KR101342171B1 - Substrate inspection apparatus and substrate inspection method - Google Patents

Abstract

assignment

Providing the board | substrate test | inspection apparatus and board | substrate test | inspection method which test wiring of board | substrates, such as a glass substrate used for the electrode plate for liquid crystal displays or a plasma display.

Solution

Signal detection means for physically contacting one wiring pattern to be inspected and detecting a signal applied to the wiring pattern, and a first electrode part physically contactlessly disposed at one end of the wiring pattern to be inspected. A second electrode portion which is physically non-contacted at the other end of the wiring pattern to be inspected, a third electrode portion which is arranged in physical contact with the first base portion of the first wiring pattern, and a second wiring pattern of The phase of the detection signal is determined from a fourth electrode portion which is arranged in physical contact with the second base portion, a power supply means for supplying a reference signal having a predetermined period to each electrode portion, and a detection signal detected by the signal detection means. On the basis of the phase of the detection signal calculated by the inspection signal calculating means and the inspection signal calculating means, the inspection of the conduction of the wiring pattern of the inspection object is performed. A conduction inspection section for judging and a short circuit inspection section for judging inspection of a short circuit of a wiring pattern to be inspected based on the phase of a detection signal calculated by the inspection signal calculation means.

Board inspection apparatus, board inspection method

Description

Substrate inspection device and substrate inspection method {SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD}

BRIEF DESCRIPTION OF THE DRAWINGS The schematic plan view of the board | substrate to test which is a test | inspection object in the board | substrate inspection apparatus of this invention.

2 is a schematic block diagram showing a relationship between a substrate inspection device and a substrate according to the embodiment of the present invention.

3 is a schematic diagram showing transmission and reception of a signal with a substrate and a substrate inspection apparatus disposed on the substrate.

4 is a schematic diagram showing the electrical positional relationship between the substrate and the substrate inspection apparatus shown in FIG. 3;

5 is a block diagram showing a function of the test signal calculating means of the embodiment according to the present invention;

Fig. 6 is a diagram showing the first to fifth results from the wiring pattern in the case of a non-defective product.

FIG. 7 is a diagram illustrating a case where the first wiring pattern is causing a poor conduction. FIG.

FIG. 8 is a diagram illustrating a case where the second wiring pattern is causing a poor conduction. FIG.

Fig. 9 is a diagram showing a case where the third wiring pattern is causing a poor conduction.

10 is a diagram illustrating a case where a first wiring pattern and a second wiring pattern are short-circuited.

11 is a diagram illustrating a case where a second wiring pattern and a third wiring pattern are short-circuited.

Fig. 12 is a diagram showing an outline of signal output when in-phase detection and 90-degree phase detection are performed.

The flowchart in the case of implementing the board | substrate inspection apparatus of one Embodiment which concerns on this invention.

14 is a perspective view illustrating an outline of a structure of a plasma display panel.

DESCRIPTION OF THE REFERENCE NUMERALS (S)

1: substrate inspection device

2: signal detection means

21: first measuring unit

22: second measuring unit

3: inspection signal calculation means

4: power supply means

41: first feeding means

42: second power supply means

43: third feed means

44: fourth feeding means

45: fifth feeding means

51: first electrode portion

52: second electrode portion

53: third electrode portion

54: fourth electrode portion

61: conduction inspection unit

62: short circuit check

8: wiring pattern

Technical field

This invention relates to a board | substrate test | inspection apparatus and a board | substrate test | inspection method, More specifically, For example, the board | substrate test | inspection apparatus which examines wiring of board | substrates, such as a glass substrate used for the electrode plate for liquid crystal displays and a plasma display, and It relates to a substrate inspection method.

Background technology

BACKGROUND ART Conventionally, with the miniaturization of wiring patterns formed on printed wiring boards, plasma display panels, glass substrates for liquid crystal panels, inspection is performed while physically separating the wiring patterns and the inspection probes, or the insulating film The board | substrate test | inspection apparatus which inspects the conduction of a wiring pattern using the non-contact inspection probe which prevents a damage to a fine wiring pattern by covering the electrode surface of an inspection probe with this is known (for example, , Patent Document 1).

In the above-described substrate inspection apparatus, two electrodes covered with an insulating film are used as inspection probes, and one electrode is disposed so as to face one end of the wiring pattern to be inspected, and the other electrode is placed on the other end of the wiring pattern. It arrange | positions so that it may face an edge part, the electrode and wiring pattern are electrostatically couple | bonded by the component of the capacitor | condenser formed by the electrode and wiring pattern which mutually oppose the insulating film which covers this electrode. Then, the test signal is injected from the one electrode to the wiring pattern, and the signal is detected at the other end of the wiring pattern from the other electrode, thereby conducting the wiring pattern based on the detected signal level. It is supposed to check.

Moreover, the structure of the plasma display panel which is an example of a board | substrate is shown below. 14 is a perspective view showing an outline of the structure of the plasma display panel. The plasma display panel shown in FIG. 14 includes a front plate 901 and a back plate 902. The front plate 901 has, for example, a bus electrode 905 formed on the surface of the glass substrate 903 by an ITO (Indium Tin Oxide) film 904 and a film such as silver. It is comprised by the glass substrate in which the wiring 909 was formed. In the front plate 901 configured as described above, the wiring 909 exhibits a resistance value of about several Ω in a good product. On the other hand, when only the bus electrode 905 of the wiring 909 is disconnected, the disconnection point is conducted only by the ITO film 904 and exhibits an intermediate level resistance value of about 100 to 10 MΩ.

Since the substrate inspection apparatus as described above injects and detects an inspection signal into the wiring pattern through the capacitance of the capacitor formed by the electrodes and the wiring pattern facing each other, the detected signal level is determined by the wiring pattern and the electrode. Is changed depending on the capacitance of the capacitor formed and is influenced by error factors such as the distance between the wiring pattern and the electrode and the stray capacitance generated between the wiring pattern and the periphery, so that the detected signal level tends to be disturbed. There is a nature. For this reason, when a substrate such as the front plate 901 is inspected using such a substrate inspection apparatus, if a defect in which the intermediate level resistance value is generated occurs as in the case where only the bus electrode 905 is disconnected, the bus electrode ( Since it is difficult to discriminate the detection signal level due to the disconnection of 905 and the signal level due to the disturbance, it is inconvenient that it is difficult to detect the defect having the intermediate level resistance value.

In order to solve such a problem, patent document 2 arrange | positions the feed probe and the detection probe which are arrange | positioned at the one end of a wiring electrically non-contactingly with the wiring, and are electrically non-contact with the wiring at the other end of a wiring. An apparatus in which opposed feeding probes are arranged has been proposed.

In this apparatus, a 1 MHz sine wave test signal is applied to a power supply probe, the voltage generated by the detection probe is detected, and the quality of the wiring is determined based on the detected phase of the voltage. By such an apparatus, the influence of the distance change between the wiring and the inspection probe can be reduced, and it is possible to solve the above problem.

However, in recent years, as the wiring pattern of a board | substrate progresses further, in the board | substrate inspection apparatus described in patent document 2, the malfunction arises when the short circuit test | inspection is performed. As the wiring pattern of the substrate becomes finer, the width of the wiring pattern itself becomes narrower and the interval between the wiring patterns becomes narrower, so that the feeding or detecting of the wiring pattern desired by the power feeding probe or the detection probe is performed. Has a difficult problem.

For this reason, even if the board | substrate with which refinement | miniaturization was advanced, the board | substrate test | inspection apparatus which can test the conduction of a wiring pattern, a short circuit, etc. correctly is needed.

Moreover, in the board | substrate test | inspection apparatus described in this patent document 2, since the test | inspection electrode which detects the conduction of a wiring pattern and the short circuit between wiring patterns, respectively is detected by another test process, the required test time becomes long, There is a problem that requires a complicated configuration.

Patent Document 1: Japanese Patent Application Laid-Open No. 11-133090

Patent Document 2: Japanese Patent Application Laid-Open No. 2005-241614

SUMMARY OF THE INVENTION The present invention has been made in view of such a situation, and even when a substrate having a plurality of fine wiring patterns can be accurately inspected for conduction of wiring patterns and short circuits between wiring patterns, conduction inspection and short circuit inspection can be simultaneously checked. Provided are a substrate inspection apparatus and method.

Means for solving the problem

The invention according to claim 1 has a first wiring pattern having a first linear portion, a first base portion extending from one end of the first linear portion, and a second one. It has a 2nd base part extended from the one end of a linear upper part and the said 2nd linear upper part, and is arrange | positioned between the 2nd wiring pattern arrange | positioned in the opposing position with the said 1st wiring pattern, and the said 1st and 2nd wiring pattern. A substrate inspection apparatus for inspecting a substrate on which a plurality of third wiring patterns having a light shielding function to be formed are formed, the apparatus comprising: signal detection means for physically non-contacting to one wiring pattern to be inspected and detecting a signal applied to the wiring pattern And a first electrode portion that is physically non-contacted at one end of the wiring pattern to be inspected, and physically non-contacted at the other end of the wiring pattern to be inspected. A second electrode portion disposed, a third electrode portion disposed in physical contact with the first base portion of the first wiring pattern, and a fourth electrode disposed in physical contact with the second base portion of the second wiring pattern A power supply means for supplying an electrode portion, a reference signal having a predetermined period to each electrode portion, inspection signal calculation means for calculating a phase of the detection signal from the detection signal detected by the signal detection means, and the inspection signal On the basis of the phase of the detection signal calculated by the calculation means, on the basis of the phase of the detection signal calculated by the inspection signal calculation means; The board | substrate test | inspection apparatus provided with the short circuit test part which judges the test | inspection of the short circuit of the target wiring pattern.

The invention according to claim 2, wherein the signal detecting means is physically disposed at one end of one wiring pattern to be inspected at a non-contact physically and at the other end of the one wiring pattern. It provides the board | substrate inspection apparatus of Claim 1 which has a 2nd measuring part arrange | positioned noncontact.

The invention according to claim 3, wherein the power supply means includes first power supply means for supplying a first reference signal having a predetermined period to the first and second electrode parts, and the first and fourth electrode parts. Second power supply means for supplying a second reference signal having a cycle, third power supply means for supplying a third reference signal having a predetermined cycle to the second and third electrode portions, and the first and second electrode portions And fourth feeding means for supplying a fourth reference signal having a predetermined period to the third and fourth electrode parts, and a fifth supplying fifth reference signal having a predetermined period to the third and fourth electrode parts. It provides the board | substrate inspection apparatus of Claim 1 which has a power supply means.

The invention according to claim 4, wherein the conduction inspection unit applies a reference signal through the first electrode portion and the second electrode portion, and uses a detection signal detected by the signal detection means. The board | substrate inspection apparatus of Claim 1 is provided.

The invention according to claim 5, wherein the conduction inspection unit determines whether the conduction is successful based on a phase difference between the detection signal and the reference signal.

The invention according to claim 6, wherein the short-circuit inspection section applies a reference signal through the first electrode section and the fourth electrode section and / or the second electrode section and the third electrode section, and the signal detecting means. It provides the board | substrate inspection apparatus of Claim 1 using the detection signal detected by the above.

The invention according to claim 7, wherein the short-circuit inspection unit determines whether the short circuit is successful by using the phase difference between the two detection signals and the two reference signals, respectively. Provide a device.

The invention according to claim 8, wherein the power supply means has fifth power supply means for supplying a fifth reference signal having a predetermined period to the third and fourth electrode portions, and the inspection signal calculation means includes the fifth power supply means. Claims characterized in that on the basis of the five reference signals, at least two phases of different detections are calculated, and the conduction inspection section and the short-circuit inspection section determine conduction and short circuits based on the results of the two detections. The board | substrate inspection apparatus of Claim 1 is provided.

The invention according to claim 9 extends from a first wiring pattern having a first linear upper portion and a first base portion extending from one end of the first linear upper portion, and a second linear upper portion and one end of the second linear upper portion. In addition to having a second base portion provided, a plurality of second wiring patterns disposed at positions opposite to the first wiring pattern, and a plurality of third wiring patterns having a light shielding function disposed between the first and second wiring patterns are formed. A substrate inspection method for inspecting a substrate, comprising: a first electrode portion that is physically non-contacted at one end of a wiring pattern to be inspected, and a second electrode portion that is physically non-contacted at the other end of the wiring pattern to be inspected And a third electrode portion disposed in physical contact with the first base portion of the first wiring pattern, and physically with a second base portion of the second wiring pattern. Arranging a fourth electrode portion arranged in contact with each other, supplying a reference signal having a predetermined period between the predetermined electrode portions, detecting a detection signal applied to the wiring pattern, and detecting the detection signal from the detected detection signal. The board | substrate test | inspection method is computed, based on the phase of the said detection signal, the test | inspection of the conduction of the wiring pattern of the said test | inspection object is carried out, and the test | inspection of a short circuit is provided. By providing these inventions, all the above problems are solved.

Carrying out the invention  Best form for

BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described.

First, an example of the structure of the board | substrate used as an inspection object in this invention is demonstrated.

1 is a schematic plan view of an inspected substrate to be inspected in the substrate inspection apparatus of the present invention.

1 is a glass substrate used as a front plate of a plasma display panel, for example.

As for the wiring pattern 8 which this board | substrate has, the 1st wiring pattern 81, the 2nd wiring pattern 82, and the 3rd wiring pattern 83 are formed in multiple numbers.

This first wiring pattern 81 has a first linear portion 811 and a first base portion 812. The first linear upper portion 811 is formed in a straight line. This first linear upper portion 811 corresponds to a bus electrode of a plasma display made of silver or the like. On one side of the first linear portion 811, a first transparent electrode 813 formed of indium tin oxide (ITO) or the like is formed.

The first base portion 812 extends from one end of the first linear upper portion 811 and is formed as a so-called tape automated bonding (TAB).

The second wiring pattern 82 has a second linear top portion 821 and a second base portion 822. The second linear upper portion 821 is formed in a straight line. The second linear top portion 821 corresponds to the bus electrode of the plasma display made of silver or the like similarly to the first linear top portion 811. The second linear top portion 821 is disposed to be parallel to the first linear top portion 811. On one side of the second linear upper portion 821, a second transparent electrode 823 is formed of indium tin oxide (ITO) or the like. Since this 2nd transparent electrode 823 is arrange | positioned so that the 2nd linear top part 821 and the 1st linear top part 811 may be parallel, it will be arrange | positioned so that it may become parallel with the 1st transparent electrode 813. FIG.

Similarly to the first base portion 812, the second base portion 822 extends from one end of the second linear upper portion 821, and functions as a so-called tape automated bonding (TAB).

As shown in FIG. 1, this second base portion 822 extends to the side (right side of the drawing) opposite to the side where the first base portion 812 is disposed. For this reason, the 1st wiring pattern 81 and the 2nd wiring pattern 82 are the 1st linear upper part 811 (or 1st transparent electrode 813), and the 2nd linear upper part 821 (or 2nd transparent). Electrodes 823 are disposed in parallel with each other.

In addition, the first transparent electrode 813 and the second transparent electrode 823 are disposed inside the first linear upper portion 811 and the second linear upper portion 821 so as to face each other, and a pair of transparent electrodes are disposed. It is formed as a pair.

In addition, in FIG. 1, the 1st base part 812 of the 1st wiring pattern 81 is arrange | positioned at the left side of the paper, and the 2nd base part 822 of the 2nd wiring pattern 82 is located at the right side of the paper. It is arranged.

The third wiring pattern 83 is a linear pattern arranged in parallel with the first linear upper portion 811 and the second linear upper portion 821, and has a light shielding function. This third wiring pattern 83 corresponds to the black stripe of the plasma display.

Unlike the first and second wiring patterns, the third wiring pattern 83 is physically formed independently and is not physically connected to other wiring patterns on the substrate surface. The third wiring pattern 83 is disposed at a position for partitioning a set of transparent electrode portions. In FIG. 1, five transparent electrode portions are divided into four third wiring patterns 83 while being indicated by diagonal lines. .

As described above, the wiring pattern 8 is formed by forming a plurality of first to third wiring patterns 81, 82, and 83 in parallel.

Next, the structure of the board | substrate inspection apparatus 1 which concerns on this invention is demonstrated.

FIG. 2 is a schematic block diagram showing the relationship between the substrate inspection apparatus and the substrate according to the embodiment of the present invention, and FIG. 3 is a schematic diagram showing transmission and reception of signals with the substrate and the substrate inspection apparatus disposed on the substrate, 4 is a schematic diagram showing the electrical positional relationship between the substrate and the substrate inspection device shown in FIG. In FIG. 4, the wiring pattern is shown by the oblique line. In FIG. 4, the code | symbol 100 has shown the glass substrate, and the code | symbol 11 has shown the mounting table for mounting the board | substrate which the board | substrate inspection apparatus 1 has.

The board | substrate test | inspection apparatus 1 of one Embodiment which concerns on this invention is the signal detection means 2, the test signal calculation means 3, the power supply means 4, the electrode part 5, the control means 6, a display. It has a means (7).

The basic principle of the present invention is to apply a signal for conduction inspection and an AC signal for short circuit inspection to a wiring pattern to be inspected, and calculate a change in phase with an applied signal based on a signal detected from the wiring pattern. By (detecting), the conduction and short circuit of a wiring pattern are judged.

In addition, although the wiring pattern is shown by the minimum number of wiring patterns required for description in the accompanying drawing, many wiring is actually formed and the inspection is performed by selecting these wirings sequentially. In addition, the wiring pattern of the test object represented by this specification has indicated any one wiring pattern of a 1st-3rd wiring pattern. In particular, the wiring pattern to be subjected to the conduction inspection is a portion of the first linear upper portion 811, the second linear upper portion 821, or the third wiring pattern 83 in the above description.

The signal detection means 2 detects the signal which flows through the wiring pattern used as a test object.

The signal detecting means 2 includes a first measuring unit 21, a second measuring unit 22, a first signal side unit 23, a second signal measuring unit 24, and a third signal measuring unit 25. Is done with). As shown in FIG. 4, this 1st measuring part 21 has a predetermined space | interval with respect to one end of a wiring pattern, and is arrange | positioned so that it may oppose noncontact. For this reason, this 1st measuring part 21 forms the capacitance C1 with respect to a wiring pattern. The signal is transmitted to the signal measuring unit 23 through the capacitance C1.

In addition, it is preferable that this predetermined space | interval is set to 0.1-0.5 mm. This predetermined interval is preferably set in the above range because the first measuring unit 21 must form one wiring pattern and the capacitance C1. In addition, since the electric field from the wiring pattern is diffused with a spread of about 30 degrees from the wiring pattern, the first measuring unit 21 has a predetermined interval (height) not affected by the electric field of the adjacent wiring pattern. You need to have

As shown in FIG. 4, the 2nd measuring part 22 is arrange | positioned noncontact by having a predetermined space | interval at the other end part of a wiring pattern. For this reason, this 2nd measuring part 22 forms the capacitance C2 with respect to a wiring pattern similarly to the 1st measuring part 21. FIG. The capacitance is transmitted to the signal measuring unit 23 using the capacitance C2.

In addition, it is preferable that this predetermined space | interval is set to 0.1-0.5 mm similarly to the 1st measuring part 21.

The position where this 2nd measuring part 22 is arrange | positioned is not specifically limited, Only the 1st measuring part 21 can also be arrange | positioned, and can be arrange | positioned in the position on the opposite side to the position where the 1st measuring part 21 is arrange | positioned. It may be.

The 1st and 2nd measuring parts 21 and 22 can use a power feeding pad, and although it has a circular shape in plan view in FIG. 3, it is not specifically limited, What is necessary is just to be able to measure a test signal reliably.

As shown in FIG. 3, these 1st and 2nd measuring parts 21 and 22 move at a predetermined speed in the direction which is substantially orthogonal to the some wiring pattern (direction of the arrow of FIG. 3).

For this reason, the 1st and 2nd measuring parts 21 and 22 can detect the signal of a wiring pattern at predetermined intervals, and can detect a signal continuously from a some wiring pattern.

Moreover, you may provide the amplifier which amplifies the magnitude | size of the signal which the 1st measuring part 21 and the 2nd measuring part 22 measure.

The first to third signal measuring units 23, 24 and 25 measure the signals from the first measuring unit 21 and the second measuring unit 22. An AC voltmeter is used for these signal measuring parts.

The signal measuring unit 23 detects signals from the first measuring unit 21 and the second measuring unit 22. The signal detected by the signal measuring unit 23 is transmitted to the test signal calculating means 3 described later.

The 2nd signal measuring part 24 and the 3rd signal measuring part 25 are grounded in order to set the reference electric potential, and can respectively measure the electric potential of the wiring pattern from a reference electric potential.

In the present description, three signal measuring units are provided for convenience, but the number is not limited as long as the potential of the wiring pattern can be measured.

It is preferable that the quantity measuring part of this signal detection means 2 has a positioning part (not shown) for specifying the position of itself on the glass substrate 100. As shown in FIG. This is because by having this positioning section, when conduction and / or short-circuit inspection described later can be specified, from which wiring pattern the defect was detected when the defect was detected.

Although this positioning part can have the said function by calculating the moving distance of xy using a speedometer or a current measuring system, if it is a function which can determine the position of the 1st and 2nd measuring parts 21 and 22, it will not specifically limit. Do not.

The electrode portion 5 is used to apply (supply) a signal to one or more desired wiring patterns. This electrode part 5 is equipped with the 1st electrode part 51, the 2nd electrode part 52, the 3rd electrode part 53, and the 4th electrode part 54. As shown in FIG.

The 1st electrode part 51 is arrange | positioned at the one end part of the wiring pattern to test | inspection at physically non-contact at predetermined intervals. In FIG. 3, it is arrange | positioned in the vicinity of the left end of the wiring pattern (1st linear top part 811 and 2nd linear top part 821). This 1st electrode part 51 is arrange | positioned inside the 1st measuring part 21. As shown in FIG.

When the first electrode portion 51 supplies a signal to the wiring pattern, as described above, since the first electrode portion 51 and the wiring pattern are arranged at a predetermined interval, an electrostatic discharge is caused to the wiring pattern. It will form a capacity. The signal is applied through this capacitance. This predetermined interval is set to 0.1 to 0.5 mm.

The first electrode portion 51 is formed so as to oppose at least the wiring pattern to be inspected and two wiring patterns adjacent to the wiring pattern. By forming in this way, the short circuit test | inspection of the conduction of the wiring pattern used as a test object, and two wiring patterns which this wiring pattern adjoins (for example, the wiring pattern arrange | positioned in the upper and lower side positions in FIG. 3) can be performed. Because there is a number.

In addition, in FIG. 3, it arrange | positions so that it may cross in a substantially perpendicular direction with respect to a parallel direction so that a signal can be applied to all the multiple wiring patterns provided in parallel.

The first electrode part 51 applies a signal of a predetermined power supply means described later to the wiring pattern. In FIG. 3, the signal from the second power supply means 42, the third power supply means 43, and the fourth power supply means 44 is supplied by the first electrode portion 51.

In addition, although this 1st electrode part 51 is formed from one member in FIG. 3, you may provide as many as the number corresponding to each power supply means.

In addition, the first electrode portion 51 forms the capacitance Ca with respect to the wiring pattern.

The 2nd electrode part 52 has a structure substantially the same as the 1st electrode part 51, and is arrange | positioned in the position (refer FIG. 3) which is linearly symmetrical with respect to the 1st electrode part 51 and an inspection board | substrate.

The second electrode portion 52 applies a signal from the first power feeding means 41, the second power feeding means 42, and the fourth power feeding means 44 to the wiring pattern.

In addition, the second electrode portion 52 forms the capacitance Cb with respect to the wiring pattern.

The third electrode portion 53 is disposed in physical contact with the first base portion 812 of the first wiring pattern 81. The third electrode portion 53 applies a signal from the first power feeding means 41, the fourth power feeding means 44, and the fifth power feeding means 45. The third electrode portion 53 is in physical contact with the wiring pattern and directly applies a signal.

The fourth electrode portion 54 is disposed in physical contact with the second base portion 822 of the second wiring pattern 82. The fourth electrode portion 54 applies signals from the third power feeding means 43, the fourth power feeding means 44, and the fifth power feeding means 45. The fourth electrode portion 54 is in physical contact with the wiring pattern and directly applies a signal. These 3rd electrode part 53 and the 4th electrode part 54 are the 1st base part 812 of all the 1st wiring patterns 81, and the 2nd wiring pattern (as shown in FIG. 3). The second base portions 822 of 82 are respectively connected.

The third electrode portion 53 and the fourth electrode portion 54 are disposed at opposing positions so as to connect the first base portion 812 and the second base portion 822, respectively.

The power supply means 4 supplies a signal (current or voltage) for inspection to the wiring pattern to be inspected. The board | substrate test | inspection apparatus 1 of this invention detects the signal level (output) shown on a wiring pattern by applying the some signal which has a fixed period to a wiring pattern, and the conduction of the wiring pattern used as a test object is carried out. And short circuits.

This power supply means 4 supplies the signal of each of the 1st-5th power supply means 41-45 by the said 1st-4th electrode part 51, 52, 53, 54. As shown in FIG.

Although the power supply means 4 may be arrange | positioned so that a signal may be supplied between the electrode parts selected using one power supply, it uses a plurality of power supplies, and supplies a signal simultaneously between each electrode.

In this embodiment shown in FIG. 3, the power supply means 4 includes the first power supply means 41, the second power supply means 42, the third power supply means 43, the fourth power supply means 44, and the first power supply means 4. 5 power supply means 45 is provided.

The first power supply means 41 supplies the first and second reference signals f1 having a predetermined period to the second and third electrode portions 52 and 53. For this reason, the 1st power supply means 41 is arrange | positioned so that it may be connected in series with the 3rd electrode part 53 and the 2nd electrode part 52, as shown in FIG.

The second power supply means 42 supplies the second reference signal f2 having a predetermined period to the first and second electrode portions 51 and 52. For this reason, the 2nd power supply means 42 is arrange | positioned so that it may be connected in series between the 1st electrode part 51 and the 2nd electrode part 52, as shown in FIG.

The third power supply means 43 supplies the third reference signal f3 having a predetermined period to the first and fourth electrode portions 51 and 54. For this reason, the 2nd power supply means 42 is arrange | positioned so that it may be connected in series between the 1st electrode part 51 and the 4th electrode part 54, as shown in FIG.

The fourth power supply means 44 includes a fourth reference signal having a predetermined period in the first electrode portion 51, the second electrode portion 52, the third electrode portion 53, and the fourth electrode portion 54 ( f4). For this reason, the 4th power supply means 44 makes the 1st electrode part 51 and the 2nd electrode part 52 into one terminal, and sets the 3rd electrode part 53 and the 4th electrode part 54 to one terminal. As another terminal, it arrange | positions so that these terminals may be connected in series.

The fifth power supply means 45 supplies the fifth reference signal f5 having a predetermined period to the third electrode portion 53 and the fourth electrode portion 54. For this reason, the 5th power supply means 45 is arrange | positioned so that it may be connected in series between the 3rd electrode part 53 and the 4th electrode part 54, as shown in FIG.

The first reference signals f1 to the fifth reference signals f5 of the first power feeding means 41 to the fifth power feeding means 45 each use signals of sinusoids of higher frequencies. For example, when these signals are used by the test signal calculation means 3 described later, the conduction or short circuit at a predetermined point can be checked by extracting each signal.

It is preferable that the 1st power supply means 41 thru | or 5th power supply means 45 shown in FIG. 3 have two power supply parts which respectively apply an alternating current signal. The two power feeding units are set to be 180 degrees out of phase. In addition, these feeders can adjust the output level so that the same impedance is loaded with respect to the wiring pattern to be inspected.

The inspection signal calculation means 3 calculates a signal for the conduction inspection and the short circuit inspection processed by the control means 6 described later.

The test signal calculating means 3 has a signal receiving unit 31 and a phase calculating unit 32.

The signal receiver 31 receives the reference signal from the first to fifth power feeding means 41, 42, 43, 44, 45 and the signal detected by the signal detecting means 2.

The signal receiver 31 transmits these received signals to the phase calculator 32.

The phase calculator 32 includes a first phase calculator 32a, a second phase calculator 32b, a third phase calculator 32c, a fourth phase calculator 32d and a fifth phase calculator ( 32e). Each of these phase calculators performs phase detection based on the respective received signals, and obtains a result for conducting or inspecting a short circuit of a predetermined site.

The first phase calculation unit 32a performs phase detection based on the first reference signal f1 from the measured value of the signal detection means 2. The result (first result) of this phase detection of the first phase calculator 32a is transmitted to the control means 6.

The second phase calculator 32b performs phase detection based on the second reference signal f2 from the measured value of the signal detection means 2. The result (second result) of this phase detection of the second phase calculator 32b is transmitted to the control means 6.

The third phase calculation unit 32c performs phase detection based on the first reference signal f3 from the measured value of the signal detection means 2. The result (third result) of this phase detection of the third phase calculator 32c is transmitted to the control means 6.

The fourth phase calculation unit 32d performs phase detection based on the second reference signal f4 from the measured value of the signal detection means 2. The result (fourth result) of this phase detection of the fourth phase calculating section 32d is transmitted to the control means 6.

The fifth phase calculation unit 32e performs phase detection based on the first reference signal f5 from the measured value of the signal detection means 2. The result (fifth result) of this phase detection of the fifth phase calculation section 32e is transmitted to the control means 6.

Each of these phase calculators can grasp the signal level applied to the target wiring pattern by performing phase detection from the measured value based on the reference signal applied to the wiring pattern to be inspected.

The control means 6 checks the conduction and short circuit of a wiring pattern based on the result computed from the test signal calculation means 3.

This control means 6 has the conduction | inspection inspection part 61 which performs the conduction | conduction test of a wiring pattern, and the short circuit inspection part 62 which performs the short circuit inspection of a wiring pattern based on the said 1st-5th result.

The basic principle of these conduction inspection part 61 and the short circuit inspection part 62 specifies the position of a wiring pattern based on a 1st result-a 5th result, and confirms that the specified wiring pattern does not conduct or short-circuit. Is done.

The concrete operation | movement of the conduction | inspection inspection part 61 and the short circuit inspection part 62 is demonstrated using FIG. FIG. 6 shows the first to fifth results from the wiring pattern in the case of good quality.

The f1-f5 shown in FIG. 6 have shown the 1st-5th result computed by each phase calculating part based on the 1st reference signal f1-the 5th reference signal f5.

In addition, the conduction test | inspection part 61 and the short circuit test | inspection part 62 of this invention use the result of which of the 1st thru | or 5th result to position wiring pattern, and the result of which the result is used. The sequence number is changed.

The case where the fifth result is used for positioning of the wiring pattern will be described.

The conduction | inspection inspection part 61 specifies the position of a wiring pattern by the 5th result. In FIG. 6, the place higher than the predetermined value (the place higher than the preset threshold. The place of round display shown in FIG. 6) becomes the place of the first wiring pattern 81 from the fifth result.

Next, when the position of the first wiring pattern 81 is determined, the first result is verified. At this time, if the value of this specific place is lower than predetermined value (preset threshold value) from a 1st result, it is judged that it is conducting. On the other hand, if the value of the 1st result of this specific place is higher than predetermined value, it will be judged that it is not conducting (bad).

Next, in the conduction inspection unit 61, a place lower than a predetermined value (a place lower than a preset threshold. A place indicated by a square shown in Fig. 6) becomes a place of the second wiring pattern 82 from the fifth result. .

Next, when the position of the second wiring pattern 82 is determined, the state of the third result is verified. At this time, if the value of this specific place is lower than predetermined value (preset threshold value) from a 3rd result, it is judged that it is conducting. On the other hand, if the value of the 3rd result of this specific place is higher than predetermined value, it will be judged that it is not conducting (poor).

Next, the short circuit inspection part 62 determines the short circuit of the 1st wiring pattern 81 and the 2nd wiring pattern 82 based on a 4th result. In this case, the short-circuit inspection unit 62 has a value higher than the predetermined value of the fourth result between the two positions of the first wiring pattern 81 specified above (the place of the triangular display shown in FIG. 6). If there exists), it is judged that there is no short circuit. On the other hand, when a high value does not exist, it is determined that the first wiring pattern 81 or the second wiring pattern 82 is short-circuited with the third wiring pattern 83.

In this case, the triangular display of the fourth result is present between the two rounded displays of the fifth result, and it is determined that the third wiring pattern is not short-circuited.

And the conduction | inspection test part 61 verifies the 2nd result corresponding to this place, after specifying the place higher than a predetermined value from a 4th result.

At this time, when the second result is smaller than the predetermined value, it is determined that the third wiring pattern 83 is conducting.

In this way, the conduction and short circuit of the first wiring patterns 81 to the third wiring pattern 83 can be determined based on the first to second results.

In addition, the order which uses said 1st thru | or 5th result is only one embodiment.

Next, the case where a defect exists in a wiring pattern is demonstrated.

FIG. 7 shows the case where the first wiring pattern is causing poor conductive.

In this case, the conduction inspection unit 61 determines, as the position (rounded display) of the first wiring pattern 81, the place showing the value higher than the predetermined value from the fifth result, and displays the first result at the position. Verify. At this time, as for the 1st wiring pattern 81 of the poor conduction, a 1st result becomes a value higher than predetermined value, and it is detected that a conduction defect has generate | occur | produced.

8 illustrates a case where the second wiring pattern is causing poor conduction.

In this case, the conduction inspection unit 61 determines, as the position (square display) of the second wiring pattern 82, the place showing the value lower than the predetermined value from the fifth result, and verifies the third result at the position. do. At this time, as for the 2nd wiring pattern 82 of poor conduction, the 3rd result becomes a value higher than predetermined value, and it is detected that a conduction defect has generate | occur | produced.

Fig. 9 shows a case where the third wiring pattern is causing poor conduction.

In this case, the conduction inspection unit 61 specifies the position of the third wiring pattern 83 from the fourth result and verifies the second result at that position. At this time, as for the 3rd wiring pattern 83 of the poor conduction, a 2nd result becomes a value lower than a predetermined value, and it is detected that a conduction defect has generate | occur | produced.

10 shows a case where the first wiring pattern and the second wiring pattern are short-circuited.

In this case, the short circuit inspection part 62 detects that two 3rd wiring patterns 83 exist between two 1st wiring patterns 81 (or 2nd wiring patterns 82) by a 5th result. do. At this time, since the 1st wiring pattern 81 and the 2nd wiring pattern 82 are short-circuited, there exists a state in which a signal is not output to 5th result, and it is detected that a short circuit has generate | occur | produced.

11 illustrates a case where the second wiring pattern and the third wiring pattern are short-circuited.

In this case, the short circuit inspection part 62 has the 3rd wiring pattern 83 between two 1st wiring patterns 81 (or the 2nd wiring pattern 82) by a 4th result and a 5th result. It can be seen that a fourth result indicating that one did not appear. At this time, it is detected that the third wiring pattern is short-circuited.

Moreover, even if the 3rd wiring pattern 83 has a short circuit with either the 1st wiring pattern 81 or the 2nd wiring pattern 82, a short circuit can be detected.

Next, another embodiment in which the conduction and short circuit of the first wiring pattern 81 and the second wiring pattern 82 are determined using the fifth reference signal will be described.

While the first wiring pattern 81 and the second wiring pattern 82 are arranged in parallel, the first wiring pattern 81 is physically connected to the third electrode portion 53, and the second wiring pattern 82 is provided. ) Is physically connected to the fourth electrode portion 54.

On the basis of the fifth reference signal, the signal measured by the signal inspecting means 2, the first signal detected in phase with the fifth reference signal, and the second signal 90 degrees phase detected. Calculate Fig. 12 shows an outline of the signal output when the first signal A in phase detection and the second signal B in phase detection of 90 degrees are performed.

As shown in FIG. 12, when no conduction defect and short circuit defect exist in the first wiring pattern 81 and the second wiring pattern 82, a repetition of the same waveform is displayed. In the location (1), a change occurs with the first signal and the second signal as compared with the normal first signal and the second signal. This is understood that the first wiring pattern 81 is causing poor conduction.

In addition, in the locations (2) and (3) in FIG. 12, a large change occurs in the first signal as compared with the normal first signal, and some change occurs as compared with the second signal in which the second signal is normal. It is understood that the first wiring pattern 81 and the second wiring pattern 82 cause short circuit failure.

In addition, in the position of (4) in FIG. 12, it changes so that a 1st signal may protrude larger than a normal 1st signal. This is understood that the first wiring pattern 81 causes a poor conduction.

In this way, the signal detected by the signal detecting means 2 is obtained by using the two signals obtained by the in-phase detection and the 90 degree phase detection on the basis of the fifth reference signal in the inspection signal calculating means 3. The conduction and short circuit of the first wiring pattern 81 or the second wiring pattern 82 can be inspected.

The display means 7 displays the result processed by the processing means 6. This display means 7 can use display apparatuses, such as what is called a liquid crystal display. The above is description of the structure of the board | substrate inspection apparatus 1 of one Embodiment which concerns on this invention.

Next, operation | movement of the board | substrate inspection apparatus 1 of one Embodiment which concerns on this invention is demonstrated.

FIG. 13 shows a flowchart in the case where the substrate inspection apparatus of the embodiment according to the present invention is implemented.

First, the glass substrate 100 is placed on the mounting table 11 of the substrate inspection apparatus 1, and the substrate 100 is prepared to be inspected (S1).

At this time, the wiring pattern 8 which consists of the 1st wiring pattern 81 thru | or the 3rd wiring pattern 83 is formed in the board | substrate 100, and the information about the shape and arrangement | positioning interval of this wiring pattern 8 Are stored in memory. Since such information is stored in the storage device, it is possible to specify whether the detection signal detected by the signal detection means 2 is the inspection signal detected from which wiring pattern.

When the substrate 100 is prepared, a reference signal applied by the first power feeding means 41 to the fifth power feeding means 45 is set.

When the test preparation is completed, the signal detecting means 2 moves the predetermined position of the wiring pattern 8 (S2).

At this time, the signal detecting means 2 continuously detects a detection signal applied on each wiring pattern, and the test signal measured by the signal measuring unit 23 (or the signal measuring units 24 and 25) is a test signal. It is sent to the calculation means 3.

The inspection signal calculation means 3 receives the detection signal from the signal detection means 2, and calculates the detection signal used for a continuity test and a short circuit test (S3).

At this time, the inspection signals required for conduction and short-circuit are calculated by detection by each phase calculating section as described above.

The inspection signal calculation means 3 transmits these inspection signals to the conduction inspection part 61 and the short circuit inspection part 62 of the control means 6.

The conduction | inspection test part 61 performs the test | inspection of the conduction of the 1st wiring pattern 81 thru | or the 3rd wiring pattern 83 by the method similar to the above-mentioned description (S4).

The short circuit inspection part 62 inspects the short circuit of the 1st wiring pattern 81 thru | or the 3rd wiring pattern 83 by the method similar to the above-mentioned description (S5).

Based on the results of these inspection units, it is determined whether the inspected substrate is a good product or a defective product (S6).

The display means 7 displays the determination result from the control means 6 (S7).

Industrial availability

The board | substrate test | inspection apparatus and board | substrate test | inspection method which concern on this invention are applicable to various board | substrates, such as not only a glass substrate but a printed wiring board, a flexible board | substrate, a multilayer wiring board, and a film carrier for semiconductor packages, Especially, A plurality of linear wiring patterns can be provided in parallel, and can be effectively used when the wiring patterns are physically arranged independently.

According to the invention as claimed in claim 1, the first wiring pattern has a first linear portion and a first base portion extending from one end of the first linear portion, and from a second linear upper portion and one end of the second linear upper portion. A plurality of second wiring patterns having an extended second base portion and disposed at an opposite position to the first wiring pattern, and a third wiring pattern having a light shielding function disposed between the first and second wiring patterns are provided. A substrate inspection apparatus for inspecting a formed substrate, the apparatus comprising: signal detection means for physically contacting one wiring pattern to be inspected and detecting a signal applied to the wiring pattern, and one end of the wiring pattern to be inspected A first electrode portion that is physically contactlessly disposed at the second electrode; and a second physically disposed contactlessly at the other end of the wiring pattern to be inspected. A second electrode portion, a third electrode portion disposed in physical contact with the first base portion of the first wiring pattern, and a fourth electrode portion disposed in physical contact with the second base portion of the second wiring pattern; Power supply means for supplying a reference signal having a predetermined period to each electrode unit, inspection signal calculation means for calculating a phase of the detection signal from the detection signal detected by the signal detection means, and the inspection signal calculation means. On the basis of the calculated phase of the detected signal, a conduction inspection unit that determines the conduction of the conduction of the wiring pattern of the inspection object, and the inspection object based on the phase of the detection signal calculated by the inspection signal calculation means. Since it has a short circuit inspection part which judges the test | inspection of the short circuit of a wiring pattern, the inspection object carries out the test of the conduction of a wiring pattern and the test of a short circuit, minimizing damage to a board | substrate. It may be determined by using the phase of the detection signal detected from the wiring pattern.

For this reason, it is possible to perform an accurate and quick inspection, and to detect a detection signal (inspection signal) for conduction and short circuit inspection by the combination of the first to fourth electrode portions.

According to the invention as set forth in claim 2, the signal detecting means includes: a first measuring unit which is physically arranged in contact with one end of one wiring pattern to be inspected, and the other end of the one wiring pattern; Since it has a 2nd measuring part physically arrange | positioned non-contactingly, a stable signal can be detected without contacting the wiring pattern used as a test object.

According to the invention according to claim 3, the power supply means includes first power supply means for supplying a first reference signal having a predetermined period to the first and second electrode parts, and the first and fourth electrode parts. Second power supply means for supplying a second reference signal having a predetermined period, third power supply means for supplying a third reference signal having a predetermined period to the second and third electrode portions, and the first and second electrodes. A fourth power supply means for supplying a fourth reference signal having a predetermined period to the third and fourth electrode portions, and a fifth reference signal having a predetermined period to the third and fourth electrodes. Since there are five power feeding means, power supply means for supplying a reference signal is provided between the electrodes, so that a test signal regarding conduction and short circuit can be simultaneously applied to the wiring pattern.

For this reason, this board | substrate test | inspection apparatus becomes possible to parallel-process (simultaneous process) conduction and a short circuit test | inspection.

According to the invention as set forth in claim 4, the conduction inspection section applies a reference signal through the first electrode section and the second electrode section and uses a detection signal detected by the signal detection means. A reference signal can be used that is only affected by the wiring pattern.

For this reason, this board | substrate inspection apparatus can perform an accurate inspection.

According to the invention of claim 5, since the conduction inspection unit determines the conduction of the conduction by the phase difference between the detection signal and the reference signal, the conduction state can be easily and accurately determined by the phase difference.

According to the invention according to claim 6, the short-circuit inspection section applies a reference signal through the first electrode section and the fourth electrode section and / or the second electrode section and the third electrode section, and detects the signal. Since the detection signal detected by the means is used, two reference signals can be used, so that it is possible to determine at which places the short circuit of the wiring pattern occurs.

According to the invention according to claim 7, the short-circuit inspection unit determines whether the short circuit is successful by using the phase difference between the two detection signals and the two reference signals, respectively. The state can be determined.

According to the invention as claimed in claim 8, since the fifth reference signal can be detected at least two phases different from each other, two signals can be calculated, and conduction and short circuit can be detected from those signals. The conduction and the short circuit can be detected with a smaller number.

According to the invention of claim 9, a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and from one end of the second linear portion and the second linear portion, A plurality of second wiring patterns having an extended second base portion and disposed at an opposite position to the first wiring pattern, and a third wiring pattern having a light shielding function disposed between the first and second wiring patterns are provided. A substrate inspection method for inspecting a formed substrate, comprising: a first electrode portion that is physically non-contacted at one end of a wiring pattern to be inspected, and a second electrode that is physically non-contacted at the other end of the wiring pattern to be inspected A third electrode portion disposed in physical contact with the first base portion of the first wiring pattern, and a second base portion of the second wiring pattern. A fourth electrode portion disposed in contact with each other, a reference signal having a predetermined period is supplied between the predetermined electrode portions, a detection signal applied to the wiring pattern is detected, and the detection signal is detected from the detected detection signal. The phase of the detection signal is calculated, and the inspection of the conduction of the wiring pattern to be inspected is judged based on the phase of the detection signal, and the inspection of the short circuit is judged. And the inspection of a short circuit can be judged by using the phase of the detection signal detected from the wiring pattern used as a test object.

For this reason, it is possible to perform an accurate and quick inspection, and to detect a detection signal (inspection signal) for conduction and short circuit inspection by the combination of the first to fourth electrode portions.

Claims (9)

And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from one end of the second linear portion and the second linear portion. And alternately arranged between the first wiring pattern and the second wiring pattern, the second wiring pattern being disposed opposite to the first wiring pattern, and the first wiring pattern and the second wiring pattern, and independently of each other wiring pattern. A substrate inspection apparatus for inspecting a substrate on which a plurality of third wiring patterns are formed, Signal detection means for moving in a direction orthogonal to the plurality of wiring patterns and being physically non-contacted to one wiring pattern to be inspected and detecting a signal applied to the wiring patterns; A first electrode portion which is physically arranged in contact with one end of the wiring pattern to be inspected; A second electrode portion physically arranged in contact with the other end of the wiring pattern to be inspected; A third electrode part disposed in physical contact with the first base part of the first wiring pattern; A fourth electrode portion disposed in physical contact with the second base portion of the second wiring pattern; Feeding means for supplying an inspection reference signal to each of the electrode portions; Inspection signal calculation means for calculating a phase of the detection signal from the detection signal detected by the signal detection means; A conduction inspection unit that judges inspection of conduction of a wiring pattern of the inspection object based on a calculation result of the inspection signal calculation means; On the basis of the calculation result of the said inspection signal calculation means, it has a short circuit inspection part which judges the inspection of the short circuit of the wiring pattern of the said inspection object, The power supply means, First signal supply means for supplying a first inspection reference signal having a predetermined period between the third electrode portion and the fourth electrode portion; And a second signal supply means for supplying a second inspection reference signal having a period different from the first inspection reference signal between the first and second electrode portions and the third and fourth electrode portions. , The inspection signal calculation means, First detection means for performing phase detection on the basis of the first inspection reference signal with respect to the detection signal detected by the signal detection means; And second detection means for performing phase detection on the detection signal detected by the signal detection means based on the second inspection reference signal, The conduction inspection section selects a place where the result of phase detection of the first detection means is higher than a predetermined value based on a change in the result of phase detection of the first detection means caused by the movement of the signal detection means. We identify as place of 1 wiring pattern, The short-circuit inspection section is configured to determine the location of two adjacent first wiring patterns specified by the conduction inspection section on the basis of a change in the result of phase detection of the second detection means caused by the movement of the signal detection means. In the case where there is no place higher than a predetermined value as a result of phase detection of the second detection means, the third wiring pattern between the two first wiring patterns is the first or second wiring. It is judged that it is short-circuited with a pattern, The board | substrate inspection apparatus characterized by the above-mentioned. The method according to claim 1, The short-circuit inspection section is further configured to determine whether two adjacent first wiring patterns specified by the conduction inspection section are changed based on a change in the result of phase detection of the second detection means that occurs with the movement of the signal detection means. Between two places, when two places higher than a predetermined value exist as a result of phase detection of the second detection means, the first wiring pattern and the second wiring pattern between the two high places are It determines with short circuit, The board | substrate inspection apparatus characterized by the above-mentioned. And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from one end of the second linear portion and the second linear portion. And alternately arranged between the first wiring pattern and the second wiring pattern, the second wiring pattern being disposed opposite to the first wiring pattern, and the first wiring pattern and the second wiring pattern, and independently of each other wiring pattern. A substrate inspection apparatus for inspecting a substrate on which a plurality of third wiring patterns are formed, Signal detection means for moving in a direction orthogonal to the plurality of wiring patterns and being physically non-contacted to one wiring pattern to be inspected and detecting a signal applied to the wiring patterns; A first electrode portion which is physically arranged in contact with one end of the wiring pattern to be inspected; A second electrode portion physically arranged in contact with the other end of the wiring pattern to be inspected; A third electrode part disposed in physical contact with the first base part of the first wiring pattern; A fourth electrode portion disposed in physical contact with the second base portion of the second wiring pattern; Feeding means for supplying an inspection reference signal to each of the electrode portions; Inspection signal calculation means for calculating a phase of the detection signal from the detection signal detected by the signal detection means; A conduction inspection unit that judges inspection of conduction of a wiring pattern of the inspection object based on a calculation result of the inspection signal calculation means; On the basis of the calculation result of the said inspection signal calculation means, it has a short circuit inspection part which judges the inspection of the short circuit of the wiring pattern of the said inspection object, The power supply means, First signal supply means for supplying a first inspection reference signal having a predetermined period between the third electrode portion and the fourth electrode portion; And a second signal supply means for supplying a second inspection reference signal having a period different from the first inspection reference signal between the first and second electrode portions and the third and fourth electrode portions. , The inspection signal calculation means, First detection means for performing phase detection on the basis of the first inspection reference signal with respect to the detection signal detected by the signal detection means; And second detection means for performing phase detection on the detection signal detected by the signal detection means based on the second inspection reference signal, The conduction inspection section selects a place where the result of phase detection of the first detection means is higher than a predetermined value based on a change in the result of phase detection of the first detection means caused by the movement of the signal detection means. We identify as place of 1 wiring pattern, The short-circuit inspection section is configured to determine the location of two adjacent first wiring patterns specified by the conduction inspection section on the basis of a change in the result of phase detection of the second detection means caused by the movement of the signal detection means. In the case where there are two places higher than a predetermined value as a result of phase detection of the second detection means, the first wiring pattern and the second wiring pattern between the two high places are short-circuited. The board | substrate inspection apparatus characterized by the above-mentioned. 4. The method according to any one of claims 1 to 3, The signal detecting means includes a first measuring unit which is physically contactless at one end of one wiring pattern to be inspected, and a second measuring unit which is physically contactless at another end of the one wiring pattern. It has a board | substrate inspection apparatus characterized by the above-mentioned. delete delete delete And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from one end of the second linear portion and the second linear portion. And alternately arranged between the first wiring pattern and the second wiring pattern, the second wiring pattern being disposed opposite to the first wiring pattern, and the first wiring pattern and the second wiring pattern, and independently of each other wiring pattern. A substrate inspection method for inspecting a substrate on which a plurality of third wiring patterns are formed, A first electrode portion that is physically non-contacted at one end of the wiring pattern to be inspected, a second electrode portion which is physically non-contacted at the other end of the wiring pattern to be inspected, and a first of the first wiring pattern A third electrode part disposed in physical contact with the first base part and a fourth electrode part disposed in physical contact with the second base part of the second wiring pattern; A first inspection reference signal having a predetermined period is supplied between the third electrode portion and the fourth electrode portion, and between the first and second electrode portions and the third and fourth electrode portions. Supply a second inspection reference signal having a period different from the first inspection reference signal to Detecting a signal applied to the wiring patterns by the signal detecting means while moving the signal detecting means physically contactlessly disposed on one wiring pattern to be inspected in the direction orthogonal to the plurality of wiring patterns, Phase detection based on the first inspection reference signal is performed on the detection signal detected by the signal detection means, and phase based on the second inspection reference signal with respect to the detection signal detected by the signal detection means. To detect, The place where the result of phase detection based on the first inspection reference signal is higher than a predetermined value based on the change of the result of phase detection based on the first inspection reference signal generated with the movement of the signal detecting means. It is specified as a place of a 1st wiring pattern, A neighbor specified based on a change in the result of phase detection based on the first inspection reference signal based on a change in the result of phase detection based on the second inspection reference signal generated with the movement of the signal detecting means If no place higher than a predetermined value exists as a result of phase detection based on the second inspection reference signal between the two places of the first wiring pattern, the space between the two first wiring patterns. It is judged that the said 3rd wiring pattern is short-circuited with the said 1st or 2nd wiring pattern, The board | substrate inspection method characterized by the above-mentioned. And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from one end of the second linear portion and the second linear portion. And alternately arranged between the first wiring pattern and the second wiring pattern, the second wiring pattern being disposed opposite to the first wiring pattern, and the first wiring pattern and the second wiring pattern, and independently of each other wiring pattern. A substrate inspection method for inspecting a substrate on which a plurality of third wiring patterns are formed, A first electrode portion that is physically non-contacted at one end of the wiring pattern to be inspected, a second electrode portion which is physically non-contacted at the other end of the wiring pattern to be inspected, and a first of the first wiring pattern A third electrode part disposed in physical contact with the first base part and a fourth electrode part disposed in physical contact with the second base part of the second wiring pattern; A first inspection reference signal having a predetermined period is supplied between the third electrode portion and the fourth electrode portion, and between the first and second electrode portions and the third and fourth electrode portions. Supply a second inspection reference signal having a period different from the first inspection reference signal to Detecting a signal applied to the wiring patterns by the signal detecting means while moving the signal detecting means physically contactlessly disposed on one wiring pattern to be inspected in the direction orthogonal to the plurality of wiring patterns, Phase detection based on the first inspection reference signal is performed on the detection signal detected by the signal detection means, and phase based on the second inspection reference signal with respect to the detection signal detected by the signal detection means. To detect, The place where the result of phase detection based on the first inspection reference signal is higher than a predetermined value based on the change of the result of phase detection based on the first inspection reference signal generated with the movement of the signal detecting means. It is specified as a place of a 1st wiring pattern, A neighbor specified based on a change in the result of phase detection based on the first inspection reference signal based on a change in the result of phase detection based on the second inspection reference signal generated with the movement of the signal detecting means When two places higher than a predetermined value exist as a result of the phase detection based on the said 2nd test reference signal between two places of the said 1st wiring pattern, It is determined that the first wiring pattern and the second wiring pattern are short-circuited.

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