JP5563562B2 - 非平坦材料の罫書き - Google Patents

非平坦材料の罫書き Download PDF

Info

Publication number
JP5563562B2
JP5563562B2 JP2011511598A JP2011511598A JP5563562B2 JP 5563562 B2 JP5563562 B2 JP 5563562B2 JP 2011511598 A JP2011511598 A JP 2011511598A JP 2011511598 A JP2011511598 A JP 2011511598A JP 5563562 B2 JP5563562 B2 JP 5563562B2
Authority
JP
Japan
Prior art keywords
glass
laser
laser beam
optical head
waist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011511598A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011522769A (ja
JP2011522769A5 (enExample
Inventor
エイ アブラモフ，アナトリー
ウクラインクジク，ルジェルカ
ウー，チー
ヂョウ，ナイユエ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of JP2011522769A publication Critical patent/JP2011522769A/ja
Publication of JP2011522769A5 publication Critical patent/JP2011522769A5/ja
Application granted granted Critical
Publication of JP5563562B2 publication Critical patent/JP5563562B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0966—Cylindrical lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2011511598A 2008-05-27 2009-05-14 非平坦材料の罫書き Expired - Fee Related JP5563562B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12894908P 2008-05-27 2008-05-27
US61/128,949 2008-05-27
US12/220,948 2008-07-30
US12/220,948 US8053704B2 (en) 2008-05-27 2008-07-30 Scoring of non-flat materials
PCT/US2009/002988 WO2009151527A2 (en) 2008-05-27 2009-05-14 Scoring of non-flat materials

Publications (3)

Publication Number Publication Date
JP2011522769A JP2011522769A (ja) 2011-08-04
JP2011522769A5 JP2011522769A5 (enExample) 2012-06-07
JP5563562B2 true JP5563562B2 (ja) 2014-07-30

Family

ID=41378489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011511598A Expired - Fee Related JP5563562B2 (ja) 2008-05-27 2009-05-14 非平坦材料の罫書き

Country Status (6)

Country Link
US (1) US8053704B2 (enExample)
JP (1) JP5563562B2 (enExample)
KR (1) KR101428141B1 (enExample)
CN (1) CN102046545B (enExample)
TW (1) TWI404683B (enExample)
WO (1) WO2009151527A2 (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9302346B2 (en) * 2009-03-20 2016-04-05 Corning, Incorporated Precision laser scoring
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
TWI472494B (zh) * 2009-11-03 2015-02-11 Corning Inc 對以非固定速度移動的玻璃帶進行雷射刻痕
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9212081B2 (en) * 2012-11-21 2015-12-15 Corning Incorporated Methods of cutting a laminate strengthened glass substrate
KR102109091B1 (ko) 2012-11-29 2020-05-12 코닝 인코포레이티드 폭 변경의 유리 리본을 제조하기 위한 방법 및 장치
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
WO2014209926A1 (en) 2013-06-26 2014-12-31 Corning Incorporated Glass ribbon breaking devices and methods of producing glass sheets
JP6594861B2 (ja) * 2013-09-24 2019-10-23 アイピージー フォトニクス コーポレーション ディザリング可能なレーザー処理システム
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
EP3183222B1 (en) * 2014-08-20 2019-12-25 Corning Incorporated Method for yielding high edge strength in cutting of flexible thin glass
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
MX2018001587A (es) * 2015-08-10 2018-05-22 Saint Gobain Metodo para cortar una capa delgada de vidrio.
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109791303A (zh) * 2016-07-15 2019-05-21 特拉迪欧德公司 利用可变光束形状的激光的材料加工
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
WO2018044843A1 (en) 2016-08-30 2018-03-08 Corning Incorporated Laser processing of transparent materials
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7353171B2 (ja) * 2019-12-26 2023-09-29 株式会社ディスコ レーザー加工装置
DE102021121947B3 (de) 2021-08-24 2023-01-26 Holochrom Gmbh Vorrichtung, System und Verfahren zur Erzeugung beweglicher räumlicher visueller Effekte mittels Laserlicht

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490608A (en) * 1980-10-21 1984-12-25 Crosfield Electronics Limited Position sensor
JPS6384789A (ja) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd 光加工方法
JPH05102561A (ja) * 1991-10-07 1993-04-23 Matsushita Electric Ind Co Ltd ガスレーザ発振装置
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5623473A (en) * 1994-06-30 1997-04-22 Nikon Corporation Method and apparatus for manufacturing a diffraction grating zone plate
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP3782212B2 (ja) * 1997-08-07 2006-06-07 株式会社アマダ 光路長可変レーザー加工装置及び同装置のビームコリメーション方法
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
DE19918936A1 (de) * 1999-04-27 2000-11-02 Schott Glas Verfahren und Vorrichtung zur Herstellung von Einzelglasscheiben
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
KR100701013B1 (ko) * 2001-05-21 2007-03-29 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단방법 및 장치
JP3823108B2 (ja) * 2001-08-10 2006-09-20 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法
JP2005021964A (ja) * 2003-07-02 2005-01-27 National Institute Of Advanced Industrial & Technology レーザーアブレーション加工方法およびその装置
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
US20060021997A1 (en) * 2004-08-02 2006-02-02 Ario Lin Heat sink for gas-fueled appliance
JP3955587B2 (ja) * 2004-08-20 2007-08-08 住友重機械工業株式会社 レーザ照射装置
JP2006142335A (ja) * 2004-11-19 2006-06-08 National Institute Of Advanced Industrial & Technology レーザー加工装置
JP4222296B2 (ja) * 2004-11-22 2009-02-12 住友電気工業株式会社 レーザ加工方法とレーザ加工装置

Also Published As

Publication number Publication date
CN102046545B (zh) 2014-04-30
US20090294419A1 (en) 2009-12-03
WO2009151527A2 (en) 2009-12-17
JP2011522769A (ja) 2011-08-04
WO2009151527A3 (en) 2010-02-25
TWI404683B (zh) 2013-08-11
TW201002638A (en) 2010-01-16
KR101428141B1 (ko) 2014-08-08
KR20110021956A (ko) 2011-03-04
CN102046545A (zh) 2011-05-04
US8053704B2 (en) 2011-11-08

Similar Documents

Publication Publication Date Title
JP5563562B2 (ja) 非平坦材料の罫書き
JP6977609B2 (ja) 光照射装置、光照射装置を用いた光加工装置、光照射方法、及び光加工方法
KR20110014596A (ko) 만곡된 궤도를 갖는 레이저 스코어링 시스템 및 그 방법
EP2716397B1 (en) Optical system for laser working device, laser working head with such optical system, laser working device with such head, laser focusing method, and laser working method using such method
JP2012521339A (ja) 精密レーザ罫書き
US11292082B2 (en) Method of laser processing of a metallic material with high dynamic control of the movement axes of the laser beam along a predetermined processing path, as well as a machine and a computer program for the implementation of said method
US20220001496A1 (en) Method and apparatus for filamentation of workpieces not having a plan-parallel shape, and workpiece produced by filamentation
WO2014156692A1 (ja) レーザ加工装置及びレーザ加工方法
CN112518141B (zh) 一种激光诱导切割方法及装置
CN103596893A (zh) 玻璃板的切割方法
JP6917003B2 (ja) 光加工装置、及び光加工物の生産方法
JP2008539161A (ja) 光学アセンブリを組み込んで脆弱な材料を罫書く方法及び装置
CN106773025B (zh) 调焦镜头及振镜式激光扫描系统
KR20150014142A (ko) 멀티 초점을 가지는 비구면 렌즈를 이용한 취성 기판 가공 장치
IT201600070352A1 (it) Procedimento di lavorazione laser di un materiale metallico con controllo della distribuzione di potenza trasversale del fascio laser in un piano di lavorazione, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento.
CN116033994A (zh) 对具有弯曲的表面的工件进行激光加工
CN110908099A (zh) 一种用于激光焊接机的准远心高功率光学聚焦镜头及其成像方法
CN112756775A (zh) 一种激光加工方法、光学系统及激光加工设备
CN114160965B (zh) 激光成丝切割装置
CN216966624U (zh) 激光成丝切割装置
JP2020105055A (ja) ガラスの曲げ加工方法および加工装置
JP2012237796A (ja) 曲率可変ユニットおよびレーザ加工装置
CN109773330B (zh) 基于匀化装置的激光输出系统及计算方法
JP4818958B2 (ja) ビーム照射装置、及び、ビーム照射方法
CN120831737A (zh) 反射式光导装置及其制造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120411

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120411

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130228

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130305

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130531

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130612

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130905

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140520

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140612

R150 Certificate of patent or registration of utility model

Ref document number: 5563562

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees