KR101308136B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101308136B1
KR101308136B1 KR1020110130296A KR20110130296A KR101308136B1 KR 101308136 B1 KR101308136 B1 KR 101308136B1 KR 1020110130296 A KR1020110130296 A KR 1020110130296A KR 20110130296 A KR20110130296 A KR 20110130296A KR 101308136 B1 KR101308136 B1 KR 101308136B1
Authority
KR
South Korea
Prior art keywords
substrate
conveying
chamber
support roller
processing liquid
Prior art date
Application number
KR1020110130296A
Other languages
English (en)
Korean (ko)
Other versions
KR20130024694A (ko
Inventor
정홍구
김진호
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to TW101130971A priority Critical patent/TWI479589B/zh
Priority to CN201210311206.7A priority patent/CN102969259B/zh
Publication of KR20130024694A publication Critical patent/KR20130024694A/ko
Application granted granted Critical
Publication of KR101308136B1 publication Critical patent/KR101308136B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020110130296A 2011-08-31 2011-12-07 기판 처리 장치 KR101308136B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101130971A TWI479589B (zh) 2011-08-31 2012-08-27 用於處理基板之設備及方法
CN201210311206.7A CN102969259B (zh) 2011-08-31 2012-08-29 处理基板的装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110088054 2011-08-31
KR20110088054 2011-08-31

Publications (2)

Publication Number Publication Date
KR20130024694A KR20130024694A (ko) 2013-03-08
KR101308136B1 true KR101308136B1 (ko) 2013-09-12

Family

ID=48176716

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110130296A KR101308136B1 (ko) 2011-08-31 2011-12-07 기판 처리 장치

Country Status (2)

Country Link
KR (1) KR101308136B1 (zh)
TW (1) TWI479589B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6289961B2 (ja) * 2014-03-27 2018-03-07 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
DE102016210883A1 (de) * 2016-06-17 2017-12-21 Singulus Technologies Ag Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204490A (ja) * 1998-01-12 1999-07-30 Dainippon Screen Mfg Co Ltd 付着液除去装置
KR20060045764A (ko) * 2004-04-16 2006-05-17 동경 엘렉트론 주식회사 현상처리장치 및 현상처리방법
KR20090128765A (ko) * 2008-06-11 2009-12-16 세메스 주식회사 기판 이송 장치 및 그의 사이드 롤러 구동 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3518676B2 (ja) * 2000-05-11 2004-04-12 東京化工機株式会社 プリント配線基板材の表面処理装置
JP4043410B2 (ja) * 2003-06-26 2008-02-06 東京応化工業株式会社 インライン式現像処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204490A (ja) * 1998-01-12 1999-07-30 Dainippon Screen Mfg Co Ltd 付着液除去装置
KR20060045764A (ko) * 2004-04-16 2006-05-17 동경 엘렉트론 주식회사 현상처리장치 및 현상처리방법
KR20090128765A (ko) * 2008-06-11 2009-12-16 세메스 주식회사 기판 이송 장치 및 그의 사이드 롤러 구동 방법

Also Published As

Publication number Publication date
TW201316437A (zh) 2013-04-16
KR20130024694A (ko) 2013-03-08
TWI479589B (zh) 2015-04-01

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