guide shaft 320 may be provided.

Four guide shafts 320 are provided in the edge regions of the lifting plate 340 to guide the lifting and lowering of the lifting and lowering plate 340. The lifting and lowering of the lifting and lowering plate 340 It is possible to guide the lifting and lowering.

The upper and lower ends of the guide shaft 320 may include an upper plate 330 and a lower plate 350, respectively.

The upper and lower ends of the guide shafts 320 may be fixed to the upper plate 330 and the lower plate 350, respectively.

Accordingly, the upper and lower plates 330 and 350 may be fixed to the upper and lower ends of the guide shaft 320 in a state in which the lifting plate 340 is inserted through the guide shaft 320.

The guide shaft 320 connecting the upper plate 330 and the lower plate 350 guides the lifting operation of the lifting plate 340 and guides the process chamber 200 to the thermal strain buffering means 500 and the upper plate 330 indirectly.

Conventionally, the process chamber 200 has a structure in which the process chamber 200 is directly connected to the upper plate 330. However, since the process chamber 200 can be continuously exposed to heat or heated, the process chamber 200, The deformation can be repeated.

When the thermal deformation of the process chamber 200 occurs, a horizontal stress may be applied to the guide shaft 320 for supporting the process chamber 200, and a stress applied to the guide shaft 320 The beating of the guide shaft 320 generated by the guide shaft 320 causes a problem of lowering the durability of the guide bush 322 or the like for mounting the lift plate 340 on the guide shaft 320 so as to be able to move up and down.

Accordingly, the lifting unit 300 constituting the substrate processing apparatus 1 according to the present invention supports the lower surface of the process chamber 200 and buffers thermal deformation of the process chamber 200, (500) of FIG. 3 connecting the top plate (200) and the top plate (330).

3, the thermal strain buffering means 500 does not use a method of directly connecting the process chamber 200 and the upper plate 330 to support the process chamber 200, The thermal deformation buffering means 500 serves to buffer the thermal deformation in the horizontal direction of the process chamber 200 by connecting the process chamber 200 and the upper plate 330 through the buffering means 500 can do.

The thermal strain buffering means 500 may include a sliding member 510 capable of sliding in the horizontal direction corresponding to thermal deformation due to thermal expansion or thermal contraction of the lower surface of the process chamber 200.

As shown in FIG. 2 (a), the sliding member 510 can be coupled with the lower surface of the process chamber 200 through the upper plate 330.

The sliding member 510 fastened to the lower surface of the process chamber 200 can slide in a predetermined direction corresponding to the expansion of the lower surface of the process chamber 200.

3, the thermal strain buffering unit 500 constituting the lifting unit 300 according to the present invention will be described in detail.

3 is a perspective view of a lifting unit 300 constituting the substrate processing apparatus 1 according to the present invention. FIG. 4 is a sectional view of the lifting unit 300 shown in FIG. Fig.

As shown in FIG. 3, a plurality of sliding members 510 constituting the thermal strain buffering unit 500 may be slidable in different predetermined directions.

The sliding member 510 may extend through the opening 331 formed in the upper plate 330 toward the process chamber 200.

The opening 331 is larger than the sectional area of the sliding member 510 so that the opening 331 has a width Sb and a lateral gap having a width Sb Sa). ≪ / RTI >

When the opening 331 is formed so as to have a gap of width Sa and Sb in a state where the sliding member 510 penetrates the opening 331, It is possible to allow sliding of the sliding member 510 when the member 510 expands or contracts according to the thermal deformation of the process chamber 200 and the thermal deformation buffering means 500 and the upper plate 330 The position of the sliding member 510 can be changed in the height adjusting process or the balance adjusting process by the height adjusting bolt 530 for connecting the sliding member 510. [

In the embodiment shown in Figs. 3 and 4, three thermal deformation buffering means 500 are shown. The first through third thermal strain buffering units 500 each include two, two, and four sliding members 510, respectively.

In addition, each thermal strain buffering means 500 includes a sliding plate 520 on which the sliding member 510 is slidably mounted, as shown in FIG.

The sliding plate 520 is fastened to the sliding plate 520 in a state where the sliding member 510 is slidably mounted on a bracket member 540 and 550 of FIGS. 5 and 6, And can be fastened by the plate 330 and the height adjusting bolts (see 530 in FIG. 5).

The sliding member 510 is fixed to the lower surface of the process chamber 200 through the sliding plate 520 so as to be able to slide in accordance with the thermal expansion of the lower surface of the process chamber 200. [ .

Even if thermal deformation such as thermal expansion or thermal shrinkage of the lower surface of the process chamber 200 occurs due to such a structure, the sliding member 510 is set in advance with respect to the sliding plate 520 fixed to the upper plate 330 The torsional stress or the like can be prevented from being transmitted to the guide shaft 320 connected to the upper plate 330 in accordance with the thermal expansion of the lower surface of the process chamber 200. Therefore, The guide bush 322 and the like for mounting the lifting plate 340 guided by the guide shaft 320 to the guide shaft 320 and the like and the friction between the guide shaft 320 and the lifting unit 300, It is possible to improve the durability.

Each of the sliding members 510 slidably provided in the respective sliding plates 520 may be slidable in a predetermined direction, and the predetermined direction may be the direction of the center of the substrate holder 400, As shown in FIG.

The amount of thermal expansion of the process chamber 200 is the smallest in the bottom center region of the process chamber 200, and the larger the amount of thermal expansion is, the larger the amount of thermal expansion is. Therefore, it is preferable that the sliding member 510 is connected to the upper plate 330 so as to be slidable in the thermal expansion direction of the lower surface of the process chamber 200.

In addition, the predetermined direction may be a direction of the driving shaft 610 constituting a driving unit for driving the substrate holder 400. This is because the drive shaft 610 can be provided at the center of the process chamber 200 or the substrate holder 400.

The number of sliding members 510 to be mounted on one sliding plate 520 constituting the thermal strain buffering means 500 may be one or plural.

3 and 4 illustrate that the first through third thermal strain buffering devices 500 illustrate a lifting unit 300 having two, two, and four sliding members 510, respectively, .

Even when a plurality of sliding members 510 are provided on one sliding plate 520, the sliding directions of the sliding members 510 are respectively set to be the center direction of the lower surface of the process chamber 200 or the driving shaft direction .

5 shows a thermal strain buffering device 500 constituting the substrate processing apparatus 1 according to the present invention. FIG. 6 shows a sliding member 510 constituting the thermal strain buffering device 500 shown in FIG. 5, And bracket members 540 and 550, respectively.

5 (a) shows a perspective view of a thermal strain buffering device 500 according to the present invention, and Fig. 5 (b) shows a sliding member 510 mounted on bracket members 540 and 550 , And FIG. 5 (c) is a plan view of the sliding member 510 mounted on the bracket members 540 and 550.

6A and 6B are perspective views of the sliding member 510 and FIGS. 6B and 6C are perspective views of the upper bracket member 540 (FIG. 6A) mounted on the lower end of the sliding member 510 6 (d) and 6 (e) show a lower bracket member 550 mounted on a lower portion of the lower end of the sliding member 510. FIG.

As described above, even when a plurality of sliding members 510 are provided in one sliding plate 520, each of the sliding members 510 is moved in the direction of the center of the lower surface of the process chamber 200 or in the direction of the driving shaft . The thermal strain buffering means 500 may be connected by the height adjusting bolts 530 for connecting the upper plate 330 and the thermal strain buffering means 500.

As shown in FIG. 6A, the sliding member 510 may be formed with a protrusion 516 in the long-side direction.

The protruding direction of the protrusion 516 of the sliding member 510 may be perpendicular to the sliding direction of the sliding member 510.

The sliding member 510 shown in FIG. 5A can be fastened to the process chamber 200 by the fastening member 512, and as shown in FIG. 6A, A fastening hole 514 may be formed in the longitudinal direction of the shaft 510.

5 and 6, the cross section of the sliding member 510 may have a rectangular shape. The sliding member 510 is not limited to the rectangular shape and may have various shapes (for example, a cylindrical shape, a circular shape, and the like) that can slide on the sliding plate 520 according to thermal deformation of the process chamber 200, An elliptical shape, etc.). In addition, the sliding member 510 may be configured to be slidable in the long side direction having a long side width.

If the sliding member 510 is configured to slide in the direction of the short side of the sliding member 510, the fastening portion of the process chamber 200 and the upper end of the sliding member 510 may be structurally weakened during the sliding process. The structural stability of the fastening portion of the sliding member 510 and the process chamber 200 can be enhanced.

The upper bracket member 540 shown in FIGS. 6 (b) and 6 (c) may have an opening 541h through which the sliding member 510 passes, And a locking protrusion 541p for locking the lower protrusion 516 of the sliding member 510 may be provided.

The protrusion 516 of the sliding member 510 can be prevented from being separated by the opening 541h of the bracket member due to the engagement of the protrusion 516 of the sliding member 510 by the locking protrusion 541p.

5 (c), if the width of the long side of the sliding member 510 is smaller than the length of the opening 541h of the upper bracket member 540, the clearance 560 Can be formed in both the short side direction and the sliding member 510 can secure a sliding range of about twice the width of the clearance 560. [

As shown in FIG. 6, the upper bracket member 540 and the lower bracket member 550 are provided with a plurality of fastening holes 543h and 553h in the long side direction, respectively. The reason why the fastening holes 543h of the upper bracket member 540 is greater than the fastening holes 553h of the lower bracket member 550 is that the upper bracket member 540 is fastened to the sliding plate 520 The sliding member 510 is inserted through the opening and then the lower bracket member 550 is fastened to the sliding plate 520 together.

A large fastening hole 555h for fastening member for fastening the sliding member 510 to the process chamber 200 may be provided at the center of the lower bracket member 550. [ The thermal deformation buffering means 500 of the substrate processing apparatus 1 according to the present invention is constructed such that the sliding member 510 is fastened to the sliding plate 520 via upper and lower bracket members 540 and 550 And finally to the process chamber 200.

The sliding member 510 may be fastened to the sliding plate 520 by a predetermined distance in a predetermined direction via the upper and lower bracket members 540 and 550.

Therefore, when the process chamber 200 undergoes thermal deformation such as thermal expansion or thermal shrinkage, it can be displaced on the sliding plate 520 according to the amount of displacement of the lower surface of the process chamber 200, It is possible to prevent transmission of stress and the like due to thermal deformation to the side of the upper plate 330 fastened by the adjustment bolt.

Fig. 7 shows the sliding plate 520 constituting the thermal strain buffering means 500 shown in Fig. 7 (a) shows a plan view of the upper surface of the sliding plate 520, and Fig. 7 (b) shows a plan view of the lower surface of the sliding plate 520. Fig.

The sliding plate 520 may be formed with a fastening hole 523h for a fastening member such as at least one height adjusting bolt and an opening 521h for penetrating at least one sliding member 510, The illustrated embodiment shows an example in which two openings 521h are formed. The rectangular shaped opening 521h may be formed such that the sliding direction of the sliding member 510 is the center of the lower surface of the process chamber or the direction of the driving shaft.

An upper bracket member (see 540 in FIG. 5 or 6) for supporting the sliding member 510 so as to be slidable may be inserted into the seating groove 521g formed in the sliding plate 520, as shown in FIG. 7 (b) And a fastening hole for fastening a number of fastening members corresponding to the number of fastening holes provided in the upper bracket member 540 is formed in the seating groove 521g in the long side direction of the inner side of the fastening hole .

(See reference numeral 500 in Fig. 3) provided with a thermal strain buffering device having such a structure, so that a horizontal twist or the like applied to a guide shaft (refer to 320 in Fig. 3) constituting the lifting unit The durability of the lifting unit can be improved, and the cost reduction and the process efficiency improvement of the entire deposition process can be expected.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

1: substrate processing apparatus
100: Lead
200: process chamber
300: lifting unit
400: substrate holder
500: thermal deformation buffering means

Claims (12)

A process chamber in which a deposition process is performed;
A lid shielding the upper portion of the process chamber;
A substrate holder on which a substrate to be deposited is placed in the process chamber;
A lifting unit for lifting and lowering the substrate holder; And
And a thermal deformation buffering means for buffering horizontal expansion or contraction deformation of the lifting unit in accordance with thermal deformation of the bottom surface of the process chamber, Processing device. The method according to claim 1,
The lifting unit
At least one lifting shaft for supporting a lower surface of the substrate holder so that the substrate holder can move up and down;
A lift plate fixed to a lower end of the lift shaft and driven by a drive unit driving the substrate holder;
At least one guide shaft disposed vertically through the lifting plate and guiding the lifting operation of the lifting plate; And
And an upper plate on which the upper end of the guide shaft is fixed. 3. The method of claim 2,
Wherein an upper end of the sliding member of the thermal strain buffering means is fastened to the lower surface of the process chamber through the upper plate and is fixed. The method of claim 3,
Wherein the thermal deformation buffering means comprises: a bracket member for supporting a lower end of the sliding member such that a lower end of the sliding member is allowed to slide in a predetermined range; And
And a sliding plate to which the bracket member is fixed and which is engaged with the upper plate. 5. The method of claim 4,
Wherein the bracket member supporting the sliding member so as to be slidable is fastened by a fastening member in a state of being seated in a seating groove formed in a bottom surface of the sliding plate. 5. The method of claim 4,
Wherein the sliding plate and the upper plate are coupled by a height adjusting bolt to adjust the height between the sliding plate provided below the upper plate and the upper plate or the process chamber. 5. The method of claim 4,
Wherein the plurality of thermal deformation buffering means are provided, and a plurality of the sliding plates constituting each thermal deformation buffering means are fastened at a position spaced apart from the upper plate. 5. The method of claim 4,
Wherein at least two of the sliding members are provided in one of the sliding plates via respective bracket members, and the sliding directions of the sliding members are different from each other. 5. The method of claim 4,
Wherein the sliding member is fastened to the lower surface of the process chamber by a fastening member penetrating the inside of the bracket member and the sliding member. 3. The method of claim 2,
Wherein the predetermined direction is the direction of the center of the substrate holder or the direction of the driving shaft of the driving unit. 5. The method of claim 4,
Wherein the sliding member is mounted on the bracket member so as to be slidable in the longitudinal direction of the sliding member. 5. The method of claim 4,
Wherein the sliding direction of the sliding member in an opening formed in the bracket member, the sliding plate, and the upper plate is greater than a width of a long side of the sliding member.

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