KR101409377B1 - 패드 표면 상에 미세 홈들이 있는 연마 패드 - Google Patents

패드 표면 상에 미세 홈들이 있는 연마 패드 Download PDF

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Publication number
KR101409377B1
KR101409377B1 KR1020097003292A KR20097003292A KR101409377B1 KR 101409377 B1 KR101409377 B1 KR 101409377B1 KR 1020097003292 A KR1020097003292 A KR 1020097003292A KR 20097003292 A KR20097003292 A KR 20097003292A KR 101409377 B1 KR101409377 B1 KR 101409377B1
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South Korea
Prior art keywords
pad
polishing
insoluble
fine grooves
polishing pad
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Korean (ko)
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KR20090031629A (ko
Inventor
오스카 케이. 슈
마크 씨. 진
데이비드 아담 웰스
존 에릭 알데보그
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에프엔에스테크 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020097003292A 2006-07-19 2007-07-19 패드 표면 상에 미세 홈들이 있는 연마 패드 Active KR101409377B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US83159506P 2006-07-19 2006-07-19
US60/831,595 2006-07-19
PCT/US2007/073921 WO2008011535A2 (en) 2006-07-19 2007-07-19 Polishing pad having micro-grooves on the pad surface

Publications (2)

Publication Number Publication Date
KR20090031629A KR20090031629A (ko) 2009-03-26
KR101409377B1 true KR101409377B1 (ko) 2014-06-20

Family

ID=38957633

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097003292A Active KR101409377B1 (ko) 2006-07-19 2007-07-19 패드 표면 상에 미세 홈들이 있는 연마 패드

Country Status (9)

Country Link
US (3) US8137166B2 (enExample)
EP (1) EP2040878A4 (enExample)
JP (1) JP5460316B2 (enExample)
KR (1) KR101409377B1 (enExample)
CN (1) CN101511533B (enExample)
CA (1) CA2658127A1 (enExample)
MY (1) MY151014A (enExample)
TW (1) TWI409136B (enExample)
WO (1) WO2008011535A2 (enExample)

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JP2011517111A (ja) * 2008-04-11 2011-05-26 イノパッド，インコーポレイテッド ボイドネットワークを有する化学機械的平坦化パッド
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
US9276747B2 (en) * 2008-08-04 2016-03-01 Technology Policy Associates, Llc Remote profile security system
US8435099B2 (en) 2009-01-27 2013-05-07 Innopad, Inc. Chemical-mechanical planarization pad including patterned structural domains
SG173547A1 (en) 2009-02-12 2011-09-29 Innopad Inc Three-dimensional network in cmp pad
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US9308620B2 (en) 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
KR102347711B1 (ko) 2014-04-03 2022-01-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9643294B2 (en) * 2015-07-14 2017-05-09 K&D Pads LLC Buffing pad and methods of making and using the same
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6829037B2 (ja) * 2016-09-30 2021-02-10 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7273796B2 (ja) * 2017-08-25 2023-05-15 スリーエム イノベイティブ プロパティズ カンパニー 表面突起研磨パッド
JP6980509B2 (ja) * 2017-12-12 2021-12-15 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
KR102674356B1 (ko) * 2019-06-19 2024-06-11 주식회사 쿠라레 연마 패드, 연마 패드의 제조 방법 및 연마 방법
CN111515872B (zh) * 2020-04-10 2022-01-11 广东大市智能装备有限公司 一种中空金刚石的粉末冶金一体成型方法
CN112809550B (zh) * 2020-12-31 2022-04-22 湖北鼎汇微电子材料有限公司 一种抛光垫
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11951590B2 (en) 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad
CN117103107A (zh) * 2022-05-16 2023-11-24 成都高真科技有限公司 还原料浆用抛光装置
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad
CN114918824B (zh) * 2022-06-29 2024-08-20 万华化学集团电子材料有限公司 一种具有径向微沟槽的抛光垫

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2001047357A (ja) * 1999-04-13 2001-02-20 Freudenberg Nonwovens Lp 研磨剤粒子を含むスラリーにより基板を化学機械研磨するために使用される研磨パッド
JP2004071985A (ja) 2002-08-08 2004-03-04 Jsr Corp 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド
KR20040074055A (ko) * 2002-08-08 2004-08-21 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드의 가공 방법 및 반도체웨이퍼용 연마 패드
JP2004528997A (ja) * 2000-11-20 2004-09-24 インターナショナル．ビジネス．マシーンズ．コーポレイション 重合体充填繊維ウェブを有する研磨パッド、およびこれを製造および使用する方法

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JP2668016B2 (ja) * 1988-09-21 1997-10-27 スピードファム株式会社 ポリッシングパッド及びその製造方法
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US6337280B1 (en) * 1998-05-11 2002-01-08 Kabushiki Kaisha Toshiba Polishing cloth and method of manufacturing semiconductor device using the same
US6953388B2 (en) * 1999-12-22 2005-10-11 Toray Industries, Inc. Polishing pad, and method and apparatus for polishing
US6712681B1 (en) 2000-06-23 2004-03-30 International Business Machines Corporation Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
US6383066B1 (en) 2000-06-23 2002-05-07 International Business Machines Corporation Multilayered polishing pad, method for fabricating, and use thereof
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
WO2003058698A1 (en) * 2001-12-28 2003-07-17 Asahi Kasei Emd Corporation Polishing pad, process for producing the same, and method of polishing
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US20030207661A1 (en) * 2002-05-01 2003-11-06 Alexander Tregub Annealing of CMP polishing pads
KR100669301B1 (ko) * 2002-06-03 2007-01-16 제이에스알 가부시끼가이샤 연마 패드 및 복층형 연마 패드
JP4039214B2 (ja) * 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
KR20040093402A (ko) 2003-04-22 2004-11-05 제이에스알 가부시끼가이샤 연마 패드 및 반도체 웨이퍼의 연마 방법
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2008000831A (ja) * 2006-06-20 2008-01-10 Saitama Univ 研磨パッドの製造方法
FR2933004B1 (fr) 2008-06-27 2010-08-20 Inst Francais Du Petrole Solution absorbante contenant un inhibiteur de degradation derive du thiadiazole et methode pour limiter la degradation d'une solution absorbante

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001047357A (ja) * 1999-04-13 2001-02-20 Freudenberg Nonwovens Lp 研磨剤粒子を含むスラリーにより基板を化学機械研磨するために使用される研磨パッド
JP2004528997A (ja) * 2000-11-20 2004-09-24 インターナショナル．ビジネス．マシーンズ．コーポレイション 重合体充填繊維ウェブを有する研磨パッド、およびこれを製造および使用する方法
JP2004071985A (ja) 2002-08-08 2004-03-04 Jsr Corp 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド
KR20040074055A (ko) * 2002-08-08 2004-08-21 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드의 가공 방법 및 반도체웨이퍼용 연마 패드

Also Published As

Publication number Publication date
US8137166B2 (en) 2012-03-20
WO2008011535A3 (en) 2008-10-02
EP2040878A2 (en) 2009-04-01
JP2009543709A (ja) 2009-12-10
US20120178348A1 (en) 2012-07-12
WO2008011535A2 (en) 2008-01-24
MY151014A (en) 2014-03-31
US20080085661A1 (en) 2008-04-10
TW200810878A (en) 2008-03-01
JP5460316B2 (ja) 2014-04-02
TWI409136B (zh) 2013-09-21
CA2658127A1 (en) 2008-01-24
US20150056894A1 (en) 2015-02-26
US8900036B2 (en) 2014-12-02
CN101511533A (zh) 2009-08-19
EP2040878A4 (en) 2012-09-12
KR20090031629A (ko) 2009-03-26
US9375822B2 (en) 2016-06-28
CN101511533B (zh) 2012-10-10

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