JP4960854B2 - Wiring board for electronic component inspection equipment - Google Patents

Description

  The present invention relates to a wiring board for an electronic component inspection apparatus that is used in an electronic component inspection apparatus such as a probe card, and that is particularly easy to manufacture in a thin film forming process and can be manufactured at a relatively low cost.

For example, an electronic component inspection device such as a probe card is used to efficiently inspect the electrical characteristics of electronic components such as a large number of semiconductor elements formed on a Si wafer or the like. In such an inspection apparatus, a multilayer wiring board having various wiring layers therein is used in order to transmit an inspection signal and receive inspection information.
On the other hand, in order to cope with the recent shortening of the development period of semiconductor elements, a multilayer wiring board capable of shortening the manufacturing delivery time and improving the electrical characteristics of the sub power connection wiring, and a probe using the same have been proposed. (For example, refer to Patent Document 1).
Japanese Patent Laying-Open No. 2005-79144 (pages 1 to 9, FIGS. 1 to 3)

  The multilayer wiring board of Patent Document 1 includes a base substrate having a plurality of insulating layers and a wiring conductor layer formed therebetween, a thin film multilayer having a plurality of resin insulating layers and a thin film wiring layer formed therebetween. Is a laminated body obtained by integrally laminating a portion (see FIG. 2 of Patent Document 1). Such a multilayer wiring board is electrically connected to the wiring of the relay board via a connection pad formed on the back surface of the base board, thereby forming a probe card together with the relay board, and a plurality of layers formed on the surface of the thin film multilayer part. It is electrically connected to the semiconductor element to be inspected through a probe connected to each electrode pad (see FIG. 3 of Patent Document 1). The probe card is mounted on the surface of a printed circuit board or the like via the relay board.

By the way, a multilayer wiring board used for an electronic component inspection apparatus is mounted on the surface of a printed circuit board or the like. For example, electrical connection between the two is performed on a pin provided on the back surface of the multilayer wiring board and the surface of the printed circuit board or the like. When the mechanical contact with the provided socket is performed, the socket on the printed circuit board side becomes very expensive and is not practical.
For this reason, a step part opened upward and laterally is formed on the side surface of the multilayer wiring board, an external connection pad formed on the bottom surface of the step part, and an external connection pad provided on the surface of the printed circuit board, etc. A method of connecting these with a bonding wire is being studied.
However, in a multilayer wiring board having the step portion on the side surface, it may be difficult to mask the step portion when manufacturing a test pad on the surface of the multilayer wiring substrate. Moreover, even if masking can be performed, a complicated process for polishing and removing the resist or plating that has inadvertently adhered to the wall surface of the stepped portion is required, which increases the number of man-hours. There was a problem that it was prolonged and the cost was increased.

  The present invention solves the problems described in the background art, and can be electrically connected to a printed circuit board or the like to be mounted via a bonding wire, particularly easy to manufacture in a thin film forming process, and thus relatively inexpensive to manufacture. It is an object to provide a wiring board for an electronic component inspection apparatus.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-described problems, the present invention divides a multilayer wiring board into a mounting board on which a testing pad is formed on the surface and a base board on which a step portion having a pad for external connection on the bottom surface is formed on the side surface. The idea is to connect the two substrates electrically.
That is, the wiring board for an electronic component inspection apparatus according to the present invention (Claim 1) includes a plurality of insulating layers, and has a front surface, a back surface, and a side surface located between these surfaces, and is formed between the insulating layers. A base substrate having a wiring layer and a step portion formed on the side surface and having a pad for external connection formed on the bottom surface, and a plurality of insulating layers mounted on the surface of the base substrate. A mounting substrate having a formed surface, a back surface, and a wiring layer formed between the plurality of insulating layers, wherein the back surface and the surface of the base substrate are electrically connected to each other. It is characterized by.

According to this, in a mounting substrate comprising a plurality of insulating layers, having a front surface, a back surface, and a side surface and including a wiring layer formed between the plurality of insulating layers, the surface can be easily masked, Even if the plating is inadvertently attached to the side surface, it can be easily removed. For this reason, it becomes a mounting board | substrate which formed the pad for a test | inspection with sufficient precision in this surface. In addition, the bonding wire for connecting to the printed circuit board can be easily connected by an external connection pad located on the bottom surface of the step portion provided on the side surface of the base substrate. Therefore, electrical connection with a printed circuit board or the like can be performed via the bonding wire, and it is possible to provide a wiring board for an electronic component inspection apparatus that can be manufactured easily and relatively inexpensively in the thin film formation process.
Further, since the mounting substrate and the base substrate are divided, both the substrates can be manufactured in parallel or at the same time. For this reason, in response to shortening of the development period of electronic components such as semiconductor elements, it is possible to quickly provide a mounting substrate in which inspection pads are formed at required positions on the surface according to needs. On the other hand, the base substrate can maintain a layout or the like according to a printed circuit board to be mounted, or can change it in a timely manner. Therefore, compared with the conventional integrated object (for example, the multilayer wiring board of the said patent document 1), it becomes easy to shorten manufacture delivery time, and it becomes possible to cope with various delivery dates flexibly.

The insulating layer is made of ceramic or resin as described later.
Further, the step portion formed on the side surface of the base substrate may be formed only on any side surface in addition to being formed for each side surface of the four sides of the substrate.
Furthermore, the electrical connection between the back surface of the mounting substrate and the front surface of the base substrate is, for example, in the form of a pad formed opposite to each of the substrates and a solder ball connecting between them, and The form by the pin provided and the socket provided in the other so that this pin may be received is included.
In addition, the inspection pads formed on the surface of the mounting substrate include, for example, a Ti thin film layer and a Cu thin film layer adjacent to the surface, a Cu plating layer formed on the Cu thin film layer, and these It consists of a Ni plating layer and an Au plating layer covering the top surface or the peripheral surface. A probe that contacts the electrode of the electronic component is connected to the top surface of the Au plating layer later.

Further, according to the present invention, the step portion of the base substrate includes a bottom surface parallel to the front surface and the back surface of the base substrate, and a vertical surface orthogonal to the bottom surface, and the bottom surface is electrically connected to the wiring layer. Also included is a wiring board for an electronic component inspection apparatus in which the pad is formed.
According to this, when the plurality of insulating layers forming the base substrate are made of ceramic, for example, a concave portion is formed on the side surface of the upper green sheet, or the vertical and horizontal dimensions of the upper green sheet are measured. By making at least one of these smaller than the green sheet on the lower layer side to be laminated, a base substrate having a stepped portion on the side surface can be easily manufactured. Further, when the plurality of insulating layers are made of a resin, for example, a base substrate having a stepped portion on the side surface can be easily manufactured by applying the same method to the resin film.
The bottom surface of the step portion is not limited to one flat bottom surface, and includes a plurality of bottom surfaces having different positions in the thickness direction and the planar direction of the base substrate, and pads for external connection may be formed for each bottom surface. good.

Furthermore, in the present invention, the mounting board has an electronic component between the periphery of the front and back surfaces of the mounting board, and has a flat side surface perpendicular to the front and back surfaces and along the thickness direction of the mounting board. A wiring board for an inspection apparatus (Claim 3) is also included.
According to this, the surface of a plurality of insulating layers made of ceramic or resin is polished to be a flat surface, masking can be easily performed except for a required position on the surface, and plating on the flat side surface is inadvertent Even if it adheres, it can be easily removed by polishing or the like. Therefore, it is possible to manufacture and provide a mounting substrate having a testing pad formed on the surface with high accuracy at a low cost by a simple process and a small number of steps.

Further, the present invention includes an electronic component inspection device wiring substrate (Claim 4) in which the inspection pad formed on the surface of the mounting substrate includes a metal thin film layer adjacent to the surface.
According to this, since, for example, a Ti thin film layer and a Cu thin film layer are formed at a required level on the surface of the mounting substrate polished flat, a Cu plating layer formed on the Cu thin film layer In addition, it is possible to arrange the inspection pads made of the Ni plating layer and the Au plating layer covering the top surface or the peripheral surface with high accuracy in position, shape, and dimensions.

Further, according to the present invention, the wiring layer formed for each of the base substrate and the mounting substrate includes a signal layer, a power supply layer, and a ground layer, respectively. Is also included.
According to this, a required current can be supplied through the power supply layer for each base board and mounting board, and a current for inspection can be transmitted by the signal layer for each base board and mounting board, and for each base board and mounting board. With this grounding layer, it is possible to easily ground at an arbitrary position. Therefore, it is ensured that the electronic component to be inspected is accurately and efficiently inspected.
In the case where a plurality of wiring layers are formed for each of the base substrate and the mounting substrate, each wiring layer includes a signal layer, a power supply layer, and a ground layer. , A configuration in which only one of the power supply layer and the ground layer is included.

In addition, according to the present invention, the plurality of insulating layers forming the base substrate and the mounting substrate are made of the same kind or different kinds of ceramics, or the same kind or different kinds of resins. 6) is also included.
According to this, a plurality of insulating layers constituting the base substrate are formed of the same kind or different kinds of ceramics, or the same kind or different kinds of resins, or a plurality of insulating layers constituting the mounting board are formed of the same kind or different kinds of ceramics, Or it can form with the same kind or different kind of resin. Accordingly, it is possible to freely utilize an optimal and inexpensive material ceramic or resin according to the specifications of the base substrate and the mounting substrate.
The ceramic includes a high-temperature fired ceramic such as alumina, and a low-temperature fired ceramic containing about 50 wt% of a glass component. In the case of the high-temperature fired ceramic, the conductors such as the wiring layers and pads for external connection are provided with W. Or Mo is used. In the case of a low-temperature fired ceramic, Ag, Cu, or the like is used.
The ceramic may be made of any of machinable ceramic, AlN, or mullite, and the machinable ceramic is a mixture of SiO ₂ and Al ₂ O ₃ , or a mixture of AlN and BN. The thermal expansion coefficient is approximately similar to that of a Si wafer having a thermal expansion coefficient of about 3.0 × 10 ⁻⁶ / ° C.
In addition to the epoxy resin, heat-resistant polyimide that can withstand heat during probing for attaching a probe to the inspection pad is used as the resin.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a perspective view showing a mounting board 2 and a base board 20 constituting a wiring board (hereinafter simply referred to as a wiring board) 1 for an electronic component inspection apparatus according to the present invention, and FIG. 2 is a vertical view showing the wiring board 1. It is sectional drawing.
As shown in FIGS. 1 and 2, the wiring board 1 is mounted on the base board 20 and above the front surface 21 of the base board 20, and the front surface 21 and the back surface 4 are electrically connected. And a substrate 2.
The base substrate 20 includes a plurality of ceramic layers (insulating layers) s6 to s9, and is formed for each of a front surface 21 and a rear surface 22 that are substantially square in plan view, a side surface 23 positioned between these four sides (periphery), and the side surfaces 23. 4 elongated stepped portions 24 are formed. The step portion 24 includes a bottom surface 26 parallel to the front surface 21 and the back surface 22, a vertical surface 25 orthogonal to the bottom surface 26, and a pair of end walls 27 located at both ends thereof.

As shown in FIG. 2, wiring layers 32, 34, and 36 are formed between the ceramic layers s6 to s9, and these include all of the signal layer, the power supply layer, and the ground layer. The lowermost wiring layer 36 is also connected to a pad 28 for external connection, a part of which extends to the bottom surface 26 of each step portion 24. A plurality of pads (LGA pads) 30 are formed on the surface 21 of the base substrate 20 in a lattice pattern. The pad 30 and the wiring layers 32, 34, and 36 can be electrically connected to each other through a via conductor v penetrating the ceramic layers s6 to s8.
The ceramic layers s6 to s9 are made of, for example, a high-temperature fired ceramic mainly composed of alumina, AlN, or the like, or a low-temperature fired ceramic containing about 50 wt% of a glass component. For the conductors 32, 34, and 36 and the via conductor v, W or Mo is used. In the latter case, Ag or Cu is used.

As shown in FIGS. 1 and 2, the mounting substrate 2 is composed of a plurality of ceramic layers (insulating layers) s1 to s5, and is located between a front surface 3 and a rear surface 4 that are substantially square in plan view, and between these four sides (periphery). And a plurality of test pads 6 formed in a lattice pattern on the front surface 3 and a plurality of pads (LGA pads) 7 formed in the same manner on the back surface 4.
Each side surface 5 is a flat surface orthogonal to the front surface 3 and the back surface 4 and along the thickness direction of the mounting substrate 2. Between the ceramic layers s1 to s5, a wiring layer 14 as a power supply layer, a pair of wiring layers 16 and 18 as a ground layer, and a wiring layer 17 as a signal layer sandwiched therebetween are formed. The wiring layers 14, 16 to 18, the inspection pad 6, and the pad 7 can be connected to each other through via conductors v that penetrate the ceramic layers s 1 to s 5 including the through holes th.
The ceramic layers s1 to s5 are also made of the same high-temperature fired ceramic or low-temperature fired ceramic, and the conductors of the wiring layers 14 and 16 to 18 and the pad 7 are also made W, Mo, or , Ag or Cu is used.

As schematically shown in the partial enlarged view in the frame of the alternate long and short dash line in FIG. 2, the inspection pad 6 is adjacent to the surface 3 of the mounting substrate 2 so that the whole has a substantially cylindrical shape. A thin film layer 8, a Cu thin film layer 9, and a Cu plating layer 10 are sequentially laminated, and an Au plating layer 12 is formed on the peripheral surface and the top surface with a Ni plating layer 11 interposed therebetween.
As shown in FIG. 2, a solder ball described later is heated and solidified between each pad 30 formed on the front surface 21 of the base substrate 20 and each pad 7 formed on the back surface 4 of the mounting substrate 2. Solder h is formed, and the mounting substrate 2 is mounted above the surface 21 of the base substrate 20 through the solder h. Thereby, the wiring board 1 of this invention is comprised. At the same time, the wiring layers 14 and 16 to 18 of the mounting substrate 2, the via conductor v and the inspection pad 6, and the wiring layers 32, 34 and 36 of the base substrate 20, via the pads 7 and 30 and the solder h. The via conductor v and the external connection pad 28 can be electrically connected to each other.

FIG. 3 is a schematic vertical sectional view showing a usage state of the wiring board 1 of the present invention.
As shown in FIG. 3, the wiring board 1 is placed on a surface 41 of a printed circuit board (motherboard) 40, a plurality of electrode pads 42 arranged on the surface 41 in a substantially rectangular frame shape in plan view, and a base substrate The plurality of external connection pads 28 located on the bottom surface 26 of each of the 20 step portions 24 are electrically connected by individually bonding wires w.
The wiring board 1 is positioned by, for example, standing a plurality of pins (not shown) on the surface 41 of the printed board 40 and inserting the pins into pin insertion holes (not shown) provided on the pace board 20. Is done.
As shown in FIG. 3, a plurality of probes p are individually attached to the top surfaces of the plurality of inspection pads 6 formed on the surface 3 of the mounting substrate 2. Such a probe p is individually contacted with an electrode pad 46 for each electronic component such as a large number of semiconductor elements formed on a Si wafer 44 that moves relative to the wiring substrate 1. It is used to inspect the electrical characteristics of. The wiring board 1 to which the probe p is attached serves as a probe card.

That is, as shown in FIG. 3, for example, the current supplied from the printed circuit board 40 to the power supply layer in the wiring layer 36 in the base substrate 20 through the pad 42, the bonding wire w, and the external connection pad 28. Is transmitted to the mounting substrate 2 via the pad 30, the solder h, and the pad 7 after passing through the via conductor v, the signal layer and the ground layer in the wiring layer 34 and the wiring layer 32. Such current flows from the probe p to Si via the via conductor v in the mounting substrate 2, the wiring layers 18 and 16 of the ground layer, the wiring layer 17 of the signal layer, the wiring layer 14 of the power supply layer, and the inspection pad 6. It is transmitted to each electrode pad 46 of the wafer 44, and an electrical function for each electronic component is executed to develop its electrical characteristics.
Then, the obtained signal current having the electrical characteristics is transmitted to the printed circuit board 40 through the reverse path. As a result, it is possible to accurately and quickly detect the electrical characteristics of each of a large number of electronic components formed on the Si wafer 44.

The wiring substrate 1 was manufactured by manufacturing the mounting substrate 2 and the base substrate 20 in parallel and connecting the substrates 2 and 20 with the solder h as follows.
First, a method for manufacturing the mounting substrate 2 will be described with reference to FIGS.
A ceramic slurry is prepared by mixing and mixing required amounts of alumina powder, required organic binder, and solvent in advance, and this is formed into a plurality of green sheets s1 to s5 that have a sheet shape by the doctor blade method. did.
Next, punching was performed for each predetermined position in the green sheets s1 to s5, and a through hole vh was formed as shown on the left side of FIG. Next, each through hole vh was filled with a conductive paste containing W powder or Mo powder to form an unfired via conductor v as shown in the vicinity of the center and on the right side of FIG.

Furthermore, the same conductive paste as described above is screen-printed on the front surface of the green sheets s2 to s5 and the back surface of the green sheet s5, and as shown in the vicinity of the center and on the right side of FIG. Wiring layers 14 and 16 to 18 and a pad 7 were formed. These are connected to any one of the via conductors v.
And after laminating | stacking and crimping | bonding the above green sheets s1-s5 along the thickness direction, it baked in the predetermined | prescribed temperature range.
As a result, as shown in FIG. 5, the wiring layers 14, 16 to 18, the via conductors v, and the pads 7 including the ceramic layers s 1 to s 5, the front surface 3, the back surface 4, and the side surface 5 The mounting substrate 2 that is provided and has no inspection pad 6 was formed.

Next, after the surface 3 of the mounting substrate 2 is polished to a flat surface, a Ti thin film layer (metal thin film layer) is formed on the surface 3 where the end face of the via conductor v is exposed, as shown on the left side of FIG. 8 and a Cu thin film layer (metal thin film layer) 9 were sequentially formed by sputtering. At this time, since the side surface 5 is a flat vertical surface, it was possible to easily prevent a part of the masking material from turning around during sputtering.
Next, after forming a resist layer r made of a photosensitive resin on the Cu thin film layer 9, by applying a photolithography technique to the resist layer r, as shown in the center of FIG. A cylindrical through-hole 13 was formed above the. At this time, since the side surface 5 is a flat vertical surface, it is easy to avoid a situation in which a part of the resist material wraps around.

Next, as shown on the right side of FIG. 6, a Cu plating layer 10 was formed on the Cu thin film layer 9 exposed on the bottom surface of each through hole 13 by electrolytic Cu plating. At this time, since the side surface 5 is a flat vertical surface, inadvertent adhesion of a part of the Cu plating can be easily prevented.
In this state, as shown on the left side of FIG. 7, the resist layer r was dissolved and removed with a developer.
Next, as shown in the center of FIG. 7, the Ni plating layer 11 was formed on the peripheral surfaces of the Ti thin film layer 8, the Cu thin film layer 9, and the Cu plating layer 10 and the top surface of the Cu plating layer 10. Further, as shown on the right side of FIG. 7, an Au plating layer 12 was formed on the entire surface of the Ni plating layer 11. As a result, the mounting substrate 2 shown in FIGS. 1 to 3 was manufactured by forming the plurality of test pads 6 on the surface 3 with high accuracy.
The mounting substrate 2 may be manufactured by a multi-cavity method.

On the other hand, the base substrate 20 was manufactured by the steps shown in FIGS.
Similarly to the above, green sheets s6 to s9 having a square plan view were manufactured in advance.
Next, the positions excluding the vicinity of both ends of each of the four sides (periphery) of the green sheets s6 to s8 were cut out into a long and narrow rectangle in plan view, and a recess k was formed on each of the four sides as shown in FIG. Further, predetermined positions in the green sheets s6 to s8 were punched out, and through holes vh were formed as shown on the left side of FIG. Next, each through hole vh was filled with a conductive paste containing W powder or Mo powder to form an unfired via conductor v as shown in the vicinity of the center and on the right side of FIG.

Furthermore, the same conductive paste as described above is screen-printed on the surfaces of the green sheets s6 to s9, and as shown in the vicinity of the center and on the right side of FIG. , 34.36 were formed. These are connected to any one of the via conductors v.
Next, the green sheets s6 to s9 as described above were laminated and pressure-bonded along the thickness direction so that the concave portions k were continuous. As a result, as shown in FIG. 9, it has a front surface 21, a back surface 22, a side surface 23, and a step 24 on four sides, a pad 30, wiring layers 32, 34, 36, a via conductor v, and a pad for external connection. An unfired base substrate 20 with 28 was obtained. The base substrate 20 shown in FIGS. 1 to 3 was obtained by firing the base substrate 20 in a predetermined temperature range.
The base substrate 20 may be manufactured by a multi-cavity method.

  Further, as shown in FIG. 10, a solder ball hb is set on each pad 30 formed on the front surface 21 of the base substrate 20, and formed on the back surface 4 of the mounting substrate 2 on each solder ball hb. After placing each pad 7, it was heated to a temperature near the melting point of each solder ball hb. As a result, the solder ball hb whose surface layer is melted and solidified connects the pads 7 and 30, whereby the mounting substrate 2 is mounted above the surface 21 of the base substrate 20, and the wiring substrate shown in FIGS. 1 was obtained.

  According to the wiring board 1 as described above, the wiring layers 14, 16 to 16 are formed of a plurality of ceramic layers s 1 to s 5, have a front surface 3, a back surface 4, and side surfaces 5 and are formed between the ceramic layers s 1 to s 5. In the mounting substrate 2 having 18, the surface 3 can be easily masked, and inadvertent plating and masking that can adhere to the side surface 5 can be easily removed. For this reason, the mounting substrate 2 is formed with the inspection pads 6 formed on the surface 3 with high accuracy. In addition, the bonding wire w for connecting to the printed circuit board 40 can be easily connected by the external connection pad 28 located on the bottom surface 26 of the step portion 24 provided on the side surface 23 of the base substrate 20.

Accordingly, it is possible to provide the wiring board 1 which can be electrically connected to the printed board 40 via the bonding wire w, and can be manufactured easily at a relatively low cost, particularly in the thin film forming process.
Furthermore, since the mounting substrate 2 and the base substrate 20 are divided, both the substrates 2 and 20 can be manufactured in parallel or at the same time. For this reason, the mounting substrate 2 in which the inspection pads 6 are formed at the required positions on the surface 3 can be quickly provided in response to the shortening of the development period of electronic components such as semiconductor elements. On the other hand, according to the printed circuit board 40 to be mounted, the base substrate 20 can maintain the layout and specifications, or change them in a timely manner. Therefore, it is easy to shorten the production delivery time compared to the conventional integrated wiring board, and it is possible to flexibly cope with various delivery dates.

FIG. 11 is a perspective view showing a mounting board 2 and a base board 50 constituting a wiring board 1a of a different form, and FIG. 12 is a vertical sectional view showing the wiring board 1a.
The wiring substrate 1a includes a base substrate 50 and the same mounting substrate 2 that is mounted above the front surface 51 of the base substrate 50 and electrically connected between the front surface 51 and the back surface 4. Yes.
As shown in FIGS. 11 and 12, the base substrate 50 is composed of the same ceramic layers (insulating layers) s6 to s9 as described above, and has a front surface 51 and a back surface 52 that are substantially square in plan view, and between these four sides (periphery). It has the side surface 53 located, and the four elongate step part 54 formed for every side surface 53. As shown in FIG. The step portion 54 includes a bottom surface 56 parallel to the front surface 51 and the back surface 52 and along the entire length of each side surface 53, and a vertical surface 55 orthogonal to the bottom surface 56.

As shown in FIG. 12, wiring layers 32, 34, and 36 including all of the signal layer, the power supply layer, and the ground layer are formed between the ceramic layers s6 to s9. A part of the lowermost wiring layer 36 is connected to an external connection pad 58 extending to the bottom surface 56 of each step 54. Further, the same 30 as described above is formed in a lattice shape on the surface 51 of the base substrate 50. The pad 30 and the wiring layers 32, 34, and 36 can be electrically connected to each other through a via conductor v that penetrates the ceramic layers s6 to s8.
As shown in FIG. 12, the solder balls hb are heated and solidified between each pad 30 formed on the front surface 51 of the base substrate 50 and each pad 7 formed on the back surface 4 of the mounting substrate 2. Solder h is formed, and the mounting substrate 2 is mounted above the surface 51 of the base substrate 50 through the solder h, whereby the wiring substrate 1a is configured.

At the same time, the wiring layers 14 and 16 to 18 of the mounting substrate 2, the via conductor v and the inspection pad 6, and the wiring layers 32, 34 and 36 of the base substrate 50, via the pads 7 and 30 and the solder h. The via conductor v and the external connection pad 58 can be electrically connected to each other.
The wiring board 1a as described above is manufactured by the same method as described above, and can exhibit the same effects as the wiring board 1 and can exhibit the same effects.

The present invention is not limited to the embodiments described above.
For example, the insulating layer may be made of various epoxy resins or heat resistant resins such as polyimide.
Further, the wiring layer of the base substrate may have a dedicated layout for any one of the signal layer, the power supply layer, and the ground layer, similarly to the wiring layer in the mounting substrate. On the other hand, each wiring layer in the mounting substrate may include all of the signal layer, the power supply layer, and the ground layer.
Further, the step portion may be formed on one side of the four sides of the base substrate, two sides facing or adjacent to each other, or three sides. Of these, two or more stepped portions having a pair of end walls at both ends of the bottom surface and the vertical surface may be formed on the same side surface of the base substrate.
The bottom surface of each step portion may be two or more steps inside and outside along the thickness direction and the planar direction of the base substrate, and the external connection pad may be formed for each bottom surface.
In addition, the inspection pads formed on the surface of the mounting substrate are not limited to the lattice-like arrangement on the surface, and are arranged at arbitrary positions facing the positions of the plurality of electrode pads in the electronic component to be inspected. May be.

The perspective view which shows the mounting board | substrate and base board which comprise the wiring board of 1 form of this invention. The vertical sectional view which shows the said wiring board after mounting, and its partial enlarged view. The typical vertical sectional view which shows the use condition of the said wiring board. Schematic which shows the manufacturing process of the said mounting board | substrate. Schematic which shows the manufacturing process of the mounting board following FIG. Schematic which shows the manufacturing process of the mounting substrate following FIG. Schematic which shows the manufacturing process of the mounting board following FIG. Schematic which shows the manufacturing process of the said base substrate. Schematic which shows the manufacturing process of the base substrate following FIG. Schematic which shows the manufacturing process of the said wiring board. The perspective view which shows the mounting board | substrate and base board which comprise the wiring board of a different form. FIG. 4 is a vertical sectional view showing the wiring board after mounting.

Explanation of symbols

1,1a ……………………………… Wiring board (wiring board for electronic component inspection equipment)
2 ………………………………………… Mounting board 3, 21, 51 ……………………… Front side 4, 22, 52 ……………………… Back side 5, 23, 53 ……………………… Side 6 ……………………………………… Inspection pad 8 ………………………………………… Ti thin film Layer (metal thin film layer)
9 ……………………………………… Cu thin film layer (metal thin film layer)
14,16-18,32,34,36 ... wiring layers 24,54 .................................... Steps 25,55 ...................................................... Vertical surfaces 26,56 ... ………………………… Bottom 28, 58 …………………………… Pads for external connection s1 to s9 …………………………… Ceramic layer (insulating layer)

Claims (6)

Consists of a plurality of insulating layers, having a front surface, a back surface, and a side surface located between these, a wiring layer formed between the insulating layers, and a pad for external connection formed on the side surface and formed on the bottom surface A base substrate having a stepped portion;
Mounted above the front surface of the base substrate, comprising a plurality of insulating layers, having a front surface and a back surface on which an inspection pad is formed, and a wiring layer formed between the plurality of insulating layers, the back surface and the base substrate A mounting substrate electrically connected to the surface of
A wiring board for an electronic component inspection apparatus. The step portion of the base substrate includes a bottom surface parallel to the front surface and the back surface of the base substrate, and a vertical surface orthogonal to the bottom surface, and the pad for external connection that is electrically connected to the wiring layer is formed on the bottom surface. ing,
The wiring board for an electronic component inspection apparatus according to claim 1. The mounting substrate has a side surface that is perpendicular to the front and back surfaces, and is flat along the thickness direction of the mounting substrate, between the front and back surfaces of the mounting substrate.
The wiring board for an electronic component inspection apparatus according to claim 1 or 2. The inspection pad formed on the surface of the mounting substrate includes a metal thin film layer adjacent to the surface.
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 3. The wiring layer formed for each of the base substrate and the mounting substrate includes a signal layer, a power supply layer, and a ground layer,
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 4, wherein: The plurality of insulating layers forming the base substrate and the mounting substrate are made of the same kind or different kind of ceramic, or the same kind or different kind of resin.
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 5.

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