KR101313020B1 - Compositions of silicone-based bonding sheet and silicone-based bonding sheet - Google Patents

Abstract

PURPOSE: A silicon-based bonding sheet resin composition is provided to improve the production efficiency when an ACF bonding process is conducted, and to provide a silicon-based bonding sheet with excellent hardness, durability, and thermal conductivity. CONSTITUTION: A silicon-based bonding sheet resin composition comprises 100.0 parts by weight of organopolysiloxane, 10-500 parts by weight of zinc, 0.1-30 parts by weight of ferric oxide, 1-100.0 parts by weight of heptanes, and 0.1-50 parts by weight of a lamp black. A manufacturing method of a silicon-based bonding sheet comprises a step of manufacturing a liquid silicon resin by mixing and stirring the silicon-based bonding sheet resin composition; a step of degassing the liquid silicon resin; and a step of thermosetting the degassed liquid silicon resin two times.

Description

Silicone Bonding Sheets Resin Compositions and Silicone Bonding Sheets {Compositions of silicone-based bonding sheet and silicone-based bonding sheet}

The present invention relates to a silicone-based bonding sheet resin composition and a silicone-based bonding sheet manufactured using the same, and more particularly, to a silicon-based bonding sheet and a carbon-based bonding sheet having a specific carbon black, which greatly improves durability (repeated compression characteristics) in an ACF bonding process. It is related with the silicone type bonding sheet resin composition used for manufacture.

Recently, the use of plasma display panels (PDPs) or liquid crystal displays (LCDs) is rapidly increasing in the field of computer monitors or TVs. In order to manufacture such a PDP or LCD, a pattern electrode terminal portion in which an electrode (address electrode and a power electrode) pattern is formed on a lower glass substrate, and a plurality of upper pattern electrodes for connecting to an external power source for controlling these electrodes are formed. Tape Carrier package (TCP) integrated circuit (IC) terminals or Flexible Tape (Chip On Film) CO terminals must be bonded.

One of the conventionally widely used methods of bonding the plurality of lower pattern electrodes of the PDP or LCD with the plurality of upper pattern electrodes is an anisotropic conductive film (ACF) between the plurality of lower pattern electrodes and the plurality of upper pattern electrodes. ), And the thermocompression bonding method of aligning the plurality of lower pattern electrodes and the plurality of upper pattern electrodes and applying heat using a heater to compress them, is widely used.

As described above, the thermocompression bonding method using the ACF uses a method of pressurizing the contact surface by heating means and thermally fusion because the thermosetting resin has to be given a constant temperature, pressure, and time due to the characteristics of the thermosetting resin. That is, after preparing a substrate, prebonding the ACF to the substrate by pressing means, peeling off the protective film from the ACF, leaving the sample to be connected thereto, and pressing again by pressing means to press the main portion by heat fusion. Bonding is common.

Conventionally, in the pre-bonding and main bonding as described above, in order to prevent damage to the substrate and the sample by the pressing means, and to prevent the adhesion of the ACF and the pressing means, a Teflon sheet having a thickness of 50 to 200 μm is used, or conductive filler is contained. The bonded silicon sheet was attached to the surface of the pressing means, and then prebonding and main bonding were performed. However, the Teflon sheet is a plastic of high hardness, has no shock absorbing function, and if the thickness is not uniform, poor crimping occurs, high thermal conductivity is required, and high heat must be applied. Difficult to re-compress, there are a number of problems, such as the need to change the roll frequently during the process. In addition, when prebonding and main bonding are performed by the press means with the silicon sheet containing the conductive filler, carbon particles added to the conductive sheet as conductive fillers are buried to the outside or the volume resistance of the sheet is kept constant. It is not possible to perform a complete insulation, which makes it difficult to uniformize the overall temperature of the pressurizing means, which reduces workability, increases the connection failure rate, and at the same time cannot optimize the connection conditions. There were various problems such as deterioration in quality.

The present invention has been made to solve the above-described problem, the present invention is to provide a silicone-based bonding sheet and a silicone-based bonding sheet resin composition that can be used for the production of a silicone-based bonding sheet markedly improved in the ACF bonding process durability (the number of repeated pressing) do.

The present invention for solving the above problems relates to a silicone-based bonding sheet resin composition, and includes organopolysiloxane, heptane, zinc, iron oxide and lamp black.

According to a preferred embodiment of the present invention, with respect to 100 parts by weight of the organopolysiloxane, it may include 10 to 500 parts by weight of zinc, 0.1 to 100 parts by weight of iron oxide, 1 to 30 parts by weight of heptane and 0.1 to 50 parts by weight of lamp black. have.

According to another preferred embodiment of the present invention, the organopolysiloxane may have a weight average molecular weight of 100 to 300, and a viscosity of 5 to 50 Pa · s.

According to another preferred embodiment of the present invention, the lamp black may be used with a packed density of 200 ~ 300 g / ℓ and DBP Absorption 100 ~ 190 mL / 100g.

According to another preferred embodiment of the present invention, it may further include an additive containing at least one selected from a curing agent, an adhesion improving agent, a hydrosilylation reaction catalyst, an antifoaming agent and a leveling agent.

According to another preferred embodiment of the present invention, the curing agent may use a platinum catalyst and / or an organic peroxide.

In addition, the present invention provides a silicon-based bonding sheet comprising a silicon-based sheet layer cured by the silicone-based bonding sheet resin composition.

According to a preferred embodiment of the present invention, the silicon-based sheet layer may have an average thickness of 50 ~ 500 ㎛.

According to another preferred embodiment of the present invention, the silicon-based sheet layer has a hardness of 50 ~ 75 shore A as measured by the ASTM D 395 method, the thermal conductivity may be 0.5 ~ 1.1 W / mk measured by the ASTM D 5470 method.

Furthermore, the present invention comprises the steps of mixing and stirring the silicone-based bonding sheet resin composition to prepare a liquid silicone resin; Defoaming the liquid silicone resin; And thermally curing the degassed liquid silicone resin twice. It provides a method of manufacturing a silicon-based bonding sheet comprising a.

According to one preferred embodiment of the present invention, the step of thermal curing comprises the steps of preparing a primary thermosetting silicon-based sheet to be carried out by performing a thermal curing at 140 ~ 160 ℃; And performing secondary thermal curing on the primary thermally cured silicone sheet at 180 to 220 ° C .; . ≪ / RTI >

In addition, the present invention is laminated to the silicon-based bonding sheet on the upper surface of the Anisotropic Conductive Film (ACF), and then anisotropic conductive film (ACF) that can be heat-compression-bonded in the direction of the anisotropic conductive film from the silicon-based bonding sheet (ACF) Provides a method of pressing.

According to a preferred embodiment of the present invention, the anisotropic conductive film crimping method may further include a printed circuit board (PCB) on the lower surface of the anisotropic conductive film.

According to another preferred embodiment of the present invention, in the anisotropic conductive film crimping method, a tape automated bonding intergrated circuit (TAB IC) may be interposed between the anisotropic conductive film and the silicon-based bonding sheet.

According to another preferred embodiment of the present invention, the anisotropic conductive film crimping method is a silicon-based bonding sheet; A TAB IC stacked on a bottom surface of the silicon bonding sheet; An anisotropic conductive film laminated on the lower surface of the TAB IC; PCB laminated on the lower surface of the anisotropic conductive film may be used.

The silicone-based bonding sheet resin composition of the present invention is surprisingly improved in durability (number of times of repeated pressing) including the lamp black, reducing the occurrence of product defects due to the thickness non-uniformity caused by repeated pressing of the silicone adhesive layer to reduce the production efficiency during the ACF bonding process It can increase.

Figure 1 is an embodiment of the present invention, a schematic view of a single-layer silicon-based bonding sheet formed of a silicon-based sheet layer 100 prepared in Example 1 and a protective film formed on both sides thereof.
2 is a state diagram used in the silicon-based bonding sheet of the present invention.

Hereinafter, the present invention will be described in more detail.

As described above, the bonding sheet including the conventional polyimide layer and the silicon adhesive layer has a problem that the silicon adhesive layer melts during the bonding process (high temperature / high pressure), and product defects are caused due to thickness unevenness due to repeated pressing of the silicon adhesive layer. There are disadvantages that can be caused.

Accordingly, in the present invention, a solution of the silicon-based bonding sheet resin composition including organopolysiloxane, heptane, zinc, iron oxide, and lamp black was sought to solve the above problems. This can provide a composition of the silicone adhesive layer with a surprisingly improved durability (number of repeated pressing) due to repeated pressing, significantly reducing the occurrence of product defects due to the thickness non-uniformity caused by the repeated pressing of the silicone adhesive layer to significantly improve productivity. have.

The silicon-based bonding sheet resin composition of the present invention does not specifically limit the mixing ratio as long as it includes organopolysiloxane, heptane, zinc, iron oxide, and lamp black, but preferably 10 to 500 parts by weight of zinc based on 100 parts by weight of organopolysiloxane. Iron oxide may include 0.1 to 30 parts by weight, heptane 1 to 100 parts by weight, and lamp black including 0.1 to 50 parts by weight, but is not limited thereto.

Lamp black of the silicone-based bonding sheet resin composition of the present invention serves to improve the heat resistance of the silicone-based bonding sheet resin as a filler, and is not particularly limited as long as it is a lamp black commonly used and sold in the art, preferably filled density (Tamped density) 200 to 300 g / ℓ and DBP Absorption 100 to 190 ml / 100g may be used, but is not limited thereto. In addition, the amount of the lamp black used may be 0.1 to 50 parts by weight, preferably 5 to 30 parts by weight based on 100 parts by weight of the organopolysiloxane. If the lamp black is used in an amount less than 0.1 part by weight based on 100 parts by weight of the organopolysiloxane, there is no effect of increasing the heat resistance of the silicone resin, and when used in excess of 50 parts by weight, the mechanical properties (tensile strength and tensile elongation) of the silicone resin are rather increased. Etc.) may fall.

In addition, the organopolysiloxane of the silicone-based bonding sheet resin composition of the present invention may have a weight average molecular weight of 100 to 300, and a viscosity of 5 to 50 Pa · s, but is not limited thereto.

Furthermore, zinc in the silicon-based bonding sheet resin composition of the present invention plays a role of transferring heat in the ACF bonding process and improves workability, and is not particularly limited as long as zinc is commonly used and sold in the art.

The amount of the zinc used may be 50 to 500 parts by weight, preferably 100 to 400 parts by weight, based on 100 parts by weight of the organopolysiloxane, and if the amount of zinc is less than 50 parts by weight, the thermal conductivity may not be increased. If it exceeds 500 parts by weight, it is uneconomical, rather it may be lowered in the physical properties of the silicone resin is preferably used within the above range.

Iron oxide in the silicone-based bonding sheet resin composition of the present invention serves to increase the heat resistance of the silicone-based resin, the amount of use may be 0.1 to 30 parts by weight, preferably 0.5 to 10 parts by weight based on 100 parts by weight of the organopolysiloxane It is not limited to this. If the amount of iron oxide used is less than 0.1 part by weight, the heat resistance of the silicone resin may not be increased, and even if it is used in excess of 20 parts by weight, the heat resistance effect of the resin does not increase any more.

In addition, heptane, which is one of the silicone-based bonding sheet resin compositions of the present invention, serves to lower the viscosity by dissolving the silicone-based resin, the amount of which is used in an amount of 1 to 100 parts by weight, preferably 5 to 50, based on 100 parts by weight of the organopolysiloxane. Part by weight may be used, but is not limited thereto. If the amount of heptane is less than 1 part by weight, there may be a problem in lowering the viscosity of the silicone-based resin, and if it is used in excess of 100 parts by weight, there may be a problem in making a cheap silicon-based bonding sheet. .

Furthermore, the silicone-based bonding sheet resin composition of the present invention may further include an appropriate amount of additives within a range that does not significantly reduce the physical properties such as hardness, durability, and thermal conductivity of the sheet prepared therefrom, and the additive may include a curing agent, an adhesive improving agent, It may include at least one selected from a hydrosilylation reaction catalyst, an antifoaming agent, and a leveling agent.

According to an embodiment of the present invention, the curing agent of the additive may include a platinum catalyst and / or an organic peroxide.

In the additive, the adhesion improving agent may more preferably use a silane compound as one or more selected from the compounds represented by the following Chemical Formulas 1 to 2.

[Formula 1]

(2)

The present invention also provides a silicon-based bonding sheet using the silicon-based bonding sheet resin composition, and provides a silicon-based bonding sheet including a silicon-based sheet layer obtained by curing the silicon-based bonding sheet resin composition.

Silicon-based bonding sheet of the present invention may be an average thickness of 50 ~ 500 ㎛, preferably an average thickness of 100 ~ 480 ㎛. If the average thickness is less than 50 μm, sufficient strength may not be obtained, and if the average thickness is more than 500 μm, inexpensive silicon-based bonding sheet may not be manufactured.

Furthermore, the silicon-based bonding sheet of the present invention may be formed as a single layer of the silicon-based sheet layer, and may further include a protective layer (or protective film) on one or both surfaces of the silicon-based sheet layer as shown in FIG. 1. When applying a silicon-based bonding sheet, it can be used by peeling off the protective layer.

The silicone sheet of the present invention may have a hardness of 50 to 75 shore A when measured by the ASTM D 395 method, and a thermal conductivity of 0.5 W / mk to 1.1 W / mk when measured by the ASTM D 5470 method.

Hereinafter, a method of manufacturing the silicon-based bonding sheet of the present invention will be described in detail.

Silicon-based bonding sheet of the present invention comprises the steps of mixing and stirring the silicon-based bonding sheet resin composition to prepare a liquid silicone-based resin; Defoaming the liquid silicone resin; And thermally curing the defoamed liquid silicone resin twice.

The components of the silicone-based bonding sheet resin composition and the composition ratio thereof are the same as described above.

The defoaming is to remove bubbles generated during the coating of the silicone resin, and is not particularly limited as long as it is a defoaming condition in the art. Preferably, the liquid silicone resin is performed for 20 to 60 minutes under a stirring speed of 2 to 20 rpm. can do.

In addition, the heat curing step is to heat the curing to increase the durability of the silicon-based bonding sheet, preferably, can be thermally cured two times by varying the temperature, but is not limited thereto.

According to one embodiment of the present invention, the step of thermal curing comprises the steps of preparing a primary thermosetting silicon-based sheet to be carried out by performing a thermal curing at 140 ~ 160 ℃; And performing secondary thermal curing on the primary thermally cured silicone sheet at 180 to 220 ° C .; . ≪ / RTI >

The step of preparing the first cured silicon-based sheet is carried out thermal curing for 1 minute to 20 minutes under 140 ~ 160 ℃, specifically 140 ~ 160 ℃, if the temperature is less than 140 ℃ silicone-based resin uncured There may be a problem that the sheet can not be obtained, and if the temperature exceeds 160 ℃ PET may be thermally decomposed to obtain a uniform silicon-based sheet may be the primary thermal curing within the temperature.

In addition, the step of manufacturing the secondary heat-cured silicon-based sheet is carried out thermosetting for 40 minutes to 90 minutes under 180 ~ 220 ℃, specifically 180 ~ 220 ℃, if the temperature is less than 180 ℃ silicon-based bonding There may be a problem that the durability of the sheet is lowered, if the temperature exceeds 220 ℃ may cause a problem that the degradation of the silicone-based resin occurs durability is good to perform the secondary thermal curing within the temperature.

Furthermore, the present invention provides a method of compressing an anisotropic conductive film (ACF) using a silicon-based bonding sheet.

Using the silicon-based bonding sheet of the present invention will be described briefly the state of use of crimping the ACF. In detail, as shown in FIG. 2, an anisotropic conductive film 240 is provided to be in contact with a printed circuit board 230 installed in the base 270, and the TAB IC 250 is an ACF 240. It is provided to be in contact with the top of the). Therefore, the PCB 230 and the TAB IC 250 are electrically connectable.

Thus, when the bonding of the PCB 230, ACF 240 and TAB IC 250 is completed in the state of the bonding bonding using the heating press 260 by interposing the silicon-based bonding sheet 220 between the PCB 230 and TAB The IC 250 can firmly maintain a state of being electrically connected through the ACF 240. The ACF 240 mixes conductive particles (metal particles, carbon, coated plastic particles coated with metal), adhesives (thermoplastic or thermosetting), and additives (dispersant) in the form of a thin film to form a conductive adhesive layer in the form of a thin film. It is formed, and is excellent in connection reliability, fine connectivity, low temperature connection, and is widely used for electrical connection of electronic components such as the PCB 230 and the TAB IC 250. In the above, the use state and position of the silicon-based bonding sheet 220 during the main compression using the heat presser 260 are shown, and the same silicon-based bonding sheet 220 is applied even when the PCB 230 and the ACF 240 are pressed. can do.

In the bonding process of the liquid crystal display device, the bonding bonding of the PCB 230 and the ACF 240 or the ACF 240 and the TAB IC 250 is performed through the heat presser 260 in the state of sandwiching the silicon-based bonding sheet 220. Therefore, the bonding efficiency can be relatively increased compared to the conventional one.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

[ Example ]

Example  One.

100 parts by weight of an organopolysiloxane (manufactured by Kaneko Chemical Co., Ltd.) having a weight average molecular weight of 150 and a viscosity of 20 Pa · s and 10 parts by weight of heptane were added to a 2 L stirring mixer, followed by stirring at 15 rpm for 5 minutes. Since then, 300 parts by weight of zinc (manufactured by SHENGXU, manufactured by SXZn-325), 3 parts by weight of iron oxide, and 260 g / L of tamed density and a lamp black having a DBP Absorption of 117 ml / 100g (manufacturer: Degussa, Brand name: Lamp Black 101) After adding 1 part by weight of the liquid silicone resin was stirred for 20 minutes at 30 rpm, the liquid silicone resin was defoamed in a stirring mixer for 30 minutes.

After coating the degassed liquid silicone resin on a PET film using a film applicator (GAP 3 ㎜, coating speed 1M / min), the liquid silicone resin was first cured for 5 minutes at 150 ℃, and the first cured silicone sheet was PET Peeled from the film. Next, the first cured silicone sheet peeled off was cured for 2 hours in an oven at 200 ° C. to prepare a silicon-based bonding sheet having a thickness of 250 μm.

Example  2.

100 parts by weight of organopolysiloxane (manufactured by Kaneko Chemical Co., Ltd.) having a weight average molecular weight of 150 and a viscosity of 20 Pa · s and 10 parts by weight of heptane were added to a 2 L stirring mixer, followed by stirring at 15 rpm for 5 minutes. Since then, 300 parts by weight of zinc (manufactured by SHENGXU Co., Ltd., SXZn-325), 3 parts by weight of iron oxide, and 260 g / L of packed density and a lamp black having a DBP Absorption of 117 ml / 100 g (manufacturer: Degussa, : Lamp Black 101) After adding 5 parts by weight of stirring at 30 rpm for 20 minutes to prepare a liquid silicone resin, the liquid silicone resin was degassed in a stirring mixer for 30 minutes.

After coating the degassed liquid silicone resin on a PET film using a film applicator (GAP 3 ㎜, coating speed 1M / min), the liquid silicone resin was first cured for 5 minutes at 150 ℃, and the first cured silicone sheet was PET Peeled from the film. Next, the first cured silicone sheet peeled off was cured for 2 hours in an oven at 200 ° C. to prepare a silicon-based bonding sheet having a thickness of 250 μm.

Example  3.

100 parts by weight of an organopolysiloxane (manufactured by Kaneko Chemical Co., Ltd.) having a weight average molecular weight of 150 and a viscosity of 20 Pa · s and 10 parts by weight of heptane were added to a 2 L stirring mixer, followed by stirring at 15 rpm for 5 minutes. Since then, 300 parts by weight of zinc (manufactured by SHENGXU, manufactured by SXZn-325), 3 parts by weight of iron oxide, and 260 g / L of tamed density and a lamp black having a DBP Absorption of 117 ml / 100g (manufacturer: Degussa, Product name: Lamp Black 101) After adding 10 parts by weight of the liquid silicone resin by stirring at 30 rpm for 20 minutes, the liquid silicone resin was defoamed in a stirring mixer for 30 minutes.

After coating the degassed liquid silicone resin on a PET film using a film applicator (GAP 3 ㎜, coating speed 1M / min), the liquid silicone resin was first cured for 5 minutes at 150 ℃, and the first cured silicone sheet was PET Peeled from the film. Next, the first cured silicone sheet peeled off was cured for 2 hours in an oven at 200 ° C. to prepare a silicon-based bonding sheet having a thickness of 250 μm.

Example  4.

100 parts by weight of an organopolysiloxane (manufactured by Kaneko Chemical Co., Ltd.) having a weight average molecular weight of 150 and a viscosity of 20 Pa · s and 10 parts by weight of heptane were added to a 2 L stirring mixer, followed by stirring at 15 rpm for 5 minutes. Since then, 300 parts by weight of zinc (manufactured by SHENGXU, manufactured by SXZn-325), 3 parts by weight of iron oxide, and 260 g / l of tampered density and a lamp black having a DBP Absorption of 117 ml / 100 g (manufacturer: Degussa, Product name: Lamp Black 101) After adding 20 parts by weight of a liquid silicone resin by stirring at 30 rpm for 20 minutes, the liquid silicone resin was defoamed in a stirring mixer for 30 minutes.

After coating the degassed liquid silicone resin on a PET film using a film applicator (GAP 3 ㎜, coating speed 1M / min), the liquid silicone resin was first cured for 5 minutes at 150 ℃, and the first cured silicone sheet was PET Peeled from the film. Next, the first cured silicone sheet peeled off was cured for 2 hours in an oven at 200 ° C. to prepare a silicon-based bonding sheet having a thickness of 250 μm.

Comparative Example  One.

To prepare a liquid silicone resin in the same manner as in Example 2, using 10 parts by weight of acetylene black (manufacturer: Denka, brand name: Denka black) instead of lamp black to prepare a liquid silicone resin, the same method as in Example 1 A silicon bonding sheet having a thickness of 250 μm was prepared.

Comparative Example  2.

In the same manner as in Example 3, a liquid silicone resin was prepared, but a liquid silicone resin was prepared by using 20 parts by weight of acetylene black (manufacturer: Denka, product name: Denka Black) instead of lamp black, and then in the same manner as in Example 1. A silicon bonding sheet having a thickness of 250 μm was prepared.

Comparative Example  3.

To prepare a liquid silicone resin in the same manner as in Example 2, using 10 parts by weight of furnace black (manufacturer: Degussa, product name: Printex 25) instead of lamp black to prepare a liquid silicone resin, Example 1 and In the same manner, a silicon-based bonding sheet having a thickness of 250 μm was manufactured.

Comparative Example  4.

In the same manner as in Example 3, a liquid silicone resin was prepared, but instead of lamp black, liquid silicone resin was prepared using 20 parts by weight of furnace black (manufacturer: Degussa, product name: Printex 25). In the same manner, a silicon-based bonding sheet having a thickness of 250 μm was manufactured.

Comparative Example  5.

A silicon sheet was manufactured in the same manner as in Example 1, except that 70 parts by weight of lamp black was used to prepare a silicon-based bonding sheet having a thickness of 250 μm.

Comparative Example  6.

A silicone sheet was prepared in the same manner as in Example 2, but after the degassed liquid silicone resin was coated on a PET film using a film applicator (GAP 3 mm, coating rate 1M / min), the liquid silicone system was heated at 150 ° C. for 1 hour. The resin was cured once, then peeled off from a PET film to prepare a silicon-based bonding sheet having a thickness of 250 μm.

Experimental Example

The hardness and durability of the silicon sheets prepared in Examples 1 to 4 and Comparative Examples 1 to 6 were measured, and the results are shown in Tables 1 to 2, and the measuring method is as follows.

(1) Hardness: Measured according to ASTM D 395 method.

(2) Durability: Using a press equipped with a pressing tool having a width of 2 mm and a length of 100 mm, the number of presses at which the silicon sheet was broken at the time of repetition was evaluated.

(3) Thermal conductivity: measured according to ASTM D 5470 method.

Classification (parts by weight) Example One 2 3 4 Organopolysiloxane 100 100 100 100 zinc 300 300 300 300 Iron oxide 3 3 3 3 Heptane 10 10 10 10 Carbon black Lamp black One 5 10 20 Acetylene black - - - - Furnace black - - - - Hardness (Shore A) 63 67 70 75 Durability (number of repeated presses) 65 100 140 150 Thermal conductivity (W / mK) 0.9 1.0 1.1 1.2

Classification (parts by weight) Comparative Example One 2 3 4 5 6 Organopolysiloxane 100 100 100 100 100 100 zinc 300 300 300 300 300 300 Iron oxide 3 3 3 3 3 3 Heptane 10 10 10 10 10 10 Carbon
black Lamp black - - - - 70 5 Acetylene black 10 20 - - - - Furnace black - - 10 20 - - Hardness (Shore A) 73 80 70 76 85 53 Durability (number of repeated presses) 55 90 45 80 130 10 Thermal conductivity (W / mK) 0.8 0.95 0.98 0.87 1.4 1.0

Looking at the experimental results of Table 1 and Table 2, in the case of the silicon-based bonding sheets (Examples 1 to 4) of the present invention, the hardness showed an appropriate hardness value of 50 ~ 75 shore A, but in the case of Comparative Example 2, too High hardness could be confirmed. When the hardness of the silicon-based bonding sheet is less than 50 shore A, there is a problem in that durability is remarkably reduced when repeated pressing, and when the hardness is more than 75 shore A, the anisotropic conductive film (ACF) and the substrate electrode when pressing the substrate electrode and electrode As the adhesion between the terminal parts is lowered, bubbles are generated between the substrate electrode and the electrode terminal parts, which may cause serious problems in product quality.

In addition, in the case of Examples 2 to 4, the number of repeated pressing times showed a high durability of 100 or more, but in the case of Comparative Examples 1 to 4, a low number of repeated pressing times of less than 100 was confirmed. In addition, in Comparative Example 6, which was thermally cured only once instead of twice, the thermal conductivity was excellent, but the durability and hardness were remarkably low, resulting in poor results.

Furthermore, in the case of Comparative Examples 1 to 4 using acetylene black or furnace black instead of lamp black, it was confirmed that the thermal conductivity is very low compared to Examples 2 to 4.

In addition, in Comparative Example 5 using too much lamp black, compared with Example 1, the thermal conductivity and durability is excellent, but the hardness is high, it does not sufficiently exhibit the adhesion between the substrate electrode and the electrode terminal portion of the ACF when crimping the ACF and substrate electrode. Poor quality can occur.

As can be seen through the above examples, comparative examples and experimental examples, the silicon-based bonding sheet of the present invention is suitable for use in various fields, in particular, it is very suitable to use an anisotropic conductive film (ACF) as a compression bonding sheet when pressing Suitable.

100: silicon sheet layer 110, 120: protective film
220: silicon bonding sheet 230: PCB
240: ACF 250: TAB IC
260: heating press 270: base

Claims (15)

delete A silicon-based bonding sheet resin composition comprising 10 to 500 parts by weight of zinc, 0.1 to 30 parts by weight of iron oxide, 1 to 100 parts by weight of heptane, and 0.1 to 50 parts by weight of lamp black, based on 100 parts by weight of organopolysiloxane. The silicone-based bonding sheet resin composition according to claim 2, wherein the organopolysiloxane has a weight average molecular weight of 100 to 300 and a viscosity of 5 to 50 Pa · s. The silicone-based bonding sheet resin composition according to claim 2, wherein the lamp black has a packed density of 200 to 300 g / l and a DBP Absorption of 100 to 190 ml / 100 g. The silicone bonding sheet resin composition of claim 2, further comprising an additive containing at least one selected from among a curing agent, an adhesion improving agent, a hydrosilylation reaction catalyst, an antifoaming agent, and a leveling agent. The silicone bonding sheet resin composition of claim 5, wherein the curing agent comprises at least one selected from a platinum catalyst and an organic peroxide. A silicone bonding sheet comprising a silicone sheet layer obtained by curing the silicone bonding sheet resin composition according to any one of claims 2 to 6. According to claim 7, wherein the silicon-based sheet layer has a hardness of 50 ~ 75 shore A as measured by ASTM D 395 method, the thermal conductivity of the silicon-based bonding sheet, characterized in that 0.5 ~ 1.1 W / mk measured by ASTM D 5470 method . The silicon-based bonding sheet according to claim 7, wherein the silicon-based sheet layer has an average thickness of 50 to 500 µm. Preparing a liquid silicone resin by mixing and stirring the silicone-based bonding sheet resin composition of any one of claims 2 to 6;
Defoaming the liquid silicone resin; And
Thermally curing the defoamed liquid silicone resin twice;
Method for producing a silicon-based bonding sheet comprising a. The method of claim 10, wherein the thermal curing step
Preparing a primary thermosetting silicon-based sheet which is performed by performing thermal curing at 140 to 160 ° C; And
Performing secondary thermal curing on the primary thermally cured silicone sheet at 180 to 220 ° C .;
Method for producing a silicon-based bonding sheet comprising a. After laminating the silicon-based bonding sheet of claim 7 on the upper surface of the anisotropic conductive film (ACF), the anisotropic conductive film (ACF) is compressed by heat-compression in the direction of the anisotropic conductive film from the silicon-based bonding sheet Way. The tape automated bonding intergrated circuit (TAB IC) is formed between the anisotropic conductive film and the silicon-based bonding sheet. A method of crimping an anisotropic conductive film (ACF), characterized in that is interposed. The method of claim 12, further comprising a printed circuit board (PCB) on a lower surface of the anisotropic conductive film. 15. The method of claim 14, wherein a TAB IC is interposed between the anisotropic conductive film and the silicon-based bonding sheet.

Images