KR101303987B1 - 산화물 소결체 및 산화물 반도체 박막 - Google Patents

산화물 소결체 및 산화물 반도체 박막 Download PDF

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KR101303987B1
KR101303987B1 KR1020137008042A KR20137008042A KR101303987B1 KR 101303987 B1 KR101303987 B1 KR 101303987B1 KR 1020137008042 A KR1020137008042 A KR 1020137008042A KR 20137008042 A KR20137008042 A KR 20137008042A KR 101303987 B1 KR101303987 B1 KR 101303987B1
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thin film
oxide
oxide semiconductor
semiconductor thin
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KR20130046449A (ko
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히데오 다카미
고조 오사다
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제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
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    • CCHEMISTRY; METALLURGY
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02565Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
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    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
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    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3281Copper oxides, cuprates or oxide-forming salts thereof, e.g. CuO or Cu2O
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3284Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3286Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Thin Film Transistor (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1020137008042A 2010-08-31 2011-07-27 산화물 소결체 및 산화물 반도체 박막 Active KR101303987B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-194469 2010-08-31
JP2010194469A JP5081960B2 (ja) 2010-08-31 2010-08-31 酸化物焼結体及び酸化物半導体薄膜
PCT/JP2011/067131 WO2012029454A1 (ja) 2010-08-31 2011-07-27 酸化物焼結体及び酸化物半導体薄膜

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KR20130046449A KR20130046449A (ko) 2013-05-07
KR101303987B1 true KR101303987B1 (ko) 2013-09-04

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KR1020137008042A Active KR101303987B1 (ko) 2010-08-31 2011-07-27 산화물 소결체 및 산화물 반도체 박막

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JP (1) JP5081960B2 (enExample)
KR (1) KR101303987B1 (enExample)
TW (1) TWI410393B (enExample)
WO (1) WO2012029454A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6078288B2 (ja) * 2012-06-13 2017-02-08 出光興産株式会社 スパッタリングターゲット、半導体薄膜及びそれを用いた薄膜トランジスタ
KR101526667B1 (ko) * 2013-06-10 2015-06-05 현대자동차주식회사 친환경 차량의 배터리모듈 간접 냉각 및 가열 장치
JP6801168B2 (ja) * 2014-06-27 2020-12-16 三菱マテリアル株式会社 スパッタリングターゲット、光学機能膜、及び、積層配線膜
JP7625671B1 (ja) 2023-10-17 2025-02-03 株式会社コベルコ科研 酸化物半導体薄膜、薄膜トランジスタおよびスパッタリングターゲット

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100753328B1 (ko) 2003-03-04 2007-08-29 닛코킨조쿠 가부시키가이샤 스퍼터링 타겟트, 광 정보기록 매체용 박막 및 그 제조방법
JP2009231613A (ja) 2008-03-24 2009-10-08 Fujifilm Corp 薄膜電界効果型トランジスタおよび表示装置
JP2009253204A (ja) 2008-04-10 2009-10-29 Idemitsu Kosan Co Ltd 酸化物半導体を用いた電界効果型トランジスタ及びその製造方法
JP2010150093A (ja) 2008-12-25 2010-07-08 Tosoh Corp 透明導電膜用焼結体の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100778429B1 (ko) * 2004-07-09 2007-11-21 미쓰이 긴조꾸 고교 가부시키가이샤 스퍼터링 타깃재
US8158974B2 (en) * 2007-03-23 2012-04-17 Idemitsu Kosan Co., Ltd. Semiconductor device, polycrystalline semiconductor thin film, process for producing polycrystalline semiconductor thin film, field effect transistor, and process for producing field effect transistor
TWI387497B (zh) * 2009-01-22 2013-03-01 China Steel Corp Manufacturing method of nickel alloy target

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100753328B1 (ko) 2003-03-04 2007-08-29 닛코킨조쿠 가부시키가이샤 스퍼터링 타겟트, 광 정보기록 매체용 박막 및 그 제조방법
JP2009231613A (ja) 2008-03-24 2009-10-08 Fujifilm Corp 薄膜電界効果型トランジスタおよび表示装置
JP2009253204A (ja) 2008-04-10 2009-10-29 Idemitsu Kosan Co Ltd 酸化物半導体を用いた電界効果型トランジスタ及びその製造方法
JP2010150093A (ja) 2008-12-25 2010-07-08 Tosoh Corp 透明導電膜用焼結体の製造方法

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Publication number Publication date
WO2012029454A1 (ja) 2012-03-08
JP2012054336A (ja) 2012-03-15
KR20130046449A (ko) 2013-05-07
TW201209007A (en) 2012-03-01
TWI410393B (zh) 2013-10-01
JP5081960B2 (ja) 2012-11-28

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