KR101447017B1 - Carrier module for testing semiconductor package - Google Patents

Abstract

The present invention provides a semiconductor package comprising: a socket having an electrode pin formed to be connected to a semiconductor package; and a guide pin disposed in parallel with the electrode pin; A socket base on which the socket is seated, and an alignment pin located outside the seating portion; And a carrier having a pocket portion formed to receive the semiconductor package, a guide hole formed to receive the guide pin, and an alignment hole formed to receive the alignment pin. to provide.

Description

[0001] CARRIER MODULE FOR TESTING SEMICONDUCTOR PACKAGE [0002]

The present invention relates to a carrier module used for testing semiconductor packages.

In general, a semiconductor package completed by a manufacturing process is checked if the operating characteristics are properly implemented through a test (inspection) process, and then shipped when it is classified as a good product.

For this test, a tray is provided with a plurality of carriers that accommodate semiconductor packages, each of which is configured to be able to insert a semiconductor package into a test socket while accommodating the semiconductor package.

In recent years, since the interval between the electrodes of the semiconductor package has become smaller, it is becoming more important to accurately align the electrode pins of each electrode and the socket for accurate testing.

An object of the present invention is to provide a carrier module for semiconductor package testing, which can more accurately align the electrodes of the semiconductor package and the electrode pins of the socket.

It is a further object of the present invention to provide a carrier module for semiconductor package testing that allows alignment between the electrodes of the semiconductor package and the electrode pins of the socket to be more precisely performed through the primary and secondary alignment means.

According to an aspect of the present invention, there is provided a carrier module for testing a semiconductor package, including: a socket having an electrode pin formed to be connected to a semiconductor package; and a guide pin disposed in parallel with the electrode pin; A socket base having a size that is sized to have a clearance with the socket, the socket being opened to receive the socket, and an alignment pin located outside the seating portion; And a carrier having a pocket portion formed by one member, wherein the pocket portion includes: a receiving hole formed to receive the semiconductor package; a guide hole formed to receive the guide pin; Wherein the alignment pin, the alignment hole, the guide pin, and the guide hole are formed such that after the alignment pin is first inserted into the alignment hole, the guide pin is inserted into the guide hole And may have a size in which insertion by a car is started.

The socket may further include a body having a central region in which the electrode pin is installed, and a peripheral region surrounding the central region, the peripheral region being provided with the guide pin.

Here, the electrode pins may be arranged to form a square ring, and the guide pins may be provided corresponding to four corners of the square ring and four.

Here, the socket base may include: a main region in which the seating portion is opened; And a wing region located on both sides of the main region and in which the alignment pins are disposed.

Here, the pocket portion may include: a main frame having a receiving hole for receiving the semiconductor package; And a wing frame extending from both sides of the main frame, wherein the alignment holes are formed.

Here, the guide hole may be formed in the main frame so as to be located outside the receiving hole.

Here, the carrier may further include a support portion formed on the main frame to support the semiconductor package accommodated in the accommodation hole.

Here, the support portion may include a plurality of support plates spaced apart from each other along the contour direction of the receiving hole.

Here, the receiving hole may be formed in a rectangular shape, and the plurality of support plates may be integrally formed with the main frame at four positions so as to be respectively located at four corners of the square.

Here, the supporting plate may include a through-hole formed corresponding to two adjacent sides of the quadrangle and having a plurality of through-holes opened to insert the electrode pin therein; And a closing portion of a triangle defined by two boundary sides which are wrapped by the penetration portion and free sides connecting the two boundary sides.

According to the carrier module for semiconductor package testing according to the present invention configured as described above, the alignment between the electrode of the semiconductor package and the electrode pin of the socket can be more accurately performed.

Further, according to the carrier module for testing a semiconductor package according to the present invention, the alignment between the electrode of the semiconductor package and the electrode pin of the socket can be performed more precisely through the primary and secondary alignment means.

1 is a partially exploded perspective view of a carrier module 100 for testing semiconductor packages according to an embodiment of the present invention.
2 is an enlarged perspective view of the socket 110 of FIG.
3 is an enlarged perspective view showing a bottom surface of the carrier 150 of FIG.
4 is a conceptual plan view showing a support plate 154 formed in the pocket portion 151 of the carrier 150 of FIG.
5 is a cutaway perspective view of the carrier module 100 for testing a semiconductor package in a state in which the carrier 150 is aligned with respect to the socket base 130 in FIG.
6 is a cutaway perspective view of the carrier module 100 for testing semiconductor packages with the carrier 150 of FIG. 5 further lowered relative to the socket 110. FIG.

Hereinafter, a carrier module for testing a semiconductor package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

1 is a partially exploded perspective view of a carrier module 100 for testing semiconductor packages according to an embodiment of the present invention.

Referring to this figure, the semiconductor package test carrier module 100 may include a socket 110, a socket base 130, and a carrier 150.

The socket 110 may include an electrode pin 111 and a guide pin 113. The electrode pin 111 is formed of a conductive material. Thereby, the electrode pin 111 can mediate an electrical connection between the circuit board B and the semiconductor package P. [ The guide pin 113 is disposed in parallel with the electrode pin 111. [ The guide pin 113 is configured to guide the carrier 150 to the correct position with respect to the socket 110 together with the guide hole 157 (FIG. 3).

The socket base 130 is mounted on the circuit board B and is formed to support the socket 110 and the carrier 150. Specifically, the socket base 130 may include a seating portion 131 and an alignment pin 133. The seating portion 131 is a portion where the socket 110 is seated. Alignment pin 133 is located outside seating portion 131 and permits carrier 150 to align with socket base 130 in alignment with alignment hole 158 (Figure 3). The socket base 130 may include a main area 135 and a wing area 137 in terms of area. The main region 135 may be a central portion of the socket base 130 and the wing region 137 may be a peripheral portion extending to both sides of the main region 135. At this time, a seating part 131 is formed through the main area 135, and an alignment pin 133 is protruded from the wing area 137. Corresponding to the wing region 137 consisting of a pair of sub-regions, the alignment pins 133 may be provided in pairs that lie in each sub-region.

The carrier 150 is configured to accommodate a package P to be electrically connected to the socket 110. The carrier 150 may specifically include a pocket portion 151 and a support portion.

The pocket portion 151 may include a main frame 152 and a wing frame 153. The main frame 152 is located at the center of the pocket portion 151 and the wing frame 153 is located at both sides of the main frame 152. In the main frame 152, a receiving hole 152a for receiving the package P is opened. The receiving hole 152a may be an opening having a substantially rectangular cross section corresponding to the shape of the carrier 150. [

The support part is provided on the main frame 152 to support the package P. The support portion may include a plurality of support plates 154 that are disposed on the inner circumferential surface of the receiving hole 152a. This support plate 154 will be described in detail with reference to FIG.

The socket 110 and the carrier 150 are described in more detail with reference to FIGS. 2 to 4. FIG.

2 is an enlarged perspective view of the socket 110 of FIG.

Referring to the drawings, the socket 110 may further include a body having a central region 115 and a peripheral region 117. The body has a size corresponding to the seating portion 131 of the socket base 130. In this embodiment, the body is shaped like a generally rectangular plate.

The central region 115 is located at the center of the body. The central region 115 may protrude from other portions of the body (the peripheral region 117). The central region 115 protrudes in a generally rectangular cross section. Thereby, the central region 115 is provided with four corner portions 111a to 111d. In the central region 115, a plurality of electrode pins 111 may be arranged to form a rectangular ring. The number and arrangement of the electrode pins 111 will be determined corresponding to the electrode E (FIG. 6) of the target chain package P connected to the electrode pins 111.

The peripheral region 117 is an area formed to surround the central region 115. Thereby, the peripheral region 117 will have a generally rectangular donut shape. In the peripheral area 117, a guide pin 113 is provided. The guide pin 113 may be arranged in parallel with the electrode pin 111. [ Further, the guide pin 113 may be provided in four corners corresponding to the four corner portions 111a to 111d of the central region 115. The free end of the guide pin 113 may protrude from the free end of the electrode pin 111.

Next, Fig. 3 is an enlarged perspective view showing a bottom surface of the carrier 150 of Fig.

The carrier 150 may further include a guide hole 157 and an alignment hole 158 in addition to the pocket portion 151 and the support plate 154. [

The guide hole 157 is a structure for receiving the guide pin 113 of the socket 110 and positioning the carrier 150 in the correct position with respect to the socket 110. The guide hole 157 may be formed in the main frame 152 of the pocket portion 151. [ Specifically, the guide hole 157 is formed in the main frame 152 so as to be positioned outside the receiving hole 152a of the main frame 152. [ The guide holes 157 may be formed in four corresponding to the four guide pins 113. [ At this time, the four guide holes 157 may be arranged to correspond to the four corners of the receiving hole 152a, respectively.

The alignment holes 158 are configured to receive the alignment pins 133 of the socket base 130 and position the carrier 150 in position relative to the socket base 130. The alignment holes 158 may be formed in the wing frame 153 of the pocket portion 151. Specifically, the alignment holes 158 may be formed one by one in the two sub regions of the wing frame 153 corresponding to the alignment pins 133.

Next, FIG. 4 is a conceptual plan view showing a support plate 154 formed in the pocket portion 151 of the carrier 150 of FIG.

Referring to this figure, a plurality of support plates 154 may be disposed apart from each other along the contour direction of the accommodation hole 152a. In this embodiment, the support plates 154 are provided in four, and are arranged one by one at the four corners of the accommodation hole 152a. The support plate 154 may be injection molded integrally with the main frame 152.

The support plate 154 may include a penetrating portion 155 and a closing portion 156. The penetrating portion 155 is a region where the through hole 155a is formed, whereas the closing portion 156 is a region where the through hole 155a is not formed but a plugged region. The electrode E of the package P and the electrode pin 111 of the socket 110 may be inserted into the through hole 155a. The through-holes 155a of the through-holes 155 are arranged corresponding to two adjacent sides of the receiving holes 152a. The closing portion 156 may include two boundary edges 156a wrapped by the penetration portion 155 and free edges 156b connecting the two boundary edges 156a. Thereby, the closure 156 can have a generally triangular shape.

An exemplary method of using the carrier module for semiconductor package test 100 described above will be described with reference to FIGS. 5 and 6. FIG.

First, FIG. 5 is a cutaway perspective view of the carrier module 100 for testing a semiconductor package with the carrier 150 aligned with respect to the socket base 130 in FIG.

Referring to this figure, the carrier 150 must be primarily aligned with respect to the socket base 130. For this purpose, when the carrier 150 is lowered toward the socket base 130, an alignment position in which the alignment pin 133 of the socket base 130 is inserted into the alignment hole 158 of the carrier 150 is found.

The two alignment pins 133 located on both sides of the socket 110 are inserted into the corresponding two alignment holes 158 so that the carrier 150 is properly aligned with respect to the socket base 130 It can be confirmed that it is descending.

By this primary alignment and descent, the guide pin 113 of the socket 110 is in a state corresponding to the entrance of the guide hole 157 of the carrier 150.

6 is a cutaway perspective view of the carrier module 100 for testing semiconductor packages with the carrier 150 of FIG. 5 further lowered relative to the socket 110. FIG.

The guide pin 113 of the socket 110 passes through the entrance of the guide hole 157 of the carrier 150 and is guided to the guide hole 157 of the guide hole 157. [ As shown in FIG.

By this secondary alignment and descent, the electrode pins 111 of the socket 110 and the electrodes E of the package P of the carrier 150 correspond to each other. The electrode E of the package P is inserted into the through hole 155a of the support plate 154 or exposed to the electrode pin 111 through the portion of the accommodation hole 152a where the support plate 154 is not provided State.

As the carrier 150 is further lowered, the electrode E of the package P physically contacts the electrode pin 111 of the socket 110. Thereby, the electrode (E) is electrically connected to the electrode pin (111).

At this time, the alignment pin 133 is inserted into the alignment hole 158 to allow the carrier 150 to be positioned in position relative to the socket base 130 (first alignment). The guide pin 113 is also inserted into the guide hole 157 to place the carrier 150 in position relative to the socket 110 (second alignment). Since the first alignment only can not completely prevent the electrode pins 111 and the electrode E from being inconsistent due to the assembly tolerance between the socket 110 and the socket base 130, It is possible to overcome the assembly tolerance and achieve more complete alignment (alignment) of the electrode pin 111 and the electrode E.

The carrier module for testing semiconductor packages as described above is not limited to the configuration and operation of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: Carrier module for semiconductor package test
110: socket 111: electrode pin
113: guide pin 130: socket base
131: seat part 133: alignment pin
150: carrier 151: pocket portion
154: support plate 157: guide hole
158: Alignment hole

Claims (10)

An electrode pin formed to be connected to the semiconductor package, and a guide pin disposed in parallel with the electrode pin;
A socket base having a size that is sized to have a clearance with the socket, the socket being opened to receive the socket, and an alignment pin located outside the seating portion; And
And a carrier having a pocket portion formed in one member,
The pocket portion
A guide hole formed to receive the guide pin; and an alignment hole formed to receive the alignment pin,
Wherein the alignment pin, the alignment hole, the guide pin,
Wherein the guide pin has a size such that insertion of the guide pin into the guide hole is initiated secondarily after the alignment pin is firstly inserted into the alignment hole.
The method according to claim 1,
The socket includes:
Further comprising a body having a central region in which the electrode pin is installed, and a peripheral region surrounding the central region, the peripheral region being provided with the guide pin.
3. The method of claim 2,
The electrode pins are arranged to form a rectangular ring,
Wherein the guide pins are provided at four corners corresponding to four corners of the rectangular ring, respectively.
3. The method of claim 2,
The socket base includes:
A main region in which the seating portion is open; And
And a wing region located on both sides of the main region and on which the alignment pins are disposed.
3. The method of claim 2,
The pocket portion
A main frame having a receiving hole for receiving the semiconductor package; And
And a wing frame extending from both sides of the main frame to form the alignment holes.
6. The method of claim 5,
And the guide hole is formed in the main frame so as to be located outside the receiving hole.
The method according to claim 6,
Wherein the carrier further comprises a support formed in the main frame to support the semiconductor package housed in the receiving hole.
8. The method of claim 7,
Wherein the support portion includes a plurality of support plates which are disposed apart from each other along the contour direction of the accommodating hole.
9. The method of claim 8,
Wherein the receiving hole is formed in a rectangular shape,
Wherein the plurality of support plates are integrally formed with the main frame at four positions so as to be respectively located at four corners of the square.
10. The method of claim 9,
The support plate
A through-hole formed corresponding to two adjacent sides of the quadrangle and having a plurality of through-holes opened so as to insert the electrode pins; And
And a closing portion of a triangle defined by two boundary sides that are wrapped by the penetration portion and free sides connecting the two boundary sides.

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