KR101305166B1 - Compositions of silicone-based bonding sheet and silicone-based bonding sheet - Google Patents

Abstract

PURPOSE: A silicon-based bonding sheet is provided to have excellent processability when using a fused alumina, and to remarkably improve durability, thereby increasing production efficiency when bonding an anisotropically conductive film. CONSTITUTION: A silicon-based bonding sheet resin composition includes 100.0 parts by weight of an organopolysiloxane, 50-600 parts by weight of a fused alumina, 0.1-20 parts by weight of a ferric oxide, 0.1-50 parts by weight of a carbon black, and 1-100.0 parts by weight of a heptane. The organopolysiloxane has a weight average molecular weight of 100-300 and a viscosity of 15-25 Pa.s. The average granularity of the fused alumina is 1-50 micron. A silicon-based bonding sheet includes a silicon-based sheet layer (100) which is obtained by curing the silicon-based bonding sheet resin composition.

Description

Silicone Bonding Sheets Resin Compositions and Silicone Bonding Sheets {Compositions of silicone-based bonding sheet and silicone-based bonding sheet}

The present invention relates to a silicone-based bonding sheet resin composition and a silicone-based bonding sheet manufactured using the same, and more particularly, to introduce a specific alumina and to improve the durability (repeated compression characteristics) in an ACF bonding process, and to manufacture a silicone-based bonding sheet. It relates to a silicone-based bonding sheet resin composition to be used in.

Recently, the use of plasma display panels (PDPs) or liquid crystal displays (LCDs) is rapidly increasing in the field of computer monitors or TVs. In order to manufacture such a PDP or LCD, a pattern electrode terminal portion in which an electrode (address electrode and a power electrode) pattern is formed on a lower glass substrate, and a plurality of upper pattern electrodes for connecting to an external power source for controlling these electrodes are formed. Tape Carrier package (TCP) integrated circuit (IC) terminals or Flexible Tape (Chip On Film) CO terminals must be bonded.

One conventionally used method of bonding the plurality of lower pattern electrodes of the PDP or LCD with the plurality of upper pattern electrodes is an anisotropic conductive film (ACF) between the plurality of lower pattern electrodes and the plurality of upper pattern electrodes. ), And the thermocompression bonding method of aligning the plurality of lower pattern electrodes and the plurality of upper pattern electrodes and applying pressure and heat using a heater to compress them in advance, is widely used.

As described above, the thermocompression bonding method using the ACF uses a method of pressurizing the contact surface by heating means and thermally fusion because the thermosetting resin has to be given a constant temperature, pressure, and time due to the characteristics of the thermosetting resin. That is, after preparing a substrate, prebonding the ACF to the substrate by pressing means, peeling off the protective film from the ACF, leaving the sample to be connected thereto, and pressing again by pressing means to press the main portion by heat fusion. Bonding is common.

Conventionally, in the pre-bonding and main bonding as described above, in order to prevent damage to the substrate and the sample by the pressing means, and to prevent the adhesion of the ACF and the pressing means, a Teflon sheet having a thickness of 50 to 200 μm is used, or conductive filler is contained. The bonded silicon sheet was attached to the surface of the pressing means, and then prebonding and main bonding were performed. However, the Teflon sheet is a plastic of high hardness, has no shock absorbing function, and if the thickness is not uniform, poor crimping occurs, and thermal conductivity is low and high heat must be applied. Difficult to re-compress after, there were a number of problems, such as the need to replace the roll frequently during the process. In addition, when prebonding and main bonding are performed by the press means with the silicon sheet containing the conductive filler, carbon particles added to the conductive sheet as conductive fillers are buried to the outside or the volume resistance of the sheet is kept constant. It is not possible to perform a complete insulation, which makes it difficult to uniformize the overall temperature of the pressurizing means, which reduces workability, increases the connection failure rate, and at the same time cannot optimize the connection conditions. There were various problems such as deterioration in quality.

The present invention has been made to solve the above-described problem, an object of the present invention is to provide a silicone-based bonding sheet and a silicone-based bonding sheet resin composition that can be used for the production of a silicone-based bonding sheet markedly improved in the ACF bonding process durability (the number of repeated pressing) To provide.

The present invention for solving the above problems relates to a silicone-based bonding sheet resin composition, characterized in that it comprises an organopolysiloxane and fused alumina.

As a preferred embodiment of the present invention, the silicon-based bonding sheet resin composition of the present invention may be characterized in that it comprises organopolysiloxane, fused alumina, iron oxide, carbon black and heptane.

As another preferred embodiment of the present invention, the silicon-based bonding sheet resin composition of the present invention is based on 100 parts by weight of the organopolysiloxane, 50 to 600 parts by weight of molten alumina, 0.1 to 20 parts by weight of iron oxide, 0.1 to 50 parts by weight of carbon black And heptane may be characterized in that it comprises 1 to 100 parts by weight.

As another preferred embodiment of the present invention, in the present invention, the organopolysiloxane may have a weight average molecular weight of 100 to 300, and a viscosity of 15 to 25 Pa.s.

As another preferred embodiment of the present invention, in the present invention, the molten alumina may have an average particle size of 1 to 50㎛, and the molten alumina (Al ₂ O ₃ ) is characterized in that the purity of 99.5 ~ 99.99%. can do.

As another preferred embodiment of the present invention, in the present invention, the carbon black may be characterized in that it comprises at least one selected from lamp black, acetylene black and furnace black.

In addition, as a preferred embodiment of the present invention, the silicone-based bonding sheet resin composition of the present invention may further include an additive containing at least one selected from a curing agent, an adhesion improving agent, a hydrosilylation reaction catalyst, an antifoaming agent, and a leveling agent. .

In one embodiment of the present invention, the curing agent may include one or more selected from a platinum catalyst and an organic peroxide.

Another aspect of the present invention relates to a silicon-based bonding sheet, and may be characterized by curing the silicone-based bonding sheet resin composition of the various forms described above.

In one embodiment of the present invention, in the silicon-based bonding sheet of the present invention, the silicon-based sheet layer may be characterized in that the average thickness of 100 ~ 500㎛.

In one embodiment of the present invention, in the silicon-based bonding sheet of the present invention, the silicon-based sheet layer has a hardness of 50 ~ 75 shore A as measured by the ASTM D 395 method, the thermal conductivity is 0.5 W / measured by the ASTM D 5470 method mk ~ 1.5 W / mk may be characterized.

Another aspect of the present invention relates to a method for manufacturing the silicon-based bonding sheet described above, comprising the steps of mixing and stirring the various types of silicon-based bonding sheet resin composition described above to prepare a liquid silicone resin; Defoaming the liquid silicone resin; And thermally curing the degassed liquid silicone resin twice.

In a preferred embodiment of the present invention, in the manufacturing method of the present invention, the step of thermosetting comprises the steps of preparing a primary thermosetting silicon-based sheet by performing heat curing under 140 ℃ ~ 160 ℃; And performing secondary thermal curing on the primary thermally cured silicon-based sheet at 180 ° C to 220 ° C.

Another aspect of the present invention relates to a method for compressing an anisotropic conductive film (ACF film), it can be characterized in that the anisotropic conductive film (ACF film) is pressed using a silicon-based bonding sheet, preferably anisotropic conductive After laminating the various types of silicon-based bonding sheet described above on the upper surface of the film, it may be characterized in that the heat-compression bonding in the direction of the anisotropic conductive film from the silicon-based bonding sheet.

As a preferred embodiment of the present invention, the lower surface of the anisotropic conductive film may be characterized in that it further comprises a PCB, and further characterized in that the TAB IC is interposed between the anisotropic conductive film and the silicon-based bonding sheet. In addition, a TAB IC may be interposed between the anisotropic conductive film and the silicon-based bonding sheet.

Such a silicon-based bonding sheet of the present invention has good workability when using molten alumina, in particular, by significantly improving the durability, it is possible to increase the production efficiency during the ACF bonding process.

1 is an embodiment of the present invention, a schematic view of a single-layer silicon-based bonding sheet formed only of the silicon-based sheet layer 100 prepared in Example 1 and a protective film formed on both sides thereof.
2 is a state diagram used in the silicon-based bonding sheet of the present invention.

Hereinafter, the present invention will be described in more detail.

The present invention relates to a silicone-based bonding sheet resin composition, comprising organopolysiloxane and fused alumina, and more specifically, the silicone-based bonding sheet resin composition of the present invention is organopolysiloxane, fused alumina, iron oxide, carbon black and heptane It may include.

The organopolysilonic acid, which is one of the silicone-based bonding sheet compositions of the present invention, has a weight average molecular weight of 100 to 300, a viscosity of 15 to 25 Pa.s, preferably a viscosity of 18 to 22 Pa.s, More preferably, the viscosity may be 20 Pa · s.

The molten alumina, which is one of the silicon-based bonding sheet compositions of the present invention, serves to transfer heat in the ACF bonding process and improves processability, and generally used and sold in the art may use molten alumina, but preferably It is good from the viewpoint of dispersibility to use an average particle size of 1 to 50 µm, more preferably 1 to 30 µm. In this case, if the average particle size is less than 1㎛ may be used to increase the viscosity of the silicone resin, there is a problem that the handleability is lowered. If the average particle size of more than 50㎛ is used, the dispersibility of the silicone-based resin is lowered, the uniform thermal conductivity There may be a problem.

In addition, the molten alumina is preferably 99.5-99.99% Al ₂ O ₃ purity, preferably 99.6-99.99%, more preferably 99.7-99.99%, Al ₂ O ₃ If the purity is less than 99.5%, there may be a problem that hinders the silicone resin curing, and if the purity is more than 99.99%, there may be a problem in producing a low-cost silicon-based bonding sheet due to an increase in material costs, the average particle size within the above range And those having purity are preferred.

In addition, the molten alumina may be an average specific gravity of 3.5 to 4.5, preferably 3.8 to 4.2, it is preferable to use a molten alumina having an average specific gravity within the above range in terms of processability of the silicone resin.

The amount of the molten alumina used may be 50 to 600 parts by weight, preferably 50 to 500 parts by weight based on 100 parts by weight of the organopolysiloxane, and at this time, when the amount of the molten alumina is less than 50 parts by weight, the thermal conductivity may be increased. If it is more than 600 parts by weight, it is uneconomical, and rather, the physical properties of the silicone resin may be lowered, so it is preferable to use it within the above range.

In addition, the iron oxide which is one of the silicon-based bonding sheet composition serves to increase the heat resistance of the silicone-based resin, the amount of use is 0.1 to 20 parts by weight, preferably 0.5 to 10 parts by weight based on 100 parts by weight of the organopolysiloxane It is good. In this case, when the amount of iron oxide used is less than 0.1 part by weight, the effect of increasing the heat resistance of the silicone-based resin may not be seen, and even when used in excess of 20 parts by weight, the heat resistance effect of the resin does not increase any more.

In addition, the carbon black, which is one of the silicone-based bonding sheet compositions, serves to increase the heat resistance of the silicone-based resin as a filler, but may be generally used in the art, preferably lamp black, acetylene black, and furnace black. It is good to use at least one selected from among. The carbon black may be used in an amount of 0.1 to 50 parts by weight, preferably 5 to 30 parts by weight, based on 100 parts by weight of the organopolysiloxane. If the amount is less than 0.1 part by weight, the heat resistance of the silicone resin is not increased. When used in excess of 50 parts by weight, the mechanical properties (tensile strength, tensile elongation, etc.) of the silicone-based resin may be deteriorated, so it is preferable to use within the above range.

In addition, the heptane, which is one of the silicone-based bonding sheet compositions, serves to lower the viscosity by dissolving the silicone-based resin, the amount of which is used in an amount of 1 to 100 parts by weight, preferably 5 to 50 parts by weight, based on 100 parts by weight of the organopolysiloxane. Good to do. At this time, if the amount of heptane used is less than 1 part by weight, there may be a problem in lowering the viscosity of the silicone-based resin, and if it is used in excess of 100 parts by weight, there may be a problem in manufacturing a low-cost silicon-based bonding sheet. .

In addition, the silicon-based bonding sheet composition of the present invention may further include an appropriate amount of additives within a range that does not significantly reduce the physical properties such as hardness, durability and thermal conductivity of the sheet prepared therefrom, the additive may include a curing agent, an adhesion improving agent, It may include at least one selected from a hydrosilylation reaction catalyst, an antifoaming agent, and a leveling agent.

Among the additives, it is preferable to use one or more curing agents selected from platinum catalysts and organic peroxides.

In the additive, the adhesion improving agent may more preferably use a silane compound as one or more selected from the compounds represented by the following Chemical Formulas 1 to 2.

[Formula 1]

[Formula 2]

Another aspect of the present invention relates to a bonding sheet using the silicone-based bonding sheet resin composition described above, and may include a silicone-based sheet layer obtained by curing the silicone-based bonding sheet resin composition.

Silicon-based bonding sheet of the present invention may be an average thickness of 100 ~ 500㎛, preferably an average thickness of 150 ~ 480㎛, more preferably 200 ~ 450㎛. At this time, if the average thickness is less than 100㎛ can not obtain sufficient strength, if it exceeds 500㎛ it can be manufactured to have a thickness within the above range can not be produced inexpensive silicon-based bonding sheet.

In addition, the silicon-based bonding sheet of the present invention may be formed of a single layer of the silicon-based sheet layer, as shown in Figure 1 may further include a protective layer (or protective film) on one or both sides of the silicon-based sheet layer. When applying a silicon-based bonding sheet, it can be used by peeling off the protective layer.

In addition, the silicone sheet of the present invention has a hardness of 50 to 75 shore A, preferably 55 to 75 shore A, as measured by ASTM D 395 method, and a thermal conductivity of 0.5 W / mk to 1.5 W when measured by ASTM D 5470 method. / mk, preferably 0.7 W / mk to 1.4 W / mk.

Hereinafter, a method of manufacturing the silicon-based bonding sheet of the present invention will be described in detail.

Silicon-based bonding sheet of the present invention comprises the steps of mixing and stirring the silicon-based bonding sheet resin composition to prepare a liquid silicone-based resin; Defoaming the liquid silicone resin; And thermally curing the defoamed liquid silicone resin twice.

The components of the silicone-based bonding sheet resin composition and the composition ratio thereof are the same as described above.

The defoaming is to remove bubbles generated during the coating of the silicone resin, and the liquid silicone resin is preferably performed for 20 to 60 minutes under a stirring speed of 2 to 20 rpm.

In addition, the step of thermal curing is carried out two times by varying the temperature to increase the durability of the silicon-based bonding sheet, which will be described in detail, the thermosetting step is carried out at 140 ℃ ~ 160 ℃ Performing a first thermosetting silicon-based sheet; And performing a second thermal curing of the first thermally cured silicon-based sheet at 180 ° C. to 220 ° C. for 40 minutes to 90 minutes.

The step of preparing the primary thermosetting silicon-based sheet is carried out thermosetting for 1 minute to 20 minutes under 140 ℃ ~ 160 ℃, specifically 140 ℃ ~ 160 ℃, when the temperature is less than 140 ℃ silicone-based resin There may be a problem that the sheet is not cured to obtain a sheet, and if the temperature exceeds 160 ° C., there may be a problem that PET may be thermally decomposed to obtain a uniform silicone sheet, and thus, primary thermal curing may be performed within the above temperature. .

In addition, the step of manufacturing the secondary thermosetting silicon-based sheet is carried out heat curing for 40 minutes to 90 minutes under 180 ℃ to 220 ℃, specifically 190 ℃ to 210 ℃, if the temperature is less than 180 ℃ There may be a problem that the durability of the bonding sheet is lowered, and when the temperature exceeds 220 ° C., decomposition reaction of the silicone-based resin may occur and durability may be lowered. Therefore, secondary heat curing may be performed within the temperature.

The present invention also relates to a method of compressing an anisotropic conductive film (ACF film) using a silicon-based bonding sheet.

The use state of the silicon-based bonding sheet of the present invention described above is briefly described as follows. Specifically, as shown in FIG. 2, an anisotropic conductive film (ACF) 240 is provided to be in contact with a PCB (Printed circuit board) 230 installed in the base 270, and a TAB IC (Tape Automated Bonding Intergrated circuit, 250). ) Is provided to be in contact with the top of the ACF 240. Therefore, the PCB 230 and the TAB IC 250 is electrically connectable.

Thus, when the bonding of the PCB 230, ACF 240 and TAB IC 250 is completed in the state of the bonding bonding using the heating press 260 by interposing the silicon-based bonding sheet 220 between the PCB 230 and TAB The IC 250 can firmly maintain a state of being electrically connected through the ACF 240. The ACF 240 mixes conductive particles (metal particles, carbon, coated plastic particles coated with metal), adhesives (thermoplastic or thermosetting), and additives (dispersant) in the form of a thin film to form a conductive adhesive layer in the form of a thin film. It is formed, and is excellent in connection reliability, fine connectivity, low temperature connection, and is widely used for electrical connection of electronic components such as the PCB 230 and the TAB IC 250. In the above, the use state and position of the silicon-based bonding sheet 220 during the main compression using the heat presser 260 are shown, and the same silicon-based bonding sheet 220 is applied even when the PCB 230 and the ACF 240 are pressed. can do.

In the bonding process of the liquid crystal display device, the bonding bonding of the PCB 230 and the ACF 240 or the ACF 240 and the TAB IC 250 is performed through the heat presser 260 in the state of sandwiching the silicon-based bonding sheet 220. Therefore, the bonding efficiency can be relatively increased compared to the conventional one.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

[ Example ]

Example  One

100 parts by weight of an organopolysiloxane (manufacturer: Kaneko Chemical Co., Ltd., weight average molecular weight 200-210, viscosity 20 Pa.s) in a 2 L stirring mixer, average particle size 20 μm and Al ₂ O ₃ 100 rpm by weight of molten alumina (manufacturer: Showa Denko) having a purity of 99.5%, 3 parts by weight of iron oxide (manufacturer: EG), and 10 parts by weight of carbon black (manufactured by Degu Co., Ltd., trade name ACECA, lamp black), followed by 15 rpm Stirred for 30 minutes. Next, 10 parts by weight of heptane was added thereto, followed by stirring at 30 rpm for 20 minutes to prepare a liquid silicone resin, and then degassed in a stirring mixer for 30 minutes.

After the degassed liquid silicone resin was coated on a PET film using a film applicator (GAP 3 mm, coating speed 1M / min), the liquid silicone resin was first cured at 150 ° C. for 5 minutes, and the first cured silicone sheet was PET. Peeled from the film. Next, the first cured silicon sheet was peeled and then cured in a 200 ° C. oven for 1 hour to prepare a silicon bonding sheet having a thickness of 250 μm. The thermal conductivity and hardness of the manufactured silicon bonding sheet were measured and shown in Table 1 below. .

Example  2

To prepare a liquid silicone resin in the same manner as in Example 1 in a 2L stirring mixer, 100 parts by weight of the organopolysiloxane, 200 parts by weight of the molten alumina, 3 parts by weight of the iron oxide, 10 parts by weight of carbon black, and then at 15 rpm Stir for 30 minutes. Next, 10 parts by weight of heptane was added, followed by stirring at 30 rpm for 20 minutes to prepare a liquid silicone resin, and then degassed in a stirring mixer for 30 minutes.

After coating the degassed liquid silicone resin on the PET film using a film applicator (GAP 3 mm, coating speed 1M / min), the liquid silicone resin is first cured at 150 ℃ for 5 minutes, and the first cured silicone sheet is PET Peeled from the film. Next, the first cured silicone sheet peeled off was cured in a 200 ° C. oven for 1 hour to prepare a silicon bonding sheet having a thickness of 250 μm.

Example  3

To prepare a liquid silicone resin in the same manner as in Example 1 in a 2L stirring mixer, 100 parts by weight of the organopolysiloxane, 300 parts by weight of molten alumina, 3 parts by weight of iron oxide, 10 parts by weight of carbon black, and then at 15 rpm Stir for 30 minutes. Next, 10 parts by weight of heptane was added and stirred at 30 rpm for 20 minutes to prepare a liquid silicone resin, and then degassed in a stirring mixer for 30 minutes.

After coating the degassed liquid silicone resin on the PET film using a film applicator (GAP 3 mm, coating speed 1M / min), the liquid silicone resin is first cured at 150 ℃ for 5 minutes, and the first cured silicone sheet is PET Peeled from the film. Next, the first cured silicone sheet peeled off was cured in a 200 ° C. oven for 1 hour to prepare a silicon bonding sheet having a thickness of 250 μm.

Example  4

To prepare a liquid silicone resin in the same manner as in Example 1 in a 2L stirring mixer, 100 parts by weight of the organopolysiloxane, 400 parts by weight of the molten alumina, 3 parts by weight of iron oxide, 10 parts by weight of carbon black, 15rpm Stirred for 30 minutes. Next, 10 parts by weight of heptane was added and stirred at 30 rpm for 20 minutes to prepare a liquid silicone resin, and then degassed in a stirring mixer for 30 minutes.

After coating the degassed liquid silicone resin on the PET film using a film applicator (GAP 3 mm, coating speed 1M / min), the liquid silicone resin is first cured at 150 ℃ for 5 minutes, and the first cured silicone sheet is PET Peeled from the film. Next, the first cured silicone sheet peeled off was cured in a 200 ° C. oven for 1 hour to prepare a silicon bonding sheet having a thickness of 250 μm.

Example  5

Average particle size of 40㎛ and Al ₂ O _{3 in the} same manner as in Example 2 After preparing a liquid silicone resin using 200 parts by weight of molten alumina having a purity of 99.9%, a silicon bonding sheet having a thickness of 250 μm was manufactured in the same manner as in Example 1.

Example  6

In the same manner as in Example 2, the average particle size 5㎛ and Al ₂ O ₃ After preparing a liquid silicone resin using 200 parts by weight of molten alumina having a purity of 99.7%, a silicon bonding sheet having a thickness of 250 μm was manufactured in the same manner as in Example 1.

Comparative example  One

A liquid silicone resin was prepared in the same manner as in Example 2, except that 200 parts by weight of sintered alumina (manufacturer: Daehan Ceramics, trade name: SA325F) was used instead of molten alumina to prepare a liquid silicone resin, and then in the same manner as in Example 1. A silicon bonding sheet having a thickness of 250 μm was prepared.

Comparative example  2

After preparing a liquid silicone resin in the same manner as in Example 3, using the sintered alumina of Comparative Example 2 (manufacturer: Daehan Ceramics, trade name: SA325F) instead of molten alumina to prepare a liquid silicone resin, Example A silicon bonding sheet having a thickness of 250 μm was manufactured in the same manner as in Example 1.

Comparative example  3

A liquid silicone resin was prepared in the same manner as in Example 2, but after preparing a liquid silicone resin using 200 parts by weight of calcined alumina (manufacturer: Daehan Ceramics, trade name: DCP2) instead of molten alumina, the liquid silicone resin was prepared in the same manner as in Example 1. A silicon bonding sheet having a thickness of 250 μm was prepared.

Comparative example  4

Preparation of the liquid silicone resin in the same manner as in Example 3, but instead of molten alumina prepared liquid silicone resin using 300 parts by weight of calcined alumina of the Comparative Example 3 (manufacturer: Daehan Ceramics, trade name: DCP2), Example A silicon bonding sheet having a thickness of 250 μm was manufactured in the same manner as in Example 1.

Comparative example  5

Prepare a silicon sheet in the same manner as in Example 2, after coating the degassed liquid silicone resin on a PET film using a film applicator (GAP 3 mm, coating speed 1M / min), liquid silicone based at 160 ℃ for 1 hour After hardening resin once, it peeled from PET film and produced the 250-micrometer-thick silicone bonding sheet.

Comparative example  6

A silicon sheet was manufactured in the same manner as in Example 1, except that only 30 parts by weight of molten alumina was used to prepare a silicon-based bonding sheet having a thickness of 250 μm.

Experimental Example

The hardness and durability of the silicon sheets prepared in Examples 1 to 6 and Comparative Examples 1 to 5 were measured, and the results are shown in Table 1 below.

(1) Hardness: The hardness was measured according to the ASTM D 395 method.

(2) Durability: By using a press equipped with a pressing tool having a width of 2 mm and a length of 100 mm, the number of presses at which the silicon sheet was broken during repeated measurements was evaluated.

(3) Thermal Conductivity: Measured according to ASTM D 5470 method.

division( Weight portion ) Example One 2 3 4 5 6 Organopolysiloxane 100 100 100 100 100 100 Iron oxide 3 3 3 3 3 3 Heptane 10 10 10 10 10 10 Carbon black (lamp black) 10 10 10 10 10 10 Alumina Fused alumina 100 200 300 400 200 200 Sintered Alumina - - - - - - Calcined alumina - - - - - - Hardness (Shore A) 55 60 65 72 55 70 Durability (number of repeated presses) 135 200 220 230 120 150 Thermal conductivity (W / mK) 0.71 1.01 1.13 1.20 0.89 1.17

division( Weight portion ) Comparative example One 2 3 4 5 6 Organopolysiloxane 100 100 100 100 100 100 Iron oxide 3 3 3 3 3 3 Heptane 10 10 10 10 10 10 Carbon black (lamp black) 10 10 10 10 10 10 Alumina Fused alumina - - - - 200 30 Sintered Alumina 200 300 - - - - Calcined alumina - - 200 300 - - Hardness (Shore A) 70 80 67 76 56 43 Durability (number of repeated presses) 100 120 80 100 20 50 Thermal conductivity (W / mK) 0.61 0.65 0.52 0.62 0.91 0.3

Looking at the experimental results of Table 1 and Table 2, in the case of the silicon-based bonding sheets (Examples 1 to 6) of the present invention, the hardness showed an appropriate hardness value of 50 ~ 75 shore A, but in Comparative Example 2, too High hardness. If the hardness of the silicon-based bonding sheet is 50 shore A or less, there is a problem in that the durability is remarkably lowered during repeated pressing. If the hardness is 75 shore A or more, the ACF adhesion strength of the lower substrate electrode and the electrode terminal portion is lowered and thus bubbles are formed between the substrate electrode and the electrode terminal portion. Can cause serious problems with product quality.

In addition, in the case of Examples 1 to 6, the number of repeated compressions showed a high durability of 110 or more, but in Comparative Examples 1 and 3 to 4, the number of repeated repeated compressions of less than 110 was shown. In the case of Comparative Example 5, which was subjected to thermal curing only once, the thermal conductivity was excellent, but hardness and durability were poor.

In addition, in the case of Comparative Examples 1 to 4 using sintered alumina or calcined alumina rather than molten alumina, it was confirmed that the thermal conductivity was very low compared to Examples 1 to 6.

And, in the case of Comparative Example 6 using too little fused alumina, compared with Example 1, the hardness and durability was poor, in particular, it was confirmed that the thermal conductivity is greatly reduced.

Such a silicon-based bonding sheet of the present invention is suitable for use in various fields, in particular, it is very suitable for using an anisotropic conductive film (ACF film) as a compression bonding sheet when pressing.

100: silicon sheet layer 110, 120: protective film
220: silicon bonding sheet 230: PCB
240: ACF 250: TAB IC
260: heating press 270: base

Claims (16)

delete A silicon-based bonding sheet resin composition comprising 50 to 600 parts by weight of molten alumina, 0.1 to 20 parts by weight of iron oxide, 0.1 to 50 parts by weight of carbon black, and 1 to 100 parts by weight of heptane, based on 100 parts by weight of organopolysiloxane. The silicone-based bonding sheet resin composition according to claim 2, wherein the organopolysiloxane has a weight average molecular weight of 100 to 300 and a viscosity of 15 to 25 Pa.s (pascal second). The silicone-based bonding sheet resin composition according to claim 2, wherein the molten alumina has an average particle size of 1 to 50 µm. 5. The silicon-based bonding sheet resin composition according to claim 4, wherein the molten alumina has an Al ₂ O ₃ purity of 99.5 to 99.99%. The silicone bonding sheet resin composition of claim 2, wherein the carbon black comprises at least one selected from lamp black, acetylene black, and furnace black. The method according to any one of claims 2 to 6,
Silicone-based bonding sheet resin composition, characterized in that it further comprises an additive containing at least one selected from a curing agent, an adhesion improving agent, a hydrosilylation reaction catalyst, an antifoaming agent and a leveling agent. The silicone-based bonding sheet resin composition of claim 7, wherein the curing agent comprises at least one selected from a platinum catalyst and an organic peroxide. A silicone bonding sheet comprising a silicone sheet layer obtained by curing the silicone bonding sheet resin composition according to any one of claims 2 to 6. The method of claim 9, wherein the silicon-based sheet layer
Silicon-based bonding sheet, characterized in that the average thickness of 100 ~ 500㎛. The method of claim 9, wherein the silicon-based sheet layer
Hardness is 50 shore A ~ 75 shore A as measured by the ASTM D 395 method, the thermal conductivity of the silicon-based bonding sheet, characterized in that 0.5 W / mk ~ 1.5 W / mk measured by the ASTM D 5470 method. Preparing a liquid silicone resin by mixing and stirring the silicone bonding sheet resin composition of any one of claims 2 to 6;
Defoaming the liquid silicone resin; And
Thermally curing the degassed liquid silicone resin twice;
Method for producing a silicon-based bonding sheet comprising a. The method of claim 12, wherein the thermal curing step
Thermal curing at 140 ° C. to 160 ° C. to prepare a primary thermoset silicon-based sheet; And
Performing secondary thermal curing on the primary thermally cured silicon-based sheet at 180 ° C to 220 ° C;
Method for producing a silicon-based bonding sheet comprising a. A method of compressing an anisotropic conductive film (ACF), comprising laminating the silicon-based bonding sheet according to claim 8 on an upper surface of the anisotropic conductive film, followed by heating and pressing the silicon-based bonding sheet in the direction of the anisotropic conductive film. 15. The method of claim 14, further comprising a printed circuit board (PCB) on a lower surface of the anisotropic conductive film. The tape automated bonding intergrated circuit (TAB IC) between the anisotropic conductive film and the silicon-based bonding sheet. A method of crimping an anisotropic conductive film (ACF), characterized in that is interposed.

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