KR101428141B1 - 비평탄 물질의 스코어링 - Google Patents

비평탄 물질의 스코어링 Download PDF

Info

Publication number
KR101428141B1
KR101428141B1 KR1020107029167A KR20107029167A KR101428141B1 KR 101428141 B1 KR101428141 B1 KR 101428141B1 KR 1020107029167 A KR1020107029167 A KR 1020107029167A KR 20107029167 A KR20107029167 A KR 20107029167A KR 101428141 B1 KR101428141 B1 KR 101428141B1
Authority
KR
South Korea
Prior art keywords
laser
glass
extended
laser beam
optical head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020107029167A
Other languages
English (en)
Korean (ko)
Other versions
KR20110021956A (ko
Inventor
안나톨리 에이 앱라모브
르저카 우크라인시지크
치 우
내이유 조우
Original Assignee
코닝 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닝 인코포레이티드 filed Critical 코닝 인코포레이티드
Publication of KR20110021956A publication Critical patent/KR20110021956A/ko
Application granted granted Critical
Publication of KR101428141B1 publication Critical patent/KR101428141B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0966—Cylindrical lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020107029167A 2008-05-27 2009-05-14 비평탄 물질의 스코어링 Expired - Fee Related KR101428141B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12894908P 2008-05-27 2008-05-27
US61/128,949 2008-05-27
US12/220,948 2008-07-30
US12/220,948 US8053704B2 (en) 2008-05-27 2008-07-30 Scoring of non-flat materials
PCT/US2009/002988 WO2009151527A2 (en) 2008-05-27 2009-05-14 Scoring of non-flat materials

Publications (2)

Publication Number Publication Date
KR20110021956A KR20110021956A (ko) 2011-03-04
KR101428141B1 true KR101428141B1 (ko) 2014-08-08

Family

ID=41378489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107029167A Expired - Fee Related KR101428141B1 (ko) 2008-05-27 2009-05-14 비평탄 물질의 스코어링

Country Status (6)

Country Link
US (1) US8053704B2 (enExample)
JP (1) JP5563562B2 (enExample)
KR (1) KR101428141B1 (enExample)
CN (1) CN102046545B (enExample)
TW (1) TWI404683B (enExample)
WO (1) WO2009151527A2 (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9302346B2 (en) * 2009-03-20 2016-04-05 Corning, Incorporated Precision laser scoring
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
TWI472494B (zh) * 2009-11-03 2015-02-11 Corning Inc 對以非固定速度移動的玻璃帶進行雷射刻痕
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9212081B2 (en) * 2012-11-21 2015-12-15 Corning Incorporated Methods of cutting a laminate strengthened glass substrate
KR102109091B1 (ko) 2012-11-29 2020-05-12 코닝 인코포레이티드 폭 변경의 유리 리본을 제조하기 위한 방법 및 장치
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
WO2014209926A1 (en) 2013-06-26 2014-12-31 Corning Incorporated Glass ribbon breaking devices and methods of producing glass sheets
JP6594861B2 (ja) * 2013-09-24 2019-10-23 アイピージー フォトニクス コーポレーション ディザリング可能なレーザー処理システム
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
EP3183222B1 (en) * 2014-08-20 2019-12-25 Corning Incorporated Method for yielding high edge strength in cutting of flexible thin glass
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
MX2018001587A (es) * 2015-08-10 2018-05-22 Saint Gobain Metodo para cortar una capa delgada de vidrio.
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109791303A (zh) * 2016-07-15 2019-05-21 特拉迪欧德公司 利用可变光束形状的激光的材料加工
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
WO2018044843A1 (en) 2016-08-30 2018-03-08 Corning Incorporated Laser processing of transparent materials
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7353171B2 (ja) * 2019-12-26 2023-09-29 株式会社ディスコ レーザー加工装置
DE102021121947B3 (de) 2021-08-24 2023-01-26 Holochrom Gmbh Vorrichtung, System und Verfahren zur Erzeugung beweglicher räumlicher visueller Effekte mittels Laserlicht

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5984159A (en) * 1997-04-14 1999-11-16 Schott Glas Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490608A (en) * 1980-10-21 1984-12-25 Crosfield Electronics Limited Position sensor
JPS6384789A (ja) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd 光加工方法
JPH05102561A (ja) * 1991-10-07 1993-04-23 Matsushita Electric Ind Co Ltd ガスレーザ発振装置
US5623473A (en) * 1994-06-30 1997-04-22 Nikon Corporation Method and apparatus for manufacturing a diffraction grating zone plate
JP3782212B2 (ja) * 1997-08-07 2006-06-07 株式会社アマダ 光路長可変レーザー加工装置及び同装置のビームコリメーション方法
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
DE19918936A1 (de) * 1999-04-27 2000-11-02 Schott Glas Verfahren und Vorrichtung zur Herstellung von Einzelglasscheiben
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
KR100701013B1 (ko) * 2001-05-21 2007-03-29 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단방법 및 장치
JP3823108B2 (ja) * 2001-08-10 2006-09-20 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法
JP2005021964A (ja) * 2003-07-02 2005-01-27 National Institute Of Advanced Industrial & Technology レーザーアブレーション加工方法およびその装置
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
US20060021997A1 (en) * 2004-08-02 2006-02-02 Ario Lin Heat sink for gas-fueled appliance
JP3955587B2 (ja) * 2004-08-20 2007-08-08 住友重機械工業株式会社 レーザ照射装置
JP2006142335A (ja) * 2004-11-19 2006-06-08 National Institute Of Advanced Industrial & Technology レーザー加工装置
JP4222296B2 (ja) * 2004-11-22 2009-02-12 住友電気工業株式会社 レーザ加工方法とレーザ加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5984159A (en) * 1997-04-14 1999-11-16 Schott Glas Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring

Also Published As

Publication number Publication date
CN102046545B (zh) 2014-04-30
US20090294419A1 (en) 2009-12-03
WO2009151527A2 (en) 2009-12-17
JP2011522769A (ja) 2011-08-04
WO2009151527A3 (en) 2010-02-25
TWI404683B (zh) 2013-08-11
TW201002638A (en) 2010-01-16
JP5563562B2 (ja) 2014-07-30
KR20110021956A (ko) 2011-03-04
CN102046545A (zh) 2011-05-04
US8053704B2 (en) 2011-11-08

Similar Documents

Publication Publication Date Title
KR101428141B1 (ko) 비평탄 물질의 스코어링
JP6977609B2 (ja) 光照射装置、光照射装置を用いた光加工装置、光照射方法、及び光加工方法
KR200485918Y1 (ko) F-세타 대물렌즈
JP2011520748A (ja) 曲線軌跡を有するレーザ切り込み
CN103100797B (zh) 基于自适应光学的激光微细加工设备和方法
CN113751892A (zh) 一种基于激光光斑能量整形的厚材切割系统
CN110908099A (zh) 一种用于激光焊接机的准远心高功率光学聚焦镜头及其成像方法
CN112548324A (zh) 激光焊接方法和用于激光焊接的设备
CN112756775B (zh) 一种激光加工方法、光学系统及激光加工设备
CN117148565B (zh) 一种可调倍率的前聚焦振镜扫描系统及扫描方法
CN109702322A (zh) 一种激光多焦点切割球差矫正方法及装置
CN114160965B (zh) 激光成丝切割装置
CN216633000U (zh) 一种可调匀化光斑的光学系统
CN109507789B (zh) 一种用于激光加工的远心镜头、激光加工装置及加工方法
US7963122B2 (en) Microprism and microrod lenses, method for the production thereof
CN114559167A (zh) 一种基于逆压电效应调节的变焦激光切割头
JP4499248B2 (ja) レーザ加工方法及びその装置
CN114178712B (zh) 一种激光切割光学系统及方法
CN216966624U (zh) 激光成丝切割装置
CN114326066B (zh) 一种双片式非球面镜连续变倍变焦zoom光学系统
JP2020105055A (ja) ガラスの曲げ加工方法および加工装置
CN107085289A (zh) 一种高功率连续变倍扩束球面镜光学系统
CN110293309B (zh) 一种长工作距的激光光束整形器件
CN114609778B (zh) 一种动态聚焦扫描振镜系统的优化方法及光路结构
US20030062345A1 (en) Apparatus and method for making a lens on the end of an optical waveguide fiber

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20170724

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20180802

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180802