KR101383645B1 - Contact film for lcd and oled panel test, and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a contact film for testing an LCD panel and a manufacturing method and, more specifically, to a contact film consisting of a base film, a wiring unit, an isolation film, a superconductor, and a bump. The bump contacting the electrodes of an inspection subject is formed thinner and higher and the isolation film is formed thicker to comprise compacted electrodes and to prevent or minimize cutting lines, an electric leakage, and damage occurred by fine glass impurities. Therefore provided is a high-performance and long life contact film and the manufacturing method which is suitable for an apparatus of testing a high definition LCD and OLED panel made of high density electrodes.

Description

Contact film and manufacturing method for LCD and OLED panel inspection {CONTACT FILM FOR LCD AND OLED PANEL TEST, AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a contact film and a manufacturing method for inspecting LCD and OLED panels, and more particularly, to a contact film mounted on a film-type probe of an inspection apparatus for inspecting whether a flat panel display panel such as LCD and OLED is electrically operated normally. The present invention relates to a high performance and long life contact film for stable electrical testing of LCD and OLED panels made of high density electrodes and a method of manufacturing the contact film.

The contact film mounted on the film type probe of the inspection device that checks whether the flat panel display panel such as LCD and OLED operates without pixel error is precisely and stably inspected by electrically connecting the inspection object and the measurement equipment. As a medium to be made, typically, the insulating film and the conductor is shaped to protrude above the insulating film.

As the pixel density is rapidly increased due to the rapid evolution of LCD and OLED panels, contact films are also required to be densified, and in particular, short circuits between electrodes are caused by fine foreign substances such as glass particles, which are frequently generated in LCD and OLED panel manufacturing processes. It is very urgent to develop high-performance and long-life contact films that respond to inspection errors due to disconnection and shortening of film life due to damage.

The present invention has been made to solve the above problems, the technical problem to be solved by the present invention, while having a very dense electrode suitable for inspection of high-resolution LCD and OLED panel having a high-density electrode, It is to provide a high performance and long life contact film that can prevent or minimize the disconnection, short circuit and film damage caused by the same fine foreign matter.

Another technical problem to be solved by the present invention is to provide a method for manufacturing a contact film that can effectively produce the contact film.

The contact film of the present invention and the OLED panel inspection for achieving the above technical problem, the insulating film having a via hole, a conductor filled in the via hole, the conductor is exposed to the upper surface of the insulating film by a certain height bump. The insulating film is an insulator made of a liquid polymer.

The insulating film may further include a conductive line vertically connected to the conductor at an inner lower portion, or further include a conductive line vertically connected to the conductor and a photoresist surrounding the conductive line.

In addition, the insulating film is a liquid polymer insulator made of any one of epoxy (epoxy), phenol (phenol), polyimide (polyimides), BCB (benzocyclobutene), PBO (piperonyl butoxide) and siloxane (siloxane) It is characterized in that, it is characterized in that the height of 10 micrometers or more.

The bump is characterized in that the top surface is planar, is equal to or smaller than the diameter of the conductor, and is at least 5 micrometers in height.

The conductor and the bump may be made of any one of copper, silver, nickel, cobalt, gold, platinum, rhodium, and a copper alloy or a nickel alloy.

The conductive line is characterized in that it further comprises a base film at the bottom.

In order to achieve the above technical problem, an embodiment of the present invention and a method of manufacturing a contact film for inspecting an OLED panel may include forming a wiring part by etching a metal film on the upper surface of the base film or filling a metal into a via hole of a photoresist, and a conductive line. Wiring part is generated by removing the surrounding photoresist, or the wiring part generating step of creating the wiring part while leaving the photoresist around the conducting line as it is, applying a liquid polymer to the base film and the upper surface of the wiring part and drying the insulating film Insulating part generating step of generating, insulating film via hole generation step of generating a via hole connected to the conductive line perpendicular to the conductive film, conductor filling step of generating a conductor by filling a metal in the via hole and a conductor filled in the via hole The upper part of the insulating film is etched to generate bumps. Characterized in that it comprises a bump generating step.

Another embodiment of the present inventors and the method for manufacturing a contact film for OLED panel inspection to achieve the above technical problem, the wiring portion generation step, the insulation portion generation step, the insulation film via hole generation step, the conductor filling step and the embodiment described above A photoresist generating step of applying a liquid photoresist on top of the insulating film filled with a conductor in a via hole and drying the film to form a film or attaching a sheet-shaped photoresist film to generate a photoresist for bump processing; A via hole generation step of generating a bump processing via hole extending in the same section as the via hole of the insulating part in the resist film, a conductor filling step of filling a via hole of the photoresist with a metal to generate a bump processing conductor, and removing the bump processing photoresist. The bump by To ensure that the conductor is exposed it characterized in that it comprises a bump generation step of generating a bump.

Another embodiment of the present invention and a method for manufacturing a contact film for OLED panel inspection to achieve the above technical problem, the wiring portion generation step, the insulation portion generation step is the same as the above-described embodiment, the upper portion of the insulating film In addition, a photoresist generating step of applying a liquid photoresist and drying to form a film or attaching a sheet-shaped photoresist film to generate a bump processing photoresist, a via hole connected to the insulating film and the bump processing photoresist perpendicularly to the conductive line Insulating film via hole generation step of generating a; Filling the via hole with a metal electroplating to create a conductor to generate a conductor and a bump generation step of generating a bump by removing the bump processing photoresist It is characterized by.

In the contact film of the present invention and the OLED panel inspection, a plurality of bumps are in contact with the same electrode of the inspected object, and a plurality of bumps in contact with the same electrode are connected to the same conducting line connected perpendicularly to the conductor, thereby structurally Stable electrical test is possible.

In addition, the end of the bump in contact with the electrode of the test object is flat and has a high height and is thin, and is used to inspect high-resolution LCDs and OLED panels with high-density electrodes while minimizing short circuits and short circuits caused by foreign substances such as fine glass materials. The bumps frictionally contacted with the inspected object are made of hard metal such as a copper alloy, and the insulating film is made thick to mitigate damage caused by foreign substances such as fine glass material, and the conductive lines, conductors and bumps are mutually The contact surface between the contact surface and the surrounding insulator is joined by melt bonding, which sufficiently supports bumps contacted with the test object under pressure and has good durability, thereby providing a high performance and long life contact film with improved durability of the insulating film. do.

According to the manufacturing method of the present invention and the contact film for inspecting the OLED panel, because the via holes are formed in the photoresist and the conductors are filled with electrochemical plating in the via holes, the conductive lines, conductors, and bumps are processed to be thin and long. The shape is precisely processed and the contact surface is in close contact with each other, so that it is firmly fixed without any gap. By using a liquid photosensitive polymer or a liquid non-photosensitive polymer as the insulating film, it is easy to process the insulating film to a predetermined height or more, and more particularly. By using the liquid photosensitive polymer having good light processability, the workability due to exposure and development is improved, so that the via hole can be precisely processed with a narrow cross-section and a deep depth. Provide an effective way to do this.

1 is a perspective view of a contact film according to the present invention.
Figure 2a is an embodiment of a method for manufacturing a contact film according to the present invention.
FIG. 2B is another embodiment of FIG. 2A.
Figure 3a is another embodiment of a method for manufacturing a contact film according to the present invention.
3B is another embodiment of FIG. 3A.
Figure 4a is another embodiment of a method for manufacturing a contact film according to the present invention.
4B is another embodiment of FIG. 4A.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing.

The terms including ordinal, such as second, first, etc., may be used to describe various elements, but the elements are not limited to these terms.

The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail.

In the following description, numerous specific details are set forth, such as specific elements, which are provided for a better understanding of the present invention, and the present invention may be practiced without these specific details. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1 is a perspective view of a contact film according to the present invention. Referring to FIG. 1A, the base film 110, the conductive line 121, and the via hole of the insulating film 131 and the insulating film 131 having a predetermined height are processed from below. A plurality of conductors 140 filled in the interior and connected vertically to the conducting line 121, and the conductors 140 are formed of bumps 150 protruding from the top of the insulating film 131. The bump 150 which is in direct contact with the electrode transmits an electrical signal to the inspection apparatus through the conductor 140 and the conducting line 121, and in particular, a plurality of bumps 150 are in contact with the individual inspected electrode. The plurality of bumps 150 connected to the electrodes are connected to the same conduction line 121, so that even if some of the bumps 150 are in poor contact, the entire test is stable. It is also possible for one bump to contact the electrode and one bump It is also possible to be connected to the conductive line. In addition, as shown in FIG. 1B, it is possible to function as the insulating film 131 without removing the photoresist 122 for conducting line processing of the wiring part 120.

The base film 110 of the present invention may be any material that is a base for manufacturing a contact film such as polyimide or silicon, and a metal film is formed on the upper surface as necessary, and the insulating film 131 is epoxy based. It is formed by applying a liquid photosensitive polymer or a liquid non-photosensitive polymer, such as phenol (phenol), polyimides (polyimides), BCB (benzocyclobutene), PBO (piperonyl butoxide) and siloxane (siloxane) and dried.

The bumps 150 and the conductors 140 which are in pressure contact with the electrodes of the LCD and OLED panels to be inspected are copper, silver, nickel, cobalt, gold, platinum, rhodium, and copper which have both good electrical conductivity and stiffness and wear resistance. It is preferable to be composed of any one of an alloy or a nickel alloy, and the conductive line 121 may be made of the same material as the bump 150 and the conductor 140 or a separate metal having good conductivity may be used.

Since the conductor 140 is formed by filling the metal with electroplating using the via hole 132 of the insulating film 131, not only the conductor 140 having an elongated shape can be precisely formed, but also the via hole. 132 is in close contact with the inner contact surface of the via hole 132 has the same internal shape and height, ensures sufficient bonding force and support force, the conductor 140 is separated or collapsed from the insulating film 131 by the pressure applied to the bumps. To prevent it.

The bump 150 is also formed by filling the conductor metal with electroplating using the via hole 132 of the insulating film 131 or the bump processing photoresist via hole 152 of the bump processing photoresist 151 as a guide. It is possible to precisely form the conductor 140, and in particular, the cross-sectional shape of the bump 150 formed by using the photoresist via hole 152 for bump processing as a guide may have a different cross-sectional shape of the conductor 140. In addition, the upper end surface of the bump 150 is preferably formed in a plane in order to increase the contact area with the electrode under test.

The contact film of the present invention, the bump 150 is formed to be thin and long to minimize damage such as disconnection or short circuit damage caused by fine glass particles and damage to the insulating film, more specifically, the height of the bump 150 is 5 micro It is characterized in that it is set to more than a meter, and also by increasing the height of the insulating film 131 to improve the durability of the insulating film 131 in consideration of the damage caused by fine glass particles, to increase the service life, More specifically, the height of the insulating film 131, the via hole 132, and the conductor 140 is set to 10 micrometers or more.

As described above, the contact film of the present invention and the OLED panel inspection is capable of structurally stable electrical inspection, minimizing disconnection and short circuit caused by foreign substances such as fine glass, and has a high-resolution LCD and OLED having a high-density electrode It provides a high performance and long life contact film suitable for inspection of panels and with sufficient durability.

 FIG. 2A illustrates an embodiment of a method for manufacturing a contact film for inspecting an LCD and an OLED panel according to an embodiment of the present invention, and is processed in the order of a wiring part generation step, an insulation part generation step, a via hole generation step, a conductor filling step, and a bump generation step.

In the wiring unit generation step of FIG. 2A, the metal film is attached to the upper surface of the base film, and a liquid photoresist is coated and dried on the upper surface of the metal film, or a sheet-like photoresist is attached, and the photoresist is exposed, developed or etched. Exposing a portion of the metal film to be etched, etching the metal film, and removing the photoresist to form a wiring portion, or apply and dry a liquid photoresist on the upper surface of the base film, or attach a sheet-like photoresist, and The via hole 132 is processed by exposure and development or etching, and the via hole 132 is filled with metal by electroplating or ion deposition or thermal deposition, and the photoresist around the conductive line is removed. ), And the photo around the conductive line as shown in the wiring section generation step of FIG. Without removing the registry it is also possible to function as a dielectric film (131).

In the insulating part generating step of FIG. 2A, a liquid photosensitive polymer or a liquid non-photosensitive polymer is coated and dried on the upper surfaces of the base film 110 and the wiring part 120 to generate an insulating film 131 above a predetermined height. do.

In the via hole generation step of FIG. 2A, a liquid photosensitive polymer is coated and dried on the insulating film 131 to be exposed and developed using a photomask, or the insulating film 131 is etched using a metal mask or photoresist to form the conductive line ( A via hole 132 is vertically connected to 121.

In the conductor filling step of FIG. 2A, each of the via holes 132 is filled with metal to generate a conductor 140.

In the bump generation step of FIG. 2A, the bump 150 is generated by etching the upper portion of the insulating film in which the via hole 132 is filled with the conductor 140 to a predetermined height or more.

2A and 2B, the manufacturing method of the contact film according to the embodiment is an efficient processing method capable of processing the bumps 150 only by etching the upper surface of the insulating film filled with the conductors 140. In the case where the cross-sectional shape of the bump 150 and the bump 150 are the same, this method is very suitable.

Figure 3a is another embodiment of the manufacturing method of the contact film for the inspection of the LCD and OLED panel of the present invention, wiring portion generation step, insulation portion generation step, via hole generation step, conductor filling step, photoresist generation step, via hole generation step The process is performed in the order of the conductor filling step and the bump generating step.

The wiring generation step, the insulation generation step, the via hole generation step, and the conductor charging step of FIG. 3A are the same as in FIG. 2A described above, and the wiring generation step of FIG. 3A is similar to the wiring generation step of FIG. 3B. It is also possible to function as the insulating film 131 without removing the photoresist.

In the photoresist generating step of FIG. 3A, a liquid photoresist is additionally coated and dried on top of the insulating film in which the conductors 140 are filled in the plurality of via holes 132 to form a film, or a sheet type photoresist film is attached. In this manner, the photoresist 151 for bump processing is produced.

In the via hole generating step of FIG. 3A, a bump processing via hole 152 extending in the same section as the via hole 132 of the insulating part 130 may be formed by exposing, developing, or etching the photoresist film.

In the conductor filling step of FIG. 3A, the via hole of the photoresist is filled with an electroplating metal to generate a bump processing conductor 153.

In the bump generation step of FIG. 3A, the bump processing photoresist 151 is removed by a removal liquid or etching to expose the bump processing conductor 153 to generate the bump 150.

3A and 3B, the method of manufacturing a contact film according to another embodiment of the present invention is a method of generating the conductor and the bump 150 in separate processing steps, and the material, width, or material of the conductor and the bump 150. And a case where the width is formed differently.

Figure 4a is another embodiment of the manufacturing method of the contact film for the inspection of the LCD and OLED panel of the present invention, wiring portion generation step, insulation portion generation step, photoresist generation step, via hole generation step, conductor filling step and bump generation Are processed in the order of the steps.

The wiring part generating step and the insulating part generating step of FIG. 4A are the same as those of FIGS. 2A and 3A described above, and the wiring part generating step of FIG. 4A does not remove the photoresist around the conductive line like the wiring part generating step of FIG. 4B. It is also possible to make a function as the insulating film 131 without making any difference.

In the photoresist generating step of FIG. 4A, a liquid photoresist is additionally coated and dried on the insulating film to form a film, or a sheet type photoresist film is attached to generate a bump processing photoresist 151.

In the via hole generating step of FIG. 4A, a via hole 132 is vertically connected to the conductive line by exposure, development or etching to the insulating film and the photoresist 151 for bump processing.

In the conductor filling step of FIG. 4A, the via hole 132 is filled with metal to generate a conductor 140.

In the bump generation step of FIG. 4A, the bump 150 is generated by removing the bump processing photoresist 151.

4A and 4B, the method of manufacturing a contact film according to another embodiment of the above description is suitable for a case where the production step is smaller than that of FIGS. 3A and 3B while generating an insulating film higher than that of FIGS. 2A and 2B. to be.

As described above, the manufacturing method of the contact film of the present invention and the OLED panel inspection, by providing a method capable of precisely and effectively processing each component of the high performance and long life contact film can achieve the object of the present invention. Make sure

110: base film
120: wiring section
121: conduction line
122: photoresist for conductive line processing
130: insulation
131: insulating film
132: Via Hole
140: conductor
150: bump
151: bump photoresist
152: via hole for bump processing
153: conductor for bump processing

Claims (13)

Etch the metal film on the top surface of the base film to create the wiring part or fill the via hole of the photoresist and create the wiring part by removing the photoresist around the conductive line, or create the wiring part with the photoresist around the conductive line intact. Generating a wiring unit;
An insulating part generating step of applying an insulating polymer to the upper surface of the base film and the wiring part and drying to generate an insulating film;
An insulating film via hole generating step of creating a via hole vertically connected to the conductive line in the insulating film;
A conductor filling step of filling a via hole with a metal to generate a conductor; And
And a bump generating step of etching an upper portion of the insulating film filled with a conductor in the via hole, to form a bump having an upper surface thereof and having a plane equal to or smaller than the diameter of the conductor. . Etch the metal film on the top surface of the base film to create the wiring part or fill the via hole of the photoresist and create the wiring part by removing the photoresist around the conductive line, or create the wiring part with the photoresist around the conductive line intact. Generating a wiring unit;
An insulating part generating step of applying an insulating polymer to the upper surface of the base film and the wiring part and drying to generate an insulating film;
An insulating film via hole generating step of creating a via hole vertically connected to the conductive line in the insulating film;
A conductor filling step of filling a via hole with a metal to generate a conductor;
A photoresist generating step of applying a liquid photoresist on top of the insulating film filled with a conductor in a via hole and drying to form a film or attaching a sheet-shaped photoresist film to generate a photoresist for bump processing;
A via hole generating step of generating a bump processing via hole extending in the photoresist film in the same section as the via hole of the insulating part;
A conductor filling step of filling a via hole of the photoresist to generate a conductor for bump processing; And
And a bump generating step of generating a bump by removing the bump processing photoresist so that the bump processing conductor is exposed. Etch the metal film on the top surface of the base film to create the wiring part or fill the via hole of the photoresist and create the wiring part by removing the photoresist around the conductive line, or create the wiring part with the photoresist around the conductive line intact. Generating a wiring unit;
An insulating part generating step of applying an insulating polymer to the upper surface of the base film and the wiring part and drying to generate an insulating film;
A photoresist generating step of coating a liquid photoresist on the insulating film and drying the film to form a film or attaching a sheet-shaped photoresist film to generate a bump processing photoresist;
An insulating film via hole generating step of generating a via hole vertically connected to the conductive line in the insulating film and the photoresist for bump processing;
A conductor filling step of filling the via hole with an electroplating metal to generate a conductor; And
And a bump generation step of generating a bump by removing the bump processing photoresist. An insulating film having a via hole;
A conductor filled in the via hole;
And a bump in which the conductor is exposed by a predetermined height to an upper surface of the insulating film.
The bump is characterized in that the upper surface is a plane, less than or equal to the diameter of the conductor,
The insulating film further includes a conductive line vertically connected to the conductor at an inner lower portion thereof,
The insulating film is a contact film, characterized in that the insulator made of a liquid polymer. delete An insulating film having a via hole;
A conductor filled in the via hole;
And a bump in which the conductor is exposed by a predetermined height to an upper surface of the insulating film.
The bump is characterized in that the upper surface is a plane, less than or equal to the diameter of the conductor,
The insulating film further includes a conductive line vertically connected to the conductor on a lower surface and a photoresist surrounding the conductive line.
The insulating film is a contact film, characterized in that the insulator made of a liquid polymer. The method of claim 4, wherein the insulating film,
A contact film, characterized in that it is at least 10 micrometers in height. delete The method of claim 4, wherein the insulating film,
Contact film, characterized in that the liquid polymer insulator made of any one of epoxy, phenol, polyimides, BCB (benzocyclobutene), PBO (piperonyl butoxide) and siloxane (siloxane) . The method of claim 4, wherein the bump,
A contact film, characterized in that the height of 5 micrometers or more. The method of claim 4, wherein the conductor and the bump,
A contact film comprising any one of copper, silver, nickel, cobalt, gold, platinum, rhodium, a copper alloy, and a nickel alloy. The method of claim 4 or 6, wherein the conductive line,
The contact film further comprises a base film at the bottom.
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