KR101425729B1 - 피가공물의 가공 방법 및 분할 방법 - Google Patents

피가공물의 가공 방법 및 분할 방법 Download PDF

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Publication number
KR101425729B1
KR101425729B1 KR1020120131332A KR20120131332A KR101425729B1 KR 101425729 B1 KR101425729 B1 KR 101425729B1 KR 1020120131332 A KR1020120131332 A KR 1020120131332A KR 20120131332 A KR20120131332 A KR 20120131332A KR 101425729 B1 KR101425729 B1 KR 101425729B1
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KR
South Korea
Prior art keywords
workpiece
light
lens
processing
cleavage
Prior art date
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KR1020120131332A
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English (en)
Korean (ko)
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KR20130105276A (ko
Inventor
이쿠요시 나카타니
유우마 이와츠보
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20130105276A publication Critical patent/KR20130105276A/ko
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Publication of KR101425729B1 publication Critical patent/KR101425729B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/007—Marks, e.g. trade marks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
    • G02F1/291—Two-dimensional analogue deflection
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
    • G02F1/294—Variable focal length devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
KR1020120131332A 2012-03-15 2012-11-20 피가공물의 가공 방법 및 분할 방법 KR101425729B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-058596 2012-03-15
JP2012058596A JP2013188785A (ja) 2012-03-15 2012-03-15 被加工物の加工方法および分割方法

Publications (2)

Publication Number Publication Date
KR20130105276A KR20130105276A (ko) 2013-09-25
KR101425729B1 true KR101425729B1 (ko) 2014-08-04

Family

ID=49128361

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120131332A KR101425729B1 (ko) 2012-03-15 2012-11-20 피가공물의 가공 방법 및 분할 방법

Country Status (4)

Country Link
JP (1) JP2013188785A (zh)
KR (1) KR101425729B1 (zh)
CN (1) CN103302403B (zh)
TW (1) TWI498181B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6262039B2 (ja) * 2014-03-17 2018-01-17 株式会社ディスコ 板状物の加工方法
CN104625433A (zh) * 2014-12-31 2015-05-20 武汉华工激光工程有限责任公司 一种用于切割led灯丝透明材料支架的方法
KR101647991B1 (ko) * 2015-09-18 2016-08-18 주식회사 레이저앱스 수직 다중 빔 레이저 가공 장치
KR102202933B1 (ko) * 2016-03-31 2021-01-14 주식회사 엘지화학 레이저 가공 장치 및 레이저 가공 방법
JP6820682B2 (ja) * 2016-07-29 2021-01-27 株式会社タムラ製作所 基板の分離方法及び半導体素子
CN108213697A (zh) * 2016-12-14 2018-06-29 上海新昇半导体科技有限公司 SiC晶体切片设备及切片方法
KR102499252B1 (ko) * 2017-03-31 2023-02-13 유니버시티 오브 로체스터 광학 재료에 굴절률 변화를 기입하기 위한 빔 멀티플렉서
CN110102910A (zh) * 2019-06-19 2019-08-09 浙江圣石激光科技股份有限公司 用于晶圆划片的双光路激光加工装置及方法
CN113369717A (zh) * 2021-07-07 2021-09-10 广东原点智能技术有限公司 一种激光加工系统及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040093139A (ko) * 2002-03-12 2004-11-04 하마마츠 포토닉스 가부시키가이샤 가공 대상물 절단 방법
JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP2006130556A (ja) 2004-11-05 2006-05-25 Lg Philips Lcd Co Ltd フェムト秒レーザー発生装置、およびこれを用いた基板の切断方法
KR20110074655A (ko) * 2009-12-25 2011-07-01 미쓰보시 다이야몬도 고교 가부시키가이샤 피가공물의 가공 방법, 피가공물의 분할 방법 및 레이저 가공 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10240033B4 (de) * 2002-08-28 2005-03-10 Jenoptik Automatisierungstech Anordnung zum Einbringen von Strahlungsenergie in ein Werkstück aus einem schwach absorbierenden Material
TWI275439B (en) * 2003-05-19 2007-03-11 Mitsubishi Electric Corp Laser processing apparatus
GB2402230B (en) * 2003-05-30 2006-05-03 Xsil Technology Ltd Focusing an optical beam to two foci
EP1721695A4 (en) * 2004-03-05 2009-04-01 Olympus Corp LASER PROCESSING FACILITY
JP4527488B2 (ja) * 2004-10-07 2010-08-18 株式会社ディスコ レーザ加工装置
JP4734101B2 (ja) * 2005-11-30 2011-07-27 株式会社ディスコ レーザー加工装置
JP4401410B2 (ja) * 2007-11-21 2010-01-20 三菱電機株式会社 レーザ加工装置
JP5104919B2 (ja) * 2010-07-23 2012-12-19 三星ダイヤモンド工業株式会社 レーザー加工装置、被加工物の加工方法および被加工物の分割方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040093139A (ko) * 2002-03-12 2004-11-04 하마마츠 포토닉스 가부시키가이샤 가공 대상물 절단 방법
JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP2006130556A (ja) 2004-11-05 2006-05-25 Lg Philips Lcd Co Ltd フェムト秒レーザー発生装置、およびこれを用いた基板の切断方法
KR20110074655A (ko) * 2009-12-25 2011-07-01 미쓰보시 다이야몬도 고교 가부시키가이샤 피가공물의 가공 방법, 피가공물의 분할 방법 및 레이저 가공 장치

Also Published As

Publication number Publication date
KR20130105276A (ko) 2013-09-25
JP2013188785A (ja) 2013-09-26
CN103302403B (zh) 2016-01-27
TW201336609A (zh) 2013-09-16
TWI498181B (zh) 2015-09-01
CN103302403A (zh) 2013-09-18

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