KR101367664B1 - Apparatus and method for substrates aligning - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention provides a substrate bonding apparatus and a method thereof, wherein the substrate bonding apparatus includes an upper base, an upper chamber, a lower chamber, and an upper plate, the substrate bonding apparatus comprising: an upper electrostatic chuck base capable of forming a magnetic force; A lower electrostatic chuck base; By including the magnetic to raise the upper and lower electrostatic chuck base by magnetic force, by removing the existing surface plate and floating the electrostatic chuck base by magnetic force to minimize the volume of the chamber to reduce the number of vacuum pump and stable Substrate bonding can be performed.

Board, Bonded, Surface Plate, Electrostatic Chuck, Magnetic, Actuator

Description

Apparatus and method for substrates aligning

1 is a cross-sectional view of a conventional substrate bonding apparatus.

2 is a flowchart illustrating a conventional substrate bonding method.

3 is a cross-sectional view of a substrate bonding apparatus according to an embodiment of the present invention.

4 is a flowchart illustrating a substrate bonding method according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

102: lower base 104: lower plate

106: upper chamber 108: lower chamber

110: upper plate 116: upper electrostatic chuck base

118: lower electrostatic chuck base 120: upper chamber lift shaft

122: upper chamber lift jack 124: vacuum pump

126: phase lift pin 128: bellows

132: linear actuators 136, 138: substrate

152 ~ 157: magnetic 158: spring plunger

160: Piezo Actuator

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding apparatus and a method thereof, and more particularly, to a substrate bonding apparatus which removes an existing surface plate and floats an electrostatic chuck base by magnetic force to reduce the number of vacuum pumps and to perform stable substrate bonding. And to a method thereof.

Generally, a substrate bonding apparatus, which is a vacuum bonding apparatus, is used to bond substrates. Such a substrate bonding device is a device that directly bonds and integrates two substrates in their original size without using an adhesive. In addition, the substrate bonding device is used to bond a substrate such as a liquid crystal display device such as a liquid crystal display (LCD) or a plasma display panel (PDP).

In addition, the liquid crystal display is formed by injecting a liquid crystal between a TFT (Thin Film Transistor) substrate having an electrode and a color filter substrate coated with a phosphor. Of course, a sealer for confining the liquid crystal material is provided at the edges of both substrates, and a spacer for maintaining a gap between the substrates at predetermined intervals is disposed between the substrates.

The liquid crystal display is driven by applying power to the liquid crystal material. Since the liquid crystal material has anisotropic dielectric constant, the liquid crystal display device displays an image by controlling the amount of light transmitted through the substrate by controlling the intensity of the power source. Therefore, in manufacturing a liquid crystal display device, after manufacturing a TFT substrate and a color filter substrate, joining both substrates and injecting a liquid crystal substance into the space between them is an essential process, and it is a very important process.

The substrate bonding process is performed by a substrate bonding apparatus capable of forming the interior thereof in a vacuum state, and in the substrate bonding apparatus, the substrate is attached to an upper plate and an under plate in the substrate bonding apparatus in a vacuum state. Electrostatic chucks (ESCs) are used to fix them. That is, power is applied to the electrostatic chucks fixed to the upper and lower plates, and the substrate is sucked and fixed by the electrostatic force generated by the power supply.

In addition, the conventional substrate bonding technology includes a bonding device for LCD cell bonding process of Korean Patent Application No. 10-2003-0001124, a substrate bonding device of PDP and a substrate bonding method of PDP of Korea Patent Application No. 10-2004-0035725 Substrate bonding / curing device for manufacturing flat panel display device of Korean Patent Application No. 10-2004-0051147, Substrate Bonding Machine of Korean Patent Application No. 10-2004-0051310, Substrate Bonding Machine of Korean Patent Application No. 10-2004-0069162 Is disclosed.

Therefore, in the conventional substrate bonding apparatus, it is inevitable to switch between a vacuum state and an atmospheric pressure state, and injecting a venting gas into the vacuum state when switching from a vacuum state to an atmospheric pressure state.

1 is a cross-sectional view of a conventional substrate bonding apparatus.

Conventional substrate bonding apparatus, as shown in Figure 1, largely the lower base (2); An upper base 4 spaced apart from the lower base 2; Upper and lower chambers 6 and 8 provided on the upper base 4; An upper plate (10) provided above the upper chamber (6) to open during maintenance of the internal components; Upper and lower plates 12 and 14 provided horizontally with the upper and lower chambers 6 and 8, respectively; An upper electrostatic chuck base 16 provided at a lower end of the upper plate 12; The lower electrostatic chuck base 18 is formed on the upper end of the lower plate 14, and the two substrates 36 and 38 respectively carried in the upper and lower chambers 6 and 8, respectively, the upper electrostatic chuck base ( 16) and the lower electrostatic chuck base 18 are arranged horizontally, and then joined up and down.

In addition, the upper chamber raising shaft 20 and the upper chamber raising jack 22, which are lifting means for raising and lowering the upper chamber 6 when the substrate is loaded into or taken out of the upper chamber 6 and the lower chamber 8, It is provided in the bottom edge area | region of the upper chamber 6, respectively. In addition, a pin 7 is provided at the lower end of the upper chamber 6.

In addition, the loaded substrate is positioned on the upper electrostatic chuck base 16 provided below the upper plate 12 and the lower electrostatic chuck base 18 provided above the lower plate 14, respectively. The upper lift pin 26 and the lower lift pin 27 are provided in plural, and the lift pins 26 and 27 are plate 12 provided on the upper and lower parts. And 14) are uniformly moved by a drive unit (not shown in the figure) that provides a driving force.

Here, a stage alignment process of aligning the substrate disposed on the lower electrostatic chuck base 18 to the correct position before performing the bonding of the substrates 36 and 38 is included, and the alignment of the substrates 36 and 38 is performed. Is performed by alignment means provided in contact with three adjacent side walls of the lower chamber (8). The alignment means is fixed to the upper surface of the upper base 4 in a state of being in contact with the lower chamber 8 of the stacked upper and lower chambers 6 and 8, and is provided eccentrically with a cam 34. It consists of a drive part which gives a rotational force to the cam 34.

Meanwhile, venting is performed to adsorb the upper and lower substrates 36 and 38 to the upper and lower electrostatic chuck bases 16 and 18 or to convert the upper and lower chambers 6 and 8 from a vacuum state to an atmospheric pressure state. A gas supply line (not shown in the drawing) for injecting gas communicates with the inside of the upper and lower chambers 6 and 8 from the outside, and is provided in a state of being divided into the upper and lower electrostatic chuck bases 16 and 18. .

In addition, the gas supply line receives a suction force from a pump of an external pump (not shown) to provide a uniform gas flow on the upper and lower electrostatic chuck bases 16 and 18, that is, the substrate. A movement of injecting nitrogen (N2) as a venting gas into the upper and lower chambers 6 and 8 to perform the function of adsorption and to switch from the vacuum state to the atmospheric pressure in the process of switching between the atmospheric pressure and the vacuum state alternately. It acts as a path. The upper base 4 and the upper plate 10 are provided with a plurality of exhaust pumps (not shown) to exhaust the venting gas.

In addition, a vacuum pump (Vacuum, VAC) 24 for forming a vacuum state for vacuum adsorption of the upper and lower substrates 36 and 38 is provided at the upper end of the upper plate 10 and the lower end of the upper base 4, respectively. . In addition, the bellows 28, 30 is provided in the upper, lower lift pins 26, 27 and the like.

On the other hand, the linear chamber (Linear Actuator) 32 is provided in the lower chamber 8 to perform the gap adjustment with the upper chamber (6).

Springs 40 to 49 are also provided between the upper base 4 and the lower plate 14 (40, 41), between the lower plate 14 and the lower electrostatic chuck base 18 (42, 43), and the upper electrostatic chuck base. Between 44 and 45 (44, 45), between top 12 and upper chamber 6 (46, 47), between top plate 10 and upper chamber 6 (48, 49). Is provided. Thus, the gap plane adjustment between the upper plate 12 and the lower plate 14 is performed by the springs 40 to 49 and bolts (not shown in the drawing).

2 is a flowchart illustrating a conventional substrate bonding method.

As shown therein, applying the sealing material to the substrates 36 and 38 (ST1); After the sealing material is applied, the platen 12 and 14 are moved or the linear chamber 32 is moved to the upper chamber 6 and the lower chamber 8 to perform mark alignment, and the springs 40 to 49. Performing gap adjustment with a bolt (ST2); Bonding the substrate after the gap adjustment (ST3); Injecting a light emitting gas after bonding the substrate (ST4); After the light emitting gas is injected, a step (ST5) of sealing the gas injection hole is performed.

Hereinafter, the surface plate adjustment of the board | substrate bonding apparatus is demonstrated with reference to FIG. 1 and FIG. 2 as follows.

First, the sealing material application process ST1 advances. That is, the sealing material is apply | coated to the outer peripheral part of either board | substrate of the upper and lower board | substrates 36 and 38. FIG.

And gap adjustment process ST2 is performed. This can be done by moving the upper plate 12 and the lower plate 14. In addition, the linear actuator 32 is used to move the upper chamber 6 and the lower chamber 8 to perform mark alignment, and to adjust the gap with the springs 40 to 49 and bolts. That is, the conventional method of adjusting the gap plane of the upper and lower platen 12 and 14 mounts the upper and lower electrostatic chuck bases 16 and 18 as another base on the platen 12 and 14, and a plurality of springs ( 40 to 49) and bolts to adjust the plane uniformly. The upper and lower plates 12 and 14 perform mark alignment before vacuum bonding. At this time, the upper and lower tables 12 and 14 are moved, or the upper and lower chambers 6 and 8 are aligned.

Next, the substrate bonding process ST3 advances. In other words, both substrates are bonded to each other by using a sealing material applied to the outer peripheral portion of either of the substrates 36 and 38. Therefore, a certain volume of sealed space is formed between both substrates 36 and 38.

A gas injection hole is formed in a predetermined portion of the bonded substrates, and impurity gas existing in the space between the substrates 36 and 38 is injected using a light emitting gas injection apparatus (not shown). Therefore, the space between both substrates 36 and 38 is almost vacuumed. The light emitting gas is supplied to this space (ST4).

Finally, the gas injection hole sealing step ST5 is performed. That is, when a light emitting gas of about several hundred torr is injected into the space between both substrates 36 and 38, supply of the light emitting gas is stopped and the gas injection hole is sealed to finish the process.

However, such conventional techniques have the following problems.

That is, the upper and lower surface plates 12, which are the standards of the upper and lower electrostatic chuck bases 16 and 18 and the upper and lower electrostatic chuck bases 16 and 18, which can assemble the substrates 36 and 38 flatly, 14) is composed in the vacuum chamber, the structure is complicated, the weight of the entire surface (12, 14) is increased, and thus the volume of the chamber is also increased, so a vacuum pump having a larger volume must be used for evacuation. There was a problem.

In addition, there is a disadvantage that the capacity, volume, and specific gravity of the drive system used to align the heavy weight (for example, cam or UVW stage method) is increased.

Accordingly, the present invention has been proposed to solve the conventional problems as described above, an object of the present invention is to remove the existing surface plate and to lift the electrostatic chuck base by using magnetic force to obtain the effect of weight reduction, The present invention provides a substrate bonding apparatus and method capable of reducing the yield and performing stable substrate bonding.

In order to achieve the above object, the substrate bonding apparatus according to an embodiment of the present invention,

A substrate bonding apparatus having a lower plate, an upper chamber, a lower chamber, and an upper plate, the substrate bonding apparatus comprising: an upper electrostatic chuck base and a lower electrostatic chuck base capable of forming a magnetic force; The technical configuration is characterized by including a magnetic to raise the upper and lower electrostatic chuck base by magnetic force.

Substrate bonding method according to an embodiment of the present invention in order to achieve the above object,

A first step of applying a sealing material to the substrate; A second step of performing a gap adjustment by floating the upper and lower electrostatic chuck bases using the magnetic force after the first step; And a third step of bonding the substrate after the second step.

Hereinafter, an embodiment according to the present invention, a substrate bonding apparatus, and a method thereof will be described with reference to the accompanying drawings.

3 is a cross-sectional view of a substrate bonding apparatus according to an embodiment of the present invention.

As shown therein, in the substrate bonding apparatus including the lower plate 104, the upper chamber 106, the lower chamber 108, and the upper plate 110, the substrate bonding apparatus includes an upper electrostatic chuck capable of forming a magnetic force. A base 116 and a lower electrostatic chuck base 118; It characterized in that it comprises a magnetic (152 ~ 157) for causing the upper and lower electrostatic chuck base (116, 118) to rise by magnetic force.

The magnetics 152 to 157 may be attached to the upper plate 110 and the lower plate 104.

Magnetics 152 to 154 attached to the upper plate 110 are characterized in that the magnetic force and the attraction of the upper electrostatic chuck base 116 is formed, using a separate spring (not shown) There is.

Magnetics 155 to 157 attached to the lower plate 104 are characterized in that the magnetic force and the repulsive force of the lower electrostatic chuck base 118 are formed.

The substrate bonding apparatus further includes a spring plunger 158 attached to the side of the upper or lower electrostatic chuck bases 116 and 118 to serve as a guide.

The substrate bonding apparatus may be configured to perform a gap adjustment between the upper electrostatic chuck base 116 and the lower electrostatic chuck base 118 with bolts.

The substrate bonding apparatus further includes an actuator 160 for fine-tuning between the lower chamber 108 and the lower electrostatic chuck base 118.

The actuator 160 is characterized in that the piezoelectric actuator.

The piezoelectric actuator 160 is characterized in that the piezo actuator 160.

The piezoelectric actuator 160 is characterized in that the PMN-PT actuator.

Where reference numeral 102 is the lower base, 120 is the upper chamber lift shaft, 122 is the upper chamber lift jack, 124 is the vacuum pump, 126 is the upper lift pin, 128 is the bellows, 132 is the linear actuator, 136 and 138 are substrates.

4 is a flowchart illustrating a substrate bonding method according to an embodiment of the present invention.

As shown therein, a first step ST11 of applying a sealing material to the substrates 136 and 138; A second step (ST12 to ST14) of performing a gap adjustment by floating the upper and lower electrostatic chuck bases (116, 118) using the magnetic force after the first step; After the second step, a third step (ST15) of bonding the substrate is performed.

In addition, after the third step, the light emitting gas injection step ST16 and the gas injection hole sealing step ST17 are performed.

In addition, the second step is characterized in that it further comprises performing a gap adjustment with a bolt.

In addition, the second step may be performed by further including aligning the lower electrostatic chuck base 118 using the piezo actuator 160.

The substrate bonding apparatus according to the present invention configured as described above and the operation of the method will be described in detail with reference to the accompanying drawings.

First, the present invention is to remove the existing surface plate and to raise the electrostatic chuck base by using a magnetic force to reduce the number of vacuum pump and to perform a stable substrate bonding.

First, as shown in FIG. 3, the substrate bonding apparatus includes a lower plate 104, an upper chamber 106, a lower chamber 108, an upper plate 110, an upper electrostatic chuck base 116, and a lower electrostatic chuck base 118. It is configured to include.

This substrate bonding apparatus eliminated the upper top plate 12 and the lower top plate 14 in comparison with the prior art.

In addition, a magnetic is coupled to the substrate bonding device configured as described above to lift the upper and lower electrostatic chuck bases 116 and 118 by magnetic force. These magnetics 152 to 157 are attached to the upper plate 110 and the lower plate 104.

Thus, by removing the conventional surface plate (12, 14), and by mounting the magnetic force (152 ~ 157) on the upper plate 110 and the lower plate 104 by using the repulsive force of the upper electrostatic chuck base 116 and the lower electrostatic Force the chuck base 118 to rise.

At this time, the magnetic (152 ~ 154) mounted on the lower end of the upper plate 110 to the magnetic force flowing in the upper electrostatic chuck base 116 is formed to cancel the load in the direction of gravity by the attraction of the magnetic (152 ~ 154) The weight can be reduced to some extent.

In addition, the magnetic 155 to 157 mounted on the top of the lower plate 104 allows magnetic force and repulsive force to flow in the lower electrostatic chuck base 118 so that the lower electrostatic chuck base 118 can be lifted in the opposite direction of gravity. do.

And the side of the upper or lower electrostatic chuck base 116, 118 is provided with a spring plunger 158 that can serve as a guide.

In addition, although the gap adjustment is conventionally performed with a plurality of springs and bolts, in the present invention, the existing surface plate is removed, and the electrostatic chuck bases 116 and 118 may be lifted by the magnetic, so that only the bolts may be adjusted.

In addition, the actuator 160 is used to fine tune the lower electrostatic chuck base 118. At this time, the actuator used uses a piezoelectric actuator which is miniaturized with a small capacity.

Here, the piezoelectric body (in the present invention, the piezoelectric material and the electrostrictive material are used in combination with the piezoelectric material and the total distortion material) is deformed by an applied electric field, and conversely, electric charges are generated by an applied external force. This phenomenon is caused by the conditions under which an electric dipole can be formed and the spontaneous separation of charge in the lattice structure, which is called a piezo effect. The material causing the piezo effect can be realized through artificial polycrystalline ceramics or naturally formed quartz. Polycrystalline ceramics having piezoelectric properties are artificially manufactured and exposed to a strong electric field (2KV / mm or more) during the manufacturing process to have piezoelectric properties. The method of exposing to a strong electric field during the manufacturing process is called polling, which is a process step of aligning a polar domain freely aligned inside a polycrystalline ceramic in the direction of an applied electric field. Through such a process, a piezoelectric having macroscopic piezoelectric properties can be manufactured.

The piezoelectric effect used in the piezoelectric method refers to the generation of a voltage when a crystal or a roselle salt is applied to a pressure. In contrast, the piezoelectric effect is called a piezoelectric adverse effect. There were two types of piezoelectric piezoelectric systems, namely, a Rosell salt system and a hydrogen phosphate-based system. After that, piezoelectric elements of barium titanate were known, but there were some problems in using them as sensors. Since then, a piezoelectric ceramic called PZT (piezo, piezo) has been discovered as a binary system and has been widely used for sensors such as accelerometers. This PZT ceramic is a mixture of lead titanate (PbTiO3) and lead zirconate (PbZrO3) in a fixed ratio, and is used as a piezoelectric ceramic having various material properties by adding impurities depending on the intended use. Electrostrictive actuators are also similar to piezoelectric actuators, which are made of lead magnesium niobate (PMN) ceramic material and are characterized by the displacement proportional to the applied electric field.

Piezo actuators, which are cylinder type stacked PZTs, are made by stacking several cylindrical PZTs, and must have a parallel structure in order to drive several piezo actuators with the same voltage. To this end, it has a structure in which an electrode is inserted to apply a voltage between PZTs. In order to stack many layers of PZT at the same height, the electrode has a very thin thickness, and it is advantageous to use a material having a weak rigidity such as a conductive epoxy rather than a metal material. Therefore, when a voltage is applied in the polling direction of the PZT piezoelectric body, the PZT piezoelectric body extends in the applied voltage direction. That is, when a positive voltage is applied to the piezoelectric body, the dipoles are aligned and stretched in a constant array, and when a negative voltage is applied, conversely, contraction occurs. Fine adjustment is possible using this.

In addition, the piezoelectric actuator may be composed of PMN-PT. PMN-PT, which constitutes the electrostrictive material, is made of ceramic material and has a characteristic that the displacement is proportional to the square with respect to the applied electric field. PMN (Lead magnesium niobate [Pb (Mg1 = 3Nb2 = 3) O3]) operates below the Curie temperature. PT (Pb-Ti-O3) is a substance added to increase the Curie temperature of PMN. The properties of PMN-PT change according to the amount of PT added to PMN.

Thus, even when the piezo actuator 160 is used, the capacity of the piezo actuator 160 can also be reduced since the surface plate is removed and the magnetics 152 to 157 are used.

As such, the present invention removes the existing surface plate and floats the electrostatic chuck base by using magnetic force to reduce the number of vacuum pumps and perform stable substrate bonding.

As described above, the substrate bonding apparatus and method according to the present invention can remove the existing surface plate and float the electrostatic chuck base by magnetic force to reduce the number of vacuum pumps and reduce the pumping time. Will be.

In addition, the present invention has the advantage that can be carried out mark alignment with a small force because the weight of the upper, lower electrostatic chuck base is installed in the air floating state is reduced.

In addition, since the present invention has no mechanical assembly on the electrostatic chuck base, it is also stable against unnecessary vibrations and noises that may occur during alignment, thereby enabling stable substrate bonding.

Although the above has been described as being limited to the preferred embodiment of the present invention, the present invention is not limited thereto and various changes, modifications, and equivalents may be used. Therefore, the present invention can be applied by appropriately modifying the above embodiments, it will be obvious that such application also belongs to the scope of the present invention based on the technical idea described in the claims below.

Claims (13)

In the substrate bonding apparatus having a lower plate, an upper chamber, a lower chamber, and an upper plate, the said substrate bonding apparatus, An upper electrostatic chuck base and a lower electrostatic chuck base capable of forming magnetic forces; Substrate bonding apparatus comprising a magnetic to raise the upper and lower electrostatic chuck base by magnetic force. The method according to claim 1, wherein the magnetic, And a substrate bonding apparatus attached to the upper plate and the lower plate. The method of claim 2, wherein the magnetic attached to the top plate, Substrate bonding apparatus characterized in that the magnetic force and the attraction of the upper electrostatic chuck base is formed. The method of claim 2, wherein the magnetic attached to the lower plate, Board bonding apparatus characterized in that the magnetic force and the repulsive force of the lower plate is formed. The method according to claim 2, The substrate bonding apparatus, And a spring plunger attached to a side of the upper or lower electrostatic chuck base to serve as a guide. The method according to claim 2, The substrate bonding apparatus, And a bolt adjusting the gap between the upper electrostatic chuck base and the lower electrostatic chuck base. The said board | substrate bonding apparatus of any one of Claims 1-6, And an actuator configured to fine-tune between the lower chamber and the lower electrostatic chuck base. The method according to claim 7, wherein the actuator, A substrate bonding apparatus, characterized in that the piezoelectric actuator. The method according to claim 8, wherein the piezoelectric actuator, A substrate bonding apparatus, characterized in that the piezo actuator. The method according to claim 8, wherein the piezoelectric actuator, A substrate bonding apparatus, characterized in that the PMN-PT actuator. A first step of applying a sealing material to the substrate; A second step of performing a gap adjustment by floating the upper and lower electrostatic chuck bases using the magnetic force after the first step; And a third step of attaching the substrate after the second step. The method of claim 11, wherein the second step, Further comprising performing a gap adjustment with bolts. The method of claim 11, wherein the second step, And further comprising aligning the lower electrostatic chuck base using a piezo actuator.

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