KR101327377B1 - A probe card using F-PCB - Google Patents

Abstract

The present invention relates to a probe card assembly using a flexible printed circuit board (f-pcb), the probe card pin is coupled to the fixed block, the fixed block is coupled to the block, the block is a printed circuit The probe card pin is coupled to a substrate, wherein the probe card pin is composed of a probe card pin body and a probe, and a portion of the probe is coupled to the probe card pin body by plating adhesion, and protrudes out of the probe card pin body to separate semiconductor electrode pads. The cross section of the end of the probe in contact with the is characterized in that the rectangular shape, the probe by f-pcb is connected between the second connector formed on the probe card pin body and the first connector formed on the printed circuit board And an electrical connection between the printed circuit board and the printed circuit board.
According to the present invention, the test performance is improved by maximizing the contact area between the probe card pins and the electrode pads, and the length of the probe can be extended, which enables the sending work, the alloy plating, and the probe and the printed circuit board. Providing a probe card assembly structure that is easy to manufacture by easy electrical connection with and to reduce the manufacturing time and effort required to reduce the manufacturing cost and efficient production work is possible.

Description

Probe card assembly using flexible printed circuit board {A probe card using F-PCB}

The present invention relates to a probe card assembly for use in testing semiconductor wafers and the like, and provides a probe card assembly structure for electrically connecting a probe card and a printed circuit board using a flexible printed circuit board, thereby improving test performance. The present invention relates to a probe card assembly capable of a sending operation while reducing the overall manufacturing cost and minimizing the production time.

In general, in a semiconductor manufacturing process, after finishing a wafer manufacturing process, a good semiconductor device is sorted by a probing test, the semiconductor device of the selected good product is packaged, and a final product is produced.

Such a probing test is performed by the test apparatus applying a predetermined electrical signal through a probe card assembly which is in contact with an electrode pad of a semiconductor device implemented on a semiconductor substrate, and then receiving a corresponding electrical signal by the test apparatus again. It is made by going through the process of testing the normal and abnormality of the semiconductor device implemented on the image.

At this time, the conventional probe card assembly, as shown in Figure 1, combines the needle (needle) 1 and the epoxy (2), the epoxy (2) with the ceramic block (3), the ceramic block (3) ) Is connected to the printed circuit board (PCB) (4) by using a reinforcement plate (5) or the like by a bolt (6) and configured by electrically connecting the probe and the connector.

Therefore, in order to construct a conventional probe card assembly, the work of directly attaching the probe to the ceramic block is required. For this purpose, the probe should be aligned with the ceramic block according to the distance pattern between the chips.

However, in order to align the probe, it is necessary to adjust the position of the probe with a camera, and then adjust the position of the probe with an expensive transfer equipment and fix it with solder, which is a complicated and difficult process. Not only was this required, but the equipment was expensive.

In addition, the electrical connection between the probe and the connector on the printed circuit board has to be performed while preventing a short circuit between a plurality of closely located probes, there is a problem that the efficiency of the production of the probe card assembly is reduced due to excessive time and effort.

Probe card assembly is a basic requirement that accurate operation is required, and the time reduction from the order date to the completion date is the key to securing the competitiveness, the difficulty of the manufacturing operation and the resulting long time was a big problem.

As one of studies for shortening a probe card manufacturing process, Korean Patent Laid-Open Publication No. 10-2008-0114096 "Probe Card Manufacturing Method and Probe Card by It" includes etching a predetermined area on a sacrificial substrate to form a trench. Forming a photoresist layer by coating a photoresist on the sacrificial substrate to fill the trench, etching away the photoresist layer to form two or more molds, and introducing two conductive materials into each of the two or more molds. It comprises a step of forming the body portion of the probe above.

However, Korean Patent Publication No. 10-2008-0114096 relates to a method of manufacturing a probe card, which is only a technique for forming two probe tips from one trench, and a plurality of photoresist layer forming steps by introducing a sacrificial substrate, As the etching step is required, the manufacturing period is long and unnecessary effort is required.

On the other hand, in the conventional probe card assembly, one side of the probe in contact with the electrode pad of the semiconductor device is formed in a pyramid shape or a round shape, and thus the contact area with the electrode pad is small, so that the test performance is reduced, and the length of the probe Was only about 30 μm, so there was a problem that the sending (sending) is impossible.

The problem to be solved by the present invention is to solve the above problems, to provide a probe card assembly structure that is easy to manufacture by reducing the time and effort required for manufacturing to reduce the manufacturing cost and to enable efficient production work will be.

Another problem to be solved by the present invention is to solve the above problems, it is possible to reduce the production time by allowing a number of operators to share the work for each dirt when manufacturing the probe card assembly.

Another problem to be solved by the present invention is to solve the above problems, the test performance is improved by maximizing the contact area with the electrode pad, the length can be extended to send (sending) and easy alloy plating One probe card is to provide a pin.

The present invention relates to a probe card assembly using a flexible printed circuit board (f-pcb), the probe card pin is coupled to the fixed block, the fixed block is coupled to the block, the block is a printed circuit The probe card pin is coupled to a substrate, wherein the probe card pin is composed of a probe card pin body and a probe, and a portion of the probe is coupled to the probe card pin body by plating adhesion, and protrudes out of the probe card pin body to separate semiconductor electrode pads. The cross section of the end of the probe in contact with the is characterized in that the rectangular shape, the probe by f-pcb is connected between the second connector formed on the probe card pin body and the first connector formed on the printed circuit board And an electrical connection between the printed circuit board and the printed circuit board.

Similarly, the present invention relates to a probe card assembly using a flexible printed circuit board, the probe card pin is coupled to the fixed block, the fixed block is coupled to the block, the block is coupled to the printed circuit board, the probe card The pin is composed of a probe card pin body and a probe so that a portion of the probe is coupled to the probe card pin body by plating adhesion and protrudes out of the probe card pin body to contact a separate semiconductor electrode pad. The cross section may have a rectangular shape, and an electrical connection between the probe and the printed circuit board may be performed by f-pcb connecting between a second connector formed on the probe card pin body and a pin fixedly coupled to the printed circuit board. This is characterized in that it is made.

At this time, the probe, the bonding hole for improving the bonding strength of the plating adhesion by filling the material of the probe card pin body when the plating adhesion with the probe card pin body; characterized in that it comprises a.

In addition, the substrate material of the f-pcb is characterized in that the polyester (Polyester, PET) or polyimide (Polyimide, PI).

According to the present invention, it is possible to reduce the manufacturing cost and efficient production work by reducing the time and effort required for manufacturing by providing a probe card assembly structure that is easy to manufacture, such as easy electrical connection with the connector.

According to the present invention, it is possible to minimize the time required for the production of the probe card assembly by allowing a plurality of operators to share the work per dirt.

According to the present invention, the test performance is improved by maximizing the contact area between the probe card pins and the electrode pads, and the length of the probe can be extended, so that the working can be performed and the alloy plating can be easily performed.

1 is a diagram of a conventional probe card assembly.
2 is a perspective view of a probe card pin body according to a preferred embodiment of the present invention.
3 is a partial perspective view of a probe card pin according to a preferred embodiment of the present invention.
4A and 4B are plan views of a probe according to a preferred embodiment of the present invention.
5A and 5B are plan views of a probe according to another embodiment of the present invention.
6 is a plan view of a probe card assembly according to a preferred embodiment of the present invention.
7 is a plan view of a probe card assembly according to another embodiment of the present invention.

Before describing the specific details for the practice of the invention, terms and words used in the specification and claims should be construed to enable the inventor to properly define the concept of a term in order to best describe its invention It should be interpreted as meaning and concept consistent with the technical idea of the present invention.

In addition, when it is determined that the detailed description of the known function and its configuration related to the present invention may unnecessarily obscure the subject matter of the present invention, it should be noted that the detailed description is omitted.

Hereinafter, a probe card assembly using a flexible printed circuit board according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 2 to 7.

2 is a perspective view of a probe card pin body according to a preferred embodiment of the present invention, Figure 3 is a partial perspective view of a probe card pin according to a preferred embodiment of the present invention, Figures 4a and 4b are preferred 5A and 5B are plan views of a probe according to another embodiment of the present invention, and FIG. 6 is a plan view of a probe card assembly according to a preferred embodiment of the present invention. 7 is a plan view of a probe card assembly according to another exemplary embodiment of the present disclosure.

As shown in Figure 2, the probe card assembly according to a preferred embodiment of the present invention includes a probe card pin, the probe card pin is composed of a probe card pin body 101 and the probe 100.

The probe card pin body 101 and the probe 100 are manufactured by processing a metal plate having a predetermined thickness into a shape as shown, and the probe 100 is coupled to one end of the probe card pin body 101 by a separate It performs a function of contact with the semiconductor electrode pad.

The thickness of the metal plate for processing the probe card pin body 101 is preferably 60 μm, and the thickness of the metal plate for processing the probe 100 is preferably less than 60 μm, but the present invention is limited to this standard. no.

In addition, as the metal of the metal plate for processing the probe card pin body 101 and the probe 100, various kinds of metals or alloys may be adopted according to the required specifications, and nickel, cobalt, rhodium, or alloys thereof may be employed. For example.

In order to manufacture the probe card pins, first, the probe 100 is manufactured, and then the probe card pin body 101 is bonded to the probe 100 by plating. Finally, a part of the probe 100 is probe card pin body. (101) The integrated probe card pin is completed in a state of protruding outward.

As shown in FIG. 3, an empty coupling hole 1001 is formed in a portion of the probe 100 located inside the probe card pin main body 101, so that the plating of the probe card pin main body 101 at the time of plating adhesion processing is performed. Since the material fills up to the coupling hole 1001, the coupling force between the probe card pin body 101 and the probe 100 is maximized.

As the planar shape of the probe 100 may be adopted as shown in Figures 4a to 5b, the present invention is not limited to this and can be variously modified according to manufacturing conditions or requirements.

Since the probe card pin body 101 has the same thickness as a whole, a large number of probe card pin body 101 can be quickly manufactured in a large amount by cutting a thin metal plate having a predetermined thickness.

In addition, as described above, after the probe 100 and the probe card pin body 101 are separately manufactured, manufacturing costs may be minimized by plating and bonding the probe card pin body 101 to the probe 100.

In addition, since the contact surface between the probe 100 and the semiconductor electrode pad has a rectangular shape, the test performance is improved according to the maximization of the contact area, and the length of a portion of the probe 100 protruding outside the probe card pin body 101 is 100. It can be extended to about μm without difficulty, allowing for sending work to maximize test efficiency.

Next, the lower portion of the probe card pin body 101 as described above is fixed to the fixed block 106.

The fixing block 106 is made of a material such as ceramic, and by combining and fixing a plurality of probe card pin bodies 101 using one fixing block 106 per dirt, the worker's work is separated by per dirt. The efficiency can be improved.

In addition, the plurality of fixing blocks 106 are fixedly coupled to the block 108, and the block 108 is fixedly coupled to the printed circuit board 110.

The method of coupling the fixed block 106 to the block 108 or the method of coupling the block 108 to the printed circuit board 110 may adopt an epoxy molding method, an adhesive method using an adhesive, or a coupling method using a bolt. Can be.

On the other hand, the electrical connection between the probe 100 and the printed circuit board 110 in the probe card assembly according to the invention is carried out in a very convenient way than the prior art.

Referring to FIG. 6, a f-pcb 114 is connected between a first connector 112 mounted on the printed circuit board 110 and a second connector 116 formed at one end of the probe card pin body 101. By doing so, an electrical connection is made between the probe 100 and the printed circuit board 110.

Since the f-pcb 114 directly connects the probe card pin body 101 and the printed circuit board 110, the f-pcb 114 directly connects the probe card pin body 101 with the printed circuit board 110 via other components. The electrical connection is smooth and the possibility of malfunction is minimized.

The f-pcb 114 according to the present invention is a flexible printed circuit board (f-pcb), a printed circuit board formed on a flexible insulating film, a flexible material (polyester, PET) Or, since heat-resistant plastic substrates such as polyimide (PI) are used, flexibility is ensured and three-dimensional wiring is possible.

In addition, as shown in FIG. 7, a pin 118 may be used instead of the first connector 112 of the printed circuit board 110 for electrical connection between the probe 100 and the printed circuit board 110.

That is, the f-pcb 114 may be electrically connected to the probe card pin body 101 and the printed circuit board 110 by being connected to the pin 118 that is fixedly coupled to the printed circuit board 110.

In addition, in the preferred embodiment of the present invention, the fixed block 106 is coupled to the block 108 and the block 108 is coupled to the printed circuit board 110, but the present invention is not limited thereto. Depending on the test specification or requirements, the fixed block 106 may be directly coupled to the printed circuit board 110 in a state in which the block 108 is missing.

In the probe card assembly according to the present invention, one worker does not need to manufacture the entire probe card assembly during manufacture, and a plurality of workers share work with each other to work by dirt. That is, since one dirt will correspond to one fixed block 106, a plurality of workers may work for each dirt and then collect the works for each dirt to combine the entire works for each dirt into one block 108. .

For example, when manufacturing a probe card assembly for inspecting chips having 400 dirts, it has traditionally taken considerable time and effort since one worker had to manufacture the entire dirt, but according to the present invention, for example, 50 workers are required to collaborate. By working only 8 dirt per person and then collecting the work of the whole dirt, the probe card assembly can be easily manufactured.

That is, after performing a separate operation for each dirt (fixing block 106), the probe card pins are aligned and fixedly coupled on one fixing block 106 according to the pattern interval of the chip, and a plurality of fixings thus formed By bringing the block 106 workpiece into a structure that couples the workpiece to the block 108, a significant effect can be expected in shortening the delivery date of the probe card assembly.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be appreciated by those skilled in the art that numerous changes and modifications can be made without departing from the invention. Accordingly, all such modifications and variations are intended to be included within the scope of the present invention.

100: probe 1001: coupling hole
101: probe card pin body 106: fixed block
108: block 110: printed circuit board
112: first connector 114: f-pcb
116: second connector 118: pin

Claims (4)

In a probe card assembly using a flexible printed circuit board (f-pcb),
Probe card pin is coupled to the fixed block 106,
The fixed block 106 is coupled to the block 108,
The block 108 is coupled to the printed circuit board 110,
The probe card pin is composed of a probe card pin body 101 and the probe 100 so that a portion of the probe 100 is coupled to the probe card pin body 101 by plating adhesion and the probe card pin body 101 The cross section of the end of the probe 100 protruding outward and in contact with a separate semiconductor electrode pad has a rectangular shape,
The probe 100 is connected by the f-pcb 114 between the second connector 116 formed on the probe card pin body 101 and the first connector 112 formed on the printed circuit board 110. And characterized in that the electrical connection is made between the printed circuit board 110,
The substrate material of the f-pcb (114) is a probe card assembly using a flexible printed circuit board, characterized in that the polyester (Polyester, PET) or polyimide (Polyimide, PI).
In a probe card assembly using a flexible printed circuit board (f-pcb),
Probe card pin is coupled to the fixed block 106,
The fixed block 106 is coupled to the block 108,
The block 108 is coupled to the printed circuit board 110,
The probe card pin is composed of a probe card pin body 101 and the probe 100 so that a portion of the probe 100 is coupled to the probe card pin body 101 by plating adhesion and the probe card pin body 101 The cross section of the end of the probe 100 protruding outward and in contact with a separate semiconductor electrode pad has a rectangular shape,
The f-pcb 114 connects between the second connector 116 formed on the probe card pin body 101 and the pin 118 coupled to and fixed to the printed circuit board 110. It characterized in that the electrical connection is made between the printed circuit board 110,
The substrate material of the f-pcb (114) is a probe card assembly using a flexible printed circuit board, characterized in that the polyester (Polyester, PET) or polyimide (Polyimide, PI).
3. The method according to claim 1 or 2,
The probe 100,
By using the flexible printed circuit board, comprising: a coupling hole (1001) to improve the bonding strength of the plating adhesion by filling the material of the probe card pin body 101 when the plating with the probe card pin body 101 Probe card assembly.
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