KR101358966B1 - 고밀도 저에너지의 플라즈마 인헨스드 기상 에피택시를 위한 시스템 및 공정 - Google Patents
고밀도 저에너지의 플라즈마 인헨스드 기상 에피택시를 위한 시스템 및 공정 Download PDFInfo
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- KR101358966B1 KR101358966B1 KR1020127009425A KR20127009425A KR101358966B1 KR 101358966 B1 KR101358966 B1 KR 101358966B1 KR 1020127009425 A KR1020127009425 A KR 1020127009425A KR 20127009425 A KR20127009425 A KR 20127009425A KR 101358966 B1 KR101358966 B1 KR 101358966B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/08—Epitaxial-layer growth by condensing ionised vapours
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/38—Nitrides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Semiconductor Lasers (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65720805P | 2005-02-28 | 2005-02-28 | |
| US60/657,208 | 2005-02-28 | ||
| PCT/IB2006/000421 WO2006097804A2 (en) | 2005-02-28 | 2006-02-28 | System and process for high-density,low-energy plasma enhanced vapor phase epitaxy |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077021605A Division KR101366181B1 (ko) | 2005-02-28 | 2006-02-28 | 고밀도 저에너지의 플라즈마 인헨스드 기상 에피택시를위한 시스템 및 공정 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120054093A KR20120054093A (ko) | 2012-05-29 |
| KR101358966B1 true KR101358966B1 (ko) | 2014-02-21 |
Family
ID=36972965
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127009425A Expired - Fee Related KR101358966B1 (ko) | 2005-02-28 | 2006-02-28 | 고밀도 저에너지의 플라즈마 인헨스드 기상 에피택시를 위한 시스템 및 공정 |
| KR1020077021605A Expired - Fee Related KR101366181B1 (ko) | 2005-02-28 | 2006-02-28 | 고밀도 저에너지의 플라즈마 인헨스드 기상 에피택시를위한 시스템 및 공정 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077021605A Expired - Fee Related KR101366181B1 (ko) | 2005-02-28 | 2006-02-28 | 고밀도 저에너지의 플라즈마 인헨스드 기상 에피택시를위한 시스템 및 공정 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8647434B2 (enExample) |
| EP (1) | EP1872383A2 (enExample) |
| JP (1) | JP5214251B2 (enExample) |
| KR (2) | KR101358966B1 (enExample) |
| CN (1) | CN101128911B (enExample) |
| AU (1) | AU2006224282B2 (enExample) |
| CA (1) | CA2597623C (enExample) |
| RU (1) | RU2462786C2 (enExample) |
| SG (1) | SG160345A1 (enExample) |
| WO (1) | WO2006097804A2 (enExample) |
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| DE60324425D1 (de) * | 2003-09-05 | 2008-12-11 | Epispeed S A | Durch LEPECVD und MOCVD auf Silizium hergestellte GaAs/GaAs-Laser |
| KR100754404B1 (ko) * | 2006-05-25 | 2007-08-31 | 삼성전자주식회사 | 확산튜브와, 확산공정용 도펀트 소스 및 상기 확산튜브와도펀트 소스를 이용한 확산방법 |
| JP5041883B2 (ja) * | 2007-06-07 | 2012-10-03 | 昭和電工株式会社 | Iii族窒化物半導体層の製造方法、iii族窒化物半導体発光素子の製造方法 |
| JP4982259B2 (ja) * | 2007-06-14 | 2012-07-25 | 昭和電工株式会社 | Iii族窒化物化合物半導体発光素子の製造方法 |
| US20110017127A1 (en) * | 2007-08-17 | 2011-01-27 | Epispeed Sa | Apparatus and method for producing epitaxial layers |
| EP2332167A4 (en) | 2008-10-03 | 2012-06-20 | Veeco Process Equipment Inc | GAS PHASE epitaxy |
| CN101494151B (zh) * | 2009-03-05 | 2013-11-13 | 苏州晶能科技有限公司 | 高效率的一维线性等离子体清洗磁控阴极装置 |
| JP2011213557A (ja) * | 2010-04-01 | 2011-10-27 | Hitachi Cable Ltd | 導電性iii族窒化物単結晶基板の製造方法 |
| TWI562195B (en) | 2010-04-27 | 2016-12-11 | Pilegrowth Tech S R L | Dislocation and stress management by mask-less processes using substrate patterning and methods for device fabrication |
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| DE102012201953A1 (de) * | 2012-02-09 | 2013-08-14 | Singulus Technologies Ag | Verfahren und Vorrichtung zur Passivierung von Solarzellen mit einer Aluminiumoxid-Schicht |
| CN102534511B (zh) * | 2012-02-28 | 2013-10-16 | 东北大学 | 一种气相沉积薄膜的装置及其使用方法 |
| WO2014008557A1 (en) * | 2012-07-13 | 2014-01-16 | Gallium Enterprises Pty Ltd | Apparatus and method for film formation |
| KR101456549B1 (ko) * | 2012-09-10 | 2014-10-31 | 한국표준과학연구원 | 플라즈마 도움 화학 기상 증착 장치 및 플라즈마 도움 화학 기상 증착 방법 |
| RU2548578C2 (ru) * | 2013-08-19 | 2015-04-20 | Валерий Анатольевич Буробин | Способ получения эпитаксиального слоя бинарного полупроводникового материала на монокристаллической подложке посредством металлоорганического химического осаждения из газовой фазы |
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| CN104752162A (zh) * | 2013-12-31 | 2015-07-01 | 江西省昌大光电科技有限公司 | 一种半绝缘GaN薄膜及其制备方法 |
| CN103806093B (zh) * | 2014-02-17 | 2017-01-18 | 清华大学 | 基于icp的化合物半导体的外延生长装置及方法 |
| RU2578870C2 (ru) * | 2014-03-26 | 2016-03-27 | Открытое акционерное общество "Ордена Трудового Красного Знамени Научно-исследовательский физико-химический институт им. Л.Я. Карпова" (ОАО "НИФХИ им. Л.Я. Карпова") | Способ выращивания пленки нитрида галлия |
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| DE102018220678A1 (de) * | 2018-11-30 | 2020-06-04 | Thyssenkrupp Ag | Verfahren zum PVD-Beschichten von Werkstücken |
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| CN109817518B (zh) * | 2019-01-18 | 2020-03-10 | 重庆市妙格科技有限公司 | 一种发光二极管原材料加热磷扩装置 |
| CN109830419B (zh) * | 2019-01-24 | 2020-05-19 | 中国原子能科学研究院 | 一种微型潘宁离子源 |
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| RU2723477C1 (ru) * | 2019-04-26 | 2020-06-11 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский Нижегородский государственный университет им. Н.И. Лобачевского" | Узел фиксации нагреваемой подложки в вакуумной камере (варианты) |
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| ATE267890T1 (de) | 1997-06-13 | 2004-06-15 | Unaxis Trading Ag | Verfahren zur herstellung von werkstücken, die mit einer epitaktischen schicht beschichtet sind |
| US6472300B2 (en) | 1997-11-18 | 2002-10-29 | Technologies And Devices International, Inc. | Method for growing p-n homojunction-based structures utilizing HVPE techniques |
| JP2004525518A (ja) | 2001-03-30 | 2004-08-19 | テクノロジーズ アンド デバイス インターナショナル インコーポレイテッド | Hvpe技術を使用したサブミクロンiii属窒化物構造を成長させる方法および装置 |
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| WO2006000846A1 (en) | 2004-06-08 | 2006-01-05 | Epispeed S.A. | System for low-energy plasma-enhanced chemical vapor deposition |
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2006
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- 2006-02-28 EP EP06755827A patent/EP1872383A2/en not_active Withdrawn
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- 2006-02-28 JP JP2007557614A patent/JP5214251B2/ja not_active Expired - Fee Related
- 2006-02-28 KR KR1020077021605A patent/KR101366181B1/ko not_active Expired - Fee Related
- 2006-02-28 AU AU2006224282A patent/AU2006224282B2/en not_active Ceased
- 2006-02-28 WO PCT/IB2006/000421 patent/WO2006097804A2/en not_active Ceased
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| WO1996022408A2 (en) | 1995-01-13 | 1996-07-25 | Trustees Of Boston University | Device and method for epitaxially growing gallium nitride layers |
| WO2001065590A2 (en) | 2000-03-02 | 2001-09-07 | Tokyo Electron Limited | Esrf source for ion plating epitaxial deposition |
| JP2004288964A (ja) * | 2003-03-24 | 2004-10-14 | Sumitomo Electric Ind Ltd | GaN結晶の成長方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8647434B2 (en) | 2014-02-11 |
| US20130260537A1 (en) | 2013-10-03 |
| KR20120054093A (ko) | 2012-05-29 |
| AU2006224282B2 (en) | 2012-02-02 |
| WO2006097804A2 (en) | 2006-09-21 |
| KR101366181B1 (ko) | 2014-02-24 |
| AU2006224282A1 (en) | 2006-09-21 |
| SG160345A1 (en) | 2010-04-29 |
| WO2006097804A3 (en) | 2007-01-18 |
| KR20070114361A (ko) | 2007-12-03 |
| RU2007135977A (ru) | 2009-04-10 |
| EP1872383A2 (en) | 2008-01-02 |
| CA2597623C (en) | 2015-07-14 |
| WO2006097804B1 (en) | 2007-02-15 |
| US9466479B2 (en) | 2016-10-11 |
| JP2008532306A (ja) | 2008-08-14 |
| CA2597623A1 (en) | 2006-09-21 |
| CN101128911A (zh) | 2008-02-20 |
| US20080152903A1 (en) | 2008-06-26 |
| CN101128911B (zh) | 2010-09-08 |
| RU2462786C2 (ru) | 2012-09-27 |
| JP5214251B2 (ja) | 2013-06-19 |
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